MPC8321VRAFDCA

Freescale Semiconductor Technical Data Document Number: MPC8323EEC Rev. 4, 09/2010 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications This document provides an overview of the MPC8323E PowerQUICC II Pro processor features. The MPC8323E is a cost-effective, highly integrated communications processor that addresses the requirements of several networking applications, including ADSL SOHO and residential gateways, modem/routers, industrial control, and test and measurement applications. The MPC8323E extends current PowerQUICC offerings, adding higher CPU performance, additional functionality, and faster interfaces, while addressing the requirements related to time-to-market, price, power consumption, and board real estate. This document describes the MPC8323E, and unless otherwise noted, the information also applies to the MPC8323, MPC8321E, and MPC8321. To locate published errata or updates for this document, refer to the MPC8323E product summary page on our website listed on the back cover of this document or contact your local Freescale sales office. © 2010 Freescale Semiconductor, Inc. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 9 Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 11 DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . 13 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Ethernet and MII Management . . . . . . . . . . . . . . . . . 19 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 UTOPIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 HDLC, BISYNC, Transparent, and Synchronous UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 System Design Information . . . . . . . . . . . . . . . . . . . 76 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 79 Document Revision History . . . . . . . . . . . . . . . . . . . 80 Overview 1 Overview The MPC8323E incorporates the e300c2 (MPC603e-based) core built on Power Architecture® technology, which includes 16 Kbytes of L1 instruction and data caches, dual integer units, and on-chip memory management units (MMUs). The e300c2 core does not contain a floating point unit (FPU). The MPC8323E also includes a 32-bit PCI controller, four DMA channels, a security engine, and a 32-bit DDR1/DDR2 memory controller. A new communications complex based on QUICC Engine technology forms the heart of the networking capability of the MPC8323E. The QUICC Engine block contains several peripheral controllers and a 32-bit RISC controller. Protocol support is provided by the main workhorses of the device—the unified communication controllers (UCCs). Note that the MPC8321 and MPC8321E do not support UTOPIA. A block diagram of the MPC8323E is shown in Figure 1. MPC8323E e300c2 Core 16 KB I-Cache 16 KB D-Cache Integer Unit (IU1) Integer Unit (IU2) Security Engine (SEC 2.2) System Interface Unit (SIU) Memory Controllers GPCM/UPM 32-Bit DDR1/DDR2 Interface Unit Classic G2 MMUs PCI Controller Timers, Power Management, and JTAG/COP Bus Arbitration Multi-User RAM Accelerators Baud Rate Generators Single 32-Bit RISC CP DUART Serial DMA and 2 Virtual DMAs I2C USB SPI SPI Interrupt Controller UCC5 UCC4 UCC3 4 Channel DMA UCC2 UCC1 Parallel I/O Protection and Configuration System Reset Time Slot Assigner Serial Interface 4 TDM Ports PCI Local Local Bus QUICC Engine Block DDR 3 MII/RMII Clock Synthesizer 1 UL2/8-Bit Figure 1. MPC8323E Block Diagram Each of the five UCCs can support a variety of communication protocols: 10/100 Mbps Ethernet, serial ATM, HDLC, UART, and BISYNC—and, in the MPC8323E and MPC8323, multi-PHY ATM and ATM support for up to OC-3 speeds. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 2 Freescale Semiconductor Overview NOTE The QUICC Engine block can also support a UTOPIA level 2 capable of supporting 31 multi-PHY (MPC8323E- and MPC8323-specific). The MPC8323E security engine (SEC 2.2) allows CPU-intensive cryptographic operations to be offloaded from the main CPU core. The security-processing accelerator provides hardware acceleration for the DES, 3DES, AES, SHA-1, and MD-5 algorithms. In summary, the MPC8323E family provides users with a highly integrated, fully programmable communications processor. This helps ensure that a low-cost system solution can be quickly developed and offers flexibility to accommodate new standards and evolving system requirements. 1.1 MPC8323E Features Major features of the MPC8323E are as follows: • High-performance, low-power, and cost-effective single-chip data-plane/control-plane solution for ATM or IP/Ethernet packet processing (or both). • MPC8323E QUICC Engine block offers a future-proof solution for next generation designs by supporting programmable protocol termination and network interface termination to meet evolving protocol standards. • Single platform architecture supports the convergence of IP packet networks and ATM networks. • DDR1/DDR2 memory controller—one 32-bit interface at up to 266 MHz supporting both DDR1 and DDR2. • An e300c2 core built on Power Architecture technology with 16-Kbyte instruction and data caches, and dual integer units. • Peripheral interfaces such as 32-bit PCI (2.2) interface up to 66-MHz operation, 16-bit local bus interface up to 66-MHz operation, and USB 2.0 (full-/low-speed). • Security engine provides acceleration for control and data plane security protocols. • High degree of software compatibility with previous-generation PowerQUICC processor-based designs for backward compatibility and easier software migration. 1.1.1 Protocols The protocols are as follows: • ATM SAR up to 155 Mbps (OC-3) full duplex, with ATM traffic shaping (ATF TM4.1) • Support for ATM AAL1 structured and unstructured circuit emulation service (CES 2.0) • Support for IMA and ATM transmission convergence sub-layer • ATM OAM handling features compatible with ITU-T I.610 • IP termination support for IPv4 and IPv6 packets including TOS, TTL, and header checksum processing • Extensive support for ATM statistics and Ethernet RMON/MIB statistics • Support for 64 channels of HDLC/transparent MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 3 Overview 1.1.2 Serial Interfaces The MPC8323E serial interfaces are as follows: • Support for one UL2 interface with 31 multi-PHY addresses (MPC8323E and MPC8323 only) • Support for up to three 10/100 Mbps Ethernet interfaces using MII or RMII • Support for up to four T1/E1/J1/E3 or DS-3 serial interfaces (TDM) • Support for dual UART and SPI interfaces and a single I2C interface 1.2 QUICC Engine Block The QUICC Engine block is a versatile communications complex that integrates several communications peripheral controllers. It provides on-chip system design for a variety of applications, particularly in communications and networking systems. The QUICC Engine block has the following features: • One 32-bit RISC controller for flexible support of the communications peripherals • Serial DMA channel for receive and transmit on all serial channels • Five universal communication controllers (UCCs) supporting the following protocols and interfaces (not all of them simultaneously): — 10/100 Mbps Ethernet/IEEE 802.3® standard — IP support for IPv4 and IPv6 packets including TOS, TTL, and header checksum processing — ATM protocol through UTOPIA interface (note that the MPC8321 and MPC8321E do not support the UTOPIA interface) — HDLC /transparent up to 70-Mbps full-duplex — HDLC bus up to 10 Mbps — Asynchronous HDLC — UART — BISYNC up to 2 Mbps — QUICC multi-channel controller (QMC) for 64 TDM channels • One UTOPIA interface (UPC1) supporting 31 multi-PHYs (MPC8323E- and MPC8323-specific) • Two serial peripheral interfaces (SPI). SPI2 is dedicated to Ethernet PHY management. • Four TDM interfaces • Thirteen independent baud rate generators and 19 input clock pins for supplying clocks to UCC serial channels • Four independent 16-bit timers that can be interconnected as two 32-bit timers The UCCs are similar to the PowerQUICC II peripherals: SCC (BISYNC, UART, and HDLC bus) and FCC (fast Ethernet, HDLC, transparent, and ATM). MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 4 Freescale Semiconductor Overview 1.3 Security Engine The security engine is optimized to handle all the algorithms associated with IPSec, IEEE 802.11i™ standard, and iSCSI. The security engine contains one crypto-channel, a controller, and a set of crypto execution units (EUs). The execution units are: • Data encryption standard execution unit (DEU), supporting DES and 3DES • Advanced encryption standard unit (AESU), supporting AES • Message digest execution unit (MDEU), supporting MD5, SHA1, SHA-256, and HMAC with any algorithm • One crypto-channel supporting multi-command descriptor chains 1.4 DDR Memory Controller The MPC8323E DDR1/DDR2 memory controller includes the following features: • Single 32-bit interface supporting both DDR1 and DDR2 SDRAM • Support for up to 266-MHz data rate • Support for two ×16 devices • Support for up to 16 simultaneous open pages • Supports auto refresh • On-the-fly power management using CKE • 1.8-/2.5-V SSTL2 compatible I/O • Support for 1 chip select only • FCRAM, ECC, hardware/software calibration, bit deskew, QIN stage, or atomic logic are not supported. 1.5 PCI Controller The MPC8323E PCI controller includes the following features: • PCI Specification Revision 2.3 compatible • Single 32-bit data PCI interface operates up to 66 MHz • PCI 3.3-V compatible (not 5-V compatible) • Support for host and agent modes • On-chip arbitration, supporting three external masters on PCI • Selectable hardware-enforced coherency 1.6 Programmable Interrupt Controller (PIC) The programmable interrupt controller (PIC) implements the necessary functions to provide a flexible solution for general-purpose interrupt control. The PIC programming model is compatible with the MPC8260 interrupt controller, and it supports 8 external and 35 internal discrete interrupt sources. Interrupts can also be redirected to an external interrupt controller. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 5 Electrical Characteristics 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8323E. The MPC8323E is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings Table 1 provides the absolute maximum ratings. Table 1. Absolute Maximum Ratings1 Characteristic Symbol Max Value Unit Notes Core supply voltage VDD –0.3 to 1.26 V — PLL supply voltage AVDDn –0.3 to 1.26 V — DDR1 and DDR2 DRAM I/O voltage GVDD –0.3 to 2.75 –0.3 to 1.98 V — PCI, local bus, DUART, system control and power management, I2C, SPI, MII, RMII, MII management, and JTAG I/O voltage OV DD –0.3 to 3.6 V — Input voltage MVIN –0.3 to (GV DD + 0.3) V 2 MVREF –0.3 to (GV DD + 0.3) V 2 Local bus, DUART, CLKIN, system control and power management, I2C, SPI, and JTAG signals OVIN –0.3 to (OV DD + 0.3) V 3 PCI OVIN –0.3 to (OV DD + 0.3) V 5 TSTG –55 to 150 °C — DDR1/DDR2 DRAM signals DDR1/DDR2 DRAM reference Storage temperature range Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during power-on reset and power-down sequences. 3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during power-on reset and power-down sequences. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 6 Freescale Semiconductor Electrical Characteristics 2.1.2 Power Supply Voltage Specification Table 2 provides the recommended operating conditions for the MPC8323E. Note that these values are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. Table 2. Recommended Operating Conditions3 Symbol Recommended Value Unit Notes Core supply voltage VDD 1.0 V ± 50 mV V 1 PLL supply voltage AVDD 1.0 V ± 50 mV V 1 DDR1 and DDR2 DRAM I/O voltage GVDD 2.5 V ± 125 mV 1.8 V ± 90 mV V 1 PCI, local bus, DUART, system control and power management, I2C, SPI, and JTAG I/O voltage OV DD 3.3 V ± 300 mV V 1 Junction temperature TA/TJ 0 to 105 °C 2 Characteristic Note: 1. GVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative direction. 2. Minimum temperature is specified with TA; maximum temperature is specified with TJ. 3. All IO pins should be interfaced with peripherals operating at same voltage level. 