NE1617A

NE1617A Temperature monitor for microprocessor systems Rev. 04 — 30 July 2009 Product data sheet 1. General description The NE1617A is an accurate two-channel temperature monitor. It measures the temperature of itself and the temperature of a remote sensor. The remote sensor is a diode connected transistor. This can be in the form of either a discrete NPN/PNP, such as the 2N3904/2N3906, or a diode connected PNP built into another die, such as is done on some Intel microprocessors. The temperature of both the remote and local sensors is stored in a register that can be read via a 2-wire SMBus. The temperatures are updated at a rate that is programmable via the SMBus (the average supply current is dependent upon the update rate—the faster the rate, the higher the current). In addition to the normal operation, which is to update the temperature at the programmed rate, there is a one-shot mode that will force a temperature update. There is also an alarm that senses either an overtemperature or undertemperature condition. The trip points for this alarm are also programmable. The device can have 1 of 9 addresses (determined by 2 address pins), so there can be up to 9 of the NE1617A on the SMBus. It can also be put in standby mode (in order to save power). This can be done either with software (over the SMBus) or with hardware (using the STBY pin). 2. Features I Replacement for Maxim MAX1617 and Analog Devices ADM1021 I Monitors local and remote temperature I Local (on-chip) sensor accuracy: N ±2 °C at 60 °C to 100 °C N ±3 °C at −40 °C to 125 °C I Remote sensor accuracy: N ±3 °C at 60 °C to 100 °C N ±5 °C at −40 °C to 125 °C I No calibration required I Programmable overtemperature/undertemperature alarm I SMBus 2-wire serial interface up to 100 kHz I 3 V to 5.5 V supply range; 5.5 V tolerant I 70 µA supply current in operating mode I 3 µA (typical) supply current in standby mode NXP Semiconductors NE1617A Temperature monitor for microprocessor systems I ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC standard JESD78, which exceeds 100 mA I Small 16-lead SSOP (QSOP) package 3. Applications I I I I I Desktop computers Notebook computers Smart battery packs Industrial controllers Telecommunications equipment 4. Ordering information Table 1. Ordering information Tamb = −40 °C to +125 °C. Type number NE1617ADS Topside mark NE1617A Package Name SSOP16[1] Description plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm Version SOT519-1 [1] Also known as QSOP16. NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 2 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 5. Block diagram STBY NE1617A LOCAL TEMP SENSOR CONTROL LOGIC ONE-SHOT REGISTER CONVERSION RATE REGISTER LOCAL TEMP DATA REGISTER REMOTE TEMP DATA REGISTER ADDRESS DECODER CONFIGURATION REGISTER LOCAL HIGH TEMP THRESHOLD LOCAL LOW TEMP THRESHOLD REMOTE HIGH TEMP THRESHOLD REMOTE LOW TEMP THRESHOLD COMMAND POINTER REGISTER LOCAL TEMP HIGH LIMIT REGISTER LOCAL TEMP LOW LIMIT REGISTER REMOTE TEMP HIGH LIMIT REGISTER REMOTE TEMP LOW LIMIT REGISTER D+ D− ANALOG MUX A-to-D CONVERTER ADD1 ADD0 ALERT INTERRUPT MASKING STATUS REGISTER SMBus INTERFACE VDD GND GND TEST1 TEST5 TEST9 TEST13 TEST16 SCLK SDATA 002aad510 Fig 1. Block diagram of NE1617A NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 3 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 6. Pinning information 6.1 Pinning TEST1 VDD D+ D− TEST5 ADD1 GND GND 1 2 3 4 5 6 7 8 002aad509 16 TEST16 15 STBY 14 SCLK 13 TEST13 12 SDATA 11 ALERT 10 ADD0 9 TEST9 NE1617ADS Fig 2. Pin configuration for SSOP16 (QSOP16) 6.2 Pin description Table 2. Symbol TEST1 VDD D+ D− TEST5 ADD1 GND TEST9 ADD0 ALERT SDATA TEST13 SCLK STBY Pin description Pin 1 2 3 4 5 6 7, 8 9 10 11 12 13 14 15 Description test pin; factory use only[1] positive supply[2] positive side of remote sensor negative side of remote sensor test pin; factory use only[1] device address 1 (3-state) ground test pin; factory use only[1] device address 0 (3-state) open-drain output used as interrupt or SMBus alert SMBus serial data input/output; open-drain test pin; factory use only[1] SMBus clock input hardware standby input HIGH = normal operating mode LOW = standby mode TEST16 [1] [2] 16 test pin; factory use only[1] These pins should either float or be tied to ground. VDD pin should be decoupled by a 0.1 µF capacitor. NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 4 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 7. Functional description The NE1617A contains an integrating A-to-D converter, an analog multiplexer, a status register, digital data registers, SMBus interface, associated control logic and a local temperature sensor or channel (refer to Figure 1 “Block diagram of NE1617A”). The remote diode-type sensor or channel should be connected to the D+ and D− pins properly. Temperature measurements or conversions are either automatically and periodically activated when the device is in free-running mode (both STBY pin = HIGH, and the configuration register bit 6 = LOW) or generated by one-shot command. The free-running