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MPC555LFMZP40R2

MPC555LFMZP40R2

  • 厂商:

    NXP(恩智浦)

  • 封装:

    BBGA272

  • 描述:

    IC MCU 32BIT 448KB FLASH 272PBGA

  • 数据手册
  • 价格&库存
MPC555LFMZP40R2 数据手册
Freescale Semiconductor, Inc. Product Brief MPC555PB/D Rev. 3, 2/2003 Freescale Semiconductor, Inc... MPC555 Product Brief This document provides an overview of the MPC555 microcontroller, including a block diagram showing the major modular components and sections that list the major features. The MPC555 member of the Freescale MPC500 RISC Microcontroller family. Table 1. MPC555 Features 1 Device Flash Code Compression MPC555 448 Kbytes Code compression not supported Introduction The MPC555 device offers the following features: • • • • • • • • • • • • • • • PowerPC™ core with floating-point unit 26 Kbytes fast RAM and 6 Kbytes TPU microcode RAM 448 Kbytes Flash EEPROM with 5-V programming 5-V I/O system Serial system: queued serial multi-channel module (QSMCM), dual CAN 2.0B controller modules (TouCANTM) 50-channel timer system: dual time processor units (TPU3), modular I/O system (MIOS1) 32 analog inputs: dual queued analog-to-digital converters (QADC64) Submicron HCMOS (CDR1) technology 272-pin plastic ball grid array (PBGA) packaging 40-MHz operation, -40 °C to 125 °C with dual supply (3.3 V, 5 V) (-55 °C to 125 °C for the suffix A device) 32-bit architecture (PowerPC ISA architecture compliant) Core performance measured at 52.7-Kbyte Dhrystones (v2.1) @ 40 MHz Fully static, low power operation Integrated double-precision floating-point unit Precise exception model © Freescale Semiconductor, Inc., 2004. All rights reserved. Freescale Semiconductor, Inc. Block Diagram • 1.1 Extensive system development support — On-chip watchpoints and breakpoints — Program flow tracking — BDM on-chip emulation development interface Block Diagram Figure 1 is a block diagram of the MPC555. 256 Kbytes Flash 192 Kbytes Flash Freescale Semiconductor, Inc... Burst Interface U-bus E-bus USIU RCPU 10 Kbytes SRAM 16 Kbytes SRAM L2U L-bus QADC QADC QSMCM UIMB TouCAN IMB3 TPU3 TPU3 DPTRAM TouCAN MIOS1 Figure 1. MPC555 Block Diagram 1.2 Key Features The MPC555 key features are explained in the following sections. 1.2.1 2 Four-Bank Memory Controller • Works with SRAM, EPROM, Flash EEPROM, and other peripherals • Byte write enables • 32-bit address decodes with bit masks MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. 1.2.2 Freescale Semiconductor, Inc... • • • • • • • • • • 1.2.3 • • • • 1.2.4 • • • • 1.2.5 • • • • 1.2.6 • • • • Key Features U-Bus System Interface Unit (USIU) Clock synthesizer Power management Reset controller MPC555 decrementer and time base Real-time clock register Periodic interrupt timer Hardware bus monitor and software watchdog timer Interrupt controller that supports up to eight external and eight internal interrupts IEEE 1149.1 JTAG test access port External bus interface — 24 address pins, 32 data pins — Supports multiple master designs — Four-beat transfer bursts, two-clock minimum bus transactions — Supports 5V inputs, provides 3.3-V outputs Flexible Memory Protection Unit Four instruction regions and four data regions 4-Kbyte to 16-Mbyte region size support Default attributes available in one global entry Attribute support for speculative accesses 448-Kbyte Flash EEPROM Memory One 256-Kbyte and one 192-Kbyte module Page read mode Block (32-Kbyte) erasable External 4.75-V to 5.25-V program and erase power supply 26-Kbytes of Static RAM One 16-Kbyte and one 10-Kbyte module