NCX8200UKZ

NCX8200 Audio jack configuration switch matrix Rev. 1 — 15 May 2015 Product data sheet 1. General description The NCX8200 is an advanced audio jack configuration switch matrix device that supports 3- and 4-pole connectors. It allows reconfiguration of the GND, microphone-bias contact to comply with the American Headset Jack (AHJ) and the Open Mobile Terminal Platform (OMTP) pinout. Furthermore, a GND sense path supports quasi-differential amplifier architectures. The device contains Human Body Model compliant ESD protection diodes rated 8 kV at all pins. The device can be operated from a supply in the range of 1.6 V to 3.6 V. It supports a broad variety of after-market headphones. 2. Features and benefits          AHJ and OMTP headset jack pinout support Low supply current Sense path to GND for quasi differential amplifier configuration Low THD and noise microphone pass through channel Ultra low RDSon of ground and sense switches High power supply ripple rejection ESD protection: HBM JEDEC JDS-001 Class 3B exceeds 8 kV Operating ambient temperature: 40C to +85C 1.22 mm  1.22 mm  0.5 mm WLCSP9 package 3. Applications  Headphones with integrated microphone and remote control buttons 4. Ordering information Table 1. Ordering information Type number NCX8200UK Package Name Description Version WLCSP9 wafer chip-scale package; 9 bumps; 1.22  1.22  0.5 mm NCX8200UK 5. Marking Table 2. Marking codes Type number Marking code NCX8200UK qx82 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 6. Functional diagram AHJ OMTP VDD Sense Rbias MIC headset jack SNS 1 SNS1 2 SNS2 R CON2 2 1 SEL L CON1 MIB 1 CMIC GND MIC MIC GND 2 GRD 750 kΩ GND aaa-016470 Default configuration with SEL = L is AHJ-compliant in this example. Fig 1. Simplified schematic NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 7. Pinning information 7.1 Pinning bump A1 index area A1 A2 A3 SNS1 Sense SNS2 B1 B2 B3 CON1 SEL CON2 C1 C2 C3 VDD GND MIC Transparent top view, solder balls facing down Fig 2. Transparent top view, solder balls facing down aaa-016471 Pin configuration WLCSP9 Fig 3. aaa-016472 NCX8200 pinout, transparent top view 7.2 Pin description Table 3. Pin description Symbol Pin Type Description SNS1 A1 I/O analog sense path 1 to headset jack GND Sense A2 I/O analog sense path for GND sensing SNS2 A3 I/O analog sense path 2 to headset jack GND CON1 B1 I/O headset jack pin 1 SEL B2 I configuration select input: SEL = L: CON1 = GND, CON2 = MIC, Sense = SNS1 SEL = H: CON1 = MIC, CON2 = GND, Sense = SNS2 CON2 B3 I/O headset jack pin 2 VDD C1 power core supply GND C2 ground ground MIC C3 I/O microphone bias connection audio codec side 8. Functional description The basic application of the NCX8200 device is shown in Figure 1. There is a 750 kW pull down resistor at SEL pin, for setting SEL default LOW. If SEL is at low level, CON1 is connected to GND, the MIC channel is routed to CON2, and the Sense channel switches to SNS1. If SEL is at high level, CON2 is connected to GND, the MIC channel is routed to CON1, and the Sense channel switches to SNS2. NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 9. Application diagram A capacitor of value not less than 1 F, should be placed between VDD and GND for stable operation of the NCX8200. The bypass capacitor should be placed close to the device with low-ohmic connection from the power supply and GND connection. SNS1 should be for sensing CON1 connection and SNS2 should be for sensing CON2 connection. In PCB design, CONx routes from the headset jack should be as low-ohmic as possible. SNSx sensing nodes should