NXP Semiconductors
Data Sheet: Technical Data
MKW36Z/35Z Data Sheet
An ultra low power, highly integrated Bluetooth® Low
Energy 5.0 wireless microcontroller
MKW36Z512
Rev. 8, 05/2020
MKW36Z512VHT4
MKW36Z512VFP4
MKW35Z512VHT4
48 LQFN
40 "Wettable" HVQFN
7x7 mm Pitch 0.5 mm 6x6 mm Pitch 0.5 mm
Multi-Standard Radio
System peripherals
• 2.4 GHz Bluetooth Low Energy (Bluetooth LE) version
• Nine MCU low-power modes to provide power
5.0 compliant supporting up to 8 simultaneous
optimization based on application requirements
hardware connections
• DC-DC Converter supporting Buck and Bypass
• Generic FSK modulation
operating modes
• Data Rate: 250, 500 and 1000 kbps
• Direct memory access (DMA) Controller
• Modulations: GFSK BT = 0.3, 0.5, and 0.7;
• Computer operating properly (COP) watchdog
FSK/MSK
• Serial wire debug (SWD) Interface and Micro Trace
• Modulation Index: 0.32, 0.5, 0.7, and 1.0
buffer
• Typical Receiver Sensitivity
• Bit Manipulation Engine (BME)
(Bluetooth LE 1 Mbps) = –95 dBm
Analog Modules
• Typical Receiver Sensitivity
• 16-bit Analog-to-Digital Converter (ADC)
(250 kbps GFSK-BT=0.5, h=0.5) = –99 dBm
• 6-bit High Speed Analog Comparator (CMP)
• Programmable Transmitter Output Power:
• 1.2 V voltage reference (VREF)
–30 dBm to 5 dBm
• Low external component counts for low cost application
Timers
• On-chip balun with single ended bidirectional RF port
• 16-bit low-power timer (LPTMR)
• 3 Timer/PWM Modules(TPM): One 4 channel TPM
MCU and Memories
and two 2 channel TPMs
• 256 KB program flash memory plus 256 KB FlexNVM
• Programmable Interrupt Timer (PIT)
on KW36Z
• Real-Time Clock (RTC)
• 8 KB FlexRAM supporting EEPROM emulation on
KW36Z
Communication interfaces
• 512 KB program flash memory on KW35Z
• 2 serial peripheral interface (SPI) modules
• Up to 48 MHz Arm® Cortex®-M0+ core
• 2 inter-integrated circuit (I2C) modules
• On-chip 64 KB SRAM
• Low Power UART (LPUART) module with LIN
support (2x LPUART on KW36Z)
Low Power Consumption
• Carrier Modulator Timer (CMT)
• Transceiver current (DC-DC buck mode, 3.6 V supply)
• FlexCAN module (with CAN FD support up to 3.2
Mbps baudrate) on KW36Z
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Security
• AES-128 Hardware Accelerator (AESA)
• True Random Number Generator (TRNG)
• Advanced flash security on Program Flash
• 80-bit unique identification number per chip
• 40-bit unique media access control (MAC) subaddress
• LE Secure Connections
• Typical Rx Current: 6.3 mA
• Typical Tx current: 5.7 mA (0 dBm output)
• Low Power Mode (VLLS0) Current: 258 nA
Clocks
• 26 and 32 MHz supported for Bluetooth LE and
Generic FSK modes
• 32.768 kHz Crystal Oscillator
Operating Characteristics
• Voltage range: 1.71 V to 3.6 V
• Ambient temperature range: –40 to 105 °C
• Industrial Qualification
Human-machine interface
• General-purpose input/output
Orderable parts details
Top Line
Marking
Qualification
CAN
FD
2nd UART with LIN
FlexRAM
Package
MKW36Z512VHT4 (F)M36Z
Industrial
Y
Y
Y
7X7 mm 48-pin
LQFN
MKW36Z512VFP4 M36Z9V4
Industrial
Y
Y
Y
6X6 mm 40-pin
"Wettable" HVQFN
MKW35Z512VHT4 (F)M35Z
Industrial
N
N
N
7X7 mm 48-pin
LQFN
Device
Related Resources
Type
Description
Resource
Product
Selector
The Product Selector lets you find the right Kinetis part for your design.
W-Series Product Selector
Fact Sheet
The Fact Sheet gives overview of the product key features and its uses.
KW36-35-34 Fact Sheet
Reference
Manual
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
MKW36A512RM1
Data Sheet
The Data Sheet includes electrical characteristics and signal
connections.
