Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPxx5004
Rev. 12.1, 05/2015
MPxx5004, 0 to 3.92 kPa, Differential
and Gauge, Integrated Pressure
Sensor
Freescale’s MPxx5004 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This sensor combines a highly sensitive implanted strain gauge with advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
MPXV5004
MPVZ5004
Top view
DNC 5
4 VOUT
DNC 6
3 GND
DNC 7
2 VS
DNC 8
1 DNC
Features
•
•
1.5% maximum error for 0 to 100 mm H2O over +10 °C to +60 °C with
autozero
Pin 1 identification,
notch on first pin or chamfered corner.
2.5% maximum error for 100 to 400 mm H2O over +10 °C to +60 °C with
autozero
•
6.25% maximum error for 0 to 400 mm H2O over 10 °C to +60 °C without
autozero
•
Temperature compensated over 10 °C to 60 °C
•
Available in gauge surface mount (SMT) or through-hole (DIP) configurations
•
Durable thermoplastic (PPS) package
Pinout
Applications
•
Washing machine water level
•
Ideally suited for microprocessor or microcontroller-based systems
•
Appliance liquid level and pressure measurement
•
Respiratory equipment
Small outline packages, through-hole
MPVZ5004G7U
Case 98ASB17758C
MPXV5004GC7U
Case 98ASB17759C
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2006-2009, 2015 Freescale Semiconductor, Inc. All rights reserved.
MPVZ5004GW7U
Case 98ASA10611D
Small outline packages, surface mount
MPVZ5004G6U/6T1
Case 98ASB17756C
MPXV5004GC6T1/6U, MPVZ5004GC6U
Case 98ASB17757C
MPXV5004DP
Case 98ASA99255D
MPVZ5004GW6U
Case 98ASA10686D
MPXV5004GP/GPT1
Case 98ASA99303D
MPXV5004GVP
Case 98ASA99302D
Ordering Information
# of Ports
Part number
Shipping
Pressure type
Package
None
Single
Dual
Gauge
Differential
Absolute
Device
marking
Small outline package (MPXV5004 series)
MPXV5004DP
Tray
98ASA99255D
•
•
MPXV5004GC6T1
Reel
98ASB17757C
•
•
MPXV5004G
MPXV5004GC6U
Rail
98ASB17757C
•
•
MPXV5004G
MPXV5004GC7U
Rail
98ASB17759C
•
•
MPXV5004G
MPXV5004GP
Tray
98ASA99303D
•
•
MPXV5004GP
MPXV5004GPT1
Reel
98ASA99303D
•
•
MPXV5004GP
MPXV5004GVP
Tray
98ASA99302D
•
•
MPXV5004GVP
MPXV5004DP
Small outline package (Media resistant gel) (MPVZ5004 series)
MPVZ5004G6T1
Reel
98ASB17756C
•
•
MPVZ5004G
MPVZ5004G6U
Rail
98ASB17756C
•
•
MPVZ5004G
MPVZ5004G7U
Rail
98ASB17758C
•
•
MPVZ5004G
MPVZ5004GC6U
Rail
98ASB17757C
•
•
MPVZ5004G
MPVZ5004GW6U
Rail
98ASA10686D
•
•
MZ5004GW
MPVZ5004GW7U
Rail
98ASA10611D
•
•
MZ5004GW
MPxx5004
2
Sensors
Freescale Semiconductor, Inc.
Contents
1
2
3
4
5
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Pressure (P1)/Vacuum (P2) side identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Related Documentation
The MPXV5004G device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1.
Go to the Freescale homepage at:
http://www.freescale.com/
2.
3.
In the Keyword search box at the top of the page, enter the device number MPXV5004G.
In the Refine Your Result pane on the left, click on the Documentation link.
MPxx5004
Sensors
Freescale Semiconductor, Inc.
3
1
General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do not connect to external circuitry or ground.
Figure 1. Integrated pressure sensor schematic
1.2
Pinout
DNC 5
4 VOUT
DNC 6
3 GND
DNC 7
2 VS
DNC 8
1 DNC
Pin 1 identification,
notch on first pin or chamfered corner.
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
Name
Function
1
DNC
Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead or chamfered corner.
Voltage supply
2
VS
3
GND
Ground
4
VOUT
Output voltage
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
7
DNC
Do not connect to external circuitry or ground.
