MPC8309VMAFDCA

Document Number:MPC8309EC Rev 4, 12/2014 Freescale Semiconductor Technical Data MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications This document provides an overview of the MPC8309 PowerQUICC II Pro processor features. The MPC8309 is a cost-effective, highly integrated communications processor that addresses the requirements of several networking applications, including residential gateways, modem/routers, industrial control, and test and measurement applications. The MPC8309 extends current PowerQUICC offerings, adding higher CPU performance, additional functionality, and faster interfaces, while addressing the requirements related to time-to-market, price, power consumption, and board real estate. This document describes the electrical characteristics of MPC8309. To locate published errata or updates for this document, refer to the MPC8309 product summary page on our website listed on the back cover of this document or contact your local Freescale sales office. © 2011, 2014 Freescale Semiconductor, Inc. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11 Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13 DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Ethernet and MII Management . . . . . . . . . . . . . . . . . 22 TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 HDLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 eSDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 52 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 System Design Information . . . . . . . . . . . . . . . . . . . 75 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 78 Document Revision History . . . . . . . . . . . . . . . . . . . 80 Overview 1 Overview The MPC8309 incorporates the e300c3 (MPC603e-based) core built on Power Architecture® technology, which includes 16 Kbytes of each L1 instruction and data caches, dual integer units, and on-chip memory management units (MMUs). The MPC8309 also includes a 32-bit PCI controller, two DMA engines and a 16/32-bit DDR2 memory controller with 8-bit ECC. A new communications complex based on QUICC Engine technology forms the heart of the networking capability of the MPC8309. The QUICC Engine block contains several peripheral controllers and a 32-bit RISC controller. Protocol support is provided by the main workhorses of the device—the unified communication controllers (UCCs). A block diagram of the MPC8309 is shown in the following figure. 2x DUART I2C Timers GPIO SPI RTC e300c3 Core with Power Management 16-KB I-Cache Interrupt Controller 16-KB D-Cache FPU 48 KB Instruction RAM eSDHC DDR2 Controller DMA Engine 2 DMA Engine 1 PCI Controller UCC7 UCC5 UCC3 Single 32-bit RISC CP Serial DMA UCC2 IO Sequencer Enhanced Local Bus 16 KB Multi-User RAM Accelerators UCC1 USB 2.0 HS Host/Device/OTG 4 FlexCAN QUICC Engine™ Block Baud Rate Generators ULPI Time Slot Assigner Serial Interface 2x TDM Ports 2x HDLC 2 RMII/MII 1 RMII/MII 2x IEEE 1588 Figure 1. MPC8309 Block Diagram Each of the five UCCs can support a variety of communication protocols such as 10/100 Mbps MII/RMII Ethernet, HDLC and TDM. In summary, the MPC8309 provides users with a highly integrated, fully programmable communications processor. This helps to ensure that a low-cost system solution can be quickly developed and offers flexibility to accommodate new standards and evolving system requirements. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 2 Freescale Semiconductor Overview 1.1 Features The major features of the device are as follows: • e300c3 Power Architecture processor core — Enhanced version of the MPC603e core — High-performance, superscalar processor core with a four-stage pipeline and low interrupt latency times — Floating-point, dual integer units, load/store, system register, and branch processing units — 16-Kbyte instruction cache and 16-Kbyte data cache with lockable capabilities — Dynamic power management — Enhanced hardware program debug features — Software-compatible with Freescale processor families implementing Power Architecture technology — Separate PLL that is clocked by the system bus clock — Performance monitor • QUICC Engine block — 32-bit RISC controller for flexible support of the communications peripherals with the following features: – One clock per instruction – Separate PLL for operating frequency that is independent of system’s bus and e300 core frequency for power and performance optimization – 32-bit instruction object code – Executes code from internal IRAM – 32-bit arithmetic logic unit (ALU) data path – Modular architecture allowing for easy functional enhancements – Slave bus for CPU access of registers and multiuser RAM space – 48 Kbytes of instruction RAM – 16 Kbytes of multiuser data RAM – Serial DMA channel for receive and transmit on all serial channels — Five unified communication controllers (UCCs) supporting the following protocols and interfaces: – 10/100 Mbps Ethernet/IEEE Std. 802.3® through MII and RMII interfaces. – IEEE Std. 1588™ support – HDLC/Transparent (bit rate up to QUICC Engine operating frequency / 8) – HDLC Bus (bit rate up to 10 Mbps) – Asynchronous HDLC (bit rate up to 2 Mbps) – Two TDM interfaces supporting up to 128 QUICC multichannel controller channels, each running at 64 kbps MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 3 Overview • • • For more information on QUICC Engine sub-modules, see QUICC Engine Block Reference Manual with Protocol Interworking. DDR SDRAM memory controller — Programmable timing supporting DDR2 SDRAM — Integrated SDRAM clock generation — Supports 8-bit ECC — 16/32-bit data interface, up to 333-MHz data rate — 14 address lines — The following SDRAM configurations are supported: – Up to two physical banks (chip selects), 512-Mbyte addressable space for 32 bit data interface – 64-Mbit to 2-Gbit devices with x8/x16/x32 data ports (no direct x4 support) — One 16-bit device or two 8-bit devices on a 16-bit bus, or two 16-bit devices or four 8-bit devices on a 32-bit bus Support for up to 16 simultaneous open pages for DDR2 — Two clock pair to support up to 4 DRAM devices — Supports auto refresh — On-the-fly power management using CKE Enhanced local bus controller (eLBC) — Multiplexed 26-bit address and 8-/16-bit data operating at up to 66 MHz — Eight chip selects supporting eight external slaves – Four chip selects dedicated – Four chip selects offered as multiplexed option — Supports boot from parallel NOR Flash and parallel NAND Flash — Supports programmable clock ratio dividers — Up to eight-beat burst transfers — 16- and 8-bit ports, separate LWE for each 8 bit — Three protocol engines available on a per chip select basis: – General-purpose chip select machine (GPCM) – Three user programmable machines (UPMs) – NAND Flash control machine (FCM) — Variable memory block sizes for FCM, GPCM, and UPM mode — Default boot ROM chip select with configurable bus width (8 or 16) — Provides two Write Enable signals to allow single byte write access to external 16-bit eLBC slave devices Integrated programmable interrupt controller (IPIC) — Functional and programming compatibility with the MPC8260 interrupt controller — Support for external and internal discrete interrupt sources — Programmable highest priority request MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 4 Freescale Semiconductor Overview • • — Six groups of interrupts with programmable priority — External and internal interrupts directed to host processor — Unique vector number for each interrupt source PCI interface — Designed to comply with PCI Local Bus Specification, Revision 2.3 — 32-bit PCI interface operating at up to 66 MHz — PCI 3.3-V compatible — Not 5-V compatible — Support for host and agent modes — Support for PCI-to-memory and memory-to-PCI streaming — Memory prefetching of PCI read accesses and support for delayed read transactions — Support for posting of processor-to-PCI and PCI-to-memory writes — On-chip arbitration, supporting three masters on PCI — Arbiter support for two-level priority request/grant signal pairs — Support for accesses to all PCI address spaces — Support for parity — Selectable hardware-enforced coherency — Address translation units for address mapping between host and peripheral — Mapping from an external 32-/64-bit address space to the internal 32-bit local space — Support for dual address cycle (DAC) (as a target only) — Internal configuration registers accessible from PCI — Selectable snooping for inbound transactions — Four outbound Translation Address Windows – Support for mapping 32-bit internal local memory space to an external 32-bit PCI address space and translating that address within the PCI space — Four inbound Translation Address Windows corresponding to defined PCI BARs – The first BAR is 32-bits and dedicated to on-chip register access – The second BAR is 32-bits for general use – The remaining two BARs may be 32- or 64-bits and are also for general use Enhanced secure digital host controller (eSDHC) — Compatible with the SD Host Controller Standard Specification Version 2.0 with test event register support — Compatible with the MMC System Specification Version 4.2 — Compatible with the SD Memory Card Specification Version 2.0 and supports the high capacity SD memory card — Compatible with the SD Input/Output (SDIO) Card Specification, Version 2.0 — Designed to work with SD Memory, miniSD Memory, SDIO, miniSDIO, SD Combo, MMC, MMCplus, and RS-MMC cards MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 5 Overview • • • • — Card bus clock frequency up to 33.33 MHz. — Supports 1-/4-bit SD and SDIO modes, 1-/4-bit modes – Up to 133 Mbps data transfer for SD/SDIO/MMC cards using 4 parallel data lines — Supports block sizes of 1 ~ 4096 bytes Universal serial bus (USB) dual-role controller — Designed to comply with Universal Serial Bus Revision 2.0 Specification — Supports operation as a stand-alone USB host controller — Supports operation as a stand-alone USB device — Supports high-speed (480-Mbps), full-speed (12-Mbps), and low-speed (1.5-Mbps) operations. Low speed is only supported in host mode. FlexCAN module — Full implementation of the CAN protocol specification version 2.0B — Up to 64 flexible message buffers of zero to eight bytes data length — Powerful Rx FIFO ID filtering, capable of matching incoming IDs — Selectable backwards compatibility with previous FlexCAN module version — Programmable loop-back mode supporting self-test operation — Global network time, synchronized by a specific message — Independent of the transmission medium (an external transceiver is required) — Short latency time due to an arbitration scheme for high-priority messages Dual I2C interfaces — Two-wire interface — Multiple-master support — Master or slave I2C mode support — On-chip digital filtering rejects spikes on the bus — I2C1 can be used as the boot sequencer DMA Engine1 — Support for the DMA engine with the following features: – Sixteen DMA channels – All data movement via dual-address transfers: read from source, write to destination – Transfer control descriptor (TCD) organized to support two-deep, nested transfer operations – Channel activation via one of two methods (for both the methods, one activation per execution of the minor loop is required): – Explicit software initiation – Initiation via a channel-to-channel linking mechanism for continuous transfers (independent channel linking at end of minor loop and/or major loop) – Support for fixed-priority and round-robin channel arbitration – Channel completion reported via optional interrupt requests — Support for scatter/gather DMA processing MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 6 Freescale Semiconductor Electrical Characteristics • • • • • • • • • 2 IO Sequencer Direct memory access (DMA) controller (DMA Engine 2) — Four independent fully programmable DMA channels — Concurrent