period is selected by changing the programmable data of the conversion rate register, as described in Section 8.3.4. For each conversion, the multiplexer switches current sources through the remote and local temperature sensors over a period of time, about 60 ms, and the voltages across the diode-type sensors are sensed and converted into the temperature data by the A-to-D converter. The resulting temperature data is then stored in the temperature registers, in 8-bit two's complement word format and automatically compared with the limits which have been programmed in the temperature limit registers. Results of the comparison are reflected accordingly by the flags stored in the status register, an out-of-limit condition will set the ALERT output pin to its LOW state. Because both channels are automatically measured for each conversion, the results are updated for both channels at the end of every successful conversion. 7.1 Remote diode selection The method of the temperature measurement is based on the change of the diode VBE at two different operating current levels given by: KT ∆ V BE = ------- × LN ( N ) q where: ∆VBE = change in base emitter voltage drop at two current levels K = Boltzman’s constant T = absolute temperature in ° Kelvin q = charge on the electron LN = natural logarithm N = ratio of the two currents The NE1617A forces two well-controlled current sources of about 10 µA and 100 µA and measures the remote diode VBE. The sensed voltage between two pins D+ and D− is limited between 0.25 V and 0.95 V. The external diode must be selected to meet this voltage range at these two current levels. The diode-connected PNP transistor provided on the microprocessor is typically used, or the discrete diode-connected transistor 2N3904 or 2N3906 is recommended as an alternative. Even though the NE1617A integrating A-to-D converter has a good noise performance, using the average of 10 measurement cycles, high frequency noise filtering between D+ and D− should be considered. An external capacitor of 2200 pF typical (but not higher (1) NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 5 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems than 3300 pF) connected between D+ and D− is recommended. Capacitance higher than 3300 pF will introduce measurement error due to the rise time of the switched current source. 7.2 No calibration is required As mentioned in Section 7.1, the NE1617A uses two well-controlled current sources of 10 : 1 ratio to measure the forward voltage of the diode (VBE). This technique eliminates the diode saturation current (a heavily process and temperature dependent variable), and results in the forward voltage being proportional to absolute temperature. 7.3 Address logic The address pins of the NE1617A can be forced into one of three levels: LOW (GND), HIGH (VDD), or ‘not connected’ (n.c.). Because the NE1617A samples and latches the address pins at the starting of every conversion, it is suggested that those address pins should be hard-wired to the logic applied, so that the logic is consistently existed at the address pins. During the address sensing period, the device forces a current at each address pin and compares the voltage developed across the external connection with the predefined threshold voltage in order to define the logic level. If an external resistor is used for the connection of the address, then its value should be less than 2 kΩ to prevent the error in logic detection from happening. Resistors of 1 kΩ are recommended. 8. Temperature monitor with SMBus serial interface 8.1 Serial bus interface The device can be connected to a standard 2-wire serial interface System Management Bus (SMBus) as a slave device under the control of a master device, using two device terminals SCLK and SDATA. The operation of the device to the bus is described with details in the following sections. 8.2 Slave address The device address is defined by the logical connections applied to the device pins ADD0 and ADD1. A list of selectable addresses are shown in Table 3. The device address can be set to any one of those nine combinations and more than one device can reside on the same bus without address conflict. Note that the state of the device address pins is sampled and latched not only at power-up step, but also at starting point of every conversion. Table 3. Device slave address n.c. = not connected ADD0[1] GND GND GND n.c. n.c. n.c. ADD1[1] GND n.c. VDD GND n.c. VDD Address byte 0011 000 0011 001 0011 010 0101 001 0101 010 0101 011 NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 6 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems Table 3. Device slave address …continued n.c. = not connected ADD0[1] VDD VDD VDD [1] ADD1[1] GND n.c. VDD Address byte 1001 100 1001 101 1001 110 Any pull-up/pull-down resistor used to connect to GND or VDD should be ≤ 2 kΩ. 8.3 Registers The device contains more than 9 registers. They are used to store the data of device set-up and operation results. Depending on the bus communication (either read or write operations), each register