4. This voltage is the input to the filter discussed in Section 24.2, “PLL Power Supply Filtering” and not necessarily the voltage at the AVDD pin, which may be reduced due to voltage drop across the filter. Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8323E G/OVDD + 20% G/OVDD + 5% VIH G/OVDD GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of tinterface1 Note: 1. tinterface refers to the clock period associated with the bus clock interface. Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 7 Electrical Characteristics 2.1.3 Output Driver Characteristics Table 3 provides information on the characteristics of the output driver strengths. The values are preliminary estimates. Table 3. Output Drive Capability Output Impedance (Ω) Supply Voltage Local bus interface utilities signals 42 OVDD = 3.3 V PCI signals 25 DDR1 signal 18 GVDD = 2.5 V DDR2 signal 18 GVDD = 1.8 V DUART, system control, I2C, SPI, JTAG 42 OVDD = 3.3 V GPIO signals 42 OVDD = 3.3 V Driver Type 2.1.4 Input Capacitance Specification Table 4 describes the input capacitance for the CLKIN pin in the MPC8323E. Table 4. Input Capacitance Specification Parameter/Condition Input capacitance for all pins except CLKIN Input capacitance for CLKIN Symbol Min Max Unit Notes CI 6 8 pF — CICLKIN 10 — pF 1 Note: 1. The external clock generator should be able to drive 10 pF. 2.2 Power Sequencing The device does not require the core supply voltage (VDD) and IO supply voltages (GVDD and OVDD) to be applied in any particular order. Note that during power ramp-up, before the power supplies are stable and if the I/O voltages are supplied before the core voltage, there might be a period of time that all input and output pins are actively driven and cause contention and excessive current. In order to avoid actively driving the I/O pins and to eliminate excessive current draw, apply the core voltage (VDD) before the I/O voltage (GVDD and OVDD) and assert PORESET before the power supplies fully ramp up. In the case where the core voltage is applied first, the core voltage supply must rise to 90% of its nominal value before the I/O supplies reach 0.7 V; see Figure 3. Once both the power supplies (I/O voltage and core voltage) are stable, wait for a minimum of 32 clock cycles before negating PORESET. Note that there is no specific power down sequence requirement for the device. I/O voltage supplies (GVDD and OVDD) do not have any ordering requirements with respect to one another. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 8 Freescale Semiconductor Power Characteristics I/O Voltage (GVDD and OVDD) V Core Voltage (VDD) 0.7 V 90% t 0 PORESET >= 32 clocks x tSYS_CLK_IN /tPCI_SYNC_IN Figure 3. MPC8323E Power-Up Sequencing Example 3 Power Characteristics The estimated typical power dissipation for this family of MPC8323E devices is shown in Table 5. Table 5. MPC8323E Power Dissipation CSB Frequency (MHz) QUICC Engine Frequency (MHz) Core Frequency (MHz) Typical Maximum Unit Notes 133 200 266 0.74 1.48 W 1, 2, 3 133 200 333 0.78 1.62 W 1, 2, 3 Notes: 1. The values do not include I/O supply power (OVDD and GVDD) or AV DD. For I/O power values, see Table 6. 2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone benchmark application. The measurements were taken on the MPC8323MDS evaluation board using WC process silicon. 3. Maximum power is based on a voltage of VDD = 1.07 V, WC process, a junction TJ = 110°C, and an artificial smoke test. Table 6 shows the estimated typical I/O power dissipation for the device. Table 6. Estimated Typical I/O Power Dissipation Interface DDR I/O 65% utilization 2.5 V Rs = 20 Ω Rt = 50 Ω 1 pair of clocks Parameter 266 MHz, 1 × 32 bits GVDD (1.8 V) 0.212 GVDD (2.5 V) OVDD (3.3 V) Unit 0.367 — W Comments — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 9 Clock Input Timing Table 6. Estimated Typical I/O Power Dissipation (continued) Local bus I/O load = 25 pF 1 pair of clocks 66 MHz, 32 bits — — 0.12 W — PCI I/O load = 30 pF 66 MHz, 32 bits — — 0.057 W — QUICC Engine block and other I/Os UTOPIA 8-bit 31 PHYs — — 0.041 W TDM serial — — 0.001 W TDM nibble — — 0.004 W HDLC/TRAN serial — — 0.003 W HDLC/TRAN nibble — — 0.025 W DUART — — 0.017 W MIIs — — 0.009 W RMII — — 0.009 W Ethernet management — — 0.002 W USB — — 0.001 W SPI — — 0.001 W Timer output — — 0.002 W Multiply by number of interfaces used. NOTE AVDDn (1.0 V) is estimated to consume 0.05 W (under normal operating conditions and ambient temperature). 4 Clock Input Timing This section provides the clock input DC and AC electrical characteristics for the MPC8323E. NOTE The rise/fall time on QUICC Engine input pins should not exceed 5 ns. This should be enforced especially on clock signals. Rise time refers to signal transitions from 10% to 90% of VCC; fall time refers to transitions from 90% to 10% of VCC. 4.1 DC Electrical Characteristics Table 7 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8323E. Table 7. CLKIN DC Electrical Characteristics Parameter Condition Symbol Min Max Unit Input high voltage — VIH 2.7 OVDD + 0.3 V Input low voltage — VIL –0.3 0.4 V MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 10 Freescale Semiconductor RESET Initialization Table 7. CLKIN DC Electrical Characteristics (continued) 0 V ≤ VIN ≤ OVDD IIN — ±5 μA PCI_SYNC_IN input current 0 V ≤ VIN ≤ 0.5 V or OVDD – 0.5 V ≤ VIN ≤ OV DD IIN — ±5 μA PCI_SYNC_IN input current 0.5 V ≤ VIN ≤ OVDD – 0.5 V IIN — ±50 μA CLKIN input current 4.2 AC Electrical Characteristics The primary clock source for the MPC8323E can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. Table 8 provides the clock input (CLKIN/PCI_CLK) AC timing specifications for the MPC8323E. Table 8. CLKIN AC Timing Specifications Parameter/Condition Symbol Min Typical Max Unit Notes CLKIN/PCI_CLK frequency fCLKIN 25 — 66.67 MHz 1 CLKIN/PCI_CLK cycle time tCLKIN 15 — — ns — CLKIN rise and fall time tKH, tKL 0.6 0.8 4 ns 2 PCI_CLK rise and fall time tPCH, tPCL 0.6 0.8 1.2 ns 2 CLKIN/PCI_CLK duty cycle tKHK/tCLKIN 40 — 60 % 3 — — — ±150 ps 4, 5 CLKIN/PCI_CLK jitter Notes: 1. Caution: The system, core, security, and QUICC Engine block must not exceed their respective maximum or minimum operating frequencies. 2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 and 2.7 V. 3. Timing is guaranteed by design and characterization. 4. This represents the total input jitter—short term and long term—and is guaranteed by design. 5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter. 5 RESET Initialization This section describes the AC electrical specifications for the reset initialization timing requirements of the MPC8323E. Table 9 provides the reset initialization AC timing specifications for the reset component(s). Table 9. RESET Initialization Timing Specifications Parameter/Condition Min Max Unit Notes Required assertion time of HRESET or SRESET (input) to activate reset flow 32 — tPCI_SYNC_IN 1 Required assertion time of PORESET with stable clock applied to CLKIN when the MPC8323E is in PCI host mode 32 — tCLKIN 2 Required assertion time of PORESET with stable clock applied to PCI_SYNC_IN when the MPC8323E is in PCI agent mode 32 — tPCI_SYNC_IN 1 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 11 RESET Initialization Table 9. RESET Initialization Timing Specifications (continued) Parameter/Condition Min Max Unit Notes HRESET/SRESET assertion (output) 512 — tPCI_SYNC_IN 1 HRESET negation to SRESET negation (output) 16 — tPCI_SYNC_IN 1 Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8323E is in PCI host mode 4 — tCLKIN 2 Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8323E is in PCI agent mode 4 — tPCI_SYNC_IN 1 Input hold time for POR config signals with respect to negation of HRESET 0 — ns — Time for the MPC8323E to turn off POR configuration signals with respect to the assertion of HRESET — 4 ns 3 Time for the MPC8323E to turn on POR configuration signals with respect to the negation of HRESET 1 — tPCI_SYNC_IN 1, 3 Notes: 1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. When the MPC8323E is In PCI host mode the primary clock is applied to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. See the MPC8323E PowerQUICC II Pro Integrated Communications Processor Reference Manual for more details. 2. tCLKIN is the clock period of the input clock applied to CLKIN. It is only valid when the MPC8323E is in PCI host mode. See the MPC8323E PowerQUICC II Pro Integrated Communications Processor Reference Manual for more details. 3. POR configuration signals consists of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV. Table 10 provides the PLL lock times. Table 10. PLL Lock Times Parameter/Condition PLL lock times 5.1 Min Max Unit Notes — 100 μs — Reset Signals DC Electrical Characteristics Table 11 provides the DC electrical characteristics for the MPC8323E reset signals mentioned in Table 9. Table 11. Reset Signals DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Notes Output high voltage VOH IOH = –6.0 mA 2.4 — V 1 Output low voltage VOL IOL = 6.0 mA — 0.5 V 1 Output low voltage VOL IOL = 3.2 mA — 0.4 V 1 Input high voltage VIH — 2.0 OVDD + 0.3 V 1 Input low voltage VIL — –0.3 0.8 V — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 12 Freescale Semiconductor DDR1 and DDR2 SDRAM Table 11. Reset Signals DC Electrical Characteristics (continued) Characteristic Input current Symbol Condition Min Max Unit Notes IIN 0 V ≤ VIN ≤ OVDD — ±5 μA — Note: 1. This specification applies when operating from 3.3 V supply. 6 DDR1 and DDR2 SDRAM This section describes the DC and AC electrical specifications for the DDR1 and DDR2 SDRAM interface of the MPC8323E. Note that DDR1 SDRAM is Dn_GVDD(typ) = 2.5 V and DDR2 SDRAM is Dn_GVDD(typ) = 1.8 V. The AC electrical specifications are the same for DDR1 and DDR2 SDRAM. 6.1 DDR1 and DDR2 SDRAM DC Electrical Characteristics Table 12 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MPC8323E when Dn_GVDD(typ) = 1.8 V. Table 12. DDR2 SDRAM DC Electrical Characteristics for Dn_GVDD(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Notes Dn_GVDD 1.71 1.89 V 1 MVREFnREF 0.49 × Dn_GVDD 0.51 × Dn_GVDD V 2 I/O termination voltage VTT MVREFnREF – 0.04 MVREFnREF + 0.04 V 3 Input high voltage VIH MVREFnREF + 0.125 Dn_GV DD + 0.3 V — Input low voltage VIL –0.3 MVREFnREF – 0.125 V — Output leakage current IOZ –9.9 9.9 μA 4 Output high current (VOUT = 1.35 V) IOH –13.4 — mA — Output low current (VOUT = 0.280 V) IOL 13.4 — mA — I/O supply voltage I/O reference voltage Notes: 1. Dn_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times. 2. MVREF nREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver. Peak-to-peak noise on MVREFnREF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREFnREF. This rail should track variations in the DC level of MVREFnREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GVDD. Table 13 provides the DDR2 capacitance when Dn_GVDD(typ) = 1.8 V. Table 13. DDR2 SDRAM Capacitance for Dn_GVDD(typ) = 1.8 V Parameter/Condition Input/output capacitance: DQ, DQS Symbol Min Max Unit Notes CIO 6 8 pF 1 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 13 DDR1 and DDR2 SDRAM Table 13. DDR2 SDRAM Capacitance for Dn_GVDD(typ) = 1.8 V Delta input/output capacitance: DQ, DQS CDIO — 0.5 pF 1 Note: 1. This parameter is sampled. Dn_GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25 °C, VOUT = Dn_GVDD ÷ 2, VOUT (peak-to-peak) = 0.2 V. Table 14 provides the recommended operating conditions for the DDR1 SDRAM component(s) of the MPC8323E when Dn_GVDD(typ) = 2.5 V. Table 14. DDR1 SDRAM DC Electrical Characteristics for Dn_GVDD(typ) = 2.5 V Parameter/Condition Symbol Min Max Unit Notes Dn_GVDD 2.375 2.625 V 1 MVREFnREF 0.49 × Dn_GVDD 0.51 × Dn_GVDD V 2 I/O termination voltage VTT MVREFnREF – 0.04 MVREFnREF + 0.04 V 3 Input high voltage VIH MVREFnREF + 0.15 Dn_GV DD + 0.3 V — Input low voltage VIL –0.3 MVREFnREF – 0.15 V — Output leakage current IOZ –9.9 –9.9 μA 4 Output high current (VOUT = 1.95 V) IOH –16.2 — mA — Output low current (VOUT = 0.35 V) IOL 16.2 — mA — I/O supply voltage I/O reference voltage Notes: 1. Dn_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times. 