NX2A4WPZ

NX2A4WP A4WP compliant high frequency wireless charging receiver front end Rev. 3 — 4 August 2015 Product short data sheet 1. General description The NX2A4WP is an A4WP (Alliance for Wireless Power) compliant wireless power receiver front end. It contains a high-voltage, highly efficient rectifier, integrated LDOs, a D3C-to-DC converter, a multi-channel 12-bit ADC, four GPIOs and a Fast-Mode I2C-bus interface. The integrated rectifier supports voltages of up to 20 V and is protected by an integrated automatic clamping function and an automatic over-power protection function. The DC-to-DC regulator delivers a nominal voltage of 5 V. The host microcontroller configures the on-chip controller for automatic interrupt-driven system control. The controller reads the rectifier output voltage, current level information, junction temperature and external temperature sensor information from the ADC. It controls the DC-to-DC converter as well as the GPIOs. 2. Features and benefits              25 V tolerant antenna input pins Automatic over-voltage protection of the antenna inputs 6.78 MHz compatible integrated rectifier High efficiency with an active rectifier and a DC-to-DC converter Integrated LDOs (1.8 V and 3.3 V up to 100 mA) with auto enable and discharge path Integrated DC-to-DC buck regulator with 5 V, 1.2 A output Multi-channel 12-bit ADC subsystem Temperature sensor (NTC) analog interface USB bus power supply detection 400 kHz I2C-bus slave interface Software and power-on reset of the on-chip digital controller Programmable rectifier modes: active, half-active and passive 2 digital General Purpose Input and Output ports (GPIOs) with open-drain outputs and up to 60 V tolerance for control and communication applications  2 digital General Purpose Input and Output ports (GPIOs) with open-drain outputs and 25 V tolerance for control and communication applications  Protection circuitry  Automatic over-power protection  Automatic AC short to ground for OVP option  Automatic DC-to-DC over-voltage protection lock out option  Over-temperature protection  Over-voltage protection  Under-voltage protection NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end  Under-voltage lockout (for LDOs and DC-to-DC controller)  Specified from 40 C to +85 C ambient temperature  3.56  3.41 mm WLCSP with 0.5 mm pitch 3. Applications  Portable electronic devices with integrated wireless charging / wireless power RX capabilities according to the A4WP standard 4. Ordering information Table 1. Ordering information Type number Topside Package marking Name Description Version NX2A4WP WLCSP42 Wafer level chip-scale package; 42 bumps; 3.56  3.41  0.57 mm (back side coating included) NX2A4WP NX2A4WP 4.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature range NX2A4WP NX2A4WPZ WLCSP42 Reel 7” Q1/T1 *Standard mark chips DP 2000 40 C to +85 C NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 5. Block diagram L1 DCIN LDRECT to PMU LX DC AND DC BUCK 5 V, 1 A FB CVOUT PGND CRECT A4WP antenna CAC AC1 ~ CB1 CAC VOUT33 3.3 V LDO + VOUT18 1.8 V LDO ~ CVOUT18 - GND AC2 RGND Rpull2 A SCL ADC I2C CTUNE CVOUT33 LDO STARTUP CONTROL Rpull2 SDA CTUNE GPIOs GPI01 GPI02 Rpull1 GPI03 INT GPI04 OSC VREF33 TA RTA CNTC Rbias(par) DIGITAL CONTROL VREF Rbias(s) RESET/POR WATCHDOG TIMER RNTC GND TEMP aaa-018319 Fig 1. Simplified block diagram NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 6. Functional diagram SYSTEM CONTROL STATUS FLAG REG INTERRUPT INT STATUS FLAG CLEAR REG INTERRUPT CONTROL REG SYSTEM CONTROL REG I/O CONTROL REG 8 ADC CONTROL REG ADC CHAN SEL REG PORT CONTROL GPIO[4:1] ADC CONTROL AND CHANNEL SCAN 12-bit ADC 6 VVRECT RECTIFIER VOLTAGE REG RECTIFIER CURRENT REG DC/DC OUTPUT VOLTAGE REG DC/DC OUTPUT CURRENT REG NTC TEMP SENSOR REG OTP TEMP SENSOR 1 REG OTP TEMP SENSOR 2 REG 1.8 V POR swrst 1.8 V BOD RECT LOWER NIBBLE REG IRECT COMPARATORS VDCOUT IDCOUT VNTC VOTP1 VOTP2 voltage and current sources DC/DC LOWER NIBBLES REG LDO reset NTC, TJ0 LOWER NIBBLES REG RESET TJ1 LOWER NIBBLE REG LDO AND DC/DC CONVERTER DC/DC CONVERTER CONTROL REG 8 NTC TEMP SELECT SDA I2C INTERFACE DEVICE ID SCL ADDRESS PTR Fig 2. MTP MEMORY aaa-017119 Functional diagram of the digital controller NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end VO(rect) temperature set OTPx flag 125 °C set OTRx flag 100 °C set OVP flag DC/DC disable over-power protection set OVD flag (LDRECT) 19 V AC-clamp Vovp(en) to GND over-power Vovp(dis) protection 18 V Vovd(en) 17 V Vovd(dis) 20 V max DC/DC converter range set NTCU flag 60 °C 12 V Tth(high)NTC nominal range set NTCL flag 10 °C 6.5 V DC/DC UVLO OFF set BOD flag 5.0 V DC/DC UVLO ON INOK bit set 3.8 V LDO UVLO OFF INOK bit clear 3.3 V LDO UVLO ON Tth(low)NTC maximum LDO range aaa-018656 Note: temperature protection is not set by default Fig 3. Diagram of key voltage and temperature limits NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7. Functional description 7.1 Interrupt handling Figure 4 and Figure 5 provide flow diagrams of the interrupt service request for the host MCU. RESET RESET FLAG = ‘0’ FLAGIE = ‘0’ FLAGC = ‘0’ INTCL = ‘0’ INT = ‘1’ FLAG = ‘0’ FLAGIE = ‘0’ INTCL = ‘1’ INT = ‘1’ N N FLAG Y Y FLAGIE FLAG N FLAGIE N Y Y INT = ‘0’ INT = ‘0’ N N N Read STAT Y Write FLAGC Y FLAG = ‘0’ INT = ‘1’ FLAG = ‘0’ INT = ‘1’ FLAGC = ‘0’ FLAG = STATUS FLAG BIT (SET TO ‘1’) FLAGIE = INTERRUPT ENABLE BIT INT = INT OPEN-DRAIN PIN INTCL = INT and Flag automatic clear STAT = STATUS REGISTERS FLAG = STATUS FLAG BIT (SET TO ‘1’) FLAGIE = INTERRUPT ENABLE BIT FLAGC = CLEAR FLAG BIT INT = INT OPEN-DRAIN PIN INTCL = INT and Flag automatic clear Fig 4. aaa-017120 ISR flow diagram using automatic status flag and INT clear (reset) (INTCL = ‘1’) NX2A4WP_SDS Product short data sheet Fig 5. aaa-017121 ISR flow diagram using the status flag clear registers (INTCL = ‘0’) All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.1.1 Automatic over-power protection (OVP) The over-power function automatically enables when the rectifier output voltage (VO(rect)) exceeds 18 V. It turns on GPIO1 and GPIO2 in an effort to reduce energy transfer. The OVD function is permanently enabled. A voltage comparator is used to detect when VO(rect) rises above the upper voltage limit, Vovd(en). The rising edge of the comparator output sets the OVD flag bit to logic 1. The OVD flag is a bit corresponding to the status register STATU. The OVD flag records the occurrence of the event. The GPIO1 and GPIO2 open-drain pins connect the CTUNE capacitors to ground as long as VRECT is above Vovd(dis). Also, if the OVDIE bit is set to logic 1, the open-drain INT pin is set to logic 0. It initiates an interrupt service request from the host microcontroller. To clear the interrupt triggered condition, the VRECT voltage must drop below the over-voltage limit (Vovd(dis)). The OVD flag bit is cleared by using the automatic clear of status bits (INTCL = logic 1 in the SYSCONL register) and reading the STATU register. Alternatively, it can be cleared by writing a logic 1 to the OVDC bit in the status flag clear register. Resetting the INT pin back to logic 1 clears the interrupt request. Once the OVD flag is cleared, it is not set again until the VO(rect) voltage crosses below Vovd(dis) and then exceeds Vovd(en) again. See Figure 4 and Figure 5 for diagrams of interrupt request handling by the host microcontroller and the NX2A4WP device. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end RESET OVD = ‘0’ OVDIE = ‘0’ GPIO1 = ‘1’ GPIO2 = ‘1’ VO(rect) > Vovd(en) N Y Positive Edge Y OVD = ‘1’ N GPIO1 = ‘0’ GPIO2 = ‘0’ N VO(rect) < Vovd(dis) Y GPIO1 = ‘1’ GPIO2 = ‘1’ OVD = over-power protection flag bit (ASYN SET TO ‘1’) OVDIE = interrupt enable bit GPIO1 = GPIO1 OPEN-DRAIN PIN GPIO2 = GPIO2 OPEN-DRAIN PIN VO(rect) = voltage on pin LDRECT Fig 6. aaa-018657 Flow diagram of automatic over-power protection 7.1.2 Automatic over-voltage protection Sudden jumps in the voltage or energy transmitted to a receiver can occur when other receivers are switched in and out of the common radiation field of a single transmitter. There are two alternative mechanisms available for over-voltage protection of the AC-input pins (AC1 and AC2). The automatic frequency over-power protection method is described above in Section 7.1.1, and the other option, the AC-clamp, is described in this section. For details see Figure 3, Figure 6 and Figure 7. The automatic over-voltage protection shorts both AC-input pins directly to ground when the rectifier output voltage (VO(rect)) exceeds the over-voltage protection limit (Vovp(en)). When the over-voltage takes place, the energy stays in the resonator circuit. In this way, the rectifier voltage stops from rising any further. When the rectifier voltage drops below the over-voltage protection limit (Vovp(dis)) the shorts are removed and the rectifier returns to normal operation. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end The AC-clamp function is permanently enabled. When VO(rect) is higher than Vovp(en), the OVP flag bit in the status register is set to logic 1. Both AC-input pins are shorted to ground as long as VO(rect) is above Vovp(dis). Also, if the OVPIE bit is set to logic 1, the open-drain INT pin is set to logic 0. It initiates an interrupt service request (ISR) from the host microcontroller. To clear the interrupt condition, the VO(rect) voltage must drop below the over-voltage Protection Off limit (Vovp(dis)). The microcontroller clears the OVP status flag by setting the OVPC bit to logic 1 in the status flag clear register. It is also cleared if the INTCL bit in the SYSCONL register is enabled, and the STATU register is read. The INT pin is reset back to logic 1. For details, see Figure 7. During an over-voltage event, all LDO regulators remain enabled. In contrast, the response of the DC-to-DC converter to an over-voltage event is software selectable by the host microcontroller. The default setting of the DCOVE bit is logic 0 in the system control register. The DC-to-DC converter is permanently enabled and an OVP event does not control it. WARNING: When both the DCOVE bit and the OVPIE bit are set to logic 1, the DC-to-DC converter is disabled automatically. It is done by setting the DCEN bit to logic 0 in the system control register when the OVP flag bit is set to logic 1 in the status register. These settings disrupt the power supply in case the DC-to-DC converter output is the only source of energy for the BLE host microcontroller. Once the power is lost, the host microcontroller might be inoperable and cannot re-enable the DC-to-DC converter. The OVP flag triggers an interrupt request and is cleared by clearing the flag bit. After the over-voltage event is removed and the rectifier returns to normal operation, the DC-to-DC converter must be re-enabled. It is re-enabled by setting the DCEN bit to logic 1 and clearing the OVP flag using the host microcontroller. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end POWER-ON RESET OVD = ‘0’ OVP = ‘0’ GPIO1 = ‘1’ GPIO2 = ‘1’ VO(rect) > Vovd(en) N VO(rect) < Vovd(dis) Y Positive Edge N VO(rect) > Vovp(en) VO(rect) < Vovp(dis) Y Y Y N Positive Edge OVD = ‘1’ N N Y Y OVP = ‘1’ N GPIO1 = ‘0’ GPIO2 = ‘0’ GPIO1 = ‘1’ GPIO2 = ‘1’ AC-CLAMP to GND AC-CLAMP TURNED OFF aaa-018658 GPIO1 = GPIO1 open-drain pin GPIO2 = GPIO2 open-drain pin OVD = over-power protection flag OVP = over-voltage protection flag VO(rect) = voltage on pin LDRECT Vovd(en) = over-power protection enable trip point Vovd(dis) = over-power protection disable trip point Vovp(en) = over-voltage protection (AC-clamping) enable trip point Vovp(dis) = over-voltage protection (AC-clamping) disable trip point Fig 7. Flow diagram of automatic over-power protection and AC-clamping for over-voltage protection 7.2 ADC The ADC enables direct measurements of internal voltages, currents, on-chip temperatures, and off-chip temperatures (VO(rect), IO(rect), VO, IO, chip temperature and NTC voltage). It is a 12-bit successive approximation (SAR) Analog-to-Digital converter (ADC) with a 7-channel input multiplexer. The host microcontroller configures and controls the ADC. The ADC does a single scan cycle of the selected input channels and stores their code values in corresponding data registers for readout by the microcontroller. The analog input channels are selected or de-selected by setting the ADx bits to logic 1 or logic 0 in the ADC channel enable register. The ADC controller subsystem sequentially converts the input voltage of each of the selected input channels. It stores the corresponding 12-bit results in the respective data registers in the form of the MSB byte register and the LSB nibble register. After completion of the last selected channel, the ADC is disabled. The ADC samples the selected input channels before the 400 kHz I2C bus allows the host MCU to read the first data byte from the first enabled channel. So, the host microcontroller does not require further control of the ADC or completion confirmation. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.3 On-chip over-temperature protection On-chip temperature sensors are used to monitor the DC-to-DC converter and the active rectifier for excessive heating. They are intrinsic p-n-junction diode references each connected to a voltage comparator with their own voltage reference. The OTP1 or OTP2 flags in the status register are set to logic 1 whenever the diode voltage transitions above the comparator reference voltage (125 C, typically). If this condition occurs, the DC-to-DC converter can be disabled. The automatic disable mode is enabled when both the DCTOE bit in the system control register and the corresponding OTPxIE bit in the ICON register are set to logic 1. WARNING: These settings disrupt the power supply in case the DC-to-DC converter output is the only source of energy for the BLE host microcontroller. Once the power is lost, the host microcontroller might be inoperable and cannot re-enable the DC-to-DC converter. When the temperature drops below 100C (typically), another interrupt is triggered and the OTRx flag is set to logic 1. It indicates that the device has recovered from the over-temperature condition and is ready to operate in a safe range again. The OTPx and/or OTRx flags remain set to logic 1. The microcontroller can clear the flags. Alternatively, the flags can be cleared by using the automatic clear function (INTCL = logic 1) and reading the STATL register via the I2C bus. The OTPx or OTRx flags trigger an interrupt service request (ISR) from the microcontroller by setting the INT pin to logic 0. The microcontroller can measure the voltages directly with the ADC. It makes the necessary adjustments either by disabling the DC-to-DC converter or reducing the power of the transmitter. It can monitor the temperature until it returns to a lower value before it re-enables the DC-to-DC converter. 7.4 Off-chip NTC over- and under-temperature protection The NX2A4WP supports one external NTC temperature sensor. A constant and accurate 3.3 V voltage source is supplied from the VREF33 pin. The NTC voltage is input through the TEMP pin and connected to two voltage comparators. The voltage comparators have their voltage references Tth(high)NTC typically 60C, and Tth(low)NTC typically 10C. Whenever the temperature is outside this range, either the NTCU flag or the NTCL flag is set to logic 1 in the status register. If the corresponding interrupt enable bits are set to logic 1 in the interrupt control register, the NTCU or NTCL flags trigger an interrupt service request (ISR) from the microcontroller by setting the INT pin to logic 0. The microcontroller can trigger an ADC scan cycle and directly measure the output voltage of the NTC temperature sensor. For details refer to Figure 3, Figure 5 and Figure 8. (See also Table 4 and Section 7.10.4). By setting the DCNTE bit in the SYSCONL register to logic 1, the DC-to-DC converter is disabled when the upper NTC temperature limit (Tth(high)NTC) is exceeded. WARNING: These settings disrupt the power supply in case the DC-to-DC converter output is the only source of energy for the BLE host microcontroller. Once the power is lost, the host microcontroller might be inoperable and cannot re-enable the DC-to-DC converter. Refer to Section 7.10.4.4 for further details. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end RESET NTCU = ‘0’ NTCUIE = ‘0’ GPNTE = ‘0’ DCNTE = ‘0’ GPIO1 = ‘1’ GPIO2 = ‘1’ DCEN = ‘0’ TNTC > Tth(high)NTC (VNTC < VNTChigh) N Y Positive Edge Y NTCU = ‘1’ N GPNTE AND NTCUIE N Y GPIO1 = ‘0’ GPIO2 = ‘0’ N DCNTE AND NTCUIE Y DCEN = ‘0’ N NTCU = NTCU FLAG BIT (ASYN SET TO ‘1’) NTCUIE = INTERRUPT ENABLE BIT GPNTE = over-power protection ENABLE BIT DCNTE = NTC CONTROL of DC/DC ENABLE BIT DCEN = DC/DC CONVERTER ENABLE BIT GPIO1 = GPIO1 open-drain pin GPIO2 = GPIO2 open-drain pin VNTC = external NTC voltage VNTChigh = external NTC high temperature trigger voltage Fig 8. N aaa-018789 Flow diagram of the off-chip NTC over-temperature protection 7.5 DCIN and LDRECT inputs To minimize supply voltage noise and ripple, bypass capacitor of value between 35 F to 100 F is connected between these pins and ground. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.6 LDODCPL The pin LDODCPL allows for noise filtering of the internal LDO18 and LDO33 supply rail. It reduces supply noise and allows the switching of the LDO supply input between VO(rect) and the DC-to-DC converter output voltage in order to optimize efficiency. As soon as the DC-to-DC converter output voltage is sufficiently high, the LDO supply input is switched from the LDRECT pin to the LDDC pin. The LDDC pin is connected to the output of the DC-to-DC converter. A decoupling capacitor of 10 F is connected between this node and ground. 7.7 LDO start-up control The LDO start-up control monitors the DC input voltage. Once this voltage exceeds VUVLO the two LDOs are enabled simultaneously after a delay of ~1.5 ms. The LDOs are disabled in case their DC supply voltage drops below VBODtrip (VUVLO(LDO) = VBOD(LDO) + VBODhys), see Figure 9. If there is a shutdown, the LDOs contain discharge paths to ramp down the supply voltage. permanent TX beacon VRECT VUVLO(DCDC) VUVLO(LDO) LDOs startup 1.8 V and 3.3 V LDO startup BT-LE and controller startup lTX start permanent power transfer DC-to-DC enable and Tx setting to optimal voltage range aaa-017126 Fig 9. NX2A4WP start-up sequence NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.8 General Purpose digital Input Output ports (GPIOs) The GPIOs can be used for control and communication applications. They are software configured and controlled through the I2C and can be configured as digital inputs and/or open-drain outputs. Each GPIO’s operation mode can be controlled individually using the GPIEx bits in the IOCONL register. When configured as inputs, the logic level of each GPIO pin can be read through the associated GPI bit in the IOCONU register. If a GPIO is used as an open-drain output, the open-drain pull-down transistor is enabled. The pin is pulled low by writing a logic 0 to the related GPO bit in the IOCONL register. Otherwise, the pin is tri-stated (high impedance). When the pin is not pulled to a logic level, the input buffer should be disabled to prevent feed-through currents in the buffer. 7.9 External supply detect pin (TA) The TA pin can be used to sense an external supply connection or state change. If the logic value changes from high to low or low to high for more than 11 ms, the interrupt pin is asserted. The pin cannot be disabled through I2C, and it should not be left floating. When the TA pin is not used, it is recommended to pull it down to ground through resistor RTA (see Table 4). NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10 Software interface1 7.10.1 I2C device address The slave address of the NX2A4WP is shown in Figure 10. fixed slave address 0 1 0 0 0 0 0 R/W aaa-017125 Fig 10. NX2A4WP address The LSB of the slave address defines the operation (read or write) to be performed. A HIGH (logic 1) selects a read operation, while a LOW (logic 0) selects a write operation. 7.10.2 I2C-bus interface definition Table 3. Interface definition Byte I2C-bus Bit slave address I/O data bus 7 (MSB) 6 5 4 3 2 1 0 (LSB) 0 1 0 0 0 0 0 R/W B7 B6 B5 B4 B3 B2 B1 B0 7.10.3 Pointer register and command byte Following the successful acknowledgement of the address byte, the bus master sends a register address byte, which is stored in the Pointer register of the NX2A4WP. This register is write only. B7 B6 B5 B4 B3 B2 B1 B0 aaa-017124 Fig 11. Pointer register bits If auto increment is enabled (default: the AUTO bit in the SYSCONU register set to logic 1), the register address will be incremented after every data read or data write transaction. As an example, the communication flow to read the ADC channels from the ADC0DU to the ADC6DL register is shown here: 1. AUTO in SYSCONU = logic 1 2. MCU writes FDh to register address ADCEL to trigger ADC conversions on 6 of the 7 ADC input channels: - send slave/device address 0100 0000 (with LSB = logic 0 for write operation) - send ADCEL address 0000 1001 (09h) to the pointer register - send data 1111 1101 to ADCEL so that the 6 ADC channels are selected and the conversions are started 1. Reference: ‘I2C-bus specification and user manual’, UM10204, Rev. 06, 4 April 2014 NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 3. MCU reads channels ADC0DU to ADC6DL: - send the slave/device address 0100 0000 (with LSB = logic 0 for write operation) - send the ADC0DU address 0000 1011 (0Bh) to the pointer register - send the slave/device address 0100 0001 (with LSB = logic 1 for READ operation) - read the register address 0Bh; the pointer register is incremented after it is read automatically from ADC0DU (0Bh) 0000 1011 to ADC1DU (0Ch) 00001100 - read the register address 0Ch; the pointer register is incremented after it is read automatically from ADC1DU (0Ch) 0000 1100 to ADC2DU (0Dh) 00001101; - continue until e.g. ADC6DL is read and MCU terminates read sequence by not acknowledging and sending a stop condition NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 44 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors NX2A4WP_SDS Product short data sheet Table 4. NX2A4WP Register address map and bit definitions Address / data content [1][2] Hexade Name cimal Address Description Access B7 B6 B5 B4 B3 B2 B1 B0 Reset value System Control and Status Registers STATL Status Register Lower Byte RO IDC NTCL NTCU OTR2 OTR1 OTP2 OTP1 INOK xxxx xxxx 01 STATU Status Register Upper Byte RO    OVP OVD  BOD TAH 0000 0000 02 SFCLRL Status Flag Clear Register Lower WO Byte IDCC NTCLC NTCUC OTR2C OTR1C OTP2C OTP1C  0000 0000 03 SFCLRU Status Flag Clear Register Upper WO Byte    OVPC OVDC  BODC TAHC 0000 0000 04 ICON Interrupt Control Register R/W TAIE OVPIE OVDIE IDCIE NTCLIE NTCUIE OTP2IE OTP1IE 0000 0000 05 SYSCONL System Control Register Lower Byte R/W INTCL DCOVE HRECT PRECT DCNTE GPNTE  DCTOE 1000 0010 06 SYSCONU System Control Register Upper Byte R/W      AUTO SWRT DCEN 1111 0101 07 IOCONL I/O Control Register Lower Byte R/W GPIE4 GPIE3 GPIE2 GPIE1 GPO4 GPO3 GPO2 GPO1 0000 1111 08 IOCONU I/O Control Register Upper Byte RO     GPI4 GPI3 GPI2 GPI1 0000 0000 ADC Registers ADCEL ADC Channel Enable Register Lower Byte R/W ADEN AD6 AD5 AD4 AD3 AD2 AD1 AD0 0111 1111 0A ADCEU ADC Channel Enable Register Upper Byte R/W         0000 0000 0B ADC0DU ADC Channel 0 VRECT Data Reg. RO Upper Byte ADC0DU [2] 0C ADC1DU ADC Channel 1 IRECT Data Reg. Upper Byte RO ADC1DU [2] 0D ADC2DU ADC Channel 2 VDCOUT Data Reg. Upper Byte RO ADC2DU [2] 0E ADC3DU ADC Channel 3 IDCOUT Data Reg. Upper Byte RO ADC3DU [2] 0F ADC4DU ADC Channel 4 VNTC Data Register Upper Byte RO ADC4DU [2] 10 ADC5DU ADC Channel 5 VOTP1 Data Reg. RO Upper Byte ADC5DU [2] NX2A4WP 17 of 44 © NXP Semiconductors N.V. 2015. All rights reserved. 09 High frequency wireless charging receiver front end Rev. 3 — 4 August 2015 All information provided in this document is subject to legal disclaimers. 00 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NX2A4WP Register address map and bit definitions NXP Semiconductors NX2A4WP_SDS Product short data sheet Table 4. Address / data content [1][2] Description Access B7 B6 B5 B4 B3 B2 B1 B0 Reset value 11 ADC6DU ADC Channel 6 VOTP2 Data Reg. RO Upper Byte ADC6DU [2] 12 ADC10DL ADC Channel 1 and 0 Data Register Lower Nibble RO ADC10DL [2] 13 ADC32DL ADC Channel 3 and 2 Data Register Lower Nibble RO ADC32DL [2] 14 ADC54DL ADC Channel 5 and 4 Data Register Lower Nibble RO ADC54DL [2] 15 ADC6DL ADC Channel 6 Data Register Lower Nibble RO ADC6DL [2] R/W V3 DC-to-DC Control Registers 19 DCSEL DC-to-DC VOUT and IOUT Level Select V2 V1 V0 NTCUL 1 NTCUL 0 C3 C2 C1 C0 0100 1011 NTC interrupt temperature limit control register 1A NTCSEL NTC High and Low INT Level Select R/W     NTCLL1 NTCLL0 0001 0001 Device Identification code 1F DEVID Device Identification Code Register RO DEVID7 DEVID6 DEVID5 DEVID4 DEVID3 DEVID2 DEVID1 DEVID0 0100 0000 [1] Bits described with ‘-’ in this table are reserved for future use. Always write logic 0 to undefined bits. [2] Bits with no value given have no default (e.g. the ADC data bits). Generation of valid content for those bits has to be triggered by conducting an ADC conversion cycle. NX2A4WP 18 of 44 © NXP Semiconductors N.V. 2015. All rights reserved. High frequency wireless charging receiver front end Rev. 3 — 4 August 2015 All information provided in this document is subject to legal disclaimers. Hexade Name cimal Address NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10.4 Register descriptions 7.10.4.1 Status registers (STATL, address 00h; STATU, address 01h) The status register contains basic device status flags. It contains temperature limit