MF1SPLUS8031DA4/03

MF1PLUSx0y1 Mainstream contactless smart card IC for fast and easy solution development Rev. 3.2 — 21 February 2011 163532 Product short data sheet PUBLIC 1. General description Migrate classic contactless smart card systems to the next security level! MIFARE Plus brings benchmark security to mainstream contactless smart card applications. It is the only mainstream IC compatible with MIFARE Classic 1K (MF1ICS50) and MIFARE Classic 4K (MF1ICS70) which offers an upgrade path for existing infrastructure and services. After the security upgrade, MIFARE Plus uses AES-128 (Advanced Encryption Standard) for authentication, data integrity and encryption. MIFARE Plus is based on open global standards for both air interface and cryptographic methods at the highest security level. MIFARE Plus is available in two versions: MIFARE Plus X and MIFARE Plus S. • The MIFARE Plus X (MF1PLUSx0y1, described in this data sheet) offers more flexibility to optimize the command flow for speed and confidentiality. It offers a rich feature set including proximity checks against relay attacks. • The MIFARE Plus S (MF1SPLUSx0y1)is the standard version for straight forward migration of MIFARE Classic systems. It is configured to offer high data integrity. 2. Features and benefits „ 2 kB or 4 kB EEPROM „ Simple fixed memory structure compatible with MIFARE Classic 1K and MIFARE Classic 4K „ Memory structure identical to MIFARE Classic 4K (sectors, blocks) „ Access conditions freely configurable „ Supports ISO/IEC 14443-31 UIDs (4-byte UID, 4 Byte NUID, 7-byte UID), optional support of random IDs „ Multi-sector authentication, Multi-block read and write „ AES-128 used for authenticity, confidentiality and integrity „ Anti-tearing mechanism for writing AES keys „ Keys can be stored as MIFARE CRYPTO1 keys (2 × 48-bit per sector) and as AES keys (2 × 128-bit per sector) „ Full support of virtual card concept „ Proximity check „ Communication speed up to 848 kbit/s 1. ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A. MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC „ Number of single write operations: 200000 cycles (typical) „ Common Criteria Certification: EAL4+ 3. Applications „ „ „ „ „ „ „ Public transportation Access management such as employee, school or campus cards Electronic toll collection Closed loop micro payment Car parking Internet cafés Loyalty programs 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit 15.0 17.0 19.04 pF - 13.56 - MHz Tamb = 22 °C 10 - - year Tamb = 22 °C; excluding anti-tearing for AES keys or sector trailers in security level 3 100000 200000 - Ci input capacitance Tamb = 22 °C; fi = 13.56 MHz; 2.8 V RMS fi input frequency [1] EEPROM characteristics tret retention time Nendu(W) write endurance [1] MF1PLUSX0Y1_SDS Product short data sheet PUBLIC cycle Measured with LCR meter. All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 2 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 5. Ordering information Table 2. Ordering information Type number Package Commercial name Name Description Version MF1PLUS8001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 4 kB EEPROM, 7-byte UID, L1 card - MF1PLUS8011DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 4 kB EEPROM, 4-byte UID, L1 card - MF1PLUS8031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 4 kB EEPROM, 4-byte NUID, L1 card - MF1PLUS8001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 7-byte UID, L1 card SOT500-2 MF1PLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 4-byte UID, L1 card SOT500-2 MF1PLUS8031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm SOT500-2 wide tape, 4 kB EEPROM, 4-byte NUID, L1 card MF1PLUS6001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 2 kB EEPROM, 7-byte UID, L1 card - MF1PLUS6011DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 2 kB EEPROM, 4-byte UID, L1 card - MF1PLUS6031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 2 kB EEPROM, 4-byte NUID, L1 card - MF1PLUS6001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 7-byte UID, L1 card SOT500-2 MF1PLUS6011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 4-byte UID, L1 card SOT500-2 MF1PLUS6031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm SOT500-2 wide tape, 2 kB EEPROM, 4-byte NUID, L1 card MF1PLUS8001DUD/13 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 4 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 3 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC Table 2. Ordering information …continued Type number Package Commercial name Name Description Version MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card SOT500-2 MF1PLUS6001DUD/13 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier; electronic