MP3V5050VC6U

Freescale Semiconductor Data Sheet: Technical Data Document Number: MP3V5050V Rev. 3.0, 09/2015 MP3V5050V, -50 to 0 kPa, Gauge Pressure Sensor MP3V5050V The MP3V5050V piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. The MP3V5050V is optimized to perform with vacuum pressures on the P1 port. Small outline package Features • 2.5% maximum error over 0 °C to 85 °C • Ideally suited for microprocessor or microcontroller-based systems • Temperature compensated over -40 °C to +125 °C • Patented silicon shear stress strain gauge • Durable thermoplastic (PPS) surface mount package • Ideal for automotive and non-automotive applications MP3V5050V Case 98ASB17757C Top view Application examples DNC 5 4 VOUT • Pump/motor control DNC 6 3 GND • Robotics DNC 7 2 VS • Level detectors DNC 8 1 DNC • Medical diagnostics • Pressure switching • Blood pressure measurement Pin 1 identification: notch Pinout Ordering Information # of Ports Part number Shipping None MP3V5050VC6U Rail Pressure type Package 98ASB17757C Single Dual • Gauge Differential • Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2008, 2010, 2015 Freescale Semiconductor, Inc. All rights reserved. Absolute Device marking MP3V5050V Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Related Documentation The MP3V5050V device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MP3V5050V. In the Refine Your Result pane on the left, click on the Documentation link. MP3V5050V 3 Sensors Freescale Semiconductor, Inc. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS GND Figure 1. Fully integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification: notch Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead. Voltage supply 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MP3V5050V Sensors Freescale Semiconductor, Inc. 5 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Symbol Value Unit Maximum pressure (P1 > P2) Rating Pmax 200 kPa Storage temperature Tstg -40° to +125° °C Operating temperature TA -40° to +125° °C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 3.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP –50 — 0 kPa Supply voltage(1) VS 2.7 3.0 3.3 VDC Supply current IO — 7.0 10 mAdc Full-scale output(2)(0° to 85°C) @ VS = 3.0 Volts, (Pdiff = 0 kPa) VFSO 2.7 2.8 2.9 VDC Full-scale span(3)(0 °C to 85 °C) @ VS = 3.0 Volts VFSS — 2.7 — VDC — — — ±2.5 %VFSS V/P — 54 —- mV/kPa Response time(5) tR — 1.0 —- ms Warm-up time(6) — — 20 —- ms Offset stability(7) — — ±0.5 —- %VFSS VOFF 0.06 0.12 0.19 VDC Pressure range Accuracy(4) (0 °C to 85 °C) Sensitivity Pressure offset(8) (0 °C to 85 °C) 1.Device is ratiometric within this specified excitation range. 2.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 3.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 4.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 °C due to all sources of errors, including the following: Linearity: Temperature hysteresis: Pressure hysteresis: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C. Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. 5. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7.Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. 8.Offset (VOFF) is defined as the output voltage at the minimum rated pressure. MP3V5050V 6 Sensors Freescale Semiconductor, Inc. 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the differential/gauge sensing chip in the basic chip carrier. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3V5050V pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. The MP3V5050V is optimized to perform in vacuum pressures applied to port P1. The sensor is calibrated and temperature compensated to give a positive electrical output upon measuring a vacuum pressure up to the rated pressure of up to -50 kPa where the output will be the full-scale voltage listed in Table 3. Fluorosilicone Gel Die Coat Die Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame P2 Differential Sensing Element Die Bond Figure 3. Cross-sectional diagram SOP (not-to-scale) 3V VOUT OUTPUT VS IPS 0.01 μF or 0.1 μF 1.0 μF 470 pF GND Figure 4. Recommended power supply decoupling and output filtering MP3V5050V Sensors Freescale Semiconductor, Inc. 7 3 TYPICAL MAX 1 Output Range (Typ) Output Voltage (V) 2 Span Range (Typ) Transfer Function: VOUIT = VS x (0.018 x P + 0.94) ± (PE x TM x 0.018 x VS) VS = 3.0 ± 0.30 VDC PE = 1.25 TM = 1 Temperature = 0 to 85 °C MIN 0 –50 –40 –30 –20 –10 0 Offset (Typ) Pressure (kPa) Figure 5. Output vs. pressure differential Nominal Transfer Value: VOUT = VS x (0.018 x P + 0.94) ± (Pressure Error x Temp Multi x 0.018 x VS) VS = 3.0 ± 0.3 V Figure 6. Transfer function Temperature Error Factor 4.0 Break Points Temp 3.0 Multiplier -40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C. Figure 7. Temperature error band MP3V5050V 8 Sensors Freescale Semiconductor, Inc. Error Limits for Pressure Pressure Error (kPa) 1.25 1.00 0.75 0 –50 –40 –30 –20 –10 0 Pressure (in kPa) –0.75 –1.00 –1.25 Pressure Error (Max) –50 to 0 kPa ±1.25 kPa Figure 8. Pressure error band MP3V5050V Sensors Freescale Semiconductor, Inc. 9 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 9. SOP footprint MP3V5050V 10 Sensors Freescale Semiconductor, Inc. 4.2 Package dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– K M PIN 1 IDENTIFIER SEATING PLANE Case 98ASB17757C, small outline package MP3V5050V Sensors Freescale Semiconductor, Inc. 11 5 Revision History Table 4. Revision history Revision number Revision date 2.1 09/2015 Description • Updated format. • Deleted part number MP3V5050VC6T1. • Added vacuum pressure information to section 3. MP3V5050V 12 Sensors Freescale Semiconductor, Inc. How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2008, 2010, 2015 Freescale Semiconductor, Inc. Document Number: MP3V5050V Rev. 3.0 09/2015