Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
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Kind regards,
Team Nexperia
INTEGRATED CIRCUITS
74F367
Hex buffer/driver
Product data
Replaces Product specification 74F365/74F367 of 2000 Jun 30
2004 Jan 30
Philips Semiconductors
Product data
Hex buffer/driver
74F367
FEATURES
• High-impedance NPN base inputs for reduced loading
TYPE
TYPICAL
PROPAGATION DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F367
5.0 ns
36 mA
(20 µA in HIGH and LOW states)
• High-speed
• Bus oriented
• 3-State buffer outputs sink 64 mA
ORDERING INFORMATION
COMMERCIAL RANGE: VCC = 5 V ± 10%; Tamb = 0 °C to +70 °C
Type number
Package
Name
Description
Version
N74F367N
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
N74F367D
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS
DESCRIPTION
74F(U.L.)
HIGH / LOW
LOAD VALUE
HIGH / LOW
1.0 / 0.033
20 µA / 20 µA
I0 - I5
Inputs
OE0, OE1
Output enable inputs (active-LOW)
1.0 / 0.033
20 µA / 20 µA
Y0 - Y5
Data Outputs
750 / 106.7
15 mA / 64 mA
NOTE: One (1.0) FAST Unit Load (U.L.) is defined as: 20 µA in the HIGH state and 0.6 mA in the LOW state.
PIN CONFIGURATION
OE0 1
16
VCC
I0
2
15
OE1
Y0
3
14
I5
I1
4
13
Y5
74F367
Y1
5
12
I4
I2
6
11
Y4
Y2
7
10
I3
GND
8
9
Y3
SF00905
2004 Jan 30
2
Philips Semiconductors
Product data
74F367
Hex buffer/driver
LOGIC SYMBOL
LOGIC SYMBOL (IEEE/IEC)
74F367
74F367
2
4
I0
6
I1
I2
10
12
I3
14
I4
1
EN1
15
EN2
2
I5
1
3
1
OE0
4
15
OE1
6
7
10
9
Y0
Y1
Y2
Y3
Y4
Y5
12
3
VCC = Pin 16
GND = Pin 8
5
7
9
11
2
14
13
5
11
13
SF00907
SF00906
LOGIC DIAGRAM
FUNCTION TABLE
INPUTS
OUTPUTS
74F367
OE0 1
I0
I1
I2
2
4
6
I3 10
3
5
7
9
Y0
Y1
H
L
X
Z
Y2
Y3
OE1 15
I4 12
I5 14
VCC = Pin 16
GND = Pin 8
2004 Jan 30
11
13
Y4
Y5
SF01442
3
=
=
=
=
OEn
In
Yn
L
L
L
L
H
H
H
X
Z
HIGH voltage level
LOW voltage level
Don’t care
High impedance “off” state
Philips Semiconductors
Product data
74F367
Hex buffer/driver
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage range
–0.5 to +7.0
V
VIN
Input voltage range
–0.5 to +7.0
V
IIN
Input current range
–30 to +5
mA
VOUT
Voltage applied to output in HIGH output state range
–0.5 to 5.5
V
IOUT
Current applied to output in LOW output state
Tamb
Operating free-air temperature range
Tstg
Storage temperature range
128
mA
0 to +70
°C
–65 to +150
°C
LIMITS
UNIT
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN
TYP
MAX
5.5
V
VCC
Supply voltage
4.5
5.0
VIH
HIGH-level input voltage
2.0
–
–
V
VIL
LOW-level input voltage
–
–
0.8
V
IIK
Input clamp current
–
–
–18
mA
IOH
HIGH-level output current
–
–
–15
mA
IOL
LOW-level output current
–
–
64
mA
Tamb
Operating free-air temperature range
0
–
70
°C
2004 Jan 30
4
Philips Semiconductors
Product data
74F367
Hex buffer/driver
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
SYMBOL
VCC = MIN; VIL = MAX;
VIH = MIN; IOH = –3 mA
VOH
O
LIMITS
TEST CONDITIONS1
PARAMETER
HIGH level output voltage
HIGH-level
VCC = MIN; VIL = MAX;
VIH = MIN; IOH = –15 mA
VCC = MIN; VIL = MAX;
VIH = MIN; IOL = MAX
VOL
O
Low level output voltage
Low-level
VIK
Input clamp voltage
II
Input current at maximum input voltage
IIH
IIL
UNIT
MIN
TYP2
MAX
± 10% VCC
2.4
–
–
V
± 5% VCC
2.7
3.3
–
V
± 10% VCC
2.0
–
–
V
± 5% VCC
2.0
–
–
V
± 10% VCC
–
–
0.55
V
± 5% VCC
–
0.42
0.55
V
VCC = MIN; II = IIK
–
–0.73
–1.2
V
VCC = 0 V; VI = 7.0 V
–
–
100
µA
HIGH-level input current
VCC = MAX; VI = 2.7 V
–
–
20
µA
LOW-level input current
VCC = MAX; VI = 0.5 V
–
–
–20
µA
IOZH
Off-state output current,
HIGH-level voltage applied
VCC = MAX; VO = 2.7 V
–
–
50
µA
IOZL
Off-state output current,
LOW-level voltage applied
VCC = MAX; VO = 0.5 V
–
–
–50
µA
IOS
Short-circuit output current3
VCC = MAX
–100
–
–225
mA
–
25
35
mA
ICC
Supply current (total)
–
47
62
mA
–
35
48
mA
ICCH
ICCL
VCC = MAX
ICCZ
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5 V, Tamb = 25 °C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests.