execution across multiple channels with programmable bandwidth control — Misaligned transfer capability for source/destination address — Data chaining and direct mode — Interrupt on completed segment, error, and chain DUART — Supports 2 DUART — Each has two 2-wire interfaces (RxD, TxD) – The same can be configured as one 4-wire interface (RxD, TxD, RTS, CTS) — Programming model compatible with the original 16450 UART and the PC16550D Serial peripheral interface (SPI) — Master or slave support Power managemnt controller (PMC) — Supports core doze/nap/sleep/ power management — Exits low power state and returns to full-on mode when – The core internal time base unit invokes a request to exit low power state – The power management controller detects that the system is not idle and there are outstanding transactions on the internal bus or an external interrupt. Parallel I/O — General-purpose I/O (GPIO) – 56 parallel I/O pins multiplexed on various chip interfaces – Interrupt capability System timers — Periodic interrupt timer — Software watchdog timer — Eight general-purpose timers Real time clock (RTC) module — Maintains a one-second count, unique over a period of thousands of years — Two possible clock sources: – External RTC clock (RTC_PIT_CLK) – CSB bus clock IEEE Std. 1149.1™ compliant JTAG boundary scan Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8309. The MPC8309 is currently targeted to these specifications. Some of these specifications are MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 7 Electrical Characteristics independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings The following table provides the absolute maximum ratings. Table 1. Absolute Maximum Ratings1 Characteristic Symbol Max Value Unit Notes Core supply voltage VDD –0.3 to 1.26 V — PLL supply voltage AVDD1 AVDD2 AVDD3 –0.3 to 1.26 V — DDR2 DRAM I/O voltage GVDD –0.3 to 1.98 V — PCI, Local bus, DUART, system control and power management, I2C, SPI, MII, RMII, MII management, eSDHC, FlexCAN, USB and JTAG I/O voltage OVDD –0.3 to 3.6 V 2 Input voltage MVIN –0.3 to (GVDD + 0.3) V 3 MVREF –0.3 to (GVDD + 0.3) V 3 Local bus, DUART, SYS_CLK_IN, system control and power management, I2C, SPI, and JTAG signals OVIN –0.3 to (OVDD + 0.3) V 4 PCI OVIN –0.3 to (OVDD + 0.3) V TSTG –55 to 150 C DDR2 DRAM signals DDR2 DRAM reference Storage temperature range — Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. OVDD here refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map. 3. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during power-on reset and power-down sequences. 4. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during power-on reset and power-down sequences. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 8 Freescale Semiconductor Electrical Characteristics 2.1.2 Power Supply Voltage Specification The following table provides the recommended operating conditions for the MPC8309. Note that these values are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. Table 2. Recommended Operating Conditions Symbol Recommended Value Unit Note Core supply voltage VDD 1.0 V ± 50 mV V 1 PLL supply voltage AVDD1 AVDD2 AVDD3 1.0 V ± 50 mV V 1 DDR2 DRAM I/O voltage GVDD 1.8 V ± 100 mV V 1 PCI, Local bus, DUART, system control and power management, I2C, SPI, MII, RMII, MII management, eSDHC, FlexCAN,USB and JTAG I/O voltage OVDD 3.3 V ± 300 mV V 1, 3 Junction temperature TA/TJ 0 to 105 C 2 Characteristic Notes: 1. GVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative direction. 2. Minimum temperature is specified with TA(Ambient Temperature); maximum temperature is specified with TJ(Junction Temperature). 3. OVDD here refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map. The following figure shows the undershoot and overshoot voltages at the interfaces of the MPC8309 G/OVDD + 20% G/OVDD + 5% VIH G/OVDD GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of tinterface1 Note: 1. tinterface refers to the clock period associated with the bus clock interface. Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 9 Electrical Characteristics 2.1.3 Output Driver Characteristics The following table provides information on the characteristics of the output driver strengths. Table 3. Output Drive Capability Output Impedance () Supply Voltage (V) Local bus interface utilities signals 42 OVDD = 3.3 PCI Signal 25 DDR2 signal 18 GVDD = 1.8 DUART, system control, I2C, SPI, JTAG 42 OVDD = 3.3 GPIO signals 42 OVDD = 3.3 Driver Type 2.1.4 Input Capacitance Specification The following table describes the input capacitance for the SYS_CLK_IN pin in the MPC8309. Table 4. Input Capacitance Specification Parameter/Condition Input capacitance for all pins except SYS_CLK_IN and QE_CLK_IN Input capacitance for SYS_CLK_IN and QE_CLK_IN Symbol Min Max Unit Note CI 6 8 pF — CICLK_IN 10 — pF 1 Note: 1. The external clock generator should be able to drive 10 pF. 2.2 Power Sequencing The device does not require the core supply voltage (VDD) and I/O supply voltages (GVDD and OVDD) to be applied in any particular order. Note that during power ramp-up, before the power supplies are stable and if the I/O voltages are supplied before the core voltage, there might be a period of time that all input and output pins are actively driven and cause contention and excessive current. In order to avoid actively driving the I/O pins and to eliminate excessive current draw, apply the core voltage (VDD) before the I/O voltage (GVDD and OVDD) and assert PORESET before the power supplies fully ramp up. In the case where the core voltage is applied first, the core voltage supply must rise to 90% of its nominal value before the I/O supplies reach 0.7 V; see Figure 3. Once both the power supplies (I/O voltage and core voltage) are stable, wait for a minimum of 32 clock cycles before negating PORESET. NOTE There is no specific power down sequence requirement for the device. I/O voltage supplies (GVDD and OVDD) do not have any ordering requirements with respect to one another. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 10 Freescale Semiconductor Power Characteristics I/O Voltage (GVDD and OVDD) V Core Voltage (VDD) 0.7 V 90% 0 t PORESET >= 32  tSYS_CLK_IN / PCI_SYNC_IN Figure 3. MPC8309 Power-Up Sequencing Example 3 Power Characteristics The typical power dissipation for this family of MPC8309 devices is shown in the following table. Table 5. MPC8309 Power Dissipation Core Frequency (MHz) QUICC Engine Frequency (MHz) CSB Frequency (MHz) Typical Maximum Unit Note 266 233 133 0.341 0.920 W 1, 2, 3 333 233 133 0.361 0.938 W 1, 2, 3 400 233 133 0.381 0.969 W 1,2,3 417 233 167 0.429 1.003 W 1,2,3 Notes: 1. The values do not include I/O supply power (OVDD and GVDD), but it does include VDD and AVDD power. For I/O power values, see Table 6. 2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone benchmark application. The measurements were taken on the evaluation board using WC process silicon. 3. Maximum power is based on a voltage of VDD = 1.05 V, WC process, a junction TJ = 105C, and a smoke test code. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 11 Clock Input Timing The following table shows the estimated typical I/O power dissipation for the device. Table 6. Typical I/O Power Dissipation Interface GVDD (1.8 V) Parameter DDR I/O 65% utilization 1.8 V Rs = 20  Rt = 50  1 pair of clocks 266 MHz, 1  16 bits Local bus I/O load = 25 pF 1 pair of clocks 66 MHz, 26 bits QUICC Engine block and other I/Os TDM serial, HDLC/TRAN serial, DUART, MII, RMII, Ethernet management, USB, PCI, SPI, Timer output, FlexCAN, eSDHC OVDD (3.3 V) Unit Comments — W — 0.415 W 1 0.149 — Note: 1. Typical I/O power is based on a nominal voltage of VDD = 3.3V, ambient temperature, and the core running a Dhrystone benchmark application. The measurements were taken on the evaluation board using WC process silicon. 4 Clock Input Timing This section provides the clock input DC and AC electrical characteristics for the MPC8309. NOTE The rise/fall time on QUICC Engine input pins should not exceed 5 ns. This should be enforced especially on clock signals. Rise time refers to signal transitions from 10% to 90% of OVDD; fall time refers to transitions from 90% to 10% of OVDD. 4.1 DC Electrical Characteristics The following table provides the clock input (SYS_CLK_IN/PCI_SYNC_IN) DC specifications for the MPC8309. These specifications are also applicable for QE_CLK_IN. Table 7. SYS_CLK_IN DC Electrical Characteristics Parameter Condition Symbol Min Max Unit Input high voltage — VIH 2.4 OVDD + 0.3 V Input low voltage — VIL –0.3 0.4 V SYS_CLK_IN input current 0 V  VIN  OVDD IIN — ±5 A SYS_CLK_IN input current 0 V  VIN  0.5 V or OVDD – 0.5 V  VIN OVDD IIN — ±5 A SYS_CLK_IN input current 0.5 V  VIN  OVDD – 0.5 V IIN — ±50 A MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 12 Freescale Semiconductor RESET Initialization 4.2 AC Electrical Characteristics The primary clock source for the MPC8309 can be one of two inputs, SYS_CLK_IN or PCI_SYNC_IN, depending on whether the device is configured in PCI host or agent mode. The following table provides the clock input (SYS_CLK_IN/PCI_SYNC_IN) AC timing specifications for the MPC8309. These specifications are also applicable for QE_CLK_IN. Table 8. SYS_CLK_IN AC Timing Specifications Parameter/Condition Symbol Min Typical Max Unit Note SYS_CLK_IN frequency fSYS_CLK_IN 24 — 66.67 MHz 1 SYS_CLK_IN cycle time tSYS_CLK_IN 15 — 41.6 ns — SYS_CLK_IN rise and fall time tKH, tKL 1.1 — 2.8 ns 2 PCI_SYNC_IN rise and fall time tPCH, tPCL 1.1 — 2.8 ns 2 tKHK/tSYS_CLK_ 40 — 60 % 3 — — ±150 ps 4, 5 SYS_CLK_IN duty cycle IN SYS_CLK_IN jitter — Notes: 1. Caution: The system, core and QUICC Engine block must not exceed their respective maximum or minimum operating frequencies. 2. Rise and fall times for SYS_CLK_IN are measured at 0.33 and 2.97 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The SYS_CLK_IN driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to allow cascade-connected PLL-based devices to track SYS_CLK_IN drivers with the specified jitter. 6. Spread spectrum is allowed up to 1% down-spread @ 33kHz (max rate). 5 RESET Initialization This section describes the AC electrical specifications for the reset initialization timing requirements of the MPC8309. The following table provides the reset initialization AC timing specifications for the reset component(s). Table 9. RESET Initialization Timing Specifications Parameter/Condition Min Max Unit Note Required assertion time of HRESET to activate reset flow 32 — tSYS_CLK_IN 1 Required assertion time of PORESET with stable clock applied to SYS_CLK_IN or PCI_SYNC_IN (in agent mode) 32 — tSYS_CLK_IN 1 HRESET assertion (output) 512 — tSYS_CLK_IN 1 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 13 DDR2 SDRAM Table 9. RESET Initialization Timing Specifications (continued) Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:3]) with respect to negation of PORESET 4 — tSYS_CLK_IN 1, 2 Input hold time for POR config signals with respect to negation of HRESET 0 — ns 1, 2 Notes: 1. tSYS_CLK_IN is the clock period of the input clock applied to SYS_CLK_IN. For more details, see the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual. 2. POR configuration signals consist of CFG_RESET_SOURCE[0:3]. The following table provides the PLL lock times. Table 10. PLL Lock Times Parameter/Condition PLL lock times 5.1 Min Max Unit Note — 100 s — Reset Signals DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 reset signals mentioned in Table 9. Table 11. Reset Signals DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Note Output high voltage VOH IOH = –6.0 mA 2.4 — V 1 Output low voltage VOL IOL = 6.0 mA — 0.5 V 1 Output low voltage VOL IOL = 3.2 mA — 0.4 V 1 Input high voltage VIH — 2.0 OVDD + 0.3 V 1 Input low voltage VIL — –0.3 0.8 V — Input current IIN 0 V  VIN  OVDD — ±5 A — Note: 1. This specification applies when operating from 3.3 V supply. 