fail die marking according to SECS-II format) see Ref. 3, 2 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card MF1PLUS6001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 7-byte UID, no security level 1or 2, L3 card SOT500-2 6. Block diagram UART ISO/IEC 14443A RF INTERFACE AES CRYPTO CO-PROCESSOR TRUE RANDOM NUMBER GENERATOR CRYPTO1 SECURITY SENSORS POWER ON RESET CPU/LOGIC UNIT CRC VOLTAGE REGULATOR CLOCK INPUT FILTER ROM RESET GENERATOR RAM EEPROM 001aah389 Fig 1. MF1PLUSX0Y1_SDS Product short data sheet PUBLIC Block diagram All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 4 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 7. Pinning information 7.1 Smart card contactless module LA top view LB 001aaj820 Fig 2. Table 3. MF1PLUSX0Y1_SDS Product short data sheet PUBLIC Contact assignments for SOT500-2 (MOA4) Bonding pad assignments to smart card contactless module Contactless interface module MF1PLUSx0y1DA4/03 and /13 Antenna contacts Symbol Description LA LA antenna coil connection LA LB LB antenna coil connection LB All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 5 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 8. Functional description 8.1 Memory organization The 4 kB EEPROM memory (MF1PLUS80x) is organized in 32 sectors of 4 blocks and in 8 sectors of 16 blocks. The 2 kB EEPROM memory (MF1PLUS60x) is organized in 32 sectors of 4 blocks. One block consists of 16 bytes. BYTE NUMBERS WITHIN A BLOCK SECTOR BLOCK 39 15 14 13 ... ... 2 1 0 0 1 2 3 4 CRYPTO1 key A 5(1) 6 7 8 access bytes 9 10 11 12 13 14 15 CRYPTO1 key B or data ... ... ... DESCRIPTION sector trailer 39 data data ... ... data data data ... ... ... 32 15 14 13 ... ... 2 1 0 CRYPTO1 key A access bytes CRYPTO1 key B or data sector trailer 32 data data ... ... data data data 31 3 2 1 0 CRYPTO1 key A access bytes CRYPTO1 key B or data sector trailer 31 data data data ... ... ... 0 ... ... ... CRYPTO1 key A 3 2 1 0 access bytes CRYPTO1 key B or data sector trailer 0 data data manufacturer data 001aaj843 (1) CRYPTO1 key A in security level 0, 1, 2; plain text access byte in security level 3 Fig 3. Memory organization 8.1.1 Manufacturer block The first data block (block 0) of the first sector (sector 0) contains the PICC manufacturer data. This block is programmed and write protected during the production test. 8.1.2 Data blocks Sectors 0D to 31D contain 3 blocks each and sectors 32D to 39D contain 15 blocks for data storage. The data blocks can be configured using the access bits as: • read/write blocks for storing binary data • value blocks (only available in security level 1) MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 6 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC Value blocks are special counters where the stored value can be manipulated with specific commands such as MF Increment, MF Decrement and MF Transfer. These value blocks have a fixed data format enabling error detection and correction with backup management to be performed. The MIFARE Plus X provides two further commands which can be used to optimize performance when using value blocks. These are: • MF Increment Decrement • MF Decrement Transfer A successful mutual authentication is required to allow any data operation. 8.1.2.1 Access conditions The access conditions for every data block and the sector trailer itself are stored in the sector trailer of the corresponding sector. The access bits control the rights of memory operations using the secret keys A and B. The access conditions may be altered after authentication with the relevant key and the current access condition allows this operation. Furthermore, value blocks are configured using the access bits. 8.1.3 AES keys AES keys are not shown in the memory map. The keys are stored on top of the other data and can be updated and used by referencing the Key Number. In security level 3, anti-tearing is supported for the update of AES keys as well as for the update of the sector trailer. In security level 2, anti-tearing is supported only for the update of AES keys. This anti-tearing mechanism is done by the PICC itself. The EEPROM stays in a defined status, even if the PICC is removed from the electromagnetic field during the write operation. 8.1.4 Proximity check The security level 3 offers a feature to verify that the PICC is in close proximity to the PCD. This functionality can be used to effectively prevent relay attacks. The proximity check is based on a precise time measurement of challenge-response pairs in combination with cryptographic methods. 