be as close to the headset jack as possible with low-ohmic connection, so that the star connection is recommended. The routes from sensing nodes to SNSx should be as low-ohmic as possible. When VDD is not powered, all the FETs become open by default. Thus, the ground return path becomes floating. Noise might be heard if a speaker (with external powered amplified) is plugged in the audio jack. It is highly recommended when the audio jack detects a plug-in, the NCX8200 is kept powered until unplug. VDD 1.0 μF VDD Sense GND Sensing MIC BIAS Audio CODEC 2.2 kΩ SNS 1 SNS1 2 SNS2 MIB 1 MIC headset jack L R CON2 1 SEL GND MIC MIC GND CON1 2 1 μF AHJ OMTP Switching Control 2 GRD Processor 750 kΩ GND Fig 4. aaa-016473 NCX8200 application diagram NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 10. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VDD supply voltage VI/O input/output voltage MIC, CON1, CON2, Sense, SNS1, SNS2 0.5 +3.6 V 0.5 VDD V VI input voltage SEL 0.5 VDD + 0.1 V ISW(GRD) switch current continuous current from CON1 or CON2 to GND - 100 mA ISW(MIB) switch current continuous current from MIC to CON1 or CON2 - 50 mA ISW(SNS) switch current continuous current from Sense to SNS1 or SNS2 - 50 mA Tj(max) maximum junction temperature 40 +125 C Tstg storage temperature 65 +150 C Ptot total power dissipation - 530 mW 11. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VDD supply voltage VI/O input/output voltage VI input voltage Tamb ambient temperature Conditions Min Max Unit 1.6 3.6 V MIC, CON1, CON2, Sense, SNS1, SNS2 0.3 VDD V SEL 0.3 VDD V 40 +85 C 12. Thermal characteristics Table 6. NCX8200 Product data sheet Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient Conditions [1][2] Typ Unit 75.5 K/W [1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB applications, the second layer should be used to create a large heat spreader area right below the device. If this layer is either ground or power, it should be connected with several vias to the top layer connecting to the device ground or supply. Try not to use any solder-stop varnish under the chip. [2] Rely on the measurement data given for rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value may vary in applications using different layer stacks and layouts. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 13. Static characteristics Table 7. Static characteristics At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Digital control VIH HIGH-level input voltage SEL input 1.0 - - V VIL LOW-level input voltage SEL input - - 0.4 V Rpd pull-down Resistor SEL input - 750 - k VDD = 3.0 V; Tamb = 25C - 0.1 1 A VDD = 3.0 V; Tamb = 85C - - 5 A - - 1.5 A - 1.6 2.5  Current consumption IDD Quiescent current Microphone bias switch MIB IS(MIB) MIB Path leakage current MIC; VMIC = 850 mV; CONx open; SEL = H or L RON(MIB) MIB switch-on resistance IO = 30 mA, VI = 850 mV VDD = 1.8 V RON(MIB_flat) MIB switch-on resistance flatness VDD = 3.0 V - 0.5 0.8  VDD = 3.6 V - 0.46 0.7  IO = 30 mA, 0.8 V < VI < 1.2 V VDD = 1.8 V - - 5  VDD = 3.0 V - - 0.1  VDD = 3.6 V - - 0.1  CS input/output capacitance MIC; CONx open; SEL = H or L - 250 - pF THD total harmonic distortion of RS = RL = 600 , fAC = 20 kHz, the conducting MIB switch VAC = 0.5 VPP, VDC = 1.7 V, VDD = 3.0 V; SEL = H or L - 0.005 - % PSRR power supply ripple rejection ratio of the conducting MIB switch - 80 - dB VDD = 1.8 V - 70 120 m VDD = 3.0 V - 60 90 m VDD = 3.6 V - 57 82 m - - 50 m RS = RL = 600 , f = 217 Hz, VDD = 3.0 V, VDC = 2.1 V, VAC = 0.3 VPP; SEL = H or L Ground switch GRD RON(GRD) GRD switch on resistance