NTB0102
Dual supply translating transceiver; auto direction sensing; 3state
Rev. 5.0 — 20 April 2022
1
Product data sheet
General description
The NTB0102 is a 2-bit, dual supply translating transceiver with auto direction sensing,
that enables bidirectional voltage level translation. It features two 2-bit input-output ports
(An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)).
VCC(A) can be supplied with any voltage between 1.2 V and 3.6 V and VCC(B) can be
supplied with any voltage between 1.65 V and 5.5 V. This flexibility makes the device
suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V,
3.3 V and 5.0 V).
Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW
level at pin OE causes the outputs to assume a high-impedance OFF-state. This device
is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables
the output, preventing the damaging backflow current through the device when it is
powered down.
2
Features and benefits
• Wide supply voltage range:
– VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
• IOFF circuitry provides partial Power-down mode operation
• Inputs accept voltages up to 5.5 V
• ESD protection:
– HBM JESD22-A114E Class 2 exceeds 2500 V for A port
– HBM JESD22-A114E Class 3B exceeds 15000 V for B port
– CDM JESD22-C101E exceeds 1500 V
• Latch-up performance exceeds 100 mA per JESD 78B Class II
• Multiple package options
• Specified from -40 °C to +85 °C and -40 °C to +125 °C
3
Ordering information
Table 1. Ordering information
Type number
Topside
marking
Package
Name
Description
NTB0102DP
t02
TSSOP8
plastic thin shrink small outline package; 8 leads; body width 3 mm; SOT505-2
lead length 0.5 mm
NTB0102GT
t02
XSON8
plastic extremely thin small outline package; no leads; 8 terminals;
body 1 × 1.95 × 0.5 mm
SOT833-1
NTB0102GF
t2
XSON8
extremely thin small outline package; no leads; 8 terminals; body
1.35 × 1 × 0.5 mm
SOT1089
Version
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
3.1 Ordering options
Table 2. Ordering options
Type number
Orderable part
number
Package
Packing method
NTB0102DP
NTB0102DP,125
TSSOP8
NTB0102GT
NTB0102GT,115
NTB0102GF
[1]
NTB0102GF,115
[1]
Minimum order
quantity
Temperature
REEL 7" Q3 NDP
3000
-40 °C to +125 °C
XSON8
REEL 7" Q1 NDP
5000
-40 °C to +125 °C
XSON8
REEL 7" Q1 NDP
5000
-40 °C to +125 °C
Standard packing quantities and other packaging data are available at www.nxp.com/packages/.
4
Functional diagram
6
OE
4
A2
1
B2
5
A1
8
VCC(A)
B1
VCC(B)
001aal914
Figure 1. Logic symbol
5
Pinning information
5.1 Pinning
NTB0102
NTB0102
B2
1
8
B1
GND
2
7
VCC(B)
VCC(A)
3
6
OE
A2
4
5
A1
8
B1
GND
2
7
VCC(B)
VCC(A)
3
6
OE
A2
4
5
A1
Transparent top view
Figure 2. Pin configuration SOT505-2 (TSSOP8)
Product data sheet
1
001aam485
001aam484
NTB0102
B2
Figure 3. Pin configuration SOT833-1 (XSON8) and
SOT1089 (XSON8)
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
2 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
5.2 Pin description
Table 3. Pin description
Symbol
Pin
Description
B2, B1
1, 8
data input or output (referenced to VCC(B))
GND
2
ground (0 V)
VCC(A)
3
supply voltage A
A2, A1
4, 5
data input or output (referenced to VCC(A))
OE
6
output enable input (active HIGH; referenced to VCC(A))
VCC(B)
7
supply voltage B
6
Functional description
Table 4. Function table
[1]
Supply voltage
Input
Input/output
VCC(A)
VCC(B)
OE
An
Bn
1.2 V to VCC(B)
1.65 V to 5.5 V
L
Z
Z
1.2 V to VCC(B)
1.65 V to 5.5 V
H
input or output
output or input
X
Z
Z
GND
[1]
[2]
[2]
GND
[2]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
When either VCC(A) or VCC(B) is at GND level, the device goes into Power-down mode.
7
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC(A)
supply voltage A
VCC(B)
supply voltage B
VI
Conditions
output voltage
Active mode
input clamping current
VI < 0 V
IOK
output clamping current
VO < 0 V
IO
output current
VO = 0 V to VCCO
ICC
supply current
ICC(A) or ICC(B)
IGND
ground current
Tstg
storage temperature
Ptot
[1]
[2]
[3]
total power dissipation
Unit
-0.5
+6.5
V
-0.5
+6.5
V
-0.5
+6.5
V
[1][2][3]
-0.5
VCCO + 0.5
V
[1]
-0.5
+6.5
V
-50
-
mA
-50
-
mA
-
±50
mA
-
100
mA
-100
-
mA
-65
+150
°C
-
250
mW
Power-down or 3-state mode
IIK
Max
[1]
input voltage
VO
Min
Tamb = -40 °C to +125 °C
[2]
[4]
The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.
