NTS0104PW

NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Rev. 2 — 27 April 2011 Product data sheet 1. General description The NTS0104 is a 4-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range: VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V Maximum data rates: Push-pull: 50 Mbps IOFF circuitry provides partial Power-down mode operation Inputs accept voltages up to 5.5 V ESD protection: HBM JESD22-A114E Class 2 exceeds 2500 V for A port HBM JESD22-A114E Class 3B exceeds 8000 V for B port MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1500 V IEC61000-4-2 contact discharge exceeds 8000 V for B port Latch-up performance exceeds 100 mA per JESD 78B Class II Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C 3. Applications I2C/SMBus UART GPIO NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 4. Ordering information Table 1. Ordering information Package Temperature range NTS0104D NTS0104PW NTS0104BQ Name Description plastic small outline package; 14 leads; body width 3.9 mm plastic thin shrink small outline package; 14 leads; body width 4.4 mm Version SOT108-1 SOT402-1 SOT762-1 Type number −40 °C to +125 °C SO14 −40 °C to +125 °C TSSOP14 −40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm −40 °C to +125 °C XQFN16 −40 °C to +125 °C XQFN12 plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 × 2.60 × 0.50 mm plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 × 2.0 × 0.50 mm NTS0104GU16 NTS0104GU12 SOT1161-1 SOT1174-1 5. Marking Table 2. NTS0104D NTS0104PW NTS0104BQ NTS0104GU16 NTS0104GU12 Marking Marking code NTS0104D NTS0104 S0104 s4 s4 Type number NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 2 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 6. Functional diagram GATE BIAS OE A1 B1 A2 B2 GATE BIAS A3 B3 GATE BIAS A4 B4 VCC(A) GATE BIAS VCC(B) 001aan110 Fig 1. Logic symbol NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 3 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 7. Pinning information 7.1 Pinning NTS0104 VCC(A) 2 3 4 5 6 7 GND OE 8 GND(1) 1 terminal 1 index area 14 VCC(B) 13 B1 12 B2 11 B3 10 B4 9 n.c. NTS0104 A1 VCC(A) A1 A2 A3 A4 n.c. GND 1 2 3 4 5 6 7 001aan111 14 VCC(B) 13 B1 12 B2 11 B3 10 B4 9 8 n.c. OE A2 A3 A4 n.c. 001aan112 Transparent top view (1) This is not a supply pin, the substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad however if it is soldered the solder land should remain floating or be connected to GND. Fig 2. Pin configuration SO14 (SOT108-1) and TSSOP14 (SOT402-1) Fig 3. Pin configuration DHVQFN14 (SOT762-1) 16 VCC(A) terminal 1 index area 13 VCC(B) 15 n.c. 14 n.c. NTS0104 12 OE terminal 1 index area VCC(A) 1 A1 1 A2 2 12 B1 11 B2 11 VCC(B) 10 B1 9 B2 8 B3 7 B4 001aan114 NTS0104 A3 3 A4 4 10 B3 9 B4 A1 2 A2 3 A3 4 A4 5 GND 6 GND 7 001aan113 Transparent top view Transparent top view Fig 4. Pin configuration XQFN16 (SOT1161-1) Fig 5. Pin configuration XQFN12 (SOT1174-1) NTS0104 All information provided in this document is subject to legal disclaimers. GND 6 n.c. 5 OE 8 © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 4 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 7.2 Pin description Table 3. Symbol Pin description Pin SOT108-1, SOT402-1 SOT1161-1 and SOT762-1 VCC(A) n.c. GND OE VCC(B) 1 6, 9 7 8 14 16 1, 2, 3, 4 5, 14, 15 6, 7 8 9, 10, 11, 12 13 A1, A2, A3, A4 2, 3, 4, 5 SOT1174-1 1 2, 3, 4, 5 6 12 7, 8, 9, 10 11 supply voltage A data input or output (referenced to VCC(A)) not connected ground (0 V) output enable input (active HIGH; referenced to VCC(A)) data input or output (referenced to VCC(B)) supply voltage B Description B4, B3, B2, B1 10, 11, 12, 13 8. Functional description Table 4. VCC(A) 1.65 V to VCC(B) 1.65 V to VCC(B) GND[2] [1] [2] Function table[1] Input VCC(B) 2.3 V to 5.5 V 2.3 V to 5.5 V GND[2] OE L H X Input/output An Z input or output Z Bn Z output or input Z Supply voltage H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode. 