Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K11P80M50SF4
Rev. 4.1, 08/2013
K11P80M50SF4
K11 Sub-Family
Supports the following:
MK11DX128VLK5, MK11DX256VLK5,
MK11DN512VLK5
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 50 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB of program flash for devices without
FlexNVM.
– Up to 256 KB program flash for devices with
FlexNVM.
– 64 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 64 KB RAM
– Serial programming interface (EzPort)
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Tamper detect and secure storage
– Hardware random-number generator
– Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel general purpose timers, one with
quadrature decoder functionality
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB Device Charger detect
– Two SPI modules
– Two I2C modules
– Four UART modules
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
5.3.2
General switching specifications...........................20
5.4 Thermal specifications.......................................................20
2 Part identification......................................................................3
5.4.1
Thermal operating requirements...........................21
2.1 Description.........................................................................3
5.4.2
Thermal attributes.................................................21
2.2 Format...............................................................................3
6 Peripheral operating requirements and behaviors....................22
2.3 Fields.................................................................................3
6.1 Core modules....................................................................22
2.4 Example............................................................................4
6.1.1
JTAG electricals....................................................22
2.5 Small package marking.....................................................4
6.2 System modules................................................................25
3 Terminology and guidelines......................................................5
6.3 Clock modules...................................................................25
3.1 Definition: Operating requirement......................................5
6.3.1
MCG specifications...............................................25
3.2 Definition: Operating behavior...........................................5
6.3.2
Oscillator electrical specifications.........................27
3.3 Definition: Attribute............................................................6
6.3.3
32 kHz oscillator electrical characteristics.............29
3.4 Definition: Rating...............................................................6
6.4 Memories and memory interfaces.....................................30
3.5 Result of exceeding a rating..............................................7
6.4.1
Flash electrical specifications................................30
3.6 Relationship between ratings and operating
6.4.2
EzPort switching specifications.............................33
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
6.5 Security and integrity modules..........................................34
6.5.1
DryIce Tamper Electrical Specifications................34
6.6 Analog...............................................................................34
3.9 Typical value conditions....................................................9
6.6.1
ADC electrical specifications.................................34
4 Ratings......................................................................................9
6.6.2
CMP and 6-bit DAC electrical specifications.........38
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................41
4.2 Moisture handling ratings..................................................10
6.8 Communication interfaces.................................................41
4.3 ESD handling ratings.........................................................10
6.8.1
4.4 Voltage and current operating ratings...............................10
DSPI switching specifications (limited voltage
range)....................................................................41
5 General.....................................................................................10
6.8.2
DSPI switching specifications (full voltage range).43
5.1 AC electrical characteristics..............................................11
6.8.3
I2C switching specifications..................................45
5.2 Nonswitching electrical specifications...............................11
6.8.4
UART switching specifications..............................45
6.8.5
Normal Run, Wait and Stop mode performance
5.2.1
Voltage and current operating requirements.........11
5.2.2
LVD and POR operating requirements.................12
5.2.3
Voltage and current operating behaviors..............13
5.2.4
Power mode transition operating behaviors..........13
over the full operating voltage range.....................47
5.2.5
Power consumption operating behaviors..............14
7 Dimensions...............................................................................49
5.2.6
EMC radiated emissions operating behaviors.......18
7.1 Obtaining package dimensions.........................................49
5.2.7
Designing with radiated emissions in mind...........19
8 Pinout........................................................................................49
5.2.8
Capacitance attributes..........................................19
8.1 K11 Signal Multiplexing and Pin Assignments..................49
5.3 Switching specifications.....................................................19
8.2 K11 Pinouts.......................................................................52
5.3.1
Device clock specifications...................................19
over the full operating voltage range.....................45
6.8.6
VLPR, VLPW, and VLPS mode performance
9 Revision History........................................................................54
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to freescale.com and perform a part number search for the
following device numbers: PK11 and MK11 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
Q
Qualification status
• M = Fully qualified, general market flow
• P = Prequalification
K##
Kinetis family
• K11
A
Key attribute
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
M
Flash memory type
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
3
Part identification
Field
Description
Values
FFF
Program flash memory size
•
•
•
•
•
•
•
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
2M0 = 2 MB
R
Silicon revision
• Z = Initial
• (Blank) = Main
• A = Revision after main
T
Temperature range (°C)
• V = –40 to 105
• C = –40 to 85
PP
Package identifier
•
•
•
•
•
•
•
•
•
•
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
MP = 64 MAPBGA (5 mm x 5 mm)
LK = 80 LQFP (12 mm x 12 mm)
LL = 100 LQFP (14 mm x 14 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
CC
Maximum CPU frequency (MHz)
•
•
•
•
•
•
5 = 50 MHz
7 = 72 MHz
10 = 100 MHz
12 = 120 MHz
15 = 150 MHz
18 = 180 MHz
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK11DX128VLK5
2.5 Small package marking
In an effort to save space, small package devices use special marking on the chip. These
markings have the following format:
Q ## C F T PP
This table lists the possible values for each field in the part number for small packages
(not all combinations are valid):
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
4
Freescale Semiconductor, Inc.