8.1.5 Multi-sector authentication A new feature has been provided in security level 2 and 3 for data which is spread over multiple sectors to improve transaction performance. Providing that such sectors are secured with identical keys (key value and key type) only one authentication is required to read and/or write data from these sectors. There is no need to re-authenticate when accessing any data within these sectors. Therefore it is possible to configure a card in such a way that operating with only one authentication is needed in security level 3 to access all sectors. The same applies also for security level 2 authentications (one is AES-based the other one is CRYPTO1-based) MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 7 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 8.1.6 Originality function The originality function is implemented by an AES authentication with the originality key. The authentication is performed in ISO/IEC 14443-4 protocol layer. 8.2 Card activation and communication protocol The ISO/IEC 14443-3 anticollision mechanism allows for simultaneous handling of multiple PICCs in the field. The anticollision algorithm selects each PICC individually and ensures that execution of a transaction with a selected PICC is performed correctly without data corruption from other PICCs in the field. There are three different versions of the PICC. The UID is programmed into a locked part of the NV-memory reserved for the manufacturer: • unique 7-byte serial number • unique 4-byte serial number • non-unique 4-byte serial number Due to security and system requirements, these bytes are write-protected after being programmed by the PICC manufacturer at production. Remark: The programmed 4-byte NUID serial number is not globally unique which has to be considered in the contactless system design. See Ref. 11 for further information regarding handling of UIDs. The customer must decide which UID length to use when ordering the product, see Table 2 for ordering information. During personalization, the PICC can be configured to support Random ID in security level 3. The user can configure whether Random ID or fixed UID shall be used. According to ISO/IEC 14443-3 the first anticollision loop (see Ref. 5) returns the Random Number Tag 08h, the 3-byte Random Number and the BCC, if Random ID is used. The retrieval of the UID in this case can be done using the Virtual Card Support Last command, see Ref. 3 or by reading out block 0. 8.2.1 Backwards compatibility protocol The backwards compatibility of this product, as used in security level 1 and security level 2, runs on the same protocol layer as MIFARE Classic 1K and MIFARE Classic 4K. The protocol is formed out of the following components: • • • • Frame definition: according to ISO/IEC 14443-3 Bit encoding: according to ISO/IEC 14443-2 Error code handling: handling is proprietary as error codes are formatted in half bytes. Command specification: commands are proprietary. Please use the specification as in Ref. 1 and Ref. 2 and the additional commands which are only implemented in MIFARE Plus as described in this document and in Ref. 3. The following security levels can run on this protocol: • Security Level 0 • Security Level 1 MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 8 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC • Security Level 2 8.2.2 ISO/IEC 14443-4 Protocol The ISO/IEC 14443-4 Protocol (also known as T=CL) is used in many processor cards. This protocol is used for the MIFARE Plus with the following security levels: • Security Level 0: all commands • Security Level 1: only the security level switch and originality function • Security Level 2: updating AES keys and configuration blocks as well as the security level switch and originality function • Security Level 3: all commands 8.3 Security level switching The MIFARE Plus X offers a unique feature to support migration from CRYPTO1 based systems to AES based operation. The migration on the card-side is done using different security levels supporting different cryptographic algorithms and protocols. There are four security levels: • Security level 0: initial delivery configuration, used for card personalization • Security level 1: backwards functional compatibility mode (with MIFARE Classic 1K and MIFARE Classic 4K) with optional AES authentication • Security level 2: 3-Pass authentication based on AES followed by MIFARE CRYPTO1 authentication, communication secured by MIFARE CRYPTO1 The MIFARE CRYPTO1 uses session keys derived from the AES and MIFARE CRYPTO1 authentication. • Security level 3: 3-Pass authentication based on AES, data manipulation commands secured by AES encryption and an AES based MACing method If the card is a L3 card the Commit Perso command will switch the card directly from security level 0 to security level 3 instead of security level 1. The security level switching (i.e. from security level 1 to security level 3) is performed using the dedicated AES authentication switching keys. The security level can only be switched from a lower to a higher level, never in the opposite direction. 