Fast (one-clock) access Keep-alive power Soft defect detection (SDD) General-Purpose I/O Support Address (24) and data (32) pins can be used for general-purpose I/O in single-chip mode Nine general-purpose I/O pins in MIOS1 unit Many peripheral pins can be used for general-purpose I/O when not used for primary function 5-V tolerant inputs/outputs MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com 3 Key Features 1.2.7 • Freescale Semiconductor, Inc. Two Time Processor Units (TPU3) Each TPU3 module provides these features: — A dedicated micro-engine operates independently of the RCPU — 16 independent programmable channels and pins — Each channel has an event register consisting of a 16-bit capture register, a 16-bit compare register and a 16-bit comparator — Nine pre-programmed timer functions are available — Any channel can perform any time function — Each timer function can be assigned to more than one channel Freescale Semiconductor, Inc... — Two timer count registers with programmable prescalers — Each channel can be synchronized to one or both counters — Selectable channel priority levels — 5-V tolerant inputs/outputs • 1.2.8 6-Kbyte dual port TPU RAM (DPTRAM) is shared by the two TPU3 modules for TPU microcode 18-Channel Modular I/O System (MIOS1) • Ten double action submodules (DASM) • Eight dedicated PWM sub-modules (PWMSM) • Two 16-bit modulus counter submodules (MCSM) • Two parallel port I/O submodules (PIOSM) • 5-V tolerant inputs/outputs 1.2.9 Two Queued Analog-to-Digital Converter Modules (QADC64) Each QADC provides: • Up to 16 analog input channels, using internal multiplexing • Up to 41 total input channels, using internal and external multiplexing • 10-bit A/D converter with internal sample/hold • Typical conversion time of 10 µs (100,000 samples per second) • Two conversion command queues of variable length • Automated queue modes initiated by: — External edge trigger/level gate — Software command 4 • 64 result registers • Output data that is right- or left-justified, signed or unsigned • 5-V reference and range MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Key Features 1.2.10 Two CAN 2.0B Controller Modules (TouCAN) Freescale Semiconductor, Inc... Each TouCAN provides these features: • • • • • • • • • • • • • • • Full implementation of CAN protocol specification, version 2.0A and 2.0B Each module has 16 receive/transmit message buffers of 0 to 8 bytes data length Global mask register for message buffers 0 to 13 Independent mask registers for message buffers 14 and 15 Programmable transmit-first scheme: lowest ID or lowest buffer number 16-bit free-running timer for message time-stamping Low power sleep mode with programmable wake-up on bus activity Programmable I/O modes Maskable interrupts Independent of the transmission medium (external transceiver is assumed) Open network architecture Multimaster concept High immunity to EMI Short latency time for high-priority messages Low power sleep mode with programmable wakeup on bus activity 1.2.11 Queued Serial Multi-Channel Module (QSMCM) • • Queued serial peripheral interface (QSPI) — Provides full-duplex communication port for peripheral expansion or interprocessor communication — Up to 32 preprogrammed transfers, reducing overhead — 160-byte queue buffer — Programmable transfer length: from 8 to 16 bits, inclusive — Synchronous interface with baud rate of up to system clock divided by 4 — Four programmable peripheral-select pins support up to 16 devices — Wrap-around mode allows continuous sampling for efficient