Terminology and guidelines
Field
Description
Values
Q
Qualification status
• M = Fully qualified, general market flow
• P = Prequalification
C
Speed
• G = 50 MHz
F
Flash memory configuration
• G = 128 KB + Flex
• H = 256 KB + Flex
• 9 = 512 KB
T
Temperature range (°C)
• V = –40 to 105
PP
Package identifier
• MC = 121 MAPBGA
This tables lists some examples of small package marking along with the original part
numbers:
Original part number
Alternate part number
MK11DX128VLK5
M11GGVLK
MK11DX256VMC5
M11GHVMC
3 Terminology and guidelines
3.1 Definition: Operating requirement
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement:
Symbol
VDD
Description
1.0 V core supply
voltage
Min.
0.9
Max.
1.1
Unit
V
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
5
Terminology and guidelines
3.2 Definition: Operating behavior
An operating behavior is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior:
Symbol
IWP
Description
Min.
Digital I/O weak pullup/ 10
pulldown current
Max.
130
Unit
µA
3.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
3.3.1 Example
This is an example of an attribute:
Symbol
CIN_D
Description
Input capacitance:
digital pins
Min.
—
Max.
7
Unit
pF
3.4 Definition: Rating
A rating is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
• Operating ratings apply during operation of the chip.
• Handling ratings apply when the chip is not powered.
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
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Freescale Semiconductor, Inc.
Terminology and guidelines
3.4.1 Example
This is an example of an operating rating:
Symbol
VDD
Description
Min.
1.0 V core supply
voltage
Max.
–0.3
Unit
1.2
V
3.5 Result of exceeding a rating
40
Failures in time (ppm)
30
The likelihood of permanent chip failure increases rapidly as
soon as a characteristic begins to exceed one of its operating ratings.
20
10
0
Operating rating
Measured characteristic
3.6 Relationship between ratings and operating requirements
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Fatal range
Degraded operating range
Normal operating range
Degraded operating range
Fatal range
Expected permanent failure
- No permanent failure
- Possible decreased life
- Possible incorrect operation
- No permanent failure
- Correct operation
- No permanent failure
- Possible decreased life
- Possible incorrect operation
Expected permanent failure
–∞
∞
Operating (power on)
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Fatal range
Handling range
Fatal range
Expected permanent failure
No permanent failure
Expected permanent failure
–∞
Handling (power off)
∞
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
7
Terminology and guidelines
3.7 Guidelines for ratings and operating requirements
Follow these guidelines for ratings and operating requirements:
• Never exceed any of the chip’s ratings.
• During normal operation, don’t exceed any of the chip’s operating requirements.
• If you must exceed an operating requirement at times other than during normal
operation (for example, during power sequencing), limit the duration as much as
possible.
3.8 Definition: Typical value
A typical value is a specified value for a technical characteristic that:
• Lies within the range of values specified by the operating behavior
• Given the typical manufacturing process, is representative of that characteristic
during operation when you meet the typical-value conditions or other specified
conditions
Typical values are provided as design guidelines and are neither tested nor guaranteed.