8.4 Security level 0 Security level 0 is the initial delivery configuration of the PICC. The card can be operated either using the backwards compatibility protocol or the ISO/IEC 14443-4 protocol. In this level, the card can be personalized including the programming of user data as well as CRYPTO1 and/or AES keys. In addition, the originality function can be used. The following mandatory AES keys must be written, using the Write Perso command before the PICC can be switched to security level 1 or security level 3 (for L3 card). MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 9 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC Security level switching is performed using the Commit Perso command: • • • • Card Configuration Key Card Master Key Level 2 Switch Key (for L1 card) Level 3 Switch Key (for L1 card) Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. 8.5 Security level 1 Security level 1 offers the same functionality as a MIFARE Classic 1K and MIFARE Classic 4K using the backwards compatibility protocol. The MIFARE Classic 1K and MIFARE Classic 4K products are specified in Ref. 1 and Ref. 2. Furthermore, an optional AES authentication is available in this level without affecting the MIFARE Classic 1K and MIFARE Classic 4K functionality. The authenticity of the card can be proven using strong cryptographic means with this additional functionality. The timings may differ from the MIFARE Classic 1K and MIFARE Classic 4K products. Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. 8.6 Security level 2 Security level 2 also offers the functionality of a MIFARE Classic 1K and MIFARE Classic 4K using the backwards compatibility protocol. The significant difference compared to security level 1 is that an AES authentication is mandatory and that the CRYPTO1 keys are derived for each session using the results from the AES authentication, rather than being constant for a specific sector. The timings may differ from the MIFARE Classic 1K and MIFARE Classic 4K products. In security level 2, the following keys are assigned to each sector: • Two AES keys (key A and key B) these keys are also used in security level 3 two CRYPTO1 keys (key A and key B) these keys are also used in security level 1 The access conditions are set in the sector trailer as in MIFARE Classic 1K and MIFARE Classic 4K. Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. 8.7 Security level 3 The operation in security level 3 is solely based on the ISO/IEC 14443-4 protocol layer. The usage of the backwards compatibility protocol is not possible. In security level 3, a mandatory AES authentication between PICC and reader is conducted, where two keys are generated as a function of the random numbers from the PICC and the reader as well as of the shared key. MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 10 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC These two session keys are used to secure the data which is exchanged on the interface between the card and reader. One of the two keys is used to ensure the confidentiality of the command and the response while the other key ensures the integrity of the command and the response. The reader can decide which security needs to be used in the communication between PICC and reader. In the simplest case, all commands are secured by a MAC, such that the PICC will only accept commands from the authenticated reader. Any message tampering is detected by verifying the MAC. All responses are appended by a MAC to prove to the reader that neither the command nor the response have been compromised. If performance is the highest priority, the card can be configured to omit the MAC for read commands. The card then accepts read commands without knowing whether they are authentic. However, there is a mechanism to prove to the reader that the read response is resulting from the unmodified read command that it sent. Other commands, like write commands, always need to have a MAC appended to ensure that no memory changes are carried out without proving the authenticity of the command. The reader can decide for each command whether a MAC is included in the response. When the appropriate MAC is received, due to linked MACs the reader knows that the command and commands before it were properly executed. All commands between two consecutive First Authenticate commands belong to one transaction and the MACing mechanism assures integrity of the whole transaction. If the MAC on read responses is omitted, the integrity of all read responses within one session can still be verified by including a MAC on one read response before issuing the next First or Following Authenticate command. If performance matters more than confidentiality of the transaction, each data block in a sector can be configured to allow or disallow sending/receiving plain data. 9. Look-up tables 9.1 Security level 0, 1, 2, 3: ISO/IEC 14443-3 Table 4. ISO/IEC 14443-3 Command Description REQA the REQA and ATQA commands are fully implemented according to ISO/IEC 14443-3 WUPA the WAKE-UP command is fully implemented according to ISO/IEC 14443-3 ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented cascade level 1 according to ISO/IEC 14443-3. The response is part 1 of the UID. ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented cascade level 2 for 7 byte according to ISO/IEC 14443-3. The response is part 2 of the UID. UID version HALT MF1PLUSX0Y1_SDS Product short data sheet PUBLIC the HALT command is fully implemented according to ISO/IEC 14443-3 All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 11 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 9.2 Security level 0, 1, 2, 3: ISO/IEC 14443-4 Table 5. ISO/IEC 14443-4 Command Description RATS the response to the RATS command identifies the PICC type to the PCD. PPS the PPS command allows individual selection of the communication baud rate between PCD and PICC. It is possible for MF1PLUSx0 to individually set the communication baud rate independently for both directions i.e. MF1PLUSx0 allows a non-symmetrical information interchange speed. DESELECT deselection according to ISO/IEC 14443-4. Please find more information on ISO/IEC 14443-3 in Ref. 5 as well as on the settings of ATQA, SAK and ATS in Ref. 4. 9.3 Security level 0 command overview Table 6. Security level 0 command overview Command Description Write Perso pre-personalization of AES keys and all blocks Commit Perso switch to security level 1 (L1 card) or security level 3 (L3 card) First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step 9.4 Security level 1 command overview Table 7. Security level 1 command overview MF1ICS50xx, MF1ICS70xx, MF1ICS20xx commands Description MF Authenticate key A authentication with key A MF Authenticate key B authentication with key B MF Read reading data MF Write writing data MF Increment incrementing a value MF Decrement decrementing a value MF Restore restoring a value MF Transfer transferring a value Commands using backwards compatibility protocol; see Section 8.2.1 Following Authenticate (part 1) following authenticate; protocol used as described in Section 8.2.1 Authenticate (part 2) second authentication step; protocol used as described in Section 8.2.1 Command set for security level switch and originality function using ISO 14443-4 protocol First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) MF1PLUSX0Y1_SDS Product short data sheet PUBLIC second authentication step All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 12 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 9.5 Security level 2 command overview Table 8. Security level 2 command overview Command Description Commands using backwards compatibility protocol; see Section 8.2.1 Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step MF1ICS50xx, MF1ICS70xx commands MF Authenticate Key A authentication with key A MF Authenticate Key B authentication with key B MF Read reading data MF Write writing data MF Decrement decrementing a value MF Increment incrementing a value MF Restore restoring a value MF Transfer transferring a value Multi Block Read reading multiple blocks (up to sector length) Multi Block Write writing multiple blocks (up to sector length) Command set for updating AES keys and configuration blocks as well as security level switch and originality function using ISO 14443-4 First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step Write writing encrypted, no MAC on response, MAC on command Write MACed writing encrypted, MAC on response, MAC on command 9.6 Security level 3 command overview Table 9. Security level 3 command overview Command Description MIFARE Plus commands First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step ResetAuth reset the authentication step READ commands Read MF1PLUSX0Y1_SDS Product short data sheet PUBLIC reading encrypted, no MAC on response, MAC on command Read MACed reading encrypted, MAC on response, MAC on command Read Plain reading in plain, no MAC on response, MAC on command Read Plain MACed reading in plain, MAC on response, MAC on command Read UnMACed reading encrypted, no MAC on response, no MAC on command Read UnMACed, Response MACed reading encrypted, MAC on response, no MAC on command Read Plain UnMACed reading in plain, no MAC on response, no MAC on command All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 13 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC Table 9. Security level 3 command overview …continued Command Description Read Plain UnMACed, Response MACed reading in plain, MAC on response, no MAC on command Write commands Write writing encrypted, no MAC on response, MAC on command Write MACed writing encrypted, MAC on response, MAC on command Write Plain writing in plain, no MAC on response, MAC on command Write Plain MACed writing in plain, MAC on response, MAC on command VALUE operations Increment incrementing a value encrypted, no MAC on response, MAC on command Increment MACed incrementing a value encrypted, MAC on response, MAC on command Decrement decrementing a value encrypted, no MAC on response, MAC on command Decrement MACed decrementing a value encrypted, MAC on response, MAC on command Transfer transferring a value, no MAC on response, MAC on command Transfer MACed transferring a value, MAC on response, MAC on command Increment Transfer combined incrementing and transferring a value encrypted, no MAC on response, MAC on command Increment Transfer MACed combined incrementing and transferring a value encrypted, MAC on response, MAC on command Decrement Transfer combined decrementing and transferring a value encrypted, no MAC on response, MAC on command Decrement Transfer MACed combined decrementing and transferring a value encrypted, MAC on response, MAC on command Restore restoring a value, no MAC on response, MAC on command Restore MACed restoring a value, MAC on response, MAC on command Proximity check and virtual card concept MF1PLUSX0Y1_SDS Product short data sheet PUBLIC Prepare Proximity Check prepare for the proximity check Proximity Check perform the precise measurement for the proximity check Verify Proximity Check verify the proximity check Virtual Card Support check, if the virtual card concept is supported Virtual Card Support Last check if the virtual card concept is supported, communicate PCD capabilities and retrieve the UID Select Virtual Card select the virtual card Deselect Virtual Card deselect the virtual card All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 14 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 10. Limiting values Table 10. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Min Max[1][2] Unit input current - 30 mA Ptot/pack total power dissipation per package - 200 mW Tstg storage temperature −55 125 °C Tamb ambient temperature −25 70 °C 2 - kV ±100 - mA Symbol Parameter II VESD electrostatic discharge voltage Ilu latch-up current Conditions [3] [1] Stresses above one or more of the limiting values may cause permanent damage to the device. [2] Exposure to limiting values for extended periods may affect device reliability. [3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ. 11. Abbreviations Table 11. MF1PLUSX0Y1_SDS Product short data sheet PUBLIC Abbreviations Acronym Description AES Advanced Encryption Standard ATQA Answer To reQuest ATS Answer To Select BCC Bit Count Check EEPROM Electrically Erasable Programmable Read-Only Memory LCR L = inductance, Capacitance, Resistance (LCR meter) MAC Message Authentication Code NUID Non-Unique IDentifier NV Non-Volatile memory PCD Proximity Coupling Device (Contactless Reader) PICC Proximity Integrated Circuit Card (Contactless Card) PPS Protocol Parameter Selection RATS Request Answer To Select REQA REQuest Answer SAK Select AcKnowledge, type A SECS-II SEMI Equipment Communications Standard part 2 SEMI Semiconductors Equipment and Materials International UID Unique IDentifier VC Virtual Card, one MIFARE Plus PICC is one virtual card WUPA Wake Up Protocol A All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 15 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 12. References [1] Data sheet — MF1ICS50 Functional specification, BU-ID Doc. No. 0010**2. [2] Data sheet — MF1ICS70 Functional specification, BU-ID Doc. No. 0435**. [3] Data sheet — M1PLUSx0y1 MIFARE Plus functional specification, BU-ID Doc. No. 1637**. [4] Application note — MIFARE Type identification procedure, BU-ID Doc. No. 1843**. [5] Application note — ISO/IEC 14443 PICC selection, BU-ID Doc. No. 1308**. [6] NIST Special Publication 800-38A — Recommendation for block cipher modes of operation: methods and techniques, 2001. [7] NIST Special Publication 800-38B — Recommendation for block cipher modes of operation: The CMAC mode for authentication. [8] ISO/IEC Standard — ISO/IEC 14443 Identification cards - contactless integrated circuit cards - proximity cards. [9] Recommendation for block cipher modes of operation: methods and techniques — FIPS PUB 197 ADVANCED ENCRYPTION STANDARD. [10] ISO/IEC Standard — ISO/IEC 9797-1 Information technology - security techniques - Message Authentication Codes (MACs) - Part 1: Mechanisms using a block cipher. [11] MIFARE and handling of UIDs — Application note, BU-ID Document number 1907**2 13. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes MF1PLUSX0Y1_SDS v.3.2 20110221 Product short data sheet - • Modifications: MF1PLUSX0Y1_SDS_31 163530 • • • • • • • - 163530 Product short data sheet - 163512 Several editorial changes and content rephrasing Table 1 “Quick reference data: min. value of Ci modified Table 2 “Ordering information”: updated Section 14 “Legal information”: updated 20090325 Modifications: Product short data sheet Minor text and standardization modifications 20100211 Modifications: 163512 Added description and ordering information for NUID Types in Section 2, Section 5 and Section 8.2 20100419 Modifications: MF1PLUSX0Y1_SDS_31 Objective short data sheet - 163511 New name for the product MIFARE Plus X General update 163511 20081113 Objective short data sheet - 163510 163510 20080919 Objective short data sheet - - 2. ** ... document version number MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 16 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 17 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 14.4 Licenses ICs with DPA Countermeasures functionality NXP ICs containing functionality implementing countermeasures to Differential Power Analysis and Simple Power Analysis are produced and sold under applicable license from Cryptography Research, Inc. 14.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE — is a trademark of NXP B.V. MIFARE Plus — is a trademark of NXP B.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 18 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 16. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .3 Bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . . .5 ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . 11 ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .12 Security level 0 command overview . . . . . . . . .12 Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Security level 1 command overview. . . . . . . . . 12 Security level 2 command overview. . . . . . . . . 13 Security level 3 command overview . . . . . . . . 13 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 17. Figures Fig 1. Fig 2. Fig 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Contact assignments for SOT500-2 (MOA4) . . . . .5 Memory organization . . . . . . . . . . . . . . . . . . . . . . .6 MF1PLUSX0Y1_SDS Product short data sheet PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.2 — 21 February 2011 163532 © NXP B.V. 2011. All rights reserved. 19 of 20 MF1PLUSx0y1 NXP Semiconductors Mainstream contactless smart card IC 18. Contents 1 2 3 4 5 6 7 7.1 8 8.1 8.1.1 8.1.2 8.1.2.1 8.1.3 8.1.4 8.1.5 8.1.6 8.2 8.2.1 8.2.2 8.3 8.4 8.5 8.6 8.7 9 9.1 9.2 9.3 9.4 9.5 9.6 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Smart card contactless module . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Memory organization . . . . . . . . . . . . . . . . . . . . 6 Manufacturer block . . . . . . . . . . . . . . . . . . . . . . 6 Data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Access conditions . . . . . . . . . . . . . . . . . . . . . . . 7 AES keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Proximity check . . . . . . . . . . . . . . . . . . . . . . . . 7 Multi-sector authentication . . . . . . . . . . . . . . . . 7 Originality function . . . . . . . . . . . . . . . . . . . . . . 8 Card activation and communication protocol . . 8 Backwards compatibility protocol . . . . . . . . . . . 8 ISO/IEC 14443-4 Protocol . . . . . . . . . . . . . . . . 9 Security level switching . . . . . . . . . . . . . . . . . . 9 Security level 0 . . . . . . . . . . . . . . . . . . . . . . . . . 9 Security level 1 . . . . . . . . . . . . . . . . . . . . . . . . 10 Security level 2 . . . . . . . . . . . . . . . . . . . . . . . . 10 Security level 3 . . . . . . . . . . . . . . . . . . . . . . . . 10 Look-up tables . . . . . . . . . . . . . . . . . . . . . . . . . 11 Security level 0, 1, 2, 3: ISO/IEC 14443-3 . . . 11 Security level 0, 1, 2, 3: ISO/IEC 14443-4 . . . 12 Security level 0 command overview . . . . . . . . 12 Security level 1 command overview . . . . . . . . 12 Security level 2 command overview . . . . . . . . 13 Security level 3 command overview . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 February 2011 163532