MSC8103M1200F

Freescale Semiconductor Product Brief MSC8103PB Rev. 3, 9/2005 MSC8103 Networking Digital Signal Processor SIU MII • TDMs { •• Serial Interface and TSA UTOPIA Interface MCC / UART / HDLC / Transparent / Ethernet / Fast Ethernet / ATM / SCC CPM 3 × FCC 2 × MCC 64-bit System Bus Interrupt Controller MEMC Timers Parallel I/O 4 × SCC Baud Rate Generators 2 × SMC Dual Ported RAM DMA Engine 2 × SDMA I2C RISC Interrupts 64-bit Local Bus Other Peripherals Extended Core Address Register File Data ALU Register File Q2PPC Bridge 128-bit QBus SIC MEMC PIC Interrupts Boot ROM HDI16 SC140 Core JTAG Address ALU Data ALU 64/32-bit System Bus SIC_EXT Bridge SPI Program Sequencer PIT System Protection Reset Control Clock Control SRAM 512 KB The Freescale MSC8103 16-bit Digital Signal Processor (DSP) is a member of the family of DSPs based on the StarCore™ SC140 DSP core. The MSC8103 is offered in two core speed levels: 275 and 300 MHz. 8/16-bit Host Interface L1 Interface EOnCE™ Power Management Clock/PLL 128-bit P-Bus 64-bit XA Data Bus 64-bit XB Data Bus Figure 1. MSC8103 Block Diagram The Freescale MSC8103 DSP is a very versatile device that integrates the high-performance SC140 four-ALU (arithmetic logic unit) DSP core along with 512 KB of on-chip memory, a communications processor module (CPM), a 64-bit bus, a very flexible system integration unit (SIU), and a 16-channel DMA controller on a single device. With its four-ALU core, the MSC8103 can execute up to four multiply-accumulate (MAC) operations in a single clock cycle. The MSC8103 CPM is a 32-bit RISC-based communications protocol engine that can network to time-division multiplexed (TDM) highways, Ethernet, and asynchronous transfer mode (ATM) backbones. The MSC8103 60x-compatible bus interface connects to multi-master system architectures. The large on-chip unified program and data SRAM, 512 KB, reduces the need for off-chip memories. The MSC8103 offers 1200 DSP MMACS performance using an internal 300 MHz clock with a 1.6 V core and independent 3.3 V input/output (I/O). © Freescale Semiconductor, Inc., 2004, 2005. All rights reserved. Features Features • • • • • • • • • • • • SC140 core — Architecture optimized for efficient C/C++ code compilation — Four 16-bit ALUs and two 32-bit AGUs — 1200 MMACS, 3000 RISC MIPS, running at 300 MHz — Very low power dissipation—less than 0.25 W for the core running full speed at 1.6 V — Variable-length execution set (VLES) execution model improves code density — JTAG/enhanced OnCE debug port Communications processor module (CPM) — Programmable protocol machine using a 32-bit RISC engine — 155 Mbps ATM interface (including AAL 0/1/2/5) — 10/100 Mbit Ethernet interface — Up to four E1/T1 interfaces or one E3/T3 interface and one E1/T1 interface — HDLC support up to T3 rates, or 256 channels 100 MHz 64- or 32-bit wide bus interface — Bursts for high efficiency — Glueless interface to 60x-compatible bus systems — Multi-master support Programmable memory controller — Control for up to eight banks of external memory — User-programmable machines (UPM) allowing glueless interface to various memory types (SRAM, DRAM, EPROM, and Flash memory) and other user-definable peripherals — Dedicated pipelined SDRAM memory interface Large on-chip SRAM — 256K 16-bit words (512 KB) — Unified program and data space configurable by the application — Word and byte addressable DMA controller — 16 DMA channels, FIFO based, with burst capabilities — Sophisticated addressing capabilities Small footprint package: 17 mm × 17 mm lidded FC-PBGA package with lead-bearing or lead-free spheres Very low power consumption Separate power supply for internal logic (1.6 V) and for I/O (3.3 V) Enhanced 16-bit parallel host interface (HDI16) supports a variety of microcontroller, microprocessor, and DSP bus interfaces Phase-lock loops (PLLs) — System PLL — CPM DPLLs (SCC and SCM) Process technology: 0.13 micron copper interconnect MSC8103 Product Brief, Rev. 3 2 Freescale Semiconductor Target Applications Target Applications The MSC8101 targets applications requiring very high performance, very large amounts of on-chip memory, and such networking capabilities as: • Third-generation wideband wireless infrastructure systems • Packet telephony systems • Multi-channel modem banks • Multi-channel xDSL Product Documentation The documents listed in Table 1 are required for a complete description of the MSC8103 and are necessary to design properly with the part. Documentation is available from the following sources (see back cover for detailed information): • A local Freescale distributor • A Freescale Semiconductor sales office • A Freescale literature distribution center • The world wide web (WWW) Table 1. MSC8103 Documentation Name Description Order Number MSC8103 Technical Data MSC8103 features list and physical, electrical, timing, and package specifications MSC8103 MSC8103 User’s Guide Detailed functional description of the MSC8103 memory configuration, operation, and register programming MSC8103UG MSC8103 Reference Manual Detailed description of the MSC8103 processor core and instruction set MSC8103RM SC140 DSP Core Reference Manual Detailed description of the SC140 family processor core and instruction set MNSC140CORE Application Notes Documents describing specific applications or optimized device operation including code examples See the MSC8103 product website MSC8103 Product Brief, Rev. 3 Freescale Semiconductor 3 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations not listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GMBH Technical Information Center Schatzbogen 7 81829 München, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T. Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MSC8103PB Rev. 3 9/2005 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™, the Freescale logo, and CodeWarrior are trademarks of Freescale Semiconductor, Inc. StarCore is a trademark of StarCore LLC. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2004, 2005.