3.8.1 Example 1
This is an example of an operating behavior that includes a typical value:
Symbol
IWP
Description
Digital I/O weak
pullup/pulldown
current
Min.
10
Typ.
70
Max.
130
Unit
µA
3.8.2 Example 2
This is an example of a chart that shows typical values for various voltage and
temperature conditions:
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
8
Freescale Semiconductor, Inc.
Ratings
5000
4500
4000
TJ
IDD_STOP (μA)
3500
150 °C
3000
105 °C
2500
25 °C
2000
–40 °C
1500
1000
500
0
0.90
0.95
1.00
1.05
1.10
VDD (V)
3.9 Typical value conditions
Typical values assume you meet the following conditions (or other conditions as
specified):
Symbol
Description
Value
Unit
TA
Ambient temperature
25
°C
VDD
3.3 V supply voltage
3.3
V
4 Ratings
4.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
9
General
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-2000
+2000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 105°C
-100
+100
mA
3
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test.
4.4 Voltage and current operating ratings
Symbol
Description
Min.
Max.
Unit
VDD
Digital supply voltage
–0.3
3.8
V
IDD
Digital supply current
—
155
mA
VDIO
Digital input voltage (except RESET, EXTAL, and XTAL)
–0.3
VAIO
Analog1, RESET, EXTAL, and XTAL input voltage
–0.3
VDD + 0.3
V
Maximum current single pin limit (applies to all digital pins)
–25
25
mA
VDD – 0.3
VDD + 0.3
V
USB regulator input
–0.3
6.0
V
RTC battery supply voltage
–0.3
3.8
V
ID
VDDA
VREGIN
VBAT
Analog supply voltage
V
1. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
5 General
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
10
Freescale Semiconductor, Inc.
General
5.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Figure 1. Input signal measurement reference
5.2 Nonswitching electrical specifications
5.2.1 Voltage and current operating requirements
Table 1. Voltage and current operating requirements
Symbol
Description
Min.
Max.
Unit
VDD
Supply voltage
1.71
3.6
V
VDDA
Analog supply voltage
1.71
3.6
V
VDD – VDDA VDD-to-VDDA differential voltage
–0.1
0.1
V
VSS – VSSA VSS-to-VSSA differential voltage
–0.1
0.1
V
1.71
3.6
V
• 2.7 V ≤ VDD ≤ 3.6 V
0.7 × VDD
—
V
• 1.7 V ≤ VDD ≤ 2.7 V
0.75 × VDD
—
V
• 2.7 V ≤ VDD ≤ 3.6 V
—
0.35 × VDD
V
• 1.7 V ≤ VDD ≤ 2.7 V
—
0.3 × VDD
V
0.06 × VDD
—
V
VBAT
VIH
VIL
RTC battery supply voltage
Notes
Input high voltage
Input low voltage
VHYS
Input hysteresis
IICIO
I/O pin DC injection current — single pin
• VIN < VSS-0.3V (Negative current injection)
• VIN > VDD+0.3V (Positive current injection)
1
mA
-3
—
—
+3
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
11
General
Table 1. Voltage and current operating requirements (continued)
Symbol
IICcont
Description
Min.
Max.
Unit
-25
—
mA
—
+25
1.2
—
V
VPOR_VBAT
—
V
Contiguous pin DC injection current —regional limit,
includes sum of negative injection currents or sum of
positive injection currents of 16 contiguous pins
• Negative current injection
• Positive current injection
VRAM
VRFVBAT
VDD voltage required to retain RAM
VBAT voltage required to retain the VBAT register file
Notes
1. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is less than VAIO_MIN or greater
than VAIO_MAX, a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as
R=(VAIO_MIN-VIN)/|IICAIO|. The positive injection current limiting resistor is calculated as R=(VIN-VAIO_MAX)/|IICAIO|. Select the
larger of these two calculated resistances if the pin is exposed to positive and negative injection currents.
5.2.2 LVD and POR operating requirements
Table 2. VDD supply LVD and POR operating requirements
Symbol
Description
Min.
