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MRF9120LR3

MRF9120LR3

  • 厂商:

    NXP(恩智浦)

  • 封装:

    NI-860

  • 描述:

    FET RF 65V 880MHZ NI-860

  • 数据手册
  • 价格&库存
MRF9120LR3 数据手册
Document Number: MRF9120 Rev. 10, 5/2006 Freescale Semiconductor Technical Data RF Power Field Effect Transistors MRF9120LR3 Designed for broadband commercial and industrial applications with frequencies from 865 to 895 MHz. The high gain and broadband performance of this device makes it ideal for large-signal, common source amplifier applications in 26 volt base station equipment. • Typical CDMA Performance @ 880 MHz, 26 Volts, IDQ = 1000 mA IS-95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) Output Power — 26 Watts Power Gain — 16 dB Efficiency — 26% Adjacent Channel Power — 750 kHz: -45 dBc in 30 kHz BW 1.98 MHz: -60 dBc in 30 kHz BW • Capable of Handling 10:1 VSWR, @ 26 Vdc, 880 MHz, 120 Watts CW Output Power Features • Characterized with Series Equivalent Large-Signal Impedance Parameters • Integrated ESD Protection • Designed for Maximum Gain and Insertion Phase Flatness • Excellent Thermal Stability • Available with Low Gold Plating Thickness on Leads. L Suffix Indicates 40μ″ Nominal. • RoHS Compliant • In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel. 880 MHz, 120 W, 26 V LATERAL N-CHANNEL RF POWER MOSFET ARCHIVE INFORMATION ARCHIVE INFORMATION N-Channel Enhancement-Mode Lateral MOSFET CASE 375B-04, STYLE 1 NI-860 Table 1. Maximum Ratings Symbol Value Unit Drain-Source Voltage Rating VDSS -0.5, +65 Vdc Gate-Source Voltage VGS -0.5, +15 Vdc Total Device Dissipation @ TC = 25°C Derate above 25°C PD 250 1.43 W W/°C Storage Temperature Range Tstg -65 to +150 °C Case Operating Temperature TC 150 °C Operating Junction Temperature TJ 200 °C Symbol Value Unit RθJC 0.45 °C/W Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Table 3. ESD Protection Characteristics Test Conditions Human Body Model Machine Model © Freescale Semiconductor, Inc., 2006, 2009. All rights reserved. Freescale Semiconductor RF Product Device Data Class 1 (Minimum) M1 (Minimum) MRF9120LR3 1 Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted) Symbol Min Typ Max Unit Zero Gate Voltage Drain Leakage Current (VDS = 65 Vdc, VGS = 0 Vdc) IDSS — — 10 μAdc Zero Gate Voltage Drain Leakage Current (VDS = 26 Vdc, VGS = 0 Vdc) IDSS — — 1 μAdc Gate-Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) IGSS — — 1 μAdc Gate Threshold Voltage (1) (VDS = 10 Vdc, ID = 200 μAdc) VGS(th) 2 3 4 Vdc Gate Quiescent Voltage (2) (VDS = 26 Vdc, ID = 1000 mAdc) VGS(Q) — 3.8 — Vdc Drain-Source On-Voltage (1) (VGS = 10 Vdc, ID = 1.3 Adc) VDS(on) — 0.17 0.4 Vdc Output Capacitance (VDS = 26 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Coss — 50 — pF Reverse Transfer Capacitance (VDS = 26 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Crss — 2 — pF Characteristic Off Characteristics (1) Dynamic Characteristics (1,3) 1. Each side of device measured separately. 2. Measurement made with device in push-pull configuration. 