VCCO is the supply voltage associated with the output.
VCCO + 0.5 V should not exceed 6.5 V.
NTB0102
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
3 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[4]
For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For XSON8 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
8
Recommended operating conditions
Table 6. Recommended operating conditions
Symbol
Parameter
VCC(A)
[1][2]
Conditions
Min
Max
Unit
supply voltage A
1.2
3.6
V
VCC(B)
supply voltage B
1.65
5.5
V
VI
input voltage
0
5.5
V
VO
output voltage
A port
0
3.6
V
B port
0
5.5
V
-40
+125
°C
-
40
ns/V
Power-down or 3-state mode;
VCC(A) = 1.2 V to 3.6 V; VCC(B)
= 1.65 V to 5.5 V
Tamb
ambient temperature
Δt/ΔV
input transition rise and fall rate
[1]
[2]
VCC(A) = 1.2 V to 3.6 V; VCC(B)
= 1.65 V to 5.5 V
The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND.
VCC(A) must be less than or equal to VCC(B).
9
Static characteristics
Table 7. Typical static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VOH
HIGH-level
output voltage
A port; VCC(A) = 1.2 V; IO = -20 μA
-
1.1
-
V
VOL
LOW-level
output voltage
A port; VCC(A) = 1.2 V; IO = 20 μA
-
0.09
-
V
II
input leakage
current
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.2 V to 3.6 V; VCC(B) =
1.65 V to 5.5 V
-
-
±1
μA
IOZ
OFF-state output A or B port; VO = 0 V to VCCO; VCC(A) = 1.2 V to 3.6 V;
current
VCC(B) = 1.65 V to 5.5 V
-
-
±1
μA
IOFF
power-off
leakage current
A port; VI or VO = 0 V to 3.6 V; VCC(A) = 0 V; VCC(B) = 0 V to
5.5 V
-
-
±1
μA
B port; VI or VO = 0 V to 5.5 V; VCC(B) = 0 V; VCC(A) = 0 V to
3.6 V
-
-
±1
μA
ICC(A); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
-
0.05
-
μA
ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
-
3.3
-
μA
ICC(A) + ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V
-
3.5
-
μA
OE input; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
1.0
-
pF
ICC
CI
supply current
input
capacitance
NTB0102
Product data sheet
VI = 0 V or VCCI; IO = 0 A
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Rev. 5.0 — 20 April 2022
[1]
[2]
© NXP B.V. 2022. All rights reserved.
4 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 7. Typical static characteristics...continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
CI/O
A port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
4.0
-
pF
B port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V
-
7.5
-
pF
[1]
[2]
input/output
capacitance
VCCO is the supply voltage associated with the output.
VCCI is the supply voltage associated with the input.
Table 8. Typical supply current
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
VCC(A)
VCC(B)
1.8 V
Unit
2.5 V
3.3 V
5.0 V
ICC(A)
ICC(B)
ICC(A)
ICC(B)
ICC(A)
ICC(B)
ICC(A)
ICC(B)
1.2 V
10
10
10
10
10
20
10
1050
nA
1.5 V
10
10
10
10
10
10
10
650
nA
1.8 V
10
10
10
10
10
10
10
350
nA
2.5 V
-
-
10
10
10
10
10
40
nA
3.3 V
-
-
-
-
10
10
10
10
nA
Table 9. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
VIL
VOH
Conditions
-40 °C to +85 °C
II
Min
Max
Min
Max
0.65VCCI
-
0.65VCCI
-
V
-
0.35VCCI
-
0.35VCCI
V
VCCO - 0.4
-
VCCO - 0.4
-
V
VCCO - 0.4
-
VCCO - 0.4
-
V
-
0.4
-
0.4
V
B port; VCC(B) = 1.65 V to 5.5 V
-
0.4
-
0.4
V
