MPC755CRX350TE

Freescale Semiconductor Document Number: MPC755EC Rev. 8, 02/2006 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are reduced instruction set computing (RISC) microprocessors that implement the PowerPC™ instruction set architecture. This document describes pertinent physical characteristics of the MPC755. For information on specific MPC755 part numbers covered by this or other specifications, see Section 10, “Ordering Information.” For functional characteristics of the processor, refer to the MPC750 RISC Microprocessor Family User’s Manual. To locate any published errata or updates for this document, refer to the website listed on the back cover of this document. 1 Overview The MPC755 is targeted for low-cost, low-power systems and supports the following power management features—doze, nap, sleep, and dynamic power management. The MPC755 consists of a processor core and an internal L2 tag combined with a dedicated L2 cache interface and a 60x bus. The MPC745 is identical to the MPC755 except it does not support the L2 cache interface. Figure 1 shows a block diagram of the MPC755. © Freescale Semiconductor, Inc., 2006. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical and Thermal Characteristics . . . . . . . . . . . . 6 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Pinout Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 32 System Design Information . . . . . . . . . . . . . . . . . . . 36 Document Revision History . . . . . . . . . . . . . . . . . . . 50 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 53 2 Integer Unit 2 + Integer Unit 1 + × ÷ Reorder Buffer (6-Entry) Completion Unit 32-Bit Reservation Station Reservation Station 2 Instructions • Time Base Counter/Decrementer • Clock Multiplier • JTAG/COP Interface • Thermal/Power Management • Performance Monitor Additional Features DTLB SRs (Original) DBAT Array Data MMU 32-Bit CR System Register Unit Reservation Station Tags PA 32-Kbyte D Cache 17-Bit L2 Address Bus 64-Bit L2 Data Bus Data Load Queue L1 Castout Queue Instruction Fetch Queue 32-Kbyte I Cache Reservation Station Tags L2CR L2 Tags Not in the MPC745 L2 Castout Queue L2 Controller FPSCR FPSCR + × ÷ 64-Bit Floating-Point Unit IBAT Array 128-Bit (4 Instructions) L2 Bus Interface Unit Rename Buffers (6) FPR File ITLB SRs (Shadow) Instruction MMU 60x Bus Interface Unit Store Queue (EA Calculation) + Load/Store Unit 64-Bit 64-Bit 32-Bit Reservation Station (2-Entry) 32-Bit Address Bus 32-/64-Bit Data Bus EA CTR LR 64-Bit (2 Instructions) BHT BTIC 64-Entry Branch Processing Unit Rename Buffers (6) GPR File Dispatch Unit Instruction Queue (6-Word) Fetcher Instruction Unit Overview Figure 1. MPC755 Block Diagram MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor Features 2 Features This section summarizes features of the MPC755 implementation of the PowerPC architecture. Major features of the MPC755 are as follows: • Branch processing unit — Four instructions fetched per clock — One branch processed per cycle (plus resolving two speculations) — Up to one speculative stream in execution, one additional speculative stream in fetch — 512-entry branch history table (BHT) for dynamic prediction — 64-entry, four-way set-associative branch target instruction cache (BTIC) for eliminating branch delay slots • Dispatch unit — Full hardware detection of dependencies (resolved in the execution units) — Dispatch two instructions to six independent units (system, branch, load/store, fixed-point unit 1, fixed-point unit 2, floating-point) — Serialization control (predispatch, postdispatch, execution serialization) • Decode — Register file access — Forwarding control — Partial instruction decode • Completion — Six-entry completion buffer — Instruction tracking and peak completion of two instructions per cycle — Completion of instructions in program order while supporting out-of-order instruction execution, completion serialization, and all instruction flow changes • Fixed point units (FXUs) that share 32 GPRs for integer operands — Fixed Point Unit 1 (FXU1)—multiply, divide, shift, rotate, arithmetic, logical — Fixed Point Unit 2 (FXU2)—shift, rotate, arithmetic, logical — Single-cycle arithmetic, shifts, rotates, logical — Multiply and divide support (multi-cycle) — Early out multiply • Floating-point unit and a 32-entry FPR file — Support for IEEE standard 754 single- and double-precision floating-point arithmetic — Hardware support for divide — Hardware support for denormalized numbers — Single-entry reservation station — Supports non-IEEE mode for time-critical operations — Three-cycle latency, one-cycle throughput, single-precision multiply-add MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor 3 Features • • • • — Three-cycle