NX20P0408
USB D+/D- protection IC
Rev. 1.1 — 19 August 2019
1
Product data sheet
General description
NX20P0408 is a single chip USB data lines protection solution that provides 28V shortto-VBUS protection to system side D+ and D- pins located near VBUS pins.
USB Type-C allows VBUS voltage to increase up to 20V through Power delivery protocol.
D+ and D- pins can be shorted to VBUS due to mechanical twisting and sliding of the
connector since Type-C connector contact pins are 25% closer to each other than a
micro USB connector. Moisture or fine dust may also cause the 20V VBUS pin to be
shorted to adjacent pins.
NX20P0408 enables D+/D- to be robust in even abnormal conditions. NX20P0408 is
28V DC tolerant on D+/D- pin in connector side and quickly disconnects switches if
the voltage is above overvoltage threshold, protecting D+/D- in system side from high
voltage.
2
Features and benefits
• USB Type-C D+/D- short protection to VBUS
– CON_DP / CON_DN : 28VDC
• Low Rdson switch : 4Ω
• High switch bandwidth = 1.5GHz
• 35V surge protection on CON_DP/CON_DN
• Fast OVP turn off time : 60ns
• Post-stage clamp circuit to clamp voltage until switch is off.
3
Applications
• Smartphone
• Tablet
• Laptop
NX20P0408
NXP Semiconductors
USB D+/D- protection IC
4
Ordering information
Table 1. Ordering information
Type number
NX20P0408UK
Topside
marking
Package
Name
Description
Version
N08
WLCSP12
Wafer level chip-scale package, 12 bumps; 1.67
mm x 1.27 mm x 0.525 mm body (backside
coating included)
SOT1390-7
4.1 Ordering options
Table 2. Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum
Temperature
order quantity
NX20P0408UK
NX20P0408UKZ
WLCSP12
REEL 7" Q1/T1 DP
CHIPS
4000
5
Tamb = -40 °C to +85 °C
Functional diagram
NX20P0408
VSYS
FLAG
SWEN
Rpd
COMPARATORS
CONTROL
LOGIC
DP
CON_DP
POST
CLAMP
DP
CON_DN
POST
CLAMP
aaa-034951
Figure 1. Block diagram
NX20P0408
Product data sheet
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USB D+/D- protection IC
6
Pinning information
6.1 Pinning
1
2
3
A
NC
NC
VSYS
B
NC
NC
GND
C
CON_
DP
DP
FLAG
D
CON_
DN
DN
SWEN
aaa-034971
Figure 2. Pin map, bump-side down
3
2
1
VSYS
NC
NC
A
GND
NC
NC
B
FLAG
DP
CON_
DP
C
SWEN
DN
CON_
DN
D
aaa-034970
Figure 3. Pin map, bump-side up
NX20P0408
Product data sheet
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USB D+/D- protection IC
6.2 Pin description
Table 3.
Pin description
NX20P0408
Product data sheet
Symbol
Pin
Type
Description
CON_DP
C1
DIO
Type-C connector side DP. Connect DP of Type-C USB
connector.
CON_DN
D1
DIO
Type-C connector side DN. Connect DN of Type-C USB
connector.
DP
C2
DIO
System side DP.
DN
D2
DIO
System side DN.
SWEN
D3
DI
USB switch enable/disable control pin. SWEN is driven
HIGH to enable USB switch. There is a 460kΩ internal pulldown resistor, 460kΩ.
VSYS
A3
P
Power supply input, connect System voltage and bypass
1uF capacitor to GND.
FLAG
C3
DO
Open-drain output indicating fault condition. LOW when
Fault condition happen. External pull-up resistor is required.
GND
B3
P
Ground
NC
A1,
A2,
B1, B2
No connection. Leave them open.
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USB D+/D- protection IC
7
Functional description
NX20P0408 is placed in front of the Type-C connector and protects D+ and D- pins in
system side from 20V VBUS short, ESD and surge.
Type-C
Connector
VSYS
VSYS
1 µF
FLAG
APPLICATION
PROCESSOR
SBUEN
NX20P0407
CC1
CON_CC1
CC1
CC2
CON_CC2
CC2
SBU1
CON_SBU1
SBU1
SBU2
CON_SBU2
SBU2
CC/PD
CONTROLLER
CRO S S BAR
SWITCH
GND
VSYS
VSYS
1 µF
FLAG
SWEN
APPLICATION
PROCESSOR
NX20P0408
DP
CON_DP
DP
DN
CON_DN
DN
GND
USB PHY
aaa-034972
Figure 4. NX20P0408 application diagram
NX20P0408
Product data sheet
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NX20P0408
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USB D+/D- protection IC
7.1 Power status
When VSYS is below VSYSUVLO, NX20P0408 stays in shutdown mode, where bias,
switches and all comparators are disabled.
NX20P0408 enters standby mode when VSYS exceed VSYSUVLO. USB switch is
controlled by SWEN.
