Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC8314EEC
Rev. 2, 11/2011
MPC8314E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8314E
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8314E contains a core built on Power Architecture™
technology. It is a cost-effective, low-power, highly
integrated host processor that addresses the requirements of
several storage, consumer, and industrial applications,
including main CPUs and I/O processors in network attached
storage (NAS), voice over IP (VoIP) router/gateway,
intelligent wireless LAN (WLAN), set top boxes, industrial
controllers, and wireless access points. The MPC8314E
extends the PowerQUICC II Pro family, adding higher CPU
performance, new functionality, and faster interfaces while
addressing the requirements related to time-to-market, price,
power consumption, and package size. Note that while the
MPC8314E supports a security engine, the MPC8314 does
not.
© Freescale Semiconductor, Inc., 2011. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
MPC8314E Features . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 13
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 15
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 16
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Ethernet: Three-Speed Ethernet, MII Management . 22
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 49
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
TDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 72
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
System Design Information . . . . . . . . . . . . . . . . . . . 95
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 98
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Overview
1
Overview
The MPC8314E incorporates the e300c3 (MPC603e-based) core, which includes 16 Kbytes of L1
instruction and data caches, on-chip memory management units (MMUs), and floating-point support. In
addition to the e300 core, the SoC platform includes features such as dual enhanced three-speed 10, 100,
1000 Mbps Ethernet controllers (eTSECs) with SGMII support, a 32- or 16-bit DDR1/DDR2 SDRAM
memory controller, a security engine to accelerate control and data plane security protocols, and a high
degree of software compatibility with previous-generation PowerQUICC processor-based designs for
backward compatibility and easier software migration. The MPC8314E also offers peripheral interfaces
such as a 32-bit PCI interface with up to 66 MHz operation, 16-bit enhanced local bus interface with up to
66 MHz operation, TDM interface, and USB 2.0 with an on-chip USB 2.0 PHY.
8314E offers additional high-speed interconnect support with dual single-lane PCI Express interfaces.
When not used for PCI Express, the SerDes interface may be configured to support SGMII. The
MPC8314E security engine (SEC 3.3) allows CPU-intensive cryptographic operations to be offloaded
from the main CPU core. This figure shows a block diagram of the MPC8314E.
MPC8314E
e300c3 Core with
Power Management
Security
Engine 3.3
DUART
I2C
Timers
GPIO
I/O
Sequencer
(IOS)
PCI
16-KB
I-Cache
Interrupt
Controller
16-KB
D-Cache
FPU
PCI
Express
PCI
Express
x1
x1
TDM
USB 2.0 HS
Host/Device/OTG
ULPI
On-Chip
HS PHY
Enhanced
Local Bus,
SPI
DDR1/DDR2
Controller
eTSEC
eTSEC
RGMII, (R)MII
RTBI, SGMII
RGMII, (R)MII
RTBI, SGMII
DMA
Note: The MPC8314 do not include a security engine.
Figure 1. MPC8314E Block Diagram
2
MPC8314E Features
The following features are supported in the MPC8314E.
2.1
e300 Core
The e300 core has the following features:
• Operates at up to 400 MHz
• 16-Kbyte instruction cache, 16-Kbyte data cache
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
MPC8314E Features
•
•
•
2.2
One floating point unit and two integer units
Software-compatible with the Freescale processor families implementing the PowerPC
Architecture
Performance monitor
Serial Interfaces
The following interfaces are supported in the MPC8314E.
• Two enhanced TSECs (eTSECs)
• Two Ethernet interfaces using one RGMII/MII/RMII/RTBI or SGMII (no GMII)
• Dual UART, one I2C, and one SPI interface
2.3
Security Engine
The security engine is optimized to handle all the algorithms associated with IPSec, 802.11i, and iSCSI.
The security engine contains one crypto-channel, a controller, and a set of crypto execution units (EUs).
The execution units are:
• Public key execution unit (PKEU)
— RSA and Diffie-Hellman (to 4096 bits)
— Programmable field size up to 2048 bits
— Elliptic curve cryptography (1023 bits)
— F2m and F(p) modes
— Programmable field size up to 511 bits
• Data encryption standard execution unit (DEU)
— DES, 3DES
— Two key (K1, K2) or three key (K1, K2, K3)
— ECB, CBC, CFB-64 and OFB-64 modes for both DES and 3DES
• Advanced encryption standard unit (AESU)
— Implements the Rinjdael symmetric key cipher
— Key lengths of 128, 192, and 256 bits
— ECB, CBC, CCM, CTR, GCM, CMAC, OFB, CFB, XCBC-MAC and LRW modes
— XOR acceleration
• Message digest execution unit (MDEU)
— SHA with 160-bit, 256-bit, 384-bit and 512-bit message digest
— SHA-384/512
— MD5 with 128-bit message digest
— HMAC with either algorithm
• Random number generator (RNG)
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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3
MPC8314E Features
•
2.4
— Combines a True Random Number Generator (TRNG) and a NIST-approved Pseudo-Random
Number Generator (PRNG) (as described in Annex C of FIPS140-2 and ANSI X9.62).
Cyclical Redundancy Check Hardware Accelerator (CRCA)
— Implements CRC32C as required for iSCSI header and payload checksums, CRC32 as required
for IEEE 802 packets, as well as for programmable 32 bit CRC polynomials
DDR Memory Controller
The DDR1/DDR2 memory controller includes the following features:
• Single 16- or 32-bit interface supporting both DDR1 and DDR2 SDRAM
• Support for up to 266 MHz data rate
• Support for two physical banks (chip selects), each bank independently addressable
• 64-Mbit to 2-Gbit (for DDR1) and to 4-Gbit (for DDR2) devices with x8/x16 data ports (no direct
x4 support)
• Support for one 16-bit device or two 8-bit devices on a 16-bit bus or two 16-bit devices on a 32-bit
bus
• Support for up to 16 simultaneous open pages
• Supports auto refresh
• On-the-fly power management using CKE
• 1.8-/2.5-V SSTL2 compatible I/O
2.5
PCI Controller
The PCI controller includes the following features:
• Designed to comply with PCI Local Bus Specification Revision 2.3
• Single 32-bit data PCI interface operates at up to 66 MHz
• PCI 3.3-V compatible (not 5-V compatible)
• Support for host and agent modes
• On-chip arbitration, supporting three external masters on PCI
• Selectable hardware-enforced coherency
2.6
TDM Interface
The TDM interface includes the following features:
• Independent receive and transmit with dedicated data, clock and frame sync line
• Separate or shared RCK and TCK whose source can be either internal or external
• Glueless interface to E1/T1 frames and MVIP, SCAS, and H.110 buses
• Up to 128 time slots, where each slot can be programmed to be active or inactive
• 8- or 16-bit word widths
• The TDM Transmitter Sync Signal (TFS), Transmitter Clock Signal (TCK) and Receiver Clock
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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MPC8314E Features
•
•
•
•
•
2.7
Signal (RCK) can be configured as either input or output
Frame sync and data signals can be programmed to be sampled either on the rising edge or on the
falling edge of the clock
Frame sync can be programmed as active low or active high
Selectable delay (0–3 bits) between the Frame Sync signal and the beginning of the frame
MSB or LSB first support
USB Dual-Role Controller
The USB controller includes the following features:
• Designed to comply with USB Specification, Rev. 2.0
• Supports operation as a stand-alone USB device
— Supports one upstream facing port
— Supports three programmable USB endpoints
• Supports operation as a stand-alone USB host controller
— Supports USB root hub with one downstream-facing port
— Enhanced host controller interface (EHCI) compatible
• Supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operation.
Low-speed operation is supported only in host mode.
• Supports UTMI+ low pin interface (ULPI) or on-chip USB-2.0 full-speed/high-speed PHY
• Supports USB on-the-go mode, which includes both device and host functionality, when using an
external ULPI PHY
2.8
Dual PCI Express Interfaces
The PCI Express interfaces have the following features:
• PCI Express 1.0a compatible
• x1 link width
• Selectable operation as root complex or endpoint
• Both 32- and 64-bit addressing
• 128-byte maximum payload size
• Support for MSI and INTx interrupt messages
• Virtual channel 0 only
• Selectable Traffic Class
• Full 64-bit decode with 32-bit wide windows
• Dedicated descriptor based DMA engine per interface with separate read and write channels
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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MPC8314E Features
2.9
Dual Enhanced Three-Speed Ethernet Controllers (eTSECs)
The eTSECs include the following features:
• Two SGMII/RGMII/MII/RMII/RTBI interfaces
• Two controllers designed to comply with IEEE Std 802.3™, IEEE 802.3u™, IEEE 802.3x™,
IEEE 802.3z™, IEEE 802.3au™, IEEE 802.3ab™, and IEEE Std 1588™
• Support for Wake-on-Magic Packet™, a method to bring the device from standby to full operating
mode
• MII management interface for external PHY control and status.
2.10
Integrated Programmable Interrupt Controller (IPIC)
The integrated programmable interrupt controller (IPIC) provides a flexible solution for general-purpose
interrupt control. The IPIC programming model is compatible with the MPC8260 interrupt controller and
supports external and internal discrete interrupt sources. Interrupts can also be redirected to an external
interrupt controller.
2.11
Power Management Controller (PMC)
The MPC8314E supports a range of power management states that significantly lower power consumption
under the control of the power management controller. The PMC includes the following features:
• Provides power management when the device is used in both PCI host and agent modes
• PCI Power Management 1.2 D0, D1, D2, D3hot, and D3cold states
• PME generation in PCI agent mode, PME detection in PCI host mode
• Wake-up from Ethernet (magic packet), USB, GPIO, and PCI (PME input as host) while in the D1,
D2 and D3hot states
• A new low-power standby power management state called D3warm
— The PMC, one Ethernet port, and the GTM block remain powered via a split power supply
controlled through an external power switch
— Wake-up events include Ethernet (magic packet), GTM, GPIO, or IRQ inputs and cause the
device to transition back to normal operation
— PCI agent mode is not be supported in D3warm state
• PCI Express-based PME events are not supported
2.12
Serial Peripheral Interface (SPI)
The serial peripheral interface (SPI) allows the MPC8314E to exchange data between other PowerQUICC
family chips, Ethernet PHYs for configuration, and peripheral devices such as EEPROMs, real-time
clocks, A/D converters, and ISDN devices.
The SPI is a full-duplex, synchronous, character-oriented channel that supports a four-wire interface
(receive, transmit, clock, and slave select). The SPI block consists of transmitter and receiver sections, an
independent baud-rate generator, and a control unit.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Electrical Characteristics
2.13
DMA Controller, I2C, DUART, Enhanced Local Bus Controller
(eLBC), and Timers
The integrated four-channel DMA controller includes the following features:
• Allows chaining (both extended and direct) through local memory-mapped chain descriptors
(accessible by local masters)
• Misaligned transfer capability for source/destination address
• Supports external DREQ, DACK and DONE signals
There is one I2C controller. This synchronous, multi-master buses can be connected to additional devices
for expansion and system development.
The DUART supports full-duplex operation and is compatible with the PC16450 and PC16550
programming models. 16-byte FIFOs are supported for both the transmitter and the receiver.
The eLBC port allows connections with a wide variety of external DSPs and ASICs. Three separate state
machines share the same external pins and can be programmed separately to access different types of
devices. The general-purpose chip select machine (GPCM) controls accesses to asynchronous devices
using a simple handshake protocol. The three user programmable machines (UPMs) can be programmed
to interface to synchronous devices or custom ASIC interfaces. Each chip select can be configured so that
the associated chip interface can be controlled by the GPCM or UPM controller. Both may exist in the
same system. The local bus can operate at up to 66 MHz.
The system timers include the following features: periodic interrupt timer, real time clock, software
watchdog timer, and two general-purpose timer blocks.
3
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8314E, which is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but they are included for complete reference. These are not purely I/O buffer
design specifications.
3.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
3.1.1
Absolute Maximum Ratings
This table provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit
Note
Core supply voltage
VDD
–0.3 to 1.26
V
—
PLL supply voltage
AVDD
–0.3 to 1.26
V
—
DDR1 DRAM I/O supply voltage
GVDD
–0.3 to 2.7
V
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
7
Electrical Characteristics
Table 1. Absolute Maximum Ratings 1 (continued)
Characteristic
Symbol
Max Value
Unit
Note
DDR2 DRAM I/O supply voltage
GVDD
–0.3 to 1.9
V
—
PCI, local bus, DUART, system control and power
management, I2C, Ethernet management, 1588 timer and
JTAG I/O voltage
NVDD
–0.3 to 3.6
V
7
USB, and eTSEC I/O voltage
LVDD
–0.3 to 2.75 or
–0.3 to 3.6
V
6, 8
USB_PLL_PWR1
–0.3 to 1.26
V
—
USB_PLL_PWR3,
USB_VDDA_BIAS,
VDDA
–0.3 to 3.6
V
—
XCOREVDD,
XPADVDD,
SDAVDD
–0.3 to 1.26
V
—
MVIN
–0.3 to (GVDD + 0.3)
V
2, 4
MVREF
–0.3 to (GVDD + 0.3)
V
2, 4
eTSEC signals
LVIN
–0.3 to (LVDD + 0.3)
V
3, 4
Local bus, DUART, SYS_CLK_IN, system
control and power management, I2C, and
JTAG signals
NVIN
–0.3 to (NVDD + 0.3)
V
3, 4
PCI
NVIN
–0.3 to (NVDD + 0.3)
V
5
TSTG
–55 to150
C
—
PHY voltage
USB PHY
SERDES PHY
Input voltage
DDR DRAM signals
DDR DRAM reference
Storage temperature range
Note:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: (N,L)VIN must not exceed (N,L)VDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms
during power-on reset and power-down sequences.
4. (M,N,L)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
5. NVIN on the PCI interface may overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 2.
6. The max value of supply voltage should be selected based on the RGMII mode.
7. NVDD means NVDD1_OFF, NVDD1_ON, NVDD2_OFF, NVDD2_ON, NVDD3_OFF, NVDD4_OFF
8. LVDD means LVDD1_OFF and LVDD2_ON
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Electrical Characteristics
3.1.2
Power Supply Voltage Specification
This table provides the recommended operating conditions for theMPC8314E. Note that the values in this
table are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 2. Recommended Operating Conditions
Symbol
Recommended
Value1
Unit
Status in D3
Warm mode
Note
SerDes internal digital power
XCOREVDD
1.0 ± 50 mv
V
Switched Off
—
SerDes internal digital power
XCOREVSS
0.0
V
—
—
SerDes I/O digital power
XPADVDD
1.0 ± 50 mv
V
Switched Off
—
SerDes I/O digital power
XPADVSS
0.0
V
—
—
SerDes analog power for PLL
SDAVDD
1.0 ± 50 mv
V
Switched Off
—
SerDes analog power for PLL
SDAVSS
0.0
V
—
—
Dedicated 3.3 V analog power for USB PLL
USB_PLL_PWR3
3.3 ± 165mv
V
Switched Off
—
Dedicated 1.0 Vanalog power for USB PLL
USB_PLL_PWR1
1.0 ± 50 mv
V
Switched Off
—
USB_PLL_GND
0.0
V
—
—
Dedicated USB power for USB bias circuit
USB_VDDA_BIAS
3.3 ± 300 mv
V
Switched Off
—
Dedicated USB ground for USB bias circuit
USB_VSSA_BIAS
0.0
V
—
—
Dedicated power for USB transceiver
USB_VDDA
3.3 ± 300 mv
V
Switched Off
—
Dedicated ground for USB transceiver
USB_VSSA
0.0
V
—
—
Core supply voltage
VDD
1.0 ± 50 mv
V
Switched Off
—
Core supply voltage
VDDC
1.0 ± 50 mv
V
Switched On
—
Analog power for e300 core APLL
AVDD1
1.0 ± 50 mv
V
Switched Off
6
Analog power for system APLL
AVDD2
1.0 ± 50 mv
V
Switched On
6
DDR and DDR2 DRAM I/O voltage
GVDD
2.5 ± 200 mv
1.8 ± 100 mv
V
Switched Off
—
MVREF
GVDD /2
V
Switched Off
—
Standard I/O voltage
NVDD1_ON
3.3 ± 300 mv
V
Switched On
1
Standard I/O voltage
NVDD2_ON
3.3 ± 300 mv
V
Switched On
1
Standard I/O voltage
NVDD1_OFF
3.3 ± 300 mv
V
Switched Off
2
Standard I/O voltage
NVDD2_OFF
3.3 ± 300 mv
V
Switched Off
2
Standard I/O voltage
NVDD3_OFF
3.3 ± 300 mv
V
Switched Off
2
Standard I/O voltage
NVDD4_OFF
3.3 ± 300 mv
V
Switched Off
2
eTSEC/USBdr I/O supply
LVDD1_OFF
2.5 ± 125 mv
3.3 ± 300 mv
V
Switched Off
—
eTSEC I/O supply
LVDD2_ON
2.5 ± 125 mv
3.3 ± 300 mv
V
Switched On
—
VSS
0.0
V
—
—
TA/TJ
0 to105
C
—
3
Characteristic
Dedicated analog ground for USB PLL
Differential reference voltage for DDR and DDR2
controller
Analog and digital ground
Junction temperature range
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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9
Electrical Characteristics
Table 2. Recommended Operating Conditions (continued)
Characteristic
Symbol
Recommended
Value1
Unit
Status in D3
Warm mode
Note
Note:
1. The NVDDx_ON are static power supplies and can be connected together.
2. The NVDDx_OFF are switchable power supplies and can be connected together.
3. Minimum Temperature is specified with TA;maximum temperature is specified with TJ.
4. All Power rails must be connected and power applied to the MPC8314 even if the IP interfaces are not used.
5. All I/O pins should be interfaced with peripherals operating at same voltage level.
6. This voltage is the input to the filter discussed in Section 25.2, “PLL Power Supply Filtering” and not necessarily the voltage
at the AVDD pin.