Typ.
Max.
Unit
VPOR
Falling VDD POR detect voltage
0.8
1.1
1.5
V
VLVDH
Falling low-voltage detect threshold — high
range (LVDV=01)
2.48
2.56
2.64
V
Low-voltage warning thresholds — high range
1
VLVW1H
• Level 1 falling (LVWV=00)
2.62
2.70
2.78
V
VLVW2H
• Level 2 falling (LVWV=01)
2.72
2.80
2.88
V
VLVW3H
• Level 3 falling (LVWV=10)
2.82
2.90
2.98
V
VLVW4H
• Level 4 falling (LVWV=11)
2.92
3.00
3.08
V
—
80
—
mV
1.54
1.60
1.66
V
VHYSH
Low-voltage inhibit reset/recover hysteresis —
high range
VLVDL
Falling low-voltage detect threshold — low range
(LVDV=00)
Low-voltage warning thresholds — low range
1
VLVW1L
• Level 1 falling (LVWV=00)
1.74
1.80
1.86
V
VLVW2L
• Level 2 falling (LVWV=01)
1.84
1.90
1.96
V
VLVW3L
• Level 3 falling (LVWV=10)
1.94
2.00
2.06
V
VLVW4L
• Level 4 falling (LVWV=11)
2.04
2.10
2.16
V
—
60
—
mV
VHYSL
Low-voltage inhibit reset/recover hysteresis —
low range
Notes
VBG
Bandgap voltage reference
0.97
1.00
1.03
V
tLPO
Internal low power oscillator period — factory
trimmed
900
1000
1100
μs
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
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Freescale Semiconductor, Inc.
General
1. Rising threshold is the sum of falling threshold and hysteresis voltage
Table 3. VBAT power operating requirements
Symbol
Description
VPOR_VBAT Falling VBAT supply POR detect voltage
Min.
Typ.
Max.
Unit
0.8
1.1
1.5
V
Notes
5.2.3 Voltage and current operating behaviors
Table 4. Voltage and current operating behaviors
Symbol
VOH
Description
Min.
Max.
Unit
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = - 9 mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3 mA
VDD – 0.5
—
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2 mA
VDD – 0.5
—
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6 mA
VDD – 0.5
—
V
—
100
mA
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 9 mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3 mA
—
0.5
V
• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2 mA
—
0.5
V
• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6 mA
—
0.5
V
—
100
mA
• @ full temperature range
—
1.0
μA
• @ 25 °C
—
0.1
μA
Notes
Output high voltage — high drive strength
Output high voltage — low drive strength
IOHT
Output high current total for all ports
VOL
Output low voltage — high drive strength
Output low voltage — low drive strength
IOLT
IIN
Output low current total for all ports
Input leakage current (per pin)
1
IOZ
Hi-Z (off-state) leakage current (per pin)
—
1
μA
IOZ
Total Hi-Z (off-state) leakage current (all input pins)
—
4
μA
RPU
Internal pullup resistors
22
50
kΩ
2
RPD
Internal pulldown resistors
22
50
kΩ
3
1. Tested by ganged leakage method
2. Measured at Vinput = VSS
3. Measured at Vinput = VDD
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
13
General
5.2.4 Power mode transition operating behaviors
All specifications except tPOR, and VLLSx→RUN recovery times in the following table
assume this clock configuration:
•
•
•
•
CPU and system clocks = 50 MHz
Bus clock = 50 MHz
Flash clock = 25 MHz
MCG mode: FEI
Table 5. Power mode transition operating behaviors
Symbol
tPOR
Description
Min.
Max.
After a POR event, amount of time from the point VDD
reaches 1.71 V to execution of the first instruction
across the operating temperature range of the chip.