interfacing to serial peripherals (e.g., – serial A/D converters, I/O latches, etc.) Two serial communications interfaces (SCI). Each SCI offers these features: — UART mode provides NRZ format and half-or full-duplex interface — 16 register receive buffer and 16 register transmit buffer (SCI1 only) — Advanced error detection and optional parity generation and detection — Word length programmable as 8 or 9 bits — Separate transmitter and receiver enable bits and double buffering of data — Wakeup functions allow the CPU to run uninterrupted until either a true idle line is detected or a new address byte is received — External source clock for baud generation — Multiplexing of transmit data pins with discrete outputs and receive data pins with discrete inputs, allowing realization of a low-speed serial protocol MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com 5 Key Features 2 Freescale Semiconductor, Inc. MPC555 Address Map The internal memory map is shown in Figure 2. 0x00 0000 0x04 0000 0x06 FFFF 0x07 0000 CMF Flash A 256 Kbytes USIU Control Registers 1 Kbyte CMF Flash B 192 Kbytes FLASH Module A (64 b ytes) FLASH Module B (64 b ytes) 0x2F C800 0x2F C840 0x 2F C880 Reserved for Flash Freescale Semiconductor, Inc... 0x2F C000 (2.6 Mbytes - 16 Kbytes) Res erved for USIU 0 x 2 F BFFF 0x 2F C000 0 x 2 F FFFF 0x 30 0000 U SI U & F l a sh Control 1 6 Kbytes IMB3 Address Space UIMB Interface & IMB3 Modules (32 Kbytes) 0x 30 8000 DPTRAM (6 Kbytes) Reserved for IMB3 (4 80 Kbytes) TPU3_B (1 Kbyte) 0x30 4800 QADC_B (1 Kbyte) 0x30 4C00 SR A M C o n t r o l B ( 8 b ytes) QSMCM (4 Kbytes) MIOS1 (4 Kbytes) Reserved 0x 3 F FFFF TouCAN_A (1 Kbyte) 0x30 5000 0x30 6000 0x30 7080 TouCAN_B (1 Kbyte) 0x30 7480 SRAM A (10 Kbytes) Reserved (1920 bytes) 0x30 7884 SRAM B (16 Kbytes) UIMB Registers (128 bytes) Figure 2. MPC555 Internal Memory Map 6 0x30 4400 QADC_A (1 Kbyte) (485.98 Kbytes) 0x 3F C000 0x30 4000 SR A M C o n t r o l A ( 8 bytes) 0x 38 0010 0x 3F 9800 0x30 2000 Reserved (2 Kbytes) TPU3_A (1 Kbyte) 0 x 3 7 FFFF 0x 38 0008 0x30 0000 Reserved (8180 bytes) 0 x 3 0 7 FFF 0x 3 8 0 00 0 DPTRAM Control (12 bytes) MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com 0x30 7F80 0x30 7FFF y Dees B_TPUCH6 B_TPUCH5 F MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com CS3B TEAB TAB BIB_STSB RD_WRB OEB TSIZ0 BURSTB R T U V Y 6 TSB TSIZ1 CS2B BDIPB VDDL CS1B CS0B VDDI 13 14 15 Addr_ SGP31 Addr_ SGP30 Addr_ SGP28 Addr_ SGP29 VDDL Data_ SGP29 Data_ SGP27 Data_ SGP25 Data_ SGP23 VDDL Data_ SGP20 RCFB_TXP VDDI VDDL VPP 19 =3 volt power (I/O) VDDi =3 volt power (internal) =ground 21 November 1997 VSS VDDH =5 volt power 20 MPIO13 MPIO12 MPIO9 MPIO6 MPWM3 MDA31 MDA28 VDDH A_CNRX0 VDDH PORESETB ECK_ BUCK VSSSYN XFC VSSF RXD2_ QGPI ECK Version 10.2 =Misc power VDDH HRESETB SRESETB XTAL EXTAL VDDSYN VDDH TXD2_ QGPO SCK_ QGP6 MISO _QGP4 MOSI _QGP5 A_CNTX0 VF0 _MPIO0 VF1 _MPIO1 MPIO14 MPIO11 MPIO7 MPWM19 MPWM2 MDA30 VDDH MDA13 Addr_ SGP13 Addr_ SGP15 Addr_ SGP17 Addr_ SGP19 Addr_ SGP21 Addr_ SGP24 Addr_ SGP25 Data_ SGP0 Data_ SGP2 Data_ SGP4 Data_ SGP6 Data_ SGP8 Data_ SGP10 Data_ SGP12 Data_ SGP14 Data_ SGP16 IRQ6B _mck2 IRQ7B _mck3 Addr_ SGP14 Addr_ SGP16 Addr_ SGP18 Addr_ SGP20 Addr_ SGP23 Addr_ SGP26 Data_ SGP1 Data_ SGP3 Data_ SGP5 Data_ SGP7 Data_ SGP9 Data_ SGP11 Data_ SGP13 Data_ SGP15 Data_ SGP17 IRQ5B _SGP CLKOUT EXTCLK KAPWR VDDF EPEE TXD1_ QGPO PCS0 _QGP VFLS1 _MPIO4 VFLS0 _MPIO3 RXD1_ QGPI PCS1 _QGP VDDL VF2 _MPIO2 MPIO15 MPIO8 MPWM18 MPWM17 MPWM1 MDA29 MDA15 Note: The pinout is a top down view of the