8
DNC
Do not connect to external circuitry or ground.
MPxx5004
4
Sensors
Freescale Semiconductor, Inc.
2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Rating
Symbol
Value
Unit
Maximum pressure (P1 > P2)
PMAX
16
kPa
Storage temperature
TSTG
–30 to +100
°C
TA
0 to +85
°C
Operating temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
3.92
400
kPa
mm H2O
VS
4.75
5.0
5.25
VDC
IS
—
—
10
mAdc
Span @ 306 mm H2O (3
Full-scale span @ 400 mm H2O (3.92 kPa)(2)
VFSS
—
—
3.0
3.92
—
—
V
Offset(3)
VOFF
0.75
1.0
1.25
V
V/P
—
1.0
—
V/kPa
0 to 100 mm H2O (10 °C to 60 °C)
—
—
—
±1.5
100 to 400 mm H2O (10 °C to 60 °C)
—
—
—
±2.5
0 to 400 mm H2O (10 °C to 60 °C)
—
—
—
±6.25
Pressure range
Supply voltage(1)
Supply current
kPa)(2)
Sensitivity
Accuracy (4) (5)
%VFSS with
autozero
%VFSS with
autozero
%VFSS without
autozero
1. Device is ratiometric within this specified excitation range.
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure, using endpoint method, over the specified
pressure range.
Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25 °C.
TcSpan:
Output deviation over the temperature range of 10 °C to 60 °C, relative to 25 °C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 °C to 60 °C, relative to
25 °C.
Variation from nominal:
The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.
5. Autozero at factory installation: Due to the sensitivity of the MPxx5004G, external mechanical stresses and mounting position can affect the
zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output
during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of
±5 °C between autozero and measurement.
MPxx5004
Sensors
Freescale Semiconductor, Inc.
5
3
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation,
calibration and signal conditioning circuitry onto a single monolithic chip.
Figure 3 illustrates the gauge configuration in the basic chip carrier (case 98ASB17756C). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPxx5004 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air,
may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and
other media, are available from the factory. Contact the factory for information regarding media tolerance in your application.
Figure 4 shows the recommended decoupling circuit for interfacing the output of the MPxx5004 to the A/D input of the
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Typical, minimum and maximum output curves are shown for operation over a temperature range of 10 °C to 60 °C using the
decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.
Fluorosilicone
Gel Die Coat
Die
Stainless
Steel Cap
P1
Thermoplastic
Case
Wire Bond
Lead Frame
P2
Die Bond
Differential Sensing Element
Figure 3. Cross-sectional diagram (not to scale)
+5 V
VOUT
OUTPUT
VS
IPS
1.0 μF
0.01 μF
GND
470 pF
Figure 4. Recommended power supply decoupling and output filtering
(For additional output filtering, please refer to AN1646.)
MPxx5004
6
Sensors
Freescale Semiconductor, Inc.
5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS
VS = 5.0 Vdc
TEMP = 10 °C to 60°C
4.0
Output (V)
3.0
MAX
TYPICAL
2.0
MIN
1.0
0
0
1.0
2.0
3.0
4.0
Differential Pressure (kPa)
Figure 5. Output vs. pressure differential
at ±6.25% VFSS (without autozero, Table 3, note 5)
5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
4.0
Output (V)
3.0
MAX
TYPICAL
2.0
MIN
1.0
0
0
1.0
2.0
3.0
4.0
Differential Pressure (kPa)
Figure 6. Output vs. pressure differential
at ±2.5% VFSS (with autozero, Table 3, note 5)
MPxx5004
Sensors
Freescale Semiconductor, Inc.
7
4
Package Information
4.1
Pressure (P1)/Vacuum (P2) side identification
Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side.
The pressure (P1) side is the side containing silicone gel which isolates the die from the environment.
The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The pressure (P1) side may be identified by using the table below.
Table 4. Pressure (P1)/Vacuum (P2) side identification table
Part number
4.2
Case number
Pressure (P1) side identifier
MPXV5004DP
98ASA99255D
Side with part marking
MPXV5004GC6U/6T1,
MPVZ5004GC6U
98ASB17757C
Side with port attached
MPXV5004GC7U
98ASB17759C
Side with port attached
MPXV5004GP/GPT1
98ASA99303D
Side with port attached
MPXV5004GVP
98ASA99302D
Stainless steel cap
MPVZ5004G6U/6T1
98ASB17756C
Stainless steel cap
MPVZ5004G7U
98ASB17758C
Stainless steel cap
MPVZ5004GW6U
98ASA10686D
Vertical port attached
MPVZ5004GW7U
98ASA10611D
Vertical port attached
Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder pads.
0.100 TYP 6X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 7. SOP footprint (case 98ASB17756C)
MPxx5004
8
Sensors
Freescale Semiconductor, Inc.
4.3
Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.
Case 98ASB17756C, small outline package, surface mount
MPxx5004
Sensors
Freescale Semiconductor, Inc.
9
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0
7
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
PIN 1 IDENTIFIER
M
K
SEATING
PLANE
Case 98ASB17757C, small outline package, through-hole
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17758C.pdf.
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
–B–
G
8
1
0.25 (0.010)
M
T B
D 8 PL
S A
S
DETAIL X
S
PIN 1 IDENTIFIER
N
C
–T–
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.210
0.220
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0
15
0.405
0.415
0.540
0.560
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.33
5.59
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0
15
10.29
10.54
13.72
14.22
K
M
J
DETAIL X
Case 98ASB17758C, small outline package, through-hole
MPxx5004
10
Sensors
Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf.
FREESCALE
D
Case 98ASB17759C, small outline package, through-hole
MPxx5004
Sensors
Freescale Semiconductor, Inc.
11
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99255D.pdf.
PAGE 1 OF 2
Case 98ASA99255D, small outline package, surface mount
MPxx5004
12
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Freescale Semiconductor, Inc.
PAGE 2 OF 2
Case 98ASA99255D, small outline package, surface mount
MPxx5004
Sensors
Freescale Semiconductor, Inc.
13
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99302D.pdf.
PAGE 1 OF 3
Case 98ASA99302D, small outline package, surface mount
MPxx5004
14
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Freescale Semiconductor, Inc.
PAGE 2 OF 3
PAGE 2 OF 3
Case 98ASA99302D, small outline package, surface mount
MPxx5004
Sensors
Freescale Semiconductor, Inc.
15
PAGE 3 OF 3
PAGE 3 OF 3
Case 98ASA99302D, small outline package, surface mount
MPxx5004
16
Sensors
Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf.
PAGE 1 OF 2
PAGE 1 OF 2
Case 98ASA99303D, small outline package
MPxx5004
Sensors
Freescale Semiconductor, Inc.
17
PAGE 2 OF 2
PAGE 2 OF 2
Case 98ASA99303D, small outline package
MPxx5004
18
Sensors
Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA10611D.pdf.
PAGE 1 OF 3
Case 98ASA10611D, small outline package
MPxx5004
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Freescale Semiconductor, Inc.
19
PAGE 2 OF 3
Case 98ASA10611D, small outline package
MPxx5004
20
Sensors
Freescale Semiconductor, Inc.
PAGE 3 OF 3
Case 98ASA10611D, small outline package
MPxx5004
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Freescale Semiconductor, Inc.
21
This drawing is available at http://cache.freescale.com/files/shared/doc/package_info/98ASA10686D.pdf
PAGE 1 OF 3
Case 98ASA10686D, small outline package
MPxx5004
22
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Freescale Semiconductor, Inc.
PAGE 2 OF 3
Case 98ASA10686D, small outline package
MPxx5004
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Freescale Semiconductor, Inc.
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PAGE 3 OF 3
Case 98ASA10686D, small outline package
MPxx5004
24
Sensors
Freescale Semiconductor, Inc.
5
Revision History
Table 5. Revision history
Revision
number
Revision
date
12.1
05/2015
Description
• Updated format.
• Table 3: Updated Full-scale span Typ value, was 4.0 to 3.92. Updated Linearity defintion in note 4.
• Updated package drawings with current versions.
MPxx5004
Sensors
Freescale Semiconductor, Inc.
25
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damages. “Typical” parameters that may be provided in Freescale data sheets and/or
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vary over time. All operating parameters, including “typicals,” must be validated for each
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respective owners.
© 2006-2009, 2015 Freescale Semiconductor, Inc.
Document Number: MPxx5004
Rev. 12.1
05/2015
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