MPXM2051G
50 kPa Temperature compensated pressure sensor
Rev. 5.1 — 17 May 2024
Product data sheet
1 General description
The MPXM2051G device is a silicon piezoresistive pressure sensor providing a highly accurate and linear
voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm
with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise
span and offset calibration and temperature compensation.
2 Features and benefits
•
•
•
•
Ratiometric to supply voltage
Available in easy-to-use Tape & Reel
Temperature compensated over 0 °C to +85 °C
Gauge ported
3 Applications
•
•
•
•
•
•
Level indicators
Medical diagnostics
Robotics
Pressure switching
Pump/motor control
Non-invasive blood pressure measurement
4 Ordering information
Table 1. Ordering options
Device name
MPXM2051GST1
Package options Case number
Tape and reel
1320A
Number of ports
None
Single
Dual
●
MPAK package
MPXM2051GST1
Case 1320A
Pressure type
Gauge Differential Absolute
●
Device marking
MPXM2051GS
MPXM2051G
NXP Semiconductors
50 kPa Temperature compensated pressure sensor
5 Block diagram
Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
Figure 1. Temperature compensated pressure sensor schematic
6 Pin information
6.1 MPXM2051GST1
1
2
3
4
aaa-037854
Figure 2. MPXM2051G
Table 2. Pin definitions - MPXM2051GST1
Symbol
Pin
Description
GND
1
Ground
+VOUT
2
+ Voltage output
VS
3
Power supply
–VOUT
4
– Voltage output
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Product data sheet
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50 kPa Temperature compensated pressure sensor
7 Maximum ratings
Table 3. Maximum ratings
Exposure beyond the specified limits may cause permanent damage or degradation to the device.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
PMAX
Overpressure
P1 > P2
—
—
200
kPa
TSTG
Storage Temperature
—
–40
—
+125
°C
TA
Operating Temperature
—
–40
—
+125
°C
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MPXM2051G
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50 kPa Temperature compensated pressure sensor
8 Operating characteristics
Table 4. Operating Characteristics (VS = 10 Vdc, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Operating pressure range
[1]
POP
0
—
50
kPa
Supply voltage
[2]
VS
—
10
16
Vdc
Supply current
Io
—
6.0
—
mAdc
Full scale span
[3]
VFSS
38.5
40
41.5
mV
Offset
[4]
Voff
–1.0
—
1.0
mV
Sensitivity
ΔV/ΔP
—
0.8
—
mV/kPa
Linearity
[5]
—
–0.3
—
0.3
%VFSS
Pressure hysteresis (0 kPa to 50 kPa)
[5]
—
—
±0.1
—
%VFSS
Temperature hysteresis (–40 °C to 125 °C)
[5]
—
—
±0.5
—
%VFSS
Temperature coefficient of full scale span
[5]
TCVFSS
–1.0
—
1.0
%VFSS
Temperature coefficient of offset
[5]
TCVoff
–1.0
—
1.0
mV
Zin
1000
—
2500
Ω
Input impedance
Output impedance
Zout
1400
—
3000
Ω
Response time (10 % to 90 %)
[6]
tR
—
1.0
—
ms
Warm up time
[7]
—
—
20
—
ms
Offset stability
[8]
—
—
±0.5
—
%VFSS
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
1.0 kPa equals 0.145 PSI.
Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to
device self-heating.
Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum
related pressure.
Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the
minimum or maximum operating temperature points, with zero differential pressure applied
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum
rated pressure at 25 °C.
• TcSpan: Output deviation at full rated pressure over the temperature range of 0 °C to 85 °C, relative to 25 °C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25°C.
Response time is defined as the time for the incremental change in the output to go from 10 % to 90 % of its final value when subjected to a specified step
change in pressure.
Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.
MPXM2051G
Product data sheet
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MPXM2051G
NXP Semiconductors
50 kPa Temperature compensated pressure sensor
9 Characteristics
9.1 Voltage output versus applied differential pressure
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
9.2 On-chip temperature compensation and calibration
Figure 3 shows the typical output characteristics of the MPXM2051G series at 25 °C.
