Freescale Semiconductor
MPC8245EC
Rev. 10, 08/2007
Technical Data
MPC8245 Integrated Processor
Hardware Specifications
The MPC8245 combines a PowerPC™ MPC603e processor
core built on Power Architecture™ technology with a PCI
bridge so that system designers can rapidly design systems
using peripherals designed for PCI and the other standard
interfaces. Also, a high-performance memory controller
supports various types of ROM and SDRAM. The MPC8245
is the second of a family of products that provide
system-level support for industry-standard interfaces with an
MPC603e processor core.
This hardware specification describes pertinent electrical
and physical characteristics of the MPC8245. For functional
characteristics of the processor, refer to the MPC8245
Integrated Processor Reference Manual (MPC8245UM).
For published errata or updates to this document, visit the
website listed on the back cover of the document.
1
Overview
The MPC8245 integrated processor is composed of a
peripheral logic block and a 32-bit superscalar MPC603e
core, as shown in Figure 1.
© Freescale Semiconductor, Inc., 2001–2007. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical and Thermal Characteristics . . . . . . . . . . . . 5
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 31
PLL Configurations . . . . . . . . . . . . . . . . . . . . . . . . . 39
System Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Document Revision History . . . . . . . . . . . . . . . . . . . 56
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 62
Overview
MPC8245
Processor Core Block
Additional Features:
• Prog I/O with Watchpoint
• JTAG/COP Interface
• Power Management
Processor
PLL
(64-Bit) Two-Instruction Fetch
Branch
Processing
Instruction Unit
Unit
(BPU)
(64-Bit) Two-Instruction Dispatch
System
Register
Unit
(SRU)
Integer
Unit
(IU)
FloatingPoint
Unit
(FPU)
Load/Store
Unit
(LSU)
64-Bit
Data
MMU
16-Kbyte
Data
Cache
Instruction
MMU
16-Kbyte
Instruction
Cache
Peripheral Logic Bus
Peripheral Logic Block
Message
Unit
(with I2O)
DMA
Controller
Address
(32-Bit)
Data (64-Bit)
Data Path
ECC Controller
Central
Control
Unit
Memory
Controller
Performance
Monitor
I2C
5 IRQs/
16 Serial
Interrupts
I2C
Controller
DUART
Watchpoint
Facility
Memory/ROM/
PortX Control/Address
SDRAM_SYNC_IN
DLL
Peripheral Logic
PLL
PIC
Interrupt
Controller/
Timers
Data Bus
(32- or 64-Bit)
with 8-Bit Parity
or ECC
SDRAM Clocks
PCI_SYNC_IN
Configuration
Registers
PCI Bus
Interface Unit
Address
Translator
PCI
Arbiter
Five
32-Bit
PCI Interface Request/Grant Pairs
Fanout
Buffers
PCI Bus
Clocks
OSC_IN
Figure 1. MPC8245 Block Diagram
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
2
Freescale Semiconductor
Features
The peripheral logic integrates a PCI bridge, dual universal asynchronous receiver/transmitter (DUART),
memory controller, DMA controller, PIC interrupt controller, a message unit (and I2O interface), and an
I2C controller. The processor core is a full-featured, high-performance processor with floating-point
support, memory management, a 16-Kbyte instruction cache, a 16-Kbyte data cache, and power
management features. The integration reduces the overall packaging requirements and the number of
discrete devices required for an embedded system.
An internal peripheral logic bus interfaces the processor core to the peripheral logic. The core can operate
at a variety of frequencies, allowing the designer to trade off performance for power consumption. The
processor core is clocked from a separate PLL that is referenced to the peripheral logic PLL. This allows
the microprocessor and the peripheral logic block to operate at different frequencies while maintaining a
synchronous bus interface. The interface uses a 64- or 32-bit data bus (depending on memory data bus
width) and a 32-bit address bus along with control signals that enable the interface between the processor
and peripheral logic to be optimized for performance. PCI accesses to the MPC8245 memory space are
passed to the processor bus for snooping when snoop mode is enabled.
The general-purpose processor core and peripheral logic serve a variety of embedded applications. The
MPC8245 can be used as either a PCI host or PCI agent controller.
2
Features
Major features of the MPC8245 are as follows:
• Processor core
— High-performance, superscalar processor core
— Integer unit (IU), floating-point unit (FPU) (software enabled or disabled), load/store unit
(LSU), system register unit (SRU), and branch processing unit (BPU)
— 16-Kbyte instruction cache
— 16-Kbyte data cache
— Lockable L1 caches—Entire cache or on a per-way basis up to three of four ways
— Dynamic power management: 60x nap, doze, and sleep modes
• Peripheral logic
— Peripheral logic bus
– Various operating frequencies and bus divider ratios
– 32-bit address bus, 64-bit data bus
– Full memory coherency
– Decoupled address and data buses for pipelining of peripheral logic bus accesses
– Store gathering on peripheral logic bus-to-PCI writes
— Memory interface
– Up to 2 Gbytes of SDRAM memory
– High-bandwidth data bus (32- or 64-bit) to SDRAM
– Programmable timing supporting SDRAM
– One to eight banks of 16-, 64-, 128-, 256-, or 512-Mbit memory devices
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
3
Features
–
–
–
–
–
–
–
–
—
—
—
—
Write buffering for PCI and processor accesses
Normal parity, read-modify-write (RMW), or ECC
Data-path buffering between memory interface and processor
Low-voltage TTL logic (LVTTL) interfaces
272 Mbytes of base and extended ROM/Flash/PortX space
Base ROM space for 8-bit data path or same size as the SDRAM data path (32- or 64-bit)
Extended ROM space for 8-, 16-, 32-bit gathering data path, 32- or 64-bit (wide) data path
PortX: 8-, 16-, 32-, or 64-bit general-purpose I/O port using ROM controller interface with
programmable address strobe timing, data ready input signal (DRDY), and 4 chip selects
32-bit PCI interface
– Operates up to 66 MHz
– PCI 2.2-compatible
– PCI 5.0-V tolerance
– Dual address cycle (DAC) for 64-bit PCI addressing (master only)
– Accesses to PCI memory, I/O, and configuration spaces
– Selectable big- or little-endian operation
– Store gathering of processor-to-PCI write and PCI-to-memory write accesses
– Memory prefetching of PCI read accesses
– Selectable hardware-enforced coherency
– PCI bus arbitration unit (five request/grant pairs)
– PCI agent mode capability
– Address translation with two inbound and outbound units (ATU)
– Internal configuration registers accessible from PCI
Two-channel integrated DMA controller (writes to ROM/PortX not supported)
– Direct mode or chaining mode (automatic linking of DMA transfers)
– Scatter gathering—Read or write discontinuous memory
– 64-byte transfer queue per channel
– Interrupt on completed segment, chain, and error
– Local-to-local memory
– PCI-to-PCI memory
– Local-to-PCI memory
– PCI memory-to-local memory
Message unit
– Two doorbell registers
– Two inbound and two outbound messaging registers
– I2O message interface
I2C controller with full master/slave support that accepts broadcast messages
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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Freescale Semiconductor
General Parameters
•
•
3
— Programmable interrupt controller (PIC)
– Five hardware interrupts (IRQs) or 16 serial interrupts
– Four programmable timers with cascade
— Two (dual) universal asynchronous receiver/transmitters (UARTs)
— Integrated PCI bus and SDRAM clock generation
— Programmable PCI bus and memory interface output drivers
System-level performance monitor facility
Debug features
— Memory attribute and PCI attribute signals
— Debug address signals
— MIV signal—Marks valid address and data bus cycles on the memory bus
— Programmable input and output signals with watchpoint capability
— Error injection/capture on data path
— IEEE Std 1149.1® (JTAG)/test interface
General Parameters
The following list summarizes the general parameters of the MPC8245:
Technology
0.25-µm CMOS, five-layer metal
Die size
49.2 mm2
Transistor count
4.5 million
Logic design
Fully-static
Packages
Surface-mount 352 tape ball grid array (TBGA)
Core power supply 1.7 V to 2.1 V DC for 266 and 300 MHz with the condition that the usage
is “nominal” ± 100 mV where “nominal” is 1.8/1.9/2.0 volts.
1.9 V to 2.2 V DC for 333 and 350 MHz with the condition that the usage
is “nominal” ± 100 mV where “nominal” is 2.0/2.1 volts.
See Table 2 for details of recommended operating conditions)
I/O power supply
3.0- to 3.6-V DC
4
Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8245.
4.1
DC Electrical Characteristics
This section covers ratings, conditions, and other DC electrical characteristics.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
5
Electrical and Thermal Characteristics
4.1.1
Absolute Maximum Ratings
The tables in this section describe the MPC8245 DC electrical characteristics. Table 1 provides the
absolute maximum ratings.
Table 1. Absolute Maximum Ratings
Characteristic 1
Symbol
Range
Unit
VDD
–0.3 to 2.25
V
Supply voltage—memory bus drivers
GVDD
–0.3 to 3.6
V
Supply voltage—PCI and standard I/O buffers
OVDD
–0.3 to 3.6
V
AV DD/AVDD
2
–0.3 to 2.25
V
LVDD
–0.3 to 5.4
V
Vin
–0.3 to 3.6
V
Supply voltage—CPU core and peripheral logic
Supply voltage—PLLs
Supply voltage—PCI reference
Input voltage 2
Operational die-junction temperature range
Storage temperature range
3
Tj
0 to 105
Tstg
–55 to 150
°C
°C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stress beyond those listed may affect device reliability or cause
permanent damage to the device.
2. PCI inputs with LV DD = 5 V ± 5% V DC may be correspondingly stressed at voltages exceeding LVDD + 0.5 V DC.
3. Note that this temperature range does not apply to the 400 MHz parts. For details, refer to the hardware specifications
addendum MPC8245ECSO2AD.
4.1.2
Recommended Operating Conditions
Table 2 provides the recommended operating conditions for the MPC8245. Some voltage values do not
apply to the 400-MHz parts. For details, refer to the hardware specifications addendum
MPC8245ECSO2AD.
Table 2. Recommended Operating Conditions1
Characteristic
Supply voltage
Symbol
Recommended
Value
Unit
Notes
VDD
1.8/1.9/2.0 V ±
V
4, 7
V
5, 7
100 mV
2.0/2.1 V ±
100 mV
I/O buffer supply for PCI and standard
OVDD
3.3 ± 0.3
V
7
Supply voltages for memory bus drivers
GVDD
3.3 ± 5%
V
9
CPU PLL supply voltage
AVDD
1.8/1.9/2.0 V ±
V
4, 7, 12
2.0/2.1 V ±
V
5, 7, 12
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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Freescale Semiconductor
Electrical and Thermal Characteristics
Table 2. Recommended Operating Conditions1 (continued)
Characteristic
PLL supply voltage—peripheral logic
PCI reference
Input voltage
Symbol
Recommended
Value
Unit
Notes
AVDD2
1.8/1.9/2.0 V ±
V
4, 7, 12
2.0/2.1 V ±
V
5, 7, 12
5.0 ± 5%
V
2, 10, 11
3.3 ± 0.3
V
3, 10, 11
0 to 3.6 or 5.75
V
2, 3
0 to 3.6
V
6
0 to 105
°C
LV DD
PCI inputs
Vin
All other inputs
Die-junction temperature
Tj
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. PCI pins are designed to withstand LV DD + 5% V DC when LVDD is connected to a 5.0-V DC power supply.
3. PCI pins are designed to withstand LV DD + 0.5 V DC when LVDD is connected to a 3.3-V DC power supply.
4. The voltage supply value of 1.8/1.9/2.0 V ± 100 mV applies to parts marked as having a maximum CPU speed of 266 and
300 MHz. See Table 7. For each chosen nominal value (1.8/1.9/2.0 V) the supply voltage should not exceed ± 100 mV of
the nominal value.
5. The voltage supply value of 2.0/2.1 V ± 100 m V applies to parts marked as having a maximum CPU speed of 333 and 350
MHz. See Table 7. For each chosen nominal value (2.0/2.1 V) the supply voltage should not exceed ± 100 mV of the nominal
value.
Cautions:
6. Input voltage (Vin) must not be greater than the supply voltage (V DD/AVDD/AVDD2) by more than 2.5 V at all times, including
during power-on reset. Input voltage (Vin) must not be greater than GVDD/OVDD by more than 0.6 V at all times, including
during power-on reset.
7. OV DD must not exceed VDD/AVDD/AVDD2 by more than 1.8 V at any time, including during power-on reset. This limit may
be exceeded for a maximum of 20 ms during power-on reset and power-down sequences.
8. VDD/AVDD/AVDD2 must not exceed OVDD by more than 0.6 V at any time, including during power-on reset. This limit may
be exceeded for a maximum of 20 ms during power-on reset and power-down sequences.
9. GV DD must not exceed VDD/AVDD/AVDD2 by more than 1.8 V at any time, including during power-on reset. This limit may
be exceeded for a maximum of 20 ms during power-on reset and power-down sequences.
10.LVDD must not exceed VDD/AVDD/AVDD2 by more than 5.4 V at any time, including during power-on reset. This limit may be
exceeded for a maximum of 20 ms during power-on reset and power-down sequences.
11. LVDD must not exceed OVDD by more than 3.0 V at any time, including during power-on reset. This limit may be exceeded
for a maximum of 20 ms during power-on reset and power-down sequences.
12.This voltage is the input to the filter discussed in Section 7.1, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AVDD pin, which may be reduced from VDD by the filter.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
7
Electrical and Thermal Characteristics
Figure 2 shows supply voltage sequencing and separation cautions.
LVDD @ 5 V
DC Power Supply Voltage
5V
11 10
3.3 V
11
OVDD/GVDD/(LVDD @ 3.3 V - - - -)
10
2.0 V
See Note 1
7, 9
8
VDD/AVDD/AV DD2
VDD Stable
100 µs
PLL
Relock
Time 3
0
Power Supply Ramp Up 2
HRST_CPU,
HRST_CTRL
Asserted 255
External Memory
Clock Cycles 3
6
PLL
Time
Reset
Configuration Pins
Nine External Memory
Clock Cycles Setup Time 4
HRST_CPU,
HRST_CTRL
Maximum Rise Time Must Be Less Than
One External Memory Clock Cycle 5
VM = 1.4 V
Notes:
1. Numbers associated with waveform separations correspond to caution numbers listed in Table 2.
2. See the Cautions section of Table 2 for details on this topic.
3. See Table 8 for details on PLL relock and reset signal assertion timing requirements.
4. Refer to Table 10 for additional information on reset configuration pin setup timing requirements.
5. HRST_CPU/HRST_CTRL must transition from a logic 0 to a logic 1 in less than one
SDRAM_SYNC_IN clock cycle for the device to be in the nonreset state.
6. PLL_CFG signals must be driven on reset and must be held for at least 25 clock cycles after the
negation of HRST_CTRL and HRST_CPU in order to be latched.
Figure 2. Supply Voltage Sequencing and Separation Cautions
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
8
Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 3 shows the undershoot and overshoot voltage of the memory interface.
VIH
VIL
4V
GVDD + 5%
GVDD
GND
GND – 0.3 V
GND – 1.0 V
Not to Exceed 10%
of tSDRAM_CLK
Figure 3. Overshoot/Undershoot Voltage
Figure 4 and Figure 5 show the undershoot and overshoot voltage of the PCI interface for the 3.3- and 5-V
signals, respectively.