may be called by different names because each register may have different sub-addresses or commands for read and write operations. For example, the configuration register is called as WC for write mode and as RC for read mode. Table 4 shows the names, commands and functions of all registers as well as the register POR states. Remark: Attempting to write to a read-command or read from a write-command will produce an invalid result. The reserved registers are used for factory test purposes and should not be written. Table 4. RIT RET RS RC RCR RIHL RILL REHL RELL WC WCR WIHL WILL WEHL WELL OSHT Register assignments Command byte 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h POR state 0000 0000 0000 0000 n/a 0000 0000 0000 0010 0111 1111 1100 1001 0111 1111 1100 1001 n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a Function read internal or local temp byte read external or remote temp byte read status byte read configuration byte read conversion rate byte read internal temp high limit byte read internal temp low limit byte read external temp high limit byte read external temp low limit byte write configuration byte write conversion rate byte write internal temp high limit byte write internal temp low limit byte write external temp high limit byte write external temp low limit byte one-shot command reserved reserved reserved reserved Register name NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 7 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 8.3.1 Low power standby modes Upon POR, the device is reset to its normal free-running auto-conversion operation mode. The device can be put into standby mode by either using hardware control (connect the STBY pin to LOW for hardware standby mode) or using software control (set bit 6 of the configuration register to HIGH for software standby mode). When the device is put in either one of the standby modes, the supply current is reduced to less than 10 µA if there is no SMBus activity, all data in the device registers are retained and the SMBus interface is still alive to bus communication. However, there is a difference in the device ADC conversion operation between hardware standby and software standby modes. In hardware standby mode, the device conversion is inhibited and the one-shot command does not initiate a conversion. In software standby mode, the one-shot command will initiate a conversion for both internal and external channels. If a hardware standby command is received when the device is in normal mode and a conversion is in progress, the conversion cycle will stop and data in reading temperature registers will not be updated. 8.3.2 Configuration register The configuration register is used to mask the Alert interrupt and/or to put the device in software standby mode. Only two bits of this register (bit 6 and bit 7) are used as listed in Table 5. Bit 7 is used to mask the device ALERT output from Alert interruption when this bit is set to logic 1, and bit 6 is used to activate the standby software mode when this bit is set to logic 1. This register can be written or read using the commands of registers named WC and RC accordingly. Upon Power-On Reset (POR), both bits are reset to zero. Table 5. Bit 7 (MSB) 6 5 to 0 Configuration register bit assignments Symbol MASK RUN/STOP POR state 0 0 n/a Function Mask ALERT interrupt. Interrupt is enabled when this bit is LOW, and disabled when this bit is HIGH. Standby or run mode control. When LOW, running mode is enabled; when HIGH, standby mode is initiated. reserved 8.3.3 External and internal temperature registers Results of temperature measurements after every ADC conversion are stored in two registers: Internal Temp register (RIT) for internal or local diode temperature, and External Temp register (RET) for external or remote diode temperature. These registers can be only read over the SMBus. The reading temperature data is in 2's complement binary form consisting of 7-bit data and 1-bit sign (MSB), with each data count represents 1 °C, and the MSB bit is transmitted first over the serial bus. The contents of those two registers are updated upon completion of each ADC conversion. Table 6 shows some values of the temperature and data. NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 8 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems Temperature data format (2’s complement) Digital output (8 bits) 0111 1111 0111 1110 0110 0100 0011 0010 0001 1001 0000 0001 0000 0000 1111 1111 1110 0111 1100 1110 1011 1111 Table 6. +127 +126 +100 +50 +25 +1 0 −1 −25 −50 −65 Temperature (°C) 8.3.4 Conversion rate register The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in standard free-running auto-convert mode. Table 7 shows all applicable data and rates for the device. Only three LSB bits of the register are used and other bits are reserved for future use. This register can be written to and read back over the SMBus using commands of the registers named WCR and RCR, respectively. The POR default conversion data is 02h (0.25 Hz). Notice that the average supply current, as well as the