Table 4. Power state
Power state
VSYS
Flag
SWEN
USB Switch
Dead battery
< VSYSUVLO
Hi-Z
x
OFF
Power ON_A
> VSYSUVLO
Hi-Z
LOW
OFF
Power ON_B
> VSYSUVLO
Hi-Z
HIGH
ON
7.2 Overvoltage protection
NX20P0408 has short circuit protection of CON_DP and CON_DN up to 28V. USB
switch overvoltage threshold is VOVP to secure turn the switch off and prevent high
voltage to USB phy in system side.
Once overvoltage on any channel is detected, the switch is quickly turned off within
tOVP_RES, to prevent overvoltage to system side. FLAG pin goes LOW in tFLAG_RES to
inform system of the fault condition. If the voltage of the channel triggered OVP comes
down below overvoltage threshold for tOVP_DEB, the switch is turned back on and FLAG
pin gets Hi-Z.
Each of the four switches for DP and DN has its own OVP comparator and is controlled
by its comparator independently. If DP voltage exceeds OVP threshold, the DP switch is
turned off, but the other switches stay ON.
40V/us
CON_DP/
CON_DN
VOVP_TH
VOVP_HYS
DP/DN
tOVP_DEB
tOVP_RES
FLAG
tFLAG_RES
tFLAG_RES
aaa-034973
Figure 5. Overvoltage protection timing
7.3 Post-stage clamp circuit
NX20P0408 has a post-stage clamp circuit to clamp extra voltage on DP and DN in
system side. When shorting with VBUS, the voltage on CON_DP and CON_DN is
NX20P0408
Product data sheet
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NX20P0408
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USB D+/D- protection IC
rapidly increased. Even though NX20P0408 features super fast response for overvoltage
condition, the overvoltage may pass through to DP/DN for the response time, 70ns.
NX20P0408 post-stage clamp circuit is second protection to clamp the voltage on DP/DN
in system side not to exceed Clamping voltage, 7V.
40V/us
CON_CCx
Without Poststage clamp
VOVP_TH
CON_SBUx
With Post-stage clamp
CCx
SBUx
tOVP_RES
aaa-034950
Figure 6. Post-stage clamp operation
7.4 Flag
The flag pin is an open drain output to indicate device fault condition to application
processor. If Fault condition is detected, Flag output is latched to LOW until the fault
condition is cleared.
Table 5 shows NX20P0408 fault conditions and its behavior.
Table 5. Fault conditions and behavior
Fault
Condition
SWEN
Flag
USB Switch
Thermal Warning
Tj > TOTP
LOW
LOW
OFF
Thermal Warning
Tj > TOTP
HIGH
LOW
ON
OVP
VCON_Dx > VOVP
LOW
Hi-Z
OFF
OVP
VCON_Dx > VOVP
HIGH
LOW
OFF
7.5 Switch
NX20P0408 has a pair of USB switches controlled by SWEN when SYS power is valid.
The switch bandwidth is 1.5GHz so that it can be used to protect USB D+/D- from
overvoltage.
NX20P0408
Product data sheet
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USB D+/D- protection IC
Figure 7. USB high speed eye diagram of USB switch
8
Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VIO
input/output voltage
CON_DP, CON_DN
-0.5
28
V
DP, DN
-0.5
6
V
VI
input voltage
VSYS
-0.5
6
V
VO
output voltage
FLAG
-0.5
6
V
IO
output current
CON_DP, CON_DN, DP, DN
-100
+100
mA
Tj
junction temperature
-40
+135
°C
VESD
electrostatic discharge voltage
HBM (JESD22-001)
-2
+2
kV
CDM (JESD22-C101E)
-500
+500
V
9
Recommended operating conditions
Table 7. Recommended operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
VIO
input/output voltage
DP, DN, CON_DP, CON_DN
0
4.5
V
input voltage
SWEN
0
5.5
V
VSYS
2.5
5.5
V
FLAG
0
5.5
V
-40
85
°C
VI
VO
output voltage
Tamb
ambient temperature
NX20P0408
Product data sheet
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USB D+/D- protection IC
10 Thermal characteristics
Table 8. Thermal characteristics
Symbol
Rth(j-a)
[1]
[2]
Parameter
Conditions
[1] [2]
thermal resistance from junction to ambient
Typ
Unit
110
°C/W
The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to larger Cu layer areas
e.g. to the power and ground layer. In multi-layer PCB applications, the second layer should be used to create a large heat spreader area right below the
device. If this layer is either ground or power, it should be connected with several vias to the top layer connecting to the device ground or supply. Try not
to use any solder-stop varnish under the chip.
This Rth(j-a) is calculated based on JEDEX2S2P board. The actual Rth(j-a) value may vary in applications using different layer stacks and layouts.