This document.
Chip Errata
The chip mask set Errata provides additional or corrective information for KINETIS_W_1N41U1
a particular device mask set.
Package
drawing
Package dimensions are provided in package drawings.
• 40-pin "Wettable" HVQFN
(6x6): 98ASA01025D1
• 48-pin LQFN (7x7):
98ASA00694D1
1. To find the associated resource, go to http://www.nxp.com and perform a search using this term.
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Table of Contents
1 Introduction......................................................................... 4
2 Feature Descriptions........................................................... 5
2.1 Block Diagram..............................................................5
2.2 Radio features..............................................................6
2.3 Microcontroller features............................................... 7
2.4 System features........................................................... 8
2.5 Peripheral features.......................................................10
2.6 Security Features.........................................................14
3 Transceiver Description.......................................................16
3.1 Key Specifications........................................................16
3.2 Channel Map Frequency Plans ...................................16
3.2.1 Channel Plan for Bluetooth Low Energy.......... 16
3.2.2 Other Channel Plans .......................................18
3.3 Transceiver Functions..................................................18
4 Transceiver Electrical Characteristics................................. 19
4.1 Radio operating conditions.......................................... 19
4.2 Receiver Feature Summary......................................... 19
4.3 Transmit and PLL Feature Summary...........................22
5 System and Power Management........................................ 26
5.1 Power Management.....................................................27
5.1.1 DC-DC Converter.............................................27
5.2 Modes of Operation..................................................... 27
5.2.1 Power modes................................................... 27
6 KW36Z/35Z Electrical Characteristics.................................30
6.1 AC electrical characteristics.........................................30
6.2 Nonswitching electrical specifications..........................30
6.2.1 Voltage and current operating requirements....30
6.2.2 LVD and POR operating requirements............ 31
6.2.3 Voltage and current operating behaviors......... 32
6.2.4 Power mode transition operating behaviors.....33
6.2.5 Power consumption operating behaviors......... 34
6.2.6 Diagram: Typical IDD_RUN operating
behavior........................................................... 40
6.4.1 Thermal operating requirements...................... 45
6.4.2 Thermal attributes............................................ 46
6.5 Peripheral operating requirements and behaviors....... 46
6.5.1 Core modules...................................................46
6.5.2 System modules.............................................. 47
6.5.3 Clock modules................................................. 48
6.5.4 Memories and memory interfaces....................52
6.5.5 Security and integrity modules......................... 54
6.5.6 Analog.............................................................. 54
6.5.7 Timers.............................................................. 62
6.5.8 Communication interfaces................................62
6.5.9 Human-machine interfaces (HMI).................... 67
6.6 DC-DC Converter Operating Requirements................ 67
6.7 Ratings.........................................................................70
6.7.1 Thermal handling ratings................................. 70
6.7.2 Moisture handling ratings................................. 70
6.7.3 ESD handling ratings....................................... 70
6.7.4 Voltage and current operating ratings.............. 71
7 Pin Diagrams and Pin Assignments.................................... 71
7.1 KW36Z Signal Multiplexing and Pin Assignments....... 71
7.2 KW36Z Pinouts............................................................ 74
7.3 KW35Z Signal Multiplexing and Pin Assignments....... 75
7.4 KW35Z Pinouts............................................................ 78
7.5 Module Signal Description Tables............................... 78
7.5.1 Core Modules...................................................79
7.5.2 Radio Modules................................................. 79
7.5.3 System Modules.............................................. 80
7.5.4 Clock Modules................................................. 81
7.5.5 Analog Modules............................................... 81
7.5.6 Timer Modules................................................. 82
7.5.7 Communication Interfaces............................... 83
7.5.8 Human-Machine Interfaces(HMI)..................... 85
8 Package Information........................................................... 85
6.2.7 SoC Power Consumption.................................42
6.2.8 Designing with radiated emissions in mind...... 43
6.2.9 Capacitance attributes..................................... 43
6.3 Switching electrical specifications................................44
6.3.1 Device clock specifications.............................. 44
6.3.2 General switching specifications...................... 44
6.4 Thermal specifications................................................. 45
8.1 Obtaining package dimensions....................................85
9 Part identification.................................................................85
9.1 Description................................................................... 85
9.2 Format..........................................................................86
9.3 Fields........................................................................... 86
9.4 Example....................................................................... 86
10 Revision History.................................................................. 87
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Introduction
1 Introduction
The KW36Z/35Z wireless microcontrollers (MCU), which includes the KW36Z and
KW35Z families of devices, are highly integrated single-chip devices that enable
Bluetooth Low Energy (Bluetooth LE) and Generic FSK connectivity for industrial and
medical/healthcare embedded systems. The target applications center on wirelessly
bridging the embedded world with mobile devices to enhance the human interface
experience, share embedded data between devices and the cloud and enable wireless
firmware updates.