device power consumption, is increased with the conversion rate. Table 7. Data 00h 01h 02h 03h 04h 05h 06h 07h 08h to FFh Conversion rate control byte Conversion rate (Hz) 0.0625 0.125 0.25 0.5 1 2 4 8 (reserved) Average supply current (µA typical at VDD = 3.3 V) 67 68 70 75 80 95 125 180 n/a 8.3.5 Temperature limit registers The device has four registers to be used for storing programmable temperature limits, including the high limit and the low limit for each channel of the external and internal diodes. Data of the temperature register (RIT and RET) for each channel are compared with the contents of the temperature limit registers of the same channel, resulting in alarm conditions. If measured temperature either equals or exceeds the corresponding temperature limits, an Alert interrupt is asserted and the corresponding flag bit in the status register is set. The temperature limit registers can be written to and read back using NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 9 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems commands of registers named WIHL, WILL, WEHL, WELL, RIHL, RILL, REHL, RELL, accordingly. The POR default values are +127 °C (0111 1111) for the HIGH limit and −55 °C (1100 1001) for the LOW limit. 8.3.6 One-shot command The one-shot command is not actually a data register as such and a write operation to it will initiate an ADC conversion. The send byte format of the SMBus, as described later, with the use of OSHT command (0Fh), is used for this writing operation. In normal free-running-conversion operation mode of the device, a one-shot command immediately forces a new conversion cycle to begin. However, if a conversion is in progress when a one-shot command is received, the command is ignored. In software standby mode the one-shot command generates a single conversion and comparison cycle and then puts the device back in its standby mode after the conversion. In hardware standby mode, the one shot is inhibited. 8.3.7 Status register The content of the status register reflects condition status resulting from all of these activities: comparisons between temperature measurements and temperature limits, the status of ADC conversion, and the hardware condition of the connection of external diode to the device. Bit assignments and bit functions of this register are listed in Table 8. This register can only be read using the command of register named RS. Upon POR, the status of all flag bits are reset to zero. The status byte is cleared by any successful read of the status register unless the fault condition persists. Notice that any one of the fault conditions, except the conversion busy, also introduces an Alert interrupt to the SMBus that will be described in Section 8.3.8. Also, whenever a one-shot command is executed, the status byte should be read after the conversion is completed, which is about 170 ms after the one-shot command is sent. Table 8. Bit 7 (MSB) 6 5 4 3 2 1 to 0 [1] [2] Status register bit assignment Symbol BUSY IHLF[1] ILLF[1] EHLF[1] ELLF[1] OPEN[2] POR state n/a 0 0 0 0 0 0 Function HIGH when the ADC is busy converting HIGH when the internal temperature high limit has tripped HIGH when the internal temperature low limit has tripped HIGH when the external temperature high limit has tripped HIGH when the external temperature low limit has tripped HIGH when the external diode is opened reserved These flags stay HIGH until the status register is read or POR is activated. This flag stays HIGH until POR is activated. 8.3.8 Alert interrupt The ALERT output is used to signal Alert interruption from the device to the SMBus and is active LOW. Because this output is an open-drain output, a pull-up resistor (10 kΩ typical) to VDD is required, and slave devices can share a common interrupt line on the same SMBus. An Alert interrupt is asserted by the device whenever any one of the fault conditions, as described in Section 8.3.7 “Status register”, occurs: measured temperature equals or exceeds corresponding temp limits, the remote diode is physically disconnected from the device pins. Alert interrupt signal is latched and can only be cleared by reading NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 10 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems the Alert Response byte from the Alert Response Address, which is a special slave address to the SMBus. The ALERT output cannot be reset by reading the device status register. The device was designed to accommodate the Alert interrupt detection capability of the SMBus.1 Basically, the SMBus provides Alert response interrupt pointers in order to identify the slave device which has caused the Alert interrupt. The 7-bit Alert response slave address is 0001 100 and the Alert response byte reflects the slave address of the device which has caused Alert interrupt. Bit assignments of the Alert response byte are listed in Table 9. The ALERT output will be reset to HIGH state upon reading the Alert response slave address unless the fault condition persists. Table 9. Bit 7 (MSB) 6 5 4 3 2 1 0 (LSB) Alert response (Alert response address 0001 100) bit description Symbol ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 1 Description indicate address B6 of alerted device indicate address B5 of alerted device indicate address B4 of alerted device indicate address B3 of alerted device indicate address B2 of alerted device indicate address B1 of alerted device indicate address B0 of alerted device logic 1 8.4 Power-up default condition Upon power-up reset (power is switched off-on), the NE1617A goes into this default condition: • Interrupt latch is cleared, the ALERT output is pulled HIGH by the external pull-up resistor. • The auto-conversion rate is at 0.25 Hz; conversion rate data is 02h. • Temperature limits for both channels are +127 °C for high limit, and −55 °C for low limit. • Command pointer register is set to ‘00’ for quickly reading the RIT. 8.5 Fault detection The NE1617A has a fault detector to the diode connection. The connection is checked when a conversion is initiated and the proper flags are set if the fault condition has occurred. Table 10. D+ and D− opened shorted Fault detection ALERT output LOW LOW RET data storage 127 °C 127 °C Status set flag B2 and B4 B4 1. The NE1617A implements the collision arbitration function per System Management Bus Specification Revision 1.1, dated December 11, 1998, which conforms to standard I2C-bus arbitration as described in NXP document UM10204, “I2C-bus specification and user manual”. © NXP B.V. 2009. All rights reserved. NE1617A_4 Product data sheet Rev. 04 — 30 July 2009 11 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 8.6 SMBus interface The device can communicate over a standard 2-wire serial interface System Management Bus (SMBus) using the device pins SCLK and SDATA. The device employs four standard SMBus protocols: write byte, read byte, send byte and receive byte. Data formats of those protocols are shown in Figure 3 with following notifications: • The SMBus master initiates data transfer by establishing a START condition (S) and terminates data transfer by generating a STOP condition (P). • Data is sent over the serial bus in sequence of 9 clock pulses according to each 8-bit data byte followed by 1-bit status of the device acknowledgement. • • • • The 7-bit slave address is equivalent to the selected address of the device. The command byte is equivalent to the selected command of the device register. The ‘send byte’ format is often used for the one-shot conversion command. The ‘receive byte’ format is used for quicker transfer data from a device reading register that was previously selected by a read byte format. address S 7 bits device address 0 R/W ACK command 8 bits device register ACK data 8 bits to register ACK P STOP condition 002aad523 START condition acknowledged by device acknowledged by device acknowledged by device a. Write byte format (for writing data byte to the device register) address S 7 bits device address 0 R/W ACK command 8 bits device register acknowledged by device acknowledged by device ACK S address 7 bits device address 1 R/W ACK data 8 bits from register acknowledged by device not acknowledged by controller NACK P STOP condition 002aad524 START condition (re)START condition b. Read byte format (for reading data byte from the device register) address S 7 bits device address 0 R/W ACK command 8 bits device register acknowledged by device acknowledged by device ACK P STOP condition 002aad525 START condition c. Send byte format (for sending command without data, such as one-shot command) address S 7 bits device address 1 R/W ACK data 8 bits from register acknowledged by device NACK P START condition not STOP acknowledged condition by controller 002aad526 d. Receive byte format (for continuously reading from device register) Fig 3. NE1617A_4 SMBus programming format © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 12 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 9. Application design-in information 0.1 µF VDD 2 VDD 15 STBY R 10 kΩ R 10 kΩ R 10 kΩ NE1617A 3 C1(1) 2200 pF D+ D− SCLK SDATA ALERT 14 12 11 clock data microcontroller interrupt 4 remote sensor 2N3904 (NPN), 2N3906 (PNP) or similar stand-alone ASIC or processor thermal diode ADD0 ADD1 GND 10 6 7 GND 8 002aad511 (1) Typical value, placed close to temperature sensor. Fig 4. Typical application circuit 9.1 How do D+, D− work? The NE1617A forces two well-controlled current sources of about 10 µA and 100 µA measures the remote diode VBE. The diode-controlled PNP transistor provided on the microprocessor is typically used, or the discrete diode-connected transistor 2N3904 or 2N3906. Please refer to Section 7.1 “Remote diode selection”. 9.2 What is the difference using diode and transistor? Traditional 2-pin diode has different characteristic and has fairly high series resistance that will not work with the NE1617A. The NE1617A works with diode connected transistor, which has lower series resistance. Furthermore, the non-ideality factor is different for different diode-connected transistors because of process differences. Therefore, in order to achieve the specified accuracy, you must use either 2N3904 or 2N3906 discrete diode-connected transistor. 