7. All 1V power supplies should be derived from the same source.
This figure shows the undershoot and overshoot voltages at the interfaces of the MPC8314E.
G/L/NVDD + 20%
G/L/NVDD + 5%
VIH
G/L/NVDD
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tinterface1
Note:
1. tinterface refers to the clock period associated with the bus clock interface.
Figure 2. Overshoot/Undershoot Voltage for GVDD/NVDD/LVDD
3.1.3
Output Driver Characteristics
This table provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 3. Output Drive Capability
Output
Impedance ()
Supply
Voltage
Local bus interface utilities signals
42
NVDD = 3.3 V
PCI signals
25
Driver Type
DDR signal
1
DDR2 signal 1
18
GVDD = 2.5 V
18
GVDD = 1.8 V
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Electrical Characteristics
Table 3. Output Drive Capability (continued)
Output
Impedance ()
Supply
Voltage
DUART, system control, I2C, JTAG,SPI
42
NVDD = 3.3 V
GPIO signals
42
NVDD = 3.3 V
eTSEC
42
LVDD = 3.3 V / 2.5 V
Driver Type
1
3.2
Output Impedance can also be adjusted through configurable options in DDR
Control Driver Register (DDRCDR). See the MPC8315E PowerQUICC II Pro
Integrated Host Processor Family Reference Manual.
Power Sequencing
The MPC8314E does not require the core supply voltage (VDD and VDDC) and I/O supply voltages
(GVDD, LVDDx_ON, LVDDx_OFF, NVDDx_ON and NVDDx_OFF) to be applied in any particular
order. During the power ramp up, before the power supplies are stable, if the I/O voltages are supplied
before the core voltage, there may be a period of time when all input and output pins be actively driven
and cause contention and/or excessive current. In order to avoid actively driving the I/O pins and to
eliminate excessive current draw, apply the continuous core voltage (VDDC) before the continuous I/O
voltages (LVDDx_ON and NVDDx_ON) and switchable core voltage (VDD) before the switchable I/O
voltages (GVDD, LVDDx_OFF, and NVDDx_OFF). PORESET should be asserted before the continuous
power supplies fully ramp up. In the case where the core voltage is applied first, the core voltage supply
must rise to 90% of its nominal value before the I/O supplies reach 0.7 V, see Figure 3. Once all the power
supplies are stable, wait for a minimum of 32 clock cycles before negating PORESET.
The I/O power supply ramp-up slew rate should be slower than 4V/100 s, this requirement is for ESD
circuit.
This figure shows the power-up sequencing for switchable and continuous supplies.
Continuous I/O Voltage
V
Switchable I/O Voltage
V
Switchable Core Voltage (VDD)
Continuous Core Voltage
0.7 V
90%
0.7 V
90%
t
t
Power sequence for continuous power supplies
Power sequence for switchable power supplies
Figure 3. Power-Up Sequencing
When switching from normal mode to D3 warm (standby) mode, first turn off the switchable I/O voltage
supply and then turn off the switchable core voltage supply. Similarly, when switching from D3 warm
(standby) mode to normal mode, first turn on the switchable core voltage supply and then turn on the
switchable I/O voltage supply.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
11
Power Characteristics
CAUTION
When the device is in D3 warm (standby) mode, all external voltage
supplies applied to any I/O pins, with the exception of wake-up pins, must
be turned off. Applying supplied external voltage to any I/O pins, except the
wake up pins, while the device is in D3 warm standby mode may cause
permanent damage to the device.
An example of the power-up sequence is shown in Figure 4 when implemented along with low power D3
warm mode.
Continuous I/O Voltage
(LVDDx_ON, NVDDx_ON)
V
Switchable I/O Voltage
(GVDD, LVDDx_OFF, NVDDx_OFF)
Continuous Core Voltage
VDDC
Switchable Core Voltage
(VDD)
90%
t
0
PORESET
tSYS_CLK_IN / tPCI_SYNC_IN >= 32 clock
Figure 4. Power Up Sequencing Example with Low power D3 Warm Mode
4
Power Characteristics
This table shows the estimated typical power dissipation for this family of devices.
Table 4. MPC8314E Power Dissipation
(Does not include I/O power dissipation)
Core Frequency (MHz)
CSB Frequency (MHz)
Typical 1,3
Maximum 1,2
Unit
266
133
1.116
1.646
W
333
133
1.142
1.665
W
400
133
1.167
1.690
W
Note:
1. The values do not include I/O supply power, but do include core, AVDD, USB PLL, and digital SerDes power.
2. Maximum power is based on a voltage of Vdd = 1.05V, a junction temperature of Tj = 105°C, and an artificial
smoker test.
3. Typical power is based on a voltage of Vdd = 1.05V, and an artificial smoker test running at room temperature.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Clock Input Timing
This table shows the estimated typical I/O power dissipation for this family of devices.
Table 5. MPC8314E Power Dissipation
Interface
GVDD GVDD NVDD
Frequency
(1.8 V) (2.5 V) (3.3 V)
SATA_VDD, XCOREVDD,
LVDD1_OFF/ LVDD2 VDD33PLL,
VDD1IO,
XPADVDD,
LVDD2_ON
_ON VDD33ANA
VDD1ANA
SDAVDD
(3.3V)
(3.3V)
(3.3V)
(1.0V)
(1.0V)
Unit
DDR 1
Rs = 22
Rt = 50
266MHz,
32 bits
—
0.323
—
—
—
—
—
—
W
200MHz,
32 bits
—
0.291
—
—
—
—
—
—
W
DDR 2
Rs = 22
Rt = 75
266MHz,
32 bits
0.246
—
—
—
—
—
—
—
W
200MHz,
32bits
0.225
—
—
—
—
—
—
—
W
33 MHz
—
—
0.120
—
—
—
—
—
W
66 MHz
—
—
0.249
—
—
—
—
—
W
66 MHz
—
—
—
—
0.056
—
—
—
W
50 MHz
—
—
—
—
0.040
—
—
—
W
—
—
—
0.008
—
—
—
—
W
—
—
—
0.078
—
—
—
—
W
—
—
—
0.044
—
—
—
—
W
PCI I/O
load = 50pF
Local bus I/O
load = 20pF
eTSEC I/O MII, 25MHz
load = 20pF
RGMII,
Multiple by
125MHz
number of
(3.3V)
interface
RGMII,
used
125MHz
(2.5V)
USBDR
Controller
(ULPI mode)
load =20pF
60 MHz
—
—
—
0.078
—
—
—
—
W
USBDR+
Internal PHY
(UTMI mode)
480 MHz
—
—
—
0.274
—
—
—
—
W
PCI Express
two x1lane
2.5 GHz
—
—
—
—
—
—
—
0.190
W
Other I/O
—
—
—
0.015
—
—
—
—
—
W
5
Clock Input Timing
This section provides the clock input DC and AC electrical characteristics for the MPC8314E.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
13
Clock Input Timing
5.1
DC Electrical Characteristics
This table provides the clock input (SYS_CLK_IN/PCI_SYNC_IN) DC timing specifications for the
MPC8314E.
Table 6. SYS_CLK_IN DC Electrical Characteristics
Parameter
5.2
Condition
Symbol
Min
Max
Unit
Input high voltage
—
VIH
2.4
NVDD + 0.3
V
Input low voltage
—
VIL
-0.3
0.4
V
SYS_CLK_IN input current
0 V VIN NVDD
IIN
—
±10
A
SYS_XTAL_IN input current
0 V VIN NVDD
IIN
—
±40
A
PCI_SYNC_IN input current
0 V VIN NVDD
IIN
—
±10
A
RTC_CLK input current
0 V VIN NVDD
IIN
—
±10
A
USB_CLK_IN input current
0 V VIN NVDD
IIN
—
±10
A
USB_XTAL_IN input current
0 V VIN NVDD
IIN
—
±40
A
AC Electrical Characteristics
The primary clock source for the MPC8314E can be one of two inputs, SYS_CLK_IN or PCI_CLK,
depending on whether the device is configured in PCI host or PCI agent mode. This table provides the
clock input (SYS_CLK_IN/PCI_CLK) AC timing specifications for the MPC8314E.
Table 7. SYS_CLK_IN AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Note
SYS_CLK_IN/PCI_CLK frequency
fSYS_CLK_IN
24
—
66.67
MHz
1, 6, 7
SYS_CLK_IN/PCI_CLK cycle time
tSYS_CLK_IN
15
—
41.6
ns
6
tKH, tKL
0.6
—
4
ns
2, 6
tPCH, tPCL
0.6
0.8
1.2
ns
2
tKHK/tSYS_CLK_IN
40
—
60
%
3, 6
—
—
—
±150
ps
4, 5, 6
SYS_CLK_IN rise and fall time
PCI_CLK rise and fall time
SYS_CLK_IN/PCI_CLK duty cycle
SYS_CLK_IN/PCI_CLK jitter
Note:
1. Caution: The system, core, and security block must not exceed their respective maximum or minimum operating
frequencies.
2. Rise and fall times for SYS_CLK_IN/PCI_CLK are specified at 20% to 80% of signal swing.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The SYS_CLK_IN/PCI_CLK driver’s closed loop jitter bandwidth should be 1,000,000
baud
1
16
—
2
Oversample rate
Note:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the eighth sampled 0 after the 1-to-0 transition of the
start bit. Subsequent bit values are sampled each sixteenth sample.
9
Ethernet: Three-Speed Ethernet, MII Management
This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII
management.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
22
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
9.1
eTSEC (10/100/1000 Mbps)—MII/RMII/RGMII/RTBI Electrical
Characteristics
The electrical characteristics specified here apply to all the media-independent interface (MII), reduced
gigabit MII (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output
(MDIO) and management data clock (MDC). The MII and RMII is defined for 3.3 V, while the RGMII,
and RTBI can operate at 2.5 V. The RGMII and RTBI follow the Hewlett-Packard reduced pin-count
interface for Gigabit Ethernet Physical Layer Device Specification Version 1.2a (9/22/2000). The
electrical characteristics for MDIO and MDC are specified in Section 9.3, “Ethernet Management
Interface Electrical Characteristics.”
9.1.1
MII, RMII, RGMII, and RTBI DC Electrical Characteristics
All MII, RMII drivers and receivers comply with the DC parametric attributes specified in Table 23 for
3.3-V operation and RGMII, RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 24. The RGMII and RTBI signals are based on a 2.5 V CMOS interface voltage as
defined by JEDEC EIA/JESD8–5.
NOTE
eTSEC should be interfaced with peripheral operating at same voltage level.
Table 23. MII/RMII (When Operating at 3.3 V) DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage 3.3 V
LVDD
—
—
3.0
3.6
V
Output high voltage
VOH
IOH = –4.0 mA
LVDD = Min
2.40
LVDD + 0.3
V
Output low voltage
VOL
IOL = 4.0 mA
LVDD = Min
VSS
0.50
V
Input high voltage
VIH
—
—
2.1
LVDD + 0.3
V
Input low voltage
VIL
—
—
–0.3
0.90
V
—
40
A
–600
—
A
Input high current
1
IIH
Input low current
VIN = LVDD
1
IIL
VIN = VSS
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LVDD
—
—
2.37
2.63
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.00
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
VSS– 0.3
0.40
V
Input high voltage
VIH
—
LVDD = Min
1.7
LVDD + 0.3
V
Input low voltage
VIL
—
LVDD =Min
–0.3
0.70
V
—
15
A
–15
—
A
Input high current
IIH
Input low current
IIL
VIN
1=
1
LVDD
VIN = VSS
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
23
Ethernet: Three-Speed Ethernet, MII Management
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics (continued)
Parameters
Symbol
Conditions
Min
Max
Unit
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
9.2
MII, RMII, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for MII, RMII, RGMII, and RTBI are presented in this section.
9.2.1
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
9.2.1.1
MII Transmit AC Timing Specifications
This table provides the MII transmit AC timing specifications.
Table 25. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 300 mv.
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
TX_CLK data clock rise VIL(min) to VIH(max)
tMTXR
1.0
—
4.0
ns
TX_CLK data clock fall VIH(max) to VIL(min)
tMTXF
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
This figure shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 9. MII Transmit AC Timing Diagram
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
24
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
9.2.1.2
MII Receive AC Timing Specifications
This table provides the MII receive AC timing specifications.
Table 26. MII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 300 mv
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
RX_CLK clock rise VIL(min) to VIH(max)
tMRXR
1.0
—
4.0
ns
RX_CLK clock fall time VIH(max) to VIL(min)
tMRXF
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII
receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock
reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the
time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. The frequency of RX_CLK should not exceed the TX_CLK by more than 300 ppm
This figure provides the AC test load for eTSEC.
Z0 = 50
Output
RL = 50
LVDD/2
Figure 10. eTSEC AC Test Load
This figure shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXH
RXD[3:0]
RX_DV
RX_ER
tMRXF
Valid Data
tMRDVKH
tMRDXKH
Figure 11. MII Receive AC Timing Diagram RMII AC Timing Specifications
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
25
Ethernet: Three-Speed Ethernet, MII Management
9.2.2
RMII AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications.
9.2.2.1
RMII Transmit AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications. This table provides the
RMII transmit AC timing specifications.
Table 27. RMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 300 mv
Symbol 1
Min
Typ
Max
Unit
tRMX
—
20
—
ns
tRMXH/tRMX
35
—
65
%
REF_CLK to RMII data TXD[1:0], TX_EN delay
tRMTKHDX
2
—
10
ns
REF_CLK data clock rise VIL(min) to VIH(max)
tRMXR
1.0
—
4.0
ns
REF_CLK data clock fall VIH(max) to VIL(min)
tRMXF
1.0
—
4.0
ns
Parameter/Condition
REF_CLK clock
REF_CLK duty cycle
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first three letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII
transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
This figure shows the RMII transmit AC timing diagram.
tRMXR
tRMX
REF_CLK
tRMXH
tRMXF
TXD[1:0]
TX_EN
tRMTKHDX
Figure 12. RMII Transmit AC Timing Diagram
9.2.2.2
RMII Receive AC Timing Specifications
This table provides the RMII receive AC timing specifications.
Table 28. RMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 300 mv
Parameter/Condition
REF_CLK clock period
REF_CLK duty cycle
Symbol 1
Min
Typ
Max
Unit
tRMX
—
20
—
ns
tRMXH/tRMX
35
—
65
%
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
26
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
Table 28. RMII Receive AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 300 mv
Symbol 1
Min
Typ
Max
Unit
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK
tRMRDVKH
4.0
—
—
ns
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK
tRMRDXKH
2.0
—
—
ns
REF_CLK clock rise VIL(min) to VIH(max)
tRMXR
1.0
—
4.0
ns
REF_CLK clock fall time VIH(max) to VIL(min)
tRMXF
1.0
—
4.0
ns
Parameter/Condition
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first three letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII
receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock
reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect to
the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
This figure provides the AC test load.
Z0 = 50
Output
RL = 50
NVDD/2
Figure 13. AC Test Load
This figure shows the RMII receive AC timing diagram.
tRMXR
tRMX
REF_CLK
tRMXH
RXD[1:0]
CRS_DV
RX_ER
tRMXF
Valid Data
tRMRDVKH
tRMRDXKH
Figure 14. RMII Receive AC Timing Diagram
9.2.3
RGMII and RTBI AC Timing Specifications
This table presents the RGMII and RTBI AC timing specifications.
Table 29. RGMII and RTBI AC Timing Specifications
At recommended operating conditions (see Table 2)
Parameter/Condition
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
2
Symbol 1
Min
Typ
Max
Unit
tSKRGT
–0.6
—
0.6
ns
tSKRGT
1.0
—
2.6
ns
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
27
Ethernet: Three-Speed Ethernet, MII Management
Table 29. RGMII and RTBI AC Timing Specifications (continued)
At recommended operating conditions (see Table 2)
Symbol 1
Min
Typ
Max
Unit
tRGT
7.2
8.0
8.8
ns
tRGTH/tRGT
45
50
55
%
tRGTH/tRGT
40
50
60
%
Rise time (20%–80%)
tRGTR
—
—
0.75
ns
Fall time (20%–80%)
tRGTF
—
—
0.75
ns
6
—
8.0
—
ns
47
—
53
%
Parameter/Condition
Clock cycle duration
3
Duty cycle for 1000Base-T
4, 5
Duty cycle for 10BASE-T and 100BASE-TX
GTX_CLK125 reference clock period
GTX_CLK125 reference clock duty cycle
3, 5
tG12
tG125H/tG125
Note:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII
and RTBI timing. For example, the subscript of tRGT represents the RTBI (T) receive (RX) clock. Note also that the notation for rise
(R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew
(SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed so that an additional trace delay of greater than 1.5 ns is added to
the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long as
the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned between.
5. Duty cycle reference is LVDD/2.
6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention. GTX_CLK
supply voltage is fixed at 3.3V inside the chip. If PHY supplies a 2.5 V Clock signal on this input, set TSCOMOBI bit of System I/O
configuration register (SICRH) as 1. See the MPC8315E PowerQUICC II Pro Integrated Host Processor Family Reference Manual.
7. The frequency of RX_CLK should not exceed the TX_CLK by more than 300 ppm
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
28
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
This figure shows the RGMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CTL
TXD[8:5]
TXD[3:0] TXD[7:4]
TXD[4]
TXEN
TXD[9]
TXERR
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[3:0] RXD[7:4]
tSKRGT
RX_CTL
RXD[4]
RXDV
RXD[9]
RXERR
tSKRGT
RX_CLK
(At Controller)
Figure 15. RGMII and RTBI AC Timing and Multiplexing Diagrams
9.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals management data
input/output (MDIO) and management data clock (MDC). The electrical characteristics for MII, RMII,
RGMII, and RTBI are specified in Section 9.1, “eTSEC (10/100/1000 Mbps)—MII/RMII/RGMII/RTBI
Electrical Characteristics.”
9.3.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in this table.
Table 30. MII Management DC Electrical Characteristics Powered at 3.3 V
Parameter
Supply voltage (3.3 V)
Symbol
Conditions
Min
Max
Unit
NVDD
—
—
3.0
3.6
V
Output high voltage
VOH
IOH = –1.0 mA
NVDD = Min
2.10
NVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
NVDD = Min
VSS
0.50
V
Input high voltage
VIH
—
—
2.00
—
V
Input low voltage
VIL
—
—
—
0.80
V
VIN = 2.1 V
—
40
A
Input high current
IIH
NVDD = Max
1
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
29
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Table 30. MII Management DC Electrical Characteristics Powered at 3.3 V (continued)
Parameter
Symbol
Input low current
IIL
Conditions
NVDD = Max
VIN = 0.5 V
Min
Max
Unit
–600
—
A
Note:
1. The symbol VIN, in this case, represents the NVIN symbol referenced in Table 1 and Table 2.
9.3.2
MII Management AC Electrical Specifications
This table provides the MII management AC timing specifications.
Table 31. MII Management AC Timing Specifications
At recommended operating conditions with NVDD is 3.3 V ± 300 mv
Symbol 1
Min
Typ
Max
Unit
Note
MDC frequency
fMDC
—
2.5
—
MHz
2
MDC period
tMDC
—
400
—
ns
—
MDC clock pulse width high
tMDCH
32
—
—
ns
—
MDC to MDIO delay
tMDKHDX
10
—
170
ns
3
MDIO to MDC setup time
tMDDVKH
5
—
—
ns
—
MDIO to MDC hold time
tMDDXKH
0
—
—
ns
—
MDC rise time
tMDCR
—
—
10
ns
—
MDC fall time
tMDHF
—
—
10
ns
—
Parameter/Condition
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes
management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data
hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the
valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 133 MHz, the maximum frequency is 4.16 MHz and
the minimum frequency is 0.593 MHz).
3. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 133 MHz, the delay is 60 ns).
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Ethernet: Three-Speed Ethernet, MII Management
This figure shows the MII management AC timing diagram.
tMDCR
tMDC
MDC
tMDCF
tMDCH
MDIO
(Input)
tMDDVKH
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 16. MII Management Interface Timing Diagram
9.4
1588 Timer Specifications
This section describes the DC and AC electrical specifications for the 1588 timer.
9.4.1
1588 Timer DC Specifications
This table provides the 1588 timer DC specifications.
Table 32. GPIO DC Electrical Characteristics
Characteristic
9.4.2
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.0
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V VIN NVDD
—
±5
A
1588 Timer AC Specifications
This table provides the 1588 timer AC specifications.
Table 33. 1588 Timer AC Specifications
Parameter
Symbol
Min
Max
Unit
Note
Timer clock cycle time
tTMRCK
0
70
MHz
1
Input setup to timer clock
tTMRCKS
—
—
—
2, 3
Input hold from timer clock
tTMRCKH
—
—
—
2, 3
Output clock to output valid
tGCLKNV
0
6
ns
Timer alarm to output valid
tTMRAL
—
—
—
2
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Ethernet: Three-Speed Ethernet, MII Management
Table 33. 1588 Timer AC Specifications (continued)
Parameter
Symbol
Min
Max
Unit
Note
Note:
1. The timer can operate on rtc_clock or tmr_clock. These clocks get muxed and any one of them can be selected.
2. Asynchronous signals.
3. Inputs need to be stable at least one TMR clock.
9.5
SGMII Interface Electrical Characteristics
Each SGMII port features a 4-wire AC-Coupled serial link from the dedicated SerDes interface of
MPC8315E as shown in Figure 17, where CTX is the external (on board) AC-Coupled capacitor. Each
output pin of the SerDes transmitter differential pair features 50-output impedance. Each input of the
SerDes receiver differential pair features 50- on-die termination to XCOREVSS. The reference circuit
of the SerDes transmitter and receiver is shown in Figure 48.
When an eTSEC port is configured to operate in SGMII mode, the parallel interface’s output signals of
this eTSEC port can be left floating. The input signals should be terminated based on the guidelines
described in Section 25.4, “Connection Recommendations,” as long as such termination does not violate
the desired POR configuration requirement on these pins, if applicable.
When operating in SGMII mode, the TSEC_GTX_CLK125 clock is not required for this port. Instead,
SerDes reference clock is required on SD_REF_CLK and SD_REF_CLK pins.
9.5.1
DC Requirements for SGMII SD_REF_CLK and SD_REF_CLK
The characteristics and DC requirements of the separate SerDes reference clock are described in
Section 15, “High-Speed Serial Interfaces (HSSI).”
9.5.2
AC Requirements for SGMII SD_REF_CLK and SD_REF_CLK
This table lists the SGMII SerDes reference clock AC requirements. Please note that SD_REF_CLK and
SD_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock
source.
Table 34. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Min
Typical
Max
Unit
Note
REFCLK cycle time
—
8
—
ns
—
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent
REFCLK cycles
—
—
100
ps
—
tREFPJ
Phase jitter. Deviation in edge location with respect to mean edge location
–50
—
50
ps
—
tREF
9.5.3
Parameter Description
SGMII Transmitter and Receiver DC Electrical Characteristics
Table 35 and Table 36 describe the SGMII SerDes transmitter and receiver AC-coupled DC electrical
characteristics. Transmitter DC characteristics are measured at the transmitter outputs (SD_TX[n] and
SD_TX[n]) as depicted in Figure 16.
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Ethernet: Three-Speed Ethernet, MII Management
Table 35. SGMII DC Transmitter Electrical Characteristics
Parameter
Symbol
Min
Typ
Max
Unit
Note
XCOREVDD
0.95
1.0
1.05
V
—
Output high voltage
VOH
—
—
XCOREVDD-Typ/2 +
|VOD|-max/2
mV
1
Output low voltage
VOL
XCOREVDD-Typ/2 |VOD|-max/2
—
—
mV
1
VRING
—
—
10
%
—
323
500
725
Equalization
setting: 1.0x
296
459
665
Equalization
setting: 1.09x
269
417
604
Equalization
setting: 1.2x
243
376
545
215
333
483
Equalization
setting: 1.5x
189
292
424
Equalization
setting: 1.71x
162
250
362
Equalization
setting: 2.0x
Supply Voltage
Output ringing
Output differential voltage2, 3, 5
|VOD|
mV
Equalization
setting: 1.33x
Output offset voltage
VOS
425
500
575
mV
1, 4
Output impedance (single-ended)
RO
40
—
60
—
RO
—
—
10
%
—
Change in VOD between “0” and “1”
|VOD|
—
—
25
mV
—
Change in VOS between “0” and “1”
VOS
—
—
25
mV
—
ISA, ISB
—
—
40
mA
—
Mismatch in a pair
Output current on short to GND
Note:
1. This will not align to DC-coupled SGMII. XCOREVDD-Typ=1.0V.
2. |VOD| = |VTXn - VTXn|. |VOD| is also referred as output differential peak voltage. VTX-DIFFp-p = 2*|VOD|.
3. The |VOD| value shown in the table assumes the following transmit equalization setting in the TXEQA (for SerDes lane A) or
TXEQE (for SerDes lane E) bit field of MPC8315E’s SerDes Control Register 0:
• The LSbits (bit [1:3]) of the above bit field is set based on the equalization setting shown in table.
4. VOS is also referred to as output common mode voltage.
5. The |VOD| value shown in the Typ column is based on the condition of XCOREVDD-Typ=1.0V, no common mode offset variation
(VOS = 500 mV), SerDes transmitter is terminated with 100- differential load between TX[n] and TX[n].
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Ethernet: Three-Speed Ethernet, MII Management
50 TXn
CTX
RXm
50
Transmitter
Receiver
50
CTX
TXn
MPC8315E SGMII
SerDes Interface
Receiver
RXn
50
RXm
CTX
TXm
50
50
Transmitter
50
50
CTX
RXn
TXm
Figure 17. 4-Wire AC-Coupled SGMII Serial Link Connection Example
MPC8315E SGMII
SerDes Interface
50 TXn
50
Transmitter
Vos
VOD
50
50
TXn
Figure 18. SGMII Transmitter DC Measurement Circuit
Table 36. SGMII DC Receiver Electrical Characteristics
Parameter
Supply Voltage
DC Input voltage range
Symbol
Min
Typ
Max
Unit
Note
XCOREVDD
0.95
1.0
1.05
V
—
—
1
1200
mV
2, 4
mV
3, 4
—
Input differential voltage
EQ = 0
VRX_DIFFp-p
EQ = 1
Loss of signal threshold
EQ = 0
EQ = 1
VLOS
N/A
100
—
175
—
30
—
100
65
—
175
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Ethernet: Three-Speed Ethernet, MII Management
Table 36. SGMII DC Receiver Electrical Characteristics (continued)
Parameter
Symbol
Min
Typ
Max
Unit
Note
VCM_ACp-p
—
—
100
mV
5
Receiver differential input impedance
ZRX_DIFF
80
100
120
—
Receiver common mode input
impedance
ZRX_CM
20
—
35
—
Common mode input voltage
VCM
—
Vxcorevss
—
V
6
Input AC common mode voltage
Note:
1. Input must be externally AC-coupled.
2. VRX_DIFFp-p is also referred to as peak to peak input differential voltage
3. The concept of this parameter is equivalent to the Electrical Idle Detect Threshold parameter in PCI Express. Refer to PCI
Express Differential Receiver (RX) Input Specifications section for further explanation.
4. The EQ shown in the table refers to the RXEQA or RXEQE bit field of MPC8315E’s SerDes Control Register 0.
5. VCM_ACp-p is also referred to as peak to peak AC common mode voltage.
6. On-chip termination to XCOREVSS.
9.5.4
SGMII AC Timing Specifications
This section describes the SGMII transmit and receive AC timing specifications. Transmitter and receiver
characteristics are measured at the transmitter outputs (TX[n] and TX[n]) or at the receiver inputs (RX[n]
and RX[n]) as depicted in Figure 20 respectively.
9.5.4.1
SGMII Transmit AC Timing Specifications
This table provides the SGMII transmit AC timing targets. A source synchronous clock is not provided.
Table 37. SGMII Transmit AC Timing Specifications
At recommended operating conditions with XCOREVDD = 1.0V ± 5%.
Parameter
Symbol
Min
Typ
Max
Unit
Note
Deterministic Jitter
JD
—
—
0.17
UI p-p
—
Total Jitter
JT
—
—
0.35
UI p-p
—
Unit Interval
UI
799.92
800
800.08
ps
—
VOD fall time (80%-20%)
tfall
50
—
120
ps
—
VOD rise time (20%-80%)
trise
50
—
120
ps
—
Note:
1. Each UI is 800 ps ± 100 ppm.
9.5.4.2
SGMII Receive AC Timing Specifications
This table provides the SGMII receive AC timing specifications. Source synchronous clocking is not
supported. Clock is recovered from the data. Figure 19 shows the SGMII Receiver Input Compliance
Mask eye diagram.
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Table 38. SGMII Receive AC Timing Specifications
At recommended operating conditions with XCOREVDD = 1.0V ± 5%.
Parameter
Symbol
Min
Typ
Max
Unit
Note
JD
0.37
—
—
UI p-p
1
Combined Deterministic and Random Jitter Tolerance
JDR
0.55
—
—
UI p-p
1
Sinusoidal Jitter Tolerance
JSIN
0.1
—
—
UI p-p
1
JT
0.65
—
—
UI p-p
1
Deterministic Jitter Tolerance
Total Jitter Tolerance
Bit Error Ratio
Unit Interval
AC Coupling Capacitor
BER
—
—
10-12
UI
799.92
800
800.08
ps
2
CTX
5
—
200
nF
3
—
Note:
1. Measured at receiver.
2. Each UI is 800 ps ± 100 ppm.
3. The external AC coupling capacitor is required. It’s recommended to be placed near the device transmitter outputs.
4. Refer to RapidIOTM 1x/4x LP Serial Physical Layer Specification for interpretation of jitter specifications.
Receiver Differential Input Voltage
VRX_DIFFp-p-max/2
VRX_DIFFp-p-min/2
0
VRX_DIFFp-p-min/2
VRX_DIFFp-p-max/2
0
0.275
0.4
0.6
1
0.725
Time (UI)
Figure 19. SGMII Receiver Input Compliance Mask
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Freescale Semiconductor
USB
Figure 20. SGMII AC Test/Measurement Load
10 USB
10.1
USB Dual-Role Controllers
This section provides the AC and DC electrical specifications for the USB-ULPI interface.
10.1.1
USB DC Electrical Characteristics
This table lists the DC electrical characteristics for the USB interface.
Table 39. USB DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
LVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
IIN
—
±5
A
High-level output voltage, IOH = –100 A
VOH
LVDD – 0.2
—
V
Low-level output voltage, IOL = 100 A
VOL
—
0.2
V
Note:
1. The symbol VIN, in this case, represents the NVIN symbol referenced in Table 1 and Table 2.
10.1.2
USB AC Electrical Specifications
This table lists the general timing parameters of the USB-ULPI interface.
Table 40. USB General Timing Parameters
Symbol 1
Min
Max
Unit
Note
tUSCK
15
—
ns
1, 2
Input setup to USB clock—all inputs
tUSIVKH
4
—
ns
1, 4
Input hold to USB clock—all inputs
tUSIXKH
1
—
ns
1, 4
Parameter
USB clock cycle time
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
37
USB
Table 40. USB General Timing Parameters (continued)
Symbol 1
Min
Max
Unit
Note
USB clock to output valid—all outputs
tUSKHOV
—
9
ns
1
Output hold from USB clock—all outputs
tUSKHOX
1
—
ns
1
Parameter
Note:
1. The symbols used for timing specifications follow the pattern of t(First two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing
(US) for the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX
symbolizes USB timing (US) for the us clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or
output hold time.
2. All timings are in reference to USB clock.
3. All signals are measured from NVDD/2 of the rising edge of USB clock to 0.4 NVDD of the signal in question for 3.3-V
signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through
the component pin is less than or equal to the leakage current specification.
Figure 21 and Figure 22 provide the AC test load and signals for the USB, respectively.
Output
Z0 = 50
RL = 50
NVDD/2
Figure 21. USB AC Test Load
USBDR_CLK
tUSIVKH
tUSIXKH
Input Signals
tUSKHOV
tUSKHOX
Output Signals
Figure 22. USB Signals
10.2
On-Chip USB PHY
This section provides the AC and DC electrical specifications for the USB PHY interface of the
MPC8314E.
For details refer to Tables 7-7 through 7-10, and Table 7-14 in the USB 2.0 Specifications document, and
the pull-up/down resistors ECN updates, all available at www.usb.org.
This table provides the USB clock input (USB_CLK_IN) DC timing specifications.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
Local Bus
Table 41. USB_CLK_IN DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Input high voltage
VIH
2.7
NVDD + 0.3
V
Input low voltage
VIL
–0.3
0.4
V
This table provides the USB clock input (USB_CLK_IN) AC timing specifications.
Table 42. USB_CLK_IN AC Timing Specifications
Parameter/Condition
Conditions
Symbol
Min
Typical
Max
Unit
Frequency range
—
fUSB_CLK_IN
—
24
—
MHz
Clock frequency tolerance
—
tCLK_TOL
–0.005
0
0.005
%
tCLK_DUTY
40
50
60
%
tCLK_PJ
—
—
200
ps
Reference clock duty cycle
Measured at 1.6 V
Total input jitter/Time interval Peak to peak value measured with a second
error
order high-pass filter of 500 KHz bandwidth
11 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the
MPC8314E.
11.1 Local Bus DC Electrical Characteristics
This table provides the DC electrical characteristics for the local bus interface.
Table 43. DC Electrical Characteristics (when Operating at 3.3 V)
Parameter
Symbol
Min
Max
Unit
Output high voltage (NVDD = min, IOH = –2 mA)
VOH
NVDD – 0.2
—
V
Output low voltage (NVDD = min, IOL = 2 mA)
VOL
—
0.2
V
Input high voltage
VIH
2
NVDD + 0.3
V
Input low voltage
VIL
–0.3
0.8
V
Input high current (VIN = 0 V or VIN = NVDD)
IIN
—
±5
A
11.2 Local Bus AC Electrical Specifications
This table describes the general timing parameters of the local bus interface of the MPC8314E.
Table 44. Local Bus General Timing Parameters
Parameter
Local bus cycle time
Input setup to local bus clock
Symbol 1
Min
Max
Unit
Note
tLBK
15
—
ns
2
tLBIVKH
7
—
ns
3, 4
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
39
Local Bus
Table 44. Local Bus General Timing Parameters (continued)
Symbol 1
Min
Max
Unit
Note
tLBIXKH
1.0
—
ns
3, 4
LALE output fall to LAD output transition (LATCH hold time)
tLBOTOT1
1.5
—
ns
5
LALE output fall to LAD output transition (LATCH hold time)
tLBOTOT2
3
—
ns
6
LALE output fall to LAD output transition (LATCH hold time)
tLBOTOT3
2.5
—
ns
7
Local bus clock to output valid
tLBKHOV
—
3
ns
3
Local bus clock to output high impedance for LAD
tLBKHOZ
—
4
ns
8
LALE output rise to LCLK negative edge
tLALEHOV
—
3.0
ns
Parameter
Input hold from local bus clock
Note:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional
block)(signal)(state)(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For
example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock
reference (K) goes high (H), in this case for clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock
reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time.
2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of
LCLK0 (for all other inputs).
3. All signals are measured from NVDD/2 of the rising/falling edge of LCLK0 to 0.4 NVDD of the signal in question for 3.3-V
signaling levels.
4. Input timings are measured at the pin.
5. tLBOTOT1 should be used when RCWH[LALE] is not set and the load on LALE output pin is at least 10pF less than the load
on LAD output pins.
6. tLBOTOT2 should be used when RCWH[LALE] is set and the load on LALE output pin is at least 10pF less than the load on
LAD output pins.
7. tLBOTOT3 should be used when RCWH[LALE] is set and the load on LALE output pin equals to the load on LAD output pins.
8. For active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the
component pin is less than or equal to the leakage current specification.
This figure provides the AC test load for the local bus.
Output
Z0 = 50
RL = 50
NVDD/2
Figure 23. Local Bus AC Test Load
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
Local Bus
Figure 24 through Figure 26 show the local bus signals.
LCLK[n]
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:15]
tLBIXKH
tLBIVKH
Input Signal:
LGTA
tLBIXKH
tLBKHOV
Output Signals:
LBCTL/LBCKE/LOE/
tLBKHOV
tLBKHOZ
Output Signals:
LAD[0:15]
tLBOTOT
t LALEHOV
LALE
Figure 24. Local Bus Signals, Nonspecial Signals Only
LCLK
T1
T3
tLBKHOV
tLBKHOZ
GPCM Mode Output Signals:
LCS[0:3]/LWE
tLBIVKH
tLBIXKH
UPM Mode Input Signal:
LUPWAIT
tLBIVKH
Input Signals:
LAD[0:15]
tLBKHOV
tLBIXKH
tLBKHOZ
UPM Mode Output Signals:
LCS[0:3]/LBS[0:1]/LGPL[0:5]
Figure 25. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
41
JTAG
LCLK
T1
T2
T3
T4
tLBKHOZ
tLBKHOV
GPCM Mode Output Signals:
LCS[0:3]/LWE
tLBIXKH
tLBIVKH
UPM Mode Input Signal:
LUPWAIT
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:15]
tLBKHOZ
tLBKHOV
UPM Mode Output Signals:
LCS[0:3]/LBS[0:1]/LGPL[0:5]
Figure 26. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4
12 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG)
interface.
12.1
JTAG DC Electrical Characteristics
This table provides the DC electrical characteristics for the IEEE 1149.1 (JTAG) interface.
Table 45. JTAG Interface DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
—
—
±5
A
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
JTAG
12.2
JTAG AC Timing Specifications
This section describes the AC electrical specifications for the IEEE 1149.1 (JTAG) interface. This table
provides the JTAG AC timing specifications as defined in Figure 28 through Figure 31.
Table 46. JTAG AC Timing Specifications (Independent of SYS_CLK_IN) 1
At recommended operating conditions (see Table 2)
Symbol 2
Min
Max
Unit
Note
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
—
JTAG external clock cycle time
t JTG
30
—
ns
—
tJTKHKL
15
—
ns
—
tJTGR, tJTGF
0
2
ns
—
tTRST
25
—
ns
3
ns
4
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
4
—
—
ns
4
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
10
10
—
—
ns
5
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
2
2
11
11
ns
5
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
2
2
—
—
JTAG external clock to output high impedance:
Boundary-scan data
TDO
ns
5, 6
tJTKLDZ
tJTKLOZ
2
2
19
9
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
Input setup times:
Input hold times:
Valid times:
Output hold times:
Note:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50-load (see Table 27).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device
timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K)
going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals
(D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference
symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the
latter convention is used with the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design and characterization.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
43
JTAG
This figure provides the AC test load for TDO and the boundary-scan outputs of the MPC8314E.
Z0 = 50
Output
RL = 50
NVDD/2
Figure 27. AC Test Load for the JTAG Interface
This figure provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTGF
tJTG
VM = Midpoint Voltage (NVDD/2)
Figure 28. JTAG Clock Input Timing Diagram
This figure provides the TRST timing diagram.
TRST
VM
VM
tTRST
VM = Midpoint Voltage (NVDD/2)
Figure 29. TRST Timing Diagram
This figure provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (NVDD/2)
Figure 30. Boundary-Scan Timing Diagram
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
44
Freescale Semiconductor
I2 C
This figure provides the test access port timing diagram.
JTAG
External Clock
VM
VM
tJTIVKH
tJTIXKH
Input
Data Valid
TDI, TMS
tJTKLOV
tJTKLOX
TDO
Output Data Valid
tJTKLOZ
TDO
Output Data Valid
VM = Midpoint Voltage (NVDD/2)
Figure 31. Test Access Port Timing Diagram
13 I2C
This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8314E.
13.1
I2C DC Electrical Characteristics
This table provides the DC electrical characteristics for the I2C interface.
Table 47. I2C DC Electrical Characteristics
At recommended operating conditions with NVDD of 3.3 V ± 300 mv
Parameter
Symbol
Min
Max
Unit
Note
Input high voltage level
VIH
0.7 NVDD
NVDD + 0.3
V
—
Input low voltage level
VIL
–0.3
0.3 NVDD
V
—
Low level output voltage
VOL
0
0.2 NVDD
V
1
High level output voltage
VOH
0.8 NVDD
NVDD + 0.3
V
—
Output fall time from VIH(min) to VIL(max) with a bus
capacitance from 10 to 400 pF
tI2KLKV
20 + 0.1 CB
250
ns
2
Pulse width of spikes which must be suppressed by the input
filter
tI2KHKL
0
50
ns
3
Capacitance for each I/O pin
CI
—
10
pF
—
Input current (0 V VIN NVDD)
IIN
—
±5
A
4
Note:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. CB = capacitance of one bus line in pF.
3. See the MPC8315E PowerQUICC II Pro Integrated Host Processor Family Reference Manual for information on the digital
filter used.
4. I/O pins obstruct the SDA and SCL lines if NVDD is switched off.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
45
I2 C
13.2
I2C AC Electrical Specifications
This table provides the AC timing parameters for the I2C interface.
Table 48. I2C AC Electrical Specifications
All values refer to VIH (min) and VIL (max) levels (see Table 47)
Symbol 1
Min
Max
Unit
SCL clock frequency
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL
1.3
—
s
High period of the SCL clock
tI2CH
0.6
—
s
Setup time for a repeated START condition
tI2SVKH
0.6
—
s
Hold time (repeated) START condition (after this period, the first clock pulse is
generated)
tI2SXKL
0.6
—
s
Data setup time
tI2DVKH
100
—
ns
—
02
—
0.9 3
Parameter
Data hold time:
s
tI2DXKL
CBUS compatible masters
I2C bus devices
Fall time of both SDA and SCL signals
tI2CF 4
—
300
ns
Setup time for STOP condition
tI2PVKH
0.6
—
s
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
s
Noise margin at the LOW level for each connected device (including hysteresis)
VNL
0.1 NVDD
—
V
Noise margin at the HIGH level for each connected device (including hysteresis)
VNH
0.2 NVDD
—
V
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing
(I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to
the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start
condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH
symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative
to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
2. MPC8314E provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
3. The maximum tI2DVKH has to be met only if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. MPC8314E does not follow the I2C-BUS Specifications version 2.1 regarding the tI2CF AC parameter.
This figure provides the AC test load for the I2C.
Output
Z0 = 50
RL = 50
NVDD/2
Figure 32. I2C AC Test Load
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
46
Freescale Semiconductor
PCI
This figure shows the AC timing diagram for the I2C bus.
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2CF
tI2SXKL
tI2CR
SCL
tI2SXKL
tI2CH
tI2DXKL
S
tI2SVKH
tI2PVKH
Sr
P
S
Figure 33. I2C Bus AC Timing Diagram
14 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8314E.
14.1
PCI DC Electrical Characteristics
This table provides the DC electrical characteristics for the PCI interface.
Table 49. PCI DC Electrical Characteristics 1
Parameter
Symbol
Test Condition
Min
Max
Unit
High-level input voltage
VIH
VOUT VOH (min) or
0.5 x NVDD
NVDD + 0.3
V
Low-level input voltage
VIL
VOUT VOL (max)
–0.5
0.3 NVDD
V
High-level output voltage
VOH
NVDD = min,
IOH = –500 A
0.9 x NVDD
—
V
Low-level output voltage
VOL
NVDD = min,
IOL = 1500 A
—
0.1 x NVDD
V
IIN
0 V VIN NVDD
—
± 10
A
Input current
Note:
1. The symbol VIN, in this case, represents the NVIN symbol referenced in Table 1 and Table 2.
14.2
PCI AC Electrical Specifications
This section describes the general AC timing parameters of the PCI bus. Note that the PCI_CLK or
PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8314E is configured
as a host or agent device. This table shows the PCI AC timing specifications at 66 MHz.
.
Table 50. PCI AC Timing Specifications at 66 MHz
Symbol 1
Min
Max
Unit
Note
Clock to output valid
tPCKHOV
—
6.0
ns
2
Output hold from clock
tPCKHOX
1
—
ns
2
Clock to output high impedance
tPCKHOZ
—
14
ns
2, 3
Input setup to clock
tPCIVKH
3.3
—
ns
2, 4
Parameter
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
47
PCI
Table 50. PCI AC Timing Specifications at 66 MHz (continued)
Parameter
Input hold from clock
Symbol 1
Min
Max
Unit
Note
tPCIXKH
0
—
ns
2, 4
Note:
1. Note that the symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH
symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the
PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC)
with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
This table shows the PCI AC Timing Specifications at 33 MHz.
Table 51. PCI AC Timing Specifications at 33 MHz
Symbol 1
Min
Max
Unit
Note
Clock to output valid
tPCKHOV
—
11
ns
2
Output hold from clock
tPCKHOX
2
—
ns
2
Clock to output high impedance
tPCKHOZ
—
14
ns
2, 3
Input setup to clock
tPCIVKH
4.0
—
ns
2, 4
Input hold from clock
tPCIXKH
0
—
ns
2, 4
Parameter
Note:
1. Note that the symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH
symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the
PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC)
with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
This figure provides the AC test load for PCI.
Output
Z0 = 50
RL = 50
NVDD/2
Figure 34. PCI AC Test Load
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
48
Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
This figure shows the PCI input AC timing conditions.
CLK
tPCIVKH
tPCIXKH
Input
Figure 35. PCI Input AC Timing Measurement Conditions
This figure shows the PCI output AC timing conditions.
CLK
tPCKHOV
tPCKHOX
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 36. PCI Output AC Timing Measurement Condition
15 High-Speed Serial Interfaces (HSSI)
This section describes the common portion of SerDes DC electrical specifications, which is the DC
requirement for SerDes Reference Clocks. The SerDes data lane’s transmitter and receiver reference
circuits are also shown.
15.1
Signal Terms Definition
The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms
used in the description and specification of differential signals.
Figure 37 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for
description. The figure shows waveform for either a transmitter output (TXn and TXn) or a receiver input
(RXn and RXn). Each signal swings between A Volts and B Volts where A > B.
Using this waveform, the definitions are as follows. To simplify illustration, the following definitions
assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling
environment.
1. Single-Ended Swing
The transmitter output signals and the receiver input signals TXn, TXn, RXn and RXn each have
a peak-to-peak swing of A – B Volts. This is also referred as each signal wire’s Single-Ended
Swing.
2. Differential Output Voltage, VOD (or Differential Output Swing):
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
49
High-Speed Serial Interfaces (HSSI)
3.
4.
5.
6.
7.
The Differential Output Voltage (or Swing) of the transmitter, VOD, is defined as the difference of
the two complimentary output voltages: VTXn – VTXn. The VOD value can be either positive or
negative.
Differential Input Voltage, VID (or Differential Input Swing):
The Differential Input Voltage (or Swing) of the receiver, VID, is defined as the difference of the
two complimentary input voltages: VRXn – VRXn. The VID value can be either positive or negative.
Differential Peak Voltage, VDIFFp
The peak value of the differential transmitter output signal or the differential receiver input signal
is defined as Differential Peak Voltage, VDIFFp = |A – B| Volts.
Differential Peak-to-Peak, VDIFFp-p
Because the differential output signal of the transmitter and the differential input signal of the
receiver each range from A – B to –(A – B) Volts, the peak-to-peak value of the differential
transmitter output signal or the differential receiver input signal is defined as Differential
Peak-to-Peak Voltage, VDIFFp-p = 2*VDIFFp = 2 * |(A - B)| Volts, which is twice of differential
swing in amplitude, or twice of the differential peak. For example, the output differential peak-peak
voltage can also be calculated as VTX-DIFFp-p = 2*|VOD|.
Differential Waveform
The differential waveform is constructed by subtracting the inverting signal (TXn, for example)
from the non-inverting signal (TXn, for example) within a differential pair. There is only one signal
trace curve in a differential waveform. The voltage represented in the differential waveform is not
referenced to ground. Refer to Figure 46 as an example for differential waveform.
Common Mode Voltage, Vcm
The Common Mode Voltage is equal to one half of the sum of the voltages between each conductor
of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out = (VTXn
+ VTXn )/2 = (A + B) / 2, which is the arithmetic mean of the two complimentary output voltages
within a differential pair. In a system, the common mode voltage may often differ from one
component’s output to the other’s input. Sometimes, it may be even different between the receiver
input and driver output circuits within the same component. It’s also referred as the DC offset in
some occasion.
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Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
TXn or RXn
A Volts
Vcm = (A + B) / 2
TXn or RXn
B Volts
Differential Swing, VID or VOD = A - B
Differential Peak Voltage, VDIFFp = |A - B|
Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)
Figure 37. Differential Voltage Definitions for Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5V and 2.0V. Using these values, the peak-to-peak voltage swing of each signal (TD
or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since
the differential signaling environment is fully symmetrical, the transmitter output’s differential swing
(VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges
between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other
phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p)
is 1000 mV p-p.
15.2
SerDes Reference Clocks
The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by
the corresponding SerDes lanes. The SerDes reference clocks input is SD_REF_CLK and SD_REF_CLK
for PCI Express and SGMII interface.
The following sections describe the SerDes reference clock requirements and some application
information.
15.2.1
SerDes Reference Clock Receiver Characteristics
Figure 38 shows a receiver reference diagram of the SerDes reference clocks.
• The supply voltage requirements for XCOREVDD are specified in Table 1 and Table 2.
• SerDes Reference Clock Receiver Reference Circuit Structure
— The SD_REF_CLK and SD_REF_CLK are internally AC-coupled differential inputs as shown
in Figure 38. Each differential clock input (SD_REF_CLK or SD_REF_CLK) has a 50-
termination to XCOREVSS followed by on-chip AC-coupling.
— The external reference clock driver must be able to drive this termination.
— The SerDes reference clock input can be either differential or single-ended. Refer to the
Differential Mode and Single-ended Mode description below for further detailed requirements.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
51
High-Speed Serial Interfaces (HSSI)
•
•
The maximum average current requirement that also determines the common mode voltage range
— When the SerDes reference clock differential inputs are DC coupled externally with the clock
driver chip, the maximum average current allowed for each input pin is 8mA. In this case, the
exact common mode input voltage is not critical as long as it is within the range allowed by the
maximum average current of 8 mA (refer to the following bullet for more detail), since the
input is AC-coupled on-chip.
— This current limitation sets the maximum common mode input voltage to be less than 0.4V
(0.4V/50 = 8mA) while the minimum common mode input level is 0.1V above XCOREVSS.
For example, a clock with a 50/50 duty cycle can be produced by a clock driver with output
driven by its current source from 0mA to 16mA (0-0.8V), such that each phase of the
differential input has a single-ended swing from 0V to 800mV with the common mode voltage
at 400mV.
— If the device driving the SD_REF_CLK and SD_REF_CLK inputs cannot drive 50 ohms to
XCOREVSS DC, or it exceeds the maximum input current limitations, then it must be
AC-coupled off-chip.
The input amplitude requirement
— This requirement is described in detail in the following sections.
50
SD_REF_CLK
Input
Amp
SD_REF_CLK
50
Figure 38. Receiver of SerDes Reference Clocks
15.2.2
DC Level Requirement for SerDes Reference Clocks
The DC level requirement for the MPC8315E SerDes reference clock inputs is different depending on the
signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described
below.
• Differential Mode
— The input amplitude of the differential clock must be between 400mV and 1600mV differential
peak-peak (or between 200mV and 800mV differential peak). In other words, each signal wire
of the differential pair must have a single-ended swing less than 800mV and greater than
200mV. This requirement is the same for both external DC-coupled or AC-coupled connection.
— For external DC-coupled connection, as described in section 15.2.1, the maximum average
current requirements sets the requirement for average voltage (common mode voltage) to be
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
•
between 100 mV and 400 mV. Figure 39 shows the SerDes reference clock input requirement
for DC-coupled connection scheme.
— For external AC-coupled connection, there is no common mode voltage requirement for the
clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver
and the SerDes reference clock receiver operate in different command mode voltages. The
SerDes reference clock receiver in this connection scheme has its common mode voltage set to
XCOREVSS. Each signal wire of the differential inputs is allowed to swing below and above
the common mode voltage (XCOREVSS). Figure 40 shows the SerDes reference clock input
requirement for AC-coupled connection scheme.
Single-ended Mode
— The reference clock can also be single-ended. The SD_REF_CLK input amplitude
(single-ended swing) must be between 400mV and 800mV peak-peak (from Vmin to Vmax)
with SD_REF_CLK either left unconnected or tied to ground.
— The SD_REF_CLK input average voltage must be between 200 and 400 mV. Figure 41 shows
the SerDes reference clock input requirement for single-ended signaling mode.
— To meet the input amplitude requirement, the reference clock inputs might need to be DC or
AC-coupled externally. For the best noise performance, the reference of the clock could be DC
or AC-coupled into the unused phase (SD_REF_CLK) through the same source impedance as
the clock input (SD_REF_CLK) in use.
200 mV < Input Amplitude or Differential Peak < 800 mV
SD_REF_CLK
Vmax < 800 mV
100 mV < Vcm < 400 mV
Vmin > 0 V
SD_REF_CLK
Figure 39. Differential Reference Clock Input DC Requirements (External DC-Coupled)
200 mV < Input Amplitude or Differential Peak < 800 mV
SD_REF_CLK
Vmax < Vcm + 400 mV
Vcm
Vmin > Vcm – 400 mV
SD_REF_CLK
Figure 40. Differential Reference Clock Input DC Requirements (External AC-Coupled)
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
53
High-Speed Serial Interfaces (HSSI)
400 mV < SD_REF_CLK Input Amplitude < 800 mV
SD_REF_CLK
0V
SD_REF_CLK
Figure 41. Single-Ended Reference Clock Input DC Requirements
15.2.3
Interfacing With Other Differential Signaling Levels
With on-chip termination to XCOREVSS, the differential reference clocks inputs are HCSL (High-Speed
Current Steering Logic) compatible DC-coupled.
Many other low voltage differential type outputs like LVDS (Low Voltage Differential Signaling) can be
used but may need to be AC-coupled due to the limited common mode input range allowed (100 to 400
mV) for DC-coupled connection.
LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at clock
driver output first, then followed with series attenuation resistor to reduce the amplitude, in addition to
AC-coupling.
NOTE
Figure 42–Figure 45 are for conceptual reference only. Due to the fact that
clock driver chip's internal structure, output impedance and termination
requirements are different between various clock driver chip manufacturers,
it’s very possible that the clock circuit reference designs provided by clock
driver chip vendor are different from what is shown below. They might also
vary from one vendor to the other. Therefore, Freescale Semiconductor can
neither provide the optimal clock driver reference circuits, nor guarantee the
correctness of the following clock driver connection reference circuits. The
system designer is recommended to contact the selected clock driver chip
vendor for the optimal reference circuits with the MPC8315E SerDes
reference clock receiver requirement provided in this document.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
This figure shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It
assumes that the DC levels of the clock driver chip is compatible with MPC8315E SerDes reference clock
input’s DC requirement.
MPC8315E
HCSL CLK Driver Chip
CLK_Out
33
SD_REF_CLK
50
SerDes Refer.
CLK Receiver
100 differential PWB trace
Clock Driver
33
SD_REF_CLK
CLK_Out
Total 50 Assume clock driver’s
output impedance is about 16
50
Clock driver vendor dependent
source termination resistor
Figure 42. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only)
This figure shows the SerDes reference clock connection reference circuits for LVDS type clock driver.
Since LVDS clock driver’s common mode voltage is higher than the MPC8315E SerDes reference clock
input’s allowed range (100 to 400mV), AC-coupled connection scheme must be used. It assumes the
LVDS output driver features 50-termination resistor. It also assumes that the LVDS transmitter
establishes its own common mode level without relying on the receiver or other external component.
MPC8315E
LVDS CLK Driver Chip
CLK_Out
10 nF
SD_REF_CLK
50
SerDes Refer.
CLK Receiver
100 differential PWB trace
Clock Driver
CLK_Out
10 nF
SD_REF_CLK
50
Figure 43. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only)
Figure 44 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver.
Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with
MPC8315E SerDes reference clock input’s DC requirement, AC-coupling has to be used. Figure 44
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
55
High-Speed Serial Interfaces (HSSI)
assumes that the LVPECL clock driver’s output impedance is 50R1 is used to DC-bias the LVPECL
outputs prior to AC-coupling. Its value could be ranged from 140to 240depending on clock driver
vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50- termination
resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8315E SerDes
reference clock’s differential input amplitude requirement (between 200mV and 800mV differential peak).
For example, if the LVPECL output’s differential peak is 900mV and the desired SerDes reference clock
input amplitude is selected as 600mV, the attenuation factor is 0.67, which requires R2 = 25Please
consult clock driver chip manufacturer to verify whether this connection scheme is compatible with a
particular clock driver chip.
LVPECL CLK
Driver Chip
MPC8315E
CLK_Out
10 nF
R2
SD_REF_CLK
50
SerDes Refer.
CLK Receiver
R1 100 differential PWB trace
Clock Driver
10 nF
R2
SD_REF_CLK
CLK_Out
R1
50
Figure 44. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only)
This figure shows the SerDes reference clock connection reference circuits for a single-ended clock driver.
It assumes the DC levels of the clock driver are compatible with MPC8315E SerDes reference clock
input’s DC requirement.
Single-Ended
CLK Driver Chip
MPC8315E
Total 50 Assume clock driver’s
output impedance is about 16
SD_REF_CLK
33
Clock Driver
CLK_Out
50
SerDes Refer.
CLK Receiver
100 differential PWB trace
50
SD_REF_CLK
50
Figure 45. Single-Ended Connection (Reference Only)
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
56
Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
15.2.4
AC Requirements for SerDes Reference Clocks
The clock driver selected should provide a high quality reference clock with low phase noise and
cycle-to-cycle jitter. Phase noise less than 100KHz can be tracked by the PLL and data recovery loops and
is less of a problem. Phase noise above 15MHz is filtered by the PLL. The most problematic phase noise
occurs in the 1-15MHz range. The source impedance of the clock driver should be 50 to match the
transmission line and reduce reflections which are a source of noise to the system.
This table describes some AC parameters common to SGMII and PCI Express protocols.
Table 52. SerDes Reference Clock Common AC Parameters
At recommended operating conditions with XCOREVDD= 1.0V ± 5%
Parameter
Symbol
Min
Max
Unit
Note
Rising Edge Rate
Rise Edge Rate
1.0
4.0
V/ns
2, 3
Falling Edge Rate
Fall Edge Rate
1.0
4.0
V/ns
2, 3
Differential Input High Voltage
VIH
+200
—
mV
2
Differential Input Low Voltage
VIL
—
–200
mV
2
Rise-Fall
Matching
—
20
%
1, 4
Rising edge rate (SDn_REF_CLK) to falling edge rate
(SDn_REF_CLK) matching
Note:
1. Measurement taken from single ended waveform.
2. Measurement taken from differential waveform.
3. Measured from -200 mV to +200 mV on the differential waveform (derived from SDn_REF_CLK minus SDn_REF_CLK).
The signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is
centered on the differential zero crossing. See Figure 46.
4. Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a
200 mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The
median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The
Rise Edge Rate of SDn_REF_CLK should be compared to the Fall Edge Rate of SDn_REF_CLK, the maximum allowed
difference should not exceed 20% of the slowest edge rate. See Figure 47.
VIH
=
+200
0.0 V
VIL = –200
SDn_REF_CL
K
minus
Figure 46. Differential Measurement Points for Rise and Fall Time
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
57
High-Speed Serial Interfaces (HSSI)
SDn_REF_CLK
SDn_REF_CLK
SDn_REF_CLK
SDn_REF_CLK
Figure 47. Single-Ended Measurement Points for Rise and Fall Time Matching
The other detailed AC requirements of the SerDes Reference Clocks is defined by each interface protocol
based on application usage. Refer to the following sections for detailed information:
• Section 9.5.2, “AC Requirements for SGMII SD_REF_CLK and SD_REF_CLK”
• Section 16.2, “AC Requirements for PCI Express SerDes Clocks”
15.2.4.1
Spread Spectrum Clock
SD_REF_CLK/SD_REF_CLK are not intended to be used with, and should not be clocked by, a spread
spectrum clock source.
15.3
SerDes Transmitter and Receiver Reference Circuits
This figure shows the reference circuits for SerDes data lane’s transmitter and receiver.
TXn
RXn
50
50
Transmitter
Receiver
50
TXn
RXn
50
Figure 48. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below
(PCI Express or SGMII) in this document based on the application usage:
• Section 9.5, “SGMII Interface Electrical Characteristics”
• Section 16, “PCI Express”
Note that external AC Coupling capacitor is required for the above two serial transmission protocols with
the capacitor value defined in specification of each protocol section.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
58
Freescale Semiconductor
PCI Express
16 PCI Express
This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8315E.
16.1
DC Requirements for PCI Express SD_REF_CLK and
SD_REF_CLK
For more information, see Section 15.2, “SerDes Reference Clocks.”
16.2
AC Requirements for PCI Express SerDes Clocks
This table lists the PCI Express SerDes clock AC requirements.
Table 53. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Min
Typ
Max
Unit
Note
REFCLK cycle time
—
10
—
ns
—
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent
REFCLK cycles.
—
—
100
ps
—
tREFPJ
Phase jitter. Deviation in edge location with respect to mean edge location.
–50
—
50
ps
—
tREF
16.3
Parameter Description
Clocking Dependencies
The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)
of each other at all times. This is specified to allow bit rate clock sources with a ±300 ppm tolerance.
16.4
Physical Layer Specifications
Following is a summary of the specifications for the physical layer of PCI Express on this device. For
further details as well as the specifications of the transport and data link layer please use the PCI Express
Base Specification, Rev. 1.0a.
16.4.1
Differential Transmitter (TX) Output
This table defines the specifications for the differential output at all transmitters (TXs). The parameters are
specified at the component pins.
Table 54. Differential Transmitter (TX) Output Specifications
Parameter
Symbol
Unit interval
UI
Differential peak-to-peak
output voltage
VTX-DIFFp-p
Comments
Min
Each UI is 400 ps ± 300 ppm. UI does not 399.88
account for Spread Spectrum Clock
dictated variations.
VTX-DIFFp-p = 2*|VTX-D+ - VTX-D-|
0.8
Typical
Max
Unit
Note
400
400.12
ps
1
—
1.2
V
2
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
59
PCI Express
Table 54. Differential Transmitter (TX) Output Specifications (continued)
Parameter
Symbol
Comments
Min
Typical
Max
Unit
Note
De-Emphasized
differential output voltage
(ratio)
VTX-DE-RATIO
Ratio of the VTX-DIFFp-p of the second and
following bits after a transition divided by
the VTX-DIFFp-p of the first bit after a
transition.
–3.0
–3.5
-4.0
dB
2
TTX-EYE
The maximum Transmitter jitter can be
derived as TTX-MAX-JITTER = 1 - UTX-EYE=
0.3 UI.
0.70
—
—
UI
2, 3
Maximum time between
the jitter median and
maximum deviation from
the median
TTX-EYE-MEDIAN-to-
Jitter is defined as the measurement
variation of the crossing points
(VTX-DIFFp-p = 0 V) in relation to a
recovered TX UI. A recovered TX UI is
calculated over 3500 consecutive unit
intervals of sample data. Jitter is
measured using all edges of the 250
consecutive UI in the center of the 3500 UI
used for calculating the TX UI.
—
—
0.15
UI
2, 3
D+/D- TX output rise/fall
time
TTX-RISE, TTX-FALL
—
0.125
—
—
UI
2, 5
RMS AC peak common
mode output voltage
VTX-CM-ACp
VTX-CM-ACp = RMS(|VTXD+ + VTXD-|/2 VTX-CM-DC)
VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D-|/2
—
—
20
mV
2
Absolute delta of DC
common mode voltage
during L0 and electrical
idle
VTX-CM-DC- ACTIVE-
|VTX-CM-DC (during L0) - VTX-CM-Idle-DC
(During Electrical Idle)| 175 mV
0.4 UI = TRX-EYE-MIN
Figure 50. Minimum Receiver Eye Timing and Voltage Compliance Specification
16.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within
0.2 inches of the package pins, into a test/measurement load shown in Figure 51.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
65
Timers
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
Figure 51. Compliance Test/Measurement Load
17 Timers
This section describes the DC and AC electrical specifications for the timers of the MPC8314E.
17.1
Timers DC Electrical Characteristics
This table provides the DC electrical characteristics for the timers pins, including TIN, TOUT, TGATE,
and RTC_CLK.
Table 56. Timers DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V VIN NVDD
—
±5
A
17.2
Timers AC Timing Specifications
This table provides the timers input and output AC timing specifications.
Table 57. Timers Input AC Timing Specifications
Characteristic
Timers inputs—minimum pulse width
Symbol 1
Min
Unit
tTIWID
20
ns
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66
Freescale Semiconductor
GPIO
Table 57. Timers Input AC Timing Specifications
Symbol 1
Characteristic
Min
Unit
Note:
1. Timers inputs and outputs are asynchronous to any visible clock. Timers outputs should be synchronized before use by any
external synchronous logic. Timers input are required to be valid for at least tTIWID ns to ensure proper operation.
This figure provides the AC test load for the Timers.
Z0 = 50
Output
NVDD/2
RL = 50
Figure 52. Timers AC Test Load
18 GPIO
This section describes the DC and AC electrical specifications for the GPIO of the MPC8314E.
18.1
GPIO DC Electrical Characteristics
This table provides the DC electrical characteristics for the GPIO.
Table 58. GPIO DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V VIN NVDD
—
±5
A
Symbol 1
Min
Unit
tPIWID
20
ns
18.2
GPIO AC Timing Specifications
This table provides the GPIO input and output AC timing specifications.
Table 59. GPIO Input AC Timing Specifications
Characteristic
GPIO inputs—minimum pulse width
Note:
1. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any
external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
67
IPIC
This figure provides the AC test load for the GPIO.
Output
Z0 = 50
NVDD/2
RL = 50
Figure 53. GPIO AC Test Load
19 IPIC
This section describes the DC and AC electrical specifications for the external interrupt pins of the
MPC8314E.
19.1
IPIC DC Electrical Characteristics
This table provides the DC electrical characteristics for the external interrupt pins.
Table 60. IPIC DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
—
—
±5
A
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Symbol 1
Min
Unit
tPIWID
20
ns
19.2
IPIC AC Timing Specifications
This table provides the IPIC input and output AC timing specifications.
Table 61. IPIC Input AC Timing Specifications
Characteristic
IPIC inputs—minimum pulse width
Note:
1. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any
external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when
working in edge triggered mode.
20 SPI
This section describes the DC and AC electrical specifications for the SPI of the MPC8314E.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
SPI
20.1
SPI DC Electrical Characteristics
This table provides the DC electrical characteristics for the SPI.
Table 62. SPI DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
—
—
±5
A
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
20.2
SPI AC Timing Specifications
This table and provide the SPI input and output AC timing specifications.
Table 63. SPI AC Timing Specifications 1
Symbol 2
Min
Max
Unit
SPI outputs valid—master mode (internal clock) delay
tNIKHOV
—
6
ns
SPI outputs hold—master mode (internal clock) delay
tNIKHOX
0.5
SPI outputs valid—slave mode (external clock) delay
tNEKHOV
—
8.5
ns
SPI outputs hold—slave mode (external clock) delay
tNEKHOX
2
—
ns
SPI inputs—master mode (internal clock) input setup time
tNIIVKH
6
—
ns
SPI inputs—master mode (internal clock)input hold time
tNIIXKH
0
—
ns
SPI inputs—slave mode (external clock) input setup time
tNEIVKH
4
—
ns
SPI inputs—slave mode (external clock) input hold time
tNEIXKH
2
—
ns
Characteristic
ns
Note:
1. Output specifications are measured from the 50% level of the rising edge of SPICLK to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal
timing (NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X).
This figure provides the AC test load for the SPI.
Output
Z0 = 50
RL = 50
NVDD/2
Figure 54. SPI AC Test Load
Figure 55 and Figure 56 represent the AC timing from Table 63. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
69
TDM
This figure shows the SPI timing in slave mode (external clock).
SPICLK (Input)
Input Signals:
SPIMOSI
(See Note)
tNEIXKH
tNEIVKH
tNEKHOV
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
Figure 55. SPI AC Timing in Slave Mode (External Clock) Diagram
This figure shows the SPI timing in master mode (internal clock).
SPICLK (Output)
Input Signals:
SPIMISO
(See Note)
tNIIXKH
tNIIVKH
tNIKHOV
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
Figure 56. SPI AC Timing in Master Mode (Internal Clock) Diagram
21 TDM
This section describes the DC and AC electrical specifications for the TDM of the MPC8314E.