The KW36Z/35Z Wireless MCU integrates an Arm® Cortex®-M0+ CPU with up to
512 KB flash and 64 KB SRAM and a 2.4 GHz radio that supports Bluetooth LE 5.0
and Generic FSK modulations. The Bluetooth LE radio supports up to 8 simultaneous
connections in any master/slave combination. The Medical Body Area Network
(MBAN) frequencies from 2.36 to 2.4 GHz are also supported enabling wearable or
implantable wireless medical devices.
The KW36Z includes an integrated FlexCAN module enabling seamless integration
into an industrial CAN communication network, enabling communication with external
control and sensor monitoring devices over Bluetooth LE. The FlexCAN module can
support CAN’s flexible data-rate (CAN FD) protocol for increased bandwidth and
lower latency.
The KW36Z/35Z devices can be used as a "BlackBox" modem in order to add
Bluetooth LE or Generic FSK connectivity to an existing host MCU or MPU
(microprocessor), or may be used as a standalone smart wireless sensor with embedded
application where no host controller is required.
The RF circuit of the KW36Z/35Z is optimized to require very few external
components, achieving the smallest RF footprint possible on a printed circuit board.
Extremely long battery life is achieved through the efficiency of code execution in the
Cortex-M0+ CPU core and the multiple low power operating modes of the KW36Z/
35Z. For power critical applications, an integrated DC-DC converter enables operation
from a single coin cell or Li-ion battery with a significant reduction of peak receive and
transmit current consumption.
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
2 Feature Descriptions
This section provides a simplified block diagram and highlights the KW36Z/35Z
features.
2.1 Block Diagram
Arm Cortex M0+ Core
Serial Wire Debug
DAP
MDM
DWT
MTB
Unified Bus
NVIC
WIC
IOPORT
MCG
DMA MUX
FLL
4ch DMA
AHBLite
IRC
4 MHz
32K Osc
IRC
32 kHz
32M Osc
AHBLite
M2A
M0
Crossbar-Lite Switch (AXBS)
S0
S1
64 KByte
SRAM
DCDC
VDCDC_IN
Flash
Controller
Flash
256 KB
FlexNVM
256 KB
FlexRAM
8 KB
S2
ADC
SIM
SMC
GPIO
CMP
PIT
BME
I2C x2
LTC(AESA)
TPM x3
LPUART x2
TRNG
LPTMR
SPI x2
RTC
CMT
AIPS-Lite
RCM
VREF
PMC
Radio
APB
IPS
IPS
FlexCAN
Figure 1. KW36 Detailed Block Diagram
Arm Cortex M0+ Core
Serial Wire Debug
DAP
MDM
DWT
MTB
Unified Bus
NVIC
WIC
IOPORT
MCG
DMA MUX
FLL
4ch DMA
AHBLite
IRC
4 MHz
32K Osc
IRC
32 kHz
32M Osc
AHBLite
M2A
M0
Crossbar-Lite Switch (AXBS)
S0
S1
64 KByte
SRAM
Flash
Controller
Flash
512 KB
Prg Acc RAM
8 KB
S2
SIM
SMC
ADC
CMP
GPIO
LTC(AESA)
PIT
TPM x3
I2C x2
BME
LPUART
AIPS-Lite
RCM
TRNG
LPTMR
SPI x2
RTC
CMT
Radio
IPS
VDCDC_IN
DCDC
PMC
VREF
APB
IPS
Figure 2. KW35 Detailed Block Diagram
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Feature Descriptions
2.2 Radio features
Operating frequencies:
• 2.4 GHz ISM band (2400-2483.5 MHz)
• Medical Body Area Network (MBAN) 2360-2400 MHz
Supported standards:
• Bluetooth Low Energy Version 5.0 compliant radio
• Generic FSK modulation supporting data rates up to 1 Mbit/s
• Support for up to 8 simultaneous Bluetooth LE hardware connections in any
master, slave combination
• Bluetooth LE Application Profiles
Receiver performance:
• Receive sensitivity of up to –95 dBm for Bluetooth LE
• Receive sensitivity of up to –99 dBm for a 250 kbit/s GFSK mode with a
modulation index of 0.5. Receive sensitivity in Generic FSK modes depends on
mode selection and data rate.