status, over-current, over-voltage, recorded reset events (BOD), and detection of the presence of a USB power supply. The status registers are read-only and writes to these registers have no effect. With autoincrement and autoclear active (AUTO = logic 1 and INTCL = logic 1), both registers must be read simultaneously in one I2C read segment. It is to prevent the STATU register being cleared with the next ACK, due to data caching in this mode and information might get lost. These registers should be read after power-up of the controller to clear them initially as it is not done by the POR. A read operation is performed as described in Section 7.10.5.2. Table 5. Status register lower byte (STATL, address 00h) Bit 7 4 3 IDC NTCL NTCU OTR2 OTR1 Default X X X X X 2 OTP2 1 [3] X OTP1 0 [3] X INOK X Status register lower byte bit mapping (STATL, address 00h) Bit Symbol Function [1][2] 0 INOK [2] INOK reflects the current voltage level of the power supply for the LDO regulators (LDODCPL pin) INOK = logic 0; VLDODCPL < 3.3 V INOK = logic 1; VLDODCPL > 3.8 V 1 OTP1 [3] If the OTP1 (rectifier) temperature sensor rises above the Tj = 125C limit, OTP1 toggles from logic 0 to logic 1 OTP1 = logic 0 if Tj(OTP1) < 125 C or after resetting OTP1 2 OTP2 [3] If the OTP2 (DC-to-DC) temperature sensor rises above the Tj = 125C limit, OTP2 toggles from logic 0 to logic 1 OTP2 = logic 0 if Tj(OTP2) < 125 C or after resetting OPT2 3 OTR1 If the OTP1 (rectifier) temperature sensor falls below the Tj = 100C limit, OTR1 toggles from logic 0 to logic 1 OTR1 = logic 0 at any other temperature and after resetting OTR1 4 OTR2 If the OTP2 (DC-to-DC) temperature sensor falls below the Tj = 100C limit, OTR2 toggles logic 0 to logic 1 OTR2 = logic 0 at any other temperature and after resetting OTR2 5 NTCU[4] If the NTC sensor temperature rises above the Tth(high)NTC limit, NTCU toggles from logic 0 to logic 1 NTCU = logic 0 if NTC < Tth(high)NTC or after resetting NTCU 6 NTCL[4] If the NTC sensor temperature falls below the Tth(low)NTC limit, NTCL toggles from logic 0 to logic 1 NTCL = logic 0 if NTC > Tth(low)NTC or after resetting NTCL 7 IDC IDC = logic 1; DC-to-DC converter output current rises above the current limit (DCSEL, bits C3-C0) IDC = logic 0; DC-to-DC converter output current is below limit (DCSEL, bits C3-C0) [1] Product short data sheet 5 Symbol Table 6. NX2A4WP_SDS 6 The status bits, except INOK, are edge triggered on the related event occurring (edge triggered: flag stores an event at its beginning with no relation to the duration or its end. For example, the event can be a rising or a falling edge of a signal). The bits are not automatically reset once triggered. They store the event related to their function until cleared via the respective status flag clear bit or by reading the STATL register while INTCL is logic 1. All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 19 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end [2] INOK is a non-latched bit representing the level of the LDO supply voltage VLDODCPL sensed by a BOD circuit. [3] The OTP1 sensor is located near the rectifier area while the OPT2 sensor is near the DC-to-DC converter. [4] The NTC comparator has hysteresis of 10 C. Table 7. Status register upper byte (STATU, address 01h) Bit 7 6 5 4 3 2 1 0 Symbol    OVP OVD  BOD TAH Default 0 0 0 0 0 0 0 0 Table 8. Status register upper byte bit mapping (STATU, address 01h) Bit Symbol Function [1] [2] 0 TAH[2] TAH is a non-latched bit always reflecting the TA input pin voltage level. It cannot be cleared via TAHC. TAH = logic 1; a high voltage is detected on the TA pin TAH = logic 0; a low voltage is detected on the TA pin 1 BOD BOD = logic 1; DCIN (VO(rect)) voltage falls below VBOD(DCDC), brownout detector monitoring the voltage on the DCIN pin was triggered BOD = logic 0; DCIN voltage did not experience a brownout event The BOD flag is cleared on the initial power-up. 2  Reserved 3 OVD OVD = logic 0; VO(rect) < Vovd(en) OVD = logic 1; over-voltage protection limit reached (DCIN voltage > Vovd(en)) 4 OVP OVP = logic 0; VO(rect) < Vovd(en) OVP = logic 1; AC-clamping over-voltage protection limit reached (DCIN voltage > Vovd(en)) 5  Reserved 6  Reserved 7  Reserved [1] The status bits, except TAH, are edge triggered on the related event occurring (edge triggered: flag bit stores an event at its beginning with no relation to the duration or its end. For example, an event can be a rising and/or a falling edge of a signal). The bits are not automatically reset once triggered and only store the event related to their function until cleared via the respective status flag clear bit or by reading the STATU register while INTCL is logic 1. [2] TAH is a non-latched bit representing the voltage level of the TA input pin. The INT signal records the event in a hidden register and is edge triggered on both edges of TAH. (INT is triggered in case TAH toggles from logic 0 to logic 1 or reverse). The INT hidden register is cleared by writing a logic 1 to the TAHC bit in the SFCLRU register or by reading the STATU register with the INTCL bit set to logic 1 in the SYSCONL register. The basic behavior of TAH in combination with INT while reading the status registers (INTCL = logic 1) is depicted in Figure 12 below. The TA input pin filters out glitches less than 11 ms wide using a digital debounce circuit. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 20 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end TA input pin time TAH time INT time status register read status register read aaa-017127 Fig 12. TA, TAH and INT behavior during a TA interrupt trigger and read cycle 7.10.4.2 Status flag clear registers (SFCLRL, address 02h; SFCLRU, address 03h) Status flag bits record certain events and reside in the status registers, STATL or STATU. They can be cleared individually by writing a logic 1 to the matching bit in the status flag clear registers. The bit positions in SFCLRL matching positions in STATL are cleared by writing a logic 1. Similarly, the bit positions in SFCLRU matching those positions in STATU, are cleared by writing a logic 1. Refer to Table 5 and Table 7 for details. For TAH, the corresponding status flag clear bit TAHC is to reset the hidden INT pin control latch. However, it does not clear the non-latched TAH flag bit to logic 0. The INOK bit is a non-latched bit and does not trigger an interrupt. Therefore, there is no corresponding clear bit. These 2 bits represent true logic level of the related signals and do not record events. Alternatively, all the status flags can be cleared automatically by reading each status register when the INTCL bit in the SYSCONL register is set to logic 1 (reset default value). Table 9. Bit 7 Product short data sheet 6 5 4 3 2 1 0 Symbol IDCC NTCLC NTCUC OTR2C OTR1C OTP2C OTP1C [1] Default 0 0 0 0 0 0 0 0 Table 10. NX2A4WP_SDS Status flag clear register lower byte (SFCLRL, address 02h) Status flag clear register upper byte (SFCLRU, address 03h) Bit 7 6 5 Symbol [1] [1] [1] Default 0 0 0 4 3 2 1 0 OVPC OVDC [1] BODC TAHC [2] 0 0 0 0 0 [1] Reserved, always write logic 0 to undefined bits. [2] INOK and TAH cannot be reset. By writing a logic 1 to the TAHC bit, only the INT pin control latch for the TAH bit is cleared. All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 21 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10.4.3 Interrupt control register (ICON, address 04h) The interrupt control register enables the masking of the different available interrupt signals. When enabled, interrupt events trigger the INT pin to be pulled low when the matching flag bit in the status registers (STATL and STATU) is set. The status registers are cleared by reading the register with INTCL = logic 1 (automatic clear) or via the status flag clear register. The status bits in each status register remain set until cleared. The INT pin is connected to the VOUT18 supply via an integrated 20 k resistor. Table 11. Bit 7 6 5 4 3 2 1 0 Symbol TAIE OVPIE OVDIE IDCIE NTCLIE NTCUIE OTP2IE OTP1IE Default 0 0 0 0 0 0 0 0 Table 12. 