In any sequence of parameter tests, IOS tests should be performed last.
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Tamb = –55 °C to +125 °C
VCC = +5.0 V ± 10%
CL = 50 pF; RL = 500 Ω
UNIT
MIN
TYP
MAX
MIN
MAX
Waveform 1
2.5
2.5
4.5
5.5
6.5
7.0
2.0
2.0
7.0
7.5
ns
ns
Output Enable time
to HIGH or LOW level
Waveform 2
Waveform 3
3.0
3.0
5.5
6.5
7.5
8.5
3.0
3.0
8.5
9.0
ns
ns
Output Disable time
from HIGH to LOW level
Waveform 2
Waveform 3
2.0
2.0
4.5
4.0
6.5
6.5
2.0
2.0
7.0
7.0
ns
ns
tPLH
tPHL
Propagation delay
In to Yn
tPZH
tPZL
tPHZ
tPLZ
2004 Jan 30
Tamb = +25 °C
VCC = +5.0 V
CL = 50 pF; RL = 500 Ω
5
Philips Semiconductors
Product data
74F367
Hex buffer/driver
AC WAVEFORMS
For all waveforms, VM = 1.5 V
In
VM
VM
tPLH
tPHL
Yn
VM
VM
SF00914
Waveform 1. For non-inverting outputs
OE
VM
OE
VM
tPZH
VM
VOH – 0.3 V
tPHZ
VM
tPZL
tPLZ
3.5 V
Yn
VM
VM
Yn
0V
VOL + 0.3 V
SF00913
SF00915
Waveform 2. 3-State Output Enable time to HIGH level and
Output Disable time from HIGH level
Waveform 3. 3-State Output Enable time to LOW level
and Output Disable time from LOW level
TEST CIRCUIT AND WAVEFORM
VCC
7.0 V
VIN
RL
VOUT
PULSE
GENERATOR
tw
90%
NEGATIVE
PULSE
VM
CL
AMP (V)
VM
10%
D.U.T.
RT
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
RL
AMP (V)
90%
90%
Test Circuit for 3-State Outputs
POSITIVE
PULSE
VM
VM
10%
TEST
tPLZ
tPZL
All other
SWITCH
closed
closed
open
DEFINITIONS:
RL = Load resistor;
see AC electrical characteristics for value.
CL = Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
10%
tw
SWITCH POSITION
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0 V
1.5 V
rep. rate
1 MHz
tw
tTLH
500 ns 2.5 ns
tTHL
2.5 ns
SF00777
2004 Jan 30
6
Philips Semiconductors
Product data
74F367
Hex buffer/driver
DIP16: plastic dual in-line package; 16 leads (300 mil)
2004 Jan 30
7
SOT38-4
Philips Semiconductors
Product data
74F367
Hex buffer/driver
SO16: plastic small outline package; 16 leads; body width 3.9 mm
2004 Jan 30
8
SOT109-1
Philips Semiconductors
Product data
74F367
Hex buffer/driver
REVISION HISTORY
Rev
Date
Description
_4
20040130
Product data (9397 750 12742). 853-0042 ECN 01-A15335 of 21 January 2004.
Replaces 74F365_74F367_3 dated 2000 Jun 30 (9397 750 07283).
Modifications:
• Delete all references to 74F365 (product discontinued).
_3
20000630
Product specification (9397 750 07283). ECN 853-0042 24024 of 30 June 2000.
Supersedes data of 1999 Jan 08.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 01-04
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
2004 Jan 30
9
9397 750 12742
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