MPXH6400AC6T1

NXP Semiconductors Data Sheet: Technical Data Document Number: MPXH6400A Rev. 6, 03/2017 MPXH6400A, 20 to 400 kPa, Absolute, Integrated Pressure Sensor MPXH6400A The NXP MPXxx6400A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make this pressure sensor a logical and economical choice for the system designer. The MPXxx6400A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features Super small outline package MPXHZ6400A6T1 MPXH6400AC6U/6T1/ Case 98ARH99066A MPXHZ6400AC6T1 Case 98ARH99089A • Improved accuracy at high temperature • Available in super small outline package • 1.5% maximum error over 0 °C to 85 °C • Fully calibrated and compensated • Ideally suited for microprocessor or microcontroller-based systems DNC 5 • Temperature compensated from -40 °C to +125 °C 4 VOUT DNC 6 3 GND • Durable thermoplastic surface mount package • Package porting and mounting options enable tube attachment for liquefied natural gas (LPG) or remote sensing applications DNC 7 DNC 8 2 VS 1 DNC Top view Typical applications • Fuel injected car engines • Vehicles powered by green gases (for example LPG and CNG) • Small engines • Industrial controls Pin 1 identification, chamfered corner. Pinout Ordering information Part number Shipping Package # of Ports None Single Pressure type Dual Gauge Differential Absolute Device marking • MPXH6400A Super Small Outline Package (Media resistant gel) MPXH6400AC6U Rail 98ARH99089A MPXH6400AC6T1 Tape and Reel 98ARH99089A MPXHZ6400A6T1 Tape and Reel 98ARH99066A MPXHZ6400AC6T1 Tape and Reel 98ARH99089A • • • • NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © NXP B.V. 2017 • MPXH6400A • MPXHZ6400A • MPXHZ6400A Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Related Documentation The MPXxx6400A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. 2. Go to the MPXx6400 web page at http://www.nxp.com/products/:MPXx6400. Click the Documentation tab. MPXH6400A 2 Sensors NXP B.V. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 DNC 8 2 VS 1 DNC Pin 1 identification, chamfered corner. Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner. Voltage supply 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPXH6400A Sensors NXP B.V. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Parametrics Symbol Value Units Maximum pressure (P1 > P2) PMAX 1600 kPa Storage temperature TSTG -40° to +125° °C TA -40° to +125° °C IO + 0.5 mAdc IO - -0.5 mAdc Operating temperature Output source current @ full-scale output(2) Output sink current @ minimum pressure offset(2) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2.) Characteristic Pressure range Symbol Min Typ Max Unit POP 20 — 400 kPa Supply voltage(1) VS 4.64 5.0 5.36 VDC Supply current IO — 6.0 10 mAdc Minimum pressure offset(2) (0 to 85 °C) @ VS = 5.0 Volts VOFF 0.133 0.2 0.267 VDC Full-scale output(3) (0 to 85 °C) @ VS = 5.0 Volts VFSO 4.733 4.8 4.866 VDC Full-scale span(4) (0 to 85 °C) @ VS = 5.0 Volts VFSS 4.467 4.6 4.733 VDC — — — ±1.5 %VFSS Accuracy(5) (0 to 85 °C) Sensitivity V/P — 12.1 — mV/kPa Response time(6) tR — 1.0 — ms Warm-up time(7) — — 20 — ms Offset stability(8) — — ±0.25 — %VFSS 1.Device is ratiometric within this specified excitation range. 2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressures 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 °C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C. 6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MPXH6400A 4 Sensors NXP B.V. 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6400A/MPXHZ6400A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Die Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame Absolute Die Bond Sealed Vacuum Reference Figure 3. Cross-sectional diagram (not-to-scale) +5.1 V VS VOUT 100 nF To ADC 1 μF GND 47 pF 51 K Figure 4. Recommended power supply decoupling and output filtering MPXH6400A Sensors NXP B.V. 5 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: VOUT = VS x (0.002421xP–0.00842 ± Error VS = 5.0 VDC Temperature = 0 to 85 °C 3.0 MAX 2.5 2.0 TYP 1.5 1.0 MIN 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 0.5 Pressure (Reference to Sealed Vacuum) in kPa Figure 5. Output vs. absolute pressure Normal Transfer Value: VOUT = VS x (0.002421 x P – 0.00842) ± Pressure Error x Temp. Factor x 0.002421 x VS VS = 5.0 ± 0.36 VDC Figure 6. Transfer function Temperature Error Factor 4.0 3.0 Break Points 2.0 1.0 Temp 0.0 -40 -20 0 20 80 40 60 Temperature in °C 100 120 NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C 140 - 40 0 to 85 125 Multiplier 3 1 1.75 Figure 7. Temperature error band MPXH6400A 6 Sensors NXP B.V. Error Limits for Pressure ±5.5 (kPa) 6.0 5.0 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 -2.0 -3.0 -4.0 - 5.0 Pressure (in kPa) - 6.0 Pressure 20 to 400 (kPa) Error (Max) ±5.5 (kPa) Figure 8. Pressure error band MPXH6400A Sensors NXP B.V. 7 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 9. SSOP footprint MPXH6400A 8 Sensors NXP B.V. 4.2 Package Dimensions This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99066A.pdf. Case 98ARH99066A, super small outline package, surface mount MPXH6400A Sensors NXP B.V. 9 Case 98ARH99066A, super small outline package, surface mount MPXH6400A 10 Sensors NXP B.V. Case 98ARH99066A, super small outline package, surface mount MPXH6400A Sensors NXP B.V. 11 This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99089A.pdf. Case 98ARH99089A, small outline package, surface mount MPXH6400A 12 Sensors NXP B.V. Case 98ARH99089A, small outline package, surface mount MPXH6400A Sensors NXP B.V. 13 5 Revision History Table 4. Revision history Document ID Release Date Data sheet status Change notice Supersedes MPXH6400A Rev. 6 2017 March Technical data — MPXH6400A Rev. 5.0 Modifications • Revised VS = 10.0 VDC value to VS = 5.0 VDC in Table 3. • The format of this data sheet has been redesigned to comply with current identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. • Updated package outlines Section 4.2, “Package Dimensions” to comply with current identity guidelines of NXP Semiconductors. MPXH6400A Rev. 5.0 2015 September Technical data — MPXH64-00A Rev. MPXH6400A 14 Sensors NXP B.V. How to Reach Us: Information in this document is provided solely to enable system and software Home Page: NXP.com implementers to use NXP products. There are no expressed or implied copyright Web Support: http://www.nxp.com/support information in this document. NXP reserves the right to make changes without further licenses granted hereunder to design or fabricate any integrated circuits based on the notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. NXP, the NXP logo, Freescale, the Freescale logo, and the Energy Efficient Solutions logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © NXP B.V. 2017. Document Number: MPXH6400A Rev. 6 03/2017