OE input; VI = 0 V to 3.6 V; VCC(A)
= 1.2 V to 3.6 V; VCC(B) = 1.65 V to
5.5 V
-
±2
-
±5
μA
HIGH-level
input voltage
A or B port and OE input
LOW-level
input voltage
A or B port and OE input
VCC(A) = 1.2 V to 3.6 V; VCC(B)
= 1.65 V to 5.5 V
[1]
VCC(A) = 1.2 V to 3.6 V; VCC(B)
= 1.65 V to 5.5 V
IO = -20 μA
HIGH-level
output voltage
A port; VCC(A) = 1.4 V to 3.6 V
IO = 20 μA
LOW-level
output voltage
A port; VCC(A) = 1.4 V to 3.6 V
input leakage
current
NTB0102
Product data sheet
Unit
[1]
[2]
B port; VCC(B) = 1.65 V to 5.5 V
VOL
-40 °C to +125 °C
[2]
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
5 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Table 9. Static characteristics...continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
-40 °C to +85 °C
[2]
-40 °C to +125 °C
Unit
Min
Max
Min
Max
-
±2
-
±10
μA
IOZ
OFF-state
output current
A or B port; VO = 0 V or VCCO;
VCC(A) = 1.2 V to 3.6 V; VCC(B) =
1.65 V to 5.5 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
±2
-
±10
μA
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
±2
-
±10
μA
OE = LOW; VCC(A) = 1.4 V to
3.6 V; VCC(B) = 1.65 V to 5.5 V
-
3
-
15
μA
OE = HIGH; VCC(A) = 1.4 V to
3.6 V; VCC(B) = 1.65 V to 5.5 V
-
3
-
20
μA
VCC(A) = 3.6 V; VCC(B) = 0 V
-
2
-
15
μA
VCC(A) = 0 V; VCC(B) = 5.5 V
-
-2
-
-15
μA
OE = LOW; VCC(A) = 1.4 V to
3.6 V; VCC(B) = 1.65 V to 5.5 V
-
5
-
15
μA
OE = HIGH; VCC(A) = 1.4 V to
3.6 V; VCC(B) = 1.65 V to 5.5 V
-
5
-
20
μA
VCC(A) = 3.6 V; VCC(B) = 0 V
-
-2
-
-15
μA
VCC(A) = 0 V; VCC(B) = 5.5 V
-
2
-
15
μA
-
8
-
40
μA
supply current VI = 0 V or VCCI; IO = 0 A
ICC
[1]
ICC(A)
ICC(B)
ICC(A) + ICC(B)
VCC(A) = 1.4 V to 3.6 V; VCC(B)
= 1.65 V to 5.5 V
[1]
[2]
VCCI is the supply voltage associated with the input.
VCCO is the supply voltage associated with the output.
10 Dynamic characteristics
[1]
Table 10. Typical dynamic characteristics for temperature 25 °C
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for waveforms see Figure 4 and Figure 5.
Symbol
Parameter
Conditions
VCC(B)
Unit
1.8 V
2.5 V
3.3 V
5.0 V
A to B
5.9
4.8
4.4
4.2
ns
B to A
5.6
4.8
4.5
4.4
ns
0.5
0.5
0.5
0.5
μs
6.9
6.9
6.9
6.9
ns
VCC(A) = 1.2 V; Tamb = 25 °C
tpd
ten
tdis
propagation delay
enable time
disable time
NTB0102
Product data sheet
OE to A, B
OE to A; no external load
[2]
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
6 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
Table 10. Typical dynamic characteristics for temperature 25 °C ...continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for waveforms see Figure 4 and Figure 5.
Symbol
Parameter
Conditions
VCC(B)
1.8 V
2.5 V
3.3 V
5.0 V
9.5
8.6
8.5
8.0
ns
OE to A
81
69
83
68
ns
OE to B
81
69
83
68
ns
A port
4.0
4.0
4.1
4.1
ns
2.6
2.0
1.7
1.4
ns
0.2
0.2
0.2
0.2
ns
15
13
13
13
ns
70
80
80
80
Mbps
[2]
OE to B; no external load
tt
transition time
B port
tsk(o)
output skew time
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
[2]
[3]
Unit
[3]
tpd is the same as tPLH and tPHL; ten is the same as tPZL and tPZH; tdis is the same as tPLZ and tPHZ; tt is the same as tTHL and tTLH
Delay between OE going LOW and when the outputs are actually disabled.
Skew between any two outputs of the same package switching in the same direction.