Other features:
• Programmable transmit output power from –30 dBm to +5 dBm
• 26 MHz and 32 MHz crystals supported for Bluetooth LE and Generic FSK modes
• Bluetooth Low Energy version 5.0 Link Layer hardware with 1 Mbit/s PHY
support
• Hardware acceleration for Generic FSK packet processing
• Generic FSK modulation at 250, 500 and 1000 kbit/s
• Supports 8 simultaneous Bluetooth LE connections in any master/slave
combination
• Enhanced Bluetooth LE automatic deep sleep modes (DSM) supporting Slave
Latency
• Up to 26 devices supported by whitelist in hardware
• Up to 8 private resolvable addresses supported in hardware
• Supports DMA capture of IQ data with sampling rate of up to 2 MHz, when using a
32 MHz crystal
• Integrated on-chip balun
• Single ended bidirectional RF port shared by transmit and receive
• Low external component count
• Supports transceiver range extension using external PA and/or LNA
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
2.3 Microcontroller features
Arm Cortex-M0+ CPU
• Up to 48 MHz CPU
• As compared to Cortex-M0, the Cortex-M0+ uses an optimized 2-stage pipeline
microarchitecture for reduced power consumption and improved architectural
performance (cycles per instruction)
• Supports up to 32 interrupt request sources
• Binary compatible instruction set architecture with the Cortex-M0 core
• Thumb instruction set combines high code density with 32-bit performance
• Serial Wire Debug (SWD) reduces the number of pins required for debugging
• Micro Trace Buffer (MTB) provides lightweight program trace capabilities using
system RAM as the destination memory
Nested Vectored Interrupt Controller (NVIC)
• 32 vectored interrupts, 4 programmable priority levels
• Includes a single non-maskable interrupt
Wake-up Interrupt Controller (WIC)
• Supports interrupt handling when system clocking is disabled in low-power
modes
• Takes over and emulates the NVIC behavior when correctly primed by the NVIC
on entry to very-deep-sleep
• A rudimentary interrupt masking system with no prioritization logic signals for
wake-up as soon as a non-masked interrupt is detected
Debug Controller
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•
•
Two-wire Serial Wire Debug (SWD) interface
Hardware breakpoint unit for 2 code addresses
Hardware watchpoint unit for 2 data items
Micro Trace Buffer for program tracing
On-Chip Memory
• Up to 512 KB Flash
• KW36Z contains 256 KB program flash with ECC and 256 KB FlexNVM.
• KW35Z contains 512 KB program flash with ECC.
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Feature Descriptions
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•
•
• Flash implemented as two equal blocks each of 256 KB block. Code can
execute or read from one block while the other block is being erased or
programmed on KW35Z only.
• Firmware distribution protection. Program flash can be marked execute-only
on a per-sector (8 KB) basis to prevent firmware contents from being read by
third parties.
64 KB SRAM
KW36Z contains 8 KB FlexRAM.
KW35Z contains 8 KB program acceleration RAM.