6 DDR2 SDRAM This section describes the DC and AC electrical specifications for the DDR2 SDRAM interface of the MPC8309. Note that DDR2 SDRAM is GVDD(typ) = 1.8 V. 6.1 DDR2 SDRAM DC Electrical Characteristics The following table provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MPC8309 when GVDD(typ) = 1.8 V. The following table provides the DDR2 capacitance when GVDD(typ) = 1.8 V. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 14 Freescale Semiconductor DDR2 SDRAM Table 12. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Note GVDD 1.7 1.9 V 1 MVREF 0.49  GVDD 0.51  GVDD V 2 I/O termination voltage VTT MVREF – 0.04 MVREF + 0.04 V 3 Input high voltage VIH MVREF+ 0.125 GVDD + 0.3 V — Input low voltage VIL –0.3 MVREF – 0.125 V — Output leakage current IOZ –9.9 9.9 A 4 Output high current (VOUT = 1.35 V) IOH –13.4 — mA — Output low current (VOUT = 0.280 V) IOL 13.4 — mA — I/O supply voltage I/O reference voltage Notes: 1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times. 2. MVREF is expected to be equal to 0.5  GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise on MVREF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of MVREF. 4. Output leakage is measured with all outputs disabled, 0 V  VOUT GVDD. Table 13. DDR2 SDRAM Capacitance for GVDD(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Note Input/output capacitance: DQ, DQS CIO 6 8 pF 1 Delta input/output capacitance: DQ, DQS CDIO — 0.5 pF 1 Note: 1. This parameter is sampled. GVDD = 1.8 V ± 0.100 V, f = 1 MHz, TA = 25 °C, VOUT = GVDD  2, VOUT (peak-to-peak) = 0.2 V. 6.2 DDR2 SDRAM AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR2 SDRAM interface. 6.2.1 DDR2 SDRAM Input AC Timing Specifications This table provides the input AC timing specifications for the DDR2 SDRAM (GVDD(typ) = 1.8 V). Table 14. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface At recommended operating conditions with GVDD of 1.8 V± 100mV. Parameter Symbol Min Max Unit Note AC input low voltage VIL — MVREF – 0.25 V — AC input high voltage VIH MVREF + 0.25 — V — The following table provides the input AC timing specifications for the DDR2 SDRAM interface. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 15 DDR2 SDRAM Table 15. DDR2 SDRAM Input AC Timing Specifications At recommended operating conditions with GVDD of 1.8V ± 100mV. Parameter Symbol Controller skew for MDQS—MDQ/MDM Min Max tCISKEW 266 MHz –750 Unit Note ps 1, 2 750 Notes: 1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that is captured with MDQS[n]. This should be subtracted from the total timing budget. 2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be determined by the equation: tDISKEW = ±(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is the absolute value of tCISKEW. The following figure shows the input timing diagram for the DDR controller. MCK[n] MCK[n] tMCK MDQS[n] MDQ[x] D0 D1 tDISKEW tDISKEW Figure 4. DDR Input Timing Diagram 6.2.2 DDR2 SDRAM Output AC Timing Specifications The following table provides the output AC timing specifications for the DDR2 SDRAM interfaces. Table 16. DDR2 SDRAM Output AC Timing Specifications At recommended operating conditions with GVDD of 1.8V ± 100mV. Parameter MCK cycle time, (MCK/MCK crossing) ADDR/CMD output setup with respect to MCK Symbol1 Min Max Unit Note tMCK 5.988 8 ns 2 ns 3 2.4 2.5 — ns 3 tDDKHAS 333 MHz 266 MHz ADDR/CMD output hold with respect to MCK 333 MHz 266 MHz tDDKHAX 2.4 2.5 — MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 16 Freescale Semiconductor DDR2 SDRAM Table 16. DDR2 SDRAM Output AC Timing Specifications (continued) At recommended operating conditions with GVDD of 1.8V ± 100mV. Symbol1 Parameter MCS output setup with respect to MCK Min Max tDDKHCS 333 MHz 266 MHz MCS output hold with respect to MCK 2.4 2.5 — 2.4 2.5 — –0.6 0.6 tDDKHCX 333 MHz 266 MHz MCK to MDQS Skew tDDKHMH MDQ/MDM output setup with respect to MDQS tDDKHDS, tDDKLDS 333 MHz 266 MHz MDQ/MDM output hold with respect to MDQS 0.8 0.9 Note ns 3 ns 3 ns 4 ns 5 ps 5 — tDDKHDX, tDDKLDX 333 MHz 266 MHz Unit 900 1100 — MDQS preamble start tDDKHMP 0.75 x tMCK — ns 6 MDQS epilogue end tDDKHME 0.4 x tMCK 0.6 x tMCK ns 6 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. 2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V. 3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied cycle. 4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjusts in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same adjustment value. See the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual for a description and understanding of the timing modifications enabled by use of these bits. 5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor. 6. tDDKHMP follows the symbol conventions described in note 1. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 17 DDR2 SDRAM The following figure shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH). MCK MCK tMCK tDDKHMH(max) = 0.6 ns MDQS tDDKHMH(min) = –0.6 ns MDQS Figure 5. Timing Diagram for tDDKHMH The following figure shows the DDR2 SDRAM output timing diagram. MCK[n] MCK[n] tMCK tDDKHAS ,tDDKHCS tDDKHAX ,tDDKHCX ADDR/CMD Write A0 NOOP tDDKHMP tDDKHMH MDQS[n] tDDKHME tDDKHDS tDDKLDS MDQ[x]/ MECC[x] D0 D1 tDDKLDX tDDKHDX Figure 6. DDR2 SDRAM Output Timing Diagram MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 18 Freescale Semiconductor Local Bus 7 Local Bus This section describes the DC and AC electrical specifications for the local bus interface of the MPC8309. 7.1 Local Bus DC Electrical Characteristics The following table provides the DC electrical characteristics for the local bus interface. Table 17. Local Bus DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2 OVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V High-level output voltage, IOH = –100 A VOH OVDD – 0.2 — V Low-level output voltage, IOL = 100 A VOL — 0.2 V IIN — ±5 A Input current 7.2 Local Bus AC Electrical Specifications The following table describes the general timing parameters of the local bus interface of the MPC8309. Table 18. Local Bus General Timing Parameters Symbol1 Min Max Unit Note tLBK 15 — ns 2 Input setup to local bus clock (LCLKn) tLBIVKH 7 — ns 3, 4 Input hold from local bus clock (LCLKn) tLBIXKH 1.0 — ns 3, 4 LALE output fall to LAD output transition (LATCH hold time) tLBOTOT 1.5 — ns LALE output rise to LCLK negative edge tLALEHOV — 3 ns — LALE output fall to LCLK negative edge tLALETOT -1.5 — ns — Local bus clock (LCLKn) to output valid tLBKHOV — 3 ns 3 Local bus clock (LCLKn) to output high impedance for LAD/LDP tLBKHOZ — 4 ns 5 Parameter Local bus cycle time Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one(1). 2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of LCLK0 (for all other inputs). 3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4  OVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 19 Local Bus The following figure provides the AC test load for the local bus. Output Z0 = 50  OVDD/2 RL = 50  Figure 7. Local Bus AC Test Load The following figures show the local bus signals. These figures has been given indicate timing parameters only and do not reflect actual functional operation of interface. LCLK[n] tLBIXKH tLBIVKH Input Signals: LAD[0:15] tLBIVKH Input Signal: LGTA tLBIXKH tLBIXKH tLBKHOV Output Signals: LBCTL/LBCKE/LOE tLBKHOV tLBKHOZ Output Signals: LAD[0:15] tLALEHOV tLALETOT tLBOTOT LALE Figure 8. Local Bus Signals MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 20 Freescale Semiconductor Local Bus LCLK T1 T3 tLBKHOV tLBKHOZ GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH tLBIXKH UPM Mode Input Signal: LUPWAIT tLBIVKH tLBIXKH Input Signals: LAD[0:15]/LDP[0:3] tLBKHOV tLBKHOZ UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 9. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 21 Ethernet and MII Management LCLK T1 T2 T3 T4 tLBKHOZ tLBKHOV GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH tLBIXKH UPM Mode Input Signal: LUPWAIT tLBIXKH tLBIVKH Input Signals: LAD[0:15] tLBKHOV tLBKHOZ UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 10. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4 8 Ethernet and MII Management This section provides the AC and DC electrical characteristics for Ethernet interfaces. 8.1 Ethernet Controller (10/100 Mbps)—MII/RMII Electrical Characteristics The electrical characteristics specified here apply to all MII (media independent interface) and RMII (reduced media independent interface), except MDIO (management data input/output) and MDC (management data clock). The MII and RMII are defined for 3.3 V. The electrical characteristics for MDIO and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.” 8.1.1 DC Electrical Characteristics All MII and RMII drivers and receivers comply with the DC parametric attributes specified in The following table. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 22 Freescale Semiconductor Ethernet and MII Management Table 19. MII and RMII DC Electrical Characteristics Parameter Symbol Conditions Min Max Unit Supply voltage 3.3 V OVDD — 3 3.6 V Output high voltage VOH IOH = –4.0 mA OVDD = Min 2.40 OVDD + 0.3 V Output low voltage VOL IOL = 4.0 mA OVDD = Min GND 0.50 V Input high voltage VIH — — 2.0 OVDD + 0.3 V Input low voltage VIL — — –0.3 0.90 V Input current IIN 0 V  VIN  OVDD — ±5 A 8.2 MII and RMII AC Timing Specifications The AC timing specifications for MII and RMII are presented in this section. 8.2.1 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. 8.2.1.1 MII Transmit AC Timing Specifications The following table provides the MII transmit AC timing specifications. Table 20. MII Transmit AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Symbol1 Min Typical Max Unit TX_CLK clock period 10 Mbps tMTX — 400 — ns TX_CLK clock period 100 Mbps tMTX — 40 — ns tMTXH/tMTX 35 — 65 % tMTKHDX 1 5 15 ns TX_CLK data clock rise VIL(max) to VIH(min) tMTXR 1.0 — 4.0 ns TX_CLK data clock fall VIH(min) to VIL(max) tMTXF 1.0 — 4.0 ns Parameter/Condition TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 23 Ethernet and MII Management The following figure provides the AC test load. Output Z0 = 50  RL = 50  OVDD/2 Figure 11. AC Test Load The following figure shows the MII transmit AC timing diagram. tMTXR tMTX TX_CLK tMTXH tMTXF TXD[3:0] TX_EN TX_ER tMTKHDX Figure 12. MII Transmit AC Timing Diagram 8.2.1.2 MII Receive AC Timing Specifications The following table provides the MII receive AC timing specifications. Table 21. MII Receive AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Symbol1 Min Typical Max Unit RX_CLK clock period 10 Mbps tMRX — 400 — ns RX_CLK clock period 100 Mbps tMRX — 40 — ns tMRXH/tMRX 35 — 65 % RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns RX_CLK clock rise VIL(max) to VIH(min) tMRXR 1.0 — 4.0 ns RX_CLK clock fall time VIH(min) to VIL(max) tMRXF 1.0 — 4.0 ns Parameter/Condition RX_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 24 Freescale Semiconductor Ethernet and MII Management The following figure shows the MII receive AC timing diagram. tMRXR tMRX RX_CLK tMRXF tMRXH RXD[3:0] RX_DV RX_ER Valid Data tMRDVKH tMRDXKH Figure 13. MII Receive AC Timing Diagram 8.2.2 RMII AC Timing Specifications This section describes the RMII transmit and receive AC timing specifications. 