2. MVREF nREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver. Peak-to-peak noise on MVREFnREF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREFnREF. This rail should track variations in the DC level of MVREFnREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GVDD. Table 15 provides the DDR1 capacitance Dn_GVDD(typ) = 2.5 V. Table 15. DDR1 SDRAM Capacitance for Dn_GVDD(typ) = 2.5 V Interface Parameter/Condition Symbol Min Max Unit Notes Input/output capacitance: DQ,DQS CIO 6 8 pF 1 Delta input/output capacitance: DQ, DQS CDIO — 0.5 pF 1 Note: 1. This parameter is sampled. D n_GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25° C, VOUT = Dn_GVDD ÷ 2, VOUT (peak-to-peak) = 0.2 V. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 14 Freescale Semiconductor DDR1 and DDR2 SDRAM 6.2 DDR1 and DDR2 SDRAM AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR1 and DDR2 SDRAM interface. 6.2.1 DDR1 and DDR2 SDRAM Input AC Timing Specifications Table 16 provides the input AC timing specifications for the DDR2 SDRAM (Dn_GVDD(typ) = 1.8 V). Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface At recommended operating conditions with D n_GVDD of 1.8 ± 5%. Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREFnREF – 0.25 V — AC input high voltage VIH MVREFnREF + 0.25 — V — Table 17 provides the input AC timing specifications for the DDR1 SDRAM (Dn_GVDD(typ) = 2.5 V). Table 17. DDR1 SDRAM Input AC Timing Specifications for 2.5 V Interface At recommended operating conditions with D n_GVDD of 2.5 ± 5%. Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREFnREF – 0.31 V — AC input high voltage VIH MVREFnREF + 0.31 — V — Table 18 provides the input AC timing specifications for the DDR1 and DDR2 SDRAM interface. Table 18. DDR1 and DDR2 SDRAM Input AC Timing Specifications At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%. Parameter Symbol Controller skew for MDQS—MDQ/MDM Min Max –750 –1250 750 1250 tCISKEW 266 MHz 200 MHz Unit Notes ps 1, 2 Notes: 1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that is captured with MDQS[n]. This should be subtracted from the total timing budget. 2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be determined by the following equation: tDISKEW = ±(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is the absolute value of tCISKEW. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 15 DDR1 and DDR2 SDRAM Figure 4 shows the input timing diagram for the DDR controller. MCK[n] MCK[n] tMCK MDQS[n] MDQ[x] D0 D1 tDISKEW tDISKEW Figure 4. DDR Input Timing Diagram 6.2.2 DDR1 and DDR2 SDRAM Output AC Timing Specifications Table 19 provides the output AC timing specifications for the DDR1 and DDR2 SDRAM interfaces. Table 19. DDR1 and DDR2 SDRAM Output AC Timing Specifications At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%. Parameter MCK cycle time, (MCK/MCK crossing) ADDR/CMD output setup with respect to MCK Symbol1 Min Max Unit Notes tMCK 7.5 10 ns 2 ns 3 ns 3 ns 3 ns 3 ns 4 tDDKHAS 266 MHz 200 MHz ADDR/CMD output hold with respect to MCK 2.5 3.5 tDDKHAX 266 MHz 200 MHz MCS output setup with respect to MCK 2.5 3.5 — — 2.5 3.5 — — 2.5 3.5 — — –0.6 0.6 tDDKHCS 266 MHz 200 MHz MCS output hold with respect to MCK tDDKHCX 266 MHz 200 MHz MCK to MDQS Skew — — tDDKHMH MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 16 Freescale Semiconductor DDR1 and DDR2 SDRAM Table 19. DDR1 and DDR2 SDRAM Output AC Timing Specifications (continued) At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%. Symbol1 Parameter MDQ/MDM output setup with respect to MDQS Max tDDKHDS, tDDKLDS 266 MHz 200 MHz MDQ/MDM output hold with respect to MDQS Min 0.9 1.0 Notes ns 5 ps 5 — — tDDKHDX, tDDKLDX 266 MHz 200 MHz Unit 1100 1200 — — MDQS preamble start tDDKHMP –0.5 × tMCK – 0.6 –0.5 × tMCK + 0.6 ns 6 MDQS epilogue end tDDKHME –0.6 0.6 ns 6 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. 2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V. 3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied cycle. 4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same adjustment value. See the MPC8323E PowerQUICC II Pro Integrated Communications Processor Reference Manual for a description and understanding of the timing modifications enabled by use of these bits. 5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor. 6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the symbol conventions described in note 1. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 17 DDR1 and DDR2 SDRAM Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH). MCK MCK tMCK tDDKHMH(max) = 0.6 ns MDQS tDDKHMH(min) = –0.6 ns MDQS Figure 5. Timing Diagram for tDDKHMH Figure 6 shows the DDR1 and DDR2 SDRAM output timing diagram. MCK[n] MCK[n] tMCK tDDKHAS,tDDKHCS tDDKHAX,tDDKHCX ADDR/CMD Write A0 NOOP tDDKHMP tDDKHMH MDQS[n] tDDKHME tDDKHDS tDDKLDS MDQ[x] D0 D1 tDDKLDX tDDKHDX Figure 6. DDR1 and DDR2 SDRAM Output Timing Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 18 Freescale Semiconductor DUART 7 DUART This section describes the DC and AC electrical specifications for the DUART interface of the MPC8323E. 7.1 DUART DC Electrical Characteristics Table 20 provides the DC electrical characteristics for the DUART interface of the MPC8323E. Table 20. DUART DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2 OVDD + 0.3 V Low-level input voltage OVDD VIL –0.3 0.8 V High-level output voltage, IOH = –100 μA VOH OV DD – 0.2 — V Low-level output voltage, IOL = 100 μA VOL — 0.2 V IIN — ±5 μA Input current (0 V ≤ VIN ≤ OV DD)1 Note: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 7.2 DUART AC Electrical Specifications Table 21 provides the AC timing parameters for the DUART interface of the MPC8323E. Table 21. DUART AC Timing Specifications Parameter Value Unit Minimum baud rate 256 baud Maximum baud rate > 1,000,000 baud 1 16 — 2 Oversample rate Notes Notes: 1. Actual attainable baud rate is limited by the latency of interrupt processing. 2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each 16th sample. 8 Ethernet and MII Management This section provides the AC and DC electrical characteristics for Ethernet and MII management. 8.1 Ethernet Controller (10/100 Mbps)—MII/RMII Electrical Characteristics The electrical characteristics specified here apply to all MII (media independent interface) and RMII (reduced media independent interface), except MDIO (management data input/output) and MDC MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 19 Ethernet and MII Management (management data clock). The MII and RMII are defined for 3.3 V. The electrical characteristics for MDIO and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.” 8.1.1 DC Electrical Characteristics All MII and RMII drivers and receivers comply with the DC parametric attributes specified in Table 22. Table 22. MII and RMII DC Electrical Characteristics Parameter Symbol Conditions Min Max Unit Supply voltage 3.3 V OVDD — 2.97 3.63 V Output high voltage VOH IOH = –4.0 mA OVDD = Min 2.40 OVDD + 0.3 V Output low voltage VOL IOL = 4.0 mA OVDD = Min GND 0.50 V Input high voltage VIH — — 2.0 OVDD + 0.3 V Input low voltage VIL — — –0.3 0.90 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 8.2 MII and RMII AC Timing Specifications The AC timing specifications for MII and RMII are presented in this section. 8.2.1 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. 8.2.1.1 MII Transmit AC Timing Specifications Table 23 provides the MII transmit AC timing specifications. Table 23. MII Transmit AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 10%. Symbol1 Min Typical Max Unit TX_CLK clock period 10 Mbps tMTX — 400 — ns TX_CLK clock period 100 Mbps tMTX — 40 — ns tMTXH/tMTX 35 — 65 % tMTKHDX 1 5 15 ns tMTXR 1.0 — 4.0 ns Parameter/Condition TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay TX_CLK data clock rise time MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 20 Freescale Semiconductor Ethernet and MII Management Table 23. MII Transmit AC Timing Specifications (continued) At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter/Condition TX_CLK data clock fall time Symbol1 Min Typical Max Unit tMTXF 1.0 — 4.0 ns Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 7 shows the MII transmit AC timing diagram. tMTXR tMTX TX_CLK tMTXH tMTXF TXD[3:0] TX_EN TX_ER tMTKHDX Figure 7. MII Transmit AC Timing Diagram 8.2.1.2 MII Receive AC Timing Specifications Table 24 provides the MII receive AC timing specifications. Table 24. MII Receive AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 10%. Symbol1 Min Typical Max Unit RX_CLK clock period 10 Mbps tMRX — 400 — ns RX_CLK clock period 100 Mbps tMRX — 40 — ns tMRXH/tMRX 35 — 65 % RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns tMRXR 1.0 — 4.0 ns Parameter/Condition RX_CLK duty cycle RX_CLK clock rise time MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 21 Ethernet and MII Management Table 24. MII Receive AC Timing Specifications (continued) At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter/Condition Symbol1 Min Typical Max Unit tMRXF 1.0 — 4.0 ns RX_CLK clock fall time Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 8 provides the AC test load. Z0 = 50 Ω Output RL = 50 Ω OVDD/2 Figure 8. AC Test Load Figure 9 shows the MII receive AC timing diagram. tMRXR tMRX RX_CLK tMRXH RXD[3:0] RX_DV RX_ER tMRXF Valid Data tMRDVKH tMRDXKH Figure 9. MII Receive AC Timing Diagram 8.2.2 RMII AC Timing Specifications This section describes the RMII transmit and receive AC timing specifications. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 22 Freescale Semiconductor Ethernet and MII Management 8.2.2.1 RMII Transmit AC Timing Specifications Table 23 provides the RMII transmit AC timing specifications. Table 25. RMII Transmit AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 10%. Symbol1 Min Typical Max Unit tRMX — 20 — ns tRMXH/tRMX 35 — 65 % REF_CLK to RMII data TXD[1:0], TX_EN delay tRMTKHDX 2 — 10 ns REF_CLK data clock rise VIL(min) to VIH(max) tRMXR 1.0 — 4.0 ns REF_CLK data clock fall VIH(max) to VIL(min) tRMXF 1.0 — 4.0 ns Parameter/Condition REF_CLK clock REF_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 10 shows the RMII transmit AC timing diagram. tRMX tRMXR REF_CLK tRMXH tRMXF TXD[1:0] TX_EN tRMTKHDX Figure 10. RMII Transmit AC Timing Diagram 8.2.2.2 RMII Receive AC Timing Specifications Table 24 provides the RMII receive AC timing specifications. Table 26. RMII Receive AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 10%. Symbol1 Min Typical Max Unit tRMX — 20 — ns tRMXH/tRMX 35 — 65 % RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK tRMRDVKH 4.0 — — ns RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK tRMRDXKH 2.0 — — ns tRMXR 1.0 — 4.0 ns Parameter/Condition REF_CLK clock period REF_CLK duty cycle REF_CLK clock rise VIL(min) to VIH(max) MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 23 Ethernet and MII Management Table 26. RMII Receive AC Timing Specifications (continued) At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter/Condition REF_CLK clock fall time V IH(max) to VIL(min) Symbol1 Min Typical Max Unit tRMXF 1.0 — 4.0 ns Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect to the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 11 provides the AC test load. Z0 = 50 Ω Output RL = 50 Ω OVDD/2 Figure 11. AC Test Load Figure 12 shows the RMII receive AC timing diagram. tRMXR tRMX REF_CLK tRMXH RXD[1:0] CRS_DV RX_ER tRMXF Valid Data tRMRDVKH tRMRDXKH Figure 12. RMII Receive AC Timing Diagram 8.3 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to MII management interface signals MDIO (management data input/output) and MDC (management data clock). The electrical characteristics for MII, and RMII are specified in Section 8.1, “Ethernet Controller (10/100 Mbps)—MII/RMII Electrical Characteristics.” MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 24 Freescale Semiconductor Ethernet and MII Management 8.3.1 MII Management DC Electrical Characteristics MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics for MDIO and MDC are provided in Table 27. Table 27. MII Management DC Electrical Characteristics When Powered at 3.3 V Parameter Supply voltage (3.3 V) Symbol Conditions Min Max Unit OVDD — 2.97 3.63 V Output high voltage VOH IOH = –1.0 