[1]
Table 11. Dynamic characteristics for temperature range -40 °C to +85 °C
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.5 V ± 0.1 V
tpd
ten
tdis
tt
propagation
delay
A to B
1.4
12.9
1.2
10.1
1.1
10.0
0.8
9.9
B to A
0.9
14.2
0.7
12.0
0.4
11.7
0.3
13.7 ns
enable time
OE to A, B
disable time
transition
time
-
1.0
-
1.0
-
1.0
-
OE to A; no external load
[2]
1.0
11.9
1.0
11.9
1.0
11.9
1.0
11.9 ns
OE to B; no external load
[2]
1.0
16.9
1.0
15.2
1.0
14.1
1.0
13.8 ns
OE to A
-
320
-
260
-
260
-
280
ns
OE to B
-
200
-
200
-
200
-
200
ns
0.9
5.1
0.9
5.1
0.9
5.1
0.9
5.1
ns
0.9
4.7
0.6
3.2
0.5
2.5
0.4
2.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
25
-
25
-
25
-
25
-
ns
-
40
-
40
-
40
-
40
Mbps
A to B
1.6
11.0
1.4
7.7
1.3
6.8
1.2
6.5
ns
B to A
1.5
12.0
1.3
8.4
1.0
7.6
0.9
7.1
ns
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
1.0
ns
μs
VCC(A) = 1.8 V ± 0.15 V
tpd
propagation
delay
NTB0102
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
7 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
Table 11. Dynamic characteristics for temperature range -40 °C to +85 °C ...continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
ten
tdis
tt
enable time
disable time
transition
time
OE to A, B
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
1.0
-
1.0
-
1.0
-
1.0
-
OE to A; no external load
[2]
1.0
11.0
1.0
11.0
1.0
11.0
1.0
11.0 ns
OE to B; no external load
[2]
1.0
15.4
1.0
13.5
1.0
12.4
1.0
12.1 ns
OE to A
-
260
-
230
-
230
-
230
ns
OE to B
-
200
-
200
-
200
-
200
ns
0.8
4.1
0.8
4.1
0.8
4.1
0.8
4.1
ns
0.9
4.7
0.6
3.2
0.5
2.5
0.4
2.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
20
-
17
-
17
-
17
-
ns
-
49
-
60
-
60
-
60
Mbps
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
μs
VCC(A) = 2.5 V ± 0.2 V
propagation
delay
A to B
-
-
1.1
6.3
1.0
5.2
0.9
4.7
ns
B to A
-
-
1.2
6.6
1.1
5.1
0.9
4.4
ns
ten
enable time
OE to A, B
-
-
-
1.0
-
1.0
-
1.0
μs
tdis
disable time
OE to A; no external load
[2]
-
-
1.0
9.2
1.0
9.2
1.0
9.2
ns
OE to B; no external load
[2]
-
-
1.0
11.9
1.0
10.7
1.0
10.2 ns
OE to A
-
-
-
200
-
200
-
200
ns
OE to B
-
-
-
200
-
200
-
200
ns
A port
-
-
0.7
3.0
0.7
3.0
0.7
3.0
ns
-
-
0.7
3.2
0.5
2.5
0.4
2.7
ns
-
-
-
0.5
-
0.5
-
0.5
ns
-
-
12
-
10
-
10
-
ns
-
-
-
85
-
100
-
100
Mbps
tpd
tt
transition
time
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
VCC(A) = 3.3 V ± 0.3 V
tpd
ten
tdis
propagation
delay
A to B
-
-
-
-
0.9
4.7
0.8
4.0
ns
B to A
-
-
-
-
1.0
4.9
0.9
3.8
ns
enable time
OE to A, B
disable time
NTB0102
Product data sheet
-
-
-
-
-
1.0
-
1.0
μs
OE to A; no external load
[2]
-
-
-
-
1.0
9.2
1.0
9.2
ns
OE to B; no external load
[2]
-
-
-
-
1.0
10.1
1.0
9.6
ns
OE to A
-
-
-
-
-
260
-
260
ns
OE to B
-
-
-
-
-
200
-
200
ns
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
8 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
Table 11. Dynamic characteristics for temperature range -40 °C to +85 °C ...continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
tt
transition
time
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
[2]
[3]
[3]
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
-
-
-
-
0.7
2.5
0.7
2.5
ns
-
-
-
-
0.5
2.5
0.4
2.7
ns
-
-
-
-
-
0.5
-
0.5
ns
-
-
-
-
10
-
10
-
ns
-
-
-
-
-
100
-
100
Mbps
tpd is the same as tPLH and tPHL; ten is the same as tPZL and tPZH; tdis is the same as tPLZ and tPHZ; tt is the same as tTHL and tTLH
Delay between OE going LOW and when the outputs are actually disabled.
Skew between any two outputs of the same package switching in the same direction.