8.2.2.1 RMII Transmit AC Timing Specifications The following table provides the RMII transmit AC timing specifications. Table 22. RMII Transmit AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Symbol1 Min Typical Max Unit tRMX — 20 — ns tRMXH/tRMX 35 — 65 % REF_CLK to RMII data TXD[1:0], TX_EN delay tRMTKHDX 2 — 13 ns REF_CLK data clock rise VIL(min) to VIH(max) tRMXR 1.0 — 4.0 ns REF_CLK data clock fall VIH(max) to VIL(min) tRMXF 1.0 — 4.0 ns Parameter/Condition REF_CLK clock REF_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). The following figure provides the AC test load. Output Z0 = 50  RL = 50  OVDD/2 Figure 14. AC Test Load MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 25 Ethernet and MII Management The following figure shows the RMII transmit AC timing diagram. tRMXR tRMX REF_CLK tRMXH tRMXF TXD[1:0] TX_EN tRMTKHDX Figure 15. RMII Transmit AC Timing Diagram 8.2.2.2 RMII Receive AC Timing Specifications The following table provides the RMII receive AC timing specifications. Table 23. RMII Receive AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Symbol1 Min Typical Max Unit tRMX — 20 — ns tRMXH/tRMX 35 — 65 % RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK tRMRDVKH 4.0 — — ns RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK tRMRDXKH 2.0 — — ns REF_CLK clock rise VIL(min) to VIH(max) tRMXR 1.0 — 4.0 ns REF_CLK clock fall time VIH(max) to VIL(min) tRMXF 1.0 — 4.0 ns Parameter/Condition REF_CLK clock period REF_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 26 Freescale Semiconductor Ethernet and MII Management The following figure shows the RMII receive AC timing diagram. tRMXR tRMX REF_CLK tRMXF tRMXH RXD[1:0] CRS_DV RX_ER Valid Data tRMRDVKH tRMRDXKH Figure 16. RMII Receive AC Timing Diagram 8.3 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to MII management interface signals MDIO (management data input/output) and MDC (management data clock). The electrical characteristics for MII, and RMII are specified in Section 8.1, “Ethernet Controller (10/100 Mbps)—MII/RMII Electrical Characteristics.” 8.3.1 MII Management DC Electrical Characteristics MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics for MDIO and MDC are provided in the following table. Table 24. MII Management DC Electrical Characteristics When Powered at 3.3 V Parameter Supply voltage (3.3 V) Symbol Conditions Min Max Unit OVDD — 3 3.6 V Output high voltage VOH IOH = –1.0 mA OVDD = Min 2.40 OVDD + 0.3 V Output low voltage VOL IOL = 1.0 mA OVDD = Min GND 0.50 V Input high voltage VIH — 2.00 — V Input low voltage VIL — — 0.80 V Input current IIN 0 V  VIN  OVDD — ±5 A 8.3.2 MII Management AC Electrical Specifications The following table provides the MII management AC timing specifications. Table 25. MII Management AC Timing Specifications At recommended operating conditions with OVDD is 3.3 V ± 300mV. Symbol1 Min Typical Max Unit Note MDC frequency fMDC — 2.5 — MHz — MDC period tMDC — 400 — ns — MDC clock pulse width high tMDCH 32 — — ns — Parameter/Condition MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 27 Ethernet and MII Management Table 25. MII Management AC Timing Specifications (continued) At recommended operating conditions with OVDD is 3.3 V ± 300mV. Symbol1 Min Typical Max Unit Note MDC to MDIO delay tMDKHDX 10 — 70 ns — MDIO to MDC setup time tMDDVKH 8.5 — — ns — MDIO to MDC hold time tMDDXKH 0 — — ns — MDC rise time tMDCR — — 10 ns — MDC fall time tMDHF — — 10 ns — Parameter/Condition Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). The following figure shows the MII management AC timing diagram. tMDC tMDCR MDC tMDCH tMDCF MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX Figure 17. MII Management Interface Timing Diagram 8.3.3 IEEE 1588DC Specifications The IEEE 1588 DC timing specifications are given in the following table. Table 26. IEEE 1588 DC Electrical Characteristics Characteristic Symbol Condition Min Max unit Output high voltage VOH IOH = -8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Output low voltage VOL IOL = 3.2mA — 0.4 V MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 28 Freescale Semiconductor Ethernet and MII Management Table 26. IEEE 1588 DC Electrical Characteristics Characteristic Symbol Condition Min Max unit Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — - 0.3 0.8 V Input current IIN 0V ≤ VIN ≤ OVDD — ±5 μA 8.3.4 IEEE 1588 AC Specifications The IEEE 1588 AC timing specifications are given in the following table. Table 27. IEEE 1588 AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Parameter/Condition Symbol Min Typ Max Unit Note QE_1588_CLK clock period tT1588CLK 2.5 — TRX_CLK  9 ns 1, 3 tT1588CLKH/tT1588CLK 40 50 60 % — QE_1588_CLK peak-to-peak jitter tT1588CLKINJ — — 250 ps — Rise time QE_1588_CLK (20%–80%) tT1588CLKINR 1.0 — 2.0 ns — Fall time QE_1588_CLK (80%–20%) tT1588CLKINF 1.0 — 2.0 ns — QE_1588_CLK_OUT clock period tT1588CLKOUT 2  tT1588CLK — — ns — QE_1588_CLK_OUT duty cycle tT1588CLKOTH /tT1588CLKOUT 30 50 70 % — tT1588OV 0.5 — 3.0 ns — tT1588TRIGH 2  tT1588CLK_MAX — — ns 2 QE_1588_CLK duty cycle QE_1588_PULSE_OUT QE_1588_TRIG_IN pulse width Notes: 1.TRX_CLK is the max clock period of QUICC engine receiving clock selected by TMR_CTRL[CKSEL]. See the MPC8309 PowerQUICC II Pro Integrated Communications Processor Reference Manual, for a description of TMR_CTRL registers. 2. It needs to be at least two times of clock period of clock selected by TMR_CTRL[CKSEL]. See the MPC8309 PowerQUICC II Pro Integrated Communications Processor Reference Manual, for a description of TMR_CTRL registers. 3. The maximum value of tT1588CLK is not only defined by the value of TRX_CLK, but also defined by the recovered clock. For example, for 10/100 Mbps modes, the maximum value of tT1588CLK is 3600 and 280ns, respectively. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 29 TDM/SI The following figure provides the data and command output timing diagram. tT1588CLKOUT tT1588CLKOUTH TSEC_1588_CLK_OUT tT1588OV TSEC_1588_PULSE_OUT TSEC_1588_TRIG_OUT Note: The output delay is count starting rising edge if tT1588CLKOUT is non-inverting. Otherwise, it is count starting falling edge. Figure 18. IEEE1588 Output AC Timing The following figure provides the data and command input timing diagram. tT1588CLK tT1588CLKH TSEC_1588_CLK TSEC_1588_TRIG_IN tT1588TRIGH Figure 19. IEEE1588 Input AC Timing 9 TDM/SI This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial interface of the MPC8309. 9.1 TDM/SI DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 TDM/SI. Table 28. TDM/SI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  OVDD — ±5 A MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 30 Freescale Semiconductor HDLC 9.2 TDM/SI AC Timing Specifications The following table provides the TDM/SI input and output AC timing specifications. Table 29. TDM/SI AC Timing Specifications1 Symbol2 Min Max Unit TDM/SI outputs—External clock delay tSEKHOV 2 14 ns TDM/SI outputs—External clock High Impedance tSEKHOX 2 10 ns TDM/SI inputs—External clock input setup time tSEIVKH 5 — ns TDM/SI inputs—External clock input hold time tSEIXKH 2 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of QE_CLK_IN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). The following figure provides the AC test load for the TDM/SI. Output Z0 = 50  RL = 50  OVDD/2 Figure 20. TDM/SI AC Test Load The following figure represents the AC timing from Table 29. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. TDM/SICLK (Input) Input Signals: TDM/SI (See Note) Output Signals: TDM/SI (See Note) tSEIXKH tSEIVKH tSEKHOV tSEKHOX Note: The clock edge is selectable on TDM/SI. Figure 21. TDM/SI AC Timing (External Clock) Diagram 10 HDLC This section describes the DC and AC electrical specifications for the high level data link control (HDLC), of the MPC8309. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 31 HDLC 10.1 HDLC DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 HDLC protocol. Table 30. HDLC DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN OVDD — ±5 A 10.2 HDLC AC Timing Specifications The following table provides the input and output AC timing specifications for HDLC protocol. Table 31. HDLC AC Timing Specifications1 Symbol2 Min Max Unit Outputs—Internal clock delay tHIKHOV 0 9 ns Outputs—External clock delay tHEKHOV 1 12 ns Outputs—Internal clock high impedance tHIKHOX 0 5.5 ns Outputs—External clock high impedance tHEKHOX 1 8 ns Inputs—Internal clock input setup time tHIIVKH 9 — ns Inputs—External clock input setup time tHEIVKH 4 — ns Inputs—Internal clock input hold time tHIIXKH 0 — ns Inputs—External clock input hold time tHEIXKH 1 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of QE_CLK_IN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tHIKHOX symbolizes the outputs internal timing (HI) for the time tserial memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). The following figure provides the AC test load. Output Z0 = 50  RL = 50  OVDD/2 Figure 22. AC Test Load MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 32 Freescale Semiconductor PCI Figure 23 and Figure 24 represent the AC timing from Table 31. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. The following figure shows the timing with external clock. Serial CLK (Input) tHEIXKH tHEIVKH Input Signals: (See Note) tHEKHOV Output Signals: (See Note) tHEKHOX Note: The clock edge is selectable. Figure 23. AC Timing (External Clock) Diagram The following figure shows the timing with internal clock. Serial CLK (Output) tHIIXKH tHIIVKH Input Signals: (See Note) tHIKHOV Output Signals: (See Note) tHIKHOX Note: The clock edge is selectable. Figure 24. AC Timing (Internal Clock) Diagram 11 PCI This section describes the DC and AC electrical specifications for the PCI bus of the MPC8309. 11.1 PCI DC Electrical Characteristics Table 32 provides the DC electrical characteristics for the PCI interface of the MPC8309. Table 32. PCI DC Electrical Characteristics1,2 Parameter Symbol Test Condition Min Max Unit High-level input voltage VIH VOUT VOH (min) or 2 OVDD + 0.3 V Low-level input voltage VIL VOUT  VOL (max) –0.3 0.8 V High-level output voltage VOH OVDD = min, IOH = –100 A OVDD – 0.2 — V MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 33 PCI Table 32. PCI DC Electrical Characteristics1,2 Low-level output voltage Input current VOL OVDD = min, IOL = 100 A — 0.2 V IIN 0 V VIN OVDD — ±5 A Notes: 1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2. 2. Ranges listed do not meet the full range of the DC specifications of the PCI 2.3 Local Bus Specifications. 11.2 PCI AC Electrical Specifications This section describes the general AC timing parameters of the PCI bus of the MPC8309. Note that the PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8309 is configured as a host or agent device. Table 33 shows the PCI AC timing specifications at 66 MHz. . Table 33. PCI AC Timing Specifications at 66 MHz Symbol1 Min Max Unit Notes Clock to output valid tPCKHOV — 6.0 ns 2 Output hold from clock tPCKHOX 1 — ns 2 Clock to output high impedance tPCKHOZ — 14 ns 2, 3 Input setup to clock tPCIVKH 3.0 — ns 2, 4 Input hold from clock tPCIXKH 0 — ns 2, 4 Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. Table 34 shows the PCI AC timing specifications at 33 MHz. Table 34. PCI AC Timing Specifications at 33 MHz Symbol1 Min Max Unit Notes Clock to output valid tPCKHOV — 11 ns 2 Output hold from clock tPCKHOX 2 — ns 2 Clock to output high impedance tPCKHOZ — 14 ns 2, 3 Parameter MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 34 Freescale Semiconductor PCI Table 34. PCI AC Timing Specifications at 33 MHz (continued) Symbol1 Min Max Unit Notes Input setup to clock tPCIVKH 3.0 — ns 2, 4 Input hold from clock tPCIXKH 0 — ns 2, 4 Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. Figure 25 provides the AC test load for PCI. Output Z0 = 50  RL = 50  OVDD/2 Figure 25. PCI AC Test Load Figure 26 shows the PCI input AC timing conditions. CLK tPCIVKH tPCIXKH Input Figure 26. PCI Input AC Timing Measurement Conditions Figure 27 shows the PCI output AC timing conditions. CLK tPCKHOV tPCKHOX Output Delay tPCKHOZ High-Impedance Output Figure 27. PCI Output AC Timing Measurement Condition MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 35 USB 12 USB 12.1 USB Controller This section provides the AC and DC electrical specifications for the USB (ULPI) interface. 