• 1.71 V/(VDD slew rate) ≤ 300 μs
• 1.71 V/(VDD slew rate) > 300 μs
• VLLS0 → RUN
• VLLS1 → RUN
• VLLS2 → RUN
• VLLS3 → RUN
• LLS → RUN
• VLPS → RUN
• STOP → RUN
Unit
Notes
μs
1
—
300
—
1.7 V / (VDD
slew rate)
—
135
μs
—
135
μs
—
85
μs
—
85
μs
—
6
μs
—
5.2
μs
—
5.2
μs
1. Normal boot (FTFL_OPT[LPBOOT]=1)
5.2.5 Power consumption operating behaviors
Table 6. Power consumption operating behaviors
Symbol
IDDA
IDD_RUN
Description
Analog supply current
Min.
Typ.
Max.
Unit
Notes
—
—
See note
mA
1
Run mode current — all peripheral clocks
disabled, code executing from flash
• @ 1.8 V
• @ 3.0 V
2
—
12.98
14
mA
—
12.93
13.8
mA
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
14
Freescale Semiconductor, Inc.
General
Table 6. Power consumption operating behaviors (continued)
Symbol
Description
Min.
IDD_RUN
Run mode current — all peripheral clocks
enabled, code executing from flash
• @ 1.8 V
Typ.
Max.
Unit
Notes
3, 4
—
17.04
19.3
mA
—
17.01
18.9
mA
—
19.8
21.3
mA
• @ 3.0 V
• @ 25°C
• @ 125°C
IDD_WAIT
Wait mode high frequency current at 3.0 V — all
peripheral clocks disabled
—
7.95
9.5
mA
2
IDD_WAIT
Wait mode reduced frequency current at 3.0 V —
all peripheral clocks disabled
—
5.88
7.4
mA
5
IDD_STOP
Stop mode current at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
320
436
360
489
410
620
610
1100
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks disabled
—
754
—
μA
6
IDD_VLPR
Very-low-power run mode current at 3.0 V — all
peripheral clocks enabled
—
1.1
—
mA
7
IDD_VLPW
Very-low-power wait mode current at 3.0 V
—
437
—
μA
8
IDD_VLPS
Very-low-power stop mode current at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
7.33
24.2
14
32
28
48
110
280
3.14
4.8
6.48
28.3
13.85
44.6
55.53
71.3
2.19
3.4
4.35
4.35
8.92
24.6
35.33
45.3
1.77
3.1
2.81
13.8
5.20
22.3
19.88
34.2
IDD_LLS
IDD_VLLS3
Low leakage stop mode current at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
Very low-leakage stop mode 3 current at 3.0 V
•
•
•
•
IDD_VLLS2
—
—
@ –40 to 25°C
@ 50°C
@ 70°C
@ 105°C
Very low-leakage stop mode 2 current at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
μA
μA
μA
μA
μA
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
15
General
Table 6. Power consumption operating behaviors (continued)
Symbol
IDD_VLLS1
IDD_VLLS0
IDD_VLLS0
IDD_VBAT
Description
Min.
Very low-leakage stop mode 1 current at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
Very low-leakage stop mode 0 current at 3.0 V
with POR detect circuit enabled
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
Very low-leakage stop mode 0 current at 3.0 V
with POR detect circuit disabled
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
Average current when CPU is not accessing RTC
registers at 3.0 V
• @ –40 to 25°C
• @ 50°C
• @ 70°C
• @ 105°C
—
Typ.
Max.
1.03
1.8
1.92
7.5
4.03
15.9
17.43
28.7
0.543
1.1
1.36
7.58
3.39
14.3
16.52
24.1
0.359
0.95
1.03
6.8
2.87
15.4
15.20
25.3
0.91
1.1
1.1
1.35
1.5
1.85
4.3
5.7
Unit
Notes
μA
μA
μA
μA
9
1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See
each module's specification for its supply current.
2. 50 MHz core and system clock, 25 MHz bus clock, and 25 MHz flash clock. MCG configured for FEI mode. All peripheral
clocks disabled.
3. 50 MHz core and system clock, 25 MHz bus clock, and 25 MHz flash clock. MCG configured for FEI mode. All peripheral
clocks enabled, and peripherals are in active operation.
4. Max values are measured with CPU executing DSP instructions
5. 25 MHz core and system clock, 25 MHz bus clock, and 12.5 MHz flash clock. MCG configured for FEI mode.