7.10.4.4 Interrupt control register (ICON, address 04h) Interrupt control register bit mapping (ICON, address 04h) Bit Symbol Function 0 OTP1IE Over-temperature protection 1 interrupt enable OTP1IE = logic 1; OTP1 or OTR1 can trigger INT OTP1IE = logic 0;OTP1 or OTR1 trigger of INT disabled 1 OTP2IE Over-temperature protection 2 interrupt enable OTP2IE = logic 1; OTP2 or OTR2 can trigger INT OTP2IE = logic 0; OTP2 or OTR2 trigger of INT disabled 2 NTCUIE NTC high temperature limit exceeded (Tth(high)NTC) INT enable NTCUIE = logic 1; NTCU can trigger INT NTCUIE = logic 0; NTCU trigger of INT disabled 3 NTCLIE NTC lower temperature limit exceeded (Tth(low)NTC) INT enable NTCLIE = logic 1; NTCL can trigger INT NTCLIE = logic 0; NTCL trigger of INT disabled 4 IDCIE DC-to-DC converter output current limit exceeded INT enable IDCIE = logic 1; IDC can trigger INT IDCIE = logic 0; IDC trigger of INT disabled 5 OVDIE over-power protection reached INT enable OVDIE = logic 1; OVD can trigger INT OVDIE = logic 0; OVD trigger of INT disabled 6 OVPIE VOVPon over-voltage protection limit reached INT enable OVPIE = logic 1; OVP can trigger INT OVPIE = logic 0; OVP trigger of INT disabled 7 TAIE TA input interrupt trigger INT enable TAIE = logic 1; TA rising or falling input change can trigger INT TAIE = logic 0; TA input trigger of INT disabled System control registers (SYSCONL, address 05h; SYSCONU, address 06h) The lower byte of the system control register enables or disables possible automatic actions triggered by the status flags. Enabled interrupts trigger the INT pin LOW. If the INTCL bit is set, the set status bits in a status register are cleared after the register is read, except for the INOK and the TAH flags. The INOK and TAH flags cannot be cleared as they are level triggered. If the INTCL bit is logic 0, the set status bits in the status registers remain set until cleared via the status flag clear register. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 22 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 13. Bit System control register lower byte (SYSCONL, address 05h) 7 6 Symbol INTCL Default 1 [1] DCOVE 0 5 HRECT 4 PRECT 0 3 DCNTE 0 0 2 GPNTE 0 1 [1] 0 DCTOE 0 0 Reserved, always write logic 0 to undefined bits Table 14. System control register lower byte bit mapping (SYSCONL, address 05h) Bit Symbol Function 0 DCTOE Enable OTP1 or OTP2 control of DC-to-DC converter DCTOE = logic 1; if (OTP1 and OTP1IE) are set to logic 1 or (OTP2 and OTP2IE) are set to logic 1, DCEN is reset to logic 0 (junction over-temperature trip point reached, DC-to-DC turned off) DCTOE = logic 0; no automatic DC-to-DC disable at over-temperature trip point 1  Reserved 2 GPNTE Enable NTCU control of GPO1 and GPO2 for over-power protection GPNTE = logic 1; over-power protection enabled (GPO1, GPO2 low ohmic) as long as Tth(high)NTC limit is exceeded GPNTE = logic 0: automatic over-power protection disabled 3 DCNTE Enable NTCU control of DC-to-DC converter DCNTE = logic 1; if NTCU and NTCUIE are set to logic 1, and the NTC over-voltage limit is reached, DCEN is reset to logic 0; no automatic DC-to-DC disable when the NTC upper temperature limit is reached 4 PRECT PRECT = logic 1 and HRECT logic 0; enable passive rectification mode PRECT = logic 0 and HRECT = logic 0; active rectification mode enabled Bits PRECT and HRECT are mutually exclusive. If both bits are set at once, then they both default to 00b (active rectification mode) 5 HRECT HRECT = logic 1 and PRECT = logic 0: enable half-active rectification mode HRECT = logic 0 and PRECT = logic 0: active rectification mode enabled Bits PRECT and HRECT are mutually exclusive. If both bits are set at once, then they both default to 00b (active rectification mode) 6 DCOVE Enable OVP control of DC-to-DC DCOVE = logic 1 If OVP and OVPIE are set to logic 1 and the AC-clamp enable trip point is reached, DCEN is reset to logic 0 DCOVE = logic 0; no automatic DC-to-DC disable at AC-clamp trip point 7 INTCL[1] Enable automatic clear (reset) of set status bits in the status registers and INT pin after a register read INTCL = logic 1; automatic clear of flag bits after read enabled INTCL = logic 0; no automatic clear. Status flags are cleared by writing a logic 1 to the related status flag clear register bits [1] When enabled, both status registers (STATL, STATU) must be read in a single I2C transaction sequence to avoid losing information. The upper byte of the system control register controls the DC-to-DC controller. It allows for the software reset of the on-chip digital control logic back to its initialized logic state. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 23 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 15. Bit 7 6 5 4 3 2 1 0 Symbol [1] [1] [1] [1] [1] AUTO SWRT DCEN Default 1 1 1 1 0 1 0 1 [1] Though the four MSBs [7:4] are set to logic 1 after reset and bit 3 is set to logic 0, always write logic 0 to these 5 bits. Table 16. 7.10.4.5 System control register upper byte (SYSCONU, address 06h) System control register upper byte bit mapping (SYSCONU, address 06h) Bit Symbol Function 0 DCEN Enable DC-to-DC converter DCEN = logic 1; DC-to-DC converter enabled DCEN = logic 0; DC-to-DC converter disabled 1 SWRT Software reset resets all registers to their power-up default values only after the I2C-bus stop condition is detected SWRT = logic 1 reset all registers; bit SWRT is reset to logic 0 2 AUTO Enable pointer register auto increment. Pointer register address is incremented after every data byte transfer (read or write) AUTO = logic 1; pointer register auto increment enabled (default) AUTO = logic 0; pointer register auto increment disabled 3 - Reserved 4 - Reserved 5 - Reserved 6 - Reserved 7 - Reserved I/O control register (IOCONL, address 07h; IOCONH, address 08h) The I/O control register controls the General Purpose Input Output (GPIO) pins. The over-power protection circuit also controls the 60 V tolerant GPIO1 and GPIO2 pins. The GPIO3 and GPIO4 pins are 25 V tolerant and can be used for control and communication applications. A logic 1 written to the GPOx bits, tri-states the open-drain output. A logic 0 enables the open-drain output and the pin is shorted to ground. The logic level of GPIO pins is read by enabling the read buffers. The read buffers are enabled by writing a logic 1 to the corresponding GPIEx bit. The logic level of the GPIO pin is found in the matching GPIx bit. Table 17. Bit 7 6 5 4 3 2 1 0 Symbol GPIE4 GPIE3 GPIE2 GPIE1 GPO4 GPO3 GPO2 GPO1 Default 0 0 0 0 1 1 1 1 Table 18. NX2A4WP_SDS Product short data sheet I/O control register byte (IOCONL, address 07h) I/O control register byte bit mapping (IOCONL, address 07h) Bit Symbol Function 0 GPO1 GPIO1 control, logic 1 = Z; logic 0 = low ohmic; OR linked to over-power protection 1 GPO2 GPIO2 control, logic 1 = Z; logic 0 = low ohmic; OR linked to over-power protection 2 GPO3 GPIO3 control, logic 1 = Z; logic 0 = low ohmic 3 GPO4 GPIO4 control, logic 1 = Z; logic 0 = low ohmic All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 24 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 18. Bit Symbol Function 4 GPIE1 GPIO1 input buffer control, logic 0 = off; logic 1 = on 5 GPIE2 GPIO2 input buffer control, logic 0 = off; logic 1 = on 6 GPIE3 GPIO1 input buffer control, logic 0 = off; logic 1 = on 7 GPIE4 GPIO2 input buffer control, logic 0 = off; logic 1 = on Table 19. I/O control register byte (IOCONU, address 08h) Bit 7 6 5 4 3 2 1 0 Symbol [1] [1] [1] [1] GPI4 GPI3 GPI2 GPI1 Default 0 0 0 0 0 0 0 0 [1] Always write logic 0 to undefined bits Table 20. I/O control register byte bit mapping (IOCONU, address 08h) Bit Symbol Function 0 GPI1 Input data latch for GPIO1. The input buffer must be enabled by setting the GPIE1 bit to logic 1 1 GPI2 Input data latch for GPIO2. The input buffer must be enabled by setting the GPIE2 bit to logic 1 2 GPI3 Input data latch for GPIO3. The input buffer must be enabled by setting the GPIE3 bit to logic 1 3 GPI4 Input data latch for GPIO4. The input buffer must be enabled by setting the GPIE4 bit to logic 1 4  Reserved [1] 5  Reserved [1] 6  Reserved [1] 7  Reserved [1] [1] 7.10.4.6 I/O control register byte bit mapping (IOCONL, address 07h) …continued Always write logic 0 to undefined bits ADC controller subsystem channel enable registers (ADCEL, address 09h; ADCEU, address 0Ah) The ADC channel enable registers control the individual channels to be converted during a one-time scan cycle. Channels 0 to 6 can be individually selected. The conversion cycle is triggered by writing a logic 1 to the ADEN bit in the ADCEL register. The ADC controller subsystem samples and converts all selected channels in one sweep starting at the lowest selected number and stores the results. The data is transferred to the host controller via I2C reads. After the ADC cycle is triggered, the host microcontroller can start immediately to read the conversion results. Table 21. Bit NX2A4WP_SDS Product short data sheet ADC enable register lower byte (ADCEL, address 09h) 7 6 5 4 3 2 1 0 Symbol ADEN [1] AD6 AD5 AD4 AD3 AD2 AD1 AD0 Default 0 1 1 1 1 1 1 1 All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 