21.1
TDM DC Electrical Characteristics
This table provides the DC electrical characteristics TDM.
Table 64. TDM DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.1
NVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V VIN NVDD
—
±5
A
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
70
Freescale Semiconductor
TDM
21.2
TDM AC Electrical Characteristics
This table provides the TDM AC timing specifications.
Table 65. TDM AC Timing specifications
Parameter/Condition
Symbol
Min
Max
Unit
tDM
20.0
—
ns
TDMxRCK/TDMxTCK high pulse width
tDM_HIGH
8.0
—
ns
TDMxRCK/TDMxTCK low pulse width
tDM_LOW
8.0
—
ns
TDMxRCK/TDMxTCK rise time (20% to 80%)
tDMKH
1.0
4.0
ns
TDMxRCK/TDMxTCK fall time (80% to 20%)
tDMKL
1.0
4.0
ns
tDMIVKH
3.0
—
ns
TDMxRD hold time
tDMRDIXKH
3.5
—
ns
TDMxTFS/TDMxRFS input hold time
tDMFSIXKH
2.0
—
ns
TDMxTCK High to TDMxTD output active
tDM_OUTAC
4.0
—
ns
TDMxTCK High to TDMxTD output valid
tDMTKHOV
—
14.0
ns
TDMxTD hold time
tDMTKHOX
2.0
—
ns
TDMxTCK High to TDMxTD output high impedance
tDM_OUTHI
—
10.0
ns
TDMxTFS/TDMxRFS output valid
tDMFSKHOV
—
13.5
ns
TDMxTFS/TDMxRFS output hold time
tDMFSKHOX
2.5
—
ns
TDMxRCK/TDMxTCK
TDM all input setup time
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTDMIVKH symbolizes TDM timing
(DM) with respect to the time the input signals (I) reach the valid state (V) relative to the TDM Clock, tTC, reference (K) going to
the high (H) state or setup time. Also, output signals (O), hold (X).
2. Output values are based on 30 pF capacitive load.
3. Inputs are referenced to the sampling that the TDM is programmed to use. Outputs are referenced to the programming edge
they are programmed to use. Use of the rising edge or falling edge as a reference is programmable. TDMxTCK and TDMxRCK
are shown using the rising edge.
This figure shows the TDM receive signal timing.
tDM
tDM_HIGH
tDM_LOW
TDMxRCK
tDMIVKH
tDMRDIXKH
TDMxRD
tDMIVKH
tDMFSIXKH
TDMxRFS
tDMFSKHOV
~
~
TDMxRFS (output)
tDMFSKHOX
Figure 57. TDM Receive Signals
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
71
Package and Pin Listings
This figure shows the TDM transmit signal timing.
tDM
tDM_HIGH
tDM_OUTHI
tDMTKHOV
tDM_OUTAC
TDMxTD
TDMxRCK
tDMFSKHOV
TDMxTFS (output)
tDMIVKH
tDMFSIXKH
~
~ ~
~
TDMxTCK
tDM_LOW
tDMTKHOX
tDMFSKHOX
TDMxTFS (input)
Figure 58. TDM Transmit Signals
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8314E is available in
a thermally enhanced plastic ball grid array (TEPBGA II), see Section 22.1, “Package Parameters for the
MPC8314E TEPBGA II,” and Section 22.2, “Mechanical Dimensions of the TEPBGA II,” for information
on the TEPBGA II.
22.1
Package Parameters for the MPC8314E TEPBGA II
The package parameters are as provided in the following list. The package type is 29 mm 29 mm,
TEPBGA II.
Package outline
29 mm 29 mm
Interconnects
620
Pitch
1 mm
Module height (typical)
2.23 mm
Solder balls
96.5 Sn/3.5 Ag (VR package)
Ball diameter (typical)
0.6 mm
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
72
Freescale Semiconductor
Package and Pin Listings
22.2
Mechanical Dimensions of the TEPBGA II
This figure shows the mechanical dimensions and bottom surface nomenclature of the 620-pin TEPBGA II
package.
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
22.3
Pinout Listings
This table provides the pin-out listing for the TEPBGA II package.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
73
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Note
DDR Memory Controller Interface
MEMC_MDQ[0]
AF16
I/O
GVDD
—
MEMC_MDQ[1]
AE17
I/O
GVDD
—
MEMC_MDQ[2]
AH17
I/O
GVDD
—
MEMC_MDQ[3]
AG17
I/O
GVDD
—
MEMC_MDQ[4]
AG18
I/O
GVDD
—
MEMC_MDQ[5]
AH18
I/O
GVDD
—
MEMC_MDQ[6]
AD18
I/O
GVDD
—
MEMC_MDQ[7]
AF19
I/O
GVDD
—
MEMC_MDQ[8]
AH19
I/O
GVDD
—
MEMC_MDQ[9]
AD19
I/O
GVDD
—
MEMC_MDQ[10]
AG20
I/O
GVDD
—
MEMC_MDQ[11]
AH20
I/O
GVDD
—
MEMC_MDQ[12]
AH21
I/O
GVDD
—
MEMC_MDQ[13]
AE21
I/O
GVDD
—
MEMC_MDQ[14]
AH22
I/O
GVDD
—
MEMC_MDQ[15]
AD21
I/O
GVDD
—
MEMC_MDQ[16]
AG10
I/O
GVDD
—
MEMC_MDQ[17]
AH9
I/O
GVDD
—
MEMC_MDQ[18]
AH8
I/O
GVDD
—
MEMC_MDQ[19]
AD11
I/O
GVDD
—
MEMC_MDQ[20]
AH7
I/O
GVDD
—
MEMC_MDQ[21]
AG7
I/O
GVDD
—
MEMC_MDQ[22]
AF8
I/O
GVDD
—
MEMC_MDQ[23]
AD10
I/O
GVDD
—
MEMC_MDQ[24]
AE9
I/O
GVDD
—
MEMC_MDQ[25]
AH6
I/O
GVDD
—
MEMC_MDQ[26]
AH5
I/O
GVDD
—
MEMC_MDQ[27]
AG6
I/O
GVDD
—
MEMC_MDQ[28]
AH4
I/O
GVDD
—
MEMC_MDQ[29]
AE6
I/O
GVDD
—
MEMC_MDQ[30]
AD8
I/O
GVDD
—
MEMC_MDQ[31]
AF5
I/O
GVDD
—
MEMC_MDM0
AE18
O
GVDD
—
MEMC_MDM1
AE20
O
GVDD
—
MEMC_MDM2
AE10
O
GVDD
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
MEMC_MDM3
AF6
O
GVDD
—
MEMC_MDQS[0]
AF17
I/O
GVDD
—
MEMC_MDQS[1]
AG21
I/O
GVDD
—
MEMC_MDQS[2]
AG9
I/O
GVDD
—
MEMC_MDQS[3]
AF7
I/O
GVDD
—
MEMC_MBA[0]
AH16
O
GVDD
—
MEMC_MBA[1]
AH15
O
GVDD
—
MEMC_MBA[2]
AG15
O
GVDD
—
MEMC_MA0
AD15
O
GVDD
—
MEMC_MA1
AE15
O
GVDD
—
MEMC_MA2
AH14
O
GVDD
—
MEMC_MA3
AG14
O
GVDD
—
MEMC_MA4
AF14
O
GVDD
—
MEMC_MA5
AE14
O
GVDD
—
MEMC_MA6
AH13
O
GVDD
—
MEMC_MA7
AH12
O
GVDD
—
MEMC_MA8
AF13
O
GVDD
—
MEMC_MA9
AD13
O
GVDD
—
MEMC_MA10
AG12
O
GVDD
—
MEMC_MA11
AH11
O
GVDD
—
MEMC_MA12
AH10
O
GVDD
—
MEMC_MA13
AE12
O
GVDD
—
MEMC_MA14
AF11
O
GVDD
—
MEMC_MWE
AE5
O
GVDD
—
MEMC_MRAS
AD7
O
GVDD
—
MEMC_MCAS
AG4
O
GVDD
—
MEMC_MCS[0]
AH3
O
GVDD
—
MEMC_MCS[1]
AD5
O
GVDD
—
MEMC_MCKE
AE4
O
GVDD
3
MEMC_MCK[0]
AF4
O
GVDD
—
MEMC_MCK[0]
AF3
O
GVDD
—
MEMC_MCK[1]
AF1
O
GVDD
—
MEMC_MCK[1]
AE1
O
GVDD
—
MEMC_MODT[0]
AE3
O
GVDD
—
MEMC_MODT[1]
AD4
O
GVDD
—
MEMC_MVREF
AD12
I
GVDD
—
Signal
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
75
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Note
Local Bus Controller Interface
LAD0
AB28
I/O
NVDD3_OFF
10
LAD1
AB27
I/O
NVDD3_OFF
10
LAD2
AC28
I/O
NVDD3_OFF
10
LAD3
AA24
I/O
NVDD3_OFF
10
LAD4
AC27
I/O
NVDD3_OFF
10
LAD5
AD28
I/O
NVDD3_OFF
10
LAD6
AB25
I/O
NVDD3_OFF
10
LAD7
AC26
I/O
NVDD3_OFF
10
LAD8
AD27
I/O
NVDD3_OFF
10
LAD9
AB24
I/O
NVDD3_OFF
10
LAD10
AE28
I/O
NVDD3_OFF
10
LAD11
AE27
I/O
NVDD3_OFF
10
LAD12
AE26
I/O
NVDD3_OFF
10
LAD13
AF28
I/O
NVDD3_OFF
10
LAD14
AC24
I/O
NVDD3_OFF
10
LAD15
AD25
I/O
NVDD3_OFF
10
LA16
V24
O
NVDD3_OFF
10
LA17
V25
O
NVDD3_OFF
10
LA18
W26
O
NVDD3_OFF
10
LA19
W28
O
NVDD3_OFF
10
LA20
U24
O
NVDD3_OFF
10
LA21
W24
O
NVDD3_OFF
10
LA22
Y28
O
NVDD3_OFF
10
LA23
AH23
O
NVDD3_OFF
10
LA24
AH24
O
NVDD3_OFF
10
LA25
AG23
O
NVDD3_OFF
10
LCS[0]
AD22
O
NVDD3_OFF
11
LCS[1]
AF25
O
NVDD3_OFF
11
LCS[2]
AG24
O
NVDD3_OFF
11
LCS[3]
AF24
O
NVDD3_OFF
11
LWE[0] /LFWE/LBS
AE23
O
NVDD3_OFF
11
LWE[1]
AG26
O
NVDD3_OFF
11
LBCTL
AH26
O
NVDD3_OFF
11
LALE
AF26
O
NVDD3_OFF
10
Y27
O
NVDD3_OFF
—
LGPL0/LFCLE
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
76
Freescale Semiconductor
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
AA28
O
NVDD3_OFF
—
LGPL2/LFRE/LOE
Y25
O
NVDD3_OFF
11
LGPL3/LFWP
Y24
O
NVDD3_OFF
—
LGPL4/LGTA/LUPWAIT/LFRB
AA26
I/O
NVDD3_OFF
2
LGPL5
AF22
O
NVDD3_OFF
11
LCLK0
AH25
O
NVDD3_OFF
10
LCLK1
AD24
O
NVDD3_OFF
10
Signal
LGPL1/LFALE
DUART
UART_SOUT1/MSRCID0 (DDR
ID)/LSRCID0
C15
O
NVDD2_OFF
—
UART_SIN1/MSRCID1 (DDR ID)/LSRCID1
B16
I/O
NVDD2_OFF
—
UART_CTS[1]/MSRCID2 (DDR
ID)/LSRCID2
D16
I/O
NVDD2_OFF
—
UART_RTS[1]/MSRCID3 (DDR
ID)/LSRCID3
B17
O
NVDD2_OFF
—
UART_SOUT2/MSRCID4 (DDR
ID)/LSRCID4
A16
O
NVDD2_OFF
—
UART_SIN2/MDVAL (DDR ID)/LDVAL
C16
I/O
NVDD2_OFF
—
UART_CTS[2]
A17
I
NVDD2_OFF
—
UART_RTS[2]
A18
O
NVDD2_OFF
—
I2C interface
IIC_SDA/CKSTOP_OUT
N1
I/O
NVDD4_OFF
2
IIC_SCL/CKSTOP_IN
N2
I/O
NVDD4_OFF
2
Interrupts
MCP_OUT
W1
O
NVDD1_OFF
2
IRQ[0]/MCP_IN
Y3
I
NVDD1_OFF
—
IRQ[1]
E1
I
NVDD1_ON
—
IRQ[2]
A7
I
NVDD1_ON
—
IRQ[3]
AA1
I
NVDD1_OFF
—
IRQ[4]
Y5
I
NVDD1_OFF
—
IRQ[5]/CORE_SRESET_IN
AA2
I
NVDD1_OFF
—
IRQ[6] /CKSTOP_OUT
AA4
I/O
NVDD1_OFF
—
IRQ[7]/CKSTOP_IN
AA5
I
NVDD1_OFF
—
Configuration
CFG_CLKIN_DIV
A5
I
NVDD1_ON
11
EXT_PWR_CTRL
D3
O
NVDD1_ON
11
PMC_PWR_OK
D4
I
—
11
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Note
JTAG
TCK
E5
I
NVDD1_ON
—
TDI
B4
I
NVDD1_ON
4
TDO
C4
O
NVDD1_ON
3
TMS
C3
I
NVDD1_ON
4
TRST
C2
I
NVDD1_ON
4
TDM
GPIO_18/TDM_RCK
AB1
I/O
NVDD1_OFF
—
GPIO_20/TDM_RD
AC1
I/O
NVDD1_OFF
—
GPIO_19/TDM_RFS
AB3
I/O
NVDD1_OFF
—
GPIO_21/TDM_TCK
AB5
I/O
NVDD1_OFF
—
GPIO_23/TDM_TD
AC3
I/O
NVDD1_OFF
—
GPIO_22/TDM_TFS
AC2
I/O
NVDD1_OFF
—
I
NVDD1_ON
6
O
NVDD1_ON
—
TEST
TEST_MODE
D6
DEBUG
QUIESCE
B5
System Control
HRESET
B6
I/O
NVDD1_ON
1
PORESET
A6
I
NVDD1_ON
—
Clocks
SYS_XTAL_IN
L27
I
NVDD2_ON
—
SYS_XTAL_OUT
J28
O
NVDD2_ON
—
SYS_CLK_IN
K28
I
NVDD2_ON
—
USB_XTAL_IN
A15
I
NVDD2_OFF
—
USB_XTAL_OUT
B14
O
NVDD2_OFF
—
USB_CLK_IN
B15
I
NVDD2_OFF
—
PCI_SYNC_OUT
J27
O
NVDD2_ON
3
RTC_CLK
K26
I
NVDD2_ON
—
PCI_SYNC_IN
K27
I
NVDD2_ON
—
MISC
AVDD1
AC15
I
—
—
AVDD2
M23
I
—
—
THERM0
L25
I
NVDD2_ON
7
DMA_DACK0/GPIO_13
AC4
I/O
NVDD1_OFF
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
78
Freescale Semiconductor
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
DMA_DREQ0/GPIO_12
AD1
I/O
NVDD1_OFF
—
DMA_DONE0/GPIO_14
AD2
I/O
NVDD1_OFF
—
NC, No Connect
A2
—
—
—
NC, No Connect
M25
—
—
—
NC, No Connect
P26
—
—
—
NC, No Connect
N25
—
—
—
NC, No Connect
U26
—
—
—
NC, No Connect
T25
—
—
—
NC, No Connect
R26
—
—
—
NC, No Connect
U25
—
—
—
Signal
PCI
PCI_INTA
B18
O
NVDD2_OFF
—
PCI_RESET_OUT
A20
O
NVDD2_OFF
—
PCI_AD[0]
J25
I/O
NVDD2_OFF
—
PCI_AD[1]
J24
I/O
NVDD2_OFF
—
PCI_AD[2]
K24
I/O
NVDD2_OFF
—
PCI_AD[3]
H27
I/O
NVDD2_OFF
—
PCI_AD[4]
H28
I/O
NVDD2_OFF
—
PCI_AD[5]
H26
I/O
NVDD2_OFF
—
PCI_AD[6]
G27
I/O
NVDD2_OFF
—
PCI_AD[7]
G28
I/O
NVDD2_OFF
—
PCI_AD[8]
F26
I/O
NVDD2_OFF
—
PCI_AD[9]
F28
I/O
NVDD2_OFF
—
PCI_AD[10]
G25
I/O
NVDD2_OFF
—
PCI_AD[11]
F27
I/O
NVDD2_OFF
—
PCI_AD[12]
E27
I/O
NVDD2_OFF
—
PCI_AD[13]
E28
I/O
NVDD2_OFF
—
PCI_AD[14]
D28
I/O
NVDD2_OFF
—
PCI_AD[15]
D27
I/O
NVDD2_OFF
—
PCI_AD[16]
B25
I/O
NVDD2_OFF
—
PCI_AD[17]
D24
I/O
NVDD2_OFF
—
PCI_AD[18]
B26
I/O
NVDD2_OFF
—
PCI_AD[19]
C24
I/O
NVDD2_OFF
—
PCI_AD[20]
A26
I/O
NVDD2_OFF
—
PCI_AD[21]
E20
I/O
NVDD2_OFF
—
PCI_AD[22]
A23
I/O
NVDD2_OFF
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
79
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
PCI_AD[23]
C22
I/O
NVDD2_OFF
—
PCI_AD[24]
E19
I/O
NVDD2_OFF
—
PCI_AD[25]
A22
I/O
NVDD2_OFF
—
PCI_AD[26]
C20
I/O
NVDD2_OFF
—
PCI_AD[27]
B21
I/O
NVDD2_OFF
—
PCI_AD[28]
D19
I/O
NVDD2_OFF
—
PCI_AD[29]
A19
I/O
NVDD2_OFF
—
PCI_AD[30]
A21
I/O
NVDD2_OFF
—
PCI_AD[31]
B19
I/O
NVDD2_OFF
—
PCI_C/BE[0]
H24
I/O
NVDD2_OFF
—
PCI_C/BE[1]
C27
I/O
NVDD2_OFF
—
PCI_C/BE[2]
A25
I/O
NVDD2_OFF
—
PCI_C/BE[3]
E21
I/O
NVDD2_OFF
—
PCI_PAR
G24
I/O
NVDD2_OFF
—
PCI_FRAME
C28
I/O
NVDD2_OFF
5
PCI_TRDY
A24
I/O
NVDD2_OFF
5
PCI_IRDY
D25
I/O
NVDD2_OFF
5
PCI_STOP
D23
I/O
NVDD2_OFF
5
PCI_DEVSEL
E22
I/O
NVDD2_OFF
5
PCI_IDSEL
D26
I
NVDD2_OFF
—
PCI_SERR
C25
I/O
NVDD2_OFF
5
PCI_PERR
D21
I/O
NVDD2_OFF
5
PCI_REQ0
E18
I/O
NVDD2_OFF
—
PCI_REQ1/CPCI_HS_ES
C18
I
NVDD2_OFF
—
PCI_REQ2
E17
I
NVDD2_OFF
—
PCI_GNT0
B20
I/O
NVDD2_OFF
—
PCI_GNT1/CPCI_HS_LED
D17
O
NVDD2_OFF
—
PCI_GNT2/CPCI_HS_ENUM
E15
O
NVDD2_OFF
—
M66EN
L24
I
NVDD2_OFF
—
PCI_CLK0
E23
O
NVDD2_OFF
—
PCI_CLK1
F24
O
NVDD2_OFF
—
PCI_CLK2
E25
O
NVDD2_OFF
—
PCI_PME
B23
I/O
NVDD2_OFF
2
Signal
ETSEC1/_USBULPI
GPIO_24/TSEC1_COL/USBDR_TXDRXD0
J1
I/O
LVDD1_OFF
—
GPIO_25/TSEC1_CRS/USBDR_TXDRXD1
H1
I/O
LVDD1_OFF
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
80
Freescale Semiconductor
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
TSEC1_GTX_CLK/USBDR_TXDRXD2
K5
I/O
LVDD1_OFF
3
TSEC1_RX_CLK/USBDR_TXDRXD3
J4
I/O
LVDD1_OFF
—
TSCE1_RX_DV/USBDR_TXDRXD4
J2
I/O
LVDD1_OFF
—
TSEC1_RXD[3]/USBDR_TXDRXD5
G1
I/O
LVDD1_OFF
—
TSEC1_RXD[2]/USBDR_TXDRXD6
H3
I/O
LVDD1_OFF
—
TSEC1_RXD[1]/USBDR_TXDRXD7/TSEC
_TMR_CLK
J5
I/O
LVDD1_OFF
—
TSEC1_RXD[0]/USBDR_NXT/TSEC_TMR
_TRIG1
H2
I
LVDD1_OFF
—
TSEC1_RX_ER/USBDR_DIR/TSEC_TMR_
TRIG2
H5
I
LVDD1_OFF
—
TSEC1_TX_CLK/USBDR_CLK
G2
I
LVDD1_OFF
—
GPIO_28/TSEC1_TXD[3]/TSEC_TMR_GC
LK
F3
I/O
LVDD1_OFF
—
GPIO_29/TSEC1_TXD[2]/TSEC_TMR_PP1
F2
I/O
LVDD1_OFF
—
GPIO_30/TSEC1_TXD[1]/TSEC_TMR_PP2
F1
I/O
LVDD1_OFF
—
TSEC1_TXD[0]/USBDR_STP/
TSEC_TMR_PP3
G4
O
LVDD1_OFF
11
GPIO_31/TSEC1_TX_EN/TSEC_TMR_AL
ARM1
F4
I/O
LVDD1_OFF
—
TSEC1_TX_ER/TSEC_TMR_ALARM2
G5
O
LVDD1_OFF
—
TSEC_GTX_CLK125
D1
I
NVDD1_ON
—
TSEC_MDC/LB_POR_CFG_BOOT_ECC
E3
I/O
NVDD1_ON
9
TSEC_MDIO
E2
I/O
NVDD1_ON
Signal
ETSEC2
GPIO_26/TSEC2_COL
A8
I/O
LVDD2_ON
—
GPIO_27/TSEC2_CRS
E9
I/O
LVDD2_ON
—
TSEC2_GTX_CLK
B10
O
LVDD2_ON
—
TSEC2_RX_CLK
B8
I
LVDD2_ON
—
TSCE2_RX_DV
C9
I
LVDD2_ON
—
TSEC2_RXD[3]
C10
I
LVDD2_ON
—
TSEC2_RXD[2]
D10
I
LVDD2_ON
—
TSEC2_RXD[1]
A9
I
LVDD2_ON
—
TSEC2_RXD[0]
B9
I
LVDD2_ON
—
TSEC2_RX_ER
A10
I
LVDD2_ON
—
TSEC2_TX_CLK
D8
I
LVDD2_ON
—
TSEC2_TXD[3]/CFG_RESET_SOURCE[0]
D11
I/O
LVDD2_ON
—
TSEC2_TXD[2]/CFG_RESET_SOURCE[1]
C7
I/O
LVDD2_ON
—
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
81
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Note
TSEC2_TXD[1]/CFG_RESET_SOURCE[2]
E8
I/O
LVDD2_ON
—
TSEC2_TXD[0]/CFG_RESET_SOURCE[3]
B7
I/O
LVDD2_ON
—
TSEC2_TX_EN
D12
O
LVDD2_ON
—
TSEC2_TX_ER
B11
O
LVDD2_ON
—
SGMII / PCI Express PHY
TXA
P4
O
XPADVDD
—
TXA
N4
O
XPADVDD
—
RXA
R1
I
XCOREVDD
—
RXA
P1
I
XCOREVDD
—
TXB
U4
O
XPADVDD
—
TXB
V4
O
XPADVDD
—
RXB
U1
I
XCOREVDD
—
RXB
V1
I
XCOREVDD
—
SD_IMP_CAL_RX
N3
I
XCOREVDD
—
SD_REF_CLK
R4
I
XCOREVDD
—
SD_REF_CLK
R5
I
XCOREVDD
—
SD_PLL_TPD
T2
O
—
—
SD_IMP_CAL_TX
V5
I
XPADVDD
—
SDAVDD
T3
I
—
—
SD_PLL_TPA_ANA
T4
O
—
—
SDAVSS
T5
I
—
—
USB Phy
USB_DP
A11
I/O
USB_VDDA
—
USB_DM
A12
I/O
USB_VDDA
—
USB_VBUS
C12
I
—
—
USB_TPA
A14
O
—
—
USB_RBIAS
D14
I
—
8
USB_PLL_PWR3
A13
I
—
—
USB_PLL_GND0 & USB_PLL_GND1
D13
I
—
—
USB_PLL_PWR1
B13
I
—
—
USB_VSSA_BIAS
E14
I
—
—
USB_VDDA_BIAS
C14
I
—
—
USB_VSSA
E13
I
—
—
USB_VDDA
E12
I
—
—
I/O
NVDD1_ON
—
GPIO
GPIO_0/DMA_DREQ1/GTM1_TOUT1
C5
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
82
Freescale Semiconductor
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Note
GPIO_1/DMA_DACK1/GTM1_TIN2/GTM2_
TIN1
A4
I/O
NVDD1_ON
—
GPIO_2/DMA_DONE1/GTM1_TGATE2/GT
M2_TGATE1
K3
I/O
NVDD4_OFF
—
GPIO_3/GTM1_TIN3/GTM2_TIN4
K1
I/O
NVDD4_OFF
—
GPIO_4/GTM1_TGATE3/GTM2_TGATE4
K2
I/O
NVDD4_OFF
—
GPIO_5/GTM1_TOUT3/GTM2_TOUT1
L5
I/O
NVDD4_OFF
—
GPIO_6/GTM1_TIN4/GTM2_TIN3
L3
I/O
NVDD4_OFF
—
GPIO_7/GTM1_TGATE4/GTM2_TGATE3
L1
I/O
NVDD4_OFF
—
GPIO_8/USBDR_DRIVE_VBUS/GTM1_TI
N1/GTM2_TIN2
M1
I/O
NVDD4_OFF
—
GPIO_9/USBDR_PWRFAULT/GTM1_TGAT
E1/GTM2_TGATE2
M2
I/O
NVDD4_OFF
—
GPIO_10/USBDR_PCTL0/GTM1_TOUT2/
GTM2_TOUT1
M5
I/O
NVDD4_OFF
—
GPIO_11/USBDR_PCTL1/GTM1_TOUT4/
GTM2_TOUT3
M4
I/O
NVDD4_OFF
—
SPI
SPIMOSI/GPIO_15
W3
I/O
NVDD1_OFF
—
SPIMISO/GPIO_16
W4
I/O
NVDD1_OFF
—
SPICLK
Y1
I/O
NVDD1_OFF
—
SPISEL/GPIO_17
W2
I/O
NVDD1_OFF
—
Y11, Y12, Y14, Y15, Y17, AC8, AC11,
AC14, AC17, AD6, AD9, AD17, AE8,
AE13, AE19, AF10, AF15, AF21, AG2,
AG3, AG8, AG13, AG19, AH2
I
—
—
LVDD1_OFF
H6, J3, L6, L9, M9
I
—
—
LVDD2_ON
C11, D9, E10, F11, J12
I
—
—
NVDD1_OFF
U9, V9, W10, Y4, Y6,
AA3, AB4
I
—
—
NVDD1_ON
B1, B2, C1, D5, E7, F5, F9, J11, K10
I
—
—
NVDD2_OFF
B22, B27, C19, E16, F15, F18, F21, F25,
H25, J17, J18, J23, L20, M20
I
—
—
NVDD2_ON
L26, N19
I
—
—
NVDD3_OFF
U20, V20, V23, V26, W19, Y18, Y26,
AA23, AA25, AC20, AC25, AD23, AE25,
AG25, AG27, T27, U27
I
—
—
NVDD4_OFF
K4, L2, M6, N10
I
—
—
Power and Ground Supplies
GVDD
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
83
Package and Pin Listings
Table 66. MPC8314E TEPBGA II Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Note
J15, K15, K16, K17, K18, K19, L10, L19,
M10, T10, U10, U19, V10, V19, W11, W12,
W13, W14, W15, W16, W17, W18, P23,
R23, T19, M26, N26, P28, R28, U23, N27
I
—
—
J14, K11, K12, K13,
K14, M19
I
—
—
A3, A27, B3, B12, B24, B28, C6, C8, C13,
C17, C21, C23, C26, D2, D7, D15, D18,
D20, D22, E4, E6, E11, E24, E26, F8, F12,
F14, F17, F20, G3, G26, H4, H23, J6, J26,
K25, L4, L11, L12, L13, L14, L15, L16, L17,
L18, L23, L28, M3, M11, M12, M13, M14,
M15, M16, M17, M18, N5, N11, N12, N13,
N14, N15, N16, N17, N18, P6, P11, P12,
P13, P14, P15, P16, P17, P18, R6, R11,
R12, R13, R14, R15, R16, R17, R18, T11,
T12, T13, T14, T15, T16, T17, T18, U5, U6,
U11, U12, U13, U14, U15, U16, U17, U18,
V6, V11, V12, V13, V14, V15, V16, V17,
V18, W5, W25, W27, Y2, Y23, AA6, AA27,
AB2, AB26, AC5, AC9, AC12, AC18, AC21,
AD3, AD14, AD16, AD20, AD26, AE2,
AE7, AE11, AE16, AE22, AE24, AF2, AF9,
AF12, AF18, AF20, AF23, AF27, AG1,
AG5, AG11, AG16, AG22, AG28, AH27,
U28,N28, M28, T28, V27, M27, V28, T26,
P24, R19, R20, R24, M24, N24, P19, P20,
P25, P27, R25, R27, T24
I
—
—
XCOREVDD
P2, P10, R2, T1
I
—
—
XCOREVSS
R3, R10, U2, V2
I
—
—
XPADVDD
P3, R9, U3
I
—
—
XPADVSS
P5, P9, V3
I
—
—
Signal
VDD
VDDC
VSS
Note:
1. This pin is an open drain signal. A weak pull-up resistor (1 k) should be placed on this pin to NVDD.
2. This pin is an open drain signal. A weak pull-up resistor (2–10 k) should be placed on this pin to NVDD.
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation.
6. This pin must always be tied to VSS.
7. Thermal sensitive resistor.
8. This pin should be connected to USB_VSSA_BIAS through 10K precision resistor.
9. The LB_POR_CFG_BOOT_ECC functionality for this pin is only available in MPC8314E revision 1.1 and later. The
LB_POR_CFG_BOOT_ECC is sampled only during the PORESET negation. This pin with an internal pull down resistor enables
the ECC by default. To disable the ECC an external strong pull up resistor or a tristate buffer is needed.
10.This pin has a weak internal pull-down.
11.This pin has a weak internal pull-up.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
84
Freescale Semiconductor
Clocking
23 Clocking
This figure shows the internal distribution of clocks within the MPC8314E
e300c3 core
Core PLL core_clk
MPC8314E
USB Mac
TDM
USB PHY
PLL
/n
x M1
to DDR
memory
controller
mux
USB_CLK_IN
csb_clk
USB_XTAL_IN
x
Crystal
/1,/2
USB_XTAL_OUT
DDR
Clock
Divider
/2
MEMC_MCK
/n
LCLK[0:1]
MEMC_MCK
ddr_clk
lbc_clk
L2
Clock
Unit
System
PLL
To local bus
CFG_CLKIN
_DIV
SYS_CLK_IN
SYS_XTAL_IN
PCI Clock
Divider (2)
PCI_CLK/
PCI_SYNC_IN
1
0
eTSEC
Protocol
Converter
PCI Express
Protocol
Converter
PCI_SYNC_OUT
3
SYS_XTAL_OUT
GTX_CLK125
125-MHz source
Local Bus
Memory
Device
LBC
Clock
Divider
csb_clk to rest
of the device
Crystal
DDR
Memory
Device
PCI_CLK_OUT[0:2]
RTC
Sys Ref
RTC_CLK (32 kHz)
PCVTR Mux
SD_REF_CLK
SD_REF_CLK_B
125/100 MHz
1
2
+
-
PLL
SerDes PHY
Multiplication factor M = 1, 1.5, 2, 2.5, and 3. Value is decided by RCWLR[COREPLL].
Multiplication factor L = 2, 3, 4 and 5. Value is decided by RCWLR[SPMF].
Figure 60. MPC8314E Clock Subsystem
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
85
Clocking
The primary clock source can be one of two inputs, SYS_CLK_IN or PCI_CLK, depending on whether
the device is configured in PCI host or PCI agent mode. When the device is configured as a PCI host
device, SYS_CLK_IN is its primary input clock. SYS_CLK_IN feeds the PCI clock divider (2) and the
multiplexors for PCI_SYNC_OUT and PCI_CLK_OUT. The CFG_SYS_CLKIN_DIV configuration
input selects whether SYS_CLK_IN or SYS_CLK_IN/2 is driven out on the PCI_SYNC_OUT signal.
PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to
synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN,
with equal delay to all PCI agent devices in the system, to allow the device to function. When the device
is configured as a PCI agent device, PCI_CLK is the primary input clock. When the device is configured
as a PCI agent device the SYS_CLK_IN signal should be tied to GND.
As shown in Figure 60, the primary clock input (frequency) is multiplied up by the system phase-locked
loop (PLL) and the clock unit to create the coherent system bus clock (csb_clk), the internal clock for the
DDR controller (ddr_clk), and the internal clock for the local bus interface unit (lbiu_clk).
The csb_clk frequency is derived from a complex set of factors that can be simplified into the following
equation:
csb_clk = {PCI_SYNC_IN × (1 + ~ CFG_SYS_CLKIN_DIV)} × SPMF
In PCI host mode, PCI_SYNC_IN × (1 + ~ CFG_SYS_CLKIN_DIV) is the SYS_CLK_IN frequency.
The csb_clk serves as the clock input to the e300 core. A second PLL inside the e300 core multiplies up
the csb_clk frequency to create the internal clock for the e300 core (core_clk). The system and core PLL
multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL)
which is loaded at power-on reset or by one of the hard-coded reset options. See Chapter 4, “Reset,
Clocking, and Initialization,” in the MPC8315E PowerQUICC II Pro Integrated Host Processor Family
Reference Manual for more information on the clock subsystem.
The internal ddr_clk frequency is determined by the following equation:
ddr_clk = csb_clk × (1 + RCWL[DDRCM])
Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider
(2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate
is the same frequency as ddr_clk.
The internal lbiu_clk frequency is determined by the following equation:
lbiu_clk = csb_clk × (1 + RCWL[LBCM])
Note that lbiu_clk is not the external local bus frequency; lbiu_clk passes through the LBIU clock divider
to create the external local bus clock outputs (LCLK[0:1]). The LBIU clock divider ratio is controlled by
LCRR[CLKDIV].
In addition, some of the internal units may be required to be shut off or operate at lower frequency than
the csb_clk frequency. Those units have a default clock ratio that can be configured by a memory mapped
register after the device comes out of reset. Table 67 specifies which units have a configurable clock
frequency.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Freescale Semiconductor
Clocking
Table 67. Configurable Clock Units
Unit
Default Frequency
Options
eTSEC1
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
eTSEC2
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
Security Core, I2C, SAP, TPR
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
USB DR
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
PCI and DMA complex
csb_clk
Off, csb_clk
PCI Express
csb_clk
Off, csb_clk
Serial ATA
csb_clk
Off, csb_clk, csb_clk/2, csb_clk/3
This table provides the operating frequencies for the TEPBGA II under recommended operating
conditions (see Table 2).
Table 68. Operating Frequencies for TEPBGA II
Characteristic1
Max Operating Frequency
Unit
e300 core frequency (core_clk)
400
MHz
Coherent system bus frequency (csb_clk)
133
MHz
DDR1/2 memory bus frequency (MCK)2
133
MHz
Local bus frequency (LCLKn)3
66
MHz
24-66
MHz
PCI input frequency (SYS_CLK_IN or PCI_CLK)
Note:
1. The SYS_CLK_IN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk,
MCK, LCLK[0:1], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies.
2. The DDR data rate is 2x the DDR memory bus frequency.
3. The local bus frequency is 1/2, 1/4, or 1/8 of the lbiu_clk frequency (depending on LCRR[CLKDIV]) which is in turn 1x or 2x the
csb_clk frequency (depending on RCWL[LBCM]).
23.1
System PLL Configuration
The system PLL is controlled by the RCWL[SPMF] parameter. Table 69 shows the multiplication factor
encodings for the system PLL.
NOTE
If RCWL[DDRCM] and RCWL[LBCM] are both cleared, the system PLL
VCO frequency = (CSB frequency) (System PLL VCO Divider).
If either RCWL[DDRCM] or RCWL[LBCM] are set, the system PLL VCO
frequency = 2 (CSB frequency) (System PLL VCO Divider).
The VCO divider needs to be set properly so that the System PLL VCO
frequency is in the range of 450–750 MHz.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
87
Clocking
Table 69. System PLL Multiplication Factors
RCWL[SPMF]
System PLL
Multiplication Factor
0000
Reserved
0001
Reserved
0010
2
0011
3
0100
4
0101
5
0110–1111
Reserved
As described in Section 23, “Clocking,” The LBCM, DDRCM, and SPMF parameters in the reset
configuration word low and the CFG_SYS_CLKIN_DIV configuration input signal select the ratio
between the primary clock input (SYS_CLK_IN or PCI_CLK) and the internal coherent system bus clock
(csb_clk). Table 70 and Table 71 shows the expected frequency values for the CSB frequency for select
csb_clk to SYS_CLK_IN/PCI_SYNC_IN ratios.
Table 70. CSB Frequency Options for Host Mode
CFG_SYS_CLKIN_DIV
at Reset1
SPMF
csb_clk :
Input Clock
Ratio 2
High/Low 3
0010
2:1
High/Low
0011
3:1
High/Low
0100
4:1
High/Low
0101
5:1
Input Clock
Frequency (MHz)2
24
33.33
66.67
133
100
—
96
133
—
120
—
—
1
CFG_SYS_CLKIN_DIV select the ratio between SYS_CLK_IN and PCI_SYNC_OUT.
SYS_CLK_IN is the input clock in host mode; PCI_CLK is the input clock in agent mode.
3
In the Host mode it does not matter if the value is High or Low.
2
Table 71. CSB Frequency Options for Agent Mode
CFG_SYS_CLKIN_DIV
at Reset1
1
2
SPMF
csb_clk :
Input Clock
Ratio 2
Input Clock
frequency (MHz)2
25
33.33
66.67
High
0010
2: 1
133
High
0011
3: 1
100
—
High
0100
4: 1
133
—
High
0101
5: 1
—
—
120
CFG_SYS_CLKIN_DIV doubles csb_clk if set low.
SYS_CLK_IN is the input clock in host mode; PCI_CLK is the input clock in agent mode.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
88
Freescale Semiconductor
Clocking
23.2
Core PLL Configuration
RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300
core clock (core_clk). Table 72 shows the encodings for RCWL[COREPLL]. COREPLL values that are
not listed in Table 72 should be considered as reserved.
NOTE
Core VCO frequency = core frequency VCO divider
VCO divider has to be set properly so that the core VCO frequency is in the
range of 400–800 MHz.
Table 72. e300 Core PLL Configuration
RCWL[COREPLL]
1
23.3
core_clk : csb_clk Ratio
VCO Divider1
0
PLL bypassed
(PLL off, csb_clk clocks core directly)
PLL bypassed
(PLL off, csb_clk clocks core directly)
nnnn
n
N/A
N/A
00
0001
0
1:1
2
01
0001
0
1:1
4
00
0001
1
1.5:1
2
01
0001
1
1.5:1
4
00
0010
0
2:1
2
01
0010
0
2:1
4
00
0010
1
2.5:1
2
01
0010
1
2.5:1
4
00
0011
0
3:1
2
01
0011
0
3:1
4
0–1
2–5
6
nn
0000
11
Core VCO frequency = core frequency VCO divider.
Suggested PLL Configurations
To simplify the PLL configurations, the MPC8314E might be separated into two clock domains. The first
domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and
has the csb_clk as its input clock. The clock domains are independent, and each of their PLLs are
configured separately. Both of the domains has one common input clock. Table 73 shows suggested PLL
configurations for 33, 25, and 66 MHz input clocks.
Table 73. Suggested PLL Configurations
Conf. No.
SPMF
Core\PLL
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
1
0100
0000100
33.33
133.33
266.66
3
0010
0000100
66.67
133.33
266.66
4
0100
0000101
33.33
133.33
333.33
5
0101
0000101
25
125
312.5
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
89
Thermal
Table 73. Suggested PLL Configurations
Conf. No.
SPMF
Core\PLL
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
6
0010
0000101
66.67
133.33
333.33
7
0101
0000110
25
125
375
8
0100
0000110
33.33
133.33
400
9
0010
0000110
66.67
133.33
400
24 Thermal
This section describes the thermal specifications of the MPC8314E.
24.1
Thermal Characteristics
This table provides the package thermal characteristics for the 620 29 29 mm TEPBGA II.
Table 74. Package Thermal Characteristics for TEPBGA II
Characteristic
Board type
Symbol
Value
Unit
Note
Junction to ambient natural convection
Single layer board (1s)
RJA
23
°C/W
1, 2
Junction to ambient natural convection
Four layer board (2s2p)
RJA
16
°C/W
1, 2, 3
Junction to ambient (@200 ft/min)
Single layer board (1s)
RJMA
18
°C/W
1, 3
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
RJMA
13
°C/W
1, 3
Junction to board
—
RJB
8
°C/W
4
Junction to case
—
RJC
6
°C/W
5
JT
6
°C/W
6
Junction to package top
Natural convection
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
90
Freescale Semiconductor
Thermal
24.2
Thermal Management Information
For the following sections, PD = (VDD IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
24.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TJ = junction temperature (C)
TA = ambient temperature for the package (C)
RJA = junction to ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ - TA) are possible.
24.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction to ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction to board thermal resistance (C/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
91
Thermal
24.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = junction to ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
24.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case to ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction to ambient thermal resistance (C/W)
RJC = junction to case thermal resistance (C/W)
RCA = case to ambient thermal resistance (C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
92
Freescale Semiconductor
Thermal
Table 75. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8314E TEPBGA II
29 29 mm TEBGA II
Heat Sink Assuming Thermal Grease
Air Flow
Junction-to-Ambient
Thermal Resistance
AAVID 30 x 30 x 9.4 mm Pin Fin
Natural Convection
14.4
AAVID 30 x 30 x 9.4 mm Pin Fin
0.5 m/s
11.4
AAVID 30 x 30 x 9.4 mm Pin Fin
1 m/s
10.1
AAVID 30 x 30 x 9.4 mm Pin Fin
2 m/s
8.9
AAVID 35 x 31 x 23 mm Pin Fin
Natural Convection
12.3
AAVID 35 x 31 x 23 mm Pin Fin
0.5 m/s
9.3
AAVID 35 x 31 x 23 mm Pin Fin
1 m/s
8.5
AAVID 35 x 31 x 23 mm Pin Fin
2 m/s
7.9
AAVID 43 x 41 x 16.5 mm Pin Fin
Natural Convection
12.5
AAVID 43 x 41 x 16.5 mm Pin Fin
0.5 m/s
9.7
AAVID 43 x 41 x 16.5 mm Pin Fin
1 m/s
8.5
AAVID 43 x 41 x 16.5 mm Pin Fin
2 m/s
7.7
Wakefield, 53 x 53 x 25 mm Pin Fin
Natural Convection
10.9
Wakefield, 53 x 53 x 25 mm Pin Fin
0.5 m/s
8.5
Wakefield, 53 x 53 x 25 mm Pin Fin
1 m/s
7.5
Wakefield, 53 x 53 x 25 mm Pin Fin
2 m/s
7.1
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
93
Thermal
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105
Internet: www.tycoelectronics.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO BOX 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
24.3
408-436-8770
800-522-6752
603-635-2800
781-935-4850
800-248-2481
888-642-7674
800-347-4572
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (45
Newtons). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted
or plastic surfaces and its performance verified under the application requirements.
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System Design Information
24.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink temperature and
then back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RJC x PD)
Where
TC is the case temperature of the package
RJC is the junction-to-case thermal resistance
PD is the power dissipation
25 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8314E.
25.1
System Clocking
The MPC8314E includes two PLLs.
1. The platform PLL (AVDD2) generates the platform clock from the externally supplied
SYS_CLK_IN input. The frequency ratio between the platform and SYS_CLK_IN is selected
using the platform PLL ratio configuration bits as described in Section 23.1, “System PLL
Configuration.”
2. The e300 Core PLL (AVDD1) generates the core clock as a slave to the platform clock. The
frequency ratio between the e300 core clock and the platform clock is selected using the e300
PLL ratio configuration bits as described in Section 23.2, “Core PLL Configuration.”
25.2
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD1,AVDD2 respectively). The AVDD level should always be equivalent to VDD, and preferably
these voltages are derived directly from VDD through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide independent filter circuits as illustrated in Figure 61, one to each of the AVDD pins. By providing
independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is
reduced.
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95
System Design Information
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
pin, which is on the periphery of package, without the inductance of vias. Note that the RC filter results in
lower voltage level on AVDD. This does not imply that the DC specification can be relaxed.
This figure shows the PLL power supply filter circuit.
10
VDD
AVDD (or L2AVDD)
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 61. PLL Power Supply Filter Circuit
25.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8314E system, and the
MPC8314E itself requires a clean, tightly regulated source of power. Therefore, it is recommended that
the system designer place at least one decoupling capacitor at each VDD, NVDD, GVDD, and LVDD pins
of the device. These decoupling capacitors should receive their power from separate VDD, NVDD,
GVDD, LVDD, and GND power planes in the PCB, utilizing thick and short traces to minimize
inductance. Capacitors may be placed directly under the device using a standard escape pattern. Others
may surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, NVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
quick response time necessary. They should also be connected to the power and ground planes through two
vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo
OSCON).
25.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to NVDD, GVDD, or LVDD as required. Unused active
high inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
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System Design Information
Power and ground connections must be made to all external VDD, GVDD, LVDD, NVDD, and GND pins
of the device.
25.5
Output Buffer DC Impedance
The MPC8314E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD
or GND. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (see Figure 62). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to
each other in value. Then, Z0 = (RP + RN)/2.
NVDD
RN
SW2
Data
Pad
SW1
RP
OGND
Figure 62. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value Rterm. The
measured voltage is V2 = (1/(1/R1 + 1/R2)) Isource. Solving for the output impedance gives Rsource =
Rterm (V1/V2 – 1). The drive current is then Isource = V1/Rsource.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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97
Ordering Information
This table summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD,
nominal NVDD, 105C.
Table 76. Impedance Characteristics
Impedance
Local Bus, Ethernet,
DUART, Control,
Configuration, Power
Management
PCI Signals
(not including PCI
Output Clocks)
PCI Output Clocks
(including
PCI_SYNC_OUT)
DDR DRAM
Symbol
Unit
RN
42 Target
25 Target
42 Target
20 Target
Z0
RP
42 Target
25 Target
42 Target
20 Target
Z0
Differential
NA
NA
NA
NA
ZDIFF
Note: Nominal supply voltages. See Table 1, Tj = 105C.
25.6
Configuration Pin Multiplexing
The MPC8314E provides the user with power-on configuration options that can be set through the use of
external pull-up or pull-down resistors of 4.7 k on certain output pins (see customer visible configuration
pins). These pins are generally used as output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when PORESET deasserts, at which time the input receiver is
disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections
to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should
minimize the disruption of signal quality or speed for output pins thus configured.
25.7
Pull-Up Resistor Requirements
The MPC8314E requires high resistance pull-up resistors (10 k is recommended) on open drain type pins
including I2C pins and EPIC interrupt pins.
For more information on required pull up resistors and the connections required for JTAG interface, see
AN3438, MPC8315 Design Checklist
26
Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Section 26.1, “Part Numbers Fully Addressed by this Document.”
26.1
Part Numbers Fully Addressed by this Document
This table provides the Freescale part numbering nomenclature for the MPC8314E. Note that the
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Freescale sales office. In addition to the processor frequency, the part numbering scheme
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
98
Freescale Semiconductor
Ordering Information
also includes an application modifier which may specify special application conditions. Each part number
also contains a revision code which refers to the die mask revision number.
Table 77. Part Numbering Nomenclature
MPC
8314
E
C
VR
AG
D
A
Product
Code
Part
Identifier
Encryption
Acceleration
Temperature
Range 3
Package 1
e300 Core
Frequency 2
DDR
Frequency
Revision
Level
MPC
8314
VR= Pb
Free
TEPBGA II
AD = 266 MHz
AF = 333 MHz
AG = 400 MHz
Blank = Not
included
E = included
Blank = 0 to 105C
C = –40 to 105C
D = 266 MHz Contact
local
Freescale
sales office
Note:
1. See Section 22, “Package and Pin Listings,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by electric may support other maximum core frequencies.
3. Contact your local Freescale field applications engineer (FAE).
This table shows the SVR settings by device and package type.
Table 78. SVR Settings
Device
Package
SVR (Rev 1.0)
SVR (Rev 1.1)
SVR (Rev 1.2)
MPC8314E
TEPBGA II
0x80B6_0010
0x80B6_0011
0x80B6_0012
MPC8314
TEPBGA II
0x80B7_0010
0x80B7_0011
0x80B7_0012
Note:
1. PVR = 8085_0020 for all devices and revisions in this table.
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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99
Revision History
27 Revision History
This table summarizes a revision history for this document.
Table 79. Revision History
Revision
Date
Substantive Change(s)
2
11/2011
• In Table 66:
– Corrected Note 10 to pull down.
– Added pull up information.
1
11/2011
• Added Notes 4, 5, 6, and 7 in Table 2.
• In Table 6:
– Decoupled PCI_CLK and SYS_CLK_IN rise and fall times.
– Relaxed maximum rise/fall time of SYS_CLK_IN from 1.2 ns to 4 ns.
– Modified Note 2.
– Updated SYS_CLK_IN/PCI_CLK frequency from 66 MHz to 66.67 MHz.
• Added Note 4 to Table 9.
• Added a note stating “eTSEC should be interfaced with peripheral operating at same voltage level.”
in Section 9.1.1, “MII, RMII, RGMII, and RTBI DC Electrical Characteristics.”
• Added a note in Table 26 stating “The frequency of RX_CLK should not exceed the TX_CLK by
more than 300 ppm."
• Added a note in Table 29 stating “The frequency of RX_CLK should not exceed the GTX_CLK125
by more than 300 ppm
• In Table 42, changed min/max values of tCLK_TOL from 0.05 to 0.005.
• Added t LALEHOV parameter to Table 44
• Replaced 50 with 50 in Section 16.5, “Receiver Compliance Eye Diagrams.”
• In Table 66:
– Added Pull up and Pull down information.
– Removed Note 2 from TSEC_MDIO.
• Removed configuration 2 from Table 73.
• Removed Preliminary from Section 24, “Thermal.”
• Removed MDIO signal from Section 25.7, “Pull-Up Resistor Requirements” as this signal is not
open drain.
• Replaced LCCR with LCRR throughout.
• Replaced SYS_CLKIN with SYS_CLK_IN throughout.
• Replaced all LBIUCM with LBCM.
• Replaced all SYS_CR_CLK_IN and SYS_CR_CLK_OUT with SYS_XTAL_IN and
SYS_XTAL_OUT, respectively. Replaced all USB_CR_CLK_IN and USB_CR_CLK_OUT with
USB_XTAL_IN and USB_XTAL_OUT, respectively.
• Added rise/fall time spec for TDM CLK
0
05/2009
Initial public release
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
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Document Number: MPC8314EEC
Rev. 2
11/2011
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