MP3V5050GP

NXP Semiconductors Data Sheet: Technical Data Document Number: MP3V5050 Rev. 1.4, 12/2018 MP3V5050, 0 to 50 kPa, Differential, and Gauge Pressure Sensor MP3V5050 The MP3V5050 series piezoresistive transducer is a state-of-the-art, monolithic silicon, pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Small outline package Features • 2.5% maximum error over 0 °C to 85 °C • Ideally suited for microprocessor or microcontroller-based systems • Temperature compensated over -40 °C to +125 °C • Patented silicon shear stress strain gauge • Thermoplastic (PPS) surface mount package • Multiple porting options for design flexibility • Barbed side ports for robust tube connection MP3V5050GC6U/6T1 Case 98ASB17757C Application examples MP3V5050GP Case 98ASA99303D • Pump/motor control • Robotics • Level detectors • Medical diagnostics • Pressure switching • Blood pressure measurement MP3V5050DP Case 98ASA99255D Top view DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, notch Pinout Ordering information Part number Shipping Package MP3V5050DP Tray 98ASA99255D # of Ports None Single Pressure Type Dual Gauge • Differential • Absolute Device marking MP3V5050DP MP3V5050GP Tray 98ASA99303D • • MP3V5050GP MP3V5050GC6U Rail 98ASB17757C • • MP3V5050G MP3V5050GC6T1 Reel 98ASB17757C • • MP3V5050G NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2008, 2009, 2015, 2017, 2018 NXP B.V. All rights reserved. Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 Pressure source 1 (P1)/Pressure source 2 (P2) side identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.3 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Related Documentation The MP3V5050 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MP3V5050 product page at http://www.nxp.com/MP3V5050 2. Click on the Documentation tab. MP3V5050 2 © NXP Sensors B.V. 2018. All rights reserved. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device GND Figure 1. Fully integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, notch Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC 2 VS Function Do not connect to external circuitry or ground. Pin 1 is denoted by notch. Voltage supply 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Symbol Value Unit Maximum pressure (P1 > P2) Rating Pmax 200 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 3.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5 required to meet electrical specifications.) Characteristic (1) Symbol Min Typ Max Unit POP 0 — 50 kPa Supply voltage(2) VS 2.7 3.0 3.3 VDC Supply current Pressure range IO — 7.0 10 mAdc Minimum pressure offset(3)(0 °C to 85 °C) @ VS = 3.0 Volts VOFF 0.053 0.12 0.188 VDC Full-scale output(4)(0 °C to 85 °C) @ VS = 3.0 Volts VFSO 2.752 2.8 2.888 VDC Full-scale span(5)(0 °C to 85 °C) @ VS = 3.0 Volts VFSS — 2.7 — VDC — — — ±2.5 %VFSS Accuracy(6)(0 °C to 85 °C) Sensitivity V/P — 54 — mV/kPa Response time(7) tR — 1.0 — ms Output source current at full-scale output IO+ — 0.1 — mAdc Warm-up time(8) — — 20 — ms stability(9) — — ±0.5 — %VFSS Offset 1.1.0 kPa (kilopascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full-scale Output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 5.Full-scale Span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25 °C. TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS at 25 °C. 7.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9.Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. MP3V5050 4 © NXP Sensors B.V. 2018. All rights reserved. 3 On-chip Temperature Compensation and Calibration The MP3V5050 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 °C to 85 °C using the decoupling circuit shown in Figure 5. The output will saturate outside of the specified pressure range. Figure 4 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (case 98ASB17757C). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. Figure 5 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 3 Transfer Function: VOUT = VS*(0.018*P+0.04) ± ERROR VS = 3.0 VDC TEMP = 0 to 85 °C Output (V) 2 TYPICAL MAX MIN 1 0 0 5 10 15 20 25 30 35 40 45 50 55 Differential Pressure (kPa) Figure 3. Output versus Pressure differential FLUOROSILICONE GEL DIE COAT STAINLESS STEEL CAP DIE P1 WIRE BOND THERMOPLASTIC CASE LEAD FRAME DIFFERENTIAL SENSING ELEMENT P2 DIE BOND Figure 4. Cross-sectional diagram SOP (not to scale) 3V VOUT OUTPUT VS IPS 0.01 μF or 0.1 μF 1.0 μF 470 pF GND Figure 5. Recommended power supply decoupling and output filtering (For additional output filtering, please refer to Application Note AN1646) MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 5 Nominal Transfer Value: VOUT = VS (P x 0.018 + 0.04) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 3.0 V ± 0.30 VDC Figure 6. Transfer function 4.0 Temp 3.0 Temperature Error Factor –40 0 to 85 +125 2.0 Multiplier 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0 °C to –40 °C and from 85 °C to 125 °C. Figure 7. Temperature error band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 Pressure (in kPa) 0.0 –1.0 0 10 20 30 40 50 60 –2.0 –3.0 Pressure Error (Max) 0 to 50 (kPa) ±1.25 (kPa) Figure 8. Pressure error band MP3V5050 6 © NXP Sensors B.V. 2018. All rights reserved. 4 Package Information 4.1 Pressure source 1 (P1)/Pressure source 2 (P2) side identification NXP Semiconductors designates the two sides of the pressure sensor as the Pressure source 1 (P1) side and Pressure source 2 (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MP3V pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Table 4. Pressure source 1 (P1)/Pressure source 2 (P2) side identification table Part number 4.2 Case number Pressure (P1) side identifier MP3V5050GP 98ASA99303D Side with port attached MP3V5050DP 98ASA99255D P1 is identified as the top-side port, above the leads. MP3V5050GC6U/T1 98ASB17757C Vertical port attached Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 9. SOP footprint (case 98ASB17757C) MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 7 4.3 Package dimensions This drawing is located at http://cache.nxp.com/files/shared/doc/package_info/98ASB17757C.pdf. PAGE 1 OF 2 Case 98ASB17757C, small outline package MP3V5050 8 © NXP Sensors B.V. 2018. All rights reserved. PAGE 2 OF 2 Case 98ASB17757C, small outline package MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 9 This drawing is located at http://cache.nxp.com/files/shared/doc/package_info/98ASA99255D.pdf. PAGE 1 OF 2 Case 98ASA99255D, small outline package MP3V5050 10 © NXP Sensors B.V. 2018. All rights reserved. PAGE 2 OF 2 Case 98ASA99255D, small outline package MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 11 This drawing is located at http://cache.nxp.com/files/shared/doc/package_info/98ASA99303D.pdf. PAGE 1 OF 2 Case 98ASA99303D, small outline package MP3V5050 12 © NXP Sensors B.V. 2018. All rights reserved. PAGE 2 OF 2 Case 98ASA99303D, small outline package MP3V5050 Sensors © NXP B.V. 2018. All rights reserved. 13 5 Revision History Table 5. Revision history Revision number Revision date Description 1.4 08/2018 • Replaced two occurrences of “,Äì” with “–20” and “–40” on the “Temperature in °C” axis in Figure 7. • Replaced three occurrences of “,Äì” with “-1.0”, “-2.0”, and “-3.0” on the “Pressure Error (kPa)” axis in Figure 8. • Revised “¬±1.25 (kPa” to “±1.25 (kPa)” for “Error (Max)” in Figure 8. 1.3 11/2017 • Corrected device marking column for MP3V5050DP and MP3V5050GP in Ordering Information table. • Corrected package numbers for devices MP3V5050GP and MP3V5050GC6U/6T1 in Ordering Information table and in illustration block. • Updated case 98ASB17757C with current drawing. 1.2 06/2017 • Revised the case numbers for MP3V5050GP and MP3V5050GC6U/6T1. • Revised the package column of the ordering information table. • Updated “Freescale” references to “NXP.” 1.1 09/2015 • Updated format. • Updated package drawings with current version. MP3V5050 14 © NXP Sensors B.V. 2018. All rights reserved. How to Reach Us: Information in this document is provided solely to enable system and software Home Page: nxp.com implementers to use NXP products. There are no express or implied copyright licenses Web Support: nxp.com/support information in this document. granted hereunder to design or fabricate any integrated circuits based on the NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: nxp.com/salestermsandconditions. NXP and Freescale are trademarks of NXP B.V., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2008, 2009, 2015, 2017, 2018 NXP B.V. All rights reserved. Document Number: MP3V5050 Rev. 1.4 12/2018