package. VSS VSS VSS MPIO10 MPIO5 MPWM16 MPWM0 VDDL MDA27 MDA14 18 MDA12 PCS2 _QGP VSS VSS VSS VSS VDDI ETRIG1 ETRIG2 17 MDA11 PCS3 _QGP VSS VSS VSS VSS 16 VDDH VSS VSS SGP_ IRQOUTB VSS IRQ2B _SGP WEB_ AT[3] 12 AAN1_PQB1 AAN50_PQB6 AAN55_PQA3 AAN58_PQA6 BAN50_PQB6 BAN55_PQA3 BAN58_PQA6 BAN59_PQA7 VSS BBB _IWP3 11 AAN2_PQB2 AAN51_PQB7 AAN56_PQA4 AAN59_PQA7 BAN49_PQB5 BAN53_PQA1 BAN56_PQA4 BAN57_PQA5 IRQ4B _SGP BGB_LWP1 10 AAN3_PQB3 AAN49_PQB5 AAN53_PQA1 AAN57_PQA5 BAN1_PQB1 BAN48_PQB4 BAN52_PQA0 BAN54_PQA2 IRQ3B _SGP VSSA VDDA 9 VSS VDDI A_TPUCH13 VRH 8 AAN0_PQB0 AAN48_PQB4 AAN52_PQA0 AAN54_PQA2 BAN0_PQB0 BAN2_PQB2 BAN3_PQB3 BAN51_PQB7 VDDL VDD SRAM B_CNTX0 B_TPUCH9 B_TPUCH12 VDDL A_TPUCH5 A_TPUCH9 7 VRL Addr_ SGP11 Addr_ SGP10 Addr_ SGP9 Addr_ SGP8 Addr_ SGP22 Addr_ SGP27 Data_ SGP31 Data_ SGP30 Data_ SGP28 Data_ SGP26 Data_ SGP24 Data_ SGP22 Data_ SGP21 Data_ SGP19 Data_ SGP18 Substrate 9/30/97a VDDH VDDH VDDH WEB_ AT[2] WEB_ AT[1] P W Addr_ SGP12 BRB_IWP2 WEB_ AT[0] N IRQ1B _SGP IWP1 _VFLS IWP0 _VFLS TMS M IRQ0B _SGP L K SGP_FRZ TDO_ DSDO TDI_DSDI TRST_B B_TPUCH0 B_TPUCH1 H J TCK_ DSCK B_CNRX0 B_TPUCH3 B_TPUCH2 G B_TPUCH4 B_TPUCH8 B_TPUCH10 B_TPUCH14 B_TPUCH7 A_TPUCH2 D B_TPUCH11 B_TPUCH13 A_TPUCH0 E 5 A_TPUCH12 A_TPUCH15 A_TPUCH10 A_TPUCH11 A_TPUCH14 A_TPUCH7 A_TPUCH6 4 A_TPUCH8 A_TPUCH3 A_T2CLK VDDH B_T2CLK B 3 A_TPUCH4 Ball Map 3 C B_TPUCH15 2 A_TPUCH1 1 VDDH A MPC555 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Key Features MPC555 Pinout Diagram Figure 3 shows the pinout for the MPC555. Figure 3. MPC555 Pinout Diagram 7 Freescale Semiconductor, Inc. Key Features 4 Supporting Documentation List Freescale Semiconductor, Inc... This list contains references to currently available and planned documentation. 5 • MPC555 User’s Manual (MPC555UM/AD) • RCPU Reference Manual (RCPURM/AD) • Board Strategies for Ensuring Optimum Frequency Synthesizer Performance (AN1282/D) • Using the MIOS on the MPC555 Evaluation Board (AN1778/D) • Exception Table Relocation and Multi-Processor Address Mapping in the Embedded MPC5XX Family (AN1821/D) • Non-Volatile Memory Technology Overview (AN1837/D) • Designing Expansion Boards for the Freescale EVB555/ETAS ES200 (AN2001/D) • MPC555 Interrupts (AN2109/D) • EMC Guidelines for MPC500-Based Automotive Powertrain Systems (AN2127/D) • Nexus Standard Specification (non-Freescale document) • Nexus Web Site: http://www.nexus5001.org/ • IEEE 1149.1 Specification (non-Freescale document) Revision History Table 2. Revision History 8 Revision Number Substantive Changes Date of Release 2 Existing Document. September 2001 2.1 Added temperature range for suffix A device. 11 December 2002 3 Updated template and formats. 11 February 2003 MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Key Features Freescale Semiconductor, Inc... THIS PAGE INTENTIONALLY LEFT BLANK MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com 9 Key Features Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... THIS PAGE INTENTIONALLY LEFT BLANK 10 MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Key Features Freescale Semiconductor, Inc... THIS PAGE INTENTIONALLY LEFT BLANK MPC555 Product Brief For More Information On This Product, Go to: www.freescale.com 11 Freescale Semiconductor, Inc. How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com Freescale Semiconductor, Inc... USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. MPC555PB/D For More Information On This Product, Go to: www.freescale.com
MPC555LFMZP40R2 价格&库存

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