6. 4 MHz core, system, and bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled.
Code executing from flash.
7. 4 MHz core, system, and bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks enabled
but peripherals are not in active operation. Code executing from flash.
8. 4 MHz core, system, and bus clock and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled.
9. Includes 32 kHz oscillator current and RTC operation.
5.2.5.1
Diagram: Typical IDD_RUN operating behavior
The following data was measured under these conditions:
•
•
•
•
•
MCG in FBE mode
USB regulator disabled
No GPIOs toggled
Code execution from flash with cache enabled
For the ALLOFF curve, all peripheral clocks are disabled except FTFL
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
16
Freescale Semiconductor, Inc.
General
Figure 2. Run mode supply current vs. core frequency
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
17
General
Figure 3. VLPR mode supply current vs. core frequency
5.2.6 EMC radiated emissions operating behaviors
Table 7. EMC radiated emissions operating behaviors 1
Symbol
Description
Frequency
band (MHz)
Typ.
Unit
Notes
2, 3
VRE1
Radiated emissions voltage, band 1
0.15–50
19
dBμV
VRE2
Radiated emissions voltage, band 2
50–150
21
dBμV
VRE3
Radiated emissions voltage, band 3
150–500
19
dBμV
VRE4
Radiated emissions voltage, band 4
500–1000
11
dBμV
IEC level
0.15–1000
L
—
VRE_IEC
3, 4
1. This data was collected on a MK20DN128VLH5 64pin LQFP device.
2. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported
emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the
measured orientations in each frequency range.
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
18
Freescale Semiconductor, Inc.
General
3. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 48 MHz, fBUS = 48MHz
4. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
—
7
pF
CIN_D
Input capacitance: digital pins
—
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
—
50
MHz
fBUS
Bus clock
—
50
MHz
fFLASH
Flash clock
—
25
MHz
fLPTMR
LPTMR clock
—
25
MHz
VLPR mode1
fSYS
System and core clock
—
4
MHz
fBUS
Bus clock
—
4
MHz
fFLASH
Flash clock
—
1
MHz
fERCLK
External reference clock
—
16
MHz
LPTMR clock
—
25
MHz
LPTMR external reference clock
—
16
MHz
fI2S_MCLK
I2S master clock
—
12.5
MHz
fI2S_BCLK
I2S bit clock
—
4
MHz
fLPTMR_pin
fLPTMR_ERCLK
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
19
General
1. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any
other module.
5.3.2 General switching specifications
These general purpose specifications apply to all pins configured for:
• GPIO signaling
• Other peripheral module signaling not explicitly stated elsewhere
Table 10. General switching specifications
Symbol
Description
Min.
Max.
Unit
Notes
GPIO pin interrupt pulse width (digital glitch filter
disabled) — Synchronous path
1.5
—
Bus clock
cycles
1, 2
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter enabled) — Asynchronous path
100
—
ns
3
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter disabled) — Asynchronous path
50
—
ns
3
External reset pulse width (digital glitch filter disabled)
100
—
ns
3
Port rise and fall time (high drive strength)
4
• Slew disabled
• 1.71 ≤ VDD ≤ 2.7V
—
13
ns
• 2.7 ≤ VDD ≤ 3.6V
—
7
ns
• 1.71 ≤ VDD ≤ 2.7V
—
36
ns
• 2.7 ≤ VDD ≤ 3.6V
—
24
ns
• Slew enabled
Port rise and fall time (low drive strength)
5
• Slew disabled
• 1.71 ≤ VDD ≤ 2.7V
—
12
ns
• 2.7 ≤ VDD ≤ 3.6V
—
6
ns
• 1.71 ≤ VDD ≤ 2.7V
—
36
ns
• 2.7 ≤ VDD ≤ 3.6V
—
24
ns
• Slew enabled
1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be
recognized in that case.
2. The greater synchronous and asynchronous timing must be met.
3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and
VLLSx modes.
4. 75 pF load
5. 15 pF load
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
20
Freescale Semiconductor, Inc.