[1]
Table 12. Dynamic characteristics for temperature range -40 °C to +125 °C
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
VCC(A) = 1.5 V ± 0.1 V
tpd
ten
tdis
tt
propagation
delay
A to B
1.4
15.9
1.2
13.1
1.1
13.0
0.8
12.9 ns
B to A
0.9
17.2
0.7
15.0
0.4
14.7
0.3
16.7 ns
enable time
OE to A, B
disable time
transition
time
-
1.0
-
1.0
-
1.0
-
OE to A; no external load
[2]
1.0
12.5
1.0
12.5
1.0
12.5
1.0
12.5 ns
OE to B; no external load
[2]
1.0
18.1
1.0
16.2
1.0
14.9
1.0
14.6 ns
OE to A
-
340
-
280
-
280
-
300
ns
OE to B
-
220
-
220
-
220
-
220
ns
0.9
7.1
0.9
7.1
0.9
7.1
0.9
7.1
ns
0.9
6.5
0.6
5.2
0.5
4.8
0.4
4.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
25
-
25
-
25
-
25
-
ns
-
40
-
40
-
40
-
40
Mbps
ns
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
1.0
μs
VCC(A) = 1.8 V ± 0.15 V
tpd
ten
propagation
delay
A to B
1.6
14.0
1.4
10.7
1.3
9.8
1.2
9.5
B to A
1.5
15.0
1.3
11.4
1.0
10.6
0.9
10.1 ns
enable time
OE to A, B
-
1.0
-
1.0
-
1.0
-
NTB0102
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
1.0
μs
© NXP B.V. 2022. All rights reserved.
9 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
Table 12. Dynamic characteristics for temperature range -40 °C to +125 °C ...continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
tdis
tt
disable time
transition
time
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
OE to A; no external load
[2]
1.0
11.5
1.0
11.5
1.0
11.5
1.0
11.5 ns
OE to B; no external load
[2]
1.0
16.5
1.0
14.5
1.0
13.3
1.0
12.7 ns
OE to A
-
280
-
250
-
250
-
250
ns
OE to B
-
220
-
220
-
220
-
220
ns
0.8
6.2
0.8
6.1
0.8
6.1
0.8
6.1
ns
0.9
5.8
0.6
5.2
0.5
4.8
0.4
4.7
ns
-
0.5
-
0.5
-
0.5
-
0.5
ns
22
-
19
-
19
-
19
-
ns
-
45
-
55
-
55
-
55
Mbps
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[3]
VCC(A) = 2.5 V ± 0.2 V
tpd
ten
propagation
delay
A to B
-
-
1.1
9.3
1.0
8.2
0.9
7.7
ns
B to A
-
-
1.2
9.6
1.1
8.1
0.9
7.4
ns
enable time
OE to A, B
-
-
-
1.0
-
1.0
-
1.0
μs
OE to A; no external load
[2]
-
-
1.0
9.6
1.0
9.6
1.0
9.6
ns
OE to B; no external load
[2]
-
-
1.0
12.6
1.0
11.4
1.0
10.8 ns
OE to A
-
-
-
220
-
220
-
220
ns
OE to B
-
-
-
220
-
220
-
220
ns
transition
time
A port
-
-
0.7
5.0
0.7
5.0
0.7
5.0
ns
B port
-
-
0.7
4.6
0.5
4.8
0.4
4.7
ns
tsk(o)
output skew
time
between channels
-
-
-
0.5
-
0.5
-
0.5
ns
tW
pulse width
data inputs;
-
-
14
-
13
-
10
-
ns
fdata
data rate
-
-
-
75
-
80
-
100
Mbps
tdis
tt
disable time
[3]
VCC(A) = 3.3 V ± 0.3 V
tpd
ten
tdis
propagation
delay
A to B
-
-
-
-
0.9
7.7
0.8
7.0
ns
B to A
-
-
-
-
1.0
7.9
0.9
6.8
ns
enable time
OE to A, B
disable time
NTB0102
Product data sheet
-
-
-
-
-
1.0
-
1.0
μs
OE to A; no external load
[2]
-
-
-
-
1.0
9.5
1.0
9.5
ns
OE to B; no external load
[2]
-
-
-
-
1.0
10.7
1.0
9.6
ns
OE to A
-
-
-
-
-
280
-
280
ns
OE to B
-
-
-
-
-
220
-
220
ns
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
10 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
Table 12. Dynamic characteristics for temperature range -40 °C to +125 °C ...continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6; for wave forms see Figure 4 and Figure 5.
Symbol Parameter
Conditions
VCC(B)
1.8 V ± 0.15 V
tt
transition
time
A port
B port
tsk(o)
output skew
time
between channels
tW
pulse width
data inputs
fdata
data rate
[1]
[2]
[3]
[3]
2.5 V
± 0.2 V
Unit
3.3 V ± 0.3 V 5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
-
-
-
-
0.7
4.5
0.7
4.5
ns
-
-
-
-
0.5
4.1
0.4
4.7
ns
-
-
-
-
-
0.5
-
0.5
ns
-
-
-
-
10
-
10
-
ns
-
-
-
-
-
100
-
100
Mbps
tpd is the same as tPLH and tPHL; ten is the same as tPZL and tPZH; tdis is the same as tPLZ and tPHZ; tt is the same as tTHL and tTLH
Delay between OE going LOW and when the outputs are actually disabled.
Skew between any two outputs of the same package switching in the same direction.
Table 13. Typical power dissipation capacitance
[1][2]
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
VCC(A)
1.2 V
1.2 V
1.5 V
1.8 V
Unit
2.5 V
2.5 V
3.3 V
VCC(B)
1.8 V
5.0 V
1.8 V
1.8 V
2.5 V
5.0 V
3.3
V to
5.0 V
A port: (direction A to B)
5
5
5
5
5
5
5
pF
A port: (direction B to A)
8
8
8
8
8
8
8
pF
B port: (direction A to B)
18
18
18
18
18
18
18
pF
B port: (direction B to A)
13
16
12
12
12
12
13
pF
A port: (direction A to B)
0.12
0.12
0.04
0.05
0.08
0.08
0.07
pF
A port: (direction B to A)
0.01
0.01
0.01
0.01
0.01
0.01
0.01
pF
B port: (direction A to B)
0.01
0.01
0.01
0.01
0.01
0.01
0.01
pF
B port: (direction B to A)
0.07
0.09
0.07
0.07
0.05
0.09
0.09
pF
Tamb = 25 °C
CPD
power
dissipation
capacitance
outputs enabled; OE = VCC(A)
outputs disabled; OE = GND
[1]
[2]
CPD is used to determine the dynamic power dissipation (PD in μW).
2
2
PD = CPD × VCC × fi × N + Σ(CL × VCC × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
2
Σ(CL × VCC × fo) = sum of the outputs.
fi = 10 MHz; VI = GND to VCC; tr = tf = 1 ns; CL = 0 pF; RL = ∞ Ω.
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
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11 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
11 Waveforms
VI
An, Bn
input
VM
GND
tPHL
VOH
Bn, An
output
tPLH
90 %
VM
10 %
VOL
tTHL
tTLH
001aal918
Measurement points are given in Table 14.
VOL and VOH are typical output voltage levels that occur with the output load.
Figure 4. Data input (An, Bn) to data output (Bn, An) propagation delay times
VI
OE input
VM
GND
tPLZ
output
LOW-to-OFF
OFF-to-LOW
tPZL
VCCO
VM
VX
VOL
tPHZ
output
HIGH-to-OFF
OFF-to-HIGH
VOH
tPZH
VY
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal919
Measurement points are given in Table 14.
VOL and VOH are typical output voltage levels that occur with the output load.
Figure 5. Enable and disable times
Table 14. Measurement points
[1]
Supply voltage
Input
Output
VCCO
VM
VM
VX
VY
1.2 V
0.5VCCI
0.5VCCO
VOL + 0.1 V
VOH - 0.1 V
1.5 V ± 0.1 V
0.5VCCI
0.5VCCO
VOL + 0.1 V
VOH - 0.1 V
1.8 V ± 0.15 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH - 0.15 V
2.5 V ± 0.2 V
0.5VCCI
0.5VCCO
VOL + 0.15 V
VOH - 0.15 V
3.3 V ± 0.3 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH - 0.3 V
5.0 V ± 0.5 V
0.5VCCI
0.5VCCO
VOL + 0.3 V
VOH - 0.3 V
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
12 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
[1]
VCCI is the supply voltage associated with the input and VCCO is the supply voltage associated with the output.
VI
negative
pulse
tW
90 %
VM
0V
VI
positive
pulse
0V
VM
10 %
tf
tr
tr
tf
90 %
VM
VM
10 %
tW
VEXT
VCC
G
VI
RL
VO
DUT
CL
RL
001aal920
Test data is given in Table 15.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/
ns.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Figure 6. Test circuit for measuring switching times
Table 15. Test data
Supply voltage
Input
VCC(A)
[1]
VI
VCC(B)
1.2 V to 3.6 V 1.65 V to 5.5 V VCCI
[1]
[2]
[3]
Load
VEXT
Δt/ΔV
CL
[2]
RL
≤ 1.0 ns/V
15 pF
50 kΩ, 1 MΩ open
tPLH, tPHL
[3]
tPZH, tPHZ
tPZL, tPLZ
open
2VCCO
VCCI is the supply voltage associated with the input.
For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and disable times, RL =
50 kΩ.
VCCO is the supply voltage associated with the output.
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
13 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
12 Application information
12.1 Applications
Voltage level-translation applications. The NTB0102 can be used to interface between
devices or systems operating at different supply voltages. See Figure 7 for a typical
operating circuit using the NTB0102.
1.8 V
3.3 V
0.1 µF
1.8 V
SYSTEM
CONTROLLER
VCC(A)
VCC(B)
3.3 V
SYSTEM
0.1 µF
OE
NTB0102
DATA
A1
B1
A2
B2
DATA
GND
001aam487
Figure 7. Typical operating circuit
12.2 Architecture
The architecture of the NTB0102 is shown in Figure 8. The device does not require an
extra input signal to control the direction of data flow from A to B or from B to A. In a
static state, the output drivers of NTB0102 can maintain a defined output level, however,
the output architecture is designed to be weak. This design enables an external driver
to override the drivers when data on the bus starts flowing in the opposite direction.
The output of one-shot circuits detect rising or falling edges on the A or B ports. During
a rising edge, the one-shot circuits turn on the PMOS transistors (T1, T3) for a short
duration, accelerating the LOW-to-HIGH transition. Similarly, during a falling edge, the
one-shot circuits turn on the NMOS transistors (T2, T4) for a short duration, accelerating
the HIGH-to-LOW transition. During output transitions, the typical output impedance is 70
Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5.0
V.
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
14 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
VCC(A)
VCC(B)
ONE
SHOT
T1
4 kΩ
ONE
SHOT
T2
B
A
ONE
SHOT
T3
4 kΩ
T4
ONE
SHOT
001aal921
Figure 8. Architecture of NTB0102 I/O cell (one channel)
12.3 Input driver requirements
For correct operation, the device driving the data I/Os of the NTB0102 must have a
minimum drive capability of ±2 mA See Figure 9 for a plot of typical input current versus
input voltage.
II
VT/4 kΩ
VI
- (VD - VT)/4 kΩ
001aal922
VT: input threshold voltage of the NTB0102 (typically VCCI / 2).
VD: supply voltage of the external driver.
Figure 9. Typical input current versus input voltage graph
12.4 Power-up
During operation VCC(A) must never be higher than VCC(B). However, during power-up,
VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up
first. There is no special power-up sequencing required. The NTB0102 includes circuitry
that disables all output ports when either VCC(A) or VCC(B) is switched off.
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
15 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
12.5 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW causes all
I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external
load) indicates the delay between when OE goes LOW and when outputs actually
become disabled. The enable time (ten) indicates the amount of time that must be
allowed for one one-shot circuitry to become operational after OE is taken HIGH. To
ensure the high-impedance OFF-state during power-up or power-down, pin OE should
be tied to GND through a pull-down resistor. The current-sourcing capability of the driver
determines the minimum value of the resistor.
12.6 Pull-up or pull-down resistors on I/O lines
As mentioned previously the NTB0102 is designed with low static drive strength to
drive capacitive loads of up to 70 pF. To avoid output contention issues, any pull-up or
pull-down resistors used must be above 50 kΩ. For this reason, the NTB0102 is not
2
recommended for use in open-drain driver applications such as 1-Wire or I C-bus. For
these applications, the NTS0102-Q100 level translator is recommended.
NTB0102
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
16 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
13 Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
pin 1 index
(A3)
A1
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Figure 10. Package outline SOT505-2 (TSSOP8)
NTB0102
Product data sheet
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Rev. 5.0 — 20 April 2022
© NXP B.V. 2022. All rights reserved.
17 / 24
NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Figure 11. Package outline SOT833-1 (XSON8)
NTB0102
Product data sheet
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
E
terminal 1
index area
D
A
A1
detail X
(4×)(2)
e
L
(8×)(2)
b 4
5
e1
1
terminal 1
index area
8
L1
X
0
0.5
scale
Dimensions
Unit
mm
max
nom
min
1 mm
A(1)
0.5
A1
b
D
E
e
e1
L
L1
0.04 0.20 1.40 1.05
0.35 0.40
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.12 1.30 0.95
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
SOT1089
sot1089_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-09
10-04-12
MO-252
Figure 12. Package outline SOT1089 (XSON8)
NTB0102
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
14 Abbreviations
Table 16. Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
NMOS
N-type Metal Oxide Semiconductor
PMOS
P-type Metal Oxide Semiconductor
PRR
Pulse Repetition Rate
15 Revision history
Table 17. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NTB0102 v.5
20220420
Product data sheet
-
NTB0102 v.4
Modifications:
• Removed type numbers NTB0102GD and NTB0102GU
• Section 3: Updated look and feel
NTB0102 v.4
20130123
Product data sheet
-
NTB0102 v.3
NTB0102 v.3
20111110
Product data sheet
-
NTB0102 v.2
NTB0102 v.2
20110428
Product data sheet
-
NTB0102 v.1
NTB0102 v.1
20100922
Product data sheet
-
-
NTB0102
Product data sheet
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
16 Legal information
16.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may result
in modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have no
liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NTB0102
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Suitability for use in automotive applications — This NXP product has
been qualified for use in automotive applications. If this product is used
by customer in the development of, or for incorporation into, products or
services (a) used in safety critical applications or (b) in which failure could
lead to death, personal injury, or severe physical or environmental damage
(such products and services hereinafter referred to as “Critical Applications”),
then customer makes the ultimate design decisions regarding its products
and is solely responsible for compliance with all legal, regulatory, safety,
and security related requirements concerning its products, regardless of
any information or support that may be provided by NXP. As such, customer
assumes all risk related to use of any products in Critical Applications and
NXP and its suppliers shall not be liable for any such use by customer.