Security circuitry to prevent unauthorized access to RAM and flash contents
through the debugger
2.4 System features
Power Management Control Unit (PMC)
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Programmable power saving modes
Available wake-up from power saving modes via internal and external sources
Integrated Power-on Reset (POR)
Integrated Low Voltage Detect (LVD) with reset (brownout) capability
Selectable LVD trip points
Programmable Low Voltage Warning (LVW) interrupt capability
Individual peripheral clocks can be gated off to reduce current consumption
Internal Buffered bandgap reference voltage
Factory programmed trim for bandgap and LVD
1 kHz Low-power Oscillator (LPO)
DC-DC Converters
• Internal switched mode power supply supporting Buck and Bypass operating
modes
• Buck operation supports external voltage sources of 2.1 V to 3.6 V
• When DC-DC is not used, the device supports an external voltage range of 1.5 V to
3.6 V (1.5 - 3.6 V on VDD_RF1, VDD_RF2, VDD_RF3 and
VDD_1P5OUT_PMCIN pins. 1.71 - 3.6 V on VDD_0, VDD_1, and VDDA pins)
• An external inductor is required to support the Buck mode
Direct Memory Access (DMA) Controller
• All data movement via dual-address transfers: read from source, write to
destination
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
• Programmable source and destination addresses and transfer size
• Support for enhanced addressing modes
• 4-channel implementation that performs complex data transfers with minimal
intervention from a host processor
• Internal data buffer, used as temporary storage to support 16- and 32-byte
transfers
• Connections to the crossbar switch for bus mastering the data movement
• Transfer Control Descriptor (TCD) organized to support two-deep, nested transfer
operations
• 32-byte TCD stored in local memory for each channel
• An inner data transfer loop defined by a minor byte transfer count
• An outer data transfer loop defined by a major iteration count
• Channel activation via one of three methods:
• Explicit software initiation
• Initiation via a channel-to-channel linking mechanism for continuous
transfers
• Peripheral-paced hardware requests, one per channel
• Fixed-priority and round-robin channel arbitration
• Channel completion reported via optional interrupt requests
• One interrupt per channel, optionally asserted at completion of major iteration
count
• Optional error terminations per channel and logically summed together to form
one error interrupt to the interrupt controller
• Optional support for scatter/gather DMA processing
• Support for complex data structures
DMA Channel Multiplexer (DMA MUX)
• 4 independently selectable DMA channel routers
• 2 periodic trigger sources available
• Each channel router can be assigned to 1 of the peripheral DMA sources
COP Watchdog Module
• Independent clock source input (independent from CPU/bus clock)
• Choice between two clock sources
• LPO oscillator
• Bus clock
System Clocks
• Both 26 MHz and 32 MHz crystal reference oscillator supported for Bluetooth LE
and Generic FSK modes
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Feature Descriptions
• MCU can derive its clock either from the crystal reference oscillator or the
Frequency-locked Loop (FLL)1
• 32.768 kHz crystal reference oscillator used to maintain precise Bluetooth Low
Energy timing in low-power modes
• Multipurpose Clock Generator (MCG)
• Internal reference clocks — Can be used as a clock source for other on-chip
peripherals
• On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 2% accuracy
across full temperature range
• On-chip 4 MHz oscillator with 5% accuracy across full temperature range
• Frequency-locked Loop (FLL) controlled by internal or external reference
• 20 MHz to 48 MHz FLL output
Unique Identifiers
• 80-bit Unique ID represents a unique identifier for each chip
• 40-bit unique Media Access Control (MAC) address, which can be used to build a
unique 48-bit Bluetooth Low Energy MAC address
2.5 Peripheral features
16-bit Analog-to-Digital Converter (ADC)
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Linear successive approximation algorithm with 16-bit resolution
Output formatted in differential-ended 16-, 13-, 11-, and 9-bit mode
Output formatted in single-ended 16-, 12-, 10-, and 8-bit mode
Single or continuous conversion
Configurable sample time and conversion speed/power
Conversion rates in 16-bit mode with no averaging up to ~500Ksamples/sec
Input clock selection
Operation in low-power modes for lower noise operation
Asynchronous clock source for lower noise operation
Selectable asynchronous hardware conversion trigger
Automatic compare with interrupt for less-than, or greater than, or equal to
programmable value
Temperature sensor
Battery voltage measurement
Hardware average function
Selectable voltage reverence
Self-calibration mode
1.
Clock options can have restrictions based on the chosen SoC configuration.
