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SEMICONDUCTOR TECHNICAL DATA
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Low Voltage 1:18 Clock
Distribution Chip
The MPC942 is a 1:18 low voltage clock distribution chip with 2.5V or
3.3V LVCMOS output capabilities. The device is offered in two versions;
the MPC942C has an LVCMOS input clock while the MPC942P has a
LVPECL input clock. The 18 outputs are 2.5V or 3.3V LVCMOS
compatible and feature the drive strength to drive 50Ω series or parallel
terminated transmission lines. With output–to–output skews of 200ps, the
MPC942 is ideal as a clock distribution chip for the most demanding of
synchronous systems. The 2.5V outputs also make the device ideal for
supplying clocks for a high performance Pentium II microprocessor
based design.
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by MPC942P/D
MPC942P
LOW VOLTAGE
1:18 CLOCK
DISTRIBUTION CHIP
LVPECL Clock Input
2.5V LVCMOS Outputs for Pentium II Microprocessor Support
200ps Maximum Targeted Output–to–Output Skew
Maximum Output Frequency of 250MHz @ 3.3 VCC
32–Lead LQFP Packaging
Single 3.3V or 2.5V Supply
With a low output impedance (≈12Ω), in both the HIGH and LOW logic
states, the output buffers of the MPC942 are ideal for driving series
terminated transmission lines. With an output impedance of 12Ω the
MPC942 can drive two series terminated transmission lines from each
output. This capability gives the MPC942 an effective fanout of 1:36. The
MPC942 provides enough copies of low skew clocks for most high
performance synchronous systems.
FA SUFFIX
32–LEAD LQFP PACKAGE
CASE 873A–02
The differential LVPECL inputs of the MPC942P allow the device to interface directly with a LVPECL fanout buffer like the
MC100EP111 to build very wide clock fanout trees or to couple to a high frequency clock source. The OE pins will place the
outputs into a high impedance state. The OE pin has an internal pullup resistor.
The MPC942 is a single supply device. The VCC power pins require either 2.5V or 3.3V. The 32–lead LQFP package was
chosen to optimize performance, board space and cost of the device. The 32–lead LQFP has a 7x7mm body size with a
conservative 0.8mm pin spacing.
Pentium II is a trademark of Intel Corporation.
02/01
Motorola, Inc. 2001
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MPC942P
LOGIC DIAGRAM
FUNCTION TABLE
MPC942P Block Diagram
Q0
PECL_CLK
PECL_CLK
Q1:Q16
OE
Output
0
1
HIGH IMPEDANCE
OUTPUTS ENABLED
Q17
OE
(Int. Pullup)
Q6
Q7
Q8
VCC
Q9
Q10
Q11
GND
24
23
22
21
20
19
18
17
GND
25
16
VCC
Q5
26
15
Q12
Q4
27
14
Q13
Q3
28
13
Q14
VCC
29
12
GND
Q2
30
11
Q15
Q1
31
10
Q16
Q0
32
9
Q17
1
2
3
4
5
6
7
8
GND
OE
NC
PECL_CLK
PECL_CLK
VCC
VCC
MPC942P
GND
Freescale Semiconductor, Inc...
Pinout: 32–Lead (Top View)
ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Min
Max
Unit
VCC
Supply Voltage
–0.3
3.6
V
VI
Input Voltage
–0.3
VCC + 0.3
V
IIN
Input Current
±20
mA
TStor
Storage Temperature Range
–40
125
°C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
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TIMING SOLUTIONS
DL207 — Rev 0
Freescale Semiconductor, Inc.