25 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 22. Bit Symbol Function 0 AD0 VRECT measurements 1 AD1 IRECT measurements 2 AD2 VDCOUT measurements 3 AD3 IDCOUT measurements 4 AD4 VNTC measurements 5 AD5 VOTP1 measurements 6 AD6 7 [1] VOTP2 measurements ADEN [1] ADC sweep enable for channels 0 to 6 (reset after channels are read) Writing to the ADEN bit triggers the ADC controller subsystem to convert all the selected channels in one conversion cycle. The ADC controller is fast enough so that the first data can be read immediately through the 400 kHz I2C bus. Although not recommended for actual implementation, the following is just for completeness of information. The ADEN bit in the ADCEL register serves 2 purposes. It initiates ADC conversion of the selected channels and acts as a conversion busy flag. It remains logic 1 until the ADC conversion of the last selected channel is completed, and then, it is cleared. The ADEN bit cannot be written to until it is cleared to logic 0 by the ADC controller. There is no interrupt associated with the ADC. Table 23. ADC enable register upper byte (ADCEU, address 0Ah) Bit 7 6 5 4 3 2 1 0 Symbol [1] [1] [1] [1] [1] [1] [1] [1] Default 0 0 0 0 0 0 0 0 [1] 7.10.4.7 ADC enable register lower byte bit mapping (ADCEL, address 09h) Reserved, always write logic 0 to undefined bits. ADC channel data registers (ADCxDU, ADCxDL, addresses 0Bh - 14h) The ADC data registers are separated into upper byte and lower nibble of the respective 12-bit data word generated by the ADC for each channel conversion. In cases where an 8-bit value is sufficient, only the upper byte of each value can be read to reduce the read cycle time. Each 12-bit data word consists of ADCxDU(8 MSBs) and ADCxDL(4 LSBs). Table 24. ADC channels, range and nominal resolution (ADCxDU, ADCxDL, addresses 0Ah - 17h) ADC address Data 0Bh ADC0DU VRECT upper byte 0Ch ADC1DU IRECT upper byte 0Dh ADC2DU VDCOUT upper byte 0Eh ADC3DU IDCOUT upper byte 0Fh ADC4DU VNTC upper byte 10h ADC5DU VOTP1 upper byte 11h ADC6DU VOTP2 upper byte Product short data sheet B6 B5 B4 B3 B2 B1 B0 12h ADC1DL ADC0DL IRECT lower nibble, VRECT lower nibble 13h ADC3DL ADC2DL Reserved nibble, VDCOUT lower nibble 14h ADC5DL ADC4DL VOTP1 lower nibble, VNTC lower nibble ADC6DL VOTP2 lower nibble 15h NX2A4WP_SDS B7 ADC channel All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 26 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end The ADC channel binary codes related to electrical signals are listed in Table 26 to Table 27. The individual scaling per channel may differ, as the channels are scaled to the respective range. Table 25. Rectifier output voltage coding, channel ADC0Dx, VRECT Channel electrical value ADC readout, ADC0DU 0Bh[7:0]b VRECT [V] decimal code upper byte, binary code lower nibble, binary code 4 500 00011111 0100 5 624 00100111 0000 6 750 00101110 1110 7 875 00110110 1011 8 999 00111110 0111 9 1124 01000110 0100 10 1249 01001110 0001 11 1374 01010101 1110 12 1499 01011101 1011 13 1624 01100101 1000 14 1749 01101101 0101 15 1875 01110101 0011 16 1999 01111100 1111 17 2125 10000100 1101 18 2250 10001100 1010 19 2374 10010100 0110 20 2498 10011100 0010 Table 26. ADC0DL 12h[3:0]b Rectifier output current coding, channel ADC1Dx, Channel electrical value ADC readout, ADC1DU 0Ch[7:0]b ADC1DL 12h[7:4]b IRECT[1] [A] decimal code upper byte, binary code lower nibble, binary code 0.1 160 00001010 0000 0.2 336 00010101 0000 0.3 504 00011111 1000 0.4 688 00101011 0000 0.5 856 00110101 1000 0.6 1024 01000000 0000 0.7 1199 01001010 1111 0.8 1370 01010101 1010 0.9 1535 01011111 1111 1.0 1697 01101010 0001 1.1 1853 01110011 1101 [1] IRECT can be estimated using approximation formulas: IRECT  ADC(12bit) / 1715 IRECT  ADC(8bit) / 107 NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 27 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 27. DC-to-DC converter output voltage coding, channel ADC2Dx, VDCOUT Channel electrical value ADC readout, ADC2DU 0Dh[7:0]b ADC2DL 13h[3:0]b VDCOUT [V] decimal code upper byte, binary code lower nibble, binary code 4.2 1566 01100001 1110 4.4 1642 01100110 1010 4.6 1716 01101011 0100 4.8 1792 01110000 0000 5.0 1866 01110100 1010 5.2 1941 01111001 0101 5.4 2016 01111110 0000 5.6 2091 10000010 1011 5.8 2166 10000111 0110 6.0 2240 10001100 0000 6.2 2315 10010000 1011 The DC-to-DC converter current readout offers only 7 effective bits. Table 28. Channel electrical value ADC3DU 0Eh[7:0]d ADC3DU 0Eh[7:0]b IDCOUT [A] (average)[1] upper byte, decimal code upper byte, binary code 0.06 35 00100011 0.14 39 00100111 0.23 43 00101011 0.32 47 00101111 0.42 51 00110011 0.51 55 00110111 0.61 59 00111011 0.70 63 00111111 0.79 67 01000011 0.89 71 01000111 1.0 75 01001011 1.1 79 01001111 1.2 83 01010011 1.3 87 01010111 1.4 91 01011011 [1] NX2A4WP_SDS Product short data sheet DC-to-DC converter output current coding, channel ADC3Dx, IDCOUT IDCOUT is the nominal value for the maximum average output current when the DC-to-DC converter is used with a 2.2 mH inductor for L1 in Figure 1. Accuracy of the limit is largely dependent upon the inductor value tolerance All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 28 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 29. VNTC voltage coding and temperature coding, channel ADC4Dx, VNTC Channel electrical value Product short data sheet ADC4DU 0Fh[7:0]b ADC4DL 14h[3:0]b VNTC [1] [V] Tamb [C] decimal code (10 k B[1] = 3380) upper byte, binary code lower nibble, binary code 3.05 40 3783 11101100 0111 3.02 35 3756 11101010 1100 3.00 30 3723 11101000 1011 2.96 -25 3682 11100110 0010 2.92 -20 3630 11100010 1110 2.87 -15 3568 11011111 0000 2.81 -10 3494 11011010 0110 2.74 -5 3407 11010100 1111 2.66 0 3306 11001110 1010 2.57 5 3192 11000111 1000 2.47 10 3065 10111111 1001 2.36 15 2927 10110110 1111 2.24 20 2779 10101101 1011 2.11 25 2620 10100011 1100 1.98 30 2461 10011001 1101 1.85 35 2297 10001111 1001 1.72 40 2131 10000101 0011 1.59 45 1967 01111010 1111 1.46 50 1809 01110001 0001 1.34 55 1657 01100111 1001 1.22 60 1513 01011110 1001 1.11 65 1377 01010110 0001 1.01 70 1251 01001110 0011 0.91 75 1136 01000111 0000 0.83 80 1029 01000000 0101 0.75 85 931 00111010 0011 0.68 90 842 00110100 1010 0.61 95 762 00101111 1010 0.55 100 690 00101011 0010 0.50 105 624 00100111 0000 0.46 110 566 00100011 0110 0.41 115 513 00100000 0001 0.37 120 466 00011101 0010 0.34 125 423 00011010 0111 [1] NX2A4WP_SDS ADC readout, Refer to the NTC parameters in Table 40, Block Diagram in Figure 1 and trimester circuit component values in Table 4. All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 29 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end The NTC temperature values can be approximated for the full 12-bit value by the formula: 3 2 ADC  12bit  = trunc  0.00191  T amb – 0.225  T amb – 22.76  T amb + 3295  The maximum error within the temperature range of 40 C to +85 C is < 3 %. For the 8-bit MSB value, the approximation formula is: 3 2 ADC  8bit  = trunc  0.0001  T amb – 0.0121  T amb – 1.43  T amb + 204  The maximum error within the temperature range of 40 C to +80 C is < 3 %. Table 30. 7.10.4.8 VOTPx, on-chip temperature sensor coding, channel ADC5Dx and ADC6Dx, VOTPx Channel Electrical Value ADC readout, ADCxDU 10h[7:0]b 11h[7:0]b ADCxDL 14h[7:4]b 15h[3:0]b Tj [C] decimal code upper byte, binary code lower nibble, binary code 40 837 00110100 0101 30 808 00110010 1000 20 779 00110000 1011 10 749 00101110 1101 0 720 00101101 0000 5 703 00101011 1111 10 689 00101011 0001 15 674 00101010 0010 20 659 00101001 0011 25 644 00101000 0100 30 630 00100111 0110 35 614 00100110 0110 40 600 00100101 1000 45 584 00100100 1000 50 569 00100011 1001 55 554 00100010 1010 60 540 00100001 1100 65 524 00100000 1100 70 509 00011111 1101 80 479 00011101 1111 90 449 00011100 0001 100 420 00011010 0100 110 389 00011000 0101 125 344 00010101 1000 DC-to-DC regulator control register (DCSEL, address 19h) The DC-to-DC regulator control register configures the external supply DC-to-DC converter operation mode and output voltage. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 30 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 31. DC-to-DC voltage and current select register (DCSEL, address 19h) Bit 7 6 5 4 3 2 1 0 Symbol V3 V2 V1 V0 C3 C2 C1 C0 Default 0 1 0 0 1 0 1 1 Table 32. DC-to-DC voltage and current select register bit mapping (DCSEL, address 19h) Symbol Description DC-to-DC peak current limit [1] C3 C2 C1 C0 Inom [2] 0 0 0 0 0.06 A 0 0 0 1 0.14 A 0 0 1 0 0.23 A 0 0 1 1 0.32 A 0 1 0 0 0.42 A 0 1 0 1 0.51 A 0 1 1 0 0.61 A 0 1 1 1 0.70 A 1 0 0 0 0.79 A 1 0 0 1 0.89 A 1 0 1 0 1.0 A 1 0 1 1 1.1 A 1 1 0 0 1.2 A 1 1 0 1 1.3 A 1 1 1 0 1.4 A 1 1 1 1 1.5 A default value DC-to-DC output voltage select [1] V3 V2 V1 V0 nominal output voltage 0 0 0 0 4.20 V 0 0 0 1 4.40 V 0 0 1 0 4.60 V 0 0 1 1 4.80 V 0 1 0 0 5.00 V 0 1 0 1 5.20 V 0 1 1 0 5.40 V 0 1 1 1 5.60 V 1 0 0 0 5.80 V 1 0 0 1 6.00 V 1 0 1 0 6.20 V other codes NX2A4WP_SDS Product short data sheet default value 5.00 V [1] Contact NXP if there is a requirement for the use of another inductor value than 2.2 mH. [2] Inom is the nominal value for the maximum average output current when the DC-to-DC converter is used with a 2.2 mH inductor for L1 in Figure 1. Accuracy of the limit is largely dependent upon the inductor value tolerance. All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 31 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10.4.9 NTC temperature limit control register (NTCSEL, address 1Ah) The NTC interrupt temperature control register allows for selecting the trigger points for NTCU (NTC high limit temperature (Tth(high)NTC)) and NTCL (NTC low limit temperature (Tth(low)NTC)). Table 33. NTC interrupt level temperature control register (NTCSEL, address 1Ah) Bit 7 6 Symbol [1] [1] Default 0 0 Table 34. 5 4 NTCUL1 NTCUL0 0 1 2 1 0 [1] [1] NTCLL1 NTCLL0 0 0 0 1 NTC interrupt level temperature control register bit mapping (NTCSEL, address 1Ah) Bits Description NTCUL1 NTCUL0 NTCU (upper temperature) trigger INT level 0 0 55 C 0 1 60 C (default) 1 0 65 C 1 1 70 C NTCLL1 NTCLL0 NTCL (lower temperature) trigger INT level 0 0 0 C 0 1 5 C (default) 1 0 10 C 1 1 15 C [1] 7.10.4.10 3 Always write logic 0 to undefined bits. Device identification code (DEVID, address 1Fh) The device identification code stores a unique identifier for each version and/or revision of a NX2A4WP, so that the connected MCU recognizes it automatically. Table 35. Bit NX2A4WP_SDS Product short data sheet Device identification code register (DEVID, address 1Fh) 7 6 5 4 3 2 1 0 Symbol DEVID7 DEVID6 DEVID5 DEVID4 DEVID3 DEVID2 DEVID1 DEVID0 Default 0 1 0 0 0 0 0 0 All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 32 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10.5 Bus transactions2 The NX2A4WP is an I2C-bus slave device. Data is exchanged between the master and the NX2A4WP slave through read and write transactions on the I2C-bus. The two communication lines are a serial data line (SDA) and a serial clock line (SCL). Both lines are connected to the VOUT18 supply via integrated 2.1 k resistors. Data transfer may be initiated only when the bus is not busy. 7.10.5.1 Write commands Data is transmitted to the NX2A4WP by sending the device address and setting the Least Significant Bit (LSB) to a logic 0 (see Figure 10 for device address). The command byte is sent after the address and determines which register receives the data that follows the command byte. If the auto increment bit AUTO is set to logic 1, the register address receiving the data is increased with every acknowledge of the slave. The example below shows a single write to a hypothetical port register at address 01h. SCL 1 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 0 START condition 0 data to register command byte 0 0 0 R/W A 0 0 0 acknowledge from slave 0 0 0 STOP condition 0 1 A DATA 1 A P acknowledge from slave acknowledge from slave write to port tv(Q) data out from port DATA 1 VALID aaa-017114 Fig 13. Write to registers 2. Reference: ‘I2C-bus specification and user manual’, UM10204, Rev. 06, 4 April 2014 NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 33 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 7.10.5.2 Read commands To read data from the NX2A4WP, the bus master must first send the NX2A4WP slave address with the least significant bit set to a logic 0 (see Figure 10 for device address). The command byte (sent after the address) determines which register is to be accessed. After a restart the device address is sent again, but this time the LSB is set to a logic 1. The NX2A4WP slave sends the data from the register defined by the command byte (see Figure 14). If AUTO is set to logic 1, the address counter is incremented with every acknowledge from the master. If AUTO is logic 0, every data read accesses the same register address. Data is clocked into the output shift register on the rising edge of the ACK clock pulse. There is no limit on the number of data bytes in one read transmission. However, on the final byte, the bus master must not acknowledge the data. slave address SDA S 0 1 0 0 0 command byte 0 0 0 START condition A 0 R/W slave address 0 1 0 0 (repeated) START condition 0 0 1 1 1 0 1 (cont.) A acknowledge from slave acknowledge from slave (cont.) S 0 data from register 0 0 1 A DATA (first byte) R/W acknowledge from slave data from register A acknowledge from master DATA (last byte) NA P no acknowledge from master at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter STOP condition 002aah680 Fig 14. Read from register 7.10.6 Reserved registers (20h to FFh) The reserved registers are not for customer use. Do not write to these registers. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 34 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 8. Recommended operating conditions Table 36. Symbol Recommended operating conditions Parameter Conditions input voltage VI VO(rect) rectifier output voltage Tamb ambient temperature Min Max Unit AC1, AC2 [1] 6.1 18 V DC output voltage [2] 4.3 13.7 V 40 85 C [1] A voltage level below 6.1 V is not recommended. The device might not be able to provide the maximum power in combination with nominal output voltage at the highest possible efficiency. A voltage level above 18 V triggers the protection circuit [2] Refer to the A4WP BSS1.2 VRX_OC_HIGH specification. NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 35 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 9. Characteristics Table 37. Static characteristics At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions VIH HIGH-level input voltage SDA, SCL 1.26 - - V input1; GPIOx 2.3 - - V input2; TA 1.7 - - V SDA, SCL 0.5 - +0.54 V input1; GPIOx 0.5 - +1 V input2; TA 0.5 - +0.4 V - 0.2 - V - - 0.4 V VIL LOW-level input voltage Min Typ Max Unit VI(hys) hysteresis of input voltage VOL LOW-level output voltage INT, SDA; II = 4 mA GPIOx; II = 200 mA - - 0.5 V Vstartup start-up voltage VO(rect) for LDOs - 3.8 - V Vstartup(hys) start-up voltage hysteresis VO(rect) for LDOs - 500 - mV Vtrip(bo) brownout trip voltage - 3.3 - V Vbo(hys) brownout voltage hysteresis DC-to-DC supply - 1.5 - V VDD supply voltage VO(rect) supply voltage level (LDRECT pin) for DC-to-DC start-up - 6.5 - V Ven enable voltage I2C transceiver; at LDRECT - 4.3 - V ADC; at LDRECT - 4.3 - V Vovd(en) enable over-voltage detection voltage pin RECT; over-power protection; GPIO1 & GPIO2 low impedance 17 18 19 V Vovd(dis) disable over-voltage detection voltage pin RECT; over-power protection; GPIO1 & GPIO2 low impedance - 17 - V Vovp(en) enable over-voltage protection voltage rectifier is disabled and both AC input ports are shorted to ground and/or over-power protection is enabled 19 20 21.5 V Vovp(dis) disable over-voltage protection voltage pin RECT - 19 - V Vovp(hys) overvoltage protection voltage hysteresis pin RECT; Vovp(en) and Vovd(en) - 1 - V Tj junction temperature over-temperature trigger - 125 - C Tj(hys) junction temperature hysteresis over-temperature - 25 - C Tth(high)NTC NTC high threshold temperature 55 60 70 C Tth(low)NTC NTC low threshold temperature 0 5 15 C NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 36 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 37. Static characteristics …continued At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Iq quiescent current VDCIN = 8 V = VO(rect); ILDO18, ILDO33 = 0 mA; ADC and I2C enabled - - - - DC-to-DC disabled - 3.5 - mA DC-to-DC enabled V = 0 mA - 12 - mA Rpu(int) internal pull-up resistance Min Typ Max Unit internal INT pull-up resistor value - 20 - k internal SCL, SDA pull-up resistor value - 2.1 - k Table 38. Electrical characteristics LDOs At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VO output voltage OUT33; IO = 1 mA 3 3.3 3.6 V OUT18; IO = 1 mA 1.755 1.800 1.860 V OUT33; VO(rect) = 4.5 V - 2.1 - ms tstartup start-up time tr rise time IO(max) maximum output current OUT18; VO(rect) = 4.5 V - 2.0 - ms start-up ramp: OUT33; VO(rect) = 4.5 V CVOUT33 = suggested applications component IVOUT33 = 0 A - 155 - ms start-up ramp: OUT18; VO(rect) = 4.5 V CVOUT18 = suggested applications component IVOUT33 = 0 A - 60 - ms OUT33; VO = 0.975  V 100 - - mA OUT18; VO = 0.975  V 100 - - mA [1] The maximum output current IODC depends on the total power consumption of the device. It is limited by the voltage drop from the incoming DC voltage VO(rect). The power dissipation of the two external supply LDO can be calculated to: PLDO = (VO(rect) - VOUT33)*IOUT33 + (VO(rect)- VOUT18)*IOUT18. [2] Under overload conditions, the LDO maximum current folds back to provide the short circuit protection. Table 39. Electrical characteristics: DC-to-DC buck converter At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 5.0 - V - 0.2 - V DC-to-DC buck regulator VO VO(step) output voltage output voltage step size NX2A4WP_SDS Product short data sheet DC-to-DC converter output voltage; Register 19h[7:3]=00100 (default) programmable VO All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 [1] [2] © NXP Semiconductors N.V. 2015. All rights reserved. 