MMG3009NT1

Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor (InGaP HBT) Broadband High Linearity Amplifier MMG3009NT1 The MMG3009NT1 is a general purpose amplifier that is internally input and output matched. It is designed for a broad range of Class A, small--signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 0 to 6000 MHz such as cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small-signal RF. 0--6000 MHz, 15 dB 18 dBm InGaP HBT GPA LIFETIME BUY Features  Frequency: 0 to 6000 MHz  P1dB: 18 dBm @ 900 MHz  Small--Signal Gain: 15 dB @ 900 MHz  Third Order Output Intercept Point: 34 dBm @ 900 MHz  Single 5 V Supply  Internally Matched to 50 Ohms  Cost--effective SOT--89 Surface Mount Plastic Package  In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical Performance (1) SOT--89 Table 2. Maximum Ratings Rating Characteristic Symbol 900 MHz 2140 MHz 3500 MHz Unit Small--Signal Gain (S21) Gp 15 14 12.5 dB Input Return Loss (S11) IRL --13 --26 --22 dB Output Return Loss (S22) ORL --17 --15 --24 dB Power Output @1dB Compression P1dB 18 18 17.5 dBm Third Order Output Intercept Point OIP3 34 32 31 dBm Symbol Value Unit Supply Voltage VCC 7 V Supply Current ICC 300 mA RF Input Power Pin 10 dBm Storage Temperature Range Tstg --65 to +150 C Junction Temperature TJ 150 C 1. VCC = 5 Vdc, TA = 25C, 50 ohm system. Table 3. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 88C, 5 Vdc, 70 mA, no RF applied Symbol Value (2) Unit RJC 81 C/W 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955.  Freescale Semiconductor, Inc., 2005--2008, 2012, 2014. All rights reserved. RF Device Data Freescale Semiconductor, Inc. LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 Document Number: MMG3009NT1 Rev. 7, 9/2014 MMG3009NT1 1 Symbol Min Typ Max Unit Small--Signal Gain (S21) Characteristic Gp 14.3 15 — dB Input Return Loss (S11) IRL — --13 — dB Output Return Loss (S22) ORL — --17 — dB Power Output @ 1dB Compression P1dB — 18 — dBm Third Order Output Intercept Point OIP3 — 34 — dBm Noise Figure NF — 4.2 — dB Supply Current ICC 58 70 82 mA Supply Voltage VCC — 5 — V Table 5. Functional Pin Description LIFETIME BUY Pin Number 2 Pin Function 1 RFin 2 Ground 3 RFout/DC Supply 1 2 3 Figure 1. Functional Diagram Table 6. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD 22--A114) 1A Machine Model (per EIA/JESD 22--A115) A Charge Device Model (per JESD 22--C101) IV Table 7. Moisture Sensitivity Level Test Methodology Per JESD 22--A113, IPC/JEDEC J--STD--020 Rating Package Peak Temperature Unit 1 260 C LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit) MMG3009NT1 2 RF Device Data Freescale Semiconductor, Inc. 50 OHM TYPICAL CHARACTERISTICS TC = 85C 15 25C --10 --40C 10 S11 --20 S22 --30 VCC = 5 Vdc VCC = 5 Vdc 5 --40 1 2 3 0 4 1 2 4 3 f, FREQUENCY (GHz) f, FREQUENCY (GHz) Figure 2. Small--Signal Gain (S21) versus Frequency Figure 3. Input/Output Return Loss versus Frequency 21 P1dB, 1 dB COMPRESSION POINT (dBm) 20 19 17 2140 MHz 900 MHz 15 1960 MHz 13 3500 MHz 11 2600 MHz 9 VCC = 5 Vdc 7 12 10 14 16 18 18 17 16 15 14 VCC = 5 Vdc 0.5 20 1 1.5 2 2.5 3 Pout, OUTPUT POWER (dBm) f, FREQUENCY (GHz) Figure 4. Small--Signal Gain versus Output Power Figure 5. P1dB versus Frequency 100 80 60 40 20 0 4 19 13 4.2 4.4 4.6 4.8 5 5.2 VCC, COLLECTOR VOLTAGE (V) Figure 6. Collector Current versus Collector Voltage 5.4 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) ICC, COLLECTOR CURRENT (mA) Gp, SMALL--SIGNAL GAIN (dB) LIFETIME BUY 0 3.5 36 33 30 27 24 VCC = 5 Vdc 1 MHz Tone Spacing 21 0 1 2 3 f, FREQUENCY (GHz) Figure 7. Third Order Output Intercept Point