General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.4.2 Thermal attributes
Board type
Symbol
Description
Single-layer (1s)
RθJA
Four-layer (2s2p)
Unit
Notes
Thermal
50
resistance, junction
to ambient (natural
convection)
°C/W
1, 2
RθJA
Thermal
35
resistance, junction
to ambient (natural
convection)
°C/W
1, 3
Single-layer (1s)
RθJMA
Thermal
39
resistance, junction
to ambient (200 ft./
min. air speed)
°C/W
1,3
Four-layer (2s2p)
RθJMA
Thermal
29
resistance, junction
to ambient (200 ft./
min. air speed)
°C/W
1,3
—
RθJB
Thermal
19
resistance, junction
to board
°C/W
4
—
RθJC
Thermal
8
resistance, junction
to case
°C/W
5
—
ΨJT
Thermal
2
characterization
parameter, junction
to package top
outside center
(natural
convection)
°C/W
6
1.
2.
80 LQFP
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
21
Peripheral operating requirements and behaviors
3.
4.
5.
6.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 JTAG electricals
Table 12. JTAG limited voltage range electricals
Symbol
J1
Description
Min.
Max.
Unit
Operating voltage
2.7
3.6
V
TCLK frequency of operation
MHz
• Boundary Scan
0
10
• JTAG and CJTAG
0
25
• Serial Wire Debug
0
50
1/J1
—
ns
• Boundary Scan
50
—
ns
• JTAG and CJTAG
20
—
ns
• Serial Wire Debug
10
—
ns
J4
TCLK rise and fall times
—
3
ns
J5
Boundary scan input data setup time to TCLK rise
20
—
ns
J6
Boundary scan input data hold time after TCLK rise
0
—
ns
J7
TCLK low to boundary scan output data valid
—
25
ns
J8
TCLK low to boundary scan output high-Z
—
25
ns
J9
TMS, TDI input data setup time to TCLK rise
8
—
ns
J10
TMS, TDI input data hold time after TCLK rise
1
—
ns
J11
TCLK low to TDO data valid
—
17
ns
J12
TCLK low to TDO high-Z
—
17
ns
J13
TRST assert time
100
—
ns
J14
TRST setup time (negation) to TCLK high
8
—
ns
J2
TCLK cycle period
J3
TCLK clock pulse width
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
22
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 13. JTAG full voltage range electricals
Symbol
J1
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
TCLK frequency of operation
MHz
• Boundary Scan
0
10
• JTAG and CJTAG
0
20
• Serial Wire Debug
0
40
1/J1
—
ns
• Boundary Scan
50
—
ns
• JTAG and CJTAG
25
—
ns
• Serial Wire Debug
12.5
—
ns
J2
TCLK cycle period
J3
TCLK clock pulse width
J4
TCLK rise and fall times
—
3
ns
J5
Boundary scan input data setup time to TCLK rise
20
—
ns
J6
Boundary scan input data hold time after TCLK rise
0
—
ns
J7
TCLK low to boundary scan output data valid
—
25
ns
J8
TCLK low to boundary scan output high-Z
—
25
ns
J9
TMS, TDI input data setup time to TCLK rise
8
—
ns
J10
TMS, TDI input data hold time after TCLK rise
1.4
—
ns
J11
TCLK low to TDO data valid
—
22.1
ns
J12
TCLK low to TDO high-Z
—
22.1
ns
J13
TRST assert time
100
—
ns
J14
TRST setup time (negation) to TCLK high
8
—
ns
J2
J3
J3
TCLK (input)
J4
J4
Figure 4. Test clock input timing
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
23
Peripheral operating requirements and behaviors
TCLK
J5
Data inputs
J6
Input data valid
J7
Data outputs
Output data valid
J8
Data outputs
J7
Data outputs
Output data valid
Figure 5. Boundary scan (JTAG) timing
TCLK
J9
TDI/TMS
J10
Input data valid
J11
TDO
Output data valid
J12
TDO
J11
TDO
Output data valid
Figure 6. Test Access Port timing
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
24
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
TCLK
J14
J13
TRST
Figure 7. TRST timing
6.2 System modules
There are no specifications necessary for the device's system modules.