37 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 39. Electrical characteristics: DC-to-DC buck converter …continued At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless otherwise specified. Symbol Parameter Conditions Min Typ Max Nstep number of steps programmable VO - 11 - VO output voltage programmable output voltage range 4.2  6.2 V IO(max) maximum output current L1 = suggested applications component register 19h[3:0]=1011 (default) - 1.1 - A Nstep number of steps number of programmable IOUT steps - 16 - IO output current programmable output current range 0.06 - 1.5 A ten enable time VO start-up time after enable command - 0.6 - ms - 0.3 - ms [2] Unit I2C command until LX switching; VO(rect) = 6.5 V rise time tr 10 % to 90 % of the output swing; VO(rect)= 6.5 V CVOUT = suggested applications component IVOUT = 0 A [1] VO(nom) = nominal output voltage (I2C programmable). [2] If the load current exceeds IOlim(nom), the DC-to-DC output voltage drops below VOnom. Table 40. Electrical characteristics: ADC Symbol Parameter Nres(ADC) ADC resolution DNL differential non-linearity INL Conditions Min Typ Max Unit - 12 - bit Using 5 % to 95 % of full scale linear fit - 1 - LSB integral non-linearity Using 5 % to 95 % of full scale linear fit - 5 - LSB EO offset error Using 5 % to 95 % of full scale linear fit - 2 - LSB EG gain error Using 5 % to 95 % of full scale linear fit - 0.65 - %FS fs sampling frequency - 187 - kHz fclk clock frequency - 6 - MHz Eres(ADC) ADC resolution error - - 3 % - - 8 % - - 3 % 12-bit40 C  Tj  +125 C ADC0Dx; VO(rect) ADC1Dx; IO(rect) ADC2Dx; VDCOUT [2] Internal temperature measurement Tj junction temperature device temperature range 40 - 125 C Tacc temperature accuracy 0 C to +85 C - 3 - C 40 C to +125 C - 3 5 C - 0.4 - C Tres temperature resolution NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 38 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Table 40. Symbol Electrical characteristics: ADC …continued Parameter Conditions Min Typ Max Unit NTC temperature measurement Vref(VREF33) reference voltage on pin VREF33 NTC supply; Iload = 150 A 3.22 3.3 3.38 V VI input voltage temperature channel input voltage range; Iload = 0 A 0.28 - 3.1 V Tacc temperature accuracy 0 C to +85 C - 3 - C 40 C to +125 C - 3 5 C - 0.04 - C Tres temperature resolution R25 thermistor resistance (25C) NTCs resistance at 25 C - 10 - k B25/50 thermal sensitivity index B25/50 NTCs B-constant (25/50 C)[4] - 3380 - K Rbias(s) series bias resistance - 5 - k Rbias(par) parallel bias resistance - 80 - k [1] IDCOUT is the nominal value for the maximum average output current when the DC-to-DC converter is used with a 2.2 H inductor for L1 in Figure 1. Accuracy of the limit is largely dependent upon the inductor value tolerance [2] At lower currents the maximum of IO(rect) accuracy is 50 mA. [3] At lower currents the IDCOUT accuracy is typically 3 LSB. [4] ln  R  R 0  B = ----------------------------1  T – 1  T0 NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 39 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 10. Package outline WLCSP42: wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) ball A1 index area A B E NX2A4WP A2 A D A1 detail X e1 C 1/2 e e Øv Øw b C A B C y G F E e2 D C B A ball A1 index area 1 2 3 4 5 6 X 0 3 mm scale Dimensions (mm are the original dimensions) Unit A max 0.61 nom 0.57 min 0.53 mm A1 A2 0.26 0.23 0.20 0.37 0.34 0.31 b D E 0.34 3.58 3.43 0.32 3.56 3.41 0.30 3.54 3.39 e e1 e2 0.5 2.5 3.0 v w y 0.15 0.05 0.03 wlcsp42_nx2a4wp_po Outline version References IEC JEDEC JEITA European projection Issue date 15-03-03 15-03-10 NX2A4WP Fig 15. Package outline WLCSP42 NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 40 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 11. Soldering of WLCSP packages A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount reflow soldering”. 12. Abbreviations Table 41. Abbreviations Acronym Description A4WP Alliance For Wireless Power (Rezence) ADC Analog-to-Digital Converter BOD Brown Out Detection BT-LE Bluetooth Low Energy CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge GPIO General Purpose Input Output HBM Human Body Model ISR Interrupt Service Request LDO Low-Dropout Regulator LSB Least Significant Bit MCU Micro-Controller Unit MOSFET Metal-Oxide Semiconductor Field Effect Transistor MSB Most Significant Bit NTC Negative Temperature Coefficient OCP Over current protection OTP Over-temperature protection OVP Over-voltage protection PMU Power management Unit POR Power-On Reset SCL Line Serial Clock Line SDA Line Serial Data Line UVLO Under-voltage lockout VBUS USB Power Supply 13. Revision history Table 42. Revision history Document ID Release date Data sheet status Change notice Supersedes NX2A4WP_SDS v.3 20150804 Product short data sheet - NX2A4WP_SDS v.2 NX2A4WP_SDS v.2 20150709 Objective short data sheet - NX2A4WP_SDS v.1 NX2A4WP_SDS v.1 20150420 Objective short data sheet - - NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 41 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 42 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NX2A4WP_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 4 August 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 43 of 44 NX2A4WP NXP Semiconductors High frequency wireless charging receiver front end 16. Contents 1 2 3 4 4.1 5 6 7 7.1 7.1.1 7.1.2 7.2 7.3 7.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . 6 Automatic over-power protection (OVP) . . . . . 7 Automatic over-voltage protection . . . . . . . . . . 8 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 On-chip over-temperature protection . . . . . . . 11 Off-chip NTC over- and under-temperature protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.5 DCIN and LDRECT inputs . . . . . . . . . . . . . . . 12 7.6 LDODCPL. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7.7 LDO start-up control . . . . . . . . . . . . . . . . . . . . 13 7.8 General Purpose digital Input Output ports (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.9 External supply detect pin (TA). . . . . . . . . . . . 14 7.10 Software interface. . . . . . . . . . . . . . . . . . . . . . 15 7.10.1 I2C device address . . . . . . . . . . . . . . . . . . . . . 15 7.10.2 I2C-bus interface definition . . . . . . . . . . . . . . . 15 7.10.3 Pointer register and command byte . . . . . . . . 15 7.10.4 Register descriptions . . . . . . . . . . . . . . . . . . . 19 7.10.4.1 Status registers (STATL, address 00h; STATU, address 01h) . . . . . . . . . . . . . . . . . . . 19 7.10.4.2 Status flag clear registers (SFCLRL, address 02h; SFCLRU, address 03h). . . . . . . 21 7.10.4.3 Interrupt control register (ICON, address 04h) 22 7.10.4.4 System control registers (SYSCONL, address 05h; SYSCONU, address 06h) . . . . . 22 7.10.4.5 I/O control register (IOCONL, address 07h; IOCONH, address 08h) . . . . . . . . . . . . . . . . . 24 7.10.4.6 ADC controller subsystem channel enable registers (ADCEL, address 09h; ADCEU, address 0Ah) . . . . . . . . . . . . . . . . . . 25 7.10.4.7 ADC channel data registers (ADCxDU, ADCxDL, addresses 0Bh - 14h) . . . . . . . . . . . 26 7.10.4.8 DC-to-DC regulator control register (DCSEL, address 19h) . . . . . . . . . . . . . . . . . . 30 7.10.4.9 NTC temperature limit control register (NTCSEL, address 1Ah) . . . . . . . . . . . . . . . . . 32 7.10.4.10 Device identification code (DEVID, address 1Fh) . . . . . . . . . . . . . . . . . . 32 7.10.5 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 33 7.10.5.1 Write commands . . . . . . . . . . . . . . . . . . . . . . 7.10.5.2 Read commands . . . . . . . . . . . . . . . . . . . . . . 7.10.6 Reserved registers (20h to FFh) . . