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MW5IC970MBR1

MW5IC970MBR1

  • 厂商:

    NXP(恩智浦)

  • 封装:

    TO-272-16

  • 描述:

    IC PWR AMP RF 28V 70W TO-272-16

  • 数据手册
  • 价格&库存
MW5IC970MBR1 数据手册
Freescale Semiconductor Technical Data Document Number: MW5IC970NBR1 Rev. 1, 5/2006 RF LDMOS Wideband 2 - Stage Power Amplifiers Designed for broadband commercial and industrial applications with frequencies from 132 MHz to 960 MHz. The high gain and broadband performance of this device make it ideal for large - signal, common - source amplifier applications in 28 volt base station equipment. The device has a 2 - stage design with off - chip matching for the input, interstage and output networks to cover the desired frequency band. • Typical Performance: 800 MHz, 28 Volts, IDQ1 = 80 mA, IDQ2 = 650 mA, Pout = 70 Watts PEP Power Gain — 30 dB Drain Efficiency — 48% • Capable of Handling 10:1 VSWR, @ 28 Vdc, 850 MHz, 70 Watts CW Output Power Features • Characterized with Series Equivalent Large - Signal Impedance Parameters • Integrated Quiescent Current Temperature Compensation with Enable/Disable Function • On - Chip Current Mirror gm Reference FET for Self Biasing Application (1) • Integrated ESD Protection • 200°C Capable Plastic Package • RoHS Compliant • In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel. VRD2 Quiescent Current Temperature Compensation VRG2/VGS2 VRG1/VGS1 RFin1 VD2/RFout2 VRD1 VD1/RFout1 VD1/RFout1 MW5IC970NBR1 800 - 900 MHz, 70 W, 28 V RF LDMOS WIDEBAND 2 - STAGE POWER AMPLIFIERS CASE 1329 - 09 TO - 272 WB - 16 PLASTIC GND VRD2 VRG2/VGS2 VRG1/VGS1 RFin1 1 2 3 4 5 16 15 GND NC GND 6 14 VD2/ RFout2 VRD1 VD1/RFout1 VD1/RFout1 RFin2 GND 7 8 9 10 11 13 12 NC GND (Top View) RFin2 Note: Exposed backside flag is source terminal for transistors. Figure 1. Functional Block Diagram Figure 2. Pin Connections 1. Refer to AN1987, Quiescent Current Control for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1987. © Freescale Semiconductor, Inc., 2006. All rights reserved. RF Device Data Freescale Semiconductor MW5IC970NBR1 1 Table 1. Maximum Ratings Symbol Value Unit Drain- Source Voltage Rating VDSS - 0.5, + 65 Vdc Gate- Source Voltage VGS - 0.5, + 15 Vdc Storage Temperature Range Tstg - 65 to +200 °C Operating Junction Temperature TJ 200 °C Symbol Value (1) Unit Table 2. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case RθJC °C/W Final Application (Pout = 70 W CW) Stage 1, 28 Vdc, IDQ = 80 mA Stage 2, 28 Vdc, IDQ = 650 mA 5.2 0.8 EDGE Application (Pout = 35 W CW) Stage 1, 28 Vdc, IDQ = 80 mA Stage 2, 28 Vdc, IDQ = 650 mA 5.3 0.8 Table 3. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22 - A114) 1A (Minimum) Machine Model (per EIA/JESD22 - A115) A (Minimum) Charge Device Model (per JESD22 - C101) IV (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Rating Package Peak Temperature Unit 3 260 °C Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28.5 Vdc, IDQ1 = 80 mA, IDQ2 = 650 mA, Pout = 70 W PEP, f1 = 870.0 MHz, f2 = 870.1 MHz Power Gain Gps 26.5 30 34.5 dB Drain Efficiency ηD 40 48 — % Input Return Loss IRL — - 12 - 10 dB Intermodulation Distortion IMD — - 33 - 28 dBc Typical 800/900 MHz Performances (In Freescale 800/900 MHz Reference Fixture, 50 ohm system) VDD = 28 Vdc, IDQ1 = 80 mA, IDQ2 = 650 mA, 740 - 870 MHz, 870 - 960 MHz Gain Flatness in 30 MHz Bandwidth @ Pout = 70 W CW GF — 2 — dB Gain Flatness in 30 MHz Instantaneous Bandwidth @ Pout = 70 W CW GF — 0.2 — dB Delay — 4.5 — ns ΔΦ — ±15 — ° Delay @ Pout = 70 W CW Including Output Matching Part - to - Part Phase Variation @ Pout = 70 W CW 1. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. (continued) MW5IC970NBR1 2 RF Device Data Freescale Semiconductor VBIAS VD2 R6 F1 R4 R8 R5 R7 R3 R2 1 C18 C16 R1 C15 RF INPUT Z1 2 VG2R2 C17 VG1R1 Z2 Z3 3 C8 16 Quiescent Current Temperature Compensation NC 15 4 Z6 5 C7 Z5 C2 6 C1 C9 Z7 C10 Z8 C12 Z9 RF OUTPUT 14 C6 7 C13 C11 Z10 8 C5 C14 9 10 NC 13 11 12 Z11 Z4 C3 C4 F2 VD1 Z1 Z2 Z3 Z4 Z5 Z6 0.485″ x 0.066″ Microstrip 0.270″ x 0.040″ Microstrip 0.068″ x 0.020″ Microstrip 0.950″ x 0.040″ Microstrip 0.131″ x 0.233″ Microstrip 0.797″ x 0.050″ Microstrip Z7 Z8 Z9 Z10 Z11 PCB 0.040″ x 0.233″ Microstrip 0.450″ x 0.120″ Microstrip 0.100″ x 0.066″ Microstrip 1.000″ x 0.040″ Microstrip 0.148″ x 0.040″ Microstrip Rogers 4350B, 0.030″, εr = 3.5 Figure 3. MW5IC970NBR1 Test Circuit Schematic Table 6. MW5IC970NBR1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C10, C11 3.9 pF Chip Capacitor 600S3R9BT ATC C2 56 pF Chip Capacitor 600S560JW ATC C3, C8, C14, C15, C17 39 pF Chip Capacitors GRM40001C0G390J050BD Murata C4, C9 10 μF Chip Capacitors ECJ4YF1H106Z Panasonic C5 24 pF Chip Capacitor 600F240JT ATC C6, C7 15 pF Chip Capacitors 600F150JT ATC C12 4.7 pF Chip Capacitor 600F4R7BT ATC C13 0.4 pF Chip Capacitor 600F0R4BT ATC C16, C18, C19, C20 0.015 μF Chip Capacitors GRM400X7R153J050BD Murata F1 5A Surface Mount Fuse 1FT5A Little Fuse F2 1A Surface Mount Fuse 1FT1A Little Fuse R1, R7 681 Ω, Chip Resistors R2, R5 4.75 kΩ, Chip Resistors R3, R4, R8 1.21 kΩ, Chip Resistors R6 267 Ω, Chip Resistor MW5IC970NBR1 RF Device Data Freescale Semiconductor 3 VD2 F1 VG2 C9 R6 VG1 C8 R8 R7 R4 R5 C18 C17 R3 R2 R1 C16 C15 C11 C13 C7 C10 C2 C6 C12 C1 C C5 C14 C3 MW5IC970 VD1 C4 Rev. 1 F2 Figure 4. MW5IC970NBR1 Test Circuit Component Layout MW5IC970NBR1 4 RF Device Data Freescale Semiconductor PAE, POWER ADDED EFFICIENCY (%) Gps, POWER GAIN (dB) 60 60 PAE 40 40 Gps 20 20 VDD = 28.5 Vdc, Pout = 35 W (Avg.) IDQ1 = 80 mA, IDQ2 = 650 mA 100 kHz Tone Spacing 0 0 IRL −20 −20 IMD −40 800 820 860 840 880 900 920 −40 960 940 IMD, INTERMODULATION DISTORTION (dBc) IRL, INPUT RETURN LOSS (dB) TYPICAL CHARACTERISTICS f, FREQUENCY (MHz) Figure 5. Two - Tone Wideband Performance @ Pout = 35 Watts (Avg.) −10 IDQ2 = 975 mA 812 mA 650 mA 30 488 mA 29 28 VDD = 28.5 Vdc, IDQ1 = 80 mA f1 = 870 MHz, f2 = 870.1 MHz Two−Tone Measurements 100 kHz Tone Spacing 325 mA 27 10 IMD, INTERMODULATION DISTORTION (dBc) 1 100 −20 −30 3rd Order −40 −50 5th Order 7th Order −60 −70 1 200 100 10 Pout, OUTPUT POWER (WATTS) PEP Pout, OUTPUT POWER (WATTS) PEP Figure 7. Intermodulation Distortion Products versus Output Power −20 34 VDD = 28.5 Vdc, Pout = 35 W (PEP) IDQ1 = 80 mA, IDQ2 = 650 mA Two−Tone Measurements (f1 + f2)/2 = Center Frequency of 870 MHz −25 −30 32 −35 5th Order −45 70 VDD = 28.5 Vdc, IDQ1 = 80 mA IDQ2 = 650 mA, f = 870 MHz 7th Order −50 1 10 25_C 60 85_C 50 Gps 30 28 TC = 25_C 40 85_C 26 100 TWO−TONE SPACING (MHz) Figure 8. Intermodulation Distortion Products versus Tone Spacing 200 30 20 24 PAE 22 −55 0.1 −30_C −30_C 3rd Order −40 300 Figure 6. Two - Tone Power Gain versus Output Power Gps, POWER GAIN (dB) Gps, POWER GAIN (dB) 31 VDD = 28.5 Vdc IDQ1 = 80 mA, IDQ2 = 650 mA f1 = 870 MHz, f2 = 870.1 MHz Two−Tone Measurements 100 kHz Tone Spacing 20 0.1 1 10 10 100 PAE, POWER ADDED EFFICIENCY (%) IMD, INTERMODULATION DISTORTION (dBc) 32 0 1000 Pout, OUTPUT POWER (WATTS) CW Figure 9. Power Gain and Power Added Efficiency versus CW Output Power MW5IC970NBR1 RF Device Data Freescale Semiconductor 5 TYPICAL CHARACTERISTICS 32 IDQ1 = 80 mA IDQ2 = 650 mA f = 870 MHz Gps, POWER GAIN (dB) 31 30 29 16 V 28 24 V VDD = 12 V 27 0 20 40 20 V 60 80 32 V 28.5 V 100 120 140 Pout, OUTPUT POWER (WATTS) CW Figure 10. Power Gain versus Output Power MW5IC970NBR1 6 RF Device Data Freescale Semiconductor NOTES MW5IC970NBR1 RF Device Data Freescale Semiconductor 7 NOTES MW5IC970NBR1 8 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS MW5IC970NBR1 RF Device Data Freescale Semiconductor 9 MW5IC970NBR1 10 RF Device Data Freescale Semiconductor MW5IC970NBR1 RF Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E - mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1 - 800- 521- 6274 or +1 - 480- 768- 2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1 - 800- 441- 2447 or 303 - 675- 2140 Fax: 303 - 675- 2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. MW5IC970NBR1 Document Number: MW5IC970NBR1 Rev. 1, 5/2006 12 RF Device Data Freescale Semiconductor
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