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
High-Speed Analog Comparator (CMP)
• 6-bit DAC programmable reference generator output
• Up to eight selectable comparator inputs; each input can be compared with any
input by any polarity sequence
• Selectable interrupt on rising edge, falling edge, or either rising or falling edges of
comparator output
• Two performance modes:
• Shorter propagation delay at the expense of higher power
• Low-power, with longer propagation delay
• Operational in all MCU power modes except VLLS0 mode
Voltage Reference(VREF1)
• Programmable trim register with 0.5 mV steps, automatically loaded with factory
trimmed value upon reset
• Programmable buffer mode selection:
• Off
• Bandgap enabled/standby (output buffer disabled)
• High-power buffer mode (output buffer enabled)
• 1.2 V output at room temperature
• VREF_OUT output signal
Low-power Timer (LPTMR)
• One channel
• Operation as timer or pulse counter
• Selectable clock for prescaler/glitch filter
• 1 kHz internal LPO
• External low-power crystal oscillator
• Internal reference clock
• Configurable glitch filter or prescaler
• Interrupt generated on timer compare
• Hardware trigger generated on timer compare
• Functional in all power modes
Timer/PWM (TPM)
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•
•
•
TPM0: 4 channels, TPM1 and TPM2: 2 channels each
Selectable source clock
Programmable prescaler
16-bit counter supporting free-running or initial/final value, and counting is up or
up-down
• Input capture, output compare, and edge-aligned and center-aligned PWM modes
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Feature Descriptions
•
•
•
•
Input capture and output compare modes
Generation of hardware triggers
TPM1 and TPM2: Quadrature decoder with input filters
Global time base mode shares single time base across multiple TPM instances
Programmable Interrupt Timer (PIT)
• Up to 2 interrupt timers for triggering ADC conversions
• 32-bit counter resolution
• Clocked by bus clock frequency
Real-Time Clock (RTC)
• 32-bit seconds counter with 32-bit alarm
• Can be invalidated on detection of tamper detect
• 16-bit prescaler with compensation
• Register write protection
• Hard Lock requires MCU POR to enable write access
• Soft lock requires POR or software reset to enable write/read access
• Capable of waking up the system from low-power modes
Inter-Integrated Circuit (I2C)
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Two channels
Compatible with I2C bus standard and SMBus Specification Version 2 features
Up to 400 kHz operation
Multi-master operation
Software programmable for one of 64 different serial clock frequencies
Programmable slave address and glitch input filter
Interrupt driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
Bus busy detection broadcast and 10-bit address extension
Address matching causes wake-up when processor is in low-power mode
LPUART
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One channel (2 channels on KW36Z)
Full-duplex operation
Standard mark/space Non-return-to-zero (NRZ) format
13-bit baud rate selection with fractional divide of 32
Programmable 8-bit or 9-bit data format
Programmable 1 or 2 stop bits
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
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Separately enabled transmitter and receiver
Programmable transmitter output polarity
Programmable receive input polarity
13-bit break character option
11-bit break character detection option
Two receiver wake-up methods:
• Idle line wake-up
• Address mark wake-up
Address match feature in receiver to reduce address mark wake-up ISR overhead
Interrupt or DMA driven operation
Receiver framing error detection
Hardware parity generation and checking
Configurable oversampling ratio to support from 1/4 to 1/32 bit-time noise
detection
Operation in low-power modes
Hardware Flow Control RTS\CTS
Functional in Stop/VLPS modes
Break detect supporting LIN
Serial Peripheral Interface (SPI)
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Two independent SPI channels
Master and slave mode
Full-duplex, three-wire synchronous transfers
Programmable transmit bit rate
Double-buffered transmit and receive data registers
Serial clock phase and polarity options
Slave select output
Control of SPI operation during wait mode
Selectable MSB-first or LSB-first shifting
Support for both transmit and receive by DMA
Carrier Modulator Timer (CMT)
• Four modes of operation
• Time; with independent control of high and low times
• Baseband
• Frequency shift key (FSK)
• Direct software control of CMT_IRO signal
• Extended space operation in time, baseband, and FSK modes
• Selectable input clock divider
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
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NXP Semiconductors
Feature Descriptions
• Interrupt on end of cycle
• Ability to disable CMT_IRO signal and use as timer interrupt
General Purpose Input/Output (GPIO)
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Hysteresis and configurable pull up device on all input pins
Independent pin value register to read logic level on digital pin
All GPIO pins can generate IRQ and wake-up events
Configurable drive strength on some output pins
GPIO can be configured to function as a interrupt driven keyboard scanning matrix
• In the 48-pin package there are a total of 25 digital pins
• In the 40-pin package there are a total of 18 digital pins
FlexCAN (for KW36Z only)
• Full implementation of the CAN with Flexible Data Rate (CAN FD) protocol
specification and CAN protocol specification, Version 2.0 B
• Flexible Message Buffers (MBs); there are total 32 MBs of 8 bytes data length
each, configurable as Rx or Tx, all supporting standard and extended messages
• Programmable clock source to the CAN Protocol Interface, either peripheral clock
or oscillator clock
• Capability to select priority between mailboxes and Rx FIFO during matching
process
• Powerful Rx FIFO ID filtering, capable of matching incoming IDs against either
128 extended, 256 standard, or 512 partial (8 bit) IDs, with up to 32 individual
masking capability
2.6 Security Features
Advanced Encryption Standard Accelerator(AES-128 Accelerator)
The Advanced Encryption Standard Accelerator (AESA) module is a standalone
hardware coprocessor capable of accelerating the 128-bit advanced encryption standard
(AES) cryptographic algorithms.
The AESA engine supports the following cryptographic features.
