MPX5010-MPXV5010-MPVZ5010
Integrated silicon pressure sensor on-chip signal conditioned, temperature
compensated and calibrated
Rev. 14 — 17 May 2024
Product data sheet
1 General description
The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors
designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor
with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and
bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied
pressure. The axial port has been modified to accommodate industrial grade tubing.
2 Features and benefits
•
•
•
•
•
•
•
5.0% maximum error over 0° to 85° C
Ideally suited for microprocessor or microcontroller-based systems
Durable epoxy unibody and thermoplastic (PPS) surface mount package
Temperature compensated over –40° to +125° C
Patented silicon shear stress strain gauge
Available in differential and gauge configurations
Available in surface mount (SMT) or through-hole (DIP) configurations
3 Applications
•
•
•
•
•
•
•
Hospital beds
HVAC
Respiratory systems
Process control
Washing machine water level measurement (Reference AN1950)
Ideally suited for microprocessor or microcontroller-based systems
Appliance liquid level and pressure measurement
MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
4 Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
Version
Unibody package (MPX5010 series)
MPX5010DP
SENSOR4F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.48 mm x
10.67 body
SOT1756-1
MPX5010GP
SENSOR6F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.47 mm x
8.01 mm body
SOT1852-1
Small outline package (MPXV5010 series)
MPXV5010DP
S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x
12.06 mm x 7.62 mm body
SOT1693-1
MPXV5010GC6T1 S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x
10.67 mm x 12.96 mm body
SOT1854-1
MPXV5010GC7U
S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x
10.67 mm x 12.96 mm body
SOT1863-1
MPXV5010GP
S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x
12.06 mm x 7.62 mm body
SOT1693-3
Small outline package (Media resistant gel) (MPVZ5010 series)
MPVZ5010GW6U
S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 SOT1691-2
mm x 1.99 mm body
MPVZ5010GW7U
S08
plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 SOT1691-1
mm x 1.99 mm body
4.1 Ordering options
Table 2. Ordering options
ORDERING INFORMATION
Device Name
Case No.
# of Ports
None
Single
Pressure Type
Dual
Gauge
Differential Absolute
Device
Marking
Unibody Package (MPX5010 Series)
MPX5010DP
867C
MPX5010GP
867B
•
•
•
•
MPX5010DP
MPX5010GP
Small Outline Package (MPXV5010 Series)
MPXV5010DP
1351
•
•
MPXV5010DP
MPXV5010GC6T1
482A
•
•
MPXV5010G
MPXV5010GC7U
482C
•
•
MPXV5010G
MPXV5010GP
1369
•
•
MPXV5010GP
Small Outline Package (Media Resistant Gel) (MPVZ5010 Series)
MPVZ5010GW6U
1735
•
•
MZ5010GW
MPVZ5010GW7U
1560
•
•
MZ5010GW
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
5 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin film
temperature
compensation
and
gain stage #1
Sensing
element
GND
Gain stage #2
and ground
reference
shift circuitry
Vout
Pins 4, 5 and 6 are NO CONNECTS
for unibody device
Pins 1, 5, 6, 7 and 8 are NO CONNECTS
for small outline package device
aaa-051151
Figure 1. Fully Integrated Pressure Sensor Schematic
6 Pinning information
6.1 Pinning - Unibody packages
1 2 3 4 5 6
VOUT
GND
VS
n.c.
n.c.
n.c.
aaa-055124
Figure 2. MPX5010DP - SOT1756-1 - Case 867C-05
1 2 3 4 5 6
VOUT
GND
VS
n.c.
n.c.
n.c.
aaa-054997
Figure 3. MPX5010GP - SOT1852-1 - Case 867B-04
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
6.2 Pin description - Unibody packages
Table 3. Pin descriptions - Unibody pacakages
This table defines the pin configuration for the Unibody packages indentified in Table 1.
Symbol
Pin
Description
VOUT
1
VOUT
GND
2
Ground
VS
3
Supply voltage
N.C.
4
No connect
N.C.