3. Part internally input matched. (continued) MRF9120LR3 2 Freescale Semiconductor RF Product Device Data ARCHIVE INFORMATION ARCHIVE INFORMATION On Characteristics Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Two-T one Common-Source Amplifier Power Gain (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 880.0 MHz, f2 = 880.1 MHz) Gps 15 16.5 — dB Two-T one Drain Efficiency (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 880.0 MHz, f2 = 880.1 MHz) η 36 39 — % 3rd Order Intermodulation Distortion (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 880.0 MHz, f2 = 880.1 MHz) IMD — -31 -28 dBc Input Return Loss (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 880.0 MHz, f2 = 880.1 MHz) IRL — -16 -9 dB Two-T one Common-Source Amplifier Power Gain (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 895.0 MHz, f2 = 895.1 MHz) Gps — 16.5 — dB Two-T one Drain Efficiency (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 895.0 MHz, f2 = 895.1 MHz) η — 40.5 — % 3rd Order Intermodulation Distortion (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 895.0 MHz, f2 = 895.1 MHz) IMD — -30 — dBc Input Return Loss (VDD = 26 Vdc, Pout = 120 W PEP, IDQ = 1000 mA, f1 = 895.0 MHz, f2 = 895.1 MHz) IRL — -13 — dB Power Output, 1 dB Compression Point (VDD = 26 Vdc, Pout = 120 W CW, IDQ = 1000 mA, f1 = 880.0 MHz) P1dB — 120 — W Common-Source Amplifier Power Gain (VDD = 26 Vdc, Pout = 120 W CW, IDQ = 1000 mA, f1 = 880.0 MHz) Gps — 16 — dB Drain Efficiency (VDD = 26 Vdc, Pout = 120 W CW, IDQ = 1000 mA, f1 = 880.0 MHz) η — 51 — % ARCHIVE INFORMATION ARCHIVE INFORMATION Functional Tests (1) (In Freescale Test Fixture, 50 ohm system) 1. Measurement made with device in push-pull configuration. MRF9120LR3 Freescale Semiconductor RF Product Device Data 3 B6 B3 B4 C21 VGG + C10 C30 + C25 C26 VDD C27 L1 C11 Balun 1 + + R1 C8 Z16 Z18 Z20 Z22 C19 Z24 Z2 Z1 Z4 Z8 Z10 Z12 Z14 Z26 C2 C3 C1 Z3 ARCHIVE INFORMATION Z6 Z5 Z7 C4 Z9 C5 Z11 DUT C6 Z13 C7 R2 C13 C14 C15 C16 C17 C20 Z15 Z25 Z17 Z19 Z23 C18 Balun 2 B2 L2 C22 VGG B5 + C29 Z1 Z2, Z3 Z4, Z5 Z6, Z7 Z8, Z9 Z10, Z11 Z12, Z13 Z21 C12 C9 B1 Z27 RF OUTPUT 0.420″ x 0.080″ Microstrip 0.090″ x 0.420″ Microstrip 0.125″ x 0.220″ Microstrip 0.095″ x 0.220″ Microstrip 0.600″ x 0.220″ Microstrip 0.200″ x 0.630″ Microstrip 0.500″ x 0.630″ Microstrip Z14, Z15 Z16, Z17 Z18, Z19 Z20, Z21 Z22, Z23 Z24, Z25 Z26 Z27 + + + C23 C24 VDD C28 0.040″ x 0.630″ Microstrip 0.040″ x 0.630″ Microstrip 0.330″ x 0.630″ Microstrip 0.450″ x 0.630″ Microstrip 0.750″ x 0.220″ Microstrip 0.115″ x 0.420″ Microstrip 0.130″ x 0.080″ Microstrip 0.350″ x 0.080″ Microstrip Figure 1. 880 MHz Broadband Test Circuit Schematic MRF9120LR3 4 Freescale Semiconductor RF Product Device Data ARCHIVE INFORMATION RF INPUT Table 5. 