INTEGRATED CIRCUITS
74F543
Octal registered transceiver,
non-inverting (3-State)
Product data sheet
Replaces data sheet 74F543/74F544 of 1994 Dec 05
2004 Jul 22
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
FEATURES
74F543
FUNCTIONAL DESCRIPTION
• Combines74F245 and 74F373 type functions in one chip
• 8-bit octal transceiver with D-type latch
• Back-to-back registers for storage
• Separate controls for data flow in each direction
• A outputs sink 20 mA and source 3 mA
• B outputs sink 64 mA and source 15 mA
• 3-State outputs for bus-oriented applications
• Available in SSOP Type II package
The 74F543 contains two sets of eight D-type latches, with separate
input and controls for each set. For data flow from A to B, for
example, the A-to-B Enable (EAB) input must be LOW in order to
enter data from A0 - A7 or take data from B0 - B7, as indicated in
the Function Table. With EAB LOW, a LOW signal on the A-to-B
Latch Enable (LEAB) input makes the A-to-B latches transparent; a
subsequent LOW-to-HIGH transition for the LEAB signal puts the
A latches in the storage mode and their outputs no longer change
with the A inputs. With EAB and OEAB both LOW, the 3-State
B output buffers are active and display the data present at the
outputs of the A latches. Control of data flow from B to A is similar,
but using the EBA, LEBA, and OEBA inputs.
DESCRIPTION
The 74F543 Octal Registered Transceiver contains two sets of
D-type latches for temporary storage of data flowing in either
direction. Separate Latch Enable (LEAB, LEBA) and Output Enable
(OEAB, OEBA) inputs are provided for each register to permit
independent control of inputting and outputting in either direction of
data flow. The A outputs are guaranteed to sink 24 mA, while the
B outputs are rated for 64 mA.
TYPE
TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F543
6.0 ns
80 mA
ORDERING INFORMATION
Commerical range: VCC = 5 V ± 10 %; Tamb = 0 °C to +70 °C
Type number
Package
Name
Description
Version
N74F543D
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
N74F543DB
SSOP24
plastic shrink small outline pacakge; 24 leads; body width 5.3 mm
SOT340-1
N74F543N
DIP24
plastic dual in-line package; 24 leads (300 mil)
SOT222–1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS
DESCRIPTION
74F(U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
A0 - A7
Port A, 3-State inputs
3.5/1.0
70 µA/0.6 mA
B0 - B7
Port B, 3-State inputs
3.5/1.0
70 µA/0.6 mA
OEAB
A-to-B Output Enable input (Active LOW)
1.0/1.0
20 µA/0.6 mA
OEBA
B-to-A Output Enable input (Active LOW)
1.0/1.0
20 µA/0.6 mA
EAB
A-to-B Enable input (Active LOW)
1.0/2.0
20 µA/1.2 mA
EBA
B-to-A Enable input (Active LOW)
1.0/2.0
20 µA/1.2 mA
LEAB
A-to-B Latch Enable input (Active LOW)
1.0/1.0
20 µA/0.6 mA
LEBA
B-to-A Latch Enable input (Active LOW)
1.0/1.0
20 µA/0.6 mA
A0 - A7
Port A, 3-State outputs
150/40
3.0 mA/24 mA
B0 - B7
Port B, 3-State outputs
750/106.7
15 mA/64 mA
NOTE: One (1.0) FAST Unit Load is defined as: 20 µA in the HIGH State and 0.6mA in the LOW state.
2004 Jul 22
2
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
PIN CONFIGURATION
LOGIC SYMBOL
LEBA
1
24 VCC
OEBA
2
23 EBA
A0
3
22 B0
A1
4
21 B1
A2
5
20 B2
3
6
A4
7
18 B4
A5
8
17 B5
A6
9
16 B6
4
5
6
7
8
9
10
A0 A1 A2 A3 A4 A5 A6 A7
19 B3
A3
A7 10
74F543
11
EAB
23
EBA
OEAB
13
14
LEAB
OEBA
2
1
LEBA
B0 B1 B2 B3 B4 B5 B6 B7
15 B7
EAB 11
14 LEAB
GND 12
13 OEAB
22 21 20 19 18 17 16 15
VCC = Pin 24
GND = Pin 12
SF00237
SF00238
FUNCTION TABLE for 74F543
LOGIC SYMBOL (IEEE/IEC)
2
INPUTS
IEN3
EXX
LEXX
DATA
OUTPUTS
23
G1
1
1C5
H
X
X
X
Z
Disabled
13
2EN4
11
G2
X
H
X
X
Z
Disabled
L
↑
L
h
Z
L
↑
L
l
Z
Disable +
Latch
22
L
L
↑
h
H
21
L
L
↑
l
L
L
L
L
H
H
L
L
L
L
L
L
L
H
X
NC
14
3
4
5
2C6
3
6D
5D
4
20
6
19
7
18
8
17
9
16
10
15
H
L
h
Latch +
Display
Transparent
Hold
= HIGH voltage level
= LOW voltage level
= HIGH state must be present one setup time before the
LOW-to-HIGH transition of LEXX or EXX (XX=AB or BA)
l
= LOW state must be present one setup time before the
LOW-to-HIGH transition of LEXX or EXX (XX=AB or BA)
↑ = LOW-to-HIGH transition of LEXX or EXX XX = AB or BA
X = Don’t care
NC = No change
Z = High-impedance “off” state
SF00239
2004 Jul 22
STATUS
OEXX
3
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
LOGIC DIAGRAM
D
DETAIL A
Q
22
B0
LE
A0
3
Q
D
LE
A1
A2
A3
A4
A5
A6
A7
OEBA
4
21
5
20
6
19
7
DETAIL A X 7
18
8
17
9
16
10
15
B1
B2
B3
B4
B5
B6
B7
2
13 OEAB
EBA
23
11
LEBA
1
VCC = Pin 24
GND = Pin 12
EAB
14 LEAB
SF00243
2004 Jul 22
4
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
VCC
Supply voltage
–0.5 to +7.0
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5
mA
VOUT
Voltage applied to output in HIGH output state
IOUT
O
Current applied to output in LOW output state
Tamb
Operating free-air temperature range
Tstg
Storage temperature
–0.5 to +5.5
V
A0 - A7
48
mA
B0 - B7
128
mA
0 to +70
°C
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
LIMITS
PARAMETER
MIN
NOM
MAX
UNIT
VCC
Supply voltage
4.5
5.0
5.5
V
VIH
HIGH-level input voltage
2.0
–
–
V
VIL
LOW-level input voltage
–
–
0.8
V
IIK
Input clamp current
–
–
–18
mA
IOH
O
HIGH level output current
HIGH-level
A0 - A7
–
–
–3
mA
B0 - B7
–
–
–15
mA
IOL
O
LOW level output current
LOW-level
A0 - A7
–
–
24
mA
–
–
64
mA
Tamb
Operating free-air temperature range
–0
–
+70
°C
2004 Jul 22
B0 - B7
5
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
TEST CONDITIONS1
PARAMETER
A0 - A7
VOH
O
A0 - A7
Input clamp voltage
II
Input current at maximum
input voltage
IIH
HIGH-level input current
VIH = MIN
VCC = MIN
IOH
15 mA
O = –15
IOL
O = 24 mA
VIL = MAX
LOW level output voltage
LOW-level
B0 - B7
VIK
IOH
3 mA
O = –3
VIL = MAX
HIGH level output voltage
HIGH-level
B0 - B7
VOL
O
VCC = MIN
VIH = MIN
IOL
O = 64 mA
LOW level input current
LOW-level
–
–
V
± 5 % VCC
2.7
3.4
–
V
± 10 % VCC
2.0
–
–
V
± 5 % VCC
2.0
–