5
No connect
N.C.
6
No connect
6.3 Pinning - Small Outline packages
n.c.
1
8
n.c.
Vs
2
7
n.c.
GND
3
6
n.c.
Vout
4
5
n.c.
aaa-051259
Figure 4. MPXV5010DP - SOT1693-1 - Case 1351-01
n.c.
1
8
n.c.
VS
2
7
n.c.
GND
3
6
n.c.
VOUT
4
5
n.c.
aaa-051261
Figure 5. MPXV5010GC6T1 - SOT1854-1 - Case 482A-01
n.c.
1
8
n.c.
VS
2
7
n.c.
GND
3
6
n.c.
VOUT
4
5
n.c.
aaa-051261
Figure 6. MPXV5010GC7U - SOT1863-1 - Case 482C-03
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
n.c.
1
8
n.c.
VS
2
7
n.c.
GND
3
6
n.c.
VOUT
4
5
n.c.
aaa-051260
Figure 7. MPXV5010GP - SOT1693-3 - Case 1369-01
n.c.
1
8
n.c.
VS
2
7
n.c.
GND
3
6
n.c.
VOUT
4
5
n.c.
aaa-055550
Figure 8. MPVZ5010GW6U - SOT1691-2 - Case 1735-01
n.c. 1
8 n.c.
VS 2
7 n.c.
GND 3
6 n.c.
VOUT 4
5 n.c.
aaa-055551
Figure 9. MPVZ5010GW7U - SOT1691-1 - Case 1560-02
6.4 Pin description - Small Outline packages
Table 4. Pin descriptions - Small Outline packages
This table defines the pin configuration for the Small Outline packages indentified in Table 1.
Symbol
Pin
Description
N.C.
1
No connect
VS
2
Supply voltage
GND
3
Ground
VOUT
4
VOUT
N.C.
5
No connect
N.C.
6
No connect
N.C.
7
No connect
N.C.
8
No connect
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
7 Limiting values
Table 5. Limiting values
[1]
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
40
kPa
Storage Temperature
Tstg
–40 to +125
°C
Operating Temperature
TA
–40 to +125
°C
[1]
Exposure beyond the specified limits may cause permanent damage or degradation to the device.
8 Recommended operating conditions
Table 6. Recommended operating conditions
VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 11 required to meet
specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
1019.78
kPa
mm H2O
VS
4.75
5.0
5.25
Vdc
Io
—
5.0
10
mAdc
Voff
0
0.2
0.425
Vdc
VFSO
4.475
4.7
4.925
Vdc
VFSS
4.275
4.5
4.725
Vdc
—
—
—
±5.0
%VFSS
V/P
—
450
4.413
—
mV/kPa
mV/
kPA H2O
Response Time
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—
mAdc
—
—
20
—
ms
—
—
± 0.5
—
%VFSS
Pressure Range
[1]
Supply Voltage
Supply Current
Minimum Pressure Offset
@ VS = 5.0 Volts
[2]
(0 to 85°C)
[3]
Full Scale Output (0 to 85°C)
@ VS = 5.0 Volts
[4]
Full Scale Span (0 to 85°C)
@ VS = 5.0 Volts
[5]
Accuracy (0 to 85°C)
Sensitivity
[6]
[7]
Warm-Up Time
Offset Stability
[1]
[2]
[3]
[4]
[5]
[8]
Device is ratiometric within this specified excitation range.
Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated
pressure.
Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the
minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
[6]
[7]
[8]
Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step
change in pressure.
Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
9 On-chip temperature compensation and calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry onto a single monolithic chip.
Figure 10 illustrates the differential or gauge configuration in the basic chip carrier (Case 482). A fluorosilicone
gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPxx5010G series pressure sensor operating characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in
your application.
Figure 11 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Figure 12 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in
Figure 11. The output will saturate outside of the specified pressure range.