12.1.1 USB DC Electrical Characteristics The following table provides the DC electrical characteristics for the USB interface. Table 35. USB DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2.0 OVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V Input current IIN — ±5 A High-level output voltage, IOH = –100 A VOH OVDD – 0.2 — V Low-level output voltage, IOL = 100 A VOL — 0.2 V 12.1.2 USB AC Electrical Specifications The following table describes the general timing parameters of the USB interface. Table 36. USB General Timing Parameters Symbol1 Min Max Unit Note tUSCK 15 — ns — Input setup to USB clock—all inputs tUSIVKH 4 — ns — input hold to USB clock—all inputs tUSIXKH 1 — ns — USB clock to output valid—all outputs (except USBDR_STP_USBDR_STP) tUSKHOV — 7 ns — USB clock to output valid—USBDR_STP tUSKHOV — 7.5 ns — Output hold from USB clock—all outputs tUSKHOX 2 — ns — Parameter USB clock cycle time Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing (USB) for the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX symbolizes us timing (USB) for the USB clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. The following figures provide the AC test load and signals for the USB, respectively. Output Z0 = 50  RL = 50  OVDD/2 Figure 28. USB AC Test Load MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 36 Freescale Semiconductor USB USBDR_CLK tUSIVKH tUSIXKH Input Signals tUSKHOV tUSKHOX Output Signals Figure 29. USB Signals MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 37 DUART 13 DUART This section describes the DC and AC electrical specifications for the DUART interface of the MPC8309. 13.1 DUART DC Electrical Characteristics The following table provides the DC electrical characteristics for the DUART interface of the MPC8309. Table 37. DUART DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2 OVDD + 0.3 V Low-level input voltage OVDD VIL –0.3 0.8 V High-level output voltage, IOH = –100 A VOH OVDD – 0.2 — V Low-level output voltage, IOL = 100 A VOL — 0.2 V IIN — ±5 A Input current (0 V VIN OVDD )1 Note: 1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2. 13.2 DUART AC Electrical Specifications The following table provides the AC timing parameters for the DUART interface of the MPC8309. Table 38. DUART AC Timing Specifications Parameter Value Unit Note Minimum baud rate 256 baud — Maximum baud rate >1,000,000 baud 1 16 — 2 Oversample rate Notes: 1. Actual attainable baud rate is limited by the latency of interrupt processing. 2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each 16th sample. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 38 Freescale Semiconductor eSDHC 14 eSDHC This section describes the DC and AC electrical specifications for the eSDHC interface of the device. 14.1 eSDHC DC Electrical Characteristics The following table provides the DC electrical characteristics for the eSDHC interface. Table 39. eSDHC Interface DC Electrical Characteristics At recommended operating conditions with OVDD = 3.3 V Characteristic Symbol Condition Min Max Unit Note Input high voltage VIH — 0.625  OVDD — V 1 Input low voltage VIL — — 0.25  OVDD V 1 Output high voltage VOH IOH = –100 A at OVDD min 0.75  OVDD — V — Output low voltage VOL IOL = 100 A at OVDD min — 0.125  OVDD V — Output high voltage VOH IOH = –100 mA OVDD – 0.2 — V 2 Output low voltage VOL IOL = 2 mA — 0.3 V 2 IIN/IOZ — –10 10 A — Input/output leakage current Notes: 1. Note that the min VILand max VIH values are based on the respective min and max OVIN values found in Table 2.. 2. Open drain mode for MMC cards only. 14.2 eSDHC AC Timing Specifications The following table provides the eSDHC AC timing specifications as defined in Figure 30 and Figure 31. Table 40. eSDHC AC Timing Specifications At recommended operating conditions with OVDD = 3.3 V Symbol1 Min Max Unit Notes SD_CLK clock frequency: SD/SDIO Full-speed/High-speed mode MMC Full-speed/High-speed mode fSHSCK 0 25/33.25 20/52 MHz 2, 4 SD_CLK clock low time—Full-speed/High-speed mode tSHSCKL 10/7 — ns 4 SD_CLK clock high time—Full-speed/High-speed mode tSHSCKH 10/7 — ns 4 SD_CLK clock rise and fall times tSHSCKR/ tSHSCKF — 3 ns 4 Input setup times: SD_CMD, SD_DATx, SD_CD to SD_CLK tSHSIVKH 5 — ns 4 Parameter MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 39 eSDHC Table 40. eSDHC AC Timing Specifications (continued) At recommended operating conditions with OVDD = 3.3 V Symbol1 Min Max Unit Notes Input hold times: SD_CMD, SD_DATx, SD_CD to SD_CLK tSHSIXKH 2.5 — ns 3, 4 Output delay time: SD_CLK to SD_CMD, SD_DATx valid tSHSKHOV –3 3 ns 4 Parameter Notes: 1. The symbols used for timing specifications herein follow the pattern of t(first three letters of functional block)(signal)(state) (reference)(state) for inputs and t(first three letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tFHSKHOV symbolizes eSDHC high-speed mode device timing (SHS) clock reference (K) going to the high (H) state, with respect to the output (O) reaching the invalid state (X) or output hold time. Note that in general, the clock reference symbol is based on five letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. In full-speed mode, the clock frequency value can be 0–25 MHz for an SD/SDIO card and 0–20 MHz for an MMC card. In high-speed mode, the clock frequency value can be 0–33.25 MHz for an SD/SDIO card and 0–52 MHz for an MMC card. 3. To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns. 4. CCARD  10 pF, (1 card), and CL = CBUS + CHOST + CCARD 40 pF The following figure provides the eSDHC clock input timing diagram. eSDHC External Clock operational mode VM VM VM tSHSCKL tSHSCKH tSHSCK VM = Midpoint Voltage (OVDD/2) tSHSCKR tSHSCKF Figure 30. eSDHC Clock Input Timing Diagram The following figure provides the data and command input/output timing diagram. SD_CK External Clock VM VM tSHSIVKH VM VM tSHSIXKH SD_DAT/CMD Inputs SD_DAT/CMD Outputs tSHSKHOV VM = Midpoint Voltage (OVDD/2) Figure 31. eSDHC Data and Command Input/Output Timing Diagram Referenced to Clock MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 40 Freescale Semiconductor FlexCAN 15 FlexCAN This section describes the DC and AC electrical specifications for the FlexCAN interface. 15.1 FlexCAN DC Electrical Characteristics The following table provides the DC electrical characteristics for the FlexCAN interface. Table 41. FlexCAN DC Electrical Characteristics (3.3V) For recommended operating conditions, see Table 2 Parameter Symbol Min Max Unit Notes Input high voltage VIH 2 — V 1 Input low voltage VIL — 0.8 V 1 Input current (OVIN = 0 V or OVIN = OVDD) IIN — ±5 A 2 Output high voltage (OVDD = min, IOH = –2 mA) VOH 2.4 — V — Output low voltage (OVDD = min, IOL = 2 mA) VOL — 0.4 V — Note: 1. Min VILand max VIH values are based on the respective min and max OVIN values found in Table 2. 2. OVIN represents the input voltage of the supply. It is referenced in Table 2. 15.2 FlexCAN AC Timing Specifications The following table provides the AC timing specifications for the FlexCAN interface. Table 42. FlexCAN AC Timing Specifications For recommended operating conditions, see Table 2 Parameter Baud rate Min Max Unit Notes 10 1000 Kbps — MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 41 I2 C 16 I2C This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8309. 16.1 I2C DC Electrical Characteristics The following table provides the DC electrical characteristics for the I2C interface of the MPC8309. Table 43. I2C DC Electrical Characteristics At recommended operating conditions with OVDD of 3.3 V ± 300mV. Parameter Symbol Min Max Unit Notes Input high voltage level VIH 0.7  OVDD OVDD + 0.3 V — Input low voltage level VIL –0.3 0.3  OVDD V — Low level output voltage VOL 0 0.4 V 1 Output fall time from VIH(min) to VIL(max) with a bus capacitance from 10 to 400 pF tI2KLKV 20 + 0.1  CB 250 ns 2 Pulse width of spikes which must be suppressed by the input filter tI2KHKL 0 50 ns 3 Capacitance for each I/O pin CI — 10 pF — Input current (0 V VIN OVDD) IIN — ±5 A 4 Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. CB = capacitance of one bus line in pF. 3. Refer to the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual for information on the digital filter used. 4. I/O pins obstructs the SDA and SCL lines if OVDD is switched off. 16.2 I2C AC Electrical Specifications The following table provides the AC timing parameters for the I2C interface of the MPC8309. Table 44. I2C AC Electrical Specifications All values refer to VIH (min) and VIL (max) levels (see Table 43). Symbol1 Min Max Unit SCL clock frequency fI2C 0 400 kHz Low period of the SCL clock tI2CL 1.3 — s High period of the SCL clock tI2CH 0.6 — s Setup time for a repeated START condition tI2SVKH 0.6 — s Hold time (repeated) START condition (after this period, the first clock pulse is generated) tI2SXKL 0.6 — s Data setup time tI2DVKH 100 — ns 300 0.93 s 300 ns Parameter Data hold time: I2C bus devices Rise time of both SDA and SCL signals tI2DXKL tI2CR 20 + 0.1 CB4 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 42 Freescale Semiconductor I2 C Table 44. I2C AC Electrical Specifications (continued) All values refer to VIH (min) and VIL (max) levels (see Table 43). Symbol1 Min Max Unit tI2CF 20 + 0.1 CB4 300 ns Setup time for STOP condition tI2PVKH 0.6 — s Bus free time between a STOP and START condition tI2KHDX 1.3 — s Noise margin at the LOW level for each connected device (including hysteresis) VNL 0.1  OVDD — V Noise margin at the HIGH level for each connected device (including hysteresis) VNH 0.2  OVDD — V Parameter Fall time of both SDA and SCL signals Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. MPC8309 provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DVKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. The following figure provides the AC test load for the I2C. Output Z0 = 50  RL = 50  OVDD/2 Figure 32. I2C AC Test Load The following figure shows the AC timing diagram for the I2C bus. SDA tI2CF tI2DVKH tI2CL tI2KHKL tI2SXKL tI2CF tI2CR SCL tI2SXKL S tI2DXKL tI2CH tI2SVKH Sr tI2PVKH P S 2 Figure 33. I C Bus AC Timing Diagram MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 43 Timers 17 Timers This section describes the DC and AC electrical specifications for the timers of the MPC8309. 17.1 Timer DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 timer pins, including TIN, TOUT, TGATE, and RTC_PIT_CLK. Table 45. Timer DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  OVDD — ±5 A 17.2 Timer AC Timing Specifications The following table provides the timer input and output AC timing specifications. Table 46. Timer Input AC Timing Specifications1 Characteristic Timers inputs—minimum pulse width Symbol2 Min Unit tTIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLK_IN. Timings are measured at the pin. 2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by any external synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation. The following figure provides the AC test load for the timers. Output Z0 = 50  RL = 50  OVDD/2 Figure 34. Timers AC Test Load MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 44 Freescale Semiconductor GPIO 18 GPIO This section describes the DC and AC electrical specifications for the GPIO of the MPC8309. 18.1 GPIO DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 GPIO. Table 47. GPIO DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Notes Output high voltage VOH IOH = –6.0 mA 2.4 — V 1 Output low voltage VOL IOL = 6.0 mA — 0.5 V 1 Output low voltage VOL IOL = 3.2 mA — 0.4 V 1 Input high voltage VIH — 2.0 OVDD + 0.3 V 1 Input low voltage VIL — –0.3 0.8 V — Input current IIN 0 V VIN OVDD — ±5 A — Note: 1. This specification applies when operating from 3.3-V supply. 