LTC includes the following features:
• Cryptographic authentication
• Message Authentication Codes (MAC)
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NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Feature Descriptions
• Cipher-based MAC (AES-CMAC)
• Extended cipher block chaining message authentication code (AESXCBC-MAC)
• Auto padding
• Integrity Check Value(ICV) checking
• Authenticated encryption algorithms
• Counter with CBC-MAC (AES-CCM)
• Symmetric key block ciphers
• AES (128-bit keys)
• Cipher modes:
• AES-128 modes
• Electronic Codebook (ECB)
• Cipher Block Chaining (CBC)
• Counter (CTR)
• Secure scan
True Random Number Generator (TRNG)
True Random Number Generator (TRNG) is a hardware accelerator module that
constitutes a high-quality entropy source.
• TRNG generates a 512-bit (4x 128-bit) entropy as needed by an entropyconsuming module, such as a deterministic random number generator.
• TRNG output can be read and used by a deterministic pseudo-random number
generator (PRNG) implemented in software.
• TRNG-PRNG combination achieves NIST-compliant true randomness and
cryptographic-strength random numbers using the TRNG output as the entropy
source.
• A fully FIPS 180 compliant solution can be realized using the TRNG together
with a FIPS-compliant deterministic random number generator and the SoC-level
security.
Flash Memory Protection
The on-chip flash memory controller enables the following useful features:
• Program flash protection scheme prevents accidental program or erase of stored
data.
• Automated, built-in, program and erase algorithms with verify.
• Read access to one program flash block is possible while programming or erasing
data in the other program flash block.
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
15
NXP Semiconductors
Transceiver Description
3 Transceiver Description
•
•
•
•
•
Direct Conversion Receiver (Zero IF)
Constant Envelope Transmitter
2.36 GHz to 2.483 GHz PLL Range
Low Transmit and Receive Current Consumption
Low BOM
3.1 Key Specifications
KW36Z/35Z meets or exceeds all Bluetooth Low Energy version 5.0 performance
specifications. The key specifications for the KW36Z/35Z are:
Frequency Band:
• ISM Band: 2400 to 2483.5 MHz
• MBAN Band: 2360 to 2400 MHz
Bluetooth Low Energy version 5.0 modulation scheme:
•
•
•
•
Symbol rate: 1000 kbit/s
Modulation: GFSK
Receiver sensitivity: –95 dBm, typical
Programmable transmitter output power: –30 dBm to +5 dBm
Generic FSK modulation scheme:
• Symbol rate: 250, 500 and 1000 kbit/s
• Modulation(s): GFSK (modulation index = 0.32, 0.5, 0.7 and 1.0, BT =0.3, 0.5, and
0.7), FSK and MSK
• Receiver Sensitivity: Mode and data rate dependent. –99 dBm typical for GFSK
(r=250 kbit/s, BT = 0.5, h = 0.5)
3.2 Channel Map Frequency Plans
16
NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Transceiver Description
3.2.1 Channel Plan for Bluetooth Low Energy
This section describes the frequency plan / channels associated with 2.4 GHz ISM and
MBAN bands for Bluetooth Low Energy.
2.4 GHz ISM Channel numbering:
• Fc=2402 + k * 2 MHz, k=0,.........,39.
MBAN Channel numbering:
• Fc=2360 + k in MHz, for k=0,.....,39
where k is the channel number.
Table 1. 2.4 GHz ISM and MBAN frequency plan and channel designations
2.4 GHz ISM1
Channel
Freq (MHz)
MBAN2
2.4GHz ISM + MBAN
Channel
Freq (MHz)
Channel
Freq (MHz)
0
2402
0
2360
28
2390
1
2404
1
2361
29
2391
2
2406
2
2362
30
2392
3
2408
3
2363
31
2393
4
2410
4
2364
32
2394
5
2412
5
2365
33
2395
6
2414
6
2366
34
2396
7
2416
7
2367
35
2397
8
2418
8
2368
36
2398
9
2420
9
2369
0
2402
10
2422
10
2370
1
2404
11
2424
11
2371
2
2406
12
2426
12
2372
3
2408
13
2428
13
2373
4
2410
14
2430
14
2374
5
2412
15
2432
15
2375
6
2414
16
2434
16
2376
7
2416
17
2436
17
2377
8
2418
18
2438
18
2378
9
2420
19
2440
19
2379
10
2422
20
2442
20
2380
11
2424
21
2444
21
2381
12
2426
22
2446
22
2382
13
2428
23
2448
23
2383
14
2430
Table continues on the next page...
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
17
NXP Semiconductors
Transceiver Description
Table 1. 2.4 GHz ISM and MBAN frequency plan and channel designations (continued)
2.4 GHz ISM1
MBAN2
2.4GHz ISM + MBAN
Channel
Freq (MHz)
Channel
Freq (MHz)
Channel
Freq (MHz)
24
2450
24
2384
15
2432
25
2452
25
2385
16
2434
26
2454
26
2386
17
2436
27
2456
27
2387
18
2438
28
2458
28
2388
19
2440
29
2460
29
2389
20
2442
30
2462
30
2390
21
2444
31
2464
31
2391
22
2446
32
2466
32
2392
23
2448
33
2468
33
2393
24
2450
34
2470
34
2394
25
2452
35
2472
35
2395
26
2454
36
2474
36
2396
27
2456
37
2476
37
2397
37
2476
38
2478
38
2398
38
2478
39
2480
39
2399
39
2480
1. ISM frequency of operation spans from 2400.0 MHz to 2483.5 MHz
2. Per FCC guideline rules, Bluetooth Low Energy single mode operation is allowed in these channels.
3.2.2 Other Channel Plans
The RF synthesizer can be configured to use any channel frequency between 2.36 and
2.487 GHz.
3.3 Transceiver Functions
Receive
The receiver architecture is Zero IF (ZIF) where the received signal after passing
through RF front end is down-converted to a baseband signal. The signal is filtered and
amplified before it is fed to analog-to-digital converter. The digital signal then
decimates to a baseband clock frequency before it digitally processes, demodulates and
passes on to packet processing/link-layer processing.
18
NXP Semiconductors
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
Transceiver Electrical Characteristics
Transmit
The transmitter transmits GFSK/FSK modulation having power and channel selection
adjustment per user application. After the channel of operation is determined, coarse
and fine-tuning is executed within the Frac-N PLL to engage signal lock. After signal
lock is established, the modulated buffered signal is routed to a multi-stage amplifier
for transmission..
4 Transceiver Electrical Characteristics
4.1 Radio operating conditions
Table 2. Radio operating conditions
Characteristic
Symbol
Min
Input Frequency
fin
Ambient Temperature Range
TA
Pmax
Maximum RF Input Power
Crystal Reference Oscillator Frequency
Typ
Max
Unit
2.360
—
2.480
GHz
–40
25
105
°C
—
—
10
dBm
fref
26 MHz or 32 MHz
1
1. The recommended crystal accuracy is ±40 ppm including initial accuracy, mechanical, temperature, and aging factors.
4.2 Receiver Feature Summary
Table 3. Top-Level Receiver Specifications (TA=25 °C, nominal process unless otherwise
noted)
Characteristic1
Symbol
Min.
Typ.
Max.
Unit
Supply current power down on VDD_RFx supplies
Ipdn
—
200
1000
nA
Supply current Rx On with DC-DC converter enable
(Buck; VDCDC_IN = 3.6 V, VDD_1P5_buck=1.5 V) , 2
IRxon
—
6.3
—
mA
Supply current Rx On with DC-DC converter disabled
(Bypass) 2
IRxon
—
17.2
—
mA
fin
2.360
—
2.4835
GHz
SENSGFSK
—
–99
—
dBm
SENSBLE
—
–95
—
dBm
NFHG
—
7.5
—
dB
Input RF Frequency
GFSK Rx Sensitivity(250 kbit/s GFSK-BT=0.5, h=0.5)
Bluetooth LE Rx Sensitivity
3
Noise Figure for maximum gain mode @ typical
sensitivity
Table continues on the next page...
MKW36Z/35Z Data Sheet, Rev. 8, 05/2020
19
NXP Semiconductors
Transceiver Electrical Characteristics
Table 3. Top-Level Receiver Specifications (TA=25 °C, nominal process unless otherwise
noted) (continued)
Characteristic1
Symbol
Min.
Typ.
Max.
Unit
RSSIRange
–100
—
55
dBm
RSSIRes
—
1
—
dB
Typical RSSI variation over frequency
–2
—
2
dB
Typical RSSI variation over temperature
–2
—
2
dB
–3
—
3
dB
Receiver Signal Strength Indicator Range4
Receiver Signal Strength Indicator Resolution
Narrowband RSSI
accuracy6
RSSIAcc
Bluetooth LE Co-channel Interference (Wanted signal at
–67 dBm, BER
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