MIMXRT106ACVL5B

NXP Semiconductors Data Sheet: Technical Data Document Number: IMXRT1060IEC Rev. 3, 03/2022 MIMXRT1061CVL5A i.MX RT1060 Crossover Processors for Industrial Products MIMXRT1061CVL5B MIMXRT1061CVJ5A MIMXRT1061CVJ5B MIMXRT1062CVL5A MIMXRT1062CVL5B MIMXRT1062CVJ5A MIMXRT1062CVJ5B MIMXRT106ACVL5B MIMXRT106SCVL5B MIMXRT106FCVL5B MIMXRT106PCVL5B Package Information Plastic Package 196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch 196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch Ordering Information See Table 1 on page 6 1 i.MX RT1060 Introduction The i.MX RT1060 is a new processor family featuring NXP’s advanced implementation of the Arm Cortex®-M7 core, which operates at speeds up to 528 MHz to provide high CPU performance and best real-time response. The i.MX RT1060 processor has 1 MB on-chip RAM. 512 KB can be flexibly configured as TCM or general purpose on-chip RAM, while the other 512 KB is general-purpose on-chip RAM. The i.MX RT1060 integrates advanced power management module with DCDC and LDO that reduces complexity of external power supply and simplifies power sequencing. The i.MX RT1060 also provides various memory interfaces, including SDRAM, RAW NAND FLASH, NOR FLASH, SD/eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. 1. i.MX RT1060 Introduction . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6 2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1. Special signal considerations . . . . . . . . . . . . . . . 19 3.2. Recommended connections for unused analog interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 22 4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 22 4.2. System power and clocks . . . . . . . . . . . . . . . . . . 29 4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.5. External memory interface . . . . . . . . . . . . . . . . . 46 4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 56 4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 69 4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 84 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 84 5.2. Boot device interface allocation . . . . . . . . . . . . . . 84 6. Package information and contact assignments . . . . . . . 89 6.1. 10 x 10 mm package information . . . . . . . . . . . . 89 6.2. 12 x 12 mm package information . . . . . . . . . . . 101 7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 i.MX RT1060 Introduction sensors. The i.MX RT1060 has rich audio and video features, including LCD display, basic 2D graphics, camera interface, SPDIF, and I2S audio interface. The i.MX RT1060 has analog interfaces, such as ADC, ACMP, and TSC. The i.MX RT1060 is specifically useful for applications such as: • Industrial Human Machine Interfaces (HMI) • Motor Control • Home Appliance 1.1 Features The i.MX RT1060 processors are based on Arm Cortex-M7 Core Platform, which has the following features: • Supports single Arm Cortex-M7 Core with: — 32 KB L1 Instruction Cache — 32 KB L1 Data Cache — Full featured Floating Point Unit (FPU) with support of the VFPv5 architecture — Support the Armv7-M Thumb instruction set • Integrated MPU, up to 16 individual protection regions • Tightly coupled GPIOs, operating at the same frequency as Arm Core • Up to 512 KB I-TCM and D-TCM in total • Frequency of 528 MHz • Cortex M7 CoreSight™ components integration for debug • Frequency of the core, as per Table 10, "Operating ranges," on page 24. The SoC-level memory system consists of the following additional components: — Boot ROM (128 KB) — On-chip RAM (1 MB) – 512 KB OCRAM shared between ITCM/DTCM and OCRAM – Dedicate 512 KB OCRAM • External memory interfaces: — 8/16-bit SDRAM, up to SDRAM-133/SDRAM-166 — 8/16-bit SLC NAND FLASH, with ECC handled in software — SD/eMMC — SPI NOR/NAND FLASH — Parallel NOR FLASH with XIP support — Two single/dual channel Quad SPI FLASH with XIP support • Timers and PWMs: — Two General Programmable Timers (GPT) – 4-channel generic 32-bit resolution timer for each i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 2 NXP Semiconductors i.MX RT1060 Introduction — — — — – Each support standard capture and compare operation Four Periodical Interrupt Timers (PIT) – Generic 32-bit resolution timer – Periodical interrupt generation Four Quad Timers (QTimer) – 4-channel generic 16-bit resolution timer for each – Each support standard capture and compare operation – Quadrature decoder integrated Four FlexPWMs – Up to 8 individual PWM channels per each – 16-bit resolution PWM suitable for Motor Control applications