11 ns
(Min)
+7.1 V
Overvoltage
Waveform
7.1 V p-to-p
(Min)
4 ns
(Max)
0V
4 ns
(Max)
62.5 ns
+3.6 V
Undervoltage
Waveform
7.1 V p-to-p
(Min)
–3.5 V
Figure 4. Maximum AC Waveforms for 3.3-V Signaling
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
9
Electrical and Thermal Characteristics
11 ns
(Min)
+11 V
Overvoltage
Waveform
11 V p-to-p
(Min)
0V
4 ns
(Max)
4 ns
(Max)
62.5 ns
+5.25 V
10.75 V p-to-p
(Min)
Undervoltage
Waveform
–5.5 V
Figure 5. Maximum AC Waveforms for 5-V Signaling
4.2
DC Electrical Characteristics
Table 3 provides the DC electrical characteristics for the MPC8245 at recommended operating conditions.
Table 3. DC Electrical Specifications
At recommended operating conditions (see Table 2)
Characteristic
Condition 3
Symbol
Min
Max
Unit
Notes
1
Input high voltage
PCI only, except
PCI_SYNC_IN
VIH
0.65 × OVDD
LVDD
V
Input low voltage
PCI only, except
PCI_SYNC_IN
VIL
—
0.3 × OVDD
V
Input high voltage
All other pins, including
PCI_SYNC_IN
(GVDD = 3.3 V)
VIH
2.0
3.3
V
Input low voltage
All inputs, including
PCI_SYNC_IN
VIL
GND
0.8
V
IL
—
±70
µA
4
IL
—
±10
µA
4
Input leakage current for pins using 0.5 V ≤ Vin ≤ 2.7 V
DRV_PCI driver
@ LVDD = 4.75 V
Input leakage current for
all others
LVDD = 3.6 V
GVDD ≤ 3.465 V
Output high voltage
IOH = driver-dependent
(GVDD = 3.3 V)
VOH
2.4
—
V
2
Output low voltage
IOL = driver-dependent
(GVDD = 3.3 V)
VOL
—
0.4
V
2
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
10
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 3. DC Electrical Specifications (continued)
At recommended operating conditions (see Table 2)
Characteristic
Capacitance
Condition 3
Vin = 0 V, f = 1 MHz
Symbol
Min
Max
Unit
Cin
—
16.0
pF
Notes
Notes:
1. See Table 16 for pins with internal pull-up resistors.
2. See Table 4 for the typical drive capability of a specific signal pin based on the type of output driver associated with that pin
as listed in Table 16.
3. These specifications are for the default driver strengths indicated in Table 4.
4. Leakage current is measured on input and output pins in the high-impedance state. The leakage current is measured for
nominal OVDD/LVDD, and V DD or both OVDD/LVDD and VDD must vary in the same direction.
4.2.1
Output Driver Characteristics
Table 4 provides information on the characteristics of the output drivers referenced in Table 16. The values
are preliminary estimates from an IBIS model and are not tested.
Table 4. Drive Capability of MPC8245 Output Pins 5
Driver Type
DRV_STD_MEM
DRV_PCI
DRV_MEM_CTRL
DRV_PCI_CLK
DRV_MEM_CLK
Programmable
Output Impedance
(Ω)
Supply
Voltage
IOH
IOL
Unit
Notes
20 (default)
OVDD = 3.3 V
36.6
18.0
mA
2, 4, 6
40
18.6
9.2
mA
2, 4, 6
20
12.0
12.4
mA
1, 3
40 (default)
6.1
6.3
mA
1, 3
89.0
42.3
mA
2, 4
36.6
18.0
mA
2, 4
18.6
9.2
mA
2, 4
6 (default)
20
40
GVDD = 3.3 V
Notes:
1. For DRV_PCI, IOH read from the IBIS listing in the pull-up mode, I(Min) column, at the 0.33-V label by interpolating between
the 0.3- and 0.4-V table entries’ current values that correspond to the PCI VOH = 2.97 = 0.9 × OVDD (OVDD = 3.3 V) where
table entry voltage = OVDD – PCI VOH.
2. For all others with GVDD or OVDD = 3.3 V, IOH read from the IBIS listing in the pull-up mode, I(Min) column, at the 0.9-V table
entry that corresponds to the VOH = 2.4 V where table entry voltage = GVDD/OVDD – VOH.
3. For DRV_PCI, IOL read from the IBIS listing in the pull-down mode, I(Min) column, at 0.33 V = PCI VOL = 0 × OVDD (OV DD
= 3.3 V) by interpolating between the 0.3- and 0.4-V table entries.
4. For all others with GVDD or OVDD = 3.3 V, IOL read from the IBIS listing in the pull-down mode, I(Min) column, at the 0.4-V
table entry.
5. See driver bit details for output driver control register (0x73) in the MPC8245 Integrated Processor Reference Manual.
6. See Chip Errata No. 19 in the MPC8245/MPC8241 RISC Microprocessor Chip Errata.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
11
Electrical and Thermal Characteristics
4.3
Power Characteristics
Table 5 provides power consumption data for the MPC8245.
Table 5. Power Consumption
PCI Bus Clock/Memory Bus Clock/CPU Clock Frequency (MHz)
Mode
Unit
Notes
2.2
W
1, 5
2.8
2.8
W
1, 2
2.2
2.4
2.4
W
1, 3
1.4
(1.3)
1.4
1.6
1.5
W
1, 4, 6
0.4
(0.4)
0.6
(0.6)
0.5
0.7
0.6
W
1, 4, 6
0.2
(0.4)
0.3
(0.3)
0.3
0.4
0.3
W
1, 4, 6
66/66/266
66/133/266
66/66/300
66/100/300
33/83/333
66/133/333
66/100/350
Typical
1.7
(1.5)
2.0
(1.8)
1.8
(1.7)
2.0
(1.8)
2.0
2.3
Max—FP
2.2
(1.9)
2.4
(2.1)
2.3
(2.0)
2.5
(2.2)
2.6
Max—INT
1.8
(1.6)
2.1
(1.8)
2.0
(1.8)
2.1
(1.8)
Doze
1.1
(1.0)
1.4
(1.3)
1.2
(1.1)
Nap
0.4
(0.4)
0.7
(0.7)
Sleep
0.2
(0.2)
0.4
(0.4)
I/O Power Supplies 10
Mode
Min
Max
Unit
Notes
Typ—OVDD
134 (121)
334 (301)
mW
7, 8
Typ—GVDD
324 (292)
800 (720)
mW
7, 9
Notes:
1. The values include VDD, AVDD, and AVDD2 but do not include I/O supply power. Information on OVDD and GVDD supply
power is captured in the I/O power supplies section of this table. Values shown in parenthesis ( ) indicate power consumption
at VDD/AVDD/AV DD2 = 1.8 V.
2. Maximum—FP power is measured at VDD = 2.1 V with dynamic power management enabled while running an entirely
cache-resident, looping, floating-point multiplication instruction.
3. Maximum—INT power is measured at VDD = 2.1 V with dynamic power management enabled while running entirely
cache-resident, looping, integer instructions.
4. Power saving mode maximums are measured at VDD = 2.1 V while the device is in doze, nap, or sleep mode.
5. Typical power is measured at V DD = AVDD = 2.0 V, OV DD = 3.3 V where a nominal FP value, a nominal INT value, and a
value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries to local memory
are averaged.
6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled.
7. The typical minimum I/O power values were results of the MPC8245 performing cache resident integer operations at the
slowest frequency combination of 33:66:200 (PCI:Mem:CPU) MHz.
8. The typical maximum OVDD value resulted from the MPC8245 operating at the fastest frequency combination of 66:100:350
(PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros to PCI memory.
9. The typical maximum GVDD value resulted from the MPC8245 operating at the fastest frequency combination of 66:100:350
(PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros on 64-bit boundaries
to local memory.
10.Power consumption of PLL supply pins (AV DD and AVDD2) < 15 mW. Guaranteed by design and not tested.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
12
Freescale Semiconductor
Electrical and Thermal Characteristics
4.4
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For details, see Section 7.8,
“Thermal Management.”
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
°C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
°C/W
1, 3
Junction-to-board
RθJB
4.8
°C/W
4
Junction-to-case
RθJC
1.8
°C/W
5
Junction-to-package top (natural convection)
ΨJT
1.0
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
4.5
AC Electrical Characteristics
After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See Section 9, “Ordering Information,” for details
on ordering parts.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
13
Electrical and Thermal Characteristics
Table 7 provides the operating frequency information for the MPC8245 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V.
Table 7. Operating Frequency 1
266 MHz
Characteristic
300 MHz
333 MHz
350 MHz
2, 3
VDD/AVDD/AV DD2 = 1.8/1.9/2.0 V
± 100 mV
VDD/AVDD/AVDD2 = 2.0/2.1 V
± 100 mV
Unit
Processor frequency (CPU)
100–266
100–300
100–333
100–350
MHz
Memory bus frequency
50–133
50–100 4
50–133
50–100 4
MHz
PCI input frequency
25–66
MHz
Notes:
1. For details, refer to the hardware specifications addendum MPC8245ECSO2AD.
2. Caution: The PCI_SYNC_IN frequency and PLL_CFG[0:4] settings must be chosen such that the resulting peripheral
logic/memory bus frequency and CPU (core) frequencies do not exceed their respective maximum or minimum operating
frequencies. Refer to the PLL_CFG[0:4] signal description in Section 6, “PLL Configurations,” for valid PLL_CFG[0:4] settings
and PCI_SYNC_IN frequencies.
3. See Table 17 and Table 18 for details on VCO limitations for memory and CPU VCO frequencies of various PLL
configurations.
4. No available PLL_CFG[0:4] settings support 133-MHz memory interface operation at 300- and 350-MHz CPU operation,
since the multipliers do not allow a 300:133 and 350:133 ratio relation. However, running these parts at slower processor
speeds may produce ratios that run above 100 MHz. See Table 17 for the PLL settings.
4.5.1
Clock AC Specifications
Table 8 provides the clock AC timing specifications at recommended operating conditions, as defined in
Section 4.5.2, “Input AC Timing Specifications.” These specifications are for the default driver strengths
indicated in Table 4.
Table 8. Clock AC Timing Specifications
At recommended operating conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V
Num
Min
Max
Unit
Frequency of operation (PCI_SYNC_IN)
25
66
MHz
PCI_SYNC_IN rise and fall times
—
2.0
ns
4
PCI_SYNC_IN duty cycle measured at 1.4 V
40
60
%
5a
PCI_SYNC_IN pulse width high measured at 1.4 V
6
9
ns
2
5b
PCI_SYNC_IN pulse width low measured at 1.4 V
6
9
ns
2
7
PCI_SYNC_IN jitter
—
200
ps
8a
PCI_CLK[0:4] skew (pin-to-pin)
—
250
ps
8b
SDRAM_CLK[0:3] skew (pin-to-pin)
—
190
ps
3
10
Internal PLL relock time
—
100
µs
2, 4, 5
15
DLL lock range with DLL_EXTEND = 0 (disabled)
and normal tap delay; (default DLL mode)
ns
6
1
2, 3
Characteristics and Conditions
See Figure 7
Notes
1
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
14
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 8. Clock AC Timing Specifications (continued)
At recommended operating conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V
Num
Characteristics and Conditions
Min
Max
See Figure 8 through Figure 10
Unit
Notes
ns
6
16
DLL lock range for other modes
17
Frequency of operation (OSC_IN)
25
66
MHz
19
OSC_IN rise and fall times
—
5
ns
20
OSC_IN duty cycle measured at 1.4 V
40
60
%
21
OSC_IN frequency stability
—
100
ppm
7
Notes:
1. Rise and fall times for the PCI_SYNC_IN input are measured from 0.4 to 2.4 V.
2. Specification value at maximum frequency of operation.
3. Pin-to-pin skew includes quantifying the additional amount of clock skew (or jitter) from the DLL besides any intentional skew
added to the clocking signals from the variable length DLL synchronization feedback loop, that is, the amount of variance
between the internal sys_logic_clk and the SDRAM_SYNC_IN signal after the DLL is locked. While pin-to-pin skew between
SDRAM_CLKs can be measured, the relationship between the internal sys_logic_clk and the external SDRAM_SYNC_IN
cannot be measured and is guaranteed by design.
4. Relock time is guaranteed by design and characterization. Relock time is not tested.
5. Relock timing is guaranteed by design. PLL-relock time is the maximum amount of time required for PLL lock after a stable
VDD and PCI_SYNC_IN are reached during the reset sequence. This specification also applies when the PLL has been
disabled and subsequently re-enabled during sleep mode. Also note that HRST_CPU/HRST_CTRL must be held asserted
for a minimum of 255 bus clocks after the PLL-relock time during the reset sequence.
6. DLL_EXTEND is bit 7 of the PMC2 register . N is a non-zero integer (see Figure 7 through Figure 10). Tclk is the period
of one SDRAM_SYNC_OUT clock cycle in ns. Tloop is the propagation delay of the DLL synchronization feedback loop (PC
board runner) from SDRAM_SYNC_OUT to SDRAM_SYNC_IN in ns; 6.25 inches of loop length (unloaded PC board runner)
corresponds to approximately 1 ns of delay. For details about how Figure 7 through Figure 10 may be used refer to the
Freescale application note AN2164, MPC8245/MPC8241 Memory Clock Design Guidelines, for details on MPC8245
memory clock design.
7. Rise and fall times for the OSC_IN input is guaranteed by design and characterization. OSC_IN input rise and fall times are
not tested.
Figure 6 shows the PCI_SYNC_IN input clock timing diagram with the labeled number items listed in
Table 8.
1
5a
PCI_SYNC_IN
VM
5b
VM
2
3
VM
VM = Midpoint Voltage (1.4 V)
Figure 6. PCI_SYNC_IN Input Clock Timing Diagram
Figure 7 through Figure 10 show the DLL locking range loop delay vs. frequency of operation. These
graphs define the areas of DLL locking for various modes. The gray areas show where the DLL locks.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
15
Electrical and Thermal Characteristics
Register settings that define each DLL mode are shown in Table 9.
Table 9. DLL Mode Definition
Bit 2 of Configuration
Register at 0x76
Bit 7 of Configuration
Register at 0x72
Normal tap delay,
No DLL extend
0
0
Normal tap delay,
DLL extend
0
1
Max tap delay,
No DLL extend
1
0
Max tap delay,
DLL extend
1
1
DLL Mode
The DLL_MAX_DELAY bit can lengthen the amount of time through the delay line by increasing the
time between each of the 128 tap points in the delay line. Although this increased time makes it easier to
guarantee that the reference clock is within the DLL lock range, there may be slightly more jitter in the
output clock of the DLL; that is, the phase comparator shifts the clock between adjacent tap points. Refer
to the Freescale application note AN2164, MPC8245/MPC8241 Memory Clock Design Guidelines:
Part 1, for details on DLL modes and memory design.