9.3 How is error reduced when necessary to use a wire instead of the PCB trace? A shielded twisted pair cable is recommended (see Figure 16). The NE1617A guarantees temperature error of ±3 °C and ±5 °C from 0 °C to 100 °C and from 0 °C to 120 °C, respectively, on the remote diode. If higher accuracy is needed, use the newer SA56004, which has a temp error of ±1 °C on the remote diode. NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 13 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 10. Limiting values Table 11. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD VI supply voltage input voltage Conditions VDD to GND D+, ADD0, ADD1 D− to GND SCLK, SDATA, ALERT, STBY II Tamb Tj(max) Tstg input current ambient temperature maximum junction temperature storage temperature SDATA D− operating Min −0.3 −0.3 −0.3 −0.3 −1 −55 −65 Max +6 VDD + 0.3 +0.8 +6 +50 ±1 +125 +150 +150 Unit V V V V mA mA °C °C °C NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 14 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 11. Characteristics Table 12. Characteristics VDD = 3.0 V to 3.6 V; Tamb = 0 °C to +125 °C; unless otherwise specified. Symbol Tres Tacc(loc) Tacc(rem) Vth(UVLO) Vth(POR) IDD(AV) IDD(stb) tconv Ef(conv) Isource Parameter temperature resolution local temperature accuracy remote temperature accuracy Tamb = +60 °C to +100 °C Tamb = 0 °C to +125 °C Tremote = +60 °C to +100 °C Tremote = −40 °C to +125 °C undervoltage lockout threshold VDD voltage[1] power-on reset threshold voltage average supply current standby supply current conversion time conversion rate error source current supply[2] Conditions Min 1 1.0 −30 Typ < ±1 < ±2 2.7 3 Max ±2 ±3 ±3 ±5 2.95 2.5 70 180 10 170 +30 Unit °C °C °C °C °C V V µA µA µA ms % VDD supply (falling edge)[3] conversion rate = 0.25 per second conversion rate = 2 per second SMBus inactive from STOP bit to conversion complete; both channels percentage error in programmed rate remote sensor HIGH level LOW level [4][5] 100 10 160 - µA µA µA Ibias bias current ADD0, ADD1; momentary as the address is being read - [1] The value of VDD below which the internal A/D converter is disabled. This is designed to be a minimum of 200 mV above the power-on reset. During the time that it is disabled, the temperature that is in the ‘read temperature registers’ will remain at the value that it was before the ADC was disabled. This is done to eliminate the possibility of reading unexpected false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising VDD), the reading that is stored in the ‘read temperature registers’ will be the default value of 0 °C. As soon as VDD has risen to the value of UVLO, the ADC will function correctly and normal temperatures will be read. VDD (rising edge) voltage below which the ADC is disabled. VDD (falling edge) voltage below which the logic is reset. Address is read at power-up and at start of conversion for all conversions except the fastest rate. Due to the bias current, any pull-up/pull-down resistors should be ≤ 2 kΩ. [2] [3] [4] [5] NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 15 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems Table 13. Characteristics VDD = 3.3 V; Tamb = −40 °C to +125 °C; unless otherwise specified.[1] Symbol Tres Tacc(loc) Tacc(rem) VDD tconv Ef(conv) Parameter temperature resolution local temperature accuracy[3] Conditions monotonicity guaranteed Tamb = +60 °C to +100 °C Tamb = −40 °C to +125 °C remote temperature accuracy[3] supply voltage conversion time conversion rate error from STOP bit to conversion complete; both channels percentage error in programmed rate STBY, SCLK, SDATA VDD = 3 V VDD = 5.5 V VIL Isink ILOH II [1] [2] [3] [2] Min 8 [4] [4] Typ < ±1 < ±2 125 - Max ±2 ±3 ±3 ±5 5.5 156 +25 Unit bits °C °C °C °C V ms % ADC and power supply Tremote = +60 °C to +100 °C Tremote = −40 °C to +125 °C 3.0 −25 SMBus interface VIH HIGH-level input voltage 2.2 2.4 6 −2 0.8 1 +2 V V V mA µA µA LOW-level input voltage sink current HIGH-level output leakage current input current STBY, SCLK, SDATA; VDD = 3 V to 5.5 V logic output LOW; ALERT, SDATA forced to 0.4 V ALERT; forced to 5.5 V logic inputs forced to VDD or GND Specifications from −40 °C to +125 °C are guaranteed by design, not production tested. Guaranteed but not 100 % tested. Quantization error is not included in specifications for temperature accuracy. For example, if the NE1617A device temperature is exactly +66.7 °C, the ADC may report +66 °C, +67 °C or +68 °C (due to the quantization error plus the −0.5 °C offset used for rounding up) and still be within the guaranteed ±1 °C error limits for the +60 °C to +100 °C temperature range. Tremote is the junction temperature of the remote diode. See Section 7.1 “Remote diode selection” for remote diode forward voltage requirements. [4] NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 16 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems Table 14. SMBus interface dynamic characteristics[1] VDD = 3.0 V to 3.6 V; Tamb = 0 °C to +125 °C; unless otherwise specified.