MPXHZ6250AC6T1

Freescale Semiconductor Technical Data MPXHZ6250A Rev 0, 09/2005 Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPXHZ6250A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for automotive system designers. The MPXHZ6250A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPXHZ6250A INTEGRATED PRESSURE SENSOR 20 to 250 kPa (3.0 to 36 psi) 0.3 to 4.9 V OUTPUT SUPER SMALL OUTLINE PACKAGE MPXHZ6250AC6T1 CASE 1317A-03 Features • • • • • • Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from –40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package Typical Applications • • ORDERING INFORMATION Ported Element Options Case No. MPX Series Order No. 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Industrial Controls Engine Control/Liquified Petroleum Gas (LPG) Device Type PIN NUMBERS(1) Packing Options Device Marking Absolute, Axial 1317A MPXHZ6250AC6T1 Tape & Reel MPXHZ6250A Port © Freescale Semiconductor, Inc., 2005. All rights reserved. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure PMAX 1000 kPa Storage Temperature TSTG –40 to +125 °C Operating Temperature TA –40 to +125 °C Output Source Current @ Full Scale Output(2) I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset2 Io – -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit. MPXHZ6250A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 250 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset @ VS = 5.0 Volts(2) (0 to 85°C) Voff 0.131 0.2 0.269 Vdc Full Scale Output @ VS = 5.0 Volts(3) (0 to 85°C) VFSO 4.731 4.8 4.869 Vdc Full Scale Span @ VS = 5.0 Volts(4) (0 to 85°C) VFSS 4.462 4.6 4.738 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS V/P — 20 — mV/kPa Response Time(6) tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS Sensitivity 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXHZ6250A Sensors Freescale Semiconductor 3 transmitted to the silicon diaphragm. The MPXHZ6250A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 illustrates a typical application circuit (output source current operation). Figure 3 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be +5.0 V VS Pin 2 MPXHZ6250A VOUT Pin 4 100 nF To ADC 47 pF GND Pin 3 51 K Figure 2. Typical Application Circuit (Output Source Current Operation) 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: Vout = Vs*(0.0040*P-0.040) ± Error VS = 5.0 Vdc Temperature = 0 to 85°C 3.0 2.5 MAX TYP 2.0 1.5 1.0 0.5 MIN 20 31 43 54 66 77 89 100 112 123 135 146 158 169 181 192 204 215 227 238 250 0 Pressure (Reference to Sealed Vacuum) in kPa Figure 3. Output versus Absolute Pressure MPXHZ6250A 4 Sensors Freescale Semiconductor Transfer Function (MPXHZ6250A) Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040) ± (Pressure Error x Temp Factor x 0.004 x VS) VS = 5.0 ± 0.36 Vdc Temperature Error Band MPXHZ6250A 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 80 60 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Pressure Error Band 4.0 Error Limits for Pressure Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 60 100 140 180 220 260 Pressure (in kPa) 300 -2.0 -3.0 Pressure -4.0 20 to 250 (kPa) Error (Max) ±3.45 (kPa) SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Super Small Outline Packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 4. SSOP Footprint (Case 1317A) MPXHZ6250A Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXHZ6250A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXHZ6250A Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXHZ6250A Rev. 0 09/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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