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC(A) VCC(B) VI VO Parameter supply voltage A supply voltage B input voltage output voltage A port and OE input B port Active mode A or B port Power-down or 3-state mode A port B port IIK IOK IO ICC input clamping current output clamping current output current supply current VI < 0 V VO < 0 V VO = 0 V to VCCO ICC(A) or ICC(B) [2] [1] [1][2] [1][2] [1][2] Conditions Min −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 −50 −50 - Max +6.5 +6.5 +6.5 +6.5 VCCO + 0.5 +4.6 +6.5 ±50 100 Unit V V V V V V V mA mA mA mA NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 5 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol IGND Tstg Ptot [1] [2] [3] Parameter ground current storage temperature total power dissipation Conditions Min −100 −65 Max +150 250 Unit mA °C mW Tamb = −40 °C to +125 °C [3] - The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed. VCCO is the supply voltage associated with the output. For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. For XQFN12 packages: above 128 °C the value of Ptot derates linearly with 11.5 mW/K. For XQFN16 packages: above 135 the value of Ptot derates linearly at 16.9 mW/K. 10. Recommended operating conditions Table 6. Symbol VCC(A) VCC(B) Tamb Δt/ΔV Recommended operating conditions[1][2] Parameter supply voltage A supply voltage B ambient temperature input transition rise and fall rate A or B port; push-pull driving VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V OE input VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V [1] [2] Conditions Min 1.65 2.3 −40 - Max 3.6 5.5 +125 10 Unit V V °C ns/V - 10 ns/V The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND. VCC(A) must be less than or equal to VCC(B). 11. Static characteristics Table 7. Typical static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter II IOZ IOFF input leakage current Conditions OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V [1] Min - Typ 2 Max ±1 ±1 ±1 ±1 - Unit μA μA μA μA pF OFF-state output A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V; current VCC(B) = 2.3 V to 5.5 V power-off leakage current A port; VI or VO = 0 V to 3.6 V; VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V B port; VI or VO = 0 V to 5.5 V; VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V CI input capacitance OE input; VCC(A) = 3.3 V; VCC(B) = 3.3 V NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 6 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 7. Typical static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter CI/O input/output capacitance Conditions A port B port A or B port; VCC(A) = 3.3 V; VCC(B) = 3.3 V [1] VCCO is the supply voltage associated with the output. Min - Typ 4 7 9 Max - Unit pF pF pF Table 8. Typical supply current At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. VCC(A) 2.5 V ICC(A) 1.8 V 2.5 V 3.3 V 0.1 0.1 ICC(B) 0.5 0.1 ICC(A) 0.1 0.1 0.1 VCC(B) 3.3 V ICC(B) 1.5 0.8 0.1 ICC(A) 0.1 0.1 0.1 5.0 V ICC(B) 4.6 3.8 2.8 μA μA μA Unit Table 9. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH HIGH-level input voltage Conditions A port VCC(A) = 1.65 V to 1.95 V; VCC(B) = 2.3 V to 5.5 V VCC(A) = 2.3 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V B port VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V OE input VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V VIL LOW-level input voltage A or B port VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V OE input VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V VOH HIGH-level output voltage LOW-level output voltage A or B port; IO = −20 μA VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V A or B port; IO = 1 mA VI ≤ 0.15 V; VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V [2] [1] [1] −40 °C to +85 °C Min VCCI − 0.2 VCCI − 0.4 Max - −40 °C to +125 °C Min VCCI − 0.2 VCCI − 0.4 Max - Unit V V [1] VCCI − 0.4 - VCCI − 0.4 - V 0.65VCC(A) - 0.65VCC(A) - V - 0.15 - 0.15 V - 0.35VCC(A) - 0.35VCC(A) V 0.67VCCO - 0.67VCCO - V VOL [2] - 0.4 - 0.4 V NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 7 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 9. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter II input leakage current OFF-state output current power-off leakage current supply current Conditions OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V A port; VI or VO = 0 V to 3.6 V; VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V B port; VI or VO = 0 V to 3.6 V; VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V VI = 0 V or VCCI; IO = 0 A ICC(A) VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V VCC(A) = 3.6 V; VCC(B) = 0 V VCC(A) = 0 V; VCC(B) = 5.5 V ICC(B) VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V VCC(A) = 3.6 V; VCC(B) = 0 V VCC(A) = 0 V; VCC(B) = 5.5 V ICC(A) + ICC(B) VCC(A) = 1.65 V to 3.6 V; VCC(B) = 2.3 V to 5.5 V [1] [2] VCCI is the supply voltage associated with the input. VCCO is the supply voltage associated with the output. [1] [2] −40 °C to +85 °C Min Max ±2 −40 °C to +125 °C Min Max ±12 Unit μA IOZ - ±2 - ±12 μA IOFF - ±2 ±2 - ±12 ±12 μA μA ICC - 2.4 2.2 −1 12 −1 1 14.4 - 15 15 −8 30 −5 6 45 μA μA μA μA μA μA μA 12. Dynamic characteristics Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min VCC(A) = 1.8 V ± 0.15 V tPHL tPLH tPHL tPLH HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay A to B A to B B to A B to A 4.6 6.8 4.4 5.3 4.7 6.8 4.5 4.5 5.8 7.0 4.7 0.5 ns ns ns ns Max VCC(B) 3.3 V ± 0.3 V Min Max 5.0 V ± 0.5 V Min Max Unit NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 8 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min ten tdis enable time disable time OE to A; B OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay enable time disable time A to B A to B B to A B to A OE to A; B OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate HIGH to LOW propagation delay LOW to HIGH propagation delay A to B A to B A port B port A port B port between channels data inputs [3] [2] [2] [2] [2] VCC(B) 3.3 V ± 0.3 V Min 2.3 2.7 1.9 2.8 20 2.6 2.9 1.9 2.4 20 Max 200 35 35 230 200 9.3 9.1 6.0 7.5 0.7 50 3.3 4.1 3.6 1.6 200 35 35 200 200 6.6 7.9 5.5 6.7 0.7 50 2.4 4.2 5.0 V ± 0.5 V Min 1.8 2.7 1.7 2.8 20 1.8 2.4 1.8 2.6 20 Max 200 35 35 230 200 7.6 7.6 13.3 10.0 0.7 50 3.4 4.4 4.3 0.7 200 35 35 200 200 6.2 6.8 5.3 6.6 0.7 50 3.1 4.4 Max 200 35 35 230 200 9.5 10.8 5.9 7.6 0.7 50 3.2 3.5 3.0 2.5 200 35 35 200 200 7.4 8.3 5.7 7.8 0.7 50 - Unit 3.2 3.3 2.0 2.9 [3] ns ns ns ns ns ns ns ns ns ns ns Mbps ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Mbps ns ns A port B port A port B port between channels data inputs tTHL tsk(o) tW fdata tPHL tPLH tPHL tPLH ten tdis 20 2.8 3.2 1.9 2.2 20 - VCC(A) = 2.5 V ± 0.2 V tTHL tsk(o) tW fdata tPHL tPLH VCC(A) = 3.3 V ± 0.3 V NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 9 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min tPHL tPLH ten tdis HIGH to LOW propagation delay LOW to HIGH propagation delay enable time disable time B to A B to A OE to A; B OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [2] [3] Delay between OE going LOW and when the outputs are actually disabled. Skew between any two outputs of the same package switching in the same direction. [2] [2] VCC(B) 3.3 V ± 0.3 V Min 2.3 2.5 2.0 2.3 20 Max 2.5 2.5 200 35 35 260 200 5.6 6.4 5.4 7.4 0.7 50 5.0 V ± 0.5 V Min 1.9 2.1 1.9 2.4 20 Max 3.3 2.6 200 35 35 260 200 5.9 7.4 5.0 7.6 0.7 50 Max - Unit [3] ns ns ns ns ns ns ns ns ns ns ns ns ns Mbps A port B port A port B port between channels data inputs tTHL tsk(o) tW fdata [1] - Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min VCC(A) = 1.8 V ± 0.15 V tPHL tPLH tPHL tPLH ten HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay enable time A to B A to B B to A B to A OE to A; B 5.8 8.5 5.5 6.7 200 5.9 8.5 5.7 5.7 200 7.3 8.8 5.9 0.7 200 ns ns ns ns ns Max VCC(B) 3.3 V ± 0.3 V Min Max 5.0 V ± 0.5 V Min Max Unit NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 10 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min tdis disable time OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate HIGH to LOW propagation delay LOW to HIGH propagation delay HIGH to LOW propagation delay LOW to HIGH propagation delay enable time disable time A to B A to B B to A B to A OE to A; B OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate HIGH to LOW propagation delay LOW to HIGH propagation delay A to B A to B A port B port A port B port between channels data inputs [3] [2] [2] [2] [2] VCC(B) 3.3 V ± 0.3 V Min 2.3 2.7 1.9 2.8 20 2.6 2.9 1.9 2.4 20 Max 45 45 250 220 11.7 11.4 7.5 9.4 0.8 50 4.2 5.2 4.5 2.0 200 45 45 220 220 8.3 9.7 6.9 8.4 0.8 50 3.0 5.3 5.0 V ± 0.5 V Min 1.8 2.7 1.7 2.8 20 1.8 2.4 1.8 2.6 20 Max 45 45 250 220 9.5 9.5 16.7 12.5 0.8 50 4.3 5.5 5.4 0.9 200 45 45 220 220 7.8 8.3 6.7 8.3 0.8 50 3.9 5.5 Max 45 45 250 220 11.9 13.5 7.4 9.5 0.8 50 4.0 4.4 3.8 3.2 200 45 45 220 220 9.3 10.4 7.2 9.8 0.8 50 - Unit 3.2 3.3 2.0 2.9 ns ns ns ns ns ns ns ns ns ns Mbps ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Mbps ns ns A port B port A port B port between channels data inputs [3] tTHL tsk(o) tW fdata tPHL tPLH tPHL tPLH ten tdis 20 2.8 3.2 1.9 2.2 20 - VCC(A) = 2.5 V ± 0.2 V tTHL tsk(o) tW fdata tPHL tPLH VCC(A) = 3.3 V ± 0.3 V NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 11 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions 2.5 V ± 0.2 V Min tPHL tPLH ten tdis HIGH to LOW propagation delay LOW to HIGH propagation delay enable time disable time B to A B to A OE to A; B OE to A; no external load OE to B; no external load OE to A OE to B tTLH LOW to HIGH output transition time HIGH to LOW output transition time output skew time pulse width data rate ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [2] [3] Delay between OE going LOW and when the outputs are actually disabled. Skew between any two outputs of the same package switching in the same direction. [2] [2] VCC(B) 3.3 V ± 0.3 V Min 2.3 2.5 2.0 2.3 20 Max 3.2 3.2 200 45 45 280 220 7.0 8.0 6.8 9.3 0.8 50 5.0 V ± 0.5 V Min 1.9 2.1 1.9 2.4 20 Max 4.2 3.3 200 45 45 280 220 7.4 9.3 6.3 9.5 0.8 50 Max - Unit [3] ns ns ns ns ns ns ns ns ns ns ns ns ns Mbps A port B port A port B port between channels data inputs tTHL tsk(o) tW fdata [1] - 13. Waveforms VI An, Bn input GND tPHL VOH Bn, An output VOL 90 % VM 10 % tTHL tTLH 001aal918 tPLH VM Measurement points are given in Table 12. VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. The data input (An, Bn) to data output (Bn, An) propagation delay times NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 12 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing VI OE input GND tPLZ output LOW-to-OFF OFF-to-LOW VCCO VM VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled 001aal919 VM tPZL VX tPZH VY VM Measurement points are given in Table 12. VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. Table 12. VCCO Enable and disable times Measurement points[1][2] Input VM 0.5VCCI 0.5VCCI 0.5VCCI 0.5VCCI Output VM 0.5VCCO 0.5VCCO 0.5VCCO 0.5VCCO VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VY VOH − 0.15 V VOH − 0.15 V VOH − 0.3 V VOH − 0.3 V Supply voltage 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V [1] [2] VCCI is the supply voltage associated with the input. VCCO is the supply voltage associated with the output. NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 13 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing VI negative pulse 0V tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VEXT VCC VI VO RL VM VI positive pulse 0V VM G DUT CL RL 001aal920 Test data is given in Table 13. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/ns. RL = Load resistance. CL = Load capacitance including jig and probe capacitance. VEXT = External voltage for measuring switching times. Fig 8. Table 13. VCC(A) Test circuit for measuring switching times Test data Input VCC(B) VI[1] VCCI Δt/ΔV ≤ 1.0 ns/V Load CL 15 pF RL [2] Supply voltage 1.65 V to 3.6 V 2.3 V to 5.5 V [1] [2] [3] VEXT tPLH, tPHL tPZH, tPHZ open tPZL, tPLZ[3] 2VCCO 50 kΩ, 1 MΩ open VCCI is the supply voltage associated with the input. For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and disable times, RL = 50 kΩ. VCCO is the supply voltage associated with the output. NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 14 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 14. Application information 14.1 Applications Voltage level-translation applications. The NTS0104 can be used in point-to-point applications to interface between devices or systems operating at different supply voltages. The device is primarily targeted at I2C or 1-wire which use open-drain drivers, it may also be used in applications where push-pull drivers are connected to the ports, however the NTB0104 may be more suitable. 