MPC942P
DC CHARACTERISTICS (TA = 0° to 70°C, VCC = 2.5V ±5%)
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Symbol
Characteristic
Min
Typ
Max
Unit
VCC
V
0.8
V
0.6
1.0
V
VCC–1.0
VCC–0.6
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
2.0
VPP
Input Swing PECL_CLK
VX
Input Crosspoint PECL_CLK
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
IIN
Input Current
CIN
Input Capacitance
4.0
pF
CPD
Power Dissipation Capacitance
14
pF
ZOUT
Output Impedance
12
ICC
Maximum Quiescent Supply Current
0.5
5.0
mA
Typ
Max
Unit
2.0
Condition
V
IOH = –16 mA
0.5
V
IOL = 16 mA
±200
µA
Per Output
W
AC CHARACTERISTICS (TA = 0° to 70°C, VCC = 2.5V ±5%)
Symbol
Characteristic
Min
Condition
Fmax
Maximum Frequency
200
MHz
tPLH
Propagation Delay
1.8
4.0
ns
tPHL
Propagation Delay
2.0
4.3
ns
tsk(o)
Output–to–Output Skew
200
ps
tsk(pr)
Part–to–Part Skew
2.2
ns
Note 2
tsk(pr)
Part–to–Part Skew
1.3
ps
Note 1
1.0
ns
tr, tf
Output Rise/Fall Time
1. For a specific temperature and voltage, includes output skew.
2. Across temperature and voltage ranges, includes output skew.
TIMING SOLUTIONS
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0.1
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Freescale Semiconductor, Inc.
MPC942P
DC CHARACTERISTICS (TA = 0° to 70°C, VCC = 3.3V ±5%)
Freescale Semiconductor, Inc...
Symbol
Characteristic
Min
Typ
Max
Unit
VCC
V
0.8
V
0.6
1.0
V
VCC–1.0
VCC–0.6
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
2.4
VPP
Input Swing PECL.CLK
VX
Input Crosspoint PECL_CLK
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
IIN
Input Current
CIN
Input Capacitance
4.0
pF
CPD
Power Dissipation Capacitance
14
pF
ZOUT
Output Impedance
12
ICC
Maximum Quiescent Supply Current
0.5
5.0
mA
Typ
Max
Unit
2.4
Condition
V
IOH = –20 mA
0.6
V
IOL = 20 mA
±200
µA
Per Output
W
AC CHARACTERISTICS (TA = 0° to 70°C, VCC = 3.3V ±5%)
Symbol
Characteristic
Min
Condition
Fmax
Maximum Frequency
250
MHz
tPLH
Propagation Delay
1.5
3.2
ns
tPHL
Propagation Delay
1.5
3.6
ns
tsk(o)
Output–to–Output Skew
200
ps
tsk(pr)
Part–to–Part Skew
1.7
ns
Note 2
tsk(pr)
Part–to–Part Skew
1.0
ps
Note 1
1.0
ns
tr, tf
Output Rise/Fall Time
1. For a specific temperature and voltage, includes output skew.
2. Across temperature and voltage ranges, includes output skew.
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0.1
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TIMING SOLUTIONS
DL207 — Rev 0
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MPC942P
OUTLINE DIMENSIONS
A
–T–, –U–, –Z–
FA SUFFIX
LQFP PACKAGE
CASE 873A–02
ISSUE A
4X
A1
32
0.20 (0.008) AB T–U Z
25
AE
P
1
–U–
–T–
AE
V
B1
DETAIL Y
17
8
9
4X
–Z–
9
DETAIL Y
V1
0.20 (0.008) AC T–U Z
S1
S
DETAIL AD
G
–AB–
0.10 (0.004) AC
AC T–U Z
–AC–
BASE
METAL
ÉÉ
ÉÉ
ÉÉ
F
8X
M_
R
J
M
N
D
0.20 (0.008)
SEATING
PLANE
SECTION AE–AE
H
W
K
X
DETAIL AD
TIMING SOLUTIONS
DL207 — Rev 0
Q_
0.250 (0.010)
C E
GAUGE PLANE
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B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
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MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_ REF
0.090
0.160
0.400 BSC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12_ REF
0.004
0.006
0.016 BSC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
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Freescale Semiconductor, Inc.
MPC942P
Freescale Semiconductor, Inc...
NOTES
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TIMING SOLUTIONS
DL207 — Rev 0
Freescale Semiconductor, Inc.
MPC942P
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NOTES
TIMING SOLUTIONS
DL207 — Rev 0
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
MPC942P
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guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the
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TIMING SOLUTIONS
MPC942P/D
DL207 — Rev 0