–
V
± 10 % VCC
–
0.35
0.50
V
± 5 % VCC
–
0.35
0.50
V
± 10 % VCC
–
–
0.55
V
± 5 % VCC
–
0.42
0.55
V
–0.73
–1.2
V
–
–
100
µA
Others
VCC = 5.5 V; VI = 5.5 V
–
–
1
mA
VCC = MAX; VI = 2.7 V
–
–
20
µA
–
–
–0.6
mA
–
–
–1.2
mA
–
–
70
µA
EAB, EBA
VCC = MAX; VI = 0
0.5
5V
IOZH + IIL
Off-state output current, LOW-level voltage applied
VCC= MAX; VO = 0. 5 V
Supply current (total)
2.4
–
VCC= MAX; VO = 2.7 V
ICC
± 10 % VCC
VCC = MAX; VI = 7.0 V
Off-state output current, HIGH-level voltage applied
Short circuit output current3
Short-circuit
MAX
VCC = MIN; II = IIK
IOZH + IIH
IOS
UNIT
TYP2
OEAB, OEBA, EAB
Others
IIL
LIMITS
MIN
A0 - A7
B0 - B7
VCC = MAX
ICCH
ICCL
VCC = MAX
ICCZ
–
–
–600
µA
–60
–
–150
mA
–100
–
–225
mA
–
70
105
mA
–
95
135
mA
–
95
135
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under the recommended operating conditions for the applicable
type.
2. All typical values are at VCC = 5 V, Tamb = 25 °C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
2004 Jul 22
6
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
Tamb = +25 °C
VCC = 5.0 V
CL = 50 pF; RL = 500 Ω
TEST CONDITIONS
Tamb = 0 °C to +70 °C
VCC = 5.0 V ± 10 %
CL = 50pF; RL = 500 Ω
UNIT
MIN
TYP
MAX
MIN
MAX
Waveform 1
3.5
3.0
5.5
5.0
8.5
8.0
3.0
2.5
9.0
8.5
ns
Propagation delay
Bn to An
Waveform 1
2.5
2.5
4.0
4.5
7.0
7.5
2.5
2.5
7.5
8.0
ns
tPLH
tPHL
Propagation delay
LEBA to An
Waveform 1
5.0
4.0
7.0
6.0
10.0
9.0
4.5
4.0
11.0
9.5
ns
tPLH
tPHL
Propagation delay
LEAB to Bn
Waveform 1
6.0
4.5
8.5
6.5
11.5
9.5
5.5
4.0
12.5
10.0
ns
tPZH
tPZL
Output Enable time
OEBA to An or OEAB to Bn
Waveform 3
Waveform 4
2.0
3.5
4.0
5.0
7.5
8.5
1.5
3.0
8.0
9.0
ns
tPHZ
tPLZ
Output Disable time
OEBA to An or OEAB to Bn
Waveform 3
Waveform 4
1.0
1.5
3.0
4.0
6.5
7.5
1.0
1.0
7.5
8.5
ns
tPZH
tPZL
Output Enable time
EBA to An or EAB to Bn
Waveform 3
Waveform 4
4.5
5.0
7.0
7.0
10.5
10.5
4.0
4.5
11.5
11.0
ns
tPHZ
tPLZ
Output Disable time
EBA to An or EAB to Bn
Waveform 3
Waveform 4
2.5
4.5
5.0
7.0
8.5
11.0
2.0
3.0
9.5
12.0
ns
tPLH
tPHL
Propagation delay
An to Bn
tPLH
tPHL
AC SETUP REQUIREMENTS
LIMITS
S
O
SYMBOL
PARAMETER
Tamb = +25 °C
VCC = 5.0 V
CL = 50 pF; RL = 500 Ω
S CONDITIONS
CO
O S
TEST
Tamb = 0 °C to +70 °C
VCC = 5.0 V ± 10 %
CL = 50 pF; RL = 500 Ω
MIN
TYP
MIN
MAX
UNIT
ts(H)
ts(L)
Setup time, HIGH or LOW
An to LEAB or Bn to LEBA
Waveform 2
0.0
2.5
–
–
0.0
3.0
–
–
ns
th(H)
th(L)
Hold time, HIGH or LOW
An to LEAB or Bn to LEBA
Waveform 2
0.0
1.5
–
–
0.0
2.0
–
–
ns
ts(H)
ts(L)
Setup time, HIGH or LOW
An to EAB or Bn to EBA
Waveform 2
1.0
2.5
–
–
1.5
3.0
–
–
ns
th(H)
th(L)
Hold time, HIGH or LOW
An to EAB or Bn to EBA
Waveform 2
0.0
1.5
–
–
0.0
2.0
–
–
ns
tw(L)
Latch enable pulse width, LOW
Waveform 2
4.0
–
4.5
–
ns
2004 Jul 22
7
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
AC WAVEFORMS
VM = 1.5 V.