Four Quadrature Encoder/Decoders Each i.MX RT1060 processor enables the following interfaces to external devices (some of them are muxed and not available simultaneously): • Display Interface: — Parallel RGB LCD interface – Support 8/16/24 bit interface – Support up to WXGA resolution – Support Index color with 256 entry x 24 bit color LUT – Smart LCD display with 8/16-bit MPU/8080 interface • Audio: — S/PDIF input and output — Three synchronous audio interface (SAI) modules supporting I2S, AC97, TDM, and codec/DSP interfaces — MQS interface for medium quality audio via GPIO pads • Generic 2D graphics engine: — BitBlit — Flexible image composition options—alpha, chroma key — Porter-duff blending — Image rotation (90, 180, 270) — Image size — Color space conversion — Multiple pixel format support (RGB, YUV444, YUV422, YUV420, YUV400) — Standard 2D-DMA operation • Camera sensors: — Support 24-bit, 16-bit, and 8-bit CSI input • Connectivity: i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 3 i.MX RT1060 Introduction • — Two USB 2.0 OTG controllers with integrated PHY interfaces — Two Ultra Secure Digital Host Controller (uSDHC) interfaces – MMC 4.5 compliance with HS200 support up to 200 MB/sec – SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec – Support for SDXC (extended capacity) — Two 10/100M Ethernet controller with support for IEEE1588 — Eight universal asynchronous receiver/transmitter (UARTs) modules — Four I2C modules — Four SPI modules — Two FlexCAN modules — One FlexCAN (with Flexible Data-Rate supported) — Three FlexIO modules GPIO and Pin Multiplexing: — General-purpose input/output (GPIO) modules with interrupt capability — Input/output multiplexing controller (IOMUXC) to provide centralized pad control The i.MX RT1060 processors integrate advanced power management unit and controllers: • Full PMIC integration, including on-chip DCDC and LDO • Temperature sensor with programmable trim points • GPC hardware power management controller The i.MX RT1060 processors support the following system debug: • Arm CoreSight debug and trace architecture • Trace Port Interface Unit (TPIU) to support off-chip real-time trace • Cross Triggering Interface (CTI) • Support for 5-pin (JTAG) and SWD debug interfaces The i.MX RT1060 processors support the following analog interfaces: • Two Analog-Digital-Converters (ADC), 16-channel for each, 20-channel in total • Four Analog Comparators (ACMP) Security functions are enabled and accelerated by the following hardware: • High Assurance Boot (HAB) • Data Co-Processor (DCP): — AES-128, ECB, and CBC mode — SHA-1 and SHA-256 — CRC-32 • Bus Encryption Engine (BEE) — AES-128, ECB, and CTR mode — On-the-fly QSPI Flash decryption i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 4 NXP Semiconductors i.MX RT1060 Introduction • • • True random number generation (TRNG) Secure Non-Volatile Storage (SNVS) — Secure real-time clock (RTC) — Zero Master Key (ZMK) Secure JTAG Controller (SJC) NOTE The actual feature set depends on the part numbers as described in Table 1. Functions such as display and camera interfaces, connectivity interfaces, and security features are not offered on all derivatives. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 5 i.MX RT1060 Introduction 1.2 Ordering information Table 1 provides examples of orderable part numbers covered by this Data Sheet. Table 1. Ordering information Part Number MIMXRT1061CVJ5A MIMXRT1061CVJ5B MIMXRT1061CVL5A MIMXRT1061CVL5B Features • 528 MHz, commercial grade for general purpose, with MPU/FPU • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • No LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • • • • • • • 528 MHz, commercial grade for general purpose, with MPU/FPU • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • No LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Junction Temperature Tj (C) Package Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 12 x 12 mm, 0.8 mm pitch, 196-pin MAPBGA -40 to +105 C Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 6 NXP Semiconductors i.MX RT1060 Introduction Table 1. Ordering information Part Number MIMXRT1062CVJ5A MIMXRT1062CVJ5B MIMXRT1062CVL5A MIMXRT1062CVL5B Features • 528 MHz, commercial grade for general purpose, with MPU/FPU • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • • • • • • • 528 MHz, commercial grade for general purpose, with MPU/FPU • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Package Junction Temperature Tj (C) Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 