The value of the current tap point after the DLL locks can be determined by reading bits 6–0
(DLL_TAP_COUNT) of the DLL tap count register (DTCR, located at offset 0xE3). These bits store the
value (binary 0 through 127) of the current tap point and can indicate whether the DLL advances or
decrements as it maintains the DLL lock. Therefore, for evaluation purposes, DTCR can be read for all
DLL modes that support the Tloop value used for the trace length of SDRAM_SYNC_OUT to
SDRAM_SYNC_IN. The DLL mode with the smallest tap point value in the DTCR should be used
because the bigger the tap point value, the more jitter that can be expected for clock signals. Note that
keeping a DLL mode that is locked below tap point decimal 12 is not recommended.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
16
Freescale Semiconductor
Electrical and Thermal Characteristics
30
27.5
Tclk SDRAM_SYNC_OUT Period (ns)
25
22.5
20
17.5
15
12.5
10
7.5
0
1
2
3
4
5
Tloop Propagation Delay Time (ns)
Figure 7. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=0
and Normal Tap Delay
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
17
Electrical and Thermal Characteristics
30
27.5
Tclk SDRAM_SYNC_OUT Period (ns)
25
22.5
20
17.5
15
12.5
10
7.5
0
1
2
3
4
5
Tloop Propagation Delay Time (ns)
Figure 8. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=1
and Normal Tap Delay
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
18
Freescale Semiconductor
Electrical and Thermal Characteristics
30
27.5
Tclk SDRAM_SYNC_OUT Period (ns)
25
22.5
20
17.5
15
12.5
10
7.5
0
1
2
3
4
5
Tloop Propagation Delay Time (ns)
Figure 9. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=0
and Max Tap Delay
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
19
Electrical and Thermal Characteristics
30
27.5
Tclk SDRAM_SYNC_OUT Period (ns)
25
22.5
20
17.5
15
12.5
10
7.5
0
1
2
3
4
5
Tloop Propagation Delay Time (ns)
Figure 10. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=1
and Max Tap Delay
4.5.2
Input AC Timing Specifications
Table 10 provides the input AC timing specifications at recommended operating conditions (see Table 2)
with LVDD = 3.3 V ± 0.3 V.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
20
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 10. Input AC Timing Specifications
Num
Characteristic
Min
Max
Unit
Notes
3.0
—
ns
1, 3
ns
2, 3, 6
10a
PCI input signals valid to PCI_SYNC_IN (input setup)
10b
Memory input signals valid to sys_logic_clk (input setup)
10b0
Tap 0, register offset , bits 5–4 = 0b00
2.6
—
10b1
Tap 1, register offset , bits 5–4 = 0b01
1.9
—
10b2
Tap 2, register offset , bits 5–4 = 0b10 (default)
1.2
—
10b3
Tap 3, register offset , bits 5–4 = 0b11
0.5
—
10c
PIC, misc. debug input signals valid to sys_logic_clk
(input setup)
3.0
—
ns
2, 3
10d
I2C input signals valid to sys_logic_clk (input setup)
3.0
—
ns
2, 3
10e
Mode select inputs valid to HRST_CPU/HRST_CTRL (input setup)
9 × tCLK
—
ns
2, 3–5
0.4
1.0
ns
7
ns
2, 3, 6
11
Tos—SDRAM_SYNC_IN to sys_logic_clk offset time
11a
sys_logic_clk to memory signal inputs invalid (input hold)
11a0
Tap 0, register offset , bits 5–4 = 0b00
0
—
11a1
Tap 1, register offset , bits 5–4 = 0b01
0.7
—
11a2
Tap 2, register offset , bits 5–4 = 0b10 (default)
1.4
—
11a3
Tap 3, register offset , bits 5–4 = 0b11
2.1
—
11b
HRST_CPU/HRST_CTRL to mode select inputs invalid (input hold)
0
—
ns
2, 3, 5
11c
PCI_SYNC_IN to Inputs invalid (input hold)
1.0
—
ns
1, 2, 3
Notes:
1. All PCI signals are measured from OVDD/2 of the rising edge of PCI_SYNC_IN to 0.4 × OVDD of the signal in question for
3.3-V PCI signaling levels. See Figure 12.
2. All memory and related interface input signal specifications are measured from the TTL level (0.8 or 2.0 V) of the signal in
question to the VM = 1.4 V of the rising edge of the memory bus clock, sys_logic_clk. sys_logic_clk is the same as
PCI_SYNC_IN in 1:1 mode but is twice the frequency in 2:1 mode (processor/memory bus clock rising edges occur on every
rising and falling edge of PCI_SYNC_IN). See Figure 11.
3. Input timings are measured at the pin.
4. tCLK is the time of one SDRAM_SYNC_IN clock cycle.
5. All mode select input signals specifications are measured from the TTL level (0.8 or 2.0 V) of the signal in question to the
VM = 1.4 V of the rising edge of the HRST_CPU/HRST_CTRL signal. See Figure 13.
6. The memory interface input setup and hold times are programmable to four possible combinations by programming bits 5–4
of register offset to select the desired input setup and hold times.
7. Tos represents a timing adjustment for SDRAM_SYNC_IN with respect to sys_logic_clk. Due to the internal delay present
on the SDRAM_SYNC_IN signal with respect to the sys_logic_clk inputs to the DLL, the resulting SDRAM clocks become
offset by the delay amount. To maintain phase-alignment of the memory clocks with respect to sys_logic_clk, the feedback
trace length of SDRAM_SYNC_OUT to SDRAM_SYNC_IN must be shortened to accommodate this range. The feedback
trace length is relative to the SDRAM clock output trace lengths. We recommend that the length of SDRAM_SYNC_OUT to
SDRAM_SYNC_IN be shortened by 0.7 ns because that is the midpoint of the range of Tos and allows the impact from the
range of Tos to be reduced. Additional analyses of trace lengths and SDRAM loading must be performed to optimize timing.
For details on trace measurements and the problem of Tos, refer to the Freescale application note AN2164,
MPC8245/MPC8241 Memory Clock Design Guidelines.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
21
Electrical and Thermal Characteristics
Figure 11 and Figure 12 show the input/output timing diagrams referenced to SDRAM_SYNC_IN and
PCI_SYNC_IN, respectively.
PCI_SYNC_IN
VM
sys_logic_clk
VM
VM
VM
Tos
SDRAM_SYNC_IN
(after DLL locks)
Shown in 2:1 Mode
VM
10b-d
11a
13b
12b-d
2.0 V
2.0 V
0.8 V
0.8 V
14b
Memory
Inputs/Outputs
Input Timing
Output Timing
Notes:
VM = Midpoint voltage (1.4 V).
10b-d = Input signals valid timing.
11a = Input hold time of SDRAM_SYNC_IN to memory.
12b-d = sys_logic_clk to output valid timing.
13b = Output hold time for non-PCI signals.
14b = SDRAM-SYNC_IN to output high-impedance timing for non-PCI signals.
Tos = Offset timing required to align sys_logic_clk with SDRAM_SYNC_IN. The SDRAM_SYNC_IN signal
is adjusted by the DLL to accommodate for internal delay. This causes SDRAM_SYNC_IN to appear
before sys_logic_clk once the DLL locks.
Figure 11. Input/Output Timing Diagram Referenced to SDRAM_SYNC_IN
OVDD ÷ 2
PCI_SYNC_IN
OVDD ÷ 2
OVDD ÷ 2
10a
12a
11c
PCI
Inputs/Outputs
13a
14a
0.615 × OVDD
0.4 × OVDD
0.285 × OVDD
Input Timing
Output Timing
Figure 12. Input/Output Timing Diagram Referenced to PCI_SYNC_IN
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
22
Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 13 shows the input timing diagram for mode select signals.
VM
HRST_CPU/HRST_CTRL
10e
11b
2.0 V
Mode Pins
0.8 V
VM = Midpoint Voltage (1.4 V)
Figure 13. Input Timing Diagram for Mode Select Signals
4.5.3
Output AC Timing Specification
Table 11 provides the processor bus AC timing specifications for the MPC8245 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V. See Figure 11 for the input/output timing diagram
referenced to sys_logic_clk. All output timings assume a purely resistive 50-Ω load (see Figure 14 for the
AC test load for the MPC8245). Output timings are measured at the pin; time-of-flight delays must be
added for trace lengths, vias, and connectors in the system. These specifications are for the default driver
strengths indicated in Table 4.
Table 11. Output AC Timing Specifications
Num
Characteristic
Min
Max
Unit
Notes
12a
PCI_SYNC_IN to output valid, see Figure 15
12a0
Tap 0, PCI_HOLD_DEL=00, [MCP,CKE] = 11, 66 MHz PCI (default)
—
6.0
ns
1, 3
12a1
Tap 1, PCI_HOLD_DEL=01, [MCP,CKE] = 10
—
6.5
12a2
Tap 2, PCI_HOLD_DEL=10, [MCP,CKE] = 01, 33 MHz PCI
—
7.0
12a3
Tap 3, PCI_HOLD_DEL=11, [MCP,CKE] = 00
—
7.5
12b
sys_logic_clk to output valid (memory control, address, and data signals)
—
4.0
ns
2
12c
sys_logic_clk to output valid (for all others)
—
7.0
ns
2
I2
12d
sys_logic_clk to output valid (for C)
—
5.0
ns
2
12e
sys_logic_clk to output valid (ROM/Flash/PortX)
—
6.0
ns
2
13a
Output hold (PCI), see Figure 15
13a0
Tap 0, PCI_HOLD_DEL=00, [MCP,CKE] = 11, 66-MHz PCI (default)
2.0
—
ns
1, 3, 4
13a1
Tap 1, PCI_HOLD_DEL=01, [MCP,CKE] = 10
2.5
—
13a2
Tap 2, PCI_HOLD_DEL=10, [MCP,CKE] = 01, 33-MHz PCI
3.0
—
13a3
Tap 3, PCI_HOLD_DEL=11, [MCP,CKE] = 00
3.5
—
13b
Output hold (all others)
1.0
—
ns
2
14a
PCI_SYNC_IN to output high impedance (for PCI)
—
14.0
ns
1, 3
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
23
Electrical and Thermal Characteristics
Table 11. Output AC Timing Specifications (continued)
Num
14b
Characteristic
sys_logic_clk to output high impedance (for all others)
Min
Max
Unit
Notes
—
4.0
ns
2
Notes:
1. All PCI signals are measured from GV DD/2 of the rising edge of PCI_SYNC_IN to 0.285 × OVDD or 0.615 × OVDD of the
signal in question for 3.3 V PCI signaling levels. See Figure 12.
2. All memory and related interface output signal specifications are specified from the VM = 1.4 V of the rising edge of the
memory bus clock, sys_logic_clk to the TTL level (0.8 or 2.0 V) of the signal in question. sys_logic_clk is the same as
PCI_SYNC_IN in 1:1 mode, but is twice the frequency in 2:1 mode (processor/memory bus clock rising edges occur on every
rising and falling edge of PCI_SYNC_IN). See Figure 11.
3. PCI bused signals are composed of the following signals: LOCK, IRDY, C/BE[3:0], PAR, TRDY, FRAME, STOP, DEVSEL,
PERR, SERR, AD[31:0], REQ[4:0], GNT[4:0], IDSEL, and INTA.
4. To meet minimum output hold specifications relative to PCI_SYNC_IN for both 33- and 66-MHz PCI systems, the MPC8245
has a programmable output hold delay for PCI signals (the PCI_SYNC_IN to output valid timing is also affected). The initial
value of the output hold delay is determined by the values on the MCP and CKE reset configuration signals; the values on
these two signals are inverted and stored as the initial settings of PCI_HOLD_DEL = PMCR2[5, 4] (power management
configuration register 2 ), respectively. Since MCP and CKE have internal pull-up resistors, the default value of
PCI_HOLD_DEL after reset is 0b00. Further output hold delay values are available by programming the PCI_HOLD_DEL
value of the PMCR2 configuration register. Figure 15 shows the PCI_HOLD_DEL effect on output valid and hold times.
Figure 14 provides the AC test load for the MPC8245.
Output Measurements are Made at the Device Pin
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2 for PCI
GVDD/2 for Memory
Figure 14. AC Test Load for the MPC8245
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
24
Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 15 provides the PCI_HOLD_DEL effect on output valid and hold times.
OVDD/2
PCI_SYNC_IN
OVDD /2
12a2, 7.0 ns for 33 MHz PCI
PCI_HOLD_DEL = 10
13a2, 2.1 ns for 33-MHz PCI
PCI_HOLD_DEL = 10
PCI Inputs/Outputs
33 MHz PCI
12a0, 6.0 ns for 66 MHz PCI
PCI_HOLD_DEL = 00
13a0, 1 ns for 66-MHz PCI
PCI_HOLD_DEL = 00
PCI Inputs/Outputs
66 MHz PCI
As PCI_HOLD_DEL
Values Decrease
PCI Inputs
and Outputs
As PCI_HOLD_DEL
Values Increase
Note: Diagram not to scale.
Output Valid
Output Hold
Figure 15. PCI_HOLD_DEL Effect on Output Valid and Hold Times
4.6
I2C
This section describes the DC and AC electrical characteristics for the I2C interfaces of the MPC8245.
4.6.1
I2C DC Electrical Characteristics
Table 12 provides the DC electrical characteristics for the I2C interfaces.
Table 12. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter
Symbol
Min
Max
Unit
Input high voltage level
VIH
0.7 × OVDD
OVDD + 0.3
V
Input low voltage level
VIL
–0.3
0.3 × OVDD
V
Low-level output voltage
VOL
0
0.2 × OVDD
V
Notes
1
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
25
Electrical and Thermal Characteristics
Table 12. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Pulse width of spikes which must be suppressed by
the input filter
tI2KHKL
0
50
ns
2
Input current each I/O pin (input voltage is between
0.1 × OVDD and 0.9 × OVDD(max)
II
–10
10
μA
3
Capacitance for each I/O pin
CI
—
10
pF
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. Refer to the MPC8245 Integrated Processor Reference Manual for information on the digital filter used.
3. I/O pins obstruct the SDA and SCL lines if the OVDD is switched off.
4.6.2
I2C AC Electrical Specifications
Table 13 provides the AC timing parameters for the I2C interfaces.
Table 13. I2C AC Electrical Specifications
All values refer to VIH (min) and VIL (max) levels (see Table 12).
Parameter
SCL clock frequency
Low period of the SCL clock
Symbol 1
Min
Max
Unit
fI2C
0
400
kHz
1.3
—
μs
tI2CL
4
tI2CH
4
0.6
—
μs
tI2SVKH
4
0.6
—
μs
Hold time (repeated) START condition (after this period, the first
clock pulse is generated)
tI2SXKL
4
0.6
—
μs
Data setup time
tI2DVKH 4
100
—
ns
—
02
—
—
High period of the SCL clock
Setup time for a repeated START condition
μs
tI2DXKL
Data input hold time:
CBUS compatible masters
I2C bus devices
Data output delay time:
tI2OVKL
—
0.93
Set-up time for STOP condition
tI2PVKH
0.6
—
μs
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs
VNL
0.1 × OVDD
—
V
Noise margin at the LOW level for each connected device (including
hysteresis)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
26
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 13. I2C AC Electrical Specifications (continued)
All values refer to VIH (min) and VIL (max) levels (see Table 12).
