N74F11N,602

INTEGRATED CIRCUITS 74F10 Triple 3-input NAND gate 74F11 Triple 3-input AND gate Product specification IC15 Data Handbook
     1989 Sep 20 Philips Semiconductors Product specification Gates 74F10, 74F11 74F10 Triple 3-input NAND gate 74F11 Triple 3-input AND gate TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT (TOTAL) 74F10 3.5ns 3.3mA 74F11 4.2ns 5.3mA TYPE ORDERING INFORMATION DESCRIPTION COMMERCIAL RANGE VCC = 5V ±10%, Tamb = 0°C to +70°C PKG DWG # 14-pin plastic DIP N74F10N, N74F11N SOT27-1 14-pin plastic SO N74F10D, N74F11D SOT108-1 INPUT AND OUTPUT LOADING AND FAN OUT TABLE PINS 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW Data inputs DESCRIPTION 1.0/1.0 20µA/0.6mA Qn Data output (74F10) 50/33 1.0mA/20mA Qn Data output (74F11) 50/33 1.0mA/20mA Dna, Dnb, Dnc NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state. PIN CONFIGURATIONS 74F10 74F11 D0a 1 14 VCC D0a 1 14 VCC D0b 2 13 D0c D0b 2 13 D0c D1a 3 12 Q0 D1a 3 12 Q0 D1b 4 11 D2c D1b 4 11 D2c D1c 5 10 D2b D1c 5 10 D2b Q1 6 9 D2a Q1 6 9 D2a GND 7 8 Q2 GND 7 8 Q2 SF00055 SF00056 LOGIC SYMBOLS 74F10 1 D0a 2 4 5 9 D0b D0c D1a D1b D1c D2a Q0 Q1 Q2 12 6 8 VCC = Pin 14 GND = Pin 7 13 3 74F11 10 11 1 D2b D2c D0a VCC = Pin 14 GND = Pin 7 SF00057 September 20, 1989 2 13 3 4 5 9 D0b D0c D1a D1b D1c D2a Q0 Q1 Q2 12 6 8 10 11 D2b D2c SF00058 2 853–0329 97683 Philips Semiconductors Product specification Gates 74F10, 74F11 IEC/IEEE SYMBOLS 74F10 1 74F11 1 & 12 2 13 13 3 3 4 12 4 6 5 5 9 9 10 & 2 6 10 8 11 8 11 SF00059 SF00060 LOGIC DIAGRAMS 74F10 74F11 1 1 D0a D0a 2 12 2 Q0 D0b 13 D1b D1c D2a D2b D2c VCC = Pin 14 GND = Pin 7 D0c 3 D1a 4 6 D1b Q1 5 D1c 9 D2a 10 8 D2b Q2 11 VCC = Pin 14 GND = Pin 7 SF00061 OUTPUTS INPUTS D2c 3 4 6 Q1 5 9 10 8 Q2 11 SF00062 FUNCTION TABLE 74F10 74F11 Dna Dnb Dnc Qn Qn L L L H L L L H H L L H L H L L H H H L H L L H L H L H H L H H L H L H H H NOTES: 1. H = High voltage level 2. L = Low voltage level L H September 20, 1989 Q0 13 D0c D1a 12 D0b 3 Philips Semiconductors Product specification Gates 74F10, 74F11 ABSOLUTE MAXIMUM RATINGS (Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.) SYMBOL PARAMETER RATING UNIT VCC Supply voltage –0.5 to +7.0 V VIN Input voltage –0.5 to +7.0 V IIN Input current –30 to +5 mA VOUT Voltage applied to output in High output state –0.5 to VCC V IOUT Current applied to output in Low output state Tamb Operating free-air temperature range Tstg Storage temperature range 40 mA 0 to +70 °C –65 to +150 °C RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL PARAMETER UNIT MIN NOM MAX 5.0 5.5 VCC Supply voltage 4.5 V VIH High-level input voltage 2.0 VIL Low-level input voltage 0.8 V IIK Input clamp current –18 mA IOH High-level output current –1 mA IOL Low-level output current 20 mA Tamb Operating free air temperature range +70 °C V 0 DC ELECTRICAL CHARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) SYMBOL TEST CONDITIONS1 PARAMETER 2.5 ±5%VCC 2.7 VCC = MIN, VIL = MAX ±10%VCC 0.35 0.50 VIH = MIN, IOl = MAX ±5%VCC 0.35 0.50 –0.73 –1.2 V 100 µA 20 µA –0.6 mA –150 mA Low level output voltage Low-level VIK Input clamp voltage VCC = MIN, II = IIK II Input current at maximum input voltage VCC = MAX, VI = 7.0V IIH High-level input current VCC = MAX, VI = 2.7V IIL Low-level input current VCC = MAX, VI = 0.5V IOS Short-circuit output current3 VCC = MAX ICC Supply current (total) 74F11 ICCH ICCL UNIT ±10%VCC VOL O ICCL MAX VIH = MIN, IOH = MAX High level output voltage High-level ICCH TYP2 VCC = MIN, VIL = MAX VOH O 74F10 LIMITS MIN VCC = MAX VCC = MAX V 3.4 –60 VIN = GND 1.8 2.1 VIN = 4.5V 6.0 7.7 VIN = 4.5V 4.7 6.2 VIN = GND 7.2 9.7 V mA mA NOTES: 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb = 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. September 20, 1989 4 Philips Semiconductors Product specification Gates 74F10, 74F11 AC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL TEST CONDITION PARAMETER VCC = +5.0V ± 10% Tamb = 0°C to +70°C CL = 50pF, RL = 500Ω VCC = +5.0V Tamb = +25°C CL = 50pF, RL = 500Ω MIN TYP MAX MIN MAX UNIT tPLH tPHL Propagation delay Dna, Dnb, Dnc to Qn 74F10 Waveform 1 2.4 1.5 3.7 3.2 5.0 4.3 2.4 1.5 6.0 5.3 ns tPLH tPHL Propagation delay Dna, Dnb, Dnc to Qn 74F11 Waveform 2 3.0 2.5 4.2 4.1 5.6 5.5 3.0 2.5 6.6 6.5 ns AC WAVEFORMS For all waveforms, VM = 1.5V. Dna, Dnb, Dnc VM tPHL VM tPLH VM Qn Dna, Dnb, Dnc VM VM tPLH VM tPHL VM Qn VM SF00064 SF00063 Waveform 1. Propagation Delay for Inverting Outputs (74F10) Waveform 2. Propagation Delay for Non-Inverting Outputs (74F11) TEST CIRCUIT AND WAVEFORM VCC NEGATIVE PULSE VIN tw 90% 10% D.U.T. RT CL RL AMP (V) VM VM VOUT PULSE GENERATOR 90% 10% tTHL (tf ) tTLH (tr ) tTLH (tr ) tTHL (tf ) 0V AMP (V) 90% POSITIVE PULSE VM VM 10% Test Circuit for Totem-Pole Outputs DEFINITIONS: RL = Load resistor; see AC ELECTRICAL CHARACTERISTICS for value. CL = Load capacitance includes jig and probe capacitance; see AC ELECTRICAL CHARACTERISTICS for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 90% 10% tw 0V Input Pulse Definition INPUT PULSE REQUIREMENTS family amplitude VM 74F 3.0V 1.5V rep. rate tw tTLH tTHL 1MHz 500ns 2.5ns 2.5ns SF00006 September 20, 1989 5 Philips Semiconductors Product specification Gates 74F10, 74F11 DIP14: plastic dual in-line package; 14 leads (300 mil) 1989 Sep 20 6 SOT27-1 Philips Semiconductors Product specification Gates 74F10, 74F11 SO14: plastic small outline package; 14 leads; body width 3.9 mm 1989 Sep 20 7 SOT108-1 Philips Semiconductors Product specification Gates 74F10, 74F11 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number:
     yyyy mmm dd 8 Date of release: 10-98 9397-750-05056