latency, one-cycle throughput, double-precision add — Four-cycle latency, two-cycle throughput, double-precision multiply-add System unit — Executes CR logical instructions and miscellaneous system instructions — Special register transfer instructions Load/store unit — One-cycle load or store cache access (byte, half-word, word, double word) — Effective address generation — Hits under misses (one outstanding miss) — Single-cycle unaligned access within double-word boundary — Alignment, zero padding, sign extend for integer register file — Floating-point internal format conversion (alignment, normalization) — Sequencing for load/store multiples and string operations — Store gathering — Cache and TLB instructions — Big- and little-endian byte addressing supported Level 1 cache structure — 32K, 32-byte line, eight-way set-associative instruction cache (iL1) — 32K, 32-byte line, eight-way set-associative data cache (dL1) — Cache locking for both instruction and data caches, selectable by group of ways — Single-cycle cache access — Pseudo least-recently-used (PLRU) replacement — Copy-back or write-through data cache (on a page per page basis) — MEI data cache coherency maintained in hardware — Nonblocking instruction and data cache (one outstanding miss under hits) — No snooping of instruction cache Level 2 (L2) cache interface (not implemented on MPC745) — Internal L2 cache controller and tags; external data SRAMs — 256K, 512K, and 1 Mbyte two-way set-associative L2 cache support — Copy-back or write-through data cache (on a page basis, or for all L2) — Instruction-only mode and data-only mode — 64-byte (256K/512K) or 128-byte (1M) sectored line size — Supports flow through (register-buffer) synchronous BurstRAMs, pipelined (register-register) synchronous BurstRAMs (3-1-1-1 or strobeless 4-1-1-1) and pipelined (register-register) late write synchronous BurstRAMs — L2 configurable to cache, private memory, or split cache/private memory — Core-to-L2 frequency divisors of ÷1, ÷1.5, ÷2, ÷2.5, and ÷3 supported — 64-bit data bus MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 4 Freescale Semiconductor General Parameters • • • • • 3 — Selectable interface voltages of 2.5 and 3.3 V — Parity checking on both L2 address and data Memory management unit — 128-entry, two-way set-associative instruction TLB — 128-entry, two-way set-associative data TLB — Hardware reload for TLBs — Hardware or optional software tablewalk support — Eight instruction BATs and eight data BATs — Eight SPRGs, for assistance with software tablewalks — Virtual memory support for up to 4 exabytes (252) of virtual memory — Real memory support for up to 4 gigabytes (232) of physical memory Bus interface — Compatible with 60x processor interface — 32-bit address bus — 64-bit data bus, 32-bit mode selectable — Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x, 10x supported — Selectable interface voltages of 2.5 and 3.3 V — Parity checking on both address and data buses Power management — Low-power design with thermal requirements very similar to MPC740/MPC750 — Three static power saving modes: doze, nap, and sleep — Dynamic power management Integrated thermal management assist unit — On-chip thermal sensor and control logic — Thermal management interrupt for software regulation of junction temperature Testability — LSSD scan design — IEEE 1149.1 JTAG interface General Parameters The following list provides a summary of the general parameters of the MPC755: Technology 0.22 µm CMOS, six-layer metal Die size 6.61 mm × 7.73 mm (51 mm2) Transistor count 6.75 million Logic design Fully-static MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor 5 Electrical and Thermal Characteristics Packages Core power supply I/O power supply 4 MPC745: Surface mount 255 plastic ball grid array (PBGA) MPC755: Surface mount 360 ceramic ball grid array (CBGA) Surface mount 360 plastic ball grid array (PBGA) 2.0 V ± 100 mV DC (nominal; some parts support core voltages down to 1.8 V; see Table 3 for recommended operating conditions) 2.5 V ± 100 mV DC or 3.3 V ± 165 mV DC (input thresholds are configuration pin selectable) Electrical and Thermal Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC755. 4.1 DC Electrical Characteristics Table 1 through Table 7 describe the MPC755 DC electrical characteristics. Table 1 provides the absolute maximum ratings. Table 1. Absolute Maximum Ratings1 Characteristic Symbol Maximum Value Unit Notes Core supply voltage VDD –0.3 to 2.5 V 4 PLL supply voltage AVDD –0.3 to 2.5 V 4 L2AVDD –0.3 to 2.5 V 4 OVDD –0.3 to 3.6 V 3 L2OVDD –0.3 to 3.6 V 3 Processor bus Vin –0.3 to OVDD + 0.3 V V 2, 5 L2 bus Vin –0.3 to L2OVDD + 0.3 V V 2, 5 JTAG signals Vin –0.3 to 3.6 V Tstg –55 to 150 °C L2 DLL supply voltage Processor bus supply voltage L2 bus supply voltage Input voltage Storage temperature range Notes: 1. Functional and tested operating conditions are given in Table 3. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. Caution: Vin must not exceed OVDD or L2OVDD by more than 0.3 V at any time including during power-on reset. 3. Caution: L2OVDD/OVDD must not exceed VDD/AVDD/L2AVDD by more than 1.6 V during normal operation. During power-on reset and power-down sequences, L2OVDD/OVDD may exceed VDD/AVDD/L2AVDD by up to 3.3 V for up to 20 ms, or by 2.5 V for up to 40 ms. Excursions beyond 3.3 V or 40 ms are not supported. 4. Caution: VDD/AVDD/L2AVDD must not exceed L2OVDD/OVDD by more than 0.4 V during normal operation. During power-on reset and power-down sequences, VDD/AVDD/L2AVDD may exceed L2OVDD/OVDD by up to 1.0 V for up to 20 ms, or by 0.7 V for up to 40 ms. Excursions beyond 1.0 V or 40 ms are not supported. 5. This is a DC specifications only. Vin may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2. MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 6 Freescale Semiconductor Electrical and Thermal Characteristics Figure 2 shows the allowable undershoot and overshoot voltage on the MPC755. (L2)OVDD + 20% (L2)OVDD + 5% (L2)OVDD VIH VIL GND GND – 0.3 V GND – 0.7 V Not to Exceed 10% of tSYSCLK Figure 2. Overshoot/Undershoot Voltage The MPC755 provides several I/O voltages to support both compatibility with existing systems and migration to future systems. The MPC755 core voltage must always be provided at nominal 2.0 V (see Table 3 for actual recommended core voltage). Voltage to the L2 I/Os and processor interface I/Os are provided through separate sets of supply pins and may be provided at the voltages shown in Table 2. The input voltage threshold for each bus is selected by sampling the state of the voltage select pins BVSEL and L2VSEL during operation. These signals must remain stable during part operation and cannot change. The output voltage will swing from GND to the maximum voltage applied to the OVDD or L2OVDD power pins. Table 2 describes the input threshold voltage setting. Table 2. Input Threshold Voltage Setting Part Revision BVSEL Signal Processor Bus Interface Voltage L2VSEL Signal L2 Bus Interface Voltage E 0 Not Available 0 Not Available 1 2.5 V/3.3 V 1 2.5 V/3.3 V Caution: The input threshold selection must agree with the OVDD/L2OVDD voltages supplied. Note: The input threshold settings above are different for all revisions prior to Rev. 2.8 (Rev. E). For more information, refer to Section 10.2, “Part Numbers Not Fully Addressed by This Document.” MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor 7 Electrical and Thermal Characteristics Table 3 provides the recommended operating conditions for the MPC755. Table 3. Recommended Operating Conditions 1 Recommended Value Characteristic Symbol 300 MHz, 350 MHz 400 MHz Min Max Min Max Unit Notes Core supply voltage VDD 1.80 2.10 1.90 2.10 V 3 PLL supply voltage AVDD 1.80 2.10 1.90 2.10 V 3 L2AVDD 1.80 2.10 1.90 2.10 V 3 OVDD 2.375 2.625 2.375 2.625 V 2, 4 3.135 3.465 3.135 3.465 2.375 2.625 2.375 2.625 3.135 3.465 3.135 3.465 L2 DLL supply voltage Processor bus supply voltage BVSEL = 1 L2 bus supply voltage L2VSEL = 1 Input voltage Die-junction temperature L2OVDD 5 V 2, 4 5 Processor bus Vin GND OVDD GND OVDD V L2 bus Vin GND L2OVDD GND L2OVDD V JTAG signals Vin GND OVDD GND OVDD V Tj 0 105 0 105 °C Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. 2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to Section 10.2, “Part Numbers Not Fully Addressed by This Document.” 3. 2.0 V nominal. 4. 2.5 V nominal. 5. 3.3 V nominal. Table 4 provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was initially sampled in a CBGA package, but production units are currently provided in both a CBGA and a PBGA package. Because of the better long-term device-to-board interconnect reliability of the PBGA package, Freescale recommends use of a PBGA package except where circumstances dictate use of a CBGA package. The MPC745 is offered in a PBGA package only. MPC755 RISC Microprocessor Hardware Specifications, Rev. 8 8 Freescale Semiconductor Electrical and Thermal Characteristics Table 4. Package Thermal Characteristics 6 Value Characteristic Symbol MPC755 CBGA MPC755 PBGA MPC745 PBGA Unit Notes Junction-to-ambient thermal resistance, natural convection RθJA 24 31 34 °C/W 1, 2 Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board RθJMA 17 25 26 °C/W 1, 3 Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board RθJMA 18 25 27 °C/W 1, 3 Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board RθJMA 14 21 22 °C/W 1, 3 Junction-to-board thermal resistance RθJB 8 17 17 °C/W 4 Junction-to-case thermal resistance RθJC