[2] Symbol VIH VIL IOL IIH IIL Ci fSCLK tLOW tHIGH tBUF tHD;STA tHD;DAT tSU;DAT tSU;STA tSU;STO tf [1] [2] Parameter HIGH-level input voltage LOW-level input voltage logic output LOW sink current HIGH-level input current LOW-level input current input capacitance SCLK operating frequency SCLK LOW time SCLK HIGH time bus free time between a STOP and START condition hold time (repeated) START condition data hold time data set-up time set-up time for a repeated START condition set-up time for STOP condition fall time Conditions STBY, SCLK, SDATA STBY, SCLK, SDATA ALERT; VOL = 0.4 V SDATA; VOL = 0.6 V VI = VDD VI = GND SCLK, SDATA Min 2.2 1.0 6.0 −1 −1 0 4.7 4.0 Typ 5 5.0 5.0 - Max 0.8 +1 +1 100 1.0 Unit V V mA mA µA µA pF kHz µs µs µs µs ns ns ns µs µs from SDATA STOP to SDATA START from SDATA START to first SCLK HIGH-to-LOW transition from SCLK HIGH-to-LOW transition to SDATA edges from SDATA edges to SCLK LOW-to-HIGH transition from SCLK LOW-to-HIGH transition to restart SDATA from SCLK LOW-to-HIGH transition to SDATA STOP condition SCLK and SDATA signals 4.7 4.0 0 250 250 4.0 - The NE1617A does not include the SMBus time-out capability (tLOW;SEXT and tLOW;MEXT). Device operation between 3.0 V and 5.5 V is allowed, but parameters may be outside the limit shown in this table. tLOW SCLK tHD;STA tHD;DAT SDATA tBUF P S tr tf tHD;STA tHIGH tSU;DAT tSU;STA tSU;STO S P 002aae777 Fig 5. Timing measurements NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 17 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 11.1 Typical performance curves 20 temp. error (°C) 10 D+ to GND 002aab749 6 temp. error (°C) 2 002aab747 0 −2 −10 D+ to VDD −20 1 102 10 leakage resistance (MΩ) −6 1 10 102 103 f (kHz) 104 VI = 100 mVpp and AC-coupled to D− Fig 6. Temperature error versus printed-circuit board leakage resistance 6 002aab748 Fig 7. Temperature error versus common-mode noise frequency 10 002aab750 temp. error (°C) 2 temp. error (°C) 0 −2 −10 −6 1 10 102 103 f (kHz) 104 −20 0 40 80 120 D+ to D− capacitance (nF) VI = 100 mVpp and AC-coupled to D− and D+ Fig 8. Temperature error versus differential mode noise frequency Fig 9. Temperature error versus D+ to D− capacitance NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 18 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 100 IDD(stb) (µA) 80 002aad517 130 IDD (µA) 110 002aad518 60 90 40 70 20 0 1 10 102 fSCLK (kHz) 103 50 10−2 10−1 1 10 conversion rate (kHz) Fig 10. Standby supply current versus clock frequency at VDD = 3.3 V 150 temperature (°C) 100 Fig 11. Operating supply current versus conversion rate at VDD = 3.3 V 002aad519 50 0 0 2 6 time (s) 10 Fig 12. Response to thermal shock immersed in +115 °C fluorinert bath NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 19 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 12. Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1 D E A X c y HE vM A Z 16 9 A2 A1 (A 3) θ Lp L 1 e bp 8 wM detail X A 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.73 A1 0.25 0.10 A2 1.55 1.40 A3 0.25 bp 0.31 0.20 c 0.25 0.18 D (1) 5.0 4.8 E (1) 4.0 3.8 e 0.635 HE 6.2 5.8 L 1 Lp 0.89 0.41 v 0.2 w 0.18 y 0.09 Z (1) 0.18 0.05 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT519-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-05-04 03-02-18 Fig 13. Package outline SOT519-1 (SSOP16) NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 20 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 21 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 14) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 15 and 16 Table 15. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 16. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 14. NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 22 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 14. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Mounting 14.1 Printed-circuit board layout consideration Because the NE1617A is used to measure a very small voltage in the range of microvolts from the remote sensor, care must be taken to minimize noise induced at the sensor inputs, especially in the computer motherboard noisy environment. The following precautions should be considered: • Place the NE1617A as close as possible to the remote sensor. It can be from 4 inches to 8 inches, as long as the worst noise sources such as clock generator, data and address buses, CRTs are avoided. • Route the D+ and D− lines in parallel and close together with ground guards enclosed (refer to Figure 15). • Leakage currents due to printed-circuit board contamination could affect the temperature accuracy and must be considered. Error can be introduced by the leakage current as shown on the characteristics curve Figure 6 “Temperature error versus printed-circuit board leakage resistance”. • Use wide tracks to reduce inductance and noise pickup that may be introduced by narrow ones. The width of 10 mil and space of 10 mil are recommended. • Place a bypass capacitor of 0.1 µF close to the VDD pin and an input filter capacitor