11 Electrical Characteristics
11.1 Static characteristics
Table 9. Static characteristics
At recommended input voltages and Tamb = -40 °C to +85 °C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Falling, 100mV hysteresis
2.14
2.27
2.40
V
VSYS = 3.6V, SWEN = 0V
32
55.5
μA
VSYS = 3.6V, SWEN = 3.6V
105
170
μA
1
μA
3.6
5.4
Ω
30
150
mΩ
4.8
5.0
V
Supply current / Leakage current
VSYSUVLO
VSYS Under Voltage
Lockout
ISYS
Standby current
ILeak
Leakage current for
DP/DN pins
VSYS = 3.6V, VDP/DN = 3.6V,
CON_DP/DN floating
Ron
On resistance
VSYS = 3.6V, SWEN = HIGH,
DP/DN= 3.6V
Ron_Flat
On resistance flatness
Sweep DP/DN voltage
between 0V and 3.6V
VOVP
OVP threshold on
CON_DP/DN
VSYS = 3.6V, SWEN = HIGH,
rising
VOVP_hys
OVP threshold
hysteresis
Con
Equivalent on
capacitance
BW
XTALK
USB switcher
NX20P0408
Product data sheet
-
4.6
100
mV
Capacitance between Dx /
CON_Dx and GND when
Powered up. VDP/DN = 0V to
1.2V, f = 240MHz
4.5
pF
3dB Bandwidth
Single ended, 50Ω termination,
VDP/DN = 0.1V to 1.2V
1500
MHz
Crosstalk
Swing 1Vpp at 10MHz,
measure the other channels
with 50mΩ termination
-84
dB
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USB D+/D- protection IC
Symbol
Parameter
Conditions
Min
Typ
Max
VCLAMP
Clamp voltage on
system side
Hot plug voltage CON_Dx =
22V. load 150nF cap and 40Ω
in series to GND on DP/DN
VOL
Output low voltage
IOL = 5mA
0.3
V
IOH
High level leakage
current
VFLAG = 5.5V
1
μA
7
Unit
V
FLAG
SWEN
VIH
Valid input HIGH
VIL
Valid input LOW
RPD
Pull down resistor
1.5
350
V
450
0.4
V
600
kΩ
Over Temperature flag
TOTP
Over temperature
Flag
TOTP_hys
Over temperature
Flag hysteresis
NX20P0408
Product data sheet
125
-
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°C
-
°C
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USB D+/D- protection IC
11.2 Dynamic characteristics
Table 10. Dynamic characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.5
5
ms
Switch Dynamic Characteristics
tpwrup
Power up time from
Valid power source of
VSYS
tOVP_res_CC
OVP response time
Time from OVP trip voltage
asserted to OVP FET turn-off
-
60
ns
tOVP_res_SBU
OVP response time
Time from OVP trip voltage
asserted to OVP FET turn-off
-
60
ns
tOVP_deb
Minimum time to
exit OVP shutdown,
CON_CCx or CON_
SBUx voltage should
be lower than OVP
voltage for this time
-
20
ms
tSBU_ON
SBU switch enable
time from SBUEN to
HIGH
tOTP_deb
Minimum time to exit
over temperature flag
tFLAG_RES
Time to FLAG
assertion from OVP
detected.
tOTP_flag
Time to Flag from
over temperature
[1]
40
[1]
-
[1]
80
us
20
ms
5
us
20
us
Guaranteed by Design
NX20P0408
Product data sheet
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12 Package outline
Figure 8. Package outline SOT1390-7 (WLCSP12)
NX20P0408
Product data sheet
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USB D+/D- protection IC
13 Revision history
Table 11. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX20P0408 v.1.1
20190819
Product data sheet
-
NX20P0408 v.1.0
NX20P0408
Product data sheet
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14 Legal information
14.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
NX20P0408
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors
USB D+/D- protection IC
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
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Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Ordering information ..........................................2
Ordering options ................................................2
............................................................................ 4
Power state ....................................................... 6
Fault conditions and behavior ........................... 7
Limiting values .................................................. 8
Tab. 7.
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Recommended operating conditions ................. 8
Thermal characteristics ..................................... 9
Static characteristics ......................................... 9
Dynamic characteristics .................................. 11
Revision history ...............................................13
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Overvoltage protection timing ............................6
Post-stage clamp operation .............................. 7
USB high speed eye diagram of USB switch .....8
Package outline SOT1390-7 (WLCSP12) ....... 12
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Block diagram ................................................... 2
Pin map, bump-side down ................................ 3
Pin map, bump-side up ..................................... 3
NX20P0408 application diagram .......................5
NX20P0408
Product data sheet
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USB D+/D- protection IC
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
8
9
10
11
11.1
11.2
12
13
14
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................1
Ordering information .......................................... 2
Ordering options ................................................ 2
Functional diagram ............................................. 2
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 4
Functional description ........................................5
Power status ......................................................6
Overvoltage protection .......................................6
Post-stage clamp circuit .................................... 6
Flag .................................................................... 7
Switch ................................................................ 7
Limiting values .................................................... 8
Recommended operating conditions ................ 8
Thermal characteristics ......................................9
Electrical Characteristics ................................... 9
Static characteristics ..........................................9
Dynamic characteristics ...................................11
Package outline .................................................12
Revision history ................................................ 13
Legal information .............................................. 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 August 2019
Document identifier: NX20P0408