The effects of temperature on full scale span and offset are very small and are shown under Section 8
"Operating characteristics".
This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film
resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and
offset calibration and temperature compensation.
aaa-040007
45
Output
40
(mVdc)
VS = 10 Vdc
TA = 25° C
35
TYP
30
25
MAX
SPAN
RANGE
(TYP)
20
15
10
MIN
5
0
kPa
-5
0
PSI
12.5
25
37.5
50
1.8
3.6
5.4
7.25
OFFSET
(TYP)
Figure 3. Output vs. pressure differential
9.3 Linearity
Linearity refers to how well a transducer's output follows the equation:
VOUT = VOFF + Sensitivity x P over the operating pressure range (Figure 4).
There are two basic methods for calculating nonlinearity:
• End point straight line fit
• Least squares best line fit
While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required
are burdensome.
Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations)
and the calculations are more straightforward for the user.
NXP's specified pressure sensor linearities are based on the end point straight line method measured at the
midrange pressure.
MPXM2051G
Product data sheet
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MPXM2051G
NXP Semiconductors
50 kPa Temperature compensated pressure sensor
Least
Square
Deviation
Least Squares Fit
Relative Voltage Output
Exaggerated
Performance
Curve
Straight Line
Deviation
End Point Straight
Line Fit
Offset
0
50
100
Pressure (% Full Scale)
aaa-038501
Figure 4. Linearity specification comparison
9.4 Pressure (P1) / vacuum (P2) side identifcation table
NXP designates the two sides of the pressure sensor as the pressure (P1) side and the vacuum (P2) side. The
pressure (P1) side is the side containing silicone gel, which isolates the die from the environment. NXP's MPX
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The pressure (P1) side may be identified by using Table 5.
Table 5. Pressure (P1) side identification table
Part Number
Case Type
Pressure (P1) Side Identifier
MPXM12GST1
1320A
Side with port attached
9.5 Media compatibilty
Figure 5 illustrates the gauge configuration in a typical chip carrier. A silicone gel isolates the die surface and
wire bonds from the environment while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPXM2051G series pressure sensor operating characteristics, internal reliability and qualification tests are
based on the use of dry clean air as the pressure medium. Media other than dry clean air may have adverse
effects on sensor performance and long term reliability. Contact the factory for information regarding media
compatibility in your application.
[5]
For more information, refer to application note AN3728 .
MPXM2051G
Product data sheet
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MPXM2051G
NXP Semiconductors
50 kPa Temperature compensated pressure sensor
P1
Silicone
gel die coat
Die
Wire
bond
Thermoplastic
case
Lead
frame
P2
Die bond
aaa-041585
Figure 5. MPAK package — cross-sectional diagram (not to scale)
MPXM2051G
Product data sheet
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NXP Semiconductors
50 kPa Temperature compensated pressure sensor
10 Package outlines
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to
https://www.nxp.com/ and perform a keyword search for the drawing's document number.
10.1 MPAK packages
Figure 6. SOT1673-1 (98ARH99087A) package outline
MPXM2051G
Product data sheet
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NXP Semiconductors
50 kPa Temperature compensated pressure sensor
Figure 7. SOT1673-1 (98ARH99087A) package outline notes
MPXM2051G
Product data sheet
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NXP Semiconductors
50 kPa Temperature compensated pressure sensor
11 References
[1]
AN840 – Temperature Compensation Methods For The Motorola X-ducer Pressure Sensor Element
https://www.nxp.com/docs/en/application-note/AN840.pdf
[2]
AN1984 – Handling Freescale Pressure Sensors
https://www.nxp.com/webapp/Download?colCode=AN1984&location=null
[3]
AN3150 – Soldering Recommendations for Pressure Sensor Devices
https://www.nxp.com/webapp/Download?colCode=AN3150&location=null
[4]
AN1318 Interfacing Semiconductor Pressure Sensors to Microcomputers
https://www.nxp.com/webapp/Download?colCode=AN1318&location=null
[5]
AN3728 Media Compatibility for IPS PRT Pressure Sensors
https://www.nxp.com/webapp/Download?colCode=AN3728&location=null
12 Revision history
Table 6. Revision history
Document ID
Release date
Description
MPXM2051G v.5.1 17 May 2024
• MPXM2051G v.5.1 supercedes MPXM2051G v.5.
• MPXM2051G v.5.1 is a product data sheet.
• Updated the document formatting, revision history and legal information
sections to comply with new NXP documentation guidelines and performed
minor typographic corrections.
• Section 8, Table 4, corrected a typographic error introduced between versions
4 and 5 on the Max value of Linearity revising the value "3.0" to "0.3" to
correctly reflect the value in version 4.
• Section 10.1, split the package outline and package outline notes images into
separate figures.
MPXM2051G v.5
22 April 2021
• MPXM2051G v.5 supercedes MPXM2051G v.4.
• MPXM2051G v.5 is a product data sheet.
• Redesigned the data sheet to comply with the new identity guidelines of
NXP Semiconductors. Adapted legal texts to the new company name where
appropriate.
MPXM2051G v.4
June 2020
• MPXM2051G v.4 supercedes MPXM2051G v.3.
• MPXM2051G v.4 is a product data sheet.
• The format of this data sheet has been redesigned to comply with the new
identity guidelines of NXP Semiconductors.
• Updated the package image on the first page.
• Table 4 "Operating Characteristics (VS = 10 Vdc, TA = 25 °C unless otherwise
noted, P1 > P2)", Added new footnote after Linearity, Pressure Hysteresis,
Temperature Hysteresis, Temperature Effect on Full Scale Span and
Temperature Effect on Offset.
• Section 10 "Package outlines", Updated the package drawing images.
MPXM2051G v.3
November 2015
• MPXM2051G v.3 supercedes all prior versions.
• MPXM2051G v.3 is a product data sheet.
• Updated format
MPXM2051G
Product data sheet
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MPXM2051G
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50 kPa Temperature compensated pressure sensor
Legal information
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Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL https://www.nxp.com.
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50 kPa Temperature compensated pressure sensor
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MPXM2051G
Product data sheet
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MPXM2051G
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50 kPa Temperature compensated pressure sensor
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Ordering options ................................................1
Pin definitions - MPXM2051GST1 .....................2
Maximum ratings ...............................................3
Tab. 4.
Tab. 5.
Tab. 6.
Operating Characteristics (VS = 10 Vdc, TA
= 25 °C unless otherwise noted, P1 > P2) ........ 4
Pressure (P1) side identification table ...............6
Revision history ...............................................10
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Temperature compensated pressure
sensor schematic .............................................. 2
MPXM2051G ..................................................... 2
Output vs. pressure differential ......................... 5
Linearity specification comparison .................... 6
MPXM2051G
Product data sheet
Fig. 5.
Fig. 6.
Fig. 7.
MPAK package — cross-sectional diagram
(not to scale) ..................................................... 7
SOT1673-1 (98ARH99087A) package
outline ................................................................ 8
SOT1673-1 (98ARH99087A) package
outline notes ......................................................9
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MPXM2051G
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50 kPa Temperature compensated pressure sensor
Contents
1
2
3
4
5
6
6.1
7
8
9
9.1
9.2
9.3
9.4
9.5
10
10.1
11
12
General description ......................................... 1
Features and benefits ..................................... 1
Applications ..................................................... 1
Ordering information .......................................1
Block diagram ..................................................2
Pin information ................................................ 2
MPXM2051GST1 ...............................................2
Maximum ratings ............................................. 3
Operating characteristics ............................... 4
Characteristics ................................................. 5
Voltage output versus applied differential
pressure ............................................................. 5
On-chip temperature compensation and
calibration ...........................................................5
Linearity ............................................................. 5
Pressure (P1) / vacuum (P2) side
identifcation table ...............................................6
Media compatibilty ............................................. 6
Package outlines ............................................. 8
MPAK packages ................................................ 8
References ......................................................10
Revision history .............................................10
Legal information ...........................................11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© 2024 NXP B.V.
All rights reserved.
For more information, please visit: https://www.nxp.com
Date of release: 17 May 2024
Document identifier: MPXM2051G