of 2200 pF close to the D+ and D− pins. • If the remote sensor is operating in a noisy environment and located several feet away from the NE1617A, a shielded twisted pair cable is recommended. Make sure the shield of the cable is connected to the NE1617A ground pin (GND), and leave the shield at the remote end unconnected. Shield connecting to ground of both ends NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 23 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems could create a ground loop (refer to Figure 16) and defeat the purpose of the shielded cable. Also, cold soldered joints and damaged cable could introduce series resistance and result in measurement error. For instance, a 1 Ω resistance can introduce a change of temperature of about 0.5 °C. shielded twisted pair GND D+ remote sensor D− GND 002aad227 002aad527 D+ NE1617A D− GND Fig 15. PCB layout for D+ and D− Fig 16. Using shielded twisted pair 15. Abbreviations Table 17. Acronym A/D ADC CDM CRT ESD HBM MM MSB PCB POR SMBus UVLO Abbreviations Description Analog-to-Digital Analog-to-Digital Converter Charged-Device Model Cathode Ray Tube ElectroStatic Discharge Human Body Model Machine Model Most Significant Bit Printed-Circuit Board Power-On Reset System Management Bus UnderVoltage LockOut NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 24 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 16. Revision history Table 18. Revision history Release date 20090730 Data sheet status Product data sheet Change notice Supersedes NE1617A_3 Document ID NE1617A_4 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 2 “Features”: – 3rd bullet item: changed temperature range from “0 °C to 125 °C” to “−40 °C to 125 °C” – 4th bullet item: changed temperature range from “0 °C to 125 °C” to “−40 °C to 125 °C” • • • Table 1 “Ordering information”: changed descriptive line below table title from “Tamb = 0 °C to +125 °C” to “Tamb = −40 °C to +125 °C” Table 7 “Conversion rate control byte”: added average supply current values in 3rd column Table 8 “Status register bit assignment”, Bit 2: – removed reference to Table note [1] – added new Table note [2] and its reference • • • • Added Section 9.1 Added Section 9.2 Added Section 9.3 Table 11 “Limiting values”: – added Symbols and modified Parameter definitions – changed Tamb Min value from “0 °C” to “−55 °C” • Table 12 “Characteristics”: – updated Parameter descriptions to align with new presentation standards – Condition for ‘remote temperature accuracy’ changed from “Tremote = 0 °C to 125 °C” to “Tremote = −40 °C to +125 °C” • NE1617A_3 (9397 750 14162) NE1617A_2 (9397 750 09273) NE1617A_1 (9397 750 07322) Added (new) Table 13 “Characteristics” Product data sheet Product specification Product specification ECN 853-2203 27461 of 14 Dec 2001 ECN 853-2203 24123 of 13 Jul 2000 NE1617A_2 NE1617A_1 - 20041005 20011214 20000713 NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 25 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 17. Legal information 17.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NE1617A_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 30 July 2009 26 of 27 NXP Semiconductors NE1617A Temperature monitor for microprocessor systems 19. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.3.5 8.3.6 8.3.7 8.3.8 8.4 8.5 8.6 9 9.1 9.2 9.3 10 11 11.1 12 13 13.1 13.2 13.3 13.4 14 14.1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Remote diode selection . . . . . . . . . . . . . . . . . . 5 No calibration is required . . . . . . . . . . . . . . . . . 6 Address logic . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Temperature monitor with SMBus serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Low power standby modes . . . . . . . . . . . . . . . . 8 Configuration register . . . . . . . . . . . . . . . . . . . . 8 External and internal temperature registers . . . 8 Conversion rate register . . . . . . . . . . . . . . . . . . 9 Temperature limit registers . . . . . . . . . . . . . . . . 9 One-shot command . . . . . . . . . . . . . . . . . . . . 10 Status register. . . . . . . . . . . . . . . . . . . . . . . . . 10 Alert interrupt . . . . . . . . . . . . . . . . . . . . . . . . . 10 Power-up default condition . . . . . . . . . . . . . . . 11 Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 11 SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 12 Application design-in information . . . . . . . . . 13 How do D+, D- work? . . . . . . . . . . . . . . . . . . . 13 What is the difference using diode and transistor? . . . . . . . . . . . . . . . . . . . . . . . . 13 How is error reduced when necessary to use a wire instead of the PCB trace? . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 Typical performance curves . . . . . . . . . . . . . . 18 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Printed-circuit board layout consideration. . . . 23 15 16 17 17.1 17.2 17.3 17.4 18 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 25 26 26 26 26 26 26 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 July 2009 Document identifier: NE1617A_4