mA OVDD = Min 2.10 OVDD + 0.3 V Output low voltage VOL IOL = 1.0 mA OVDD = Min GND 0.50 V Input high voltage VIH — 2.00 — V Input low voltage VIL — — 0.80 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 8.3.2 MII Management AC Electrical Specifications Table 28 provides the MII management AC timing specifications. Table 28. MII Management AC Timing Specifications At recommended operating conditions with OVDD is 3.3 V ± 10%. Symbol1 Min Typical Max Unit Notes MDC frequency fMDC — 2.5 — MHz — MDC period tMDC — 400 — ns — MDC clock pulse width high tMDCH 32 — — ns — MDC to MDIO delay tMDKHDX 10 — 70 ns — MDIO to MDC setup time tMDDVKH 5 — — ns — MDIO to MDC hold time tMDDXKH 0 — — ns — MDC rise time tMDCR — — 10 ns — MDC fall time tMDHF — — 10 ns — Parameter/Condition Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 25 Local Bus Figure 13 shows the MII management AC timing diagram. tMDC tMDCR MDC tMDCH tMDCF MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX Figure 13. MII Management Interface Timing Diagram 9 Local Bus This section describes the DC and AC electrical specifications for the local bus interface of the MPC8323E. 9.1 Local Bus DC Electrical Characteristics Table 29 provides the DC electrical characteristics for the local bus interface. Table 29. Local Bus DC Electrical Characteristics Parameter Symbol Min Max Unit High-level input voltage VIH 2 OVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V High-level output voltage, IOH = –100 μA VOH OV DD – 0.2 — V Low-level output voltage, IOL = 100 μA VOL — 0.2 V IIN — ±5 μA Input current 9.2 Local Bus AC Electrical Specifications Table 30 describes the general timing parameters of the local bus interface of the MPC8323E. Table 30. Local Bus General Timing Parameters Symbol1 Min Max Unit Notes tLBK 15 — ns 2 Input setup to local bus clock (LCLKn) tLBIVKH 7 — ns 3, 4 Input hold from local bus clock (LCLKn) tLBIXKH 1.0 — ns 3, 4 tLBOTOT1 1.5 — ns 5 Parameter Local bus cycle time LALE output fall to LAD output transition (LATCH hold time) MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 26 Freescale Semiconductor Local Bus Table 30. Local Bus General Timing Parameters (continued) Symbol1 Min Max Unit Notes LALE output fall to LAD output transition (LATCH hold time) tLBOTOT2 3 — ns 6 LALE output fall to LAD output transition (LATCH hold time) tLBOTOT3 2.5 — ns 7 Local bus clock (LCLK n) to output valid tLBKHOV — 3 ns 3 Local bus clock (LCLK n) to output high impedance for LAD/LDP tLBKHOZ — 4 ns 8 Local bus clock (LCLK n) duty cycle tLBDC 47 53 % — Local bus clock (LCLK n) jitter specification tLBRJ — 400 ps — Delay between the input clock (PCI_SYNC_IN) of local bus output clock (LCLKn) tLBCDL — 1.7 ns — Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one(1). 2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of LCLK0 (for all other inputs). 3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4 × OVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5. tLBOTOT1 should be used when RCWH[LALE] is not set and the load on LALE output pin is at least 10 pF less than the load on LAD output pins. 6. tLBOTOT2 should be used when RCWH[LALE] is set and the load on LALE output pin is at least 10 pF less than the load on LAD output pins. 7. tLBOTOT3 should be used when RCWH[LALE] is set and the load on LALE output pin equals to the load on LAD output pins. 8. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. Figure 14 provides the AC test load for the local bus. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 14. Local Bus C Test Load MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 27 Local Bus Figure 15 through Figure 17 show the local bus signals. LCLK[n] tLBIXKH tLBIVKH Input Signals: LAD[0:15] tLBIXKH tLBIVKH Input Signal: LGTA tLBIXKH tLBKHOV Output Signals: LBCTL/LBCKE/LOE tLBKHOV tLBKHOZ Output Signals: LAD[0:15] tLBOTOT LALE Figure 15. Local Bus Signals, Nonspecial Signals Only LCLK T1 T3 tLBKHOV tLBKHOZ GPCM Mode Output Signals: LCS[0:3]/LWE tLBIVKH tLBIXKH UPM Mode Input Signal: LUPWAIT tLBIXKH tLBIVKH Input Signals: LAD[0:15]/LDP[0:3] tLBKHOV tLBKHOZ UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 16. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 28 Freescale Semiconductor JTAG LCLK T1 T2 T3 T4 tLBKHOZ tLBKHOV GPCM Mode Output Signals: LCS[0:3]/LWE tLBIXKH tLBIVKH UPM Mode Input Signal: LUPWAIT tLBIXKH tLBIVKH Input Signals: LAD[0:15] tLBKHOZ tLBKHOV UPM Mode Output Signals: LCS[0:3]/LBS[0:1]/LGPL[0:5] Figure 17. Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4 10 JTAG This section describes the DC and AC electrical specifications for the IEEE Std. 1149.1™ (JTAG) interface of the MPC8323E. 10.1 JTAG DC Electrical Characteristics Table 31 provides the DC electrical characteristics for the IEEE Std. 1149.1 (JTAG) interface of the MPC8323E. Table 31. JTAG Interface DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.5 OVDD + 0.3 V MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 29 JTAG Table 31. JTAG Interface DC Electrical Characteristics (continued) Characteristic Symbol Condition Min Max Unit Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 10.2 JTAG AC Electrical Characteristics This section describes the AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the MPC8323E. Table 32 provides the JTAG AC timing specifications as defined in Figure 19 through Figure 22. Table 32. JTAG AC Timing Specifications (Independent of CLKIN)1 At recommended operating conditions (see Table 2). Symbol2 Min Max Unit Notes JTAG external clock frequency of operation fJTG 0 33.3 MHz — JTAG external clock cycle time t JTG 30 — ns — tJTKHKL 11 — ns — tJTGR, tJTGF 0 2 ns — tTRST 25 — ns 3 Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 4 — — Boundary-scan data TMS, TDI tJTDXKH tJTIXKH 10 10 — — Boundary-scan data TDO tJTKLDV tJTKLOV 2 2 15 15 Boundary-scan data TDO tJTKLDX tJTKLOX 2 2 — — Parameter JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time ns Input setup times: Input hold times: 4 ns Valid times: 4 ns 5 ns Output hold times: 5 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 30 Freescale Semiconductor JTAG Table 32. JTAG AC Timing Specifications (Independent of CLKIN)1 (continued) At recommended operating conditions (see Table 2). Parameter Symbol2 Min Max JTAG external clock to output high impedance: Boundary-scan data TDO tJTKLDZ tJTKLOZ 2 2 19 9 Unit Notes ns 5, 6 6 Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 14). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. 6. Guaranteed by design and characterization. Figure 18 provides the AC test load for TDO and the boundary-scan outputs of the MPC8323E. Z0 = 50 Ω Output RL = 50 Ω OVDD/2 Figure 18. AC Test Load for the JTAG Interface Figure 19 provides the JTAG clock input timing diagram. JTAG External Clock VM VM VM tJTGR tJTKHKL tJTG tJTGF VM = Midpoint Voltage (OVDD/2) Figure 19. JTAG Clock Input Timing Diagram Figure 20 provides the TRST timing diagram. TRST VM VM tTRST VM = Midpoint Voltage (OVDD/2) Figure 20. TRST Timing Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 31 JTAG Figure 21 provides the boundary-scan timing diagram. JTAG External Clock VM VM tJTDVKH tJTDXKH Input Data Valid Boundary Data Inputs tJTKLDV tJTKLDX Boundary Data Outputs Output Data Valid tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (OVDD/2) Figure 21. Boundary-Scan Timing Diagram Figure 22 provides the test access port timing diagram. JTAG External Clock VM VM tJTIVKH tJTIXKH Input Data Valid TDI, TMS tJTKLOV tJTKLOX Output Data Valid TDO tJTKLOZ TDO Output Data Valid VM = Midpoint Voltage (OVDD/2) Figure 22. Test Access Port Timing Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 32 Freescale Semiconductor I2C 11 I2C This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8323E. 11.1 I2C DC Electrical Characteristics Table 33 provides the DC electrical characteristics for the I2C interface of the MPC8323E. Table 33. I2C DC Electrical Characteristics At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter Symbol Min Max Unit Notes Input high voltage level VIH 0.7 × OV DD OVDD + 0.3 V — Input low voltage level VIL –0.3 0.3 × OV DD V — Low level output voltage VOL 0 0.4 V 1 Output fall time from VIH(min) to VIL(max) with a bus capacitance from 10 to 400 pF tI2KLKV 20 + 0.1 × CB 250 ns 2 Pulse width of spikes which must be suppressed by the input filter tI2KHKL 0 50 ns 3 Capacitance for each I/O pin CI — 10 pF — Input current (0 V ≤ VIN ≤ OV DD) IIN — ±5 μA 4 Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. CB = capacitance of one bus line in pF. 3. Refer to the MPC8323E PowerQUICC II Pro Integrated Communications Processor Reference Manual for information on the digital filter used. 4. I/O pins obstructs the SDA and SCL lines if OVDD is switched off. 11.2 I2C AC Electrical Specifications Table 34 provides the AC timing parameters for the I2C interface of the MPC8323E. Table 34. I2C AC Electrical Specifications All values refer to VIH (min) and VIL (max) levels (see Table 33). Symbol1 Min Max Unit SCL clock frequency fI2C 0 400 kHz Low period of the SCL clock tI2CL 1.3 — μs High period of the SCL clock tI2CH 0.6 — μs Setup time for a repeated START condition tI2SVKH 0.6 — μs Hold time (repeated) START condition (after this period, the first clock pulse is generated) tI2SXKL 0.6 — μs Data setup time tI2DVKH 100 — ns tI2DXKL — 02 — 0.93 μs Parameter Data hold time: CBUS compatible masters I2C bus devices MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 33 I2C Table 34. I2C AC Electrical Specifications (continued) All values refer to VIH (min) and VIL (max) levels (see Table 33). Symbol1 Min Max Unit Rise time of both SDA and SCL signals tI2CR 20 + 0.1 Cb4 300 ns Fall time of both SDA and SCL signals tI2CF 20 + 0.1 Cb4 300 ns Setup time for STOP condition tI2PVKH 0.6 — μs Bus free time between a STOP and START condition tI2KHDX 1.3 — μs Noise margin at the LOW level for each connected device (including hysteresis) VNL 0.1 × OV DD — V Noise margin at the HIGH level for each connected device (including hysteresis) VNH 0.2 × OV DD — V Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. MPC8323E provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DVKH has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. Figure 23 provides the AC test load for the I2C. Z0 = 50 Ω Output RL = 50 Ω OV DD/2 Figure 23. I2C AC Test Load Figure 24 shows the AC timing diagram for the I2C bus. SDA tI2CF tI2DVKH tI2CL tI2KHKL tI2SXKL tI2CF tI2CR SCL tI2SXKL S tI2CH tI2DXKL tI2SVKH Sr tI2PVKH P S Figure 24. I2C Bus AC Timing Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 34 Freescale Semiconductor PCI 12 PCI This section describes the DC and AC electrical specifications for the PCI bus of the MPC8323E. 12.1 PCI DC Electrical Characteristics Table 35 provides the DC electrical characteristics for the PCI interface of the MPC8323E. Table 35. PCI DC Electrical Characteristics1,2 Parameter Symbol Test Condition Min Max Unit High-level input voltage VIH VOUT ≥ VOH (min) or 2 OVDD + 0.3 V Low-level input voltage VIL VOUT ≤ VOL (max) –0.3 0.8 V High-level output voltage VOH OVDD = min, IOH = –100 μA OV DD – 0.2 — V Low-level output voltage VOL OVDD = min, IOL = 100 μA — 0.2 V IIN 0 V ≤ VIN ≤ OVDD — ±5 μA Input current Notes: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 2. Ranges listed do not meet the full range of the DC specifications of the PCI 2.3 Local Bus Specifications. 12.2 PCI AC Electrical Specifications This section describes the general AC timing parameters of the PCI bus of the MPC8323E. Note that the PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8323E is configured as a host or agent device. Table 36 shows the PCI AC timing specifications at 66 MHz. . Table 36. PCI AC Timing Specifications at 66 MHz Symbol1 Min Max Unit Notes Clock to output valid tPCKHOV — 6.0 ns 2 Output hold from clock tPCKHOX 1 — ns 2 Clock to output high impedence tPCKHOZ — 14 ns 2, 3 Input setup to clock tPCIVKH 3.0 — ns 2, 4 Input hold from clock tPCIXKH 0 — ns 2, 4 Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 35 PCI Table 37 shows the PCI AC timing specifications at 33 MHz. Table 37. PCI AC Timing Specifications at 33 MHz Symbol1 Min Max Unit Notes Clock to output valid tPCKHOV — 11 ns 2 Output hold from clock tPCKHOX 2 — ns 2 Clock to output high impedence tPCKHOZ — 14 ns 2, 3 Input setup to clock tPCIVKH 3.0 — ns 2, 4 Input hold from clock tPCIXKH 0 — ns 2, 4 Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications. 