Accordingly, customer will indemnify and hold NXP harmless from any
claims, liabilities, damages and associated costs and expenses (including
attorneys’ fees) that NXP may incur related to customer’s incorporation of
any product in a Critical Application.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document, including
the legal information in that document, is for reference only. The English
version shall prevail in case of any discrepancy between the translated and
English versions.
NTB0102
Product data sheet
Security — Customer understands that all NXP products may be subject to
unidentified vulnerabilities or may support established security standards or
specifications with known limitations. Customer is responsible for the design
and operation of its applications and products throughout their lifecycles
to reduce the effect of these vulnerabilities on customer’s applications
and products. Customer’s responsibility also extends to other open and/or
proprietary technologies supported by NXP products for use in customer’s
applications. NXP accepts no liability for any vulnerability. Customer should
regularly check security updates from NXP and follow up appropriately.
Customer shall select products with security features that best meet rules,
regulations, and standards of the intended application and make the
ultimate design decisions regarding its products and is solely responsible
for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may be
provided by NXP.
NXP has a Product Security Incident Response Team (PSIRT) (reachable
at PSIRT@nxp.com) that manages the investigation, reporting, and solution
release to security vulnerabilities of NXP products.
16.4 Trademarks
Notice: All referenced brands, product names, service names, and
trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
All information provided in this document is subject to legal disclaimers.
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
Tab. 9.
Tab. 10.
Ordering information ..........................................1
Ordering options ................................................2
Pin description ...................................................3
Function table ....................................................3
Limiting values .................................................. 3
Recommended operating conditions ................. 4
Typical static characteristics ..............................4
Typical supply current ....................................... 5
Static characteristics ......................................... 5
Typical dynamic characteristics for
temperature 25 °C .............................................6
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
Tab. 15.
Tab. 16.
Tab. 17.
Dynamic characteristics for temperature
range -40 °C to +85 °C .....................................7
Dynamic characteristics for temperature
range -40 °C to +125 °C ................................... 9
Typical power dissipation capacitance ............ 11
Measurement points ........................................12
Test data ..........................................................13
Abbreviations ...................................................20
Revision history ...............................................20
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Logic symbol ..................................................... 2
Pin configuration SOT505-2 (TSSOP8) .............2
Pin configuration SOT833-1 (XSON8) and
SOT1089 (XSON8) ........................................... 2
Data input (An, Bn) to data output (Bn, An)
propagation delay times .................................. 12
Enable and disable times ................................12
Test circuit for measuring switching times ....... 13
NTB0102
Product data sheet
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Fig. 12.
Typical operating circuit ...................................14
Architecture of NTB0102 I/O cell (one
channel) ...........................................................15
Typical input current versus input voltage
graph ............................................................... 15
Package outline SOT505-2 (TSSOP8) ............17
Package outline SOT833-1 (XSON8) ..............18
Package outline SOT1089 (XSON8) ............... 19
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NTB0102
NXP Semiconductors
Dual supply translating transceiver; auto direction sensing; 3-state
Contents
1
2
3
3.1
4
5
5.1
5.2
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
12.6
13
14
15
16
General description ............................................ 1
Features and benefits .........................................1
Ordering information .......................................... 1
Ordering options ................................................ 2
Functional diagram ............................................. 2
Pinning information ............................................ 2
Pinning ............................................................... 2
Pin description ................................................... 3
Functional description ........................................3
Limiting values .................................................... 3
Recommended operating conditions ................ 4
Static characteristics .......................................... 4
Dynamic characteristics .....................................6
Waveforms ......................................................... 12
Application information .................................... 14
Applications ......................................................14
Architecture ......................................................14
Input driver requirements .................................15
Power-up ..........................................................15
Enable and disable ..........................................16
Pull-up or pull-down resistors on I/O lines ....... 16
Package outline .................................................17
Abbreviations .................................................... 20
Revision history ................................................ 20
Legal information .............................................. 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2022.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 April 2022
Document identifier: NTB0102
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