versus Frequency LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 0 S11, S22 (dB) Gp, SMALL--SIGNAL GAIN (dB) 20 4 MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 3 30 27 24 f = 900 MHz 1 MHz Tone Spacing 21 4.9 4.95 5 5.05 5.1 VCC, COLLECTOR VOLTAGE (V) 35 34 33 32 31 30 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing 29 28 --40 --20 20 40 60 80 100 T, TEMPERATURE (_C) Figure 9. Third Order Output Intercept Point versus Case Temperature Figure 8. Third Order Output Intercept Point versus Collector Voltage 105 --30 --40 MTTF (YEARS) IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) 0 --50 --60 104 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing --70 103 --80 0 3 9 6 120 15 12 125 Pout, OUTPUT POWER (dBm) 4 2 VCC = 5 Vdc 0 2 140 145 150 NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 70 mA 3 Figure 11. MTTF versus Junction Temperature ACPR, ADJACENT CHANNEL POWER RATIO (dBc) 6 1 135 TJ, JUNCTION TEMPERATURE (C) Figure 10. Third Order Intermodulation Distortion versus Output Power 0 130 4 --20 VCC = 5 Vdc, f = 2140 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF) --30 --40 --50 --60 --70 2 4 6 8 10 12 14 f, FREQUENCY (GHz) Pout, OUTPUT POWER (dBm) Figure 12. Noise Figure versus Frequency Figure 13. Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 33 8 NF, NOISE FIGURE (dB) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 36 LIFETIME BUY OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 50 OHM TYPICAL CHARACTERISTICS 16 MMG3009NT1 4 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 40--300 MHz R1 C3 C4 L1 RF INPUT Z1 DUT Z2 C1 S21, S11, S22 (dB) LIFETIME BUY Z1, Z5 Z2 Z3 Z3 Z4 Z5 C2 VCC 0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.172 x 0.058 Microstrip RF OUTPUT Z4 PCB 0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 14. 50 Ohm Test Circuit Schematic 20 S21 10 R1 0 L1 --10 C2 C1 S22 --20 C4 C3 --30 S11 VCC = 5 Vdc --40 0 100 200 MMG30XX Rev 2 300 400 500 f, FREQUENCY (MHz) Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C3 0.01 F Chip Capacitors C0603C103J5RAC Kemet C4 1000 pF Chip Capacitor C0603C102J5RAC Kemet L1 470 nH Chip Inductor BK2125HM471--T Taiyo Yuden R1 0 Ω Chip Resistor ERJ3GEY0R00V Panasonic LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 VSUPPLY MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 5 50 OHM APPLICATION CIRCUIT: 300--3600 MHz R1 C3 C4 L1 RF INPUT Z1 DUT Z2 C1 S21, S11, S22 (dB) LIFETIME BUY Z1, Z5 Z2 Z3 Z3 Z4 Z5 C2 VCC 0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.172 x 0.058 Microstrip RF OUTPUT Z4 PCB 0.403 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 17. 50 Ohm Test Circuit Schematic 30 20 R1 S21 10 L1 0 C4 C3 C2 C1 --10 S22 --20 --30 300 S11 VCC = 5 Vdc 800 1300 1800 MMG30XX Rev 2 2300 2800 3300 3800 f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 150 pF Chip Capacitors C0603C151J5RAC Kemet C3 0.01 F Chip Capacitor C0603C103J5RAC Kemet C4 1000 pF Chip Capacitor C0603C102J5RAC Kemet L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden R1 0 Ω Chip Resistor ERJ3GEY0R00V Panasonic LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 VSUPPLY MMG3009NT1 6 RF Device Data Freescale Semiconductor, Inc. LIFETIME BUY Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System) S11 S21 S12 S22 f MHz |S11|  |S21|  |S12|  |S22|  100 0.19606 --174.964 6.33492 175.897 0.10115 --0.614 0.07282 176.529 150 0.19734 --176.357 6.30368 173.26 0.10204 --1.587 0.07571 178.062 200 0.19944 169.849 6.27983 171.036 0.10220 --2.173 0.07648 --178.213 250 0.20027 168.421 6.24623 169.018 0.10243 --2.498 0.08038 --175.337 300 0.19924 166.435 6.22884 166.867 0.10334 --2.998 0.07928 --172.371 350 0.19543 164.497 6.22675 164.532 0.10364 --3.636 0.07836 --172.028 400 0.19419 162.266 6.21021 162.42 0.10357 --4.18 0.07876 --169.383 450 0.19172 160.135 6.19495 160.278 0.10351 --4.669 0.07882 --167.245 500 0.18914 158.072 6.18191 158.065 0.10361 --5.256 0.07903 --165.903 550 0.18788 156.056 6.16313 155.935 0.10378 --5.746 0.07946 --164.125 600 0.18596 154.01 6.14591 153.778 0.10379 --6.277 0.08061 --162.978 650 0.18399 152.064 6.12734 151.629 0.10396 --6.756 0.08181 --162.118 700 0.18285 150.008 6.10486 149.511 0.10408 --7.313 0.08346 --161.229 750 0.18159 148.088 6.08449 147.384 0.10411 --7.817 0.08496 --160.812 800 0.18056 146.09 6.06038 145.27 0.10427 --8.376 0.08717 --160.896 850 0.17973 144.286 6.03306 143.153 0.10440 --8.885 0.08917 --161.031 900 0.17932 142.485 6.00923 141.039 0.10453 --9.38 0.09202 --161.574 950 0.17920 140.759 5.98147 138.952 0.10467 --9.995 0.09484 --162.293 1000 0.17847 139.226 5.95646 136.927 0.10485 --10.462 0.09809 --163.293 1050 0.17754 137.531 5.92809 134.838 0.10508 --11.017 0.10057 --164.366 1100 0.17453 136.047 5.89423 132.763 0.10519 --11.541 0.10471 --165.489 --167.229 1150 0.17205 134.871 5.86296 130.716 0.10534 --12.012 0.10843 1200 0.17066 133.54 5.83017 128.685 0.10542 --12.612 0.11227 --168.9 1250 0.16951 132.305 5.79633 126.662 0.10564 --13.155 0.11601 --170.51 1300 0.16662 131.182 5.76557 124.647 0.10580 --13.654 0.12012 --172.32 1350 0.16577 130.038 5.73189 122.631 0.10602 --14.194 0.12430 --174.175 1400 0.16504 128.988 5.69605 120.653 0.10620 --14.728 0.12842 --176.041 1450 0.16426 128.206 5.65985 118.678 0.10641 --15.283 0.13238 --178.197 1500 0.16609 122.177 5.63288 116.712 0.10680 --15.856 0.13929 --178.349 1550 0.16661 120.535 5.60045 114.805 0.10706 --16.422 0.14264 179.292 1600 0.16797 118.895 5.56701 112.889 0.10732 --16.914 0.14623 176.482 1650 0.17042 117.389 5.53367 110.947 0.10761 --17.529 0.14778 174.032 1700 0.17177 116.114 5.50453 109.079 0.10790 --18.111 0.15034 171.358 1750 0.17361 114.897 5.47270 107.137 0.10818 --18.625 0.15223 168.855 1800 0.17663 113.75 5.43993 105.194 0.10841 --19.165 0.15382 166.27 1850 0.17969 112.634 5.40358 103.282 0.10863 --19.761 0.15575 163.924 1900 0.18333 111.562 5.36970 101.431 0.10919 --20.39 0.15708 161.656 1950 0.18634 110.534 5.33711 99.484 0.10950 --21.017 0.15722 159.517 2000 0.18991 109.707 5.30347 97.624 0.10980 --21.621 0.15781 157.67 2050 0.19272 108.497 5.26942 95.722 0.11012 --22.222 0.15859 156.162 2100 0.19593 107.602 5.23491 93.803 0.11037 --22.899 0.15951 154.73 2150 0.19925 106.721 5.19782 91.865 0.11076 --23.629 0.16086 153.761 2200 0.20272 105.922 5.15894 89.97 0.11107 --24.273 0.16242 152.923 2250 0.20521 104.933 5.11750 88.119 0.11132 --24.939 0.16412 151.958 LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 50 OHM TYPICAL CHARACTERISTICS (continued) MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 7 LIFETIME BUY Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System) (continued) S11 S21 S12 S22 f MHz |S11|  |S21|  |S12|  |S22|  2300 0.20819 103.761 5.07836 86.232 0.11160 --25.64 0.16622 151.355 2350 0.21027 102.506 5.03981 84.384 0.11177 --26.346 0.16892 150.63 2400 0.21179 101.509 4.99976 82.526 0.11206 --26.995 0.17307 150.179 2450 0.21372 100.321 4.95674 80.649 0.11219 --27.627 0.17696 149.454 2500 0.21503 99.084 4.91517 78.813 0.11247 --28.368 0.18136 148.699 2550 0.21607 98.079 4.87557 77.083 0.11260 --29.056 0.18649 147.675 2600 0.21693 96.937 4.83415 75.317 0.11290 --29.737 0.19209 146.671 2650 0.21764 95.679 4.79330 73.409 0.11315 --30.261 0.19800 145.149 2700 