Parameter
Symbol 1
Min
Max
Unit
Noise margin at the HIGH level for each connected device (including
hysteresis)
VNH
0.2 × OVDD
—
V
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2)
with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high
(H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition
(S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C
timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock
reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. As a transmitter, the MPC8245 provides a delay time of at least 300 ns for the SDA signal (referred to as the Vihmin of the
SCL signal) to bridge the undefined region of the falling edge of SCL to avoid unintended generation of Start or Stop condition.
When the MPC8245acts as the I2C bus master while transmitting, it drives both SCL and SDA. As long as the load on SCL
and SDA is balanced, the MPC8245 does not cause the unintended generation of a Start or Stop condition. Therefore, the
300 ns SDA output delay time is not a concern. If, under some rare condition, the 300 ns SDA output delay time is required
for the MPC8245 as transmitter, the following setting is recommended for the FDR bit field of the I2CFDR register to ensure
both the desired I2C SCL clock frequency and SDA output delay time are achieved. It is assumed that the desired I2C SCL
clock frequency is 400 KHz and the digital filter sampling rate register (DFFSR bits in I2CFDR) is programmed with its default
setting of 0x10 (decimal 16):
SDRAM Clock Frequency
100 MHz 133 MHz
FDR Bit Setting
0x00
0x2A
Actual FDR Divider Selected
384
896
2
Actual I C SCL Frequency Generated 260.4 KHz 148.4 KHz
For details on I2C frequency calculation, refer to the application note AN2919 “Determining the I2C Frequency Divider Ratio
for SCL”.
3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. Guaranteed by design.
Figure 16 provides the AC test load for the I2C.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 16. I2C AC Test Load
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
27
Electrical and Thermal Characteristics
Figure 17 shows the AC timing diagram for the I2C bus.
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2CF
tI2SXKL
tI2CR
SCL
tI2SXKL
tI2CH
tI2DXKL,tI2OVKL
S
tI2SVKH
tI2PVKH
Sr
P
S
Figure 17. I2C Bus AC Timing Diagram
4.7
PIC Serial Interrupt Mode AC Timing Specifications
Table 14 provides the PIC serial interrupt mode AC timing specifications for the MPC8245 at
recommended operating conditions (see Table 2) with GVDD = 3.3 V ± 5% and LVDD = 3.3 V ± 0.3 V.
Table 14. PIC Serial Interrupt Mode AC Timing Specifications
Num
Characteristic
Min
Max
Unit
Notes
1
S_CLK frequency
1/14 SDRAM_SYNC_IN
1/2 SDRAM_SYNC_IN
MHz
1
2
S_CLK duty cycle
40
60
%
—
3
S_CLK output valid time
—
6
ns
—
4
Output hold time
0
—
ns
—
5
S_FRAME, S_RST output valid time
—
1 sys_logic_clk period + 6
ns
2
6
S_INT input setup time to S_CLK
1 sys_logic_clk period + 2
—
ns
2
7
S_INT inputs invalid (hold time) to S_CLK
—
0
ns
2
Notes:
1. See the MPC8245 Integrated Processor Reference Manual for a description of the PIC interrupt control register (ICR) and
S_CLK frequency programming.
2. S_RST, S_FRAME, and S_INT shown in Figure 18 and Figure 19, depict timing relationships to sys_logic_clk and S_CLK
and do not describe functional relationships between S_RST, S_FRAME, and S_INT. The MPC8245 Integrated Processor
Reference Manual describes the functional relationships between these signals.
3. The sys_logic_clk waveform is the clocking signal of the internal peripheral logic from the output of the peripheral logic PLL;
sys_logic_clk is the same as SDRAM_SYNC_IN when the SDRAM_SYNC_OUT to SDRAM_SYNC_IN feedback loop is
implemented and the DLL is locked. See the MPC8245 Integrated Processor Reference Manual for a complete clocking
description.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
28
Freescale Semiconductor
Electrical and Thermal Characteristics
sys_logic_clk
VM
VM
VM
3
S_CLK
4
VM
VM
5
4
S_FRAME
VM
VM
S_RST
Figure 18. PIC Serial Interrupt Mode Output Timing Diagram
VM
S_CLK
7
6
S_INT
Figure 19. PIC Serial Interrupt Mode Input Timing Diagram
4.8
IEEE 1149.1 (JTAG) AC Timing Specifications
Table 15 provides the JTAG AC timing specifications for the MPC8245 while in the JTAG operating mode
at recommended operating conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V. Timings are independent
of the system clock (PCI_SYNC_IN).
Table 15. JTAG AC Timing Specification (Independent of PCI_SYNC_IN)
Num
Characteristic
Min
Max
Unit
Notes
TCK frequency of operation
0
25
MHz
1
TCK cycle time
40
—
ns
2
TCK clock pulse width measured at 1.5 V
20
—
ns
3
TCK rise and fall times
0
3
ns
4
TRST setup time to TCK falling edge
10
—
ns
5
TRST assert time
10
—
ns
6
Input data setup time
5
—
ns
2
7
Input data hold time
15
—
ns
2
8
TCK to output data valid
0
30
ns
3
9
TCK to output high impedance
0
30
ns
3
10
TMS, TDI data setup time
5
—
ns
1
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
29
Electrical and Thermal Characteristics
Table 15. JTAG AC Timing Specification (Independent of PCI_SYNC_IN) (continued)
Num
Characteristic
Min
Max
Unit
11
TMS, TDI data hold time
15
—
ns
12
TCK to TDO data valid
0
15
ns
13
TCK to TDO high impedance
0
15
ns
Notes
Notes:
1. TRST is an asynchronous signal. The setup time is for test purposes only.
2. Nontest (other than TDI and TMS) signal input timing with respect to TCK.
3. Nontest (other than TDO) signal output timing with respect to TCK.
Figure 20 through Figure 23 show the different timing diagrams.
1
2
2
VM
TCK
3
VM
VM
3
VM = Midpoint Voltage
Figure 20. JTAG Clock Input Timing Diagram
TCK
4
TRST
5
Figure 21. JTAG TRST Timing Diagram
TCK
6
Data Inputs
7
Input Data Valid
8
Data Outputs
Output Data Valid
9
Data Outputs
Figure 22. JTAG Boundary Scan Timing Diagram
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
30
Freescale Semiconductor
Package Description
TCK
10
TDI, TMS
11
Input Data Valid
12
TDO
Output Data Valid
13
TDO
Figure 23. Test Access Port Timing Diagram
5
Package Description
This section details package parameters, pin assignments, and dimensions.
5.1
Package Parameters
The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Package Outline
35 mm × 35 mm
Interconnects
352
Pitch
1.27 mm
Solder Balls
ZU (TBGA package)—62 Sn/36 Pb/2 Ag
VV (Lead-free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
Solder Ball Diameter
0.75 mm
Maximum Module Height
1.65 mm
Co-Planarity Specification 0.15 mm
Maximum Force
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
31
Package Description
5.2
Pin Assignments and Package Dimensions
Figure 24 shows the top surface, side profile, and pinout of the MPC8245, 352 TBGA package.
–F–
B
CORNER
–E–
–T–
0.150 T
A
Top View
Dot on top indicates
corner of A1 pin on
bottom
26 24 22 20 18 16 14 12 10 8 6 4 2
25 23 21 19 17 15 13 11 9 7 5 3 1
E
G
J
L
N
R
U
W
MAX
A
34.8
35.2
B
34.8
35.2
C
1.45
1.65
D
.60
.90
G
1.27 BASIC
H
.85
K
L
A
C
MIN
.95
31.75 BASIC
.50
.70
B
D
F
H
K
M
K
P
T
V
Y
AA
AB
AC
AD
AE
AF
C
H
L
Bottom View
352X ∅ D
K
G
Notes:
1. Drawing not to scale.
2. All measurements are in millimeters (mm).
Figure 24. MPC8245 Package Dimensions and Pinout Assignments
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
32
Freescale Semiconductor
Package Description
5.3
Pinout Listings
Table 16 provides the pinout listing for the MPC8245, 352 TBGA package.
Table 16. MPC8245 Pinout Listing
Name
Pin Numbers
Type
Power
Supply
Output
Driver Type
Notes
PCI Interface Signals
C/BE[3:0]
P25 K23 F23 A25
I/O
OVDD
DRV_PCI
6, 15
DEVSEL
H26
I/O
OVDD
DRV_PCI
8, 15
FRAME
J24
I/O
OVDD
DRV_PCI
8, 15
IRDY
K25
I/O
OVDD
DRV_PCI
8, 15
LOCK
J26
Input
OVDD
—
8
AD[31:0]
V25 U25 U26 U24 U23 T25 T26
R25 R26 N26 N25 N23 M26 M25
L25 L26 F24 E26 E25 E23 D26
D25 C26 A26 B26 A24 B24 D19
B23 B22 D22 C22
I/O
OVDD
DRV_PCI
6, 15
PAR
G25
I/O
OVDD
DRV_PCI
15
GNT[3:0]
W25 W24 W23 V26
Output
OVDD
DRV_PCI
6, 15
GNT4/DA5
W26
Output
OVDD
DRV_PCI
7, 15, 14
REQ[3:0]
Y25 AA26 AA25 AB26
Input
OVDD
—
6, 12
REQ4/DA4
Y26
I/O
OVDD
—
12, 14
PERR
G26
I/O
OVDD
DRV_PCI
8, 15, 18
SERR
F26
I/O
OVDD
DRV_PCI
8, 15, 16
STOP
H25
I/O
OVDD
DRV_PCI
8, 15
TRDY
K26
I/O
OVDD
DRV_PCI
8, 15
INTA
AC26
Output
OVDD
DRV_PCI
10, 15, 16
IDSEL
P26
Input
OVDD
—
Memory Interface Signals
MDL[0:31]
AD17 AE17 AE15 AF15 AC14
AE13 AF13 AF12 AF11 AF10 AF9
AD8 AF8 AF7 AF6 AE5 B1 A1 A3
A4 A5 A6 A7 D7 A8 B8 A10 D10
A12 B11 B12 A14
I/O
GVDD
DRV_STD_MEM
5, 6
MDH[0:31]
AC17 AF16 AE16 AE14 AF14
AC13 AE12 AE11 AE10 AE9 AE8
AC7 AE7 AE6 AF5 AC5 E4 A2 B3
D4 B4 B5 D6 C6 B7 C9 A9 B10
A11 A13 B13 A15
I/O
GVDD
DRV_STD_MEM
6
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
33
Package Description
Table 16. MPC8245 Pinout Listing (continued)
Name
Pin Numbers
Type
Power
Supply
Output
Driver Type
Notes
DQM[0:7]
AB1 AB2 K3 K2 AC1 AC2 K1 J1
Output
GVDD
DRV_MEM_CTRL
6
CS[0:7]
Y4 AA3 AA4 AC4 M2 L2 M1 L1
Output
GVDD
DRV_MEM_CTRL
6
FOE
H1
I/O
GVDD
DRV_MEM_CTRL
3, 4
RCS0
N4
Output
GVDD
DRV_MEM_CTRL
3, 4
RCS1
N2
Output
GVDD
DRV_MEM_CTRL
RCS2/TRIG_IN
AF20
I/O
OVDD
6 ohms
10, 14
RCS3/TRIG_OUT
AC18
Output
GVDD
DRV_MEM_CTRL
14
SDMA[1:0]
W1 W2
I/O
GVDD
DRV_MEM_CTRL
3, 4, 6
SDMA[11:2]
N1 R1 R2 T1 T2 U4 U2 U1 V1 V3
Output
GVDD
DRV_MEM_CTRL
6
DRDY
B20
Input
OVDD
—
9, 10
SDMA12/SRESET
B16
I/O
GVDD
DRV_MEM_CTRL
10, 14
SDMA13/TBEN
B14
I/O
GVDD
DRV_MEM_CTRL
10, 14
SDMA14/
CHKSTOP_IN
D14
I/O
GVDD
DRV_MEM_CTRL
10, 14
SDBA1
P1
Output
GVDD
DRV_MEM_CTRL
SDBA0
P2
Output
GVDD
DRV_MEM_CTRL
PAR[0:7]
AF3 AE3 G4 E2 AE4 AF4 D2 C2
I/O
GVDD
DRV_STD_MEM
6
SDRAS
AD1
Output
GVDD
DRV_MEM_CTRL
3
SDCAS
AD2
Output
GVDD
DRV_MEM_CTRL
3
CKE
H2
Output
GVDD
DRV_MEM_CTRL
3, 4
WE
AA1
Output
GVDD
DRV_MEM_CTRL
AS
Y1
Output
GVDD
DRV_MEM_CTRL
3, 4
PIC Control Signals
IRQ0/S_INT
C19
Input
OVDD
—
IRQ1/S_CLK
B21
I/O
OVDD
DRV_PCI
IRQ2/S_RST
AC22
I/O
OVDD
DRV_PCI
IRQ3/S_FRAME
AE24
I/O
OVDD
DRV_PCI
IRQ4/L_INT
A23
I/O
OVDD
DRV_PCI
I2C Control Signals
SDA
AE20
I/O
OVDD
DRV_STD_MEM
10, 16
SCL
AF21
I/O
OVDD
DRV_STD_MEM
10, 16
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
34
Freescale Semiconductor
Package Description
Table 16. MPC8245 Pinout Listing (continued)
Name
Pin Numbers
Type
Power
Supply
Output
Driver Type
Notes
DUART Control Signals
SOUT1/PCI_CLK0
AC25
Output
GVDD
DRV_MEM_CTRL
13, 14
SIN1/PCI_CLK1
AB25
I/O
GVDD
DRV_MEM_CTRL
13, 14, 26
SOUT2/RTS1/
PCI_CLK2
AE26
Output
GVDD
DRV_MEM_CTRL
13, 14
SIN2/CTS1/
PCI_CLK3
AF25
I
GVDD
DRV_MEM_CTRL
13, 14, 26
Clock-Out Signals
PCI_CLK0/SOUT1
AC25
Output
GVDD
DRV_PCI_CLK
13, 14
PCI_CLK1/SIN1
AB25
Output
GVDD
DRV_PCI_CLK
13, 14, 26
PCI_CLK2/RTS1/
SOUT2
AE26
Output
GVDD
DRV_PCI_CLK
13, 14
PCI_CLK3/CTS1/
SIN2
AF25
Output
GVDD
DRV_PCI_CLK
13, 14, 26
PCI_CLK4/DA3
AF26
Output
GVDD
DRV_PCI_CLK
13, 14
PCI_SYNC_OUT
AD25
Output
GVDD
DRV_PCI_CLK
PCI_SYNC_IN
AB23
Input
GVDD
—
SDRAM_CLK [0:3]
D1 G1 G2 E1
Output
GVDD
DRV_MEM_CTRL
or
DRV_MEM_CLK
6, 21
Output
GVDD
DRV_MEM_CTRL
or
DRV_MEM_CLK
21
SDRAM_SYNC_OUT C1
SDRAM_SYNC_IN
H3
Input
GVDD
—
CKO/DA1
B15
Output
OVDD
DRV_STD_MEM
14
OSC_IN
AD21
Input
OVDD
—
19
Miscellaneous Signals
HRST_CTRL
A20
Input
OVDD
—
27
HRST_CPU
A19
Input
OVDD
—
27
MCP
A17
Output
OVDD
DRV_STD_MEM
3, 4, 17
NMI
D16
Input
OVDD
—
SMI
A18
Input
OVDD
—
10
SRESET/SDMA12
B16
I/O
GVDD
DRV_MEM_CTRL
10, 14
TBEN/SDMA13
B14
I/O
GVDD
DRV_MEM_CTRL
10, 14
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
35
Package Description