880 MHz Broadband Test Circuit Component Designations and Values Description Part Number Manufacturer Long Ferrite Beads, Surface Mount 95F787 Newark B2, B4 Short Ferrite Beads, Surface Mount 95F786 Newark C1, C2 68 pF Chip Capacitors 100B680JP500X ATC C3, C6 0.8 - 8.0 pF Variable Capacitors 44F3360 Newark C4 7.5 pF Chip Capacitor 100B7R5JP150X ATC C5 3.3 pF Chip Capacitor 100B3R3CP150X ATC C7, C8 11 pF Chip Capacitors 100B110BCA500X ATC C9, C10, C21, C22 51 pF Chip Capacitors 100B510JP500X ATC C11, C12 6.2 pF Chip Capacitors 100B6R2BCA150X ATC C13 4.7 pF Chip Capacitor 100B4R7BCA150X ATC C14 5.1 pF Chip Capacitor 100B5R1BCA150X ATC C15 3.0 pF Chip Capacitor 100B2R7BCA150X ATC C16 2.7 pF Chip Capacitor 100B3R0BCA150X ATC C17 0.6 - 4.5 pF Variable Capacitor 44F3358 Newark C18, C19 47 pF Chip Capacitors 100B470JP500X ATC C20 0.4 - 2.5 pF Variable Capacitor 44F3367 Newark C29, C30 10 μF, 35 V Tantalum Chip Capacitors 93F2975 Newark C23, C24, C25, C26 22 μF, 35 V Tantalum Chip Capacitors 92F1853 Newark C27, C28 220 μF, 50 V Electrolytic Capacitors 14F185 Newark Balun 1, Balun 2 Xinger Surface Mount Balun Transformers 3A412 Anaren L1, L2 12.5 nH Mini Spring Inductors A04T-5 Coilcraft R1, R2 510 Ω, 1/4 W Chip Resistors WB1, WB2, WB3, WB4 10 mil Brass Wear Blocks Board Material 30 mil Glass Teflon®, εr = 2.55 Copper Clad, 2 oz Cu 900 MHz Push-Pull Rev 01B CMR PCB Etched Circuit Board 900 MHz Push-Pull Rev 01B CMR ARCHIVE INFORMATION ARCHIVE INFORMATION Part B1, B3, B5, B6 MRF9120LR3 Freescale Semiconductor RF Product Device Data 5 C30 B3 MRF9120 900 MHz PUSH PULL Rev 01B B4 C25 C26 C10 INPUT C5 C1 C6 ARCHIVE INFORMATION R2 C9 WB2 C4 C7 Balun2 L1 WB3 C3 C11 WB4 C2 C8 WB1 R1 C21 CUTOUT AREA Balun1 C27 VDD B6 C12 C19 C17 OUTPUT C16 C13-C15 C18 C20 L2 C22 C23 C24 VGG C29 B1 B2 B5 C28 VDD Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor signature/‐ logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have no impact on form, fit or function of the current product. Figure 2. 865-895 MHz Broadband Test Circuit Component Layout MRF9120LR3 6 Freescale Semiconductor RF Product Device Data ARCHIVE INFORMATION VGG Gps 16 η 45 40 VDD = 26 Vdc Pout = 120 W (PEP) IDQ = 1000 mA Tone Spacing = 100 kHz 15 14 35 -30 13 IMD -32 12 IRL -34 11 -36 -38 860 865 870 875 880 885 890 -12 -14 -16 -18 900 895 f, FREQUENCY (MHz) Figure 3. Class AB Broadband Circuit Performance 1500 mA 1200 mA 17 1000 mA 16.5 800 mA 16 VDD = 26 Vdc f1 = 880.0 MHz f2 = 880.1 MHz 15.5 15 1 -10 -20 VDD = 26 Vdc f1 = 880.0 MHz f2 = 880.1 MHz -30 800 mA -40 1000 mA -50 -60 Pout, OUTPUT POWER (WATTS) PEP 100 Pout, OUTPUT POWER (WATTS) PEP Figure 4. Power Gain versus Output Power Figure 5. Intermodulation Distortion versus Output Power -10 18 VDD = 26 Vdc IDQ = 1000 mA f1 = 880.0 MHz f2 = 880.1 MHz -30 -40 3rd Order -50 5th Order 7th Order -60 60 Gps 16 Gps, POWER GAIN (dB) -20 10 1 100 10 1200 mA 1500 mA 50 14 40 12 30 10 20 η VDD = 26 Vdc IDQ = 1000 mA f = 880 MHz 8 -70 6 1 10 100 Pout, OUTPUT POWER (WATTS) PEP Figure 6. Intermodulation Distortion Products versus Output Power 1000 10 h, DRAIN EFFICIENCY (%) 17.5 G ps , POWER GAIN (dB) IMD, INTERMODULATION DISTORTION (dBc) 18 IMD, INTERMODULATION DISTORTION (dBc) ARCHIVE INFORMATION 10 -10 ARCHIVE INFORMATION 17 IRL, INPUT RETURN LOSS (dB) 50 IMD, INTERMODULATION DISTORTION (dBc) G ps , POWER GAIN (dB) 18 h , DRAIN EFFICIENCY (%) TYPICAL CHARACTERISTICS 0 1 10 100 Pout, OUTPUT POWER (WATTS) AVG. Figure 