MPXM2010GST1

MPX2010 Series 10 kPa Temperature Compensated Pressure Sensors Rev. 14 — 27 April 2021 1 Product data sheet General Description The MPX2010 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. 2 Features and Benefits • • • • 3 Ratiometric to Supply Voltage Differential and Gauge Options Temperature Compensated over 0 °C to 85 °C Easy-to-Use Chip Carrier Package Options Applications • • • • Air Movement Control Respiratory Diagnostics Controllers Pressure Switching MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 4 Ordering Information Device name Package options Case number Number of ports None Single Pressure type Dual Gauge Differential Device marking Absolute Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 MPXV2010DP Tray 1351 ● ● MPXV2010GP ● ● MPXV2010DP ● MPX2010D ● MPX2010DP Unibody Package (MPX2010 Series) MPX2010D Tray 344 ● MPX2010DP Tray 344C MPX2010GP Tray 344B ● ● MPX2010GP MPX2010GSX Tray 344F ● ● MPX2010D Rail 1320A ● ● MPXM2010GS Tape & Reel 1320A ● ● MPXM2010GS ● MPAK Package (MPXM2010 Series) MPXM2010GS MPXM2010GST1 Small outline packages MPXV2010GP Case 1369-01 MPAK Packages MPXV2010DP Case 1351-01 MPXM2010GS/GST1 Case 1320A-02 Unibody Packages aaa-041213 MPX2010D Case 344-15 MPX2010 Product data sheet MPX2010GP Case 344B-01 aaa-041242 MPX2010DP Case 344C-01 All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 aaa-041665 MPX2010GSX Case 344F-01 © NXP B.V. 2021. All rights reserved. 2 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 5 Block Diagram Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Figure 1. Temperature compensated pressure sensor schematic 6 Pin Information 6.1 MPX2010D 1 2 3 4 aaa-037831 Figure 2. Case 344-15 Table 1. Pin definitions - MPX2010D MPX2010 Product data sheet Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 3 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 6.2 MPX2010DP 1 2 3 4 aaa-037859 Figure 3. Case 344C-01 Table 2. Pin definitions - MPX2010DP Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output 6.3 MPX2010GP 4 3 2 1 aaa-037861 Figure 4. Case 344B-01 Table 3. Pin definitions - MPX2010GP MPX2010 Product data sheet Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 4 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 6.4 MPXM2010GS/GST1 1 2 3 4 aaa-037854 Figure 5. Case 1320A-02 Table 4. Pin definitions - MPXM2010GS/GST1 Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output 6.5 MPXV2010GP 5 4 6 3 7 2 8 1 aaa-037857 Figure 6. Case 1369-01 Table 5. Pin definitions - MPXV2010GP MPX2010 Product data sheet Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output n.a. 5 — n.a. 6 — n.a. 7 — n.a. 8 — All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 5 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 6.6 MPXV2010DP 5 4 6 3 7 2 8 1 aaa-037858 Figure 7. CASE 1351-01 Table 6. Pin definitions - MPXV2010DP Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output n.a. 5 — n.a. 6 — n.a. 7 — n.a. 8 — 6.7 MPX2010GSX 1 2 3 4 aaa-038356 Figure 8. Case 344F-01 Table 7. Pin definitions - MPX2010GSX MPX2010 Product data sheet Symbol Pin Description GND 1 Ground +VOUT 2 + Voltage output VS 3 Power supply –VOUT 4 – Voltage output All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 6 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 7 Maximum Ratings Table 8. Maximum ratings Exposure beyond the specified limits may cause permanent damage or degradation to the device. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Typ Max Unit Pmax Overpressure P1 > P2 — — 75 kPa Pburst Burst Pressure P1 > P2 — — 100 kPa Tstg Storage Temperature −40 — +125 °C TA Operating Temperature −40 — +125 °C MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 7 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 8 Operating Characteristics Table 9. Operating characteristics (VS = 10 Vdc, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units Operating Pressure Range [1] POP 0 — 10 kPa Supply Voltage [2] VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span [3] VFSS 24 25 26 mV Offset [4] Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity [5] — –1.0 — 1.0 %VFSS Pressure Hysteresis (0 kPa to 10 kPa) [5] — — ±0.1 — %VFSS Temperature Hysteresis (–40 °C to +125 °C) [5] — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span [5] TCVFSS –1.0 — 1.0 %VFSS Temperature Coefficient of Offset [5] TCVoff –1.0 — 1.0 mV Zin 1300 — 2550 Ω Input Impedance Output Impedance Zout 1400 — 3000 Ω Response Time (10% to 90%) [6] tR — 1.0 — ms Warm-Up Time [7] — — 20 — ms Offset Stability [8] — — ±0.5 — %VFSS [1] [2] [3] [4] [5] [6] [7] [8] 1.0 kPa equals 0.145 PSI. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure using the end point method over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 °C to 85 °C, relative to 25 °C • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure Temperature Cycling with Bias test. MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 8 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 9 Characteristics 9.1 Voltage output versus applied differential pressure The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). 9.2 On-chip temperature compensation and calibration Figure 9 shows the typical output characteristics of the MPX2010 series at 25 °C. The effects of temperature on full scale span and offset are very small and are shown under Section 8 "Operating Characteristics". This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation. Output (mVdc) 35 VS = 10 Vdc TA = 25 °C P1 > P2 30 25 20 TYP 15 Span Range (Typical) MAX 10 MIN 5 0 PSI -5 0 kPa 0.362 0.725 1.09 1.45 2.5 5 7.5 10 Offset (Typical) Pressure Differential aaa-038500 Figure 9. Output vs. pressure differential 9.3 Linearity Linearity refers to how well a transducer's output follows the equation Vout = Voff + Sensitivity x P over the operating pressure range (Figure 10). There are two basic methods for calculating nonlinearity: • End point straight line fit • Least squares best line fit While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 9 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. NXP's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Square Deviation Least Squares Fit Relative Voltage Output Exaggerated Performance Curve Straight Line Deviation End Point Straight Line Fit Offset 0 50 100 Pressure (% Full Scale) aaa-038501 Figure 10. Linearity specification comparison 9.4 Pressure (P1) / Vacuum (P2) side identification NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel that isolates the die from the environment. The NXP MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 10. Table 10. Pressure (P1) side delineation table Part Number Case Type Pressure (P1) Side Identifier MPX2010D 344 Stainless Steel Cap MPX2010DP 344C Side with Part Marking MPX2010GP 344B Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369 Side with Port Attached MPXV2010DP 1351 Side with Part Marking MPXM2010GS/GSTI 1320A Side with Port Attached 9.5 Media compatibility Figure 11 illustrates the differential or gauge configuration in a typical chip carrier. A silicone gel isolates the die surface and wire bonds from the environment while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 10 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Operating characteristics, internal reliability and qualification tests are based on the use of dry clean air as the pressure medium. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. For more information, refer to application note AN3728. silicone die coat stainless steel metal cover die epoxy case P1 wire bond lead frame P2 RTV die bond aaa-037713 Figure 11. Unibody package — cross-sectional diagram (not to scale) MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 11 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 10 Package Outlines Package dimensions are provided in package drawings. To find the most current package outline drawing, go to https://www.nxp.com/ and perform a keyword search for the drawing's document number. 10.1 Small outline packages Figure 12. SOT1693-1 (Case 1351) – Page 1 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 12 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 13. SOT1693-1 (Case 1351) – Page 2 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 13 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 14. SOT1693-3 (Case 1369-01) – Page 1 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 14 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 15. SOT1693-3 (Case 1369-01) – page 2 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 15 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 10.2 Unibody packages Figure 16. SOT1753-1 (Case 344B-01) MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 16 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 17. SOT1754-1 (Case 344C-01) MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 17 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 18. SOT1757-1 (Case 344F-01) MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 18 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 19. SOT1772-1 (Case 344-15) MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 19 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 10.3 MPAK packages Figure 20. SOT1673-1 (1320A-02) – Page 1 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 20 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Figure 21. SOT1673-1 (1320A-02) – Page 2 MPX2010 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 21 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 11 References [1] AN840 – Temperature Compensation Methods For The Motorola X-ducer Pressure Sensor Element https://www.nxp.com/docs/en/application-note/AN840.pdf [2] AN1984 – Handling Freescale Pressure Sensors https://www.nxp.com/docs/en/application-note/AN1984.pdf [3] AN3150 – Soldering Recommendations for Pressure Sensor Devices https://www.nxp.com/docs/en/application-note/AN3150.pdf [4] AN1318 Interfacing Semiconductor Pressure Sensors to Microcomputers https://www.nxp.com/docs/en/application-note/AN1318.pdf [5] AN3728 Media Compatibility for IPS PRT Pressure Sensors https://www.nxp.com/docs/en/application-note/AN3728.pdf 12 Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes MPX2010 v.14 20210427 Released — MPX2010 v.13 Modifications • Redesigned the data sheet to comply with the new identity guidelines of NXP Semiconductors. Adapted legal texts to the new company name where appropriate. • Removed the following discontinued part numbers throughout: MPX2010GS MPX2010 v.13 200810 MPX2010 Product data sheet Released — All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 MPX2010 v.12 © NXP B.V. 2021. All rights reserved. 22 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors 13 Legal information 13.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 13.2 Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without MPX2010 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 23 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Security — Customer understands that all NXP products may be subject to unidentified or documented vulnerabilities. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s MPX2010 Product data sheet Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 24 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Tables Tab. 1. Tab. 2. Tab. 3. Tab. 4. Tab. 5. Tab. 6. Pin definitions - MPX2010D .............................. 3 Pin definitions - MPX2010DP ............................4 Pin definitions - MPX2010GP ............................4 Pin definitions - MPXM2010GS/GST1 ...............5 Pin definitions - MPXV2010GP ......................... 5 Pin definitions - MPXV2010DP ......................... 6 Tab. 7. Tab. 8. Tab. 9. Tab. 10. Tab. 11. Pin definitions - MPX2010GSX ......................... 6 Maximum ratings ...............................................7 Operating characteristics (VS = 10 Vdc, TA = 25 °C unless otherwise noted, P1 > P2) ........ 8 Pressure (P1) side delineation table ............... 10 Revision history ...............................................22 Figures Fig. 1. Fig. 2. Fig. 3. Fig. 4. Fig. 5. Fig. 6. Fig. 7. Fig. 8. Fig. 9. Fig. 10. Temperature compensated pressure sensor schematic .............................................. 3 Case 344-15 ......................................................3 Case 344C-01 ................................................... 4 Case 344B-01 ................................................... 4 Case 1320A-02 ................................................. 5 Case 1369-01 ....................................................5 CASE 1351-01 .................................................. 6 Case 344F-01 ................................................... 6 Output vs. pressure differential ......................... 9 Linearity specification comparison .................. 10 MPX2010 Product data sheet Fig. 11. Fig. 12. Fig. 13. Fig. 14. Fig. 15. Fig. 16. Fig. 17. Fig. 18. Fig. 19. Fig. 20. Fig. 21. Unibody package — cross-sectional diagram (not to scale) ..................................... 11 SOT1693-1 (Case 1351) – Page 1 ................. 12 SOT1693-1 (Case 1351) – Page 2 ................. 13 SOT1693-3 (Case 1369-01) – Page 1 ............ 14 SOT1693-3 (Case 1369-01) – page 2 .............15 SOT1753-1 (Case 344B-01) ........................... 16 SOT1754-1 (Case 344C-01) ........................... 17 SOT1757-1 (Case 344F-01) ............................18 SOT1772-1 (Case 344-15) ..............................19 SOT1673-1 (1320A-02) – Page 1 ................... 20 SOT1673-1 (1320A-02) – Page 2 ................... 21 All information provided in this document is subject to legal disclaimers. Rev. 14 — 27 April 2021 © NXP B.V. 2021. All rights reserved. 25 / 26 MPX2010 Series NXP Semiconductors 10 kPa Temperature Compensated Pressure Sensors Contents 1 2 3 4 5 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 7 8 9 9.1 9.2 9.3 9.4 9.5 10 10.1 10.2 10.3 11 12 13 General Description ............................................ 1 Features and Benefits ........................................ 1 Applications .........................................................1 Ordering Information .......................................... 2 Block Diagram .....................................................3 Pin Information ....................................................3 MPX2010D .........................................................3 MPX2010DP ...................................................... 4 MPX2010GP ...................................................... 4 MPXM2010GS/GST1 .........................................5 MPXV2010GP ....................................................5 MPXV2010DP ....................................................6 MPX2010GSX ....................................................6 Maximum Ratings ............................................... 7 Operating Characteristics .................................. 8 Characteristics .................................................... 9 Voltage output versus applied differential pressure ............................................................. 9 On-chip temperature compensation and calibration ...........................................................9 Linearity ............................................................. 9 Pressure (P1) / Vacuum (P2) side identification ..................................................... 10 Media compatibility .......................................... 10 Package Outlines .............................................. 12 Small outline packages ....................................12 Unibody packages ........................................... 16 MPAK packages .............................................. 20 References ......................................................... 22 Revision history ................................................ 22 Legal information .............................................. 23 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2021. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 April 2021 Document identifier: MPX2010