Table 16. MPC8245 Pinout Listing (continued)
Name
Pin Numbers
Type
Power
Supply
Output
Driver Type
Notes
Output
OVDD
DRV_STD_MEM
4, 14, 25
QACK/DA0
F2
CHKSTOP_IN/
SDMA14
D14
I/O
GVDD
DRV_MEM_CTRL
10, 14
TRIG_IN/RCS2
AF20
I/O
OVDD
—
10, 14
TRIG_OUT/RCS3
AC18
Output
GVDD
DRV_MEM_CTRL
14
Output
GVDD
DRV_STD_MEM
3, 4, 6
MAA[0:2]
AF2 AF1 AE1
MIV
A16
Output
OVDD
—
24
PMAA[0:1]
AD18 AF18
Output
OVDD
DRV_STD_MEM
3, 4, 6, 15
PMAA[2]
AE19
Output
OVDD
DRV_STD_MEM
4, 6, 15
I/O
OVDD
DRV_STD_MEM
6, 14, 20
Test/Configuration Signals
PLL_CFG[0:4]/
DA[10:6]
A22 B19 A21 B18 B17
TEST0
AD22
Input
OVDD
—
1, 9
RTC
Y2
Input
GVDD
—
11
TCK
AF22
Input
OVDD
—
9, 12
TDI
AF23
Input
OVDD
—
9, 12
TDO
AC21
Output
OVDD
—
24
TMS
AE22
Input
OVDD
—
9, 12
TRST
AE23
Input
OVDD
—
9, 12
Ground
—
—
Reference
voltage
3.3 V, 5.0 V
LVDD
—
Power and Ground Signals
GND
AA2 AA23 AC12 AC15 AC24 AC3
AC6 AC9 AD11 AD14 AD16 AD19
AD23 AD4 AE18 AE2 AE21 AE25
B2 B25 B6 B9 C11 C13 C16 C23
C4 C8 D12 D15 D18 D21 D24 D3
F25 F4 H24 J25 J4 L24 L3 M23
M4 N24 P3 R23 R4 T24 T3 V2
V23 W3
LVDD
AC20 AC23 D20 D23 G23 P23
Y23
GV DD
AB3 AB4 AC10 AC11 AC8 AD10
AD13 AD15 AD3 AD5 AD7 C10
C12 C3 C5 C7 D13 D5 D9 E3 G3
H4 K4 L4 N3 P4 R3 U3 V4 Y3
Power for
memory drivers
3.3 V
GVDD
—
OV DD
AB24 AD20 AD24 C14 C20 C24
E24 G24 J23 K24 M24 P24 T23
Y24
PCI/Stnd 3.3 V
OVDD
—
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
36
Freescale Semiconductor
Package Description
Table 16. MPC8245 Pinout Listing (continued)
Power
Supply
Output
Driver Type
Notes
Power for core
1.8/2.0 V
VDD
—
22
D17
—
—
—
23
AV DD
C17
Power for PLL
(CPU core logic)
1.8/2.0 V
AVDD
—
22
AV DD2
AF24
Power for PLL
(peripheral
logic)
1.8/2.0 V
AVDD2
—
22
Name
Pin Numbers
Type
VDD
AA24 AC16 AC19 AD12 AD6 AD9
C15 C18 C21 D11 D8 F3 H23 J3
L23 M3 R24 T4 V24 W4
No Connect
Debug/Manufacturing Pins
DA0/QACK
F2
Output
OVDD
DRV_STD_MEM
4, 10, 25
DA1/CKO
B15
Output
OVDD
DRV_STD_MEM
14
DA2
C25
Output
OVDD
DRV_PCI
2
DA3/PCI_CLK4
AF26
Output
GVDD
DRV_PCI_CLK
14
DA4/REQ4
Y26
I/O
OVDD
—
12, 14
DA5/GNT4
W26
Output
OVDD
DRV_PCI
7, 15, 14
DA[10:6]/
PLL_CFG[0:4]
A22 B19 A21 B18 B17
I/O
OVDD
DRV_STD_MEM
6, 14, 20
DA[11]
AD26
Output
OVDD
DRV_PCI
2
DA[12:13]
AF17 AF19
Output
OVDD
DRV_STD_MEM
2, 6
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
37
Package Description
Table 16. MPC8245 Pinout Listing (continued)
Name
DA[14:15]
Pin Numbers
F1 J2
Type
Power
Supply
Output
Driver Type
Notes
Output
GVDD
DRV_MEM_CTRL
2, 6
Notes:
1. Place a pull-up resistor of 120 Ω or less on the TEST0 pin.
2. Treat these pins as no connects (NC) unless debug address functionality is used.
3. This pin has an internal pull-up resistor that is enabled only in the reset state. The value of the internal pull-up resistor is not
guaranteed but is sufficient to ensure that a logic 1 is read into configuration bits during reset if the signal is left unterminated.
4. This pin is a reset configuration pin.
5. DL[0] is a reset configuration pin with an internal pull-up resistor that is enabled only in the reset state. The value of the
internal pull-up resistor is not guaranteed but is sufficient to ensure that a logic 1 is read into configuration bits during reset.
6. Multi-pin signals such as AD[31:0] and MDL[0:31] have their physical package pin numbers listed in an order corresponding
to the signal names. Example: AD0 is on pin C22, AD1 is on pin D22, ..., AD31 is on pin V25.
7. GNT4 is a reset configuration pin with an internal pull-up resistor that is enabled only in the reset state.
8. A weak pull-up resistor (2–10 kΩ) should be placed on this PCI control pin to LVDD.
9. VIH and V IL for these signals are the same as the PCI VIH and VIL entries in Table 3.
10. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD.
11. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to GVDD.
12. This pin has an internal pull-up resistor that is enabled at all times. The value of the internal pull-up resistor is not guaranteed
but is sufficient to prevent unused inputs from floating.
13. An external PCI clocking source or fan-out buffer may be required for the MPC8245 DUART functionality since
PCI_CLK[0:3] are not available in DUART mode. Only PCI_CLK4 is available in DUART mode.
14. This pin is a multiplexed signal and appears more than once in this table.
15. This pin is affected by the programmable PCI_HOLD_DEL parameter.
16. This pin is an open-drain signal.
17. This pin can be programmed as driven (default) or as open-drain (in MIOCR 1).
18. This pin is a sustained three-state pin as defined by the PCI Local Bus Specification.
19. OSC_IN uses the 3.3-V PCI interface driver, which is 5-V tolerant. See Table 2 for details.
20. PLL_CFG signals must be driven on reset and must be held for at least 25 clock cycles after the negation of HRST_CTRL
and HRST_CPU in order to be latched.
21. SDRAM_CLK[0:3] and SDRAM_SYNC_OUT signals use DRV_MEM_CTRL for chip Rev 1.1 (A). These signals use
DRV_MEM_CLK for chip Rev 1.2 (B).
22. The 266- and 300-MHz part offerings can run at a source voltage of 1.8 ± 100 mV or 2.0 ± 100 mV. Source voltage should
be 2.0 ± 100 mV for 333- and 350-MHz parts.
23. This pin is LAVDD on the MPC8240. It is an NC on the MPC8245, which should not pose a problem when an MPC8240 is
replaced with an MPC8245.
24. The driver capability of this pin is hardwired to 40 Ω and cannot be changed.
25. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD so that a 1 can be detected at reset if an external
memory clock is not used and PLL[0:4] does not select a half-clock frequency ratio.
26. Typically, the serial port has sufficient drivers in the RS232 transceiver to drive the CTS pin actively as an input. No pullups
are needed in this case.
27. HRST_CPU/HRST_CTRL must transition from a logic 0 to a logic 1 in less than one SDRAM_SYNC_IN clock cycle for the
device to be in the nonreset state
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
38
Freescale Semiconductor
PLL Configurations
6
PLL Configurations
The internal PLLs are configured by the PLL_CFG[0:4] signals. For a given PCI_SYNC_IN (PCI bus)
frequency, the PLL configuration signals set both the peripheral logic/memory bus PLL (VCO) frequency
of operation for the PCI-to-memory frequency multiplying and the MPC603e CPU PLL (VCO) frequency
of operation for memory-to-CPU frequency multiplying. The PLL configurations are shown in Table 17
and Table 18.
Table 17. PLL Configurations (266- and 300-MHz Parts)
266-MHz Part 9
300-MHz Part 9
Multipliers
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
Periph
Logic/
MemBus
Clock
Range
(MHz)
CPU
Clock
Range
(MHz)
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
Periph
Logic/
MemBus
Clock
Range
(MHz)
CPU
Clock
Range
(MHz)
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
Ref. No.
PLL_CFG
[0:4] 10,13
0
0000012
25–355
75–105
188–263
25–405,7
75–120
188–300
3 (2)
2.5 (2)
1
0000112
25–295
75–88
225–264
25–335
2
11
3
00010
0001111,14
12
4
00100
6
0011015
14
18
50 –59
5,7
5017–661
4
25–46
18
75–99
225–297
3 (2)
3 (2)
1
50–66
225–297
1 (4)
4.5 (2)
50–66
100–133
1 (Bypass)
2 (4)
50–92
100–184
2 (4)
2 (4)
50–59
225–266
50 –66
50–66
100–133
5017–661
50–92
100–184
4
25–46
Bypass
6
1
Bypass
7
Rev B
00111
7
Rev D
0011114
8
0100012
9
12
01001
45 –66
90–132
180–264
A
0101012
25–295
50–58
225–261
B
12
60 –66
60–66
180–198
6
1
60 –66
60–66
Bypass
180–198
1 (Bypass)
3 (2)
60–66
180–198
1 (4)
3 (2)
45 –66
90–132
180–264
2 (2)
2 (2)
25–335
Not available
606–661
6
1
3
60–66
01011
5
45 –59
68–88
C
0110012
366–464
72–92
D
12
3
01101
5
45 –50
68–75
E
0111012
306–445
60–88
F
12
01111
10
1000012
11
12
10001
25–26
12
1001012
606–661
25
5
306–442,5
5,7
180–198
606–661
6
1
50–66
225–297
2 (4)
4.5 (2)
204–264
1
45 –66
68–99
204–297
1.5 (2)
3 (2)
180–230
366–464
3
72–92
180–230
2 (4)
2.5 (2)
238–263
5
45 –57
68–85
238–298
1.5 (2)
3.5 (2)
180–264
306–464
60–92
180–276
2 (4)
3 (2)
5
3
75
263
25–28
75–85
263–298
3 (2)
3.5 (2)
90–132
180–264
306–442
90–132
180–264
3 (2)
2 (2)
100–106
250–266
2
25–29
100–116
250–290
4 (2)
2.5 (2)
90–99
180–198
606–661
90–99
180–198
1.5 (2)
2 (2)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
39
PLL Configurations
Table 17. PLL Configurations (266- and 300-MHz Parts) (continued)
266-MHz Part 9
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
Periph
Logic/
MemBus
Clock
Range
(MHz)
300-MHz Part 9
CPU
Clock
Range
(MHz)
Multipliers
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
Periph
Logic/
MemBus
Clock
Range
(MHz)
CPU
Clock
Range
(MHz)
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
252,7
100
300
4 (2)
3 (2)
26 –42
52–84
182–294
2 (4)
3.5 (2)
273–305,7
68–75
272–300
2.5 (2)
4 (2)
Ref. No.
PLL_CFG
[0:4] 10,13
13
1001112
14
10100
12
15
1010112
16
12
10110
25–33
50–66
200–264
25–37
50–74
200–296
2 (4)
4 (2)
17
1011112
25–335
100–132
200–264
25–332
100–132
200–264
4 (2)
2 (2)
18
12
11000
27 –35
68–88
204–264
68–100
204–300
2.5 (2)
3 (2)
19
1100112
366–535
72–106
180–265
72–118
180–295
2 (2)
2.5 (2)
1A
12
50–66
200–264
1 (4)
4 (2)
Not available
6
5
26 –38
52–76
182–266
Not available
5
3
5
18
6
5
5
3
27 –40
5,7
366–592
11010
50 –66
1
50–66
200–264
50 –66
1B
1101112
343–445
68–88
204–264
343–505,7
1C
11100
12
1D
1110112
3
5
44 –59
66–88
486–661
72–99
8
1E
Rev B
11110
1E
Rev D
11110
18
1
68–100
204–300
2 (2)
3 (2)
198–264
1
44 –66
66–99
198–297
1.5 (2)
3 (2)
180–248
486–661
72–99
180–248
1.5 (2)
2.5 (2)
Off
Off
2(2)
3.5(2)
3
Not usable
333–385
66–76
Not usable
231–266
333–425
66–84
231–294
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
40
Freescale Semiconductor
PLL Configurations
Table 17. PLL Configurations (266- and 300-MHz Parts) (continued)
266-MHz Part 9
Ref. No.
PLL_CFG
[0:4] 10,13
1F
111118
Periph
Logic/
MemBus
Clock
Range
(MHz)
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
300-MHz Part 9
CPU
Clock
Range
(MHz)
PCI Clock
Input
(PCI_
SYNC_IN)
Range 1
(MHz)
Not usable
Periph
Logic/
MemBus
Clock
Range
(MHz)
Multipliers
CPU
Clock
Range
(MHz)
Not usable
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
Off
Off
Notes:
1. Limited by the maximum PCI input frequency (66 MHz).
2 Limited by the maximum system memory interface operating frequency (100 MHz @ 300 MHz CPU).
3. Limited by the minimum memory VCO frequency (133 MHz).
4. Limited due to the maximum memory VCO frequency (372 MHz).
5. Limited by the maximum CPU operating frequency.
6. Limited by the minimum CPU VCO frequency (360 MHz).
7. Limited by the maximum CPU VCO frequency (maximum marked CPU speed X 2).
8. In clock-off mode, no clocking occurs inside the MPC8245, regardless of the PCI_SYNC_IN input.
9. Range values are rounded down to the nearest whole number (decimal place accuracy removed).
10. PLL_CFG[0:4] settings not listed are reserved.
11. Multiplier ratios for this PLL_CFG[0:4] setting differ from the MPC8240 and are not backward-compatible.
12. PCI_SYNC_IN range for this PLL_CFG[0:4] setting differs from or does not exist on the MPC8240 and may not be fully
backward-compatible.
13. Bits 7–4 of register offset contain the PLL_CFG[0:4] setting value.
14. In PLL bypass mode, the PCI_SYNC_IN input signal clocks the internal processor directly, the peripheral logic PLL is
disabled, and the bus mode is set for 1:1 (PCI:Mem) mode operation. This mode is for hardware modeling. The AC timing
specifications in this document do not apply in PLL bypass mode.