Fluoro silicone
gel die coat
Die
Stainless
steel cap
P1
Thermoplastic
case
Wire bond
Lead frame
P2
Differential sensing element
Die bond
aaa-054999
Figure 10. Cross-sectional diagram SOP (not to scale)
+5 V
OUTPUT
Vout
VS
IPS
1.0 µF
0.01 µF
GND
470 pF
aaa-040608
Figure 11. Recommended power supply decoupling and output filtering
Note: For additional output filtering, please refer to Application Note AN1646.
MPX5010
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
aaa-055000
5.0
Transfer function (kPa):
Vout = VS × (0.09 × P + 0.04) ± 5.0 VFSS
VS = 5.0 Vdc
TEMP = 0 to 85°C
Output
(V)
4.0
3.0
Max
Typical
2.0
Min
1.0
0
0
2.0
4.0
6.0
8.0
Differential pressure (kPa)
10.0
Figure 12. Output vs. Pressure Differential
Nominal Transfer Value:
4
Temperature
error
factor 3
2
Temp
Multiplier
-40
0 to 85
+125
3
1
3
1
0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
aaa-051150
Figure 13. Temperature error band
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
0.5
0.4
0.3
0.2
0.1
Pressure
error
0.0
(kPa)
-0.1
0
1
2
3
4
5
6
7
8
9
10
Pressure (kPa)
-0.2
-0.3
-0.4
-0.5
Pressure
Error (max)
0 to 10 (kPa)
± 0.5 (kPa)
aaa-055001
Figure 14. Pressure error band
10 Pressure (P1) / Vacuum (P2) side identification table
NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using Table 7.
Table 7. Pressure (P1) side identification
Part Number
Case Type
Pressure (P1) Side Identifier
MPX5010DP
867C
Side with Part Marking
MPX5010GP
867B
Side with Port Attached
MPXV5010DP
1351
Side with Part Marking
MPXV5010GC6T1
482A
Side with Port Attached
MPXV5010GC7U
482C
Side with Port Attached
MPXV5010GP
1369
Side with Port Attached
MPVZ5010GW6U
1735
Vertical Port Attached
MPVZ5010GW7U
1560
Vertical Port Attached
MPX5010
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NXP Semiconductors
MPX5010-MPXV5010-MPVZ5010
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
11 Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages
must be the correct size to ensure proper solder connection interface between the board and the package.
With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
aaa-040612
Figure 15. SOP Footprint (Case 482)
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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12 Package outline
Figure 16. SOT1691-1 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 17. SOT1691-1 Package Outline Detail
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 18. SOT1691-1 Package Outline Notes
MPX5010
Product data sheet
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 19. SOT1691-2 Package Outline
MPX5010
Product data sheet
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 20. SOT1691-2 Package Outline Detail
MPX5010
Product data sheet
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 21. SOT1691-2 Package Outline Notes
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 22. SOT1693-1 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 23. SOT1693-1 Package Outline Notes
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 24. SOT1693-3 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 25. SOT1693-3 Package Outline Notes
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 26. SOT1756-1 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 27. SOT1852-1 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Figure 28. SOT1852-1 Package Outline Notes
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 29. SOT1854-1 Package Outline
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Figure 30. SOT1854-1 Package Outline Notes
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 31. SOT1863-1 Package Outline
MPX5010
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MPX5010-MPXV5010-MPVZ5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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Figure 32. SOT1863-1 Package Outline Notes
MPX5010
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Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
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13 Revision history
Table 8. Revision history
Document ID
Release date
Description
MPX5010 v.14
17 May 2024
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors. Legal texts have been adapted to the new
company name where appropriate.
• Section 4, Table 1 and Section 4.1 Table 2, removed devices MPX5010GS,
MPX5010GSX, MPXV5010G6U, MPXV5010GC6U, MPVZ5010G7U, and MPVZ5010
G6U.
• Section 8, Table 6, Sensitivity Unit: Revised "mV/mm" to "mV/kPa".
MPX5010 v.13
October 2012
• Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and
MPVZ5010G6U/6T1 throughout the document.
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Legal information
Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
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MPX5010
Product data sheet
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MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
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MPX5010
Product data sheet
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30 / 32
MPX5010-MPXV5010-MPVZ5010
NXP Semiconductors
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Ordering information ..........................................2
Ordering options ................................................2
Pin descriptions - Unibody pacakages .............. 4
Pin descriptions - Small Outline packages ........ 5
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
Limiting values .................................................. 6
Recommended operating conditions ................. 6
Pressure (P1) side identification ....................... 9
Revision history ...............................................28
Fig. 13.
Fig. 14.
Fig. 15.
Fig. 16.
Fig. 17.
Fig. 18.
Fig. 19.
Fig. 20.
Fig. 21.
Fig. 22.
Fig. 23.
Fig. 24.
Fig. 25.
Fig. 26.
Fig. 27.
Fig. 28.
Fig. 29.
Fig. 30.
Fig. 31.
Fig. 32.
Temperature error band .................................... 8
Pressure error band .......................................... 9
SOP Footprint (Case 482) .............................. 10
SOT1691-1 Package Outline .......................... 11
SOT1691-1 Package Outline Detail ................ 12
SOT1691-1 Package Outline Notes ................ 13
SOT1691-2 Package Outline .......................... 14
SOT1691-2 Package Outline Detail ................ 15
SOT1691-2 Package Outline Notes ................ 16
SOT1693-1 Package Outline .......................... 17
SOT1693-1 Package Outline Notes ................ 18
SOT1693-3 Package Outline .......................... 19
SOT1693-3 Package Outline Notes ................ 20
SOT1756-1 Package Outline .......................... 21
SOT1852-1 Package Outline .......................... 22
SOT1852-1 Package Outline Notes ................ 23
SOT1854-1 Package Outline .......................... 24
SOT1854-1 Package Outline Notes ................ 25
SOT1863-1 Package Outline .......................... 26
SOT1863-1 Package Outline Notes ................ 27
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Fig. 12.
Fully Integrated Pressure Sensor
Schematic ..........................................................3
MPX5010DP - SOT1756-1 - Case 867C-05 ......3
MPX5010GP - SOT1852-1 - Case 867B-04 ......3
MPXV5010DP - SOT1693-1 - Case
1351-01 ............................................................. 4
MPXV5010GC6T1 - SOT1854-1 - Case
482A-01 ............................................................. 4
MPXV5010GC7U - SOT1863-1 - Case
482C-03 .............................................................4
MPXV5010GP - SOT1693-3 - Case
1369-01 ............................................................. 5
MPVZ5010GW6U - SOT1691-2 - Case
1735-01 ............................................................. 5
MPVZ5010GW7U - SOT1691-1 - Case
1560-02 ............................................................. 5
Cross-sectional diagram SOP (not to scale) ......7
Recommended power supply decoupling
and output filtering ............................................ 7
Output vs. Pressure Differential ........................ 8
MPX5010
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 14 — 17 May 2024
© 2024 NXP B.V. All rights reserved.
31 / 32
NXP Semiconductors
MPX5010-MPXV5010-MPVZ5010
Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and
calibrated
Contents
1
2
3
4
4.1
5
6
6.1
6.2
6.3
6.4
7
8
9
10
11
12
13
General description ......................................... 1
Features and benefits ..................................... 1
Applications ..................................................... 1
Ordering information .......................................2
Ordering options ................................................ 2
Block diagram ..................................................3
Pinning information .........................................3
Pinning - Unibody packages ..............................3
Pin description - Unibody packages .................. 4
Pinning - Small Outline packages ......................4
Pin description - Small Outline packages .......... 5
Limiting values ................................................ 6
Recommended operating conditions .............6
On-chip temperature compensation and
calibration .........................................................7
Pressure (P1) / Vacuum (P2) side
identification table ........................................... 9
Minimum recommended footprint for
surface mounted applications ...................... 10
Package outline ............................................. 11
Revision history .............................................28
Legal information ...........................................29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© 2024 NXP B.V.
All rights reserved.
For more information, please visit: https://www.nxp.com
Date of release: 17 May 2024
Document identifier: MPX5010