12 x 12 mm, 0.8 mm pitch, 196-pin MAPBGA -40 to +105 C Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 7 i.MX RT1060 Introduction Table 1. Ordering information Part Number Features MIMXRT106ACVL5B • 528 MHz, industrial grade with MPU/FPU • Turnkey solution for AVS for IoT, including far-field audio front end, see www. nxp.com/mcu-avs • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • • • • • • • MIMXRT106FCVL5B • 528 MHz, industrial grade with MPU/FPU • Turnkey solution for face and emotion recognition, see www. nxp.com/mcu-vision2 • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Package Junction Temperature Tj (C) eMMC 4.5/SD 3.0 x2 Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C eMMC 4.5/SD 3.0 x2 Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 8 NXP Semiconductors i.MX RT1060 Introduction Table 1. Ordering information Part Number Features MIMXRT106PCVL5B • 528 MHz, industrial grade with MPU/FPU • Turnkey solution with NXP VoiceSeeker AFE and VoiceSpot Wake Word for Alexa for IoT • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • • • • • • • • MIMXRT106SCVL5B • 528 MHz, industrial grade with MPU/FPU • Turnkey solution for local voice (phoneme based) recognition, see www.nxp.com/mcu-loca l2 • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Package Junction Temperature Tj (C) USB OTG x2 eMMC 4.5/SD 3.0 x2 Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C MQS x1 USB OTG x2 eMMC 4.5/SD 3.0 x2 Ethernet x2 UART x8 I2C x4 FlexSPI x2 CAN x2 FlexCAN (with Flexible Data-Rate supported) FlexIO x3 127 GPIOs (124 tightly coupled) HAB/DCP/BEE TRNG SNVS SJC ADC x2 ACMP x4 TSC DCDC Temperature sensor GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA -40 to +105 C Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 9 i.MX RT1060 Introduction primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field and matching it to the proper data sheet. If there are any questions, visit the web page nxp.com/IMXRT or contact an NXP representative for details. M Qualification Level IMX XX @ ## % + VV $ A M Silicon Rev A Prototype Samples P A0 A Mass Production M A1 B Special S Core Frequency $ 400 MHz 4 500 MHz 5 600 MHz 6 Part # series XX i.MX RT RT Family @ First Generation RT family 1 Reserved Package Type 2-8 VV 225MAPBGA, 13 x 13 mm, 0.8 mm pitch VN Sub-Family ## 196MAPBGA, 12 x 12 mm, 0.8 mm pitch VJ RT101x 01 196MAPBGA, 10 x 10 mm, 0.65 mm pitch VL RT102x 02 169MAPBGA, 11 x 11 mm, 0.8 mm pitch JM RT104x 04 169MAPBGA, 9 x 9 mm, 0.65 mm pitch FP RT105x 05 144LQFP, 20 x 20 mm, 0.5 mm pitch AG RT106x 06 Tie % Standard Feature 1 Full Feature 2 4MB Flash SIP 4 100LQFP, 14 x 14 mm, 0.5 mm pitch AF 80LQFP, 12 x 12 mm, 0.5 mm pitch AE Enhanced Feature 5 Temperature (Tj) + Far Field AFE A Consumer: 0 to + 95 °C D Facial Recognition F Industrial: -40 to +105 °C C Extended Industrial: -40 to +125 eC X $OH[DIRU,R7 Local Voice Control (text input models) 3 S Figure 1. Part number nomenclature—i.MX RT10XX family i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 10 NXP Semiconductors Architectural Overview 2 Architectural Overview The following subsections provide an architectural overview of the i.MX RT1060 processor system. 2.1 Block diagram Figure 2 shows the functional modules in the i.MX RT1060 processor system1. System Control CPU Platform Connectivity Secure JTAG eMMC 4.5 / SD 3.0 x2 Arm Cortex-M7 PLL / OSC 32 KB D-cache 32 KB I-cache UART x8 RTC and Reset FPU NVIC MPU 8 x 8 Keypad Enhanced DMA Up to 512 KB TCM IOMUX GP Timer x6 High-speed GPIO GPIO 6/7/8/9 I2C x4 FLEXIO3 SPI x4 Quadrature ENC x4 QuadTimer (4-Channel) x4 FlexPWM (8-Channel) x4 Watch Dog x4 Internal Memory Multimedia GPIO 8 / 16 / 24-bit Parallel CSI I2S / SAI x3 24-bit Parallel LCD PXP 2D Graphics Acceleration Resize, CSC, Overlay, Rotation 512 KB OCRAM shared with TCM 96 KB ROM S/PDIF Tx / Rx FlexCAN x2 USB 2.0 OTG with PHY x2 External Memory FlexSPI x2 (dual-channel QuadSPI NAND and NOR, Octal Flash, and RAM) 10 / 100 ENET with IEEE 1588 x1 Power Management DCDC LDO Temp Monitor External Memory Controller 8-bit / 16-bit SDRAM Parallel NOR FLASH NAND FLASH PSRAM ADC ADC x2 (20-Channel) ACMP x4 Security Ciphers and RNG Secure RTC eFuse HAB . Figure 2. i.MX RT1060 system block diagram 1. Some modules shown in this block diagram are not offered on all derivatives. See Table 1 for details. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 11 Modules List 3 Modules List The i.MX RT1060 processors contain a variety of digital and analog modules. Table 2 describes these modules in alphabetical order. Table 2. i.MX RT1060 modules list Block Mnemonic Block Name Subsystem Brief Description ACMP1 ACMP2 ACMP3 ACMP4 Analog Comparator Analog The comparator (CMP) provides a circuit for comparing two analog input voltages. The comparator circuit is designed to operate across the full range of the supply voltage (rail-to-rail operation). ADC1 ADC2 Analog to Digital Converter Analog The ADC is a 12-bit general purpose analog to digital converter. AOI And-Or-Inverter Cross Trigger The AOI provides a universal boolean function generator using a four team sum of products expression with each product term containing true or complement values of the four selected inputs (A, B, C, D). Arm Arm Platform Arm The Arm Core Platform includes one Cortex-M7 core. It includes associated sub-blocks, such as Nested Vectored Interrupt Controller (NVIC), Floating-Point Unit (FPU), Memory Protection Unit (MPU), and CoreSight debug modules. BEE Bus Encryption Engine Security CCM GPC SRC On-The-Fly FlexSPI Flash Decryption Clock Control Module, Clocks, Resets, and These modules are responsible for clock and reset General Power Power Control distribution in the system, and also for the system Controller, System Reset power management. Controller CSI Parallel CSI Multimedia Peripherals The CSI IP provides parallel CSI standard camera interface port. The CSI parallel data ports are up to 24 bits. It is designed to support 24-bit RGB888/YUV444, CCIR656 video interface, 8-bit YCbCr, YUV or RGB, and 8-bit/10-bit/16-bit Bayer data input. CSU Central Security Unit Security The Central Security Unit (CSU) is responsible for setting comprehensive security policy within the i.MX RT1060 platform. DAP Debug Access Port System Control Peripherals The DAP provides real-time access for the debugger without halting the core to: • System memory and peripheral registers • All debug configuration registers The DAP also provides debugger access to JTAG scan chains. The DAP module is internal to the Cortex-M7 Core Platform. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 12 NXP Semiconductors Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description DCDC DCDC Converter Analog The DCDC module is used for generating power supply for core logic. Main features are: • Adjustable high efficiency regulator • Supports 3.3 V input voltage • Supports nominal run and low power standby modes • Supports at 0.9 ~ 1.3 V output in run mode • Supports at 0.9 ~ 1.0 V output in standby mode • Over current and over voltage detection eDMA enhanced Direct Memory Access System Control Peripherals There is an enhanced DMA (eDMA) engine and two DMA_MUX. • The eDMA is a 32 channel DMA engine, which is capable of performing complex data transfers with minimal intervention from a host processor. • The DMA_MUX is capable of multiplexing up to 128 DMA request sources to the 32 DMA channels of eDMA. ENC Quadrature Encoder/Decoder Timer Peripherals The enhanced quadrature encoder/decoder module provides interfacing capability to position/speed sensors. There are five input signals: PHASEA, PHASEB, INDEX, TRIGGER, and HOME. This module is used to decode shaft position, revolution count, and speed. ENET Ethernet Controller Connectivity Peripherals The Ethernet Media Access Controller (MAC) is designed to support 10/100 Mbit/s Ethernet/IEEE 802.3 networks. An external transceiver interface and transceiver function are required to complete the interface to the media. The module has dedicated hardware to support the IEEE 1588 standard. See the ENET chapter of the reference manual for details. EWM External Watchdog Monitor Timer Peripherals The EWM modules is designed to monitor external circuits, as well as the software flow. This provides a back-up mechanism to the internal WDOG that can reset the system. The EWM differs from the internal WDOG in that it does not reset the system. The EWM, if allowed to time-out, provides an independent trigger pin that when asserted resets or places an external circuit into a safe mode. FLEXCAN1 FLEXCAN2 Flexible Controller Area Network Connectivity Peripherals The CAN protocol was primarily, but not only, designed to be used as a vehicle serial data bus, meeting the specific requirements of this field: real-time processing, reliable operation in the Electromagnetic interference (EMI) environment of a vehicle, cost-effectiveness and required bandwidth. The FlexCAN module is a full implementation of the CAN protocol specification, Version 2.0 B, which supports both standard and extended message frames. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 13 Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description FLEXCAN (FD) Flexible Controller Area Network Connectivity Peripherals The CAN with Flexible Data-Rate protocol and the CAN 2.0 version B protocol supports both standard and extended message frames, both of them have long payloads up to 64 bytes transferred at faster rates up to 8 Mbps. FlexIO1 FlexIO2 Flexible Input/output Connectivity and Communications The FlexIO is capable of supporting a wide range of protocols including, but not limited to: UART, I2C, SPI, I2S, camera interface, display interface, PWM waveform generation, etc. The module can remain functional when the chip is in a low power mode provided the clock it is using remain active. FlexPWM1 FlexPWM2 FlexPWM3 FlexPWM4 Pulse Width Modulation Timer Peripherals The pulse-width modulator (PWM) contains four PWM sub-modules, each of which is set up to control a single half-bridge power stage. Fault channel support is provided. The PWM module can generate various switching patterns, including highly sophisticated waveforms. FlexRAM RAM Memories The i.MX RT1060 has 1 MB of on-chip RAM which could be flexible allocated to I-TCM, D-TCM, and on-chip RAM (OCRAM) in a 32 KB granularity. The FlexRAM is the manager of the on-chip RAM array. Major functions of this blocks are: interfacing to I-TCM and D-TCM of Arm core and OCRAM controller; dynamic RAM arrays allocation for I-TCM, D-TCM, and OCRAM. FlexSPI1 FlexSPI2 Quad Serial Peripheral Interface Connectivity and Communications FlexSPI acts as an interface to one or two external serial flash devices, each with up to four bidirectional data lines. GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 General Purpose I/O Modules System Control Peripherals Used for general purpose input/output to external ICs. Each GPIO module supports up to 32 bits of I/O. GPT1 GPT2 General Purpose Timer Timer Peripherals Each GPT is a 32-bit “free-running” or “set and forget” mode timer with programmable prescaler and compare and capture register. A timer counter value can be captured using an external event and can be configured to trigger a capture event on either the leading or trailing edges of an input pulse. When the timer is configured to operate in “set and forget” mode, it is capable of providing precise interrupts at regular intervals with minimal processor intervention. The counter has output compare logic to provide the status and interrupt at comparison. This timer can be configured to run either on an external clock or on an internal clock. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 14 NXP Semiconductors Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description KPP Keypad Port Human Machine Interfaces LCDIF LCD interface Multimedia Peripherals The LCDIF is a general purpose display controller used to drive a wide range of display devices varying in size and capabilities. The LCDIF is designed to support dumb (synchronous 24-bit Parallel RGB interface) and smart (asynchronous parallel MPU interface) LCD devices. LPI2C1 LPI2C2 LPI2C3 LPI2C4 Low Power Inter-integrated Circuit Connectivity and Communications The LPI2C is a low power Inter-Integrated Circuit (I2C) module that supports an efficient interface to an I2C bus as a master. The I2C provides a method of communication between a number of external devices. More detailed information, see Section 4.9.2, LPI2C module timing parameters. LPSPI1 LPSPI2 LPSPI3 LPSPI4 Low Power Serial Peripheral Interface Connectivity and Communications The LPSPI is a low power Serial Peripheral Interface (SPI) module that support an efficient interface to an SPI bus as a master and/or a slave. • It can continue operating while the chip is in stop modes, if an appropriate clock is available • Designed for low CPU overhead, with DMA off loading of FIFO register access LPUART1 LPUART2 LPUART3 LPUART4 LPUART5 LPUART6 LPUART7 LPUART8 UART Interface Connectivity Peripherals Each of the UART modules support the following serial data transmit/receive protocols and configurations: • 7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd or none) • Programmable baud rates up to 20 Mbps. MQS Medium Quality Sound Multimedia Peripherals MQS is used to generate 2-channel medium quality PWM-like audio via two standard digital GPIO pins. PXP Pixel Processing Pipeline Multimedia Peripherals A high-performance pixel processor capable of 1 pixel/clock performance for combined operations, such as color-space conversion, alpha blending, and rotation. The PXP is enhanced with features specifically for gray scale applications. In addition, the PXP supports traditional pixel/frame processing paths for still-image and video processing applications. The KPP is a 16-bit peripheral that can be used as a keypad matrix interface or as general purpose input/output (I/O). It supports 8 x 8 external key pad matrix. Main features are: • Multiple-key detection • Long key-press detection • Standby key-press detection • Supports a 2-point and 3-point contact key matrix i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 15 Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description QuadTimer1 QuadTimer2 QuadTimer3 QuadTimer4 QuadTimer Timer Peripherals The quad-timer provides four time channels with a variety of controls affecting both individual and multi-channel features.Specific features include up/down count, cascading of counters, programmable module, count once/repeated, counter preload, compare registers with preload, shared use of input signals, prescaler controls, independent capture/compare, fault input control, programmable input filters, and multi-channel synchronization. ROMCP ROM Controller with Patch Memories and The ROMCP acts as an interface between the Arm Memory Controllers advanced high-performance bus and the ROM. The on-chip ROM is only used by the Cortex-M7 core during boot up. Size of the ROM is 96 KB. RTC OSC Real Time Clock Oscillator Clock Sources and The RTC OSC provides the clock source for the Control Real-Time Clock module. The RTC OSC module, in conjunction with an external crystal, generates a 32.768 kHz reference clock for the RTC. RTWDOG Watch Dog Timer Peripherals The RTWDG module is a high reliability independent timer that is available for system to use. It provides a safety feature to ensure software is executing as planned and the CPU is not stuck in an infinite loop or executing unintended code. If the WDOG module is not serviced (refreshed) within a certain period, it resets the MCU. Windowed refresh mode is supported as well. SAI1 SAI2 SAI3 Synchronous Audio Interface Multimedia Peripherals The SAI module provides a synchronous audio interface (SAI) that supports full duplex serial interfaces with frame synchronization, such as I2S, AC97, TDM, and codec/DSP interfaces. SA-TRNG Standalone True Random Number Generator Security The SA-TRNG is hardware accelerator that generates a 512-bit entropy as needed by an entropy consuming module or by other post processing functions. SEMC Smart External Memory Controller Memory and Memory Controller The SEMC is a multi-standard memory controller optimized for both high-performance and low pin-count. It can support multiple external memories in the same application with shared address and data pins. The interface supported includes SDRAM, NOR Flash, SRAM, and NAND Flash, as well as 8080 display interface. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 16 NXP Semiconductors Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description SJC System JTAG Controller System Control Peripherals The SJC provides JTAG interface, which complies with JTAG TAP standards, to internal logic. The i.MX RT1060 processors use JTAG port for production, testing, and system debugging. In addition, the SJC provides BSR (Boundary Scan Register) standard support, which complies with IEEE 1149.1 and IEEE 1149.6 standards. The JTAG port is accessible during platform initial laboratory bring-up, for manufacturing tests and troubleshooting, as well as for software debugging by authorized entities. The i.MX RT1060 SJC incorporates three security modes for protecting against unauthorized accesses. Modes are selected through eFUSE configuration. SNVS Secure Non-Volatile Storage Security SPDIF Sony Philips Digital Interconnect Format Multimedia Peripherals Temp Monitor Temperature Monitor Analog TSC Touch Screen Human Machine Interfaces USBO2 Universal Serial Bus 2.0 Connectivity Peripherals Secure Non-Volatile Storage, including Secure Real Time Clock, Security State Machine, Master Key Control, Violation, and reporting. A standard audio file transfer format, developed jointly by the Sony and Phillips corporations. Has Transmitter and Receiver functionality. The temperature sensor implements a temperature sensor/conversion function based on a temperature-dependent voltage to time conversion. With touch controller to support 4-wire and 5-wire resistive touch panel. USBO2 (USB OTG1 and USB OTG2) contains: • Two high-speed OTG 2.0 modules with integrated HS USB PHYs • Support eight Transmit (TX) and eight Receive (Rx) endpoints, including endpoint 0 i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 NXP Semiconductors 17 Modules List Table 2. i.MX RT1060 modules list (continued) Block Mnemonic Block Name Subsystem Brief Description uSDHC1 uSDHC2 SD/MMC and SDXC Enhanced Multi-Media Card / Secure Digital Host Controller Connectivity Peripherals i.MX RT1060 specific SoC characteristics: All four MMC/SD/SDIO controller IPs are identical and are based on the uSDHC IP. They are: • Fully compliant with MMC command/response sets and Physical Layer as defined in the Multimedia Card System Specification, v4.5/4.2/4.3/4.4/4.41/ including high-capacity (size > 2 GB) cards HC MMC. • Fully compliant with SD command/response sets and Physical Layer as defined in the SD Memory Card Specifications, v3.0 including high-capacity SDXC cards up to 2 TB. • Fully compliant with SDIO command/response sets and interrupt/read-wait mode as defined in the SDIO Card Specification, Part E1, v3.0 Two ports support: • 1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to UHS-I SDR104 mode (104 MB/s max) • 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52 MHz in both SDR and DDR modes (104 MB/s max) • 4-bit or 8-bit transfer mode specifications for eMMC chips up to 200 MHz in HS200 mode (200 MB/s max) WDOG1 WDOG2 Watch Dog Timer Peripherals The watchdog (WDOG) Timer supports two comparison points during each counting period. Each of the comparison points is configurable to evoke an interrupt to the Arm core, and a second point evokes an external event on the WDOG line. XBAR Cross BAR Cross Trigger Each crossbar switch is an array of muxes with shared inputs. Each mux output provides one output of the crossbar. The number of inputs and the number of muxes/outputs are user configurable and registers are provided to select which of the shared inputs are routed to each output. i.MX RT1060 Crossover Processors for Industrial Products, Rev. 3, 03/2022 18 NXP Semiconductors Modules List 3.1 Special signal considerations Table 3 lists special signal considerations for the i.MX RT1060 processors. The signal names are listed in alphabetical order. The package contact assignments can be found in Section 6, Package information and contact assignments.” Signal descriptions are provided in the i.MX RT1060 Reference Manual (IMXRT1060RM). Table 3. Special signal considerations Signal Name Remarks CCM_CLK1_P/ CCM_CLK1_N One general purpose differential high speed clock Input/output (LVDS I/O) is provided. It can be used: • To feed external reference clock to the PLLs and further to the modules inside SoC. • To output internal SoC clock to be used outside the SoC as either reference clock or as a functional clock for peripherals. See the i.MX RT1060 Reference Manual (IMXRT1060RM) for details on the respective clock trees. Alternatively one may use single ended signal to drive CLK1_P input. In this case corresponding CLK1_N input should be tied to the constant voltage level equal 1/2 of the input signal swing. Termination should be provided in case of high frequency signals. After initialization, the CLK1 input/output can be disabled (if not used). If unused either or both of the CLK1_N/P pairs may remain unconnected. DCDC_PSWITCH PAD is in DCDC_IN domain and connected the ground to bypass DCDC. To enable DCDC function, assert to DCDC_IN with at least 1ms delay for DCDC_IN rising edge. RTC_XTALI/RTC_XTALO If the user wishes to configure RTC_XTALI and RTC_XTALO as an RTC oscillator, a 32.768 kHz crystal, (100 k ESR, 10 pF load) should be connected between RTC_XTALI and RTC_XTALO. Keep in mind the capacitors implemented on either side of the crystal are about twice the crystal load capacitor. To hit the exact oscillation frequency, the board capacitors need to be reduced to account for board and chip parasitics. The integrated oscillation amplifier is self biasing, but relatively weak. Care must be taken to limit parasitic leakage from RTC_XTALI and RTC_XTALO to either power or ground (>100 M). This will debias the amplifier and cause a reduction of startup margin. Typically RTC_XTALI and RTC_XTALO should bias to approximately 0.5 V. If it is desired to feed an external low frequency clock into RTC_XTALI the RTC_XTALO pin must remain unconnected or driven with a complimentary signal. The logic level of this forcing clock should not exceed VDD_SNVS_CAP level and the frequency should be