The shaded areas indicate when the input is permitted to change for predictable output performance.
VIN
VM
OEAB, OEBA
EAB, EBA
VM
tPLH
VM
tPZH
tPHL
VOUT
VM
VM
VM
VOH – 0.3 V
tPHZ
VM
An, Bn
0V
SF00246
Waveform 1.
An
Bn
Propagation delay for non-inverting outputs
VM
VM
VM
ts(H)
LEAB, LEBA
EAB, EBA
SF00248
Waveform 3. 3-State Output Enable Time to HIGH Level and
Output Disable Time from HIGH Level
th(H)
VM
ts(L)
OEAB, OEBA
EAB, EBA
th(L)
VM
VM
tPZL
tPLZ
VM
VM
VM
An, Bn
tw(L)
VOL + 0.3 V
SF00247
Waveform 2.
SF00249
Data Setup Time and Hold Times, and Latch
Enable Pulse Width
Waveform 4. 3-State Output Enable Time to LOW Level and
Output Disable Time from LOW Level
TEST CIRCUIT AND WAVEFORMS
VCC
7.0 V
VIN
RL
VOUT
PULSE
GENERATOR
tw
90%
NEGATIVE
PULSE
VM
CL
AMP (V)
VM
10%
D.U.T.
RT
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
RL
AMP (V)
90%
90%
Test Circuit for Open Collector Outputs
POSITIVE
PULSE
VM
VM
10%
TEST
tPLZ
tPZL
All other
SWITCH
closed
closed
open
DEFINITIONS:
RL = Load resistor;
see AC electrical characteristics for value.
CL = Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
10%
tw
SWITCH POSITION
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0 V
1.5 V
rep. rate
1 MHz
tw
tTLH
500 ns 2.5 ns
tTHL
2.5 ns
SF00128
2004 Jul 22
8
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
SO24: plastic small outline package; 24 leads; body width 7.5 mm
2004 Jul 22
9
74F543
SOT137-1
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2004 Jul 22
10
74F543
SOT340-1
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
DIP24: plastic dual in-line package; 24 leads (300 mil)
2004 Jul 22
11
74F543
SOT222-1
Philips Semiconductors
Product data sheet
Octal registered transceiver, non-inverting (3-State)
74F543
REVISION HISTORY
Rev
Date
Description
_3
20040722
Product data sheet (9397 750 13803).
Replaces Product specification 74F543_544_1 of 1994 Dec 05 (9397 750 05135).
Modifications:
• Remove part-type 74F544 and all its references.
• Change Type number for SSOP24 package from “74F543DB” to “N74F543DB”.
_2
19941205
Product specification (9397 750 05135). ECN 853-0874 14379 of 05 December 1994.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data sheet
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data sheet
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data sheet
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 07-04
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
2004 Jul 22
12
9397 750 13803