0.21800 94.585 4.75322 71.62 0.11317 --31.061 0.20392 144.12 2750 0.21817 93.428 4.71387 69.917 0.11349 --31.733 0.20970 142.804 2800 0.21833 92.207 4.67702 68.159 0.11366 --32.454 0.21628 141.065 2850 0.21805 91.061 4.63817 66.317 0.11402 --33.132 0.22172 139.329 2900 0.21865 89.888 4.60218 64.555 0.11435 --33.832 0.22856 137.508 2950 0.21925 88.748 4.56625 62.873 0.11463 --34.552 0.23450 135.667 3000 0.21915 87.532 4.53210 61.144 0.11512 --35.281 0.24044 133.457 3050 0.22110 86.342 4.50064 59.382 0.11540 --36.033 0.24561 131.639 3100 0.22166 85.246 4.46608 57.613 0.11582 --36.792 0.25129 129.229 3150 0.22283 84.227 4.43647 55.954 0.11604 --37.437 0.25625 127.153 3200 0.22458 83.152 4.40552 54.104 0.11651 --38.235 0.26146 124.84 3250 0.22637 82.137 4.37427 52.337 0.11696 --38.955 0.26652 122.578 3300 0.22771 81.039 4.34455 50.582 0.11740 --39.776 0.27125 120.071 3350 0.23010 79.979 4.31085 48.824 0.11778 --40.645 0.27548 118.04 3400 0.23244 78.98 4.28183 47.09 0.11825 --41.441 0.28049 115.642 3450 0.23531 78.054 4.25137 45.379 0.11856 --42.323 0.28504 113.247 3500 0.23838 77.028 4.22125 43.528 0.11892 --43.156 0.28907 111.227 3550 0.24191 76.08 4.19033 41.795 0.11931 --43.953 0.29393 108.97 3600 0.24470 75.139 4.15822 40.059 0.11966 --44.868 0.29797 106.843 LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 50 OHM TYPICAL CHARACTERISTICS MMG3009NT1 8 RF Device Data Freescale Semiconductor, Inc. 7.62 0.305 diameter 2.49 3.48 5.33 1.27 1.27 0.58 0.86 0.64 3.86 LIFETIME BUY Recommended Solder Stencil NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM PITCH. Figure 20. Recommended Mounting Configuration M3009N ( ) YYWW Figure 21. Product Marking 2.54 LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 1.7 MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 9 PACKAGE DIMENSIONS MMG3009NT1 10 RF Device Data Freescale Semiconductor, Inc. MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 11 MMG3009NT1 12 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS  AN1955: Thermal Measurement Methodology of RF Power Amplifiers  AN3100: General Purpose Amplifier and MMIC Biasing Software  .s2p File Development Tools  Printed Circuit Boards LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15 Refer to the following resources to aid your design process. Application Notes For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. REVISION HISTORY The following table summarizes revisions to this document. Date 3 Mar. 2007  Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS compliant part numbers, pp. 6, 7 4 July 2007  Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 11--13. Case updated to add missing dimension for Pin 1 and Pin 3. 5 Mar. 2008  Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 LIFETIME BUY Revision Description  Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis (ACPR) unit of measure to dBc, p. 5  Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 8, 9 6 Feb. 2012  Corrected temperature at which ThetaJC is measured from 25C to 88C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1  Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 3  Removed ICC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading as bias is not a controlled value, pp. 4--9  Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14 7 Sept. 2014  Added Fig. 21, Product Marking, p. 9 MMG3009NT1 RF Device Data Freescale Semiconductor, Inc. 13 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E 2005--2008, 2012, 2014 Freescale Semiconductor, Inc. MMG3009NT1 Document Number: MMG3009NT1 Rev. 14 7, 9/2014 RF Device Data Freescale Semiconductor, Inc.