1.8 V 0.1 μF 3.3 V VCC(A) VCC(B) OE 1.8 V SYSTEM CONTROLLER DATA A1 A2 A3 A4 GND 001aan115 0.1 μF 1 μF NTS0104 B1 B2 B3 B4 3.3 V SYSTEM DATA Fig 9. Typical operating circuit 14.2 Architecture The architecture of the NTS0104 is shown in Figure 10. The device does not require an extra input signal to control the direction of data flow from A to B or B to A. VCC(A) VCC(B) T1 T2 ONE SHOT 10 kΩ ONE SHOT 10 kΩ GATE BIAS T3 A B 001aal965 Fig 10. Architecture of NTS0104 I/O cell (one channel) The NTS0104 is a "switch" type voltage translator, it employs two key circuits to enable voltage translation: 1. A pass-gate transistor (N-channel) that ties the ports together. 2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O pins. NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 15 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing The gate bias voltage of the pass gate transistor (T3) is set at approximately one threshold voltage above the VCC level of the low-voltage side. During a LOW-to-HIGH transition the output one-shot accelerates the output transition by switching on the PMOS transistors (T1, T2) bypassing the 10 kΩ pull-up resistors and increasing current drive capability. The one-shot is activated once the input transition reaches approximately VCCI/2; it is de-activated approximately 50 ns after the output reaches VCCO/2. During the acceleration time the driver output resistance is between approximately 50 Ω and 70 Ω. To avoid signal contention and minimize dynamic ICC, the user should wait for the one-shot circuit to turn-off before applying a signal in the opposite direction. Pull-up resistors are included in the device for DC current sourcing capability. 14.3 Input driver requirements As the NTS0104 is a switch type translator, properties of the input driver directly effect the output signal. The external open-drain or push-pull driver applied to an I/O determines the static current sinking capability of the system; the max data rate, HIGH-to-LOW output transition time (tTHL) and propagation delay (tPHL) are dependent upon the output impedance and edge-rate of the external driver. The limits provided for these parameters in the datasheet assume a driver with output impedance below 50 Ω is used. 14.4 Output load considerations The maximum lumped capacitive load that can be driven is dependant upon the one-shot pulse duration. In cases with very heavy capacitive loading there is a risk that the output will not reach the positive rail within the one-shot pulse duration. To avoid excessive capacitive loading and to ensure correct triggering of the one-shot it's recommended to use short trace lengths and low capacitance connectors on NTS0104 PCB layouts. To ensure low impedance termination and avoid output signal oscillations and one-shot re-triggering, the length of the PCB trace should be such that the round trip delay of any reflection is within the one-shot pulse duration (approximately 50 ns). 14.5 Power up During operation VCC(A) must never be higher than VCC(B), however during power-up VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up first. There is no special power-up sequencing required. The NTS0104 includes circuitry that disables all output ports when either VCC(A) or VCC(B) is switched off. 14.6 Enable and disable An output enable input (OE) is used to disable the device. Setting OE = LOW causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external load) indicates the delay between when OE goes LOW and when outputs actually become disabled. The enable time (ten) indicates the amount of time the user must allow for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the high-impedance OFF-state during power-up or power-down, pin OE should be tied to GND through a pull-down resistor, the minimum value of the resistor is determined by the current-sourcing capability of the driver. NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 16 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 14.7 Pull-up or pull-down resistors on I/Os lines Each A port I/O has an internal 10 kΩ pull-up resistor to VCC(A), and each B port I/O has an internal 10 kΩ pull-up resistor to VCC(B). If a smaller value of pull-up resistor is required, an external resistor must be added parallel to the internal 10 kΩ, this will effect the VOL level. When OE goes LOW the internal pull-ups of the NTS0104 are disabled. NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 17 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 15. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 A1 pin 1 index (A 3) θ Lp L A 1 7 e bp wM detail X 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ o 0.010 0.057 inches 0.069 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 0.028 0.004 0.012 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT108-1 (SO14) NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 18 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 D E A X c y HE vMA Z 14 8 Q A2 pin 1 index A1 θ Lp L (A 3) A 1 e bp 7 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 θ 8 o 0 o Fig 12. Package outline SOT402-1 (TSSOP14) NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 19 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm D B A A A1 E c terminal 1 index area detail X terminal 1 index area e 2 L e1 b 6 vMCAB wM C y1 C C y 1 Eh 14 7 e 8 13 Dh 0 9 X 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.1 2.9 Dh 1.65 1.35 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT762-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT762-1 (DHVQFN14) NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 20 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing XQFN16: plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 x 2.60 x 0.50 mm SOT1161-1 X D B A terminal 1 index area E A A1 A3 detail X e1 e 5 L 4 9 e e2 b 8 v w CAB C y1 C C y 1 terminal 1 index area 16 L1 13 12 0 Dimensions Unit(1) mm max nom min A 0.5 A1 0.05 A3 b D 1.9 1.8 1.7 E 2.7 2.6 2.5 e 0.4 e1 1.2 e2 1.2 1 scale L L1 v 2 mm w y y1 0.25 0.127 0.20 0.00 0.15 0.45 0.55 0.40 0.50 0.35 0.45 0.1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version SOT1161-1 References IEC --JEDEC --JEITA --European projection sot1161-1_po Issue date 09-12-28 09-12-29 Fig 14. Package outline SOT1161-1 (XQFN16) NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 21 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X D terminal 1 index area B A E A A1 A3 detail X b ∅v ∅w 7 CAB C C y1 C y 5 e1 e 1 terminal 1 index area L 0 1 scale Dimensions Unit(1) mm max nom min A 0.5 A1 0.05 A3 b D 1.8 1.7 1.6 E 2.1 2.0 1.9 e 0.4 e1 1.6 L L1 v 0.1 w y y1 2 mm 11 L1 0.25 0.127 0.20 0.00 0.15 0.55 0.50 0.15 0.45 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version SOT1174-1 References IEC --JEDEC MO-288 JEITA --European projection sot1174-1_po Issue date 10-04-07 10-04-21 Fig 15. Package outline SOT1174-1 (XQFN12) NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 22 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 16. Abbreviations Table 14. Acronym CDM CMOS DUT ESD GPIO HBM I2C MM SMBus UART Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge General Purpose Input Output Human Body Model Inter-Integrated Circuit Machine Model System Management Bus Universal Asynchronous Receiver Transmitter 17. Revision history Table 15. Revision history Release date 20110427 Data sheet status Product data sheet Change notice Supersedes NTS0104 v.1 Document ID NTS0104 v.2 Modifications: NTS0104 v.1 • • Added Table 8: total supply current (typical). SOT1174 changed to SOT1174-1. Product data sheet - 20101125 NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 23 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 18. Legal information 18.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 24 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NTS0104 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product Specification Rev. 2 — 27 April 2011 25 of 26 NXP Semiconductors NTS0104 Dual supply translating transceiver; open drain; auto direction sensing 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 15 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input driver requirements . . . . . . . . . . . . . . . . 16 Output load considerations . . . . . . . . . . . . . . . 16 Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Enable and disable . . . . . . . . . . . . . . . . . . . . . 16 Pull-up or pull-down resistors on I/Os lines . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 April 2011 Document identifier: NTS0104