7. Power Gain and Efficiency versus Output Power MRF9120LR3 Freescale Semiconductor RF Product Device Data 7 18 60 40 14 20 η 12 0 VDD = 26 Vdc IDQ = 1000 mA f1 = 880.0 MHz f2 = 880.1 MHz 10 -20 8 -40 IMD 6 -60 ARCHIVE INFORMATION 1 100 10 ARCHIVE INFORMATION G ps , POWER GAIN (dB) Gps 16 h, DRAIN EFFICIENCY (%) IMD, INTERMODULATION DISTORTION (dBc) TYPICAL CHARACTERISTICS Pout, OUTPUT POWER (WATTS) PEP 18 40 Gps G ps , POWER GAIN (dB) 16 20 η 14 0 VDD = 26 Vdc IDQ = 1000 mA f = 880 MHz IS-95, Pilot, Sync, Paging Traffic Codes 8 through 13 12 10 -20 -40 750 kHz 8 -60 1.98 MHz 6 -80 0.1 1 10 h, DRAIN EFFICIENCY (%) ACPR, ADJACENT CHANNEL POWER RATIO (dB) Figure 8. Power Gain, Efficiency and IMD versus Output Power 100 Pout, OUTPUT POWER (WATTS) AVG. Figure 9. Power Gain, Efficiency and ACPR versus Output Power MRF9120LR3 8 Freescale Semiconductor RF Product Device Data Zo = 5 Ω Zload f = 895 MHz f = 865 MHz f = 865 MHz Zsource ARCHIVE INFORMATION ARCHIVE INFORMATION f = 895 MHz VDD = 26 V, IDQ = 1000 mA, Pout = 120 W PEP Zload Ω f MHz Zsource Ω 865 4.89 - j0.2 4.9 - j0.5 880 4.54 + j0.07 4.6 - j0.32 895 3.29 - j1.3 4.2 - j0.04 Zsource = Test circuit impedance as measured from gate to gate, balanced configuration. Zload = Test circuit impedance as measured from drain to drain, balanced configuration. Input Matching Network + Device Under Test - Z source Output Matching Network + Z load Figure 10. Series Equivalent Source and Load Impedance MRF9120LR3 Freescale Semiconductor RF Product Device Data 9 PACKAGE DIMENSIONS Q bbb M T A M B M NOTES: 1. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY. 4. RECOMMENDED BOLT CENTER DIMENSION OF 1.140 (28.96) BASED ON M3 SCREW. 4 G B L 1 2 B (FLANGE) 5 3 4X K 4X 4 D bbb T A M M B M ARCHIVE INFORMATION ccc ccc M T A M B T A M B M R M F (LID) H N C (LID) E M S DIM A B C D E F G H K L M N Q R S bbb ccc INCHES MIN MAX 1.335 1.345 0.380 0.390 0.180 0.224 0.325 0.335 0.060 0.070 0.004 0.006 1.100 BSC 0.097 0.107 0.085 0.115 0.425 BSC 0.852 0.868 0.851 0.869 0.118 0.138 0.395 0.405 0.394 0.406 0.010 REF 0.015 REF MILLIMETERS MIN MAX 33.91 34.16 9.65 9.91 4.57 5.69 8.26 8.51 1.52 1.78 0.10 0.15 27.94 BSC 2.46 2.72 2.16 2.92 10.80 BSC 21.64 22.05 21.62 22.07 3.00 3.51 10.03 10.29 10.01 10.31 0.25 REF 0.38 REF (INSULATOR) bbb M PIN 5 (INSULATOR) bbb M T A M M T B M SEATING PLANE T A M B M STYLE 1: PIN 1. 2. 3. 4. 5. DRAIN DRAIN GATE GATE SOURCE CASE 375B-04 ISSUE F NI-860 MRF9120LR3 10 Freescale Semiconductor RF Product Device Data ARCHIVE INFORMATION 2X A A REVISION HISTORY The following table summarizes revisions to this document. Date 10 Dec. 2009 Description • Data sheet archived. Part no longer manufactured. ARCHIVE INFORMATION ARCHIVE INFORMATION Revision MRF9120LR3 Freescale Semiconductor RF Product Device Data 11 Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006, 2009. All rights reserved. MRF9120LR3 Document Number: MRF9120 Rev. 10, 5/2006 12 Freescale Semiconductor RF Product Device Data ARCHIVE INFORMATION ARCHIVE INFORMATION How to Reach Us:
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