6.3 Clock modules
6.3.1 MCG specifications
Table 14. MCG specifications
Symbol
Description
Min.
Typ.
Max.
Unit
—
32.768
—
kHz
31.25
—
39.0625
kHz
Δfdco_res_t Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM and SCFTRIM
—
± 0.3
± 0.6
%fdco
1
Δfdco_res_t Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM only
—
± 0.2
± 0.5
%fdco
1
fints_ft
Internal reference frequency (slow clock) —
factory trimmed at nominal VDD and 25 °C
fints_t
Internal reference frequency (slow clock) — user
trimmed
Notes
Δfdco_t
Total deviation of trimmed average DCO output
frequency over voltage and temperature
—
+0.5/-0.7
±2
%fdco
1, 2
Δfdco_t
Total deviation of trimmed average DCO output
frequency over fixed voltage and temperature
range of 0–70°C
—
± 0.3
±1
%fdco
1, 2
fintf_ft
Internal reference frequency (fast clock) —
factory trimmed at nominal VDD and 25°C
—
4
—
MHz
fintf_t
Internal reference frequency (fast clock) — user
trimmed at nominal VDD and 25 °C
3
—
5
MHz
floc_low
Loss of external clock minimum frequency —
RANGE = 00
(3/5) x
fints_t
—
—
kHz
floc_high
Loss of external clock minimum frequency —
RANGE = 01, 10, or 11
(16/5) x
fints_t
—
—
kHz
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
Freescale Semiconductor, Inc.
25
Peripheral operating requirements and behaviors
Table 14. MCG specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
31.25
—
39.0625
kHz
20
20.97
25
MHz
40
41.94
50
MHz
60
62.91
75
MHz
80
83.89
100
MHz
—
23.99
—
MHz
—
47.97
—
MHz
—
71.99
—
MHz
—
95.98
—
MHz
—
180
—
—
150
—
—
—
1
ms
48.0
—
100
MHz
—
1060
—
µA
—
600
—
µA
2.0
—
4.0
MHz
Notes
FLL
ffll_ref
fdco
FLL reference frequency range
DCO output
frequency range
Low range (DRS=00)
3, 4
640 × ffll_ref
Mid range (DRS=01)
1280 × ffll_ref
Mid-high range (DRS=10)
1920 × ffll_ref
High range (DRS=11)
2560 × ffll_ref
fdco_t_DMX32 DCO output
frequency
Low range (DRS=00)
5, 6
732 × ffll_ref
Mid range (DRS=01)
1464 × ffll_ref
Mid-high range (DRS=10)
2197 × ffll_ref
High range (DRS=11)
2929 × ffll_ref
Jcyc_fll
FLL period jitter
• fDCO = 48 MHz
• fDCO = 98 MHz
tfll_acquire
FLL target frequency acquisition time
ps
7
PLL
fvco
VCO operating frequency
Ipll
PLL operating current
• PLL @ 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref =
2 MHz, VDIV multiplier = 48)
Ipll
PLL operating current
• PLL @ 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref =
2 MHz, VDIV multiplier = 24)
fpll_ref
PLL reference frequency range
Jcyc_pll
PLL period jitter (RMS)
Jacc_pll
8
8
9
• fvco = 48 MHz
—
120
—
ps
• fvco = 100 MHz
—
50
—
ps
PLL accumulated jitter over 1µs (RMS)
9
• fvco = 48 MHz
—
1350
—
ps
• fvco = 100 MHz
—
600
—
ps
Dlock
Lock entry frequency tolerance
± 1.49
—
± 2.98
%
Dunl
Lock exit frequency tolerance
± 4.47
—
± 5.97
%
Table continues on the next page...
K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013.
26
Freescale Semiconductor, Inc.
Peripheral operating requirements and behaviors
Table 14. MCG specifications (continued)
Symbol
tpll_lock
Description
Lock detector detection time
Min.
Typ.
Max.
Unit
Notes
—
—
150 × 10-6
+ 1075(1/
fpll_ref)
s
10
1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock
mode).
2. 2 V
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