15. In dual PLL bypass mode, the PCI_SYNC_IN input signal clocks the internal peripheral logic directly, the peripheral logic
PLL is disabled, and the bus mode is set for 1:1 (PCI_SYNC_IN:Mem) mode operation. In this mode, the OSC_IN input
signal clocks the internal processor directly in 1:1 (OSC_IN:CPU) mode operation, and the processor PLL is disabled. The
PCI_SYNC_IN and OSC_IN input clocks must be externally synchronized. This mode is for hardware modeling. The AC
timing specifications in this document do not apply in dual PLL bypass mode.
16. Limited by the maximum system memory interface operating frequency (133 MHz @ 266 MHz CPU).
17. Limited by the minimum CPU operating frequency (100 MHz).
18. Limited by the minimum memory bus frequency (50 MHz).
Table 18. PLL Configurations (333- and 350-MHz Parts)
333 MHz Part 9
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
350 MHz Part 9
CPU
Clock
Range
(MHz)
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
Ref
PLL_
CFG[0:4] 10,13
0
0000012
25–4416
75–132
188–330
25–4416
1
0000112
25–375,7
75–111
225–333
25–385
Multipliers
CPU
Clock
Range
(MHz)
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
75–132
188–330
3 (2)
2.5 (2)
75–114
225–342
3 (2)
3 (2)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
41
PLL Configurations
Table 18. PLL Configurations (333- and 350-MHz Parts) (continued)
333 MHz Part 9
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
350 MHz Part 9
CPU
Clock
Range
(MHz)
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
Ref
PLL_
CFG[0:4] 10,13
2
0001011
5018–661
50–66
225–297
5018–661
3
0001111,14
5017–661
50–66
100–133
5017–661
12
4
00100
6
0011015
14
4
25–46
50–92
25–46
Bypass
6
1
60 –66
60–66
7
Rev B
00111
7
Rev D
0011114
8
0100012
606–661
60–66
9
0100112
456–661
90–132
A
12
25–37
5,7
12
3
1
01010
100–184
4
CPU
Clock
Range
(MHz)
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
50–66
225–297
1 (4)
4.5 (2)
50–66
100–133
1 (Bypass)
2 (4)
50–92
100–184
2 (4)
2 (4)
Bypass
180–198
6
1
Bypass
60 –66
60–66
180–198
1 (Bypass)
3 (2)
25
100
350
4(2)
3.5(2)
180–198
606–661
60–66
180–198
1 (4)
3 (2)
180–264
456–661
90–132
180–264
2 (2)
2 (2)
225–333
5
50–76
225–342
2 (4)
4.5 (2)
1
Not available
50–74
Multipliers
25–38
3
B
01011
45 –66
68–99
204–297
45 –66
68–99
204–297
1.5 (2)
3 (2)
C
0110012
366–464
72–92
180–230
366–464
D
12
01101
E
0111012
F
0111112
10
10000
12
11
1000112
12
12
60 –66
12
5
10010
3
45 –63
5,7
3
72–92
180–230
2 (4)
2.5 (2)
1
68–95
238–333
45 –66
68–99
238–347
1.5 (2)
3.5 (2)
306–464
60–92
180–276
306–464
60–92
180–276
2 (4)
3 (2)
25–315
75–93
263–326
25–335
75–99
263–347
3 (2)
3.5 (2)
6
2
6
2
30 –44
90–132
180–264
30 –44
90–132
180–264
3 (2)
2 (2)
25–332,16
100–132
250–330
25–332,16
6
1
90–99
100–132
250–330
4 (2)
2.5 (2)
180–198
1
60 –66
90–99
180–198
1.5 (2)
2 (2)
5
100–116
300–348
4 (2)
3 (2)
6
13
10011
25–27
100–108
300–324
25–29
14
1010012
266–474
52–94
182–329
266–474
15
12
10101
5
27 –33
68–83
16
1011012
25–415
17
1011112
25–332
18
12
3
182–329
2 (4)
3.5 (2)
272–332
27 –34
68–85
272–340
2.5 (2)
4 (2)
50–82
200–328
25–435
50–86
200–344
2 (4)
4 (2)
100–132
200–264
25–332
11000
5
27 –44
68–110
19
1100112
366–661
72–132
1A
12
11010
12
3
52–94
5
18
1
3
5
50 –66
50–66
3
100–132
200–264
4 (2)
2 (2)
204–330
5
27 –46
68–115
204–345
2.5 (2)
3 (2)
180–330
366–661
200–264
3
72–132
180–330
2 (2)
2.5 (2)
18
1
50–66
200–264
1 (4)
4 (2)
3
5
50 –66
1B
11011
34 –55
68–110
204–330
34 –58
68–116
204–348
2 (2)
3 (2)
1C
1110012
443–661
66–99
198–297
443–661
66–99
198–297
1.5 (2)
3 (2)
1D
12
72–99
180–248
1.5 (2)
2.5(2)
11101
6
1
48 –66
72–99
180–248
6
1
48 –66
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
42
Freescale Semiconductor
PLL Configurations
Table 18. PLL Configurations (333- and 350-MHz Parts) (continued)
333 MHz Part 9
Ref
PLL_
CFG[0:4] 10,13
1E
Rev B
111108
1E
Rev D
11110
1F
111118
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
350 MHz Part 9
CPU
Clock
Range
(MHz)
PCI Clock
Periph
Input
Logic/Mem
(PCI_
Bus Clock
SYNC_IN)
Range
1
Range
(MHz)
(MHz)
Not usable
333–475
66–94
Not usable
Multipliers
CPU
Clock
Range
(MHz)
Not usable
231–329 333–502,5,7
66–100
231–350
Not usable
PCI-toMem
(Mem
VCO)
Mem-toCPU
(CPU
VCO)
Off
Off
2(2)
3.5(2)
Off
Off
Notes:
1. Limited by the maximum PCI input frequency (66 MHz).
2. Limited by the maximum system memory interface operating frequency (100 MHz @ 350 MHz CPU).
3. Limited by the minimum memory VCO frequency (132 MHz).
4. Limited due to the maximum memory VCO frequency (372 MHz).
5. Limited by the maximum CPU operating frequency.
6. Limited by the minimum CPU VCO frequency (360 MHz).
7. Limited by the maximum CPU VCO frequency (Maximum marked CPU speed X 2).
8. In clock-off mode, no clocking occurs inside the MPC8245, regardless of the PCI_SYNC_IN input.
9. Range values are rounded down to the nearest whole number (decimal place accuracy removed).
10. PLL_CFG[0:4] settings not listed are reserved.
11. Multiplier ratios for this PLL_CFG[0:4] setting differ from or do not exist on the MPC8240 and are not backward-compatible.
12. PCI_SYNC_IN range for this PLL_CFG[0:4] setting differs from the MPC8240 and may not be fully backward-compatible.
13. Bits 7–4 of register offset contain the PLL_CFG[0:4] setting value.
14. In PLL bypass mode, the PCI_SYNC_IN input signal clocks the internal processor directly, the peripheral logic PLL is
disabled, and the bus mode is set for 1:1 (PCI:Mem) mode operation. This mode is for hardware modeling. The AC timing
specifications in this document do not apply in PLL bypass mode.
15. In dual PLL bypass mode, the PCI_SYNC_IN input signal clocks the internal peripheral logic directly, the peripheral logic
PLL is disabled, and the bus mode is set for 1:1 (PCI_SYNC_IN:Mem) mode operation. In this mode, the OSC_IN input
signal clocks the internal processor directly in 1:1 (OSC_IN:CPU) mode operation, and the processor PLL is disabled. The
PCI_SYNC_IN and OSC_IN input clocks must be externally synchronized. This mode is for hardware modeling. The AC
timing specifications in this document do not apply in dual PLL bypass mode.
16. Limited by the maximum system memory interface operating frequency (133 MHz @ 333 MHz CPU).
17. Limited by the minimum CPU operating frequency (100 MHz).
18. Limited by the minimum memory bus frequency (50 MHz).
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
43
System Design
7
System Design
This section provides electrical and thermal design recommendations for successful application of the
MPC8245.
7.1
PLL Power Supply Filtering
The AVDD and AVDD2 power signals on the MPC8245 provide power to the peripheral logic/memory bus
PLL and the MPC603e processor PLL. To ensure stability of the internal clocks, the power supplied to the
AVDD and AVDD2 input signals should be filtered of any noise in the 500-kHz to 10-MHz resonant
frequency range of the PLLs. Two separate circuits similar to the one shown in Figure 25 using surface
mount capacitors with minimum effective series inductance (ESL) is recommended for AVDD and AVDD2
power signal pins. Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital
Design: A Handbook of Black Magic (Prentice Hall, 1993), using multiple small capacitors of equal value
is recommended over using multiple values.
Place the circuits as closely as possible to the respective input signal pins to minimize noise coupled from
nearby circuits. Routing from the capacitors to the input signal pins should be as direct as possible with
minimal inductance of vias.
10 Ω
VDD
AVDD or AV DD2
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 25. PLL Power Supply Filter Circuit
7.2
Decoupling Recommendations
Due to its dynamic power management feature, large address and data buses, and high operating
frequencies, the MPC8245 can generate transient power surges and high frequency noise in its power
supply, especially while driving large capacitive loads. This noise must be prevented from reaching other
components in the MPC8245 system, and the MPC8245 itself requires a clean, tightly regulated source of
power. Therefore, place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pin.
These decoupling capacitors should receive their power from dedicated power planes in the PCB, with
short traces to minimize inductance. These capacitors should have a value of 0.1 µF. Only ceramic SMT
(surface mount technology) capacitors should be used to minimize lead inductance, preferably 0508 or
0603, oriented such that connections are made along the length of the part.
In addition, several bulk storage capacitors should be distributed around the PCB, feeding the VDD, OVDD,
GVDD, and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors
should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary.
They should also be connected to the power and ground planes through two vias to minimize inductance.
Suggested bulk capacitors: 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
44
Freescale Semiconductor
System Design
7.3
Connection Recommendations
To ensure reliable operation, connect unused inputs to an appropriate signal level. Tie unused active-low
inputs to OVDD. Connect unused active-high inputs tie to GND. All NC signals must remain unconnected.
Power and ground connections must be made to all external VDD, OVDD, GVDD, LVDD, and GND pins.
The PCI_SYNC_OUT signal is to be routed halfway out to the PCI devices and returned to the
PCI_SYNC_IN input of the MPC8245.
The SDRAM_SYNC_OUT signal is to be routed halfway out to the SDRAM devices and then returned to
the SDRAM_SYNC_IN input of the MPC8245. The trace length can be used to skew or adjust the timing
window as needed. See the Tundra Tsi107™ Design Guide (AN1849) and Freescale application notes
AN2164, MPC8245/MPC8241 Memory Clock Design Guidelines: Part 1 and AN2746,
MPC8245/MPC8241 Memory Clock Design Guidelines: Part 2 for details. Note that there is an
SDRAM_SYNC_IN to PCI_SYNC_IN time requirement (refer to Table 10 for the input AC timing
specifications).
7.4
Pull-Up/Pull-Down Resistor Requirements
The data bus input receivers are normally turned off when no read operation is in progress; therefore, they
do not require pull-up resistors on the bus. The data bus signals are: MDH[0:31], MDL[0:31], and
PAR[0:7].
If the 32-bit data bus mode is selected, the input receivers of the unused data and parity bits (MDL[0:31]
and PAR[4:7]) are disabled, and their outputs drive logic zeros when they would otherwise normally be
driven. For this mode, these pins do not require pull-up resistors and should be left unconnected to
minimize possible output switching.
The TEST0 pin requires a pull-up resistor of 120 Ω or less connected to OVDD.
RTC should have weak pull-up resistors (2–10 kΩ) connected to GVDD.
The following signals should be pulled up to OVDD with weak pull-up resistors (2–10 kΩ): SDA, SCL,
SMI, SRESET/SDMA12, TBEN/SDMA13, CHKSTOP_IN/SDMA14, TRIG_IN/RCS2, INTA,
QACK/DA0 and DRDY. Note that QACK/DA0 should be left without a pull-up resistor only if an external
clock is used because this signal enables internal clock flipping logic when it is low on reset, which is
necessary when the PLL[0:4] signals select a half-clock frequency ratio and an external PLL is used to
drive the SDRAM device.
It is recommended that the following PCI control signals be pulled up to LVDD (the clamping voltage) with
weak pull-up resistors (2–10 kΩ): DEVSEL, FRAME, IRDY, LOCK, PERR, SERR, STOP, and TRDY.
The resistor values may need to be adjusted stronger to reduce induced noise on specific board designs.
The following pins have internal pull-up resistors enabled at all times: REQ[3:0], REQ4/DA4, TCK, TDI,
TMS, and TRST. See Table 16.
The following pins have internal pull-up resistors enabled only while device is in the reset state:
GNT4/DA5, MDL0, FOE, RCS0, SDRAS, SDCAS, CKE, AS, MCP, MAA[0:2], and PMAA[0:2]. See
Table 16.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
45
System Design
The following pins are reset configuration pins: GNT4/DA5, MDL[0], FOE, RCS0, CKE, AS, MCP,
QACK/DA0, MAA[0:2], PMAA[0:2], SDMA[1:0], MDH[16:31], and PLL_CFG[0:4]/DA[10:15]. These
pins are sampled during reset to configure the device. The PLL_CFG[0:4] signals are sampled a few clocks
after the negation of HRST_CPU and HRST_CTRL.
Reset configuration pins should be tied to GND via 1-kΩ pull-down resistors to ensure a logic 0 level is
read into the configuration bits during reset if the default logic 1 level is not desired.
Any other unused active low input pins should be tied to a logic-one level through weak pull-up resistors
(2–10 kΩ) to the appropriate power supply listed in Table 16. Unused active high input pins should be tied
to GND through weak pull-down resistors (2–10 kΩ).
7.5
PCI Reference Voltage—LVDD
The MPC8245 PCI reference voltage (LVDD) pins should be connected to a 3.3 ± 0.3 V power supply if
interfacing the MPC8245 into a 3.3-V PCI bus system. Similarly, the LVDD pins should be connected to
a 5.0 V ± 5% power supply if interfacing the MPC8245 into a 5-V PCI bus system. For either reference
voltage, the MPC8245 always performs 3.3-V signaling as described in the PCI Local Bus Specification
(Rev. 2.2). The MPC8245 tolerates 5-V signals when interfaced into a 5-V PCI bus system.
7.6
MPC8245 Compatibility with MPC8240
The MPC8245 AC timing specifications are backward-compatible with those of the MPC8240, except for
the requirements of item 11 in Table 10. Timing adjustments are needed as specified for Tos
(SDRAM_SYNC_IN to sys_logic_clk offset) time requirements.
The MPC8245 does not support the SDRAM flow-through memory interface.
The nominal core VDD power supply changes from 2.5 V on the MPC8240 to 1.8/2.0 V on the MPC8245.
See Table 2.
For example, the MPC8245 PLL_CFG[0:4] setting 0x02 (0b00010) has a different PCI-to-Mem and
Mem-to-CPU multiplier ratio than the same setting on the MPC8240, so it is not backward-compatible.
See Table 17.
Most of the MPC8240 PLL_CFG[0:4] settings are subsets of the PCI_SYNC_IN input frequency range
accepted by the MPC8245. However, the parts are not fully backward-compatible since the ranges of the
two parts do not always match. Modes 0x8 and 0x18 of the MPC8245 are not compatible with settings 0x8
and 0x18 on the MPC8240. See Table 17 and Table 18.
Two reset configuration signals on the MPC8245 are not used as reset configuration signals on the
MPC8240: SDMA0 and SDMA1.
The SDMA0 reset configuration pin selects between the MPC8245 DUART and the MPC8240
backward-compatible mode PCI_CLK[0:4] functionality on these multiplexed signals. The default state
(logic 1) of SDMA0 selects the MPC8240 backward-compatible mode of PCI_CLK[0:4] functionality
while a logic 0 state on the SDMA0 signal selects DUART functionality. In DUART mode, four of the
five PCI clocks, PCI_CLK[0:3], are not available.
The SDMA1 reset configuration pin selects between MPC8245 extended ROM functionality and
MPC8240 backward-compatible functionality on the multiplexed signals: TBEN, CHKSTOP_IN,
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
46
Freescale Semiconductor
System Design
SRESET, TRIG_IN, and TRIG_OUT. The default state (logic 1) of SDMA1 selects the MPC8240
backward-compatible mode functionality, while a logic 0 state on the SDMA1 signal selects extended
ROM functionality. In extended ROM mode, the TBEN, CHKSTOP_IN, SRESET, TRIG_IN, and
TRIG_OUT functionalities are not available.
The driver names and pin capability of the MPC8245 and the MPC8240 differ slightly. Refer to the drive
capability table (for the ODCR register at 0x73) in the MPC8240 Integrated Processor Hardware
Specifications and Table 4.
The programmable PCI output valid and output hold feature controlled by bits in the power management
configuration register 2 (PMCR2) differs slightly in the MPC8245. For the MPC8240, three bits,
PMCR2[6:4] = PCI_HOLD_DEL, are used to select 1 of 8 possible PCI output timing configurations.
PMCR2[6:5] are software-controllable but are initially set by the reset configuration state of the MCP and
CKE signals, respectively. Software can change PMCR2[4]. The default configuration for PMCR2[6:4] =
0b110 since the MCP and CKE signals have internal pull-up resistors, but this default configuration does
not select 33- or 66-MHz PCI operation output timing parameters for the MPC8240. Software makes this
selection. For the MPC8245, only two bits in the power management configuration register 2 (PMCR2),
PMCR2[5:4] = PCI_HOLD_DEL, control the variable PCI output timing. PMCR2[5:4] are software
controllable but are initially set by the inverted reset configuration state of the MCP and CKE signals,
respectively. The default configuration for PMCR2[5:4] = 0b00 since the MCP and CKE signals have
internal pull-up resistors and the values from these signals are inverted; this default configuration selects
66-MHz PCI operation output timing parameters. There are four programmable PCI output timing
configurations on the MPC8245. See Table 11.
Voltage sequencing requirements for the MPC8245 are similar to those for the MPC8240, with two
exceptions in the MPC8245. In the MPC8245, the non-PCI input voltages (Vin) must not be greater than
GVDD or OVDD by more than 0.6 V at all times, including during power-on reset (see Caution 5 in
Table 2). Second, LVDD must not exceed OVDD by more than 3.0 V at any time, including during
power-on reset (see Caution 10 in Table 2); the allowable separation between LVDD and OVDD is 3.6 V
for the MPC8240.
There is no LAVDD input voltage supply signal on the MPC8245 since the SDRAM clock delay-locked
loop (DLL) has power supplied internally. Signal D17 should be treated as a NC for the MPC8245.
Application note AN2128 highlights the differences between the MPC8240 and the MPC8245.
7.7
JTAG Configuration Signals
Boundary scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification but is provided on all processors that implement the Power Architecture
technology. While the TAP controller can be forced to the reset state using only the TCK and TMS signals,
more reliable power-on reset performance can be obtained if the TRST signal is asserted during power-on
reset. Because the JTAG interface is also used for accessing the common on-chip processor (COP)
function, simply tying TRST to HRESET is not practical.
The COP function of these processors allows a remote computer system (typically, a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
interface connects primarily through the JTAG, with additional status monitoring signals. The COP port
must independently assert HRESET or TRST to control the processor. If the target system has independent
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
47
System Design
reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches,
the COP reset signals must be merged into these signals with logic.
The arrangement shown in Figure 26 allows the COP port to independently assert HRESET or TRST,
while ensuring that the target can drive HRESET as well. If the JTAG interface and COP header will not
be used, TRST should be tied to HRESET through a 0-Ω isolation resistor so that it is asserted when the
system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during
power-on. Although Freescale recommends that the COP header be designed into the system as shown in
Figure 26, if this is not possible, the isolation resistor will allow future access to TRST in the case where
a JTAG interface may need to be wired onto the system in debug situations.
The COP interface has a standard header for connection to the target system based on the 0.025"
square-post, 0.100" centered header assembly (often called a Berg header). Typically, pin 14 is removed
as a connector key.
There is no standardized way to number the COP header shown in Figure 26. Consequently, different
emulator vendors number the pins differently. Some pins are numbered top-to-bottom and left-to-right
while others use left-to-right then top-to-bottom and still others number the pins counter clockwise from
pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in Figure 26 is
common to all known emulators.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
48
Freescale Semiconductor
System Design
MPC8245
From Target
Board Sources
(if any)
SRESET 5
SRESET 5
HRESET 7
13
11
HRST_CPU
COP_HRESET
10 kΩ
SRESET 5
10 kΩ
10 kΩ
HRST_CTRL
OVDD
OVDD
OVDD
10 kΩ
0Ω8
4
1
2
3
4
6
6
2
7
8
9
10
11
5
15
Key
14 4
12
KEY
13 No pin
15
16
COP Connector
Physical Pin Out
8
9
1
3
TRST 7
COP_TRST
VDD_SENSE
1 kΩ
10 kΩ
OVDD
OVDD
10 kΩ
3
COP Header
5
OVDD
10 kΩ
CHKSTOP_IN 6
TMS
TDO
OVDD
OVDD
CHKSTOP_IN 6
TMS
TDO
TDI
TCK
7
TDI
TCK
2
NC
10
NC
12
NC
QACK 1
16
Note:
1
QACK is an output and is not required at the COP header for emulation.
2
RUN/STOP normally found on pin 5 of the COP header is not implemented on the MPC8245. Connect pin 5 of the COP
header to OVDD with a 1-kΩ pull-up resistor.
3
CKSTP_OUT normally on pin 15 of the COP header is not implemented on the MPC8245. Connect pin 15 of the COP
header to OVDD with a 10-kΩ pull-up resistor.
4
Pin 14 is not physically present on the COP header.
5
SRESET functions as output SDMA12 in extended ROM mode.
6
CHKSTOP_IN functions as output SDMA14 in extended ROM mode.
7
The COP port and target board should be able to independently assert HRESET and TRST to the processor to control
the processor as shown.
8
If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP header through
an AND gate to TRST of the part. If the JTAG interface is not implemented, connect HRESET from the target source to
TRST of the part through a 0-Ω isolation resistor.
Figure 26. COP Connector Diagram
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
49
System Design
7.8
Thermal Management
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks can be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.
Figure 27 displays a package-exploded cross-sectional view of a TBGA package with several heat sink
options.
Heat Sink
TBGA Package
Heat Sink
Clip
Adhesive or
Thermal Interface
Material
Die
Printed-Circuit Board
Option
Figure 27. Package-Exploded Cross-Sectional View with Several Heat Sink Options
Figure 28 depicts the die junction-to-ambient thermal resistance for four typical cases:
• A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
from adjacent components.
• A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from
adjacent components.
• A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high
board-level thermal loading from adjacent components.
• A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low
board-level thermal loading from adjacent components.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
50
Freescale Semiconductor
System Design
Die Junction-to-Ambient Thermal Resistance (°C/W)
18
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
16
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
14
12
10
8
6
4
2
0
0.5
1
1.5
Airflow Velocity (m/s)
2
2.5
Figure 28. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
51
System Design
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-635-5102
Selection of an appropriate heat sink depends on thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy,
Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances and may or may not need airflow.
7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA cavity-down packaging technology shown
in Figure 29 are as follows:
• Die junction-to-case thermal resistance
• Die junction-to-ball thermal resistance
Figure 29 depicts the primary heat transfer path for a package with an attached heat sink mounted on a
printed-circuit board.
Radiation
External Resistance
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Internal Resistance
Printed-Circuit Board
External Resistance
Radiation
Convection
(Note the internal versus external package resistance)
Figure 29. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
In a TBGA package, the active side of the die faces the printed-circuit board. Most of the heat travels
through the die, across the die attach layer, and into the copper spreader. Some of the heat is removed from
the top surface of the spreader through convection and radiation. Another percentage of the heat enters the
printed-circuit board through the solder balls. The heat is then removed from the exposed surfaces of the
board through convection and radiation. If a heat sink is used, a larger percentage of heat leaves through
the top side of the spreader.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
52
Freescale Semiconductor
System Design
7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material placed between the top of the package and the bottom of the heat sink
minimizes thermal contact resistance. For applications that attach the heat sink by a spring clip
mechanism, Figure 30 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. Thermal grease significantly reduces the interface thermal resistance. That is, the bare joint
offers a thermal resistance approximately seven times greater than the thermal grease joint.
A spring clip attaches heat sinks to holes in the printed-circuit board (see Figure 30). Therefore, synthetic
grease offers the best thermal performance, considering the low interface pressure. The selection of any
thermal interface material depends on factors such as thermal performance requirements,
manufacturability, service temperature, dielectric properties, and cost.
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Specific Thermal Resistance (K-in.2/W)
2
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (psi)
Figure 30. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
are selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
53
System Design
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
7.8.3
800-248-2481
888-642-7674
800-347-4572
888-246-9050
Heat Sink Usage
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, two values are in common usage: the value determined
on a single-layer board and the value obtained on a board with two planes. Which value is closer to the
application depends on the power dissipated by other components on the board. The value obtained on a
single-layer board is appropriate for the tightly packed printed-circuit board. The value obtained on the
board with the internal planes is usually appropriate if the board has low power dissipation and the
components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
54
Freescale Semiconductor
System Design
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or the thermal dissipation on the printed-circuit board surrounding the device.
To determine the junction temperature of the device in the application without a heat sink, the thermal
characterization parameter (ΨJT) measures the temperature at the top center of the package case using the
following equation:
TJ = TT + (ΨJT × PD)
where:
TT = thermocouple temperature atop the package (°C)
ΨJT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance minimizes the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
In many cases, it is appropriate to simulate the system environment using a computational fluid dynamics
thermal simulation tool. In such a tool, the simplest thermal model of a package that has demonstrated
reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a
junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink is used or
a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal
resistance describes the thermal performance when most of the heat is conducted to the printed-circuit
board.
7.9
References
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
55
Document Revision History
8
Document Revision History
Table 19 provides a revision history for this hardware specification.
Table 19. Revision History Table
Revision
Date
Substantive Change(s)
10
8/07
Section 3, Table 3, and Table 7—Changed format of recommended voltage supply values so that delta
to the chosen nominal does not exceed ± 100 mV.
Completely replaced Section 4.6 with compliant I2C specifications as with other related integrated
processor devices.
9
12/27/05
Document—Added Power Architecture information.
Section 4.1—Changed increased absolute maximum range for VDD in Table 1. Updated format of
nominal voltage listings in Table 2.
Section 9.2—Removed Note 3 from Table 21.
Updated back page information.
8
11/15/2005 Document—Imported new template and made minor editorial changes.
Removed references to a 466 MHz part since it is not available for new orders.
Section 4.3.2—Added paragraph for using DLL mode that provides lowest locked tap point read in
0xE3.
Section 5.3—Updated the driver and I/O assignment information for the multiplexed PCI clock and
DUART signals. Added note for HRST_CPU and HRST_CTRL, which had been mentioned only in
Figure 2.
Section 9.2—Updated the part ordering specifications for the extended temperature parts. Also
updated the section to reflect what we offer for new orders.
Section 9.3—Added new section, “Part Marking.” Updated Figure 33 to match with current part
marking format.
7
10/07/2004 Section 4.1.2—Table 2: Corrected range of AVDD and AVDD2.
Section 9.1—Table 21: Corrected voltage range under Process Descriptor column. Minor reformatting.
6.1
05/24/2004 Section 4.5.3—Table 11: Spec 12b was improved from 4.5 ns to 4.0 ns. This improvement is
guaranteed on devices marked after work week (WW) 28 of 2004. A device's work week may be
determined from the “YYWW” portion of the devices trace ability code which is marked on the top of
the device. So for WW28 in 2004, the device’s YYWW is marked as 0428. For more information refer
to Figure 33
6
5.1
05/11/2004 Section 4.1.2—Table 2: Corrected range of GVDD to 3.3 ± 5%.
Section 4.2.1—Table 4: Changed the default for drive strength of DRV_STD_MEM.
Section 4.5.1—Table 8: Changed the wording description for item 15.
Section 4.5.2—Table 10: Changed Tos range and wording in note; Figure 11:changed wording for
SDRAM_SYNC_IN description relative to TOS.
Section 4.5.3—Table 11: Changed timing specification for sys_logic_clk to output valid (memory
control, address, and data signals).
—
Section 4.3.1—Table 9: Corrected last row to state the correct description for the bit setting. Max tap
delay, DLL extend. Figure 8: Corrected the label name for the DLL graph to state “DLL Locking Range
Loop Delay vs. Frequency of Operation for DLL_Extend=1 and Normal Tap Delay”
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
56
Freescale Semiconductor
Document Revision History
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
5
—
Section 4.1.2 — Added note 6 and related label for latching of the PLL_CFG signals.
Section 4.1.3 — Updated specifications for the input high and input low voltages of PCI_SYNC_IN.
Section 4.3 — Table 7, updated specifications for the voltage range of VDD for specific CPU
frequencies.
Section 4.3.1 — Table 8: Corrected typo for first number 1a to 1; Updated characteristics for the DLL
lock range for the default and remaining three DLL locking modes; Reworded note description for note
6. Replaced contents of Table 9 with bit descriptions for the four DLL locking modes. In Figures 7
through 10, updated the DLL locking mode graphs.
Section 4.3.2 — Table 10: Changed the name of references for timing parameters from
SDRAM_SYNC_IN to sys_logic_clk to be consistent with Figure 11. Followed the same change for
note 2.
Section 4.3.3— Table 11: Changed the name of references for timing parameters from
SDRAM_SYNC_IN to sys_logic_clk to be consistent with Figure 11. Followed the same change for
note 2.
Section 5.3 — Table 17: Removed extra listing of DRDY in Test/Configuration signal list and updated
relevant notes for signal in Memory Interface signal listing. Updated note #20. Added note 26 for the
signals of the UART interface.
Section 7.6 — Added reference to AN2128 application note that highlights the differences between the
MPC8240 and the MPC8245.
Section 7.7 — Added relevant notes to this section and updated Figure 29.
4
—
Section 1.4.1.2—Updated notes for GVDD, AVDD, AVDD2.
Section 1.5.1—Updated solder ball information to include lead-free (V V) balls.
Section 1.5.3—Updated Note 25 for QACK/DA0 signal. Added a sentence to Note 3.
Section 1.6 —Incorporated Note 19 into Note 12 and modified Tables 18 and 19 accordingly.