3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 4. Input timings are measured at the pin. Figure 25 provides the AC test load for PCI. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 25. PCI AC Test Load Figure 26 shows the PCI input AC timing conditions. CLK tPCIVKH tPCIXKH Input Figure 26. PCI Input AC Timing Measurement Conditions MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 36 Freescale Semiconductor Timers Figure 27 shows the PCI output AC timing conditions. CLK tPCKHOV tPCKHOX Output Delay tPCKHOZ High-Impedance Output Figure 27. PCI Output AC Timing Measurement Condition 13 Timers This section describes the DC and AC electrical specifications for the timers of the MPC8323E. 13.1 Timer DC Electrical Characteristics Table 38 provides the DC electrical characteristics for the MPC8323E timer pins, including TIN, TOUT, TGATE, and RTC_CLK. Table 38. Timer DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 13.2 Timer AC Timing Specifications Table 39 provides the timer input and output AC timing specifications. Table 39. Timer Input AC Timing Specifications1 Characteristic Timers inputs—minimum pulse width Symbol2 Min Unit tTIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. 2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by any external synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 37 GPIO Figure 28 provides the AC test load for the timers. Z0 = 50 Ω Output OVDD/2 RL = 50 Ω Figure 28. Timers AC Test Load 14 GPIO This section describes the DC and AC electrical specifications for the GPIO of the MPC8323E. 14.1 GPIO DC Electrical Characteristics Table 11 provides the DC electrical characteristics for the MPC8323E GPIO. Table 40. GPIO DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Notes Output high voltage VOH IOH = –6.0 mA 2.4 — V 1 Output low voltage VOL IOL = 6.0 mA — 0.5 V 1 Output low voltage VOL IOL = 3.2 mA — 0.4 V 1 Input high voltage VIH — 2.0 OVDD + 0.3 V 1 Input low voltage VIL — –0.3 0.8 V — Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA — Note: 1. This specification applies when operating from 3.3-V supply. 14.2 GPIO AC Timing Specifications Table 41 provides the GPIO input and output AC timing specifications. Table 41. GPIO Input AC Timing Specifications1 Characteristic GPIO inputs—minimum pulse width Symbol2 Min Unit tPIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. 2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 38 Freescale Semiconductor IPIC Figure 29 provides the AC test load for the GPIO. Z0 = 50 Ω Output OVDD /2 RL = 50 Ω Figure 29. GPIO AC Test Load 15 IPIC This section describes the DC and AC electrical specifications for the external interrupt pins of the MPC8323E. 15.1 IPIC DC Electrical Characteristics Table 42 provides the DC electrical characteristics for the external interrupt pins of the MPC8323E. Table 42. IPIC DC Electrical Characteristics1,2 Characteristic Symbol Condition Min Max Unit Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN — — ±5 μA Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Notes: 1. This table applies for pins IRQ[0:7], IRQ_OUT, MCP_OUT, and CE ports Interrupts. 2. IRQ_OUT and MCP_OUT are open drain pins, thus VOH is not relevant for those pins. 15.2 IPIC AC Timing Specifications Table 43 provides the IPIC input and output AC timing specifications. Table 43. IPIC Input AC Timing Specifications1 Characteristic IPIC inputs—minimum pulse width Symbol2 Min Unit tPIWID 20 ns Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. 2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when working in edge triggered mode. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 39 SPI 16 SPI This section describes the DC and AC electrical specifications for the SPI of the MPC8323E. 16.1 SPI DC Electrical Characteristics Table 44 provides the DC electrical characteristics for the MPC8323E SPI. Table 44. SPI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –6.0 mA 2.4 — V Output low voltage VOL IOL = 6.0 mA — 0.5 V Output low voltage VOL IOL = 3.2 mA — 0.4 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 16.2 SPI AC Timing Specifications Table 45 and provide the SPI input and output AC timing specifications. Table 45. SPI AC Timing Specifications1 Symbol2 Min Max Unit SPI outputs—Master mode (internal clock) delay tNIKHOV 0.5 6 ns SPI outputs—Slave mode (external clock) delay tNEKHOV 2 8 ns SPI inputs—Master mode (internal clock) input setup time tNIIVKH 6 — ns SPI inputs—Master mode (internal clock) input hold time tNIIXKH 0 — ns SPI inputs—Slave mode (external clock) input setup time tNEIVKH 4 — ns SPI inputs—Slave mode (external clock) input hold time tNEIXKH 2 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOV symbolizes the NMSI outputs internal timing (NI) for the time tSPI memory clock reference (K) goes from the high state (H) until outputs (O) are valid (V). Figure 30 provides the AC test load for the SPI. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 30. SPI AC Test Load MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 40 Freescale Semiconductor TDM/SI Figure 31 and Figure 32 represent the AC timing from Table 45. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 31 shows the SPI timing in slave mode (external clock). SPICLK (Input) Input Signals: SPIMOSI (See Note) tNEIXKH tNEIVKH tNEKHOV Output Signals: SPIMISO (See Note) Note: The clock edge is selectable on SPI. Figure 31. SPI AC Timing in Slave Mode (External Clock) Diagram Figure 32 shows the SPI timing in master mode (internal clock). SPICLK (Output) Input Signals: SPIMISO (See Note) tNIIXKH tNIIVKH tNIKHOV Output Signals: SPIMOSI (See Note) Note: The clock edge is selectable on SPI. Figure 32. SPI AC Timing in Master Mode (Internal Clock) Diagram 17 TDM/SI This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial interface of the MPC8323E. 17.1 TDM/SI DC Electrical Characteristics Table 46 provides the DC electrical characteristics for the MPC8323E TDM/SI. Table 46. TDM/SI DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH — 2.0 OVDD + 0.3 V MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 41 TDM/SI Table 46. TDM/SI DC Electrical Characteristics (continued) Characteristic Symbol Condition Min Max Unit Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 17.2 TDM/SI AC Timing Specifications Table 47 provides the TDM/SI input and output AC timing specifications. Table 47. TDM/SI AC Timing Specifications1 Symbol2 Min Max Unit TDM/SI outputs—External clock delay tSEKHOV 2 12 ns TDM/SI outputs—External clock High Impedance tSEKHOX 2 10 ns TDM/SI inputs—External clock input setup time tSEIVKH 5 — ns TDM/SI inputs—External clock input hold time tSEIXKH 2 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). Figure 33 provides the AC test load for the TDM/SI. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 33. TDM/SI AC Test Load Figure 34 represents the AC timing from Table 47. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. TDM/SICLK (Input) Input Signals: TDM/SI (See Note) tSEIXKH tSEIVKH tSEKHOV Output Signals: TDM/SI (See Note) tSEKHOX Note: The clock edge is selectable on TDM/SI. Figure 34. TDM/SI AC Timing (External Clock) Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 42 Freescale Semiconductor UTOPIA 18 UTOPIA This section describes the UTOPIA DC and AC electrical specifications of the MPC8323E. NOTE The MPC8321E and MPC8321 do not support UTOPIA. 18.1 UTOPIA DC Electrical Characteristics Table 48 provides the DC electrical characteristics for the MPC8323E UTOPIA. Table 48. UTOPIA DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –8.0 mA 2.4 — V Output low voltage VOL IOL = 8.0 mA — 0.5 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 18.2 UTOPIA AC Timing Specifications Table 49 provides the UTOPIA input and output AC timing specifications. Table 49. UTOPIA AC Timing Specifications1 Symbol2 Min Max Unit UTOPIA outputs—Internal clock delay tUIKHOV 0 5.5 ns UTOPIA outputs—External clock delay tUEKHOV 1 8 ns UTOPIA outputs—Internal clock high impedance tUIKHOX 0 5.5 ns UTOPIA outputs—External clock high impedance tUEKHOX 1 8 ns UTOPIA inputs—Internal clock input setup time tUIIVKH 8 — ns UTOPIA inputs—External clock input setup time tUEIVKH 4 — ns UTOPIA inputs—Internal clock input hold time tUIIXKH 0 — ns UTOPIA inputs—External clock input hold time tUEIXKH 1 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUIKHOX symbolizes the UTOPIA outputs internal timing (UI) for the time tUTOPIA memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 43 UTOPIA Figure 35 provides the AC test load for the UTOPIA. Z0 = 50 Ω Output RL = 50 Ω OVDD/2 Figure 35. UTOPIA AC Test Load Figure 36 and Figure 37 represent the AC timing from Table 49. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. Figure 36 shows the UTOPIA timing with external clock. UTOPIACLK (Input) tUEIVKH tUEIXKH Input Signals: UTOPIA tUEKHOV Output Signals: UTOPIA tUEKHOX Figure 36. UTOPIA AC Timing (External Clock) Diagram Figure 37 shows the UTOPIA timing with internal clock. UTOPIACLK (Output) tUIIVKH tUIIXKH Input Signals: UTOPIA tUIKHOV Output Signals: UTOPIA tUIKHOX Figure 37. UTOPIA AC Timing (Internal Clock) Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 44 Freescale Semiconductor HDLC, BISYNC, Transparent, and Synchronous UART 19 HDLC, BISYNC, Transparent, and Synchronous UART This section describes the DC and AC electrical specifications for the high level data link control (HDLC), BISYNC, transparent, and synchronous UART of the MPC8323E. 19.1 HDLC, BISYNC, Transparent, and Synchronous UART DC Electrical Characteristics Table 50 provides the DC electrical characteristics for the MPC8323E HDLC, BISYNC, transparent, and synchronous UART protocols. Table 50. HDLC, BISYNC, Transparent, and Synchronous UART DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Output high voltage VOH IOH = –2.0 mA 2.4 — V Output low voltage VOL IOL = 3.2 mA — 0.5 V Input high voltage VIH — 2.0 OVDD + 0.3 V Input low voltage VIL — –0.3 0.8 V Input current IIN 0 V ≤ VIN ≤ OVDD — ±5 μA 19.2 HDLC, BISYNC, Transparent, and Synchronous UART AC Timing Specifications Table 51 provides the input and output AC timing specifications for HDLC, BISYNC, and transparent UART protocols. Table 51. HDLC, BISYNC, and Transparent UART AC Timing Specifications1 Symbol2 Min Max Unit Outputs—Internal clock delay tHIKHOV 0 5.5 ns Outputs—External clock delay tHEKHOV 1 10 ns Outputs—Internal clock high impedance tHIKHOX 0 5.5 ns Outputs—External clock high impedance tHEKHOX 1 8 ns Inputs—Internal clock input setup time tHIIVKH 6 — ns Inputs—External clock input setup time tHEIVKH 4 — ns Inputs—Internal clock input hold time tHIIXKH 0 — ns Characteristic MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 45 HDLC, BISYNC, Transparent, and Synchronous UART Table 51. HDLC, BISYNC, and Transparent UART AC Timing Specifications1 (continued) Characteristic Inputs—External clock input hold time Symbol2 Min Max Unit tHEIXKH 1 — ns Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tHIKHOX symbolizes the outputs internal timing (HI) for the time tserial memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). Table 52. Synchronous UART AC Timing Specifications1 Symbol2 Min Max Unit Outputs—Internal clock delay tUAIKHOV 0 5.5 ns Outputs—External clock delay tUAEKHOV 1 10 ns Outputs—Internal clock high impedance tUAIKHOX 0 5.5 ns Outputs—External clock high impedance tUAEKHOX 1 8 ns Inputs—Internal clock input setup time tUAIIVKH 6 — ns Inputs—External clock input setup time tUAEIVKH 4 — ns Inputs—Internal clock input hold time tUAIIXKH 0 — ns Inputs—External clock input hold time tUAEIXKH 1 — ns Characteristic Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUAIKHOX symbolizes the outputs internal timing (UAI) for the time tserial memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X). Figure 38 provides the AC test load. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 38. AC Test Load Figure 39 and Figure 40 represent the AC timing from Table 51. Note that although the specifications generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 46 Freescale Semiconductor HDLC, BISYNC, Transparent, and Synchronous UART Figure 39 shows the timing with external clock. Serial CLK (Input) tHEIXKH tHEIVKH Input Signals: (See Note) tHEKHOV Output Signals: (See Note) tHEKHOX Note: The clock edge is selectable. Figure 39. AC Timing (External Clock) Diagram Figure 40 shows the timing with internal clock. Serial CLK (Output) tHIIVKH tHIIXKH Input Signals: (See Note) tHIKHOV Output Signals: (See Note) tHIKHOX Note: The clock edge is selectable. Figure 40. AC Timing (Internal Clock) Diagram MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 47 USB 20 USB This section provides the AC and DC electrical specifications for the USB interface of the MPC8323E. 20.1 USB DC Electrical Characteristics Table 53 provides the DC electrical characteristics for the USB interface. Table 53. USB DC Electrical Characteristics1 Parameter Symbol Min Max Unit High-level input voltage VIH 2 OVDD + 0.3 V Low-level input voltage VIL –0.3 0.8 V High-level output voltage, IOH = –100 μA VOH OV DD – 0.2 — V Low-level output voltage, IOL = 100 μA VOL — 0.2 V IIN — ±5 μA Input current Note: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 20.2 USB AC Electrical Specifications Table 54 describes the general timing parameters of the USB interface of the MPC8323E. Table 54. USB General Timing Parameters Symbol1 Min Max Unit USB clock cycle time tUSCK 20.83 — ns Full speed 48 MHz USB clock cycle time tUSCK 166.67 — ns Low speed 6 MHz tUSTSPN — 5 ns Skew among RXP, RXN, and RXD tUSRSPND — 10 ns Full speed transitions Skew among RXP, RXN, and RXD tUSRPND — 100 ns Low speed transitions Parameter Skew between TXP and TXN Notes — Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(state)(signal) for receive signals and t(first two letters of functional block)(state)(signal) for transmit signals. For example, tUSRSPND symbolizes USB timing (US) for the USB receive signals skew (RS) among RXP, RXN, and RXD (PND). Also, tUSTSPN symbolizes USB timing (US) for the USB transmit signals skew (TS) between TXP and TXN (PN). 2. Skew measurements are done at OVDD/2 of the rising or falling edge of the signals. Figure 41 provide the AC test load for the USB. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 41. USB AC Test Load MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 48 Freescale Semiconductor Package and Pin Listings 21 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for information on the PBGA. 21.1 Package Parameters for the MPC8323E PBGA The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516 PBGA. Package outline 27 mm × 27 mm Interconnects 516 Pitch 1.00 mm Module height (typical) 2.25 mm Solder Balls 62 Sn/36 Pb/2 Ag (ZQ package) 95.5 Sn/0.5 Cu/4Ag (VR package) Ball diameter (typical) 0.6 mm 21.2 Mechanical Dimensions of the MPC8323E PBGA Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E, 516-PBGA package. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 49 Package and Pin Listings Notes: 1.All dimensions are in millimeters. 2.Dimensions and tolerances per ASME Y14.5M-1994. 3.Maximum solder ball diameter measured parallel to datum A. 4.Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8323E PBGA MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 50 Freescale Semiconductor Package and Pin Listings 21.3 Pinout Listings Table 55 shows the pin list of the MPC8323E. Table 55. MPC8323E PBGA Pinout Listing Signal Package Pin Number Pin Type Power Supply Notes DDR Memory Controller Interface MEMC_MDQ0 AE9 IO GVDD — MEMC_MDQ1 AD10 IO GVDD — MEMC_MDQ2 AF10 IO GVDD — MEMC_MDQ3 AF9 IO GVDD — MEMC_MDQ4 AF7 IO GVDD — MEMC_MDQ5 AE10 IO GVDD — MEMC_MDQ6 AD9 IO GVDD — MEMC_MDQ7 AF8 IO GVDD — MEMC_MDQ8 AE6 IO GVDD — MEMC_MDQ9 AD7 IO GVDD — MEMC_MDQ10 AF6 IO GVDD — MEMC_MDQ11 AC7 IO GVDD — MEMC_MDQ12 AD8 IO GVDD — MEMC_MDQ13 AE7 IO GVDD — MEMC_MDQ14 AD6 IO GVDD — MEMC_MDQ15 AF5 IO GVDD — MEMC_MDQ16 AD18 IO GVDD — MEMC_MDQ17 AE19 IO GVDD — MEMC_MDQ18 AF17 IO GVDD — MEMC_MDQ19 AF19 IO GVDD — MEMC_MDQ20 AF18 IO GVDD — MEMC_MDQ21 AE18 IO GVDD — MEMC_MDQ22 AF20 IO GVDD — MEMC_MDQ23 AD19 IO GVDD — MEMC_MDQ24 AD21 IO GVDD — MEMC_MDQ25 AF22 IO GVDD — MEMC_MDQ26 AC21 IO GVDD — MEMC_MDQ27 AF21 IO GVDD — MEMC_MDQ28 AE21 IO GVDD — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 51 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes MEMC_MDQ29 AD20 IO GVDD — MEMC_MDQ30 AF23 IO GVDD — MEMC_MDQ31 AD22 IO GVDD — MEMC_MDM0 AC9 O GVDD — MEMC_MDM1 AD5 O GVDD — MEMC_MDM2 AE20 O GVDD — MEMC_MDM3 AE22 O GVDD — MEMC_MDQS0 AE8 IO GVDD — MEMC_MDQS1 AE5 IO GVDD — MEMC_MDQS2 AC19 IO GVDD — MEMC_MDQS3 AE23 IO GVDD — MEMC_MBA0 AD16 O GVDD — MEMC_MBA1 AD17 O GVDD — MEMC_MBA2 AE17 O GVDD — MEMC_MA0 AD12 O GVDD — MEMC_MA1 AE12 O GVDD — MEMC_MA2 AF12 O GVDD — MEMC_MA3 AC13 O GVDD — MEMC_MA4 AD13 O GVDD — MEMC_MA5 AE13 O GVDD — MEMC_MA6 AF13 O GVDD — MEMC_MA7 AC15 O GVDD — MEMC_MA8 AD15 O GVDD — MEMC_MA9 AE15 O GVDD — MEMC_MA10 AF15 O GVDD — MEMC_MA11 AE16 O GVDD — MEMC_MA12 AF16 O GVDD — MEMC_MA13 AB16 O GVDD — MEMC_MWE AC17 O GVDD — MEMC_MRAS AE11 O GVDD — MEMC_MCAS AD11 O GVDD — MEMC_MCS AC11 O GVDD — Signal MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 52 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes MEMC_MCKE AD14 O GVDD 3 MEMC_MCK AF14 O GVDD — MEMC_MCK AE14 O GVDD — MEMC_MODT AF11 O GVDD — Signal Local Bus Controller Interface LAD0 N25 IO OV DD 7 LAD1 P26 IO OV DD 7 LAD2 P25 IO OV DD 7 LAD3 R26 IO OV DD 7 LAD4 R25 IO OV DD 7 LAD5 T26 IO OV DD 7 LAD6 T25 IO OV DD 7 LAD7 U25 IO OV DD 7 LAD8 M24 IO OV DD 7 LAD9 N24 IO OV DD 7 LAD10 P24 IO OV DD 7 LAD11 R24 IO OV DD 7 LAD12 T24 IO OV DD 7 LAD13 U24 IO OV DD 7 LAD14 U26 IO OV DD 7 LAD15 V26 IO OV DD 7 LA16 K25 O OV DD 7 LA17 L25 O OV DD 7 LA18 L26 O OV DD 7 LA19 L24 O OV DD 7 LA20 M26 O OV DD 7 LA21 M25 O OV DD 7 LA22 N26 O OV DD 7 LA23 AC24 O OV DD 7 LA24 AC25 O OV DD 7 LA25 AB23 O OV DD 7 LCS0 AB24 O OV DD 4 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 53 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes LCS1 AB25 O OV DD 4 LCS2 AA23 O OV DD 4 LCS3 AA24 O OV DD 4 LWE0 Y23 O OV DD 4 LWE1 W25 O OV DD 4 LBCTL V25 O OV DD 4 LALE V24 O OV DD 7 CFG_RESET_SOURCE[0]/LSDA10/LGPL0 L23 IO OV DD — CFG_RESET_SOURCE[1]/LSDWE/LGPL1 K23 IO OV DD — LSDRAS/LGPL2/LOE J23 O OV DD 4 CFG_RESET_SOURCE[2]/LSDCAS/LGPL3 H23 IO OV DD — LGPL4/LGTA/LUPWAIT/LPBSE G23 IO OV DD 4, 8 LGPL5 AC22 O OV DD 4 LCLK0 Y24 O OV DD 7 LCLK1 Y25 O OV DD 7 UART_SOUT1/MSRCID0 (DDR ID)/LSRCID0 G1 IO OV DD — UART_SIN1/MSRCID1 (DDR ID)/LSRCID1 G2 IO OV DD — UART_CTS1/MSRCID2 (DDR ID)/LSRCID2 H3 IO OV DD — UART_RTS1/MSRCID3 (DDR ID)/LSRCID3 K3 IO OV DD — UART_SOUT2/MSRCID4 (DDR ID)/LSRCID4 H2 IO OV DD — UART_SIN2/MDVAL (DDR ID)/LDVAL H1 IO OV DD — UART_CTS2 J3 IO OV DD — K4 IO OV DD — IIC_SDA/CKSTOP_OUT AE24 IO OV DD 2 IIC_SCL/CKSTOP_IN AF24 IO OV DD 2 Signal DUART UART_RTS2 I2C interface Programmable Interrupt Controller MCP_OUT AD25 O OV DD — IRQ0/MCP_IN AD26 I OV DD — IRQ1 K1 IO OV DD — IRQ2 K2 I OV DD — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 54 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes IRQ3 J2 I OV DD — IRQ4 J1 I OV DD — IRQ5 AE26 I OV DD — IRQ6/CKSTOP_OUT AE25 IO OV DD — IRQ7/CKSTOP_IN AF25 I OV DD — CFG_CLKIN_DIV F1 I OV DD — M23 I OV DD — TCK W26 I OV DD — TDI Y26 I OV DD 4 TDO AA26 O OV DD 3 TMS AB26 I OV DD 4 TRST AC26 I OV DD 4 N23 I OV DD 6 T23 O OV DD — Signal CFG_LBIU_MUX_EN JTAG TEST TEST_MODE PMC QUIESCE System Control HRESET AC23 IO OV DD 1 PORESET AD23 I OV DD — SRESET AD24 IO OV DD 2 CLKIN R3 I OV DD — CLKIN P4 O OV DD — PCI_SYNC_OUT V1 O OV DD 3 RTC_PIT_CLOCK U23 I OV DD — PCI_SYNC_IN/PCI_CLK V2 I OV DD — PCI_CLK0/clkpd_cerisc1_ipg_clkout/DPTC_OSC T3 O OV DD — PCI_CLK1/clkpd_half_cemb4ucc1_ipg_clkout/ CLOCK_XLB_CLOCK_OUT U2 O OV DD — PCI_CLK2/clkpd_third_cesog_ipg_clkout/ cecl_ipg_ce_clock R4 O OV DD — Clocks MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 55 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes Power and Ground Supplies AVDD1 P3 I AV DD1 — AVDD2 AA1 I AV DD2 — AVDD3 AB15 I AV DD3 — AVDD4 C24 I AV DD4 — MVREF1 AB8 I DDR reference voltage — MVREF2 AB17 I DDR reference voltage — PCI_INTA /IRQ_OUT AF2 O OV DD 2 PCI_RESET_OUT AE2 O OV DD — PCI_AD0/MSRCID0 (DDR ID) L1 IO OV DD — PCI_AD1/MSRCID1 (DDR ID) L2 IO OV DD — PCI_AD2/MSRCID2 (DDR ID) M1 IO OV DD — PCI_AD3/MSRCID3 (DDR ID) M2 IO OV DD — PCI_AD4/MSRCID4 (DDR ID) L3 IO OV DD — PCI_AD5/MDVAL (DDR ID) N1 IO OV DD — PCI_AD6 N2 IO OV DD — PCI_AD7 M3 IO OV DD — PCI_AD8 P1 IO OV DD — PCI_AD9 R1 IO OV DD — PCI_AD10 N3 IO OV DD — PCI_AD11 N4 IO OV DD — PCI_AD12 T1 IO OV DD — PCI_AD13 R2 IO OV DD — PCI_AD14/ECID_TMODE_IN T2 IO OV DD — PCI_AD15 U1 IO OV DD — PCI_AD16 Y2 IO OV DD — PCI_AD17 Y1 IO OV DD — PCI_AD18 AA2 IO OV DD — PCI_AD19 AB1 IO OV DD — PCI MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 56 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes PCI_AD20 AB2 IO OV DD — PCI_AD21 Y4 IO OV DD — PCI_AD22 AC1 IO OV DD — PCI_AD23 AA3 IO OV DD — PCI_AD24 AA4 IO OV DD — PCI_AD25 AD1 IO OV DD — PCI_AD26 AD2 IO OV DD — PCI_AD27 AB3 IO OV DD — PCI_AD28 AB4 IO OV DD — PCI_AD29 AE1 IO OV DD — PCI_AD30 AC3 IO OV DD — PCI_AD31 AC4 IO OV DD — PCI_C_BE0 M4 IO OV DD — PCI_C_BE1 T4 IO OV DD — PCI_C_BE2 Y3 IO OV DD — PCI_C_BE3 AC2 IO OV DD — PCI_PAR U3 IO OV DD — PCI_FRAME W1 IO OV DD 5 PCI_TRDY W4 IO OV DD 5 PCI_IRDY W2 IO OV DD 5 PCI_STOP V4 IO OV DD 5 PCI_DEVSEL W3 IO OV DD 5 PCI_IDSEL P2 I OV DD — PCI_SERR U4 IO OV DD 5 PCI_PERR V3 IO OV DD 5 PCI_REQ0 AD4 IO OV DD — PCI_REQ1/CPCI_HS_ES AE3 I OV DD — PCI_REQ2 AF3 I OV DD — PCI_GNT0 AD3 IO OV DD — PCI_GNT1/CPCI_HS_LED AE4 O OV DD — PCI_GNT2/CPCI_HS_ENUM AF4 O OV DD — L4 I OV DD — Signal M66EN MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 57 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes CE/GPIO GPIO_PA0/SER1_TXD[0]/TDMA_TXD[0]/USBTXN G3 IO OV DD — GPIO_PA1/SER1_TXD[1]/TDMA_TXD[1]/USBTXP F3 IO OV DD — GPIO_PA2/SER1_TXD[2]/TDMA_TXD[2] F2 IO OV DD — GPIO_PA3/SER1_TXD[3]/TDMA_TXD[3] E3 IO OV DD — GPIO_PA4/SER1_RXD[0]/TDMA_RXD[0]/USBRXP E2 IO OV DD — GPIO_PA5/SER1_RXD[1]/TDMA_RXD[1]/USBRXN E1 IO OV DD — GPIO_PA6/SER1_RXD[2]/TDMA_RXD[2]/USBRXD D3 IO OV DD — GPIO_PA7/SER1_RXD[3]/TDMA_RXD[3] D2 IO OV DD — GPIO_PA8/SER1_CD/TDMA_REQ/USBOE D1 IO OV DD — GPIO_PA9 TDMA_CLKO C3 IO OV DD — GPIO_PA10/SER1_CTS/TDMA_RSYNC C2 IO OVDD — GPIO_PA11/TDMA_STROBE C1 IO OV DD — GPIO_PA12/SER1_RTS/TDMA_TSYNC B1 IO OV DD — GPIO_PA13/CLK9/BRGO9 H4 IO OV DD — GPIO_PA14/CLK11/BRGO10 G4 IO OV DD — GPIO_PA15/BRGO7 J4 IO OV DD — GPIO_PA16/ LA0 (LBIU) K24 IO OV DD — GPIO_PA17/ LA1 (LBIU) K26 IO OV DD — GPIO_PA18/Enet2_TXD[0]/SER2_TXD[0]/ TDMB_TXD[0]/LA2 (LBIU) G25 IO OV DD — GPIO_PA19/Enet2_TXD[1]/SER2_TXD[1]/ TDMB_TXD[1]/LA3 (LBIU) G26 IO OV DD — GPIO_PA20/Enet2_TXD[2]/SER2_TXD[2]/ TDMB_TXD[2]/LA4 (LBIU) H25 IO OV DD — GPIO_PA21/Enet2_TXD[3]/SER2_TXD[3]/ TDMB_TXD[3]/LA5 (LBIU) H26 IO OV DD — GPIO_PA22/Enet2_RXD[0]/SER2_RXD[0]/ TDMB_RXD[0]/LA6 (LBIU) C25 IO OV DD — GPIO_PA23/Enet2_RXD[1]/SER2_RXD[1]/ TDMB_RXD[1]/LA7 (LBIU) C26 IO OV DD — GPIO_PA24/Enet2_RXD[2]/SER2_RXD[2]/ TDMB_RXD[2]/LA8 (LBIU) D25 IO OV DD — GPIO_PA25/Enet2_RXD[3]/SER2_RXD[3]/ TDMB_RXD[3]/LA9 (LBIU) D26 IO OV DD — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 58 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes GPIO_PA26/Enet2_RX_ER/SER2_CD/TDMB_REQ/ LA10 (LBIU) E26 IO OV DD — GPIO_PA27/Enet2_TX_ER/TDMB_CLKO/LA11 (LBIU) F25 IO OV DD — GPIO_PA28/Enet2_RX_DV/SER2_CTS/ TDMB_RSYNC/LA12 (LBIU) E25 IO OV DD — GPIO_PA29/Enet2_COL/RXD[4]/SER2_RXD[4]/ TDMB_STROBE/LA13 (LBIU) J25 IO OV DD — GPIO_PA30/Enet2_TX_EN/SER2_RTS/ TDMB_TSYNC/LA14 (LBIU) F26 IO OV DD — GPIO_PA31/Enet2_CRS/SDET LA15 (LBIU) J26 IO OV DD — GPIO_PB0/Enet3_TXD[0]/SER3_TXD[0]/ TDMC_TXD[0] A13 IO OV DD — GPIO_PB1/Enet3_TXD[1]/SER3_TXD[1]/ TDMC_TXD[1] B13 IO OV DD — GPIO_PB2/Enet3_TXD[2]/SER3_TXD[2]/ TDMC_TXD[2] A14 IO OV DD — GPIO_PB3/Enet3_TXD[3]/SER3_TXD[3]/ TDMC_TXD[3] B14 IO OV DD — GPIO_PB4/Enet3_RXD[0]/SER3_RXD[0]/ TDMC_RXD[0] B8 IO OV DD — GPIO_PB5/Enet3_RXD[1]/SER3_RXD[1]/ TDMC_RXD[1] A8 IO OV DD — GPIO_PB6/Enet3_RXD[2]/SER3_RXD[2]/ TDMC_RXD[2] A9 IO OV DD — GPIO_PB7/Enet3_RXD[3]/SER3_RXD[3]/ TDMC_RXD[3] B9 IO OV DD — GPIO_PB8/Enet3_RX_ER/SER3_CD/TDMC_REQ A11 IO OV DD — GPIO_PB9/Enet3_TX_ER/TDMC_CLKO B11 IO OV DD — GPIO_PB10/Enet3_RX_DV/SER3_CTS/ TDMC_RSYNC A10 IO OV DD — GPIO_PB11/Enet3_COL/RXD[4]/SER3_RXD[4]/ TDMC_STROBE A15 IO OV DD — GPIO_PB12/Enet3_TX_EN/SER3_RTS/ TDMC_TSYNC B12 IO OV DD — GPIO_PB13/Enet3_CRS/SDET B15 IO OV DD — GPIO_PB14/CLK12 D9 IO OV DD — GPIO_PB15 UPC1_TxADDR[4] D14 IO OV DD — GPIO_PB16 UPC1_RxADDR[4] B16 IO OV DD — Signal MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 59 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes GPIO_PB17/BRGO1/CE_EXT_REQ1 D10 IO OV DD — GPIO_PB18/Enet4_TXD[0]/SER4_TXD[0]/ TDMD_TXD[0] C10 IO OV DD — GPIO_PB19/Enet4_TXD[1]/SER4_TXD[1]/ TDMD_TXD[1] C9 IO OV DD — GPIO_PB20/Enet4_TXD[2]/SER4_TXD[2]/ TDMD_TXD[2] D8 IO OV DD — GPIO_PB21/Enet4_TXD[3]/SER4_TXD[3]/ TDMD_TXD[3] C8 IO OV DD — GPIO_PB22/Enet4_RXD[0]/SER4_RXD[0]/ TDMD_RXD[0] C15 IO OV DD — GPIO_PB23/Enet4_RXD[1]/SER4_RXD[1]/ TDMD_RXD[1] C14 IO OV DD — GPIO_PB24/Enet4_RXD[2]/SER4_RXD[2]/ TDMD_RXD[2] D13 IO OV DD — GPIO_PB25/Enet4_RXD[3]/SER4_RXD[3]/ TDMD_RXD[3] C13 IO OV DD — GPIO_PB26/Enet4_RX_ER/SER4_CD/TDMD_REQ C12 IO OV DD — GPIO_PB27/Enet4_TX_ER/TDMD_CLKO D11 IO OV DD — GPIO_PB28/Enet4_RX_DV/SER4_CTS/ TDMD_RSYNC D12 IO OV DD — GPIO_PB29/Enet4_COL/RXD[4]/SER4_RXD[4]/ TDMD_STROBE D7 IO OV DD — GPIO_PB30/Enet4_TX_EN/SER4_RTS/ TDMD_TSYNC C11 IO OV DD — GPIO_PB31/Enet4_CRS/SDET C7 IO OV DD — GPIO_PC0/UPC1_TxDATA[0]/SER5_TXD[0] A18 IO OV DD — GPIO_PC1/UPC1_TxDATA[1]/SER5_TXD[1] A19 IO OV DD — GPIO_PC2/UPC1_TxDATA[2]/SER5_TXD[2] B18 IO OV DD — GPIO_PC3/UPC1_TxDATA[3]/SER5_TXD[3] B19 IO OV DD — GPIO_PC4/UPC1_TxDATA[4] A24 IO OV DD — GPIO_PC5/UPC1_TxDATA[5] B24 IO OV DD — GPIO_PC6/UPC1_TxDATA[6] A23 IO OV DD — GPIO_PC7/UPC1_TxDATA[7] B26 IO OV DD — GPIO_PC8/UPC1_RxDATA[0]/SER5_RXD[0] A21 IO OV DD — GPIO_PC9/UPC1_RxDATA[1]/SER5_RXD[1] B20 IO OV DD — Signal MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 60 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes GPIO_PC10/UPC1_RxDATA[2]/SER5_RXD[2] B21 IO OV DD — GPIO_PC11/UPC1_RxDATA[3]/SER5_RXD[3] A20 IO OV DD — GPIO_PC12/UPC1_RxDATA[4] D19 IO OV DD — GPIO_PC13/UPC1_RxDATA[5]/LSRCID0 C18 IO OV DD — GPIO_PC14/UPC1_RxDATA[6]/LSRCID1 D18 IO OV DD — GPIO_PC15/UPC1_RxDATA[7]/LSRCID2 A25 IO OV DD — GPIO_PC16/UPC1_TxADDR[0] C21 IO OV DD — GPIO_PC17/UPC1_TxADDR[1]/LSRCID3 D22 IO OV DD — GPIO_PC18/UPC1_TxADDR[2]/LSRCID4 C23 IO OV DD — GPIO_PC19/UPC1_TxADDR[3]/LDVAL D23 IO OV DD — GPIO_PC20/UPC1_RxADDR[0] C17 IO OV DD — GPIO_PC21/UPC1_RxADDR[1] D17 IO OV DD — GPIO_PC22/UPC1_RxADDR[2] C16 IO OV DD — GPIO_PC23/UPC1_RxADDR[3] D16 IO OV DD — GPIO_PC24/UPC1_RxSOC/SER5_CD A16 IO OV DD — GPIO_PC25/UPC1_RxCLAV D20 IO OV DD — GPIO_PC26/UPC1_RxPRTY/CE_EXT_REQ2 E23 IO OV DD — GPIO_PC27/UPC1_RxEN B17 IO OV DD — GPIO_PC28/UPC1_TxSOC B22 IO OV DD — GPIO_PC29/UPC1_TxCLAV/SER5_CTS A17 IO OV DD — GPIO_PC30/UPC1_TxPRTY A22 IO OV DD — GPIO_PC31/UPC1_TxEN/SER5_RTS C20 IO OV DD — GPIO_PD0/SPIMOSI A2 IO OV DD — GPIO_PD1/SPIMISO B2 IO OV DD — GPIO_PD2/SPICLK B3 IO OV DD — GPIO_PD3/SPISEL A3 IO OV DD — GPIO_PD4/SPI_MDIO/CE_MUX_MDIO A4 IO OV DD — GPIO_PD5/SPI_MDC/CE_MUX_MDC B4 IO OV DD — GPIO_PD6/CLK8/BRGO16/CE_EXT_REQ3 F24 IO OV DD — GPIO_PD7/GTM1_TIN1/GTM2_TIN2/CLK5 G24 IO OV DD — GPIO_PD8/GTM1_TGATE1/GTM2_TGATE2/CLK6 H24 IO OV DD — GPIO_PD9/GTM1_TOUT1 D24 IO OV DD — Signal MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 61 Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes GPIO_PD10/GTM1_TIN2/GTM2_TIN1/CLK17 J24 IO OV DD — GPIO_PD11/GTM1_TGATE2/GTM2_TGATE1 B25 IO OV DD — GPIO_PD12/GTM1_TOUT2/GTM2_TOUT1 C4 IO OV DD — GPIO_PD13/GTM1_TIN3/GTM2_TIN4/BRGO8 D4 IO OV DD — GPIO_PD14/GTM1_TGATE3/GTM2_TGATE4 D5 IO OV DD — GPIO_PD15/GTM1_TOUT3 A5 IO OV DD — GPIO_PD16/GTM1_TIN4/GTM2_TIN3 B5 IO OV DD — GPIO_PD17/GTM1_TGATE4/GTM2_TGATE3 C5 IO OV DD — GPIO_PD18/GTM1_TOUT4/GTM2_TOUT3 A6 IO OV DD — GPIO_PD19/CE_RISC1_INT/CE_EXT_REQ4 B6 IO OV DD — GPIO_PD20/CLK18/BRGO6 D21 IO OV DD — GPIO_PD21/CLK16/BRGO5/UPC1_CLKO C19 IO OV DD — GPIO_PD22/CLK4/BRGO9/UCC2_CLKO A7 IO OV DD — GPIO_PD23/CLK3/BRGO10/UCC3_CLKO B7 IO OV DD — GPIO_PD24/CLK10/BRGO2/UCC4_CLKO A12 IO OV DD — GPIO_PD25/CLK13/BRGO16/UCC5_CLKO B10 IO OV DD — GPIO_PD26/CLK2/BRGO4/UCC1_CLKO E4 IO OV DD — GPIO_PD27/CLK1/BRGO3 F4 IO OV DD — GPIO_PD28/CLK19/BRGO11 D15 IO OV DD — GPIO_PD29/CLK15/BRGO8 C6 IO OV DD — GPIO_PD30/CLK14 D6 IO OV DD — GPIO_PD31/CLK7/BRGO15 E24 IO OV DD — Signal Power and Ground Supplies GV DD AA8, AA10, AA11, AA13, AA14, AA16, AA17, AA19, AA21, AB9, AB10, AB11, AB12, AB14, AB18, AB20, AB21, AC6, AC8, AC14, AC18 GVDD — — OVDD E5, E6, E8, E9, E10, E12, E14, E15, E16, E18, E19, E20, E22, F5, F6, F8, F10, F14, F16, F19, F22, G22, H5, H6, H21, J5, J22, K21, K22, L5, L6, L22, M5, M22, N5, N21, N22, P6, P22, P23, R5, R23, T5, T21, T22, U6, U22, V5, V22, W22, Y5, AB5, AB6, AC5 OV DD — — MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 62 Freescale Semiconductor Package and Pin Listings Table 55. MPC8323E PBGA Pinout Listing (continued) Package Pin Number Pin Type Power Supply Notes VDD K10, K11, K12, K13, K14, K15, K16, K17, L10, L17, M10, M17, N10, N17, P10, P17, R10, R17, T10, T17, U10, U11, U12, U13, U14, U15, U16, U17 VDD — — VSS B23, E7, E11, E13, E17, E21, F11, F13, F17, F21, F23, G5, H22, K5, K6, L11, L12, L13, L14, L15, L16, L21, M11, M12, M13, M14, M15, M16, N6, N11, N12, N13, N14, N15, N16, P5, P11, P12, P13, P14, P15, P16, P21, R11, R12, R13, R14, R15, R16, R22, T6, T11, T12, T13, T14, T15, T16, U5, U21, V23, W5, W6, W21, W23, W24, Y22, AA5, AA6, AA22, AA25, AB7, AB13, AB19, AB22, AC10, AC12, AC16, AC20 VSS — — — — — Signal No Connect NC C22 Notes: 1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD. 2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD. 3. This output is actively driven during reset rather than being three-stated during reset. 4. These JTAG and local bus pins have weak internal pull-up P-FETs that are always enabled. 5. This pin should have a weak pull up if the chip is in PCI host mode. Follow the PCI specification’s recommendation. 6. This pin must always be tied to GND. 7.This pin has weak internal pull-down N-FET that is always enabled.8.Though this pin has weak internal pull-up yet it is recommended to apply an external pull-up. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 63 Clocking 22 Clocking Figure 43 shows the internal distribution of clocks within the MPC8323E. e300c2 core MPC8323E to DDR memory controller csb_clk DDR Clock Divider /2 QUICC Engine PLL MEMC_MCK DDR Memory Device MEMC_MCK ddr_clk Clock Unit System PLL core_clk Core PLL ce_clk to QUICC Engine block lbc_clk /n to local bus LBC Clock Divider LCLK[0:1] Local Bus Memory Device csb_clk to rest of the device PCI_CLK/ PCI_SYNC_IN CFG_CLKIN_DIV 1 0 CLKIN Crystal PCI_SYNC_OUT PCI Clock Divider (÷2) CLKIN 3 PCI_CLK_OUT[0:2] Figure 43. MPC8323E Clock Subsystem The primary clock source for the MPC8323E can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode, respectively. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 64 Freescale Semiconductor Clocking 22.1 Clocking in PCI Host Mode When the MPC8323E is configured as a PCI host device (RCWH[PCIHOST] = 1), CLKIN is its primary input clock. CLKIN feeds the PCI clock divider (÷2) and the PCI_SYNC_OUT and PCI_CLK_OUT multiplexors. The CFG_CLKIN_DIV configuration input selects whether CLKIN or CLKIN/2 is driven out on the PCI_SYNC_OUT signal. PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN, with equal delay to all PCI agent devices in the system. 22.1.1 PCI Clock Outputs (PCI_CLK_OUT[0:2]) When the MPC8323E is configured as a PCI host, it provides three separate clock output signals, PCI_CLK_OUT[0:2], for external PCI agents. When the device comes out of reset, the PCI clock outputs are disabled and are actively driven to a steady low state. Each of the individual clock outputs can be enabled (enable toggling of the clock) by setting its corresponding OCCR[PCICOEn] bit. All output clocks are phase-aligned to each other. 22.2 Clocking in PCI Agent Mode When the MPC8323E is configured as a PCI agent device, PCI_CLK is the primary input clock. In agent mode, the CLKIN signal should be tied to GND, and the clock output signals, PCI_CLK_OUTn and PCI_SYNC_OUT, are not used. 22.3 System Clock Domains As shown in Figure 43, the primary clock input (frequency) is multiplied up by the system phase-locked loop (PLL) and the clock unit to create three major clock domains: • The coherent system bus clock (csb_clk) • The QUICC Engine clock (ce_clk) • The internal clock for the DDR controller (ddr_clk) • The internal clock for the local bus controller (lb_clk) The csb_clk frequency is derived from a complex set of factors that can be simplified into the following equation: csb_clk = [PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV)] × SPMF In PCI host mode, PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV) is the CLKIN frequency. The csb_clk serves as the clock input to the e300c2 core. A second PLL inside the core multiplies up the csb_clk frequency to create the internal clock for the core (core_clk). The system and core PLL multipliers are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL) which is loaded at power-on reset or by one of the hard-coded reset options. See the “Reset Configuration” section in the MPC8323E PowerQUICC II Pro Communications Processor Reference Manual for more information. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 65 Clocking The ce_clk frequency is determined by the QUICC Engine PLL multiplication factor (RCWL[CEPMF) and the QUICC Engine PLL division factor (RCWL[CEPDF]) according to the following equation: When CLKIN is the primary input clock, ce_clk = (primary clock input × CEPMF) ÷ (1 + CEPDF) When PCI_CLK is the primary input clock, ce_clk = [primary clock input × CEPMF × (1 + ~CFG_CLKIN_DIV)] ÷ (1 + CEPDF) See the “QUICC Engine PLL Multiplication Factor” section and the “QUICC Engine PLL Division Factor” section in the MPC8323E PowerQUICC II Pro Communications Processor Reference Manual for more information. The DDR SDRAM memory controller operates with a frequency equal to twice the frequency of csb_clk. Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (÷2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the same frequency as ddr_clk. The local bus memory controller operates with a frequency equal to the frequency of csb_clk. Note that lbc_clk is not the external local bus frequency; lbc_clk passes through the LBC clock divider to create the external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LBC clock divider ratio is controlled by LCRR[CLKDIV]. See the “LBC Bus Clock and Clock Ratios” section in the MPC8323E PowerQUICC II Pro Communications Processor Reference Manual for more information. In addition, some of the internal units may be required to be shut off or operate at lower frequency than the csb_clk frequency. These units have a default clock ratio that can be configured by a memory mapped register after the device comes out of reset. Table 56 specifies which units have a configurable clock frequency. Refer to the “System Clock Control Register (SCCR)” section in the MPC8323E PowerQUICC II Pro Communications Processor Reference Manual for a detailed description. Table 56. Configurable Clock Units Unit Default Frequency Options Security core, I2C, SAP, TPR csb_clk Off, csb_clk/2, csb_clk/3 PCI and DMA complex csb_clk Off, csb_clk NOTE Setting the clock ratio of these units must be performed prior to any access to them. Table 57 provides the operating frequencies for the 8323E PBGA under recommended operating conditions (see Table 2). Table 57. Operating Frequencies for PBGA Characteristic1 Max Operating Frequency Unit e300 core frequency (core_clk) 333 MHz Coherent system bus frequency (csb_clk) 133 MHz QUICC Engine frequency (ce_clk) 200 MHz MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 66 Freescale Semiconductor Clocking Table 57. Operating Frequencies for PBGA (continued) Characteristic1 Max Operating Frequency Unit 133 MHz 66 MHz 66 MHz DDR1/DDR2 memory bus frequency (MCLK)2 Local bus frequency (LCLKn) 3 PCI input frequency (CLKIN or PCI_CLK) 1 The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk, MCLK, LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies. 2 The DDR1/DDR2 data rate is 2× the DDR1/DDR2 memory bus frequency. 