IICONx = 100 mA RON(GRD_flat) GRD switch-on resistance IICONx = 10 mA, VDD = 1.8 V ~ 3.6 V flatness IICONx = 1 mA, VDD = 1.8 V ~ 3.6 V PSRR power supply ripple rejection ratio of the conducting GRD switch NCX8200 Product data sheet VS = 1 V, RS = 8 , VDD = 3.0 V, VAC = 0.3 VPP, f = 217 Hz; SEL = H or L All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 - - 50 m - 60 - dB © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix Table 7. Static characteristics …continued At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V). …continued Symbol Parameter Conditions Min Typ Max Unit VDD = 1.8 V - 80 130 m VDD = 3.0 V - 60 90 m VDD = 3.6 V - 57 82 m IIsense = 10 mA, SNSx = 0 V, VDD = 1.8 V ~ 3.6 V - - 50 m IIsense = 1 mA, SNSx= 0 V, VDD = 1.8 V ~ 3.6 V - - 50 m SEL = H; SNS1 =GND; SNS2 = OPEN - - 1 A SEL = L; SNS1 = OPEN; SNS2 = GND - - 1 A Sense switch SNS RON(SNS) SNS switch on resistance RON(SNS_flat) SNS switch-on resistance flatness IS(SNS_OFF) SNS switch leakage current NCX8200 Product data sheet IIsense = 30 mA, SNSx= 0 V Sense; Vsense = 1 V All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 13.1 Test circuit and graphs VDD VDD CONX MIC SEL = VIH or VIL VSW ll MIB CONX CONX lS GND SEL = VIH or VIL V V RON = sw ll Fig 5. aaa-016475 aaa-016474 Test circuit for measuring ON resistance Fig 6. DDD  5RQ Pȍ Test circuit for measuring leakage current DDD  5RQ ȍ             GND     9''9    (1) SNS RON     9''9  MIB RON (2) GRD RON Fig 7. GRD and SNS channel ON resistance NCX8200 Product data sheet Fig 8. MIB channel ON resistance All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 14. Dynamic characteristics Table 8. Dynamic characteristics At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max [1] Unit tON Turn-ON Time VMIC = VDD, Vsense= 0 V, RL = 50 , CL = 35 pF - 215 400 ns tOFF Turn-OFF Time VMIC = VDD, Vsense= 0 V, RL = 50 , CL = 35 pF - 35 120 ns tBBM break-before-make time VMIC = VDD, Vsense= 0 V, RL = 50 , CL = 35 pF 70[1] 180 320 ns [1] Guaranteed by design 14.1 Waveform VDD SEL Logic Input 50 % 50 % 0V TOFF TON 90 % 90 % CON1 or CON2 CON2 or CON1 90 % 90 % TBBM TBBM aaa-016476 Fig 9. Turn-ON time and turn-OFF time NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 15. Package outline :/&63ZDIHUFKLSVFDOHSDFNDJHEXPSV[[PP $ ' 1&;8. % EDOO$ LQGH[DUHD $ $ ( $ GHWDLO; H & E H & $ % & ‘Y ‘Z \ & H H % $ EDOO$ LQGH[DUHD    ;  PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ $ E ' ( PD[       QRP       PLQ       H H H    Y Z \    QF[XNBSR 2XWOLQH YHUVLRQ 5HIHUHQFHV ,(& -('(& -(,7$ (XURSHDQ SURMHFWLRQ ,VVXHGDWH   1&;8. Fig 10. Package outline NCX8200 (WLCSP9) NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 16. Abbreviations Table 9. Abbreviations Acronym Description THD Total Harmonic Distortion CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MOSFET Metal-Oxide Semiconductor Field Effect Transistor 17. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes NCX8200 v.1 20150515 Product data sheet - - NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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NCX8200 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NCX8200 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 14 NCX8200 NXP Semiconductors Audio jack configuration switch matrix 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 13.1 14 14.1 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Application diagram . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Test circuit and graphs . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 May 2015 Document identifier: NCX8200