Freescale Semiconductor
Technical Data
Document Number: MPC8245ECS01AD
Rev. 1.1, 12/2005
MPC8245 Hardware Specification
Addendum for the
MPC8245TXXnnnX Series
This document describes part-number-specific changes to
recommended operating conditions and revised electrical
specifications, as applicable, from those described in the general
MPC8245 Integrated Processor Hardware Specifications (Order
No. MPC8245EC). The MPC8245 combines a PowerPC™
MPC603e core with a PCI bridge.
Specifications provided in this document supersede those in the
MPC8245 Integrated Processor Hardware Specifications,
Revision 7 or later, for the part numbers listed in Table A only.
Specifications not addressed herein are unchanged. Because this
document is frequently updated, refer to http://www.freescale.com
or to a local Freescale sales office for the latest version.
Note that headings and table numbers in this document are not
consecutively numbered. They correspond to the heading or table
affected in the general hardware specification.
Part numbers addressed in this document are listed in Table A. For
more detailed ordering information, see Section 9, “Ordering
Information.”
© Freescale Semiconductor, Inc., 2005. All rights reserved.
Freescale Part Numbers Affected:
MPC8245TVV266D
MPC8245TZU266D
MPC8245TVV300D
MPC8245TZU300D
MPC8245TVV333D
MPC8245TZU333D
MPC8245TVV350D
MPC8245TZU350D
Ordering Information
Table A. Part Numbers Addressed by This Data Sheet
Operating Conditions
Freescale
Part Number
CPU
Frequency
MPC8245TVV266D
MPC8245TZU266D
266 MHz
MPC8245TVV300D
MPC8245TZU300D
300 MHz
MPC8245TVV333D
MPC8245TZU333D
333 MHz
MPC8245TVV350D
MPC8245TZU350D
350 MHz
VDD
Significant
Differences from
Hardware
Specification
TJ (°C)
Processor
Version Register
Value
1.7 V–2.1 V
–40 to 105
Extended temperature
range for additional part 0x80811014
offering
2.0 ± 100 mV
Note: The X prefix in a Freescale part number designates it as a ‘Pilot Production Prototype’ as defined by Freescale SOP 3-13.
These are part of a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified technology
to simulate normal production. These parts have only preliminary reliability and characterization data. Before pilot production
prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging
the qualification status and the fact that product changes may still occur while shipping pilot production prototypes. Note that
the VV package refers to lead free TBGA and is only available in part revision D.
4.1.3 DC Electrical Characteristics
Table 2 provides the recommended operating conditions for the MPC8245 part numbers described herein.
Table 2. Recommended Operating Conditions
Characteristic
Die-junction temperature
Symbol
Recommended Value
Unit
Tj
–40 to 105
°C
Note: These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
Please consult the MPC8245 Integrated Processor Hardware Specifications document for more details concerning
the part’s specifications.
9 Ordering Information
Ordering information for the parts fully covered by this document is provided in Section 9.1, “Part Numbers Fully
Addressed by This Document.” This section also addresses the marking specifications.
9.1 Part Numbers Fully Addressed by This Document
Table 21 provides the ordering information for the MPC8245 parts described in this document. Note that the
individual part numbers correspond to a maximum processor core frequency.
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
2
Freescale Semiconductor
Ordering Information
Table 21. Part Numbers Addressed by this document
MPC
nnnn
X
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Revision Level
MPC
8245
T: –40° to 105°C
ZU = TBGA
V V3= Lead-free
TBGA
266 MHz, 300 MhZ: D:1.4 Rev ID:0x14
1.7 V to 2.1 V
333 MHz, 350 MHz:
1.9 V to 2.2 V
Processor
Version
Register Value
0x80811014
Notes:
1.See Section 5, “Package Description,”in the MPC8245 Integrated Processor Hardware Specifications for more information on
available package types.
2.Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core
frequencies.
3.Note that the V V package option is only available in part revision D.
9.3
Part Marking
Parts are marked as in the example shown in Figure 33.
Figure 33. Freescale Part Marking for TBGA Device
MPC8245TXXnnnD
ATWLYYWW
CCCCC
MMMMM
YWWLAZ
Notes:
MMMMM is the 5-digit mask number.
ATWLYYWW is Test traceability code.
YWWLAZ is the Assembly traceability code.
CCCCC is the country code.
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
Freescale Semiconductor
3
Document Revision History
Document Revision History
Table B provides a revision history for this part number specification.
Table B. Document Revision History
Revision
Date
Substantive Change(s)
1.1
12/2005
Changed all occurrences of XPC to MPC.
Table 21 and Figure 33 were updated to reflect current part nomenclature and marking.
1
10/05/04
Added range information regarding 1.7V to 2.1V for 266 MHz and 300 MHz parts. Changed title
wording from ‘Part Number Specification’ to ‘Hardware Specification Addendum’; adopted new
Document ID numbering scheme. This document replaces the earlier document
MPC8245TXXPNS.
0
03/14/04
Original version of MPC8245TXXPNS. Information in this document supersedes that of the
MPC8245TZUPNS as lead free (VV) information was added.
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Document Number: MPC8245ECS01AD
Rev. 1.1
12/2005
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