Section 1.9—Updated part marking nomenclature where appropriate to include the lead-free offering.
Replaced reference to PNS document MPC8245RZUPNS with MPC8245ARZUPNS.
3
—
Section 1.4.1.2—Figure 2: Updated Note 2 and removed ‘voltage regulator delay’ label since Section
1.7.2 is being deleted this revision. Added Figures 4 and 5 to show voltage overshoot and undershoot
of the PCI interface on the MPC8245.
Section 1.4.1.3—Table 3: Updated the maximum input capacitance from 7 to 16 pF based on
characterization data.
Section 1.4.3.1—Updated PCI_SYNC_IN jitter specifications to 200 ps.
Section 1.4.3.3—Table 11, item 12b: added the word ‘address’ to help clarify which signals the spec
applies to. Figure 15: edited timing for items 12a0 and 12a2 to correspond with Table 11.
Section 1.5.3—Updated notes for the QACK/DA0 signal because this signal has been found to have
no internal pull resistor.
Section 1.6—Corrected note numbers for reference numbers 3,10,1B, and 1C of the PLL tables.
Updated PLL specifications for modes 7 and 1E.
Section 1.7.2—Removed this section since the information already exists in Section 1.4.1.5.
Section 1.7.4—Added the words ‘the clamping voltage’ to describe LVDD in the sixth paragraph.
Changed the QACK/DA0 signal from the list of signals having an internal pull-up resistor to the list of
signals needing a weak pull-up resistor to OVDD.
Section 1.9.1—Tables 21 thru 23: Added processor version register value.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
57
Document Revision History
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
2
—
Globally changed EPIC to PIC.
Section 1.4.1.4—Note 5: Changed register reference from 0x72 to 0x73.
Section 1.4.1.5—Table 5: Updated power dissipation numbers based on latest characterization data.
Section 1.4.2—Table 6: Updated table to show more thermal specifications.
Section 1.4.3—Table 7: Updated minimum memory bus value to 50 MHz.
Section 1.4.3.1—Changed equations for DLL locking range based on characterization data. Added
updates and reference to AN2164 for note 6. Added table defining Tdp parameters. Labeled N value
in Figures 5 through 8.
Section 1.4.3.2—Table 10: Changed bit definitions for tap points. Updated note on Tos and added
reference to AN2164 for note 7. Updated Figure 9 to show significance of Tos.
Section 1.4.3.4—Added column for SDRAM_CLK @ 133 MHz
Sections 1.5.1 and 1.5.2—Corrected packaging information to state TBGA packaging.
Section 1.5.3—Corrected some signals in Table 16 which were missing overbars in the Rev 1.0
release of the document.
Section 1.6—Updated Note 10 of Tables 18 and 19.
Section 1.7.3—Changed sentence recommendation regarding decoupling capacitors.
Section 1.9—Updated format of tables in Ordering Information section.
1
—
Updated document template.
Section 1.4.1.4—Changed the driver type names in Table 6 to match with the names used in the
MPC8245 Reference Manual.
Section 1.5.3—Updated driver type names for signals in Table 16 to match with names used in the
MPC8245 Integrated Processor Reference Manual.
Section 1.4.1.2—Updated Table 7 to refer to new PLL Tables for VCO limits.
Section 1.4.3.3—Added item 12e to Table 10 for SDRAM_SYNC_IN to Output Valid timing.
Section 1.5.1—Updated solder balls information to 62Sn/36PB/2Ag.
Section 1.6—Updated PLL Tables 17 and 18 and appropriate notes to reflect changes of VCO ranges
for memory and CPU frequencies.
Section 1.7—Updated voltage sequencing requirements in Table 2 and removed Section 1.7.2.
Section 1.7.8—Updated TRST information and Figure 26.
New Section 1.7.2—Updated the range of I/O power consumption numbers for OVDD and GVDD to
correct values as in Table 5. Updated fastest frequency combination to 66:100:350 MHz.
Section 1.7.9—Updated list for heat sink and thermal interface vendors.
Section 1.9—Changed format of Ordering Information section. Added tables to reflect part number
specifications also available.
Added Sections 1.9.2 and 1.9.3.
0.5
—
Corrected labels for Figures 5 through 8.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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Document Revision History
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
0.4
—
Section 1.2—Changed Features list (format) to match with the features list of the MPC8245 Integrated
Processor Reference Manual.
Section 1.4.1.2—Updated Table 2 to include 1.8 ± 100mV numbers.
Section 1.4.3—Changed Table 7 to include new part offerings of 333 and 350 MHz. Added rows to
include VCO frequency ranges for all parts for both memory VCO and CPU VCO.
Section 1.4.1.5—Updated power consumption table to include 1.8 V (VDD) and higher frequency
numbers.
Section 1.4.3—Updated Table 7 to include higher frequency offerings and CPU VCO frequency range.
Section 1.4.3.1—Changed lettering to caps for DLL_EXTEND and DLL_MAX_DELAY in graph
description section.
Section 1.4.3.2—Changed name of item 11 from Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN Time to
Tos—SDRAM_SYNC_IN to sys_logic_clk Offset Time. Changed name to Tos in Note 7 as well.
Section 1.6—Updated notes in Table 17. Included minimum and maximum VCO numbers for memory
VCO. Changed Note 13 for location of PLL_CFG[0:4] to correct bits location. Bits 7–4 of register offset
. Added Table 18 to cover PLL configuration of higher frequency part offerings.
Section: 1.7—Changed frequency ranges for reference numbers 0, 9, 10, and 17, for the 300-MHz part
to include the higher memory bus frequencies when operating at lower CPU bus frequencies. Added
Table 18 to include PLL configurations for the 333 MHz and the 350 MHz CPU part offerings. Added
VCO multipliers in Tables 17 and 18.
Section 1.7.8—Changed Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN Time to Tos—SDRAM_
SYNC_IN to sys_logic_clk Offset Time.”
Section 1.7.10—Added vendor (Cool Innovations, Inc.) to list of heat sink vendors.
0.3
—
Section 1.4.1.5—Changed Max-FP value for 33/133/266 of Table 5 from 2.3 to 2.1 watts to represent
characterization data. Changed Note 4 to say VDD = 2.1 for power measurements (for 2-V part).
Changed numbers for maximum I/O power supplies for OVDD and GVDD to represent characterization
data.
Section 1.4.3.1—Added four graphs (Figures 5–8) and description for DLL Locking Range vs.
Frequency of Operation to replace Figure 5 of Rev 0.2 document.
Section 1.4.3.2—Added row (item 11: Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN timing) to Table 9 to
include offset change requirement.
Section 1.5.3—Changed Note 4 of PLL_CFG pins in Table 16 to Note 20.
Section 1.7.2—Added diode (MUR420) to Figure 27, Voltage Sequencing Circuit, to compensate for
voltage extremes in design.
Section 1.7.5—Added sentence with regards to SDRAM_SYNC_IN to PCI_SYNC_IN timing
requirement (Tsu) as a connection recommendation.
Section 1.7.8—Mention of Tsu offset timing and driver capability differences between the MPC8240
and the MPC8245.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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59
Document Revision History
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
0.2
—
Changed core supply voltage to 2.0 ± 100 mV in Section 1.3. (Supply voltage of 1.8 ± 100 mV is no
longer recommended.)
Changed rows 2, 5, and 6 of Table 2 to 2.0 ± 100 mV in the “Recommended Value” column.
Changed the power consumption numbers in Table 5 to reflect the power values for VDD = 2.0 V.
(Notes 2, 3, 4, and 5 of the table were also updated to reflect the new value of VDD.)
Updated Table 9 for VDD/AV DD/AVDD2 to 2.0 ± 100 mV.
Table 8: VDD/AVDD/AVDD2 was changed to 2.0 V for both CPU frequency offerings. Note 2 was
updated by removing the “at reduced voltage...” statement.
Table 10: Update maximum time of the rows 12a0 through 12a3.
Table 16: Fixed overbars for the active-low signals. Changed pin type information for VDD, AV DD, and
AVDD2 to 2.0 V.
Changed Note 16 of Table 17 to a value of 2.0 V for VDD/AVDD/AVDD2.
Removed second sentence of the second paragraph in Section 1.7.2 because it referenced
information about a 1.8-V design.
Removed reference to 1.8 V in third sentence of Section 1.7.7.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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Document Revision History
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
0.1
—
Made VDD/AVDD/AVDD2 = 1.8 V ± 100 mV information for 133-MHz memory interface operation to
Section 1.3, Table 2, Table 5, Table 9, Table 17, and Section 1.7.2.
Pin D17, formerly LAVDD (supply voltage for DLL), is a NC on the MPC8245 since the DLL voltage is
supplied internally. Eliminated all references to LAVDD; updated Section 1.7.1.
Previous Note 4 of Table 2 did not apply to the MPC8245 (MPC8240 document legacy). New Note 4
added in reference to maximum CPU speed at reduced VDD voltage.
Updated the Programmable Output Impedance of DEV_MEM_ADDR in Table 4 to 6 Ω to reflect
characterization data.
Updated Table 5 to reflect reduced power consumption when operating VDD/AVDD/AV DD2 = 1.8 V ±
100 mV. Changed Notes 2, 3, and 4 to reflect VDD at 1.9 V. Changed Note 5 to represent VDD = AVDD
= 1.8 V.
Updated Table 7 to reflect VDD/AV DD/AVDD2 voltage level operating frequency dependencies;
changed 250 MHz device column to 266 MHz; modified Note 1 eliminating VCO references; added
Note 2. Changed 250 MHz processor frequency offering to 266 MHz.
Changed Spec 12b for memory output valid time in Table 11 from 5.5 ns to 4.5 ns; this is a key
specification change to enable 133-MHz memory interface designs.
Updated Pinout Table 16 with the following changes:
• Pin types for RCS0, RCS3/TRIG_OUT and DA[11:15] were erroneously listed as I/O, changed Pin
Types to Output.
• Pin types for REQ4/DA4, RCS2/TRIG_IN, and PLL_CFG[0:4]/DA[10:6] were erroneously listed as
Input, changed Pin Types to I/O.
• Changed Pin D17 from LAVDD to No Connect; deleted Note 21 and references.
• Notes 3, 5, and 7 contained references to the MPC8240 (MPC8240 document legacy); changed
these references to MPC8245.
• Previous Notes 13 and 14 did not apply to the MPC8245 (MPC8240 document legacy), these notes
were deleted; moved Note 19 to become new Note 13; moved Note 20 to become new Note 14;
updated associated references.
• Added Note 3 to SDMA[1:0] signals about internal pull-up resistors during reset state.
• Reversed vector ordering for the PCI Interface Signals: C/BE[0:3] changed to C/BE[3:0], AD[0:31]
changed to AD[31:0], GNT[0:3] changed to GNT[3:0], and REQ[0:3] changed to REQ[3:0]. The
package pin number orderings were also reversed meaning that pin functionality did NOT change.
For example, AD0 is still on signal C22, AD1 is still on signal D22,..., AD31 is still on signal V25. This
change was made to make the vectored PCI signals in this hardware specification consistent with
the PCI Local Bus Specification and the MPC8245 Integrated Processor Reference Manual vector
ordering.
• Changed TEST1/DRDY signal on pin B20 to DRDY.
• Changed TEST2 signal on pin Y2 to RTC for performance monitor use.
Updated PLL Table 17 with the following changes for 133-MHz memory interface operation:
• Added Ref. 9 (01001) and Ref. 17 (10111) details; removed these settings from Note 10 (reserved
settings list).
• Enhanced range of Ref. 10 (10000).
• Updated Note 13, changed bits 16–20 erroneous information to correct bits 23–19.
• Added Notes 16 and 17.
Added information to Section 1.7.8 in reference to CHKSTOP_IN and SRESET being unavailable in
extended ROM mode.
0.0
—
Initial release.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
61
Ordering Information
9
Ordering Information
Ordering information for the parts fully covered by this specification document is provided in Section 9.1,
“Part Numbers Fully Addressed by This Document.” Section 9.2, “Part Numbers Not Fully Addressed by
This Document,” lists the part numbers that do not fully conform to the specifications of this document.
These special part numbers require an additional document called a hardware specifications addendum.
9.1
Part Numbers Fully Addressed by This Document
Table 20 provides the Freescale part numbering nomenclature for the MPC8245. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact a
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier that may specify special application conditions. Each part number also
contains a revision code that refers to the die mask revision number. The revision level can be determined
by reading the Revision ID register at address offset 0x08.
Table 20. Part Numbering Nomenclature
MPC
nnnn
L
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1
Processor
Frequency 2
(MHz)
Revision Level
MPC
8245
L: 0° to 105°C
ZU = TBGA
V V = Lead-free
TBGA
266, 300
D:1.4 Rev ID:0x14
1.7 V to 2.1 V
L: 0° to 105°C
ZU = TBGA
V V = Lead-free
TBGA
333, 350
1.9 V to 2.2 V
Processor
Version Register
Value
0x80811014
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by a hardware specifications addendum may
support other maximum core frequencies.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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Freescale Semiconductor
Ordering Information
9.2
Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications that supplement and supersede this document. Table 21
shows the part numbers addressed by the MPC8245TXXnnnx series. The revision level can be determined
by reading the Revision ID register at address offset 0x08.
Table 21. Part Numbers Addressed by MPC8245TXXnnnx Series
Part Number Specification Markings
(Document Order No. MPC8245ECS01AD)
MPC
nnnn
X
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Revision Level
MPC
8245
T: –40°
to 105°C
ZU = TBGA
V V= Lead-free
TBGA
266 MHz, 300 MHz: D:1.4 Rev ID:0x14
1.7 V to 2.1 V
333 MHz, 350 MHz:
1.9 V to 2.2 V
Processor
Version
Register Value
0x80811014
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by a hardware specifications addendum may
support other maximum core frequencies.
Table 22 shows the part numbers addressed by the MPC8245ARZUnnnx series.
Table 22. Part Numbers Addressed by MPC8245ARZUnnnx Series
Part Number Specification Markings
(Document Order No. MPC8245ECS02AD)
MPC
nnnn
X
X
Product
Code
Part
Identifier
Process 3
Identifier
Process
Descriptor
MPC
8245
A
R: 0° to 85°C
xx
Package
nnn
1
ZU = TBGA
V V= Lead-free
TBGA
Processor
Frequency 2
400 MHz
2.1 V ±
100 mV
x
Revision Level
Processor
Version
Register
Value
D:1.4 Rev ID:0x14
0x80811014
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by a hardware specifications addendum may
support other maximum core frequencies.
3. Process identifier ‘A’ represents parts that are manufactured under a 29-angstrom process verses the original 35-angstrom
process.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
63
Ordering Information
9.3
Part Marking
Parts are marked as the example shown in Figure 31.
MPC8245LXXnnnx
ATWLYYWW
CCCCC
MMMMM
YWWLAZ
Notes:
MMMMM is the 5-digit mask number.
ATWLYYWW is test traceability code.
YWWLAZ is the assembly traceability code.
CCCCC is the country code.
Figure 31. Part Marking for TBGA Device
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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THIS PAGE INTENTIONALLY LEFT BLANK
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
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67
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Document Number: MPC8245EC
Rev. 10
08/2007
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