18.2 GPIO AC Timing Specifications The following table provides the GPIO input and output AC timing specifications. Table 48. GPIO Input AC Timing Specifications1 Characteristic GPIO inputs—minimum pulse width Symbol2 Min Unit tPIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLK_IN. Timings are measured at the pin. 2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation. The following figure provides the AC test load for the GPIO. Output Z0 = 50  RL = 50  OVDD/2 Figure 35. GPIO AC Test Load MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 45 IPIC 19 IPIC This section describes the DC and AC electrical specifications for the external interrupt pins of the MPC8309. 19.1 IPIC DC Electrical Characteristics The following table provides the DC electrical characteristics for the external interrupt pins of the MPC8309. Table 49. IPIC DC Electrical Characteristics1,2 Characteristic Symbol Condition Min Max Unit Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN — — ±5 A Output High Voltage VOH IOL = -8.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Notes: 1. This table applies for pins IRQ, MCP_OUT, and QE ports Interrupts. 2. MCP_OUT is open drain pins, thus VOH is not relevant for those pins. 19.2 IPIC AC Timing Specifications The following table provides the IPIC input and output AC timing specifications. Table 50. IPIC Input AC Timing Specifications1 Characteristic IPIC inputs—minimum pulse width Symbol2 Min Unit tPIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of SYS_CLK_IN. Timings are measured at the pin. 2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when working in edge triggered mode. 20 SPI This section describes the DC and AC electrical specifications for the SPI of the MPC8309. 20.1 SPI DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 SPI. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 46 Freescale Semiconductor SPI Table 51. SPI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  OVDD — ±5 A 20.2 SPI AC Timing Specifications The following table and provide the SPI input and output AC timing specifications. Table 52. SPI AC Timing Specifications1 Symbol2 Min Max Unit SPI outputs—Master mode (internal clock) delay tNIKHOV 0.5 6 ns SPI outputs—Slave mode (external clock) delay tNEKHOV 2 8 ns SPI inputs—Master mode (internal clock) input setup time tNIIVKH 6 — ns SPI inputs—Master mode (internal clock) input hold time tNIIXKH 0 — ns SPI inputs—Slave mode (external clock) input setup time tNEIVKH 4 — ns SPI inputs—Slave mode (external clock) input hold time tNEIXKH 2 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of SPICLK to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOV symbolizes the NMSI outputs internal timing (NI) for the time tSPI memory clock reference (K) goes from the high state (H) until outputs (O) are valid (V). 3. All units of output delay must be enabled for 8309_output_port spimosi_lpgl0(SPI Master Mode) 4. delay units must not be enabled for Slave Mode. The following figure provides the AC test load for the SPI. Output Z0 = 50  RL = 50  OVDD/2 Figure 36. SPI AC Test Load Figure 37 and Figure 38 represent the AC timing from Table 52. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 47 JTAG The following figure shows the SPI timing in slave mode (external clock). SPICLK (Input) tNEIXKH tNEIVKH Input Signals: SPIMOSI (See Note) tNEKHOV Output Signals: SPIMISO (See Note) Note: The clock edge is selectable on SPI. Figure 37. SPI AC Timing in Slave Mode (External Clock) Diagram The following figure shows the SPI timing in master mode (internal clock). SPICLK (Output) tNIIXKH tNIIVKH Input Signals: SPIMISO (See Note) tNIKHOV Output Signals: SPIMOSI (See Note) Note: The clock edge is selectable on SPI. Figure 38. SPI AC Timing in Master Mode (Internal Clock) Diagram 21 JTAG This section describes the DC and AC electrical specifications for the IEEE Std. 1149.1™ (JTAG) interface of the MPC8309. 21.1 JTAG DC Electrical Characteristics The following table provides the DC electrical characteristics for the IEEE Std. 1149.1 (JTAG) interface of the MPC8309. Table 53. JTAG Interface DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 48 Freescale Semiconductor JTAG Table 53. JTAG Interface DC Electrical Characteristics (continued) Characteristic Symbol Condition Min Max Unit Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V  VIN  OVDD — ±5 A 21.2 JTAG AC Electrical Characteristics This section describes the AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the MPC8309. The following table provides the JTAG AC timing specifications as defined in Figure 40 through Figure 43. Table 54. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)1 At recommended operating conditions (see Table 2). Symbol2 Min Max Unit Notes JTAG external clock frequency of operation fJTG 0 33.3 MHz — JTAG external clock cycle time t JTG 30 — ns — tJTKHKL 11 — ns — tJTGR, tJTGF 0 2 ns — tTRST 25 — ns 3 Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 4 — — Boundary-scan data TMS, TDI tJTDXKH tJTIXKH 10 10 — — Boundary-scan data TDO tJTKLDV tJTKLOV 2 2 15 15 Parameter JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time Input setup times: ns Input hold times: 4 ns Valid times: 4 ns 5 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 49 JTAG Table 54. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)1 (continued) At recommended operating conditions (see Table 2). Symbol2 Min Max Boundary-scan data TDO tJTKLDX tJTKLOX 2 2 — — JTAG external clock to output high impedance: Boundary-scan data TDO tJTKLDZ tJTKLOZ 2 2 19 9 Parameter Unit Notes ns Output hold times: 5 ns 5, 6 6 Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-load (see Figure 39). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. 6. Guaranteed by design and characterization. The following figure provides the AC test load for TDO and the boundary-scan outputs of the MPC8309. Output Z0 = 50  RL = 50  OVDD/2 Figure 39. AC Test Load for the JTAG Interface The following figure provides the JTAG clock input timing diagram. JTAG External Clock VM VM VM tJTGR tJTKHKL tJTGF tJTG VM = Midpoint Voltage (OVDD/2) Figure 40. JTAG Clock Input Timing Diagram The following figure provides the TRST timing diagram. TRST VM VM tTRST VM = Midpoint Voltage (OVDD/2) Figure 41. TRST Timing Diagram MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 50 Freescale Semiconductor JTAG The following figure provides the boundary-scan timing diagram. JTAG External Clock VM VM tJTDVKH tJTDXKH Input Data Valid Boundary Data Inputs tJTKLDV tJTKLDX Boundary Data Outputs Output Data Valid tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (OVDD/2) Figure 42. Boundary-Scan Timing Diagram The following figure provides the test access port timing diagram. JTAG External Clock VM VM tJTIVKH tJTIXKH Input Data Valid TDI, TMS tJTKLOX tJTKLOV TDO Output Data Valid tJTKLOZ TDO Output Data Valid VM = Midpoint Voltage (OVDD/2) Figure 43. Test Access Port Timing Diagram MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 51 Package and Pin Listings 22 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 22.1, “Package Parameters for the MPC8309,” and Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,” for information on the MAPBGA. 22.1 Package Parameters for the MPC8309 The package parameters are as provided in the following list. Package outline 19 mm 19 mm Package Type MAPBGA Interconnects 489 Pitch 0.80 mm Module height (typical) 1.48 mm; Min = 1.31mm and Max 1.61mm Solder Balls 96 Sn / 3.5 Ag / 0.5 Cu (VM package) Ball diameter (typical) 0.40 mm 22.2 Mechanical Dimensions of the MPC8309 MAPBGA The following figure shows the mechanical dimensions and bottom surface nomenclature of the MPC8309, 489-MAPBGA package. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 52 Freescale Semiconductor Package and Pin Listings Figure 44. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8309 MAPBGA Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 53 Package and Pin Listings 22.3 Pinout Listings Following table shows the pin list of the MPC8309. Table 55. MPC8309 Pinout Listing Signal Terminal Pad Dir Power Supply Notes DDR Memory Controller Interface MEMC_MDQ0 U5 IO GVDD — MEMC_MDQ1 AA1 IO GVDD — MEMC_MDQ2 W3 IO GVDD — MEMC_MDQ3 R5 IO GVDD — MEMC_MDQ4 W2 IO GVDD — MEMC_MDQ5 U3 IO GVDD — MEMC_MDQ6 U2 IO GVDD — MEMC_MDQ7 T3 IO GVDD — MEMC_MDQ8 H3 IO GVDD — MEMC_MDQ9 H4 IO GVDD — MEMC_MDQ10 G3 IO GVDD — MEMC_MDQ11 F3 IO GVDD — MEMC_MDQ12 G5 IO GVDD — MEMC_MDQ13 F4 IO GVDD — MEMC_MDQ14 F5 IO GVDD — MEMC_MDQ15 E3 IO GVDD — MEMC_MDQ16 V4 IO GVDD — MEMC_MDQ17 Y2 IO GVDD — MEMC_MDQ18 Y1 IO GVDD — MEMC_MDQ19 U4 IO GVDD — MEMC_MDQ20 V1 IO GVDD — MEMC_MDQ21 R4 IO GVDD — MEMC_MDQ22 U1 IO GVDD — MEMC_MDQ23 T2 IO GVDD — MEMC_MDQ24 J5 IO GVDD — MEMC_MDQ25 G2 IO GVDD — MEMC_MDQ26 G1 IO GVDD — MEMC_MDQ27 F1 IO GVDD — MEMC_MDQ28 E2 IO GVDD — MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 54 Freescale Semiconductor Package and Pin Listings MEMC_MDQ29 D2 IO GVDD — MEMC_MDQ30 C2 IO GVDD — MEMC_MDQ31 C1 IO GVDD — MEMC_MECC0 Y5 IO GVDD — MEMC_MECC1 AA4 IO GVDD — MEMC_MECC2 Y4 IO GVDD — MEMC_MECC3 AA3 IO GVDD — MEMC_MECC4 AC2 IO GVDD — MEMC_MECC5 AB2 IO GVDD — MEMC_MECC6 Y3 IO GVDD — MEMC_MECC7 AB1 IO GVDD — MEMC_MDM0 W1 O GVDD — MEMC_MDM1 E1 O GVDD — MEMC_MDM2 V3 O GVDD — MEMC_MDM3 D1 O GVDD — MEMC_MDM8 W5 O GVDD — MEMC_MDQS0 T5 IO GVDD — MEMC_MDQS1 H5 IO GVDD — MEMC_MDQS2 P5 IO GVDD — MEMC_MDQS3 E5 IO GVDD - MEMC_MDQS8 V5 IO GVDD - MEMC_MBA0 K2 O GVDD - MEMC_MBA1 K3 O GVDD - MEMC_MBA2 N5 O GVDD - MEMC_MA0 L3 O GVDD - MEMC_MA1 L5 O GVDD - MEMC_MA2 L2 O GVDD - MEMC_MA3 L1 O GVDD - MEMC_MA4 M3 O GVDD - MEMC_MA5 M4 O GVDD - MEMC_MA6 M1 O GVDD - MEMC_MA7 N1 O GVDD - MEMC_MA8 N2 O GVDD - MEMC_MA9 N3 O GVDD - MEMC_MA10 L4 O GVDD - MEMC_MA11 P2 O GVDD - MEMC_MA12 N4 O GVDD - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 55 Package and Pin Listings MEMC_MA13 P1 O GVDD - MEMC_MWE_B J1 O GVDD - MEMC_MRAS_B K1 O GVDD - MEMC_MCAS_B J3 O GVDD - MEMC_MCS_B0 J4 O GVDD - MEMC_MCS_B1 K5 O GVDD - MEMC_MCKE P4 O GVDD - MEMC_MCK0 R1 O GVDD - MEMC_MCK1 R3 O GVDD - MEMC_MCK_B0 T1 O GVDD - MEMC_MCK_B1 P3 O GVDD - MEMC_MODT0 H1 O GVDD - MEMC_MODT1 H2 O GVDD - MEMC_MVREF M6 GVDD - Local Bus Controller Interface LAD0 B5 IO OVDD - LAD1 A4 IO OVDD - LAD2 C7 IO OVDD - LAD3 D9 IO OVDD - LAD4 A5 IO OVDD - LAD5 E10 IO OVDD - LAD6 A6 IO OVDD - LAD7 C8 IO OVDD - LAD8 D10 IO OVDD - LAD9 A7 IO OVDD - LAD10 B7 IO OVDD - LAD11 C9 IO OVDD - LAD12 E11 IO OVDD - LAD13 B8 IO OVDD - LAD14 A8 IO OVDD - LAD15 C10 IO OVDD - LA16 C11 IO OVDD - LA17 B10 O OVDD - LA18 D12 O OVDD - LA19 A9 O OVDD - LA20 E12 O OVDD - LA21 B11 O OVDD - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 56 Freescale Semiconductor Package and Pin Listings LA22 A11 O OVDD - LA23 A10 O OVDD - LA24 C12 O OVDD - LA25 A12 O OVDD - LCLK0 E13 O OVDD - LCS_B0 D13 O OVDD 2 LCS_B1 C13 O OVDD 2 LCS_B2 A13 O OVDD 2 LCS_B3 B13 O OVDD 2 LWE_B0/LFWE_B0/LBS_B0 A14 O OVDD - LWE_B1/LBS_B1 B14 O OVDD - LBCTL A15 O OVDD - LGPL0/LFCLE C14 O OVDD - LGPL1/LFALE C15 O OVDD - LGPL2/LOE_B/LFRE_B B16 O OVDD 2 LGPL3/LFWP_B A16 O OVDD - LGPL4/LGTA_B/LUPWAIT/LFRB_B E14 IO OVDD 2 LGPL5 B17 O OVDD - LALE A17 O OVDD - DUART UART1_SOUT1 AB7 O OVDD - UART1_SIN1 AC6 I OVDD - UART1_SOUT2/UART1_RTS_B1 W10 O OVDD - Y9 I OVDD - UART1_SIN2/UART1_CTS_B1 I2C IIC_SDA1 A20 IO OVDD 1 IIC_SCL1 B20 IO OVDD 1 IIC_SDA2 /CKSTOP_OUT_B D19 IO OVDD 1 IIC_SCL2/CKSTOP_IN_B C20 IO OVDD 1 Interrupts IRQ_B0_MCP_IN_B A21 IO OVDD - IRQ_B1/MCP_OUT_B A22 IO OVDD - IRQ_B2/CKSTOP_IN_B E18 I OVDD - IRQ_B3/CKSTOP_OUT_B/INTA_B E19 IO OVDD - IO OVDD - SPI SPIMOSI B19 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 57 Package and Pin Listings SPIMISO E16 IO OVDD - SPICLK E17 IO OVDD - SPISEL A19 I OVDD - SPISEL_BOOT_B D18 OVDD - JTAG TCK A2 I OVDD - TDI C5 I OVDD 2 TDO A3 O OVDD - TMS D7 I OVDD 2 TRST_B E9 I OVDD 2 I OVDD - Test Interface TEST_MODE C6 System Control Signals HRESET_B W23 IO OVDD 1 PORESET_B W22 I OVDD - Clock Interface QE_CLK_IN R22 I OVDD - SYS_CLK_IN R23 I OVDD - SYS_XTAL_IN P23 I OVDD - SYS_XTAL_OUT P19 O OVDD - PCI_SYNC_IN T23 I OVDD - PCI_SYNC_OUT R20 O OVDD - CFG_CLKIN_DIV_B U23 I OVDD - RTC_PIT_CLOCK V23 I OVDD - OVDD - Miscellaneous Signals QUIESCE_B D6 THERM0 E8 O GPIO GPIO_0/SD_CLK/MSRCID0 (DDR ID) E4 IO OVDD - GPIO_1/SD_CMD/MSRCID1 (DDR ID) E6 IO OVDD - GPIO_2/SD_CD/MSRCID2 (DDR ID) D3 IO OVDD - GPIO_3/SD_WP/MSRCID3 (DDR ID) E7 IO OVDD - GPIO_4/SD_DAT0/MSRCID4 (DDR ID) D4 IO OVDD - GPIO_5/SD_DAT1/MDVAL (DDR ID) C4 IO OVDD - GPIO_6/SD_DAT2/QE_EXT_REQ_3 B2 IO OVDD - GPIO_7/SD_DAT3/QE_EXT_REQ_1 B3 IO OVDD - GPIO_8/RXCAN1/LSRCID0/LCS_B4 C16 IO OVDD - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 58 Freescale Semiconductor Package and Pin Listings GPIO_9/TXCAN1/LSRCID1/LCS_B5 C17 IO OVDD - GPIO_10/RXCAN2/LSRCID2/LCS_B6 E15 IO OVDD - GPIO_11/TXCAN2/LSRCID3/LCS_B7 A18 IO OVDD - GPIO_12/RXCAN3/LSRCID4/LCLK1 D15 IO OVDD - GPIO_13/TXCAN3/LDVAL C18 IO OVDD - GPIO_14/RXCAN4 D16 IO OVDD - GPIO_15/TXCAN4 C19 IO OVDD - USB USBDR_PWRFAULT/CE_PIO_1 AA6 I OVDD 1 USBDR_CLK/UART2_SIN2/UART2_CTS_B1 AC9 I OVDD - USBDR_DIR AA7 I OVDD - USBDR_NXT/UART2_SIN1/QE_EXT_REQ_4 AC5 I OVDD - USBDR_TXDRXD0/GPIO_32 Y6 IO OVDD - USBDR_TXDRXD1/GPIO_33 W9 IO OVDD - USBDR_TXDRXD2/GPIO_34/QE_BRG_1 AB5 IO OVDD - USBDR_TXDRXD3/GPIO_35/QE_BRG_2 AA5 IO OVDD - USBDR_TXDRXD4/GPIO_36/QE_BRG_3 Y8 IO OVDD - USBDR_TXDRXD5/GPIO_37/QE_BRG_4 AC4 IO OVDD - USBDR_TXDRXD6/GPIO_38/QE_BRG_9 AC3 IO OVDD - USBDR_TXDRXD7/GPIO_39/QE_BRG_11 AB3 IO OVDD - USBDR_PCTL0/UART2_SOUT1/LB_POR_CFG _BOOT_ECC W8 O OVDD - USBDR_PCTL1/UART2_SOUT2/UART2_RTS_B 1/LB_POR_BOOT_ERR W7 O OVDD - USBDR_STP/QE_EXT_REQ_2 W6 O OVDD - PCI PCI_INTA_B B22 O OVDD - PCI_RESET_OUT_B F19 O OVDD - PCI_AD0 B23 IO OVDD - PCI_AD1 C21 IO OVDD - PCI_AD2 E20 IO OVDD - PCI_AD3 G19 IO OVDD - PCI_AD4 C23 IO OVDD - PCI_AD5 H19 IO OVDD - PCI_AD6/CE_PIO_0 D21 IO OVDD - PCI_AD7 F20 IO OVDD - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 59 Package and Pin Listings PCI_AD8/ E21 IO OVDD - PCI_AD9/ H20 IO OVDD - PCI_AD10/ D22 IO OVDD - PCI_AD11/ D23 IO OVDD - PCI_AD12/ J19 IO OVDD - PCI_AD13/ F21 IO OVDD - PCI_AD14/ G21 IO OVDD - PCI_AD15/ E22 IO OVDD - PCI_AD16/ E23 IO OVDD - PCI_AD17/ J20 IO OVDD - PCI_AD18/ F23 IO OVDD - PCI_AD19/ G23 IO OVDD - PCI_AD20 K19 IO OVDD - PCI_AD21 H21 IO OVDD - PCI_AD22 L19 IO OVDD - PCI_AD23 G22 IO OVDD - PCI_AD24 H23 IO OVDD - PCI_AD25 J21 IO OVDD - PCI_AD26 H22 IO OVDD - PCI_AD27 J23 IO OVDD - PCI_AD28 K18 IO OVDD - PCI_AD29 K21 IO OVDD - PCI_AD30 K22 IO OVDD - PCI_AD31 K23 IO OVDD - PCI_C_BE_B0 L20 IO OVDD - PCI_C_BE_B1 L23 IO OVDD - PCI_C_BE_B2 L22 IO OVDD - PCI_C_BE_B3 L21 IO OVDD - PCI_PAR M19 IO OVDD - PCI_FRAME_B M20 IO OVDD - PCI_TRDY_B M23 IO OVDD - PCI_IRDY_B M21 IO OVDD - PCI_STOP_B N23 IO OVDD - PCI_DEVSEL_B N22 IO OVDD - PCI_IDSEL N21 IO OVDD - PCI_SERR_B N19 IO OVDD - PCI_PERR_B P20 IO OVDD - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 60 Freescale Semiconductor Package and Pin Listings PCI_REQ_B0 P21 IO OVDD - PCI_REQ_B1/CPCI_HS_ES P22 IO OVDD - PCI_REQ_B2 T22 IO OVDD - PCI_GNT_B0 T21 IO OVDD - PCI_GNT_B1/CPCI_HS_LED U22 O OVDD - PCI_GNT_B2/CPCI_HS_ENUM U21 IO OVDD - M66EN V21 I OVDD - PCI_CLK0 T19 O OVDD - PCI_CLK1 U19 O OVDD - PCI_CLK2 R19 O OVDD - Ethernet Management FEC_MDC W18 O OVDD - FEC_MDIO W17 IO OVDD - Y18 IO OVDD - FEC1_CRS/GTM1_TGATE1_B/GPIO_17 AA19 IO OVDD - FEC1_RX_CLK[CLK9]/GPIO_18 W16 IO OVDD - FEC1_RX_DV/GTM1_TIN2/GPIO_19 AC22 IO OVDD - FEC1_RX_ER/GTM1_TGATE2_B/GPIO_20 AA18 IO OVDD - FEC1_RXD0/GPIO_21 AB20 IO OVDD - Y17 IO OVDD - FEC1_RXD2/GTM1_TGATE3_B/GPIO_23 AB19 IO OVDD - FEC1_RXD3/GPIO_24 AC21 IO OVDD - FEC1_TX_CLK[CLK10]/GTM1_TIN4/GPIO_25 W15 IO OVDD - FEC1_TX_EN/GTM1_TGATE4_B/GPIO_26 AC19 IO OVDD - FEC1_TX_ER/GTM1_TOUT4_B/GPIO_27 AC20 IO OVDD - FEC1_TXD0/GTM1_TOUT1_B/GPIO_28 AA17 IO OVDD - FEC1_TXD1/GTM1_TOUT2_B/GPIO_29 AC18 IO OVDD - FEC1_TXD2/GTM1_TOUT3_B/GPIO_30 AA16 IO OVDD - FEC1_TXD3/GPIO_31 AB17 IO OVDD - Y15 IO OVDD - AC17 IO OVDD - FEC/GTM/GPIO FEC1_COL/GTM1_TIN1/GPIO_16 FEC1_RXD1/GTM1_TIN3/GPIO_22 FEC2_COL/GTM2_TIN1/GPIO_32 FEC2_CRS/GTM2_TGATE1_B/GPIO_33 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 61 Package and Pin Listings FEC2_RX_CLK[CLK7]/GPIO_34 W14 IO OVDD - FEC2_RX_DV/GTM2_TIN2/GPIO_35 AB16 IO OVDD - Y14 IO OVDD - FEC2_RXD0/GPIO_37 AA15 IO OVDD - FEC2_RXD1/GTM2_TIN3/GPIO_38 AC15 IO OVDD - FEC2_RXD2/GTM2_TGATE3_B/GPIO_39 AC16 IO OVDD - FEC2_RXD3/GPIO_40 AA14 IO OVDD - FEC2_TX_CLK[CLK8]/GTM2_TIN4/GPIO_41 W13 IO OVDD - FEC2_TX_EN/GTM2_TGATE4_B/GPIO_42 AB14 IO OVDD - FEC2_TX_ER/GTM2_TOUT4_B/GPIO_43 AC14 IO OVDD - FEC2_TXD0/GTM2_TOUT1_B/GPIO_44 Y12 IO OVDD - FEC2_TXD1/GTM2_TOUT2_B/GPIO_45 AA13 IO OVDD - FEC2_TXD2/GTM2_TOUT3_B/GPIO_46 AB13 IO OVDD - FEC2_TXD3/GPIO_47 AC13 IO OVDD - FEC3_COL/GPIO_48 AC12 IO OVDD - FEC3_CRS/GPIO_49 W11 IO OVDD - FEC3_RX_CLK[CLK11]/GPIO_50 W12 IO OVDD - FEC3_RX_DV/GPIO_51 AA12 IO OVDD - FEC3_RX_ER/GPIO_52 AB11 IO OVDD - FEC3_RXD0/GPIO_53 AA11 IO OVDD - FEC3_RXD1/GPIO_54 AC11 IO OVDD - FEC3_RXD2/FEC_TMR_TRIG1/GPIO_55 Y11 IO OVDD - FEC3_RXD3/FEC_TMR_TRIG2/GPIO_56 AB10 IO OVDD - FEC3_TX_CLK[CLK12]/FEC_TMR_CLK/GPIO_5 7 AC10 IO OVDD - FEC3_TX_EN/FEC_TMR_GCLK/GPIO_58 AA10 IO OVDD - FEC3_TX_ER/FEC_TMR_PP1/GPIO_59 AC8 IO OVDD - FEC3_TXD0/FEC_TMR_PP2/GPIO_60 AB8 IO OVDD - FEC3_TXD1/FEC_TMR_PP3/GPIO_61 AA9 IO OVDD - FEC3_TXD2/FEC_TMR_ALARM1/GPIO_62 AA8 IO OVDD - FEC3_TXD3/FEC_TMR_ALARM2/GPIO_63 AC7 IO OVDD - FEC2_RX_ER/GTM2_TGATE2_B/GPIO_36 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 62 Freescale Semiconductor Package and Pin Listings HDLC/TDM/GPIO HDLC1_TXCLK[CLK16]/GPIO_0/QE_BRG_5/TD M1_TCK[CLK4] AA20 IO OVDD - HDLC1_RXCLK[CLK15]/GPIO_1/TDM1_RCK [CLK3] AA21 IO OVDD - HDLC1_TXD/GPIO_2/TDM1_TD/CFG_RESET_ SOURCE[0] AB22 IO OVDD 1 HDLC1_RXD/GPIO_3/TDM1_RD AB23 IO OVDD - HDLC1_CD_B/GPIO_4/TDM1_TFS W19 IO OVDD - HDLC1_CTS_B/GPIO_5/TDM1_RFS V19 IO OVDD - HDLC1_RTS_B/GPIO_6/TDM1_STROBE_B/CF G_RESET_SOURCE[1] AA23 IO OVDD - HDLC2_TXCLK[CLK14]/GPIO_16/QE_BRG_7/T DM2_TCK[CLK6] Y20 IO OVDD - HDLC2_RXCLK[CLK13]/GPIO_17/TDM2_RCK [CLK5]/QE_BRG_8 Y22 IO OVDD - HDLC2_TXD/GPIO_18/TDM2_TD/CFG_RESET _SOURCE[2] W20 IO OVDD 1 HDLC2_RXD/GPIO_19/TDM2_RD W21 IO OVDD - HDLC2_CD_B/GPIO_20/TDM2_TFS V20 IO OVDD - HDLC2_CTS_B/GPIO_21/TDM2_RFS Y23 IO OVDD - HDLC2_RTS_B/GPIO_22/TDM2_STROBE_B/C FG_RESET_SOURCE[3] U20 IO OVDD - Power AVDD1 L16 - - - AVDD2 M16 - - - AVDD3 N8 - - - GVDD F6, G6, H6, J6, K6, L6, N6, P6, R6, T6, U6, V6, V7 - - - NVDD F7, F8, F9, F10, F11, F12, F13,F14, F15, F16, F17, F18, G18,H18, J18, L18, M18, N18, P18,R18, T18, U18, V8, V9, V10, V11, V12, V13, V14, V15, V16, V17, V18 - - - MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 63 Package and Pin Listings VDD H8,H9,H10,H11,H12,M8, H13,N16,H14,H15,H16, P16,P8,L8,K16,J16,K8,J 8,R8,T16,R16,T8,T9,T11 ,T10,T12,T13,T14,T15 - - - VSS A1, C3, F22, J14, K14, M15, L15, N20, R9, Y21, T20, AB21, B1, C22,G4, K15, J15, M2, M22, P9, R10, V2, AA2, AC1, B4,D5, G20, J22, K20, M5, N9, P10, R11, V22, AA22,AC23, B6, D8, J2, K4, M9,L9, N10, P11, R12, W4, AB4, D11, B9, J9, K9, L10,M10, N11, P12, R13, Y7,AB6, B12, D14, J10, K10, L11, M11, P13, N12, R14, Y10,AB9, B15, D17, J11, K11, D20, B18, J12, K12, L13, L12, L14, K13, J13, F2, B21, M14, M13, M12, Y19, Y16, AB15, AB12, Y13, N13, N14, N15, P14, P15, R2, AB18, R15, R21, T4 - - - NC A23 - - - Notes 1. This pin is an open drain signal. A weak pull-up resistor should be placed on this pin to OVDD 2 This pin has weak pull-up that is always enabled. 4. OVDD here refers to NVDDA, NVDDB,NVDDC, NVDDF, NVDDG, and NVDDH from the ball map. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 64 Freescale Semiconductor Clocking 23 Clocking The following figure shows the internal distribution of clocks within the MPC8309. MPC8309 e300c3 core Core PLL core_clk Rest of the System /n csb_clk to DDR memory controller DDR Clock Divider /2 MEMC_MCK DDR Memory Device MEMC_MCK ddr_clk Clock Unit System PLL lbc_clk /n to local bus SYS_XTAL_OUT CRYSTAL csb_clk to rest of the device SYS_XTAL_IN LBC Clock Divider LCLK[0:1] Local Bus Memory Device PCI_SYNC_IN SYS_CLK_IN PCI_SYNC_OUT PCI Clock Divider PCI_CLK[0:2] CFG_CLKIN_DIV QE_CLK_IN QE PLL CLK Gen qe_clk QE Block Figure 45. MPC8309 Clock Subsystem The primary clock source for the MPC8309 can be one of three inputs,Crystal(SYS_XTAL_IN ), SYS_CLK_IN or PCI_SYNC_IN, depending on whether the device is configured in PCI host or PCI agent mode, respectively. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 65 Clocking 23.1 Clocking in PCI Host Mode When the MPC8309 is configured as a PCI host device (RCWH[PCIHOST] = 1), SYS_CLK_IN is its primary input clock. SYS_CLK_IN feeds the PCI clock divider (2) and the PCI_SYNC_OUT and PCI_CLK multiplexors. The CFG_CLKIN_DIV configuration input selects whether SYS_CLK_IN or SYS_CLK_IN/2 is driven out on the PCI_SYNC_OUT signal. PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN, with equal delay to all PCI agent devices in the system. 23.1.1 PCI Clock Outputs (PCI_CLK[0:2]) When the MPC8309 is configured as a PCI host, it provides three separate clock output signals, PCI_CLK[0:2], for external PCI agents. When the device comes out of reset, the PCI clock outputs are disabled and are actively driven to a steady low state. Each of the individual clock outputs can be enabled (enable toggling of the clock) by setting its corresponding OCCR[PCICOEn] bit. All output clocks are phase-aligned to each other. 23.2 Clocking in PCI Agent Mode When the MPC8309 is configured as a PCI agent device, PCI_SYNC_IN is the primary input clock. In agent mode, the SYS_CLK_IN signal should be tied to GND, and the clock output signals, PCI_CLKn and PCI_SYNC_OUT, are not used. 23.3 System Clock Domains As shown in Figure 45, the primary clock input (frequency) is multiplied up by the system phase-locked loop (PLL) and the clock unit to create four major clock domains: • The coherent system bus clock (csb_clk) • The QUICC Engine clock (qe_clk) • The internal clock for the DDR controller (ddr_clk) • The internal clock for the local bus controller (lbc_clk) The csb_clk frequency is derived from the following equation: csb_clk = [PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV)] × SPMF Eqn. 1 In PCI host mode, PCI_SYNC_IN = SYS_CLK_IN (1 + ~CFG_CLKIN_DIV) . Eqn. 2 The csb_clk serves as the clock input to the e300 core. A second PLL inside the core multiplies up the csb_clk frequency to create the internal clock for the core (core_clk). The system and core PLL multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL) which is loaded at power-on reset or by one of the hard-coded reset options. For more information, see the Reset MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 66 Freescale Semiconductor Clocking Configuration chapter in the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual. The qe_clk frequency is determined by the QUICC Engine PLL multiplication factor (RCWL[CEPMF]) and the QUICC Engine PLL division factor (RCWL[CEPDF]) as the following equation: qe_clk = (QE_CLK_IN × CEPMF)  (1 + CEPDF) Eqn. 3 For more information, see the QUICC Engine PLL Multiplication Factor section and the “QUICC Engine PLL Division Factor” section in the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual for more information. The DDR SDRAM memory controller operates with a frequency equal to twice the frequency of csb_clk. Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the same frequency as ddr_clk. The local bus memory controller operates with a frequency equal to the frequency of csb_clk. Note that lbc_clk is not the external local bus frequency; lbc_clk passes through the LBC clock divider to create the external local bus clock outputs (LCLK). The LBC clock divider ratio is controlled by LCRR[CLKDIV]. For more information, see the LBC Bus Clock and Clock Ratios section in the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual. In addition, some of the internal units may be required to be shut off or operate at lower frequency than the csb_clk frequency. These units have a default clock ratio that can be configured by a memory mapped register after the device comes out of reset. The following table specifies which units have a configurable clock frequency. For detailed description, refer to the “System Clock Control Register (SCCR)” section in the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual. Table 56. Configurable Clock Units Unit Default Frequency I2C,SDHC, USB, DMA Complex csb_clk Options Off, csb_clk, csb_clk/2, csb_clk/3 NOTE Setting the clock ratio of these units must be performed prior to any access to them. The following table provides the maximum operating frequencies for the MPC8309 MAPBGA under recommended operating conditions (see Table 2). Table 57. Operating Frequencies for MAPBGA Characteristic1 Max Operating Frequency Unit e300 core frequency (core_clk) 417 MHz Coherent system bus frequency (csb_clk) 167 MHz QUICC Engine frequency (qe_clk) 233 MHz MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 67 Clocking Table 57. Operating Frequencies for MAPBGA (continued) Characteristic1 DDR2 memory bus frequency (MCLK)2 Local bus frequency (LCLKn) 3 Max Operating Frequency Unit 167 MHz 66 MHz Notes: 1. The SYS_CLK_IN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk, MCLK, LCLK, and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. 2. The DDR2 data rate is 2× the DDR2 memory bus frequency. 3. The local bus frequency is 1/2, 1/4, or 1/8 of the lb_clk frequency (depending on LCRR[CLKDIV]) which is in turn 1× or 2× the csb_clk frequency (depending on RCWL[LBCM]). 23.4 System PLL Configuration The system PLL is controlled by the RCWL[SPMF] parameter. Table 58 shows the multiplication factor encodings for the system PLL. NOTE System PLL VCO frequency = 2 × (CSB frequency) × (System PLL VCO divider). The VCO divider needs to be set properly so that the System PLL VCO frequency is in the range of 450–750 MHz. Table 58. System PLL Multiplication Factors RCWL[SPMF] System PLL Multiplication Factor 0000 Reserved 0001 Reserved 0010 ×2 0011 ×3 0100 ×4 0101 ×5 0110 ×6 0111–1111 Reserved As described in Section 23, “Clocking,” the LBCM, DDRCM, and SPMF parameters in the reset configuration word low select the ratio between the primary clock input (SYS_CLK_IN) and the internal coherent system bus clock (csb_clk). The following table shows the expected frequency values for the CSB frequency for selected csb_clk to SYS_CLK_IN ratios. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 68 Freescale Semiconductor Clocking Table 59. CSB Frequency Options PCI_SYNC_IN(MHz) SPMF csb_clk : sys_clk_in Ratio 25 33.33 66.67 csb_clk Frequency (MHz) 23.5 0010 2:1 0011 3:1 0100 4:1 0101 5:1 0110 6:1 133 133 125 167 Core PLL Configuration RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300 core clock (core_clk). The following table shows the encodings for RCWL[COREPLL]. COREPLL values not listed, and should be considered reserved. Table 60. e300 Core PLL Configuration RCWL[COREPLL] 0-1 2-5 core_clk : csb_clk Ratio VCO Divider 6 nn 0000 n PLL bypassed (PLL off, csb_clk clocks core directly) PLL bypassed (PLL off, csb_clk clocks core directly) 00 0001 0 1:1 2 01 0001 0 1:1 4 10 0001 0 1:1 8 11 0001 0 1:1 8 00 0001 1 1.5:1 2 01 0001 1 1.5:1 4 10 0001 1 1.5:1 8 11 0001 1 1.5:1 8 00 0010 0 2:1 2 01 0010 0 2:1 4 10 0010 0 2:1 8 11 0010 0 2:1 8 00 0010 1 2.5:1 2 01 0010 1 2.5:1 4 10 0010 1 2.5:1 8 11 0010 1 2.5:1 8 00 0011 0 3:1 2 MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 69 Clocking Table 60. e300 Core PLL Configuration (continued) RCWL[COREPLL] 0-1 2-5 core_clk : csb_clk Ratio VCO Divider 6 01 0011 0 3:1 4 10 0011 0 3:1 8 11 0011 0 3:1 8 NOTE Core VCO frequency = core frequency  VCO divider. The VCO divider (RCWL[COREPLL[0:1]]), must be set properly so that the core VCO frequency is in the range of 400–800 MHz. 23.6 QUICC Engine PLL Configuration The QUICC Engine PLL is controlled by the RCWL[CEPMF] and RCWL[CEPDF] parameters. The following table shows the multiplication factor encodings for the QUICC Engine PLL. Table 61. QUICC Engine PLL Multiplication Factors RCWL[CEPMF] RCWL[CEPDF] QUICC Engine PLL Multiplication Factor = RCWL[CEPMF]/ (1 + RCWL[CEPDF) 00000–00001 0 Reserved 00010 0 2 00011 0 3 00100 0 4 00101 0 5 00110 0 6 00111 0 7 01000 0 8 01001–11111 0 Reserved The RCWL[CEVCOD] denotes the QUICC Engine PLL VCO internal frequency as shown in the following table. Table 62. QUICC Engine PLL VCO Divider RCWL[CEVCOD] VCO Divider 00 2 01 4 10 8 11 Reserved MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 70 Freescale Semiconductor Clocking NOTE The VCO divider (RCWL[CEVCOD]) must be set properly so that the QUICC Engine VCO frequency is in the range of 300–600 MHz. The QUICC Engine frequency is not restricted by the CSB and core frequencies. The CSB, core, and QUICC Engine frequencies should be selected according to the performance requirements. The QUICC Engine VCO frequency is derived from the following equations: qe_clk = (primary clock input × CEPMF)  (1 + CEPDF) QUICC Engine VCO Frequency = qe_clk × VCO divider × (1 + CEPDF) 23.7 Suggested PLL Configurations To simplify the PLL configurations, the MPC8309 might be separated into two clock domains. The first domain contains the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock domains are independent, and each of their PLLs is configured separately. The following table shows suggested PLL configurations for 33 and 66 MHz input clocks. Table 63. Suggested PLL Configurations CEDF Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz) QUICC Engine Frequency (MHz) Conf No. SPMF Core PLL 1 0100 0000100 0111 0 33.33 133.33 266.66 233 2 0010 0000100 0111 1 66.67 133.33 266.66 233 3 0100 0000101 0111 0 33.33 133.33 333.33 233 4 0101 0000101 1001 0 25 125 312.5 225 5 0010 0000101 0111 1 66.67 133.33 333.33 233 6 0100 0000110 0111 0 33.33 133.33 399.96 233 7 0101 0000110 1000 0 25 125 375 225 8 0010 0000110 0011 0 66.67 133.33 399.96 233 9 0101 0000101 0111 0 33.33 166.67 416.67 233 CEPMF MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 71 Thermal 24 Thermal This section describes the thermal specifications of the MPC8309. 24.1 Thermal Characteristics The following table provides the package thermal characteristics for the 369, 19  19 mm MAPBGA of the MPC8309. Table 64. Package Thermal Characteristics for MAPBGA Characteristic Board type Symbol Value Unit Notes Junction-to-ambient natural convection Single-layer board (1s) RJA 40 °C/W 1, 2 Junction-to-ambient natural convection Four-layer board (2s2p) RJA 25 °C/W 1, 2, 3 Junction-to-ambient (@200 ft/min) Single-layer board (1s) RJMA 33 °C/W 1, 3 Junction-to-ambient (@200 ft/min) Four-layer board (2s2p) RJMA 22 °C/W 1, 3 Junction-to-board — RJB 15 °C/W 4 Junction-to-case — RJC 9 °C/W 5 Natural convection JT 2 °C/W 6 Junction-to-package top Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 24.1.1 Thermal Management Information For the following sections, PD = (VDD  IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 24.1.2 Estimation of Junction Temperature with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RJA  PD) Eqn. 1 where: TJ = junction temperature (C) MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 72 Freescale Semiconductor Thermal TA = ambient temperature for the package (C) RJA = junction-to-ambient thermal resistance (C/W) PD = power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. As a general statement, the value obtained on a single layer board is appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 24.1.3 Estimation of Junction Temperature with Junction-to-Board Thermal Resistance The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal resistance. The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device. At a known board temperature, the junction temperature is estimated using the following equation: TJ = TB + (RJB  PD) Eqn. 2 where: TJ = junction temperature (C) TB = board temperature at the package perimeter (C) RJB = junction-to-board thermal resistance (C/W) per JESD51-8 PD = power dissipation in package (W) When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes. 24.1.4 Experimental Determination of Junction Temperature To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (JT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (JT  PD) Eqn. 3 where: TJ = junction temperature (C) MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 73 Thermal TT = thermocouple temperature on top of package (C) JT = thermal characterization parameter (C/W) PD = power dissipation in package (W) The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 24.1.5 Heat Sinks and Junction-to-Case Thermal Resistance In some application environments, a heat sink is required to provide the necessary thermal management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a case to ambient thermal resistance as shown in the following equation: RJA = RJC + RCA Eqn. 4 where: RJA = junction-to-ambient thermal resistance (C/W) RJC = junction-to-case thermal resistance (C/W) RCA = case-to-ambient thermal resistance (C/W) RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been simulated with a few commercially available heat sinks. The heat sink choice is determined by the application environment (temperature, air flow, adjacent component power dissipation) and the physical space available. Because there is not a standard application environment, a standard heat sink is not required. Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. 24.2 Heat Sink Attachment When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 74 Freescale Semiconductor System Design Information lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force. If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic surfaces and its performance verified under the application requirements. 24.2.1 Experimental Determination of the Junction Temperature with a Heat Sink When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance using the following equation: TJ = TC + (RJC  PD) Eqn. 5 where: TC = case temperature of the package (C) RJC = junction-to-case thermal resistance (C/W) PD = power dissipation (W) 25 System Design Information This section provides electrical and thermal design recommendations for successful application of the MPC8309. 25.1 System Clocking The MPC8309 includes three PLLs. • The system PLL (AVDD2) generates the system clock from the externally supplied SYS_CLK_IN input. The frequency ratio between the system and SYS_CLK_IN is selected using the system PLL ratio configuration bits as described in Section 23.4, “System PLL Configuration.” • The e300 core PLL (AVDD3) generates the core clock as a slave to the system clock. The frequency ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio configuration bits as described in Section 23.5, “Core PLL Configuration.” • The QUICC Engine PLL (AVDD1) which uses the same reference as the system PLL. The QUICC Engine block generates or uses external sources for all required serial interface clocks. MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 75 System Design Information 25.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins. The voltage level at each AVDDn pin should always be equivalent to VDD, and preferably these voltages are derived directly from VDD through a low frequency filter scheme such as the following. There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent filter circuits as illustrated in Figure 46, one to each of the three AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD pin, which is on the periphery of package, without the inductance of vias. The following figure shows the PLL power supply filter circuit. VDD 10 AVDD 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors (