NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPX5100
Rev. 14, 12/2018
MPX5100, 0 to 100 kPa, Differential,
Gauge, and Absolute, Integrated,
Pressure Sensors
MPX5100
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high-level, analog output signal that is proportional to the applied pressure.
Unibody packages
Features
•
2.5% maximum error over 0 to 85 °C
•
Ideally suited for microprocessor or microcontroller-based systems
•
Patented silicon shear stress strain gauge
•
Available in absolute, differential and gauge configuration
•
Durable epoxy unibody element
•
Easy-to-use chip carrier option
MPX5100AP/GP
98ASB42796B
MPX5100DP
98ASA42797B
Small outline packages
Typical applications
•
•
•
•
•
Patient monitoring
Process control
Pump/motor control
Pressure switching
White goods
MPXV5100DP
98ASA99255D
MPXV5100GP
98ASA99303D
MPXV5100GC6U
98ASB17757C
MPXV5100GC7U
98ASB17759C
Ordering information
Device name
Shipping
Package
# of Ports
None
Single
Pressure type
Dual
Gauge
Differential
Absolute
Device
marking
Unibody Package (MPX5100 Series)
MPX5100AP
Tray
98ASB42796B
MPX5100DP
Tray
98ASB42797B
MPX5100GP
Tray
98ASB42796B
•
•
•
•
•
•
MPX5100AP
MPX5100DP
MPX5100GP
Small Outline Package (MPXV5100 Series)
MPXV5100DP
Tray
98ASA99255D
•
•
MPXV5100GC6U
Rail
98ASB17757C
•
•
MPXV5100GC7U
Rail
98ASB17759C
•
•
MPXV5100G
MPXV5100GP
Tray
98ASA99303D
•
•
MPXV5100GP
NXP reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2018 NXP Semiconductors, B.V.
MPXV5100DP
MPXV5100G
Contents
1
2
3
4
5
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 MPX5100AP/DP/GP Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 MPX5100AP/DP/GP Pinout (Unibody) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 MPXV5100DP/GC6U/GC7U/GP block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Pressure (P1)/Gauge (P2) side identification table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Related Documentation
The MPX5100 device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1.
Go to the NXP homepage at:
http://www.nxp.com/
2.
3.
In the Keyword search box at the top of the page, enter the device number MPX5100.
In the Refine Your Result pane on the left, click on the Documentation link.
MPX5100
2
Sensors
NXP Semiconductors, B.V.
1
General Description
1.1
MPX5100AP/DP/GP Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a unibody package.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 4, 5, and 6 are internal device connections.
Do not connect to external circuitry or ground.
Figure 1. Integrated pressure sensor block diagram
1.2
MPX5100AP/DP/GP Pinout (Unibody)
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
Name
Function
1
VOUT
2
GND
3
VS
4
DNC
Do not connect to external circuitry or ground.
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
Output voltage
Ground
Voltage supply
MPX5100
Sensors
NXP Semiconductors, B.V.
3
1.3
MPXV5100DP/GC6U/GC7U/GP block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a small outline package.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do not connect to external circuitry or ground.
Figure 3. Integrated pressure sensor block diagram
1.4
MPXV5100DP/GC6U/GC7U/GP pinout (small outline package)
DNC
5
4
VOUT
DNC
6
3
GND
DNC
7
2
VS
DNC
8
1
DNC
Figure 4. Device pinout (top view)
Table 2. Pin functions
Pin
Name
1
DNC
Function
Do not connect to external circuitry or ground.
Voltage supply
2
VS
3
GND
Ground
4
VOUT
Output voltage
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
7
DNC
Do not connect to external circuitry or ground.
8
DNC
Do not connect to external circuitry or ground.
MPX5100
4
Sensors
NXP Semiconductors, B.V.
2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 3. Maximum ratings(1)
Symbol
Value
Unit
Maximum pressure
Rating
Pmax
400
kPa
Storage temperature
Tstg
-40 to +125
°C
Operating temperature
TA
-40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.2
Operating characteristics
Table 4. Operating characteristics (VS = 5 Vdc, TA = 25 °C.)
Characteristic
Min
Typ
Max
0
15
—
—
100
115
VS
4.75
5.0
5.25
VDC
IO
—
7.0
10
mAdc
Minimum pressure offset , (0 to 85 °C)
@ VS = 5.0 V
VOFF
0.088
0.20
0.313
VDC
Full-scale output(4), differential and absolute (0 to 85 °C)
@ VS = 5.0 V
VFSO
4.587
4.700
4.813
VDC
Full-scale Span(5), differential and absolute (0 to 85 °C)
@ VS = 5.0 V
VFSS
—
4.500
—
VDC
Accuracy(6)
—
—
—
±2.5
%VFSS
Sensitivity
V/P
—
45
—
mV/kPa
tR
—
1.0
—
ms
Pressure range(1)
Gauge, differential: MPX5100G/MPXV5100G
Absolute: MPX5100AP
Supply voltage(2)
Supply current
(3)
Response
time(7)
POP
Unit
kPa
IO+
—
0.1
—
mAdc
time(8)
—
—
20
—
ms
stability(9)
—
—
±0.5
—
%VFSS
Output source current at full-scale output
Warm-up
Offset
Symbol
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
5. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Temperature hysteresis:
Pressure hysteresis:
TcSpan:
TcOffset:
Variation from nominal:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C.
Output deviation with minimum pressure applied over the temperature range of 0 to 85 °C, relative to 25 °C.
The variation from nominal values, for offset or full-scale span, as a percent of VFSS at 25 °C.
7. Response time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.
MPX5100
Sensors
NXP Semiconductors, B.V.
5
3
On-chip Temperature Compensation and Calibration
Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for
operation over a temperature range of 0 to 85 °C using the decoupling circuit shown in Figure 7. The output will saturate outside
of the specified pressure range.
Figure 6 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier. A fluorosilicone gel
isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor
diaphragm.
Span Range (Typ)
MAX
2
TYP
1
110
100
90
80
70
30
20
0
0
10
MIN
60
3
50
Output Voltage (V)
4
VOUT = VS*(0.009*P+0.04)
± (Pressure Error * Temperature Factor * 0.009 * VS)
VS = 5.0 V ± 0.25 VDC
PE = 2.5
TM = 1
TEMP = 0 to 85 °C
40
5
Pressure (kPa)
Output Range (Typ)
The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media compatibility in your application.
(Typ)
Offset
Figure 5. Output versus pressure differential
Fluorosilicone
Gel Die Coat
Stainless Steel
Metal Cover
Die
Fluorosilicone
Gel Die Coat
Epoxy
Plastic
Case
Wire Bond
Differential/Gauge Element
Epoxy
Plastic
Case
Wire Bond
Die
Bond
Lead Frame
Stainless Steel
Metal Cover
Die
Lead Frame
Absolute Element
Die
Bond
Figure 6. Cross-sectional diagrams (not-to-scale)
Figure 7 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
+5.0 V
VOUT
OUTPUT
VS
IPS
0.01 μF
1.0 μF
470 pF
GND
Figure 7. Recommended power supply decoupling and output filtering
(For additional output filtering, please refer to application note AN1646.)
MPX5100
6
Sensors
NXP Semiconductors, B.V.
The following figures show the nominal transfer function, temperature and pressure error over the operating range for the
MPX5100D,MPX5100G and MPXV5100G devices.
Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Figure 8. Transfer function (MPX5100D, MPX5100G, MPXV5100G)
Break Points
Temp
4.0
Multiplier
- 40
0 to 85 °C
+125 °C
3.0
3
1
3
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0 to -40 °C and from 85 to 125 °C.
Figure 9. Temperature error multiplier (MPX5100D, MPX5100G, MPXV5100G)
Error Limits for Pressure
3.0
Error (kPa)
2.0
1.0
0.0
0
20
40
60
80
100
120
Pressure in kPa
-1.0
-2.0
-3.0
Pressure
Error (max)
0 to 100 kPa
± 2.5 kPa
Figure 10. Pressure error band (MPX5100D, MPX5100G, MPXV5100G)
MPX5100
Sensors
NXP Semiconductors, B.V.
7
The following figures show the nominal transfer function, temperature and pressure error over the operating range for the
MPX5100AP device.
Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Figure 11. Transfer function (MPX5100AP)
Break Points
Temp
Multiplier
4.0
- 40
0 to 85 °C
+125 °
3.0
3
1
3
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
130
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0 to -40 °C and from 85 to 125 °C.
Figure 12. Temperature error multiplier (MPX5100AP)
Error Limits for Pressure
3.0
Error (kPa)
2.0
1.0
0.0
0
20
40
60
80
100
130
Pressure in kPa
-1.0
-2.0
-3.0
Pressure
Error (max)
15 to 115 kPa
± 2.5 kPa
Figure 13. Pressure error band (MPX5100AP)
MPX5100
8
Sensors
NXP Semiconductors, B.V.
4
Package Information
4.1
Pressure (P1)/Gauge (P2) side identification table
NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Gauge (P2) side. The Pressure (P1) side
is the side containing fluoro-silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table below.
Part number
Package
Pressure (P1) side identifier
MPX5100AP, MPX5100GP
98ASB42796B
Side with port attached
MPX5100DP
98ASB42797B
Side with part marking
MPXV5100DP
98ASA99255D
Side with part marking
MPXV5100GC6U
98ASB17757C
Side with port attached
MPXV5100GC7U
98ASB17759C
Side with port attached
MPXV5100GP
98ASA99303D
Side with port attached
4.2
Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder
Figure 14. Small outline package footprint
4.3
Package dimensions
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17757C.pdf.
MPX5100
Sensors
NXP Semiconductors, B.V.
9
–A–
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
K
M
PIN 1 IDENTIFIER
SEATING
PLANE
Case 98ASB17757C, 8-lead small outline package
MPX5100
10
Sensors
NXP Semiconductors, B.V.
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17759C.pdf.
FREESCALE
D
Case 98ASB17759C, 8-lead small outline package
MPX5100
Sensors
NXP Semiconductors, B.V.
11
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42796B.pdf.
Case 98ASB42796B, 6-lead unibody package
MPX5100
12
Sensors
NXP Semiconductors, B.V.
Case 98ASB42796B, 6-lead unibody package
MPX5100
Sensors
NXP Semiconductors, B.V.
13
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42797B.pdf.
Case 98ASB42797B, 6-lead unibody package
MPX5100
14
Sensors
NXP Semiconductors, B.V.
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99255D.pdf.
Case 98ASA99255D, 8-lead, dual port, small outline package
MPX5100
Sensors
NXP Semiconductors, B.V.
15
Case 98ASA99255D, 8-lead, dual port, small outline package
MPX5100
16
Sensors
NXP Semiconductors, B.V.
This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99303D.pdf.
PAGE 1 OF 2
Case 98ASA99303D, 8-lead, side port, small outline package
MPX5100
Sensors
NXP Semiconductors, B.V.
17
Case 98ASA99303D, 8-lead, side port, small outline package
MPX5100
18
Sensors
NXP Semiconductors, B.V.
5
Revision History
Table 5. Revision history
Revision
number
14
Revision
date
12/2018
Description of changes
•
•
•
•
•
•
•
•
•
Deleted obsolete part numbers MPX5100A and MPX5100D.
Changed format to new corporate format.
Added pinout for MPX5100AP/DP/GP in Figure 2.
Added pin functions for MPX5100AP/DP/GP as Table 1.
Added pinout for MPXV5100DP/GC6U/GC7U/GP as Figure 4.
Added pin functions for MPXV5100DP/GC6U/GC7U/GP as Table 2.
Moved section 5.1, Package dimensions to Section 4.3.
Deleted section 5, duplicate Package Information information section.
Added revision history as Table 5.
MPX5100
Sensors
NXP Semiconductors, B.V.
19
How to Reach Us:
Information in this document is provided solely to enable system and software
Home Page:
NXP.com
implementers to use NXP products.There are no expressed or implied copyright
Web Support:
NXP.com/support
information in this document. NXP reserves the right to make changes without further
licenses granted hereunder to design or fabricate any integrated circuits based on the
notice to any products herein.
NXP makes no warranty, representation, or guarantee regarding the suitability of its
products for any particular purpose, nor does NXP assume any liability arising out of
the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation, consequential or incidental damages. "Typical"
parameters that may be provided in NXP data sheets and/or specifications can and do
vary in different applications, and actual performance may vary over time. All operating
parameters, including "typicals," must be validated for each customer application by the
customer's technical experts. NXP does not convey any license under its patent rights
nor the rights of others. NXP sells products pursuant to standard terms and conditions
of sale, which can be found at the following address:
NXP.com/salestermsandconditions.
NXP and the NXP logo are trademarks of NXP Semiconductors, B.V. All other product
or service names are the property of their respective owners.
© NXP Semiconductors, B.V., Inc., 2018. All Rights reserved.
Document Number: MPX5100
Rev. 14
12/2018