3 The local bus frequency is 1/2, 1/4, or 1/8 of the lb_clk frequency (depending on LCRR[CLKDIV]) which is in turn 1× or 2× the csb_clk frequency (depending on RCWL[LBCM]). 22.4 System PLL Configuration The system PLL is controlled by the RCWL[SPMF] parameter. Table 58 shows the multiplication factor encodings for the system PLL. NOTE System PLL VCO frequency = 2 × (CSB frequency) × (System PLL VCO divider). The VCO divider needs to be set properly so that the System PLL VCO frequency is in the range of 300–600 MHz. Table 58. System PLL Multiplication Factors RCWL[SPMF] System PLL Multiplication Factor 0000 Reserved 0001 Reserved 0010 ×2 0011 ×3 0100 ×4 0101 ×5 0110 ×6 0111–1111 Reserved As described in Section 22, “Clocking,” the LBCM, DDRCM, and SPMF parameters in the reset configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the primary clock input (CLKIN or PCI_CLK) and the internal coherent system bus clock (csb_clk). Table 59 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 67 Clocking shows the expected frequency values for the CSB frequency for select csb_clk to CLKIN/PCI_SYNC_IN ratios. Table 59. CSB Frequency Options Input Clock Frequency (MHz)2 CFG_CLKIN_DIV_B at Reset1 SPMF csb_clk : Input Clock Ratio 2 25 33.33 66.67 csb_clk Frequency (MHz) High 0010 2:1 High 0011 3:1 High 0100 4:1 100 High 0101 5:1 125 High 0110 6:1 High 0111 7:1 High 1000 8:1 High 1001 9:1 High 1010 10 : 1 High 1011 11 : 1 High 1100 12 : 1 High 1101 13 : 1 High 1110 14 : 1 High 1111 15 : 1 High 0000 16 : 1 Low 0010 2:1 Low 0011 3:1 100 Low 0100 4:1 133 Low 0101 5:1 Low 0110 6:1 Low 0111 7:1 Low 1000 8:1 Low 1001 9:1 Low 1010 10 : 1 Low 1011 11 : 1 Low 1100 12 : 1 Low 1101 13 : 1 Low 1110 14 : 1 Low 1111 15 : 1 Low 0000 16 : 1 133 100 133 133 1 CFG_CLKIN_DIV_B is only used for host mode; CLKIN must be tied low and CFG_CLKIN_DIV_B must be pulled up (high) in agent mode. 2 CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 68 Freescale Semiconductor Clocking 22.5 Core PLL Configuration RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300 core clock (core_clk). Table 60 shows the encodings for RCWL[COREPLL]. COREPLL values not listed in Table 60 should be considered reserved. Table 60. e300 Core PLL Configuration RCWL[COREPLL] core_clk : csb_clk Ratio VCO Divider n PLL bypassed (PLL off, csb_clk clocks core directly) PLL bypassed (PLL off, csb_clk clocks core directly) 0001 0 1:1 ÷2 01 0001 0 1:1 ÷4 10 0001 0 1:1 ÷8 11 0001 0 1:1 ÷8 00 0001 1 1.5:1 ÷2 01 0001 1 1.5:1 ÷4 10 0001 1 1.5:1 ÷8 11 0001 1 1.5:1 ÷8 00 0010 0 2:1 ÷2 01 0010 0 2:1 ÷4 10 0010 0 2:1 ÷8 11 0010 0 2:1 ÷8 00 0010 1 2.5:1 ÷2 01 0010 1 2.5:1 ÷4 10 0010 1 2.5:1 ÷8 11 0010 1 2.5:1 ÷8 00 0011 0 3:1 ÷2 01 0011 0 3:1 ÷4 10 0011 0 3:1 ÷8 11 0011 0 3:1 ÷8 0-1 2-5 6 nn 0000 00 NOTE Core VCO frequency = core frequency × VCO divider VCO divider (RCWL[COREPLL[0:1]]) must be set properly so that the core VCO frequency is in the range of 500–800 MHz. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 69 Clocking 22.6 QUICC Engine PLL Configuration The QUICC Engine PLL is controlled by the RCWL[CEPMF] and RCWL[CEPDF] parameters. Table 61 shows the multiplication factor encodings for the QUICC Engine PLL. Table 61. QUICC Engine PLL Multiplication Factors RCWL[CEPMF] RCWL[CEPDF] QUICC Engine PLL Multiplication Factor = RCWL[CEPMF]/ (1 + RCWL[CEPDF) 00000–00001 0 Reserved 00010 0 ×2 00011 0 ×3 00100 0 ×4 00101 0 ×5 00110 0 ×6 00111 0 ×7 01000 0 ×8 01001–11111 0 Reserved The RCWL[CEVCOD] denotes the QUICC Engine PLL VCO internal frequency as shown in Table 62. Table 62. QUICC Engine PLL VCO Divider RCWL[CEVCOD] VCO Divider 00 4 01 8 10 2 11 Reserved NOTE The VCO divider (RCWL[CEVCOD]) must be set properly so that the QUICC Engine VCO frequency is in the range of 300–600 MHz. The QUICC Engine frequency is not restricted by the CSB and core frequencies. The CSB, core, and QUICC Engine frequencies should be selected according to the performance requirements. The QUICC Engine VCO frequency is derived from the following equations: ce_clk = (primary clock input × CEPMF) ÷ (1 + CEPDF) QUICC Engine VCO Frequency = ce_clk × VCO divider × (1 + CEPDF) MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 70 Freescale Semiconductor Thermal 22.7 Suggested PLL Configurations To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock domains are independent, and each of their PLLs are configured separately. Both of the domains has one common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks. Table 63. Suggested PLL Configurations CEDF Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz) QUICC Engine Frequency (MHz) Conf No. SPMF Core PLL 1 0100 0000100 0110 0 33.33 133.33 266.66 200 2 0100 0000101 1000 0 25 100 250 200 3 0010 0000100 0011 0 66.67 133.33 266.66 200 4 0100 0000101 0110 0 33.33 133.33 333.33 200 5 0101 0000101 1000 0 25 125 312.5 200 6 0010 0000101 0011 0 66.67 133.33 333.33 200 CEMF 23 Thermal This section describes the thermal specifications of the MPC8323E. 23.1 Thermal Characteristics Table 64 provides the package thermal characteristics for the 516 27 × 27 mm PBGA of the MPC8323E. Table 64. Package Thermal Characteristics for PBGA Characteristic Board type Symbol Value Unit Notes Junction-to-ambient natural convection Single-layer board (1s) RθJA 28 °C/W 1, 2 Junction-to-ambient natural convection Four-layer board (2s2p) RθJA 21 °C/W 1, 2, 3 Junction-to-ambient (@200 ft/min) Single-layer board (1s) RθJMA 23 °C/W 1, 3 Junction-to-ambient (@200 ft/min) Four-layer board (2s2p) RθJMA 18 °C/W 1, 3 Junction-to-board — RθJB 13 °C/W 4 Junction-to-case — RθJC 9 °C/W 5 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 71 Thermal Table 64. Package Thermal Characteristics for PBGA (continued) Characteristic Junction-to-package top Board type Symbol Value Unit Notes Natural convection ΨJT 2 °C/W 6 Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 23.2 Thermal Management Information For the following sections, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 23.2.1 Estimation of Junction Temperature with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJA × PD) where: TJ = junction temperature (°C) TA = ambient temperature for the package (°C) RθJA = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. As a general statement, the value obtained on a single layer board is appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 23.2.2 Estimation of Junction Temperature with Junction-to-Board Thermal Resistance The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal resistance. The thermal performance of any component is strongly dependent on the power dissipation of surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 72 Freescale Semiconductor Thermal (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device. At a known board temperature, the junction temperature is estimated using the following equation: TJ = TB + (RθJB × PD) where: TJ = junction temperature (°C) TB = board temperature at the package perimeter (°C) RθJB = junction-to-board thermal resistance (°C/W) per JESD51-8 PD = power dissipation in package (W) When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. The application board should be similar to the thermal test condition: the component is soldered to a board with internal planes. 23.2.3 Experimental Determination of Junction Temperature To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) where: TJ = junction temperature (°C) TT = thermocouple temperature on top of package (°C) ΨJT = thermal characterization parameter (°C/W) PD = power dissipation in package (W) The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 23.2.4 Heat Sinks and Junction-to-Case Thermal Resistance In some application environments, a heat sink is required to provide the necessary thermal management of the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a case to ambient thermal resistance: RθJA = RθJC + RθCA MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 73 Thermal where: RθJA = junction-to-ambient thermal resistance (°C/W) RθJC = junction-to-case thermal resistance (°C/W) RθCA = case-to-ambient thermal resistance (°C/W) RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been simulated with a few commercially available heat sinks. The heat sink choice is determined by the application environment (temperature, air flow, adjacent component power dissipation) and the physical space available. Because there is not a standard application environment, a standard heat sink is not required. Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink vendors include the following list: Aavid Thermalloy 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com 603-224-9988 408-567-8082 International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-thermal.com 408-436-8770 Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com 800-522-2800 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 74 Freescale Semiconductor Thermal Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Interface material vendors include the following: Chomerics, Inc. 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com 603-635-5102 781-935-4850 Dow-Corning Corporation Dow-Corning Electronic Materials P.O. Box 994 Midland, MI 48686-0997 Internet: www.dowcorning.com 800-248-2481 Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com 888-642-7674 The Bergquist Company 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com 800-347-4572 23.3 Heat Sink Attachment When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force. If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic surfaces and its performance verified under the application requirements. 23.3.1 Experimental Determination of the Junction Temperature with a Heat Sink When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 75 System Design Information interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance. TJ = TC + (RθJC × PD) where: TC = case temperature of the package (°C) RθJC = junction-to-case thermal resistance (°C/W) PD = power dissipation (W) 24 System Design Information This section provides electrical and thermal design recommendations for successful application of the MPC8323E. 24.1 System Clocking The MPC8323E includes three PLLs. • The system PLL (AVDD2) generates the system clock from the externally supplied CLKIN input. The frequency ratio between the system and CLKIN is selected using the system PLL ratio configuration bits as described in Section 22.4, “System PLL Configuration.” • The e300 core PLL (AVDD3) generates the core clock as a slave to the system clock. The frequency ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio configuration bits as described in Section 22.5, “Core PLL Configuration.” • The QUICC Engine PLL (AVDD1) which uses the same reference as the system PLL. The QUICC Engine block generates or uses external sources for all required serial interface clocks. 24.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins. The voltage level at each AVDDn pin should always be equivalent to VDD, and preferably these voltages are derived directly from VDD through a low frequency filter scheme such as the following. There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide five independent filter circuits as illustrated in Figure 44, one to each of the five AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 76 Freescale Semiconductor System Design Information Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD pin, which is on the periphery of package, without the inductance of vias. Figure 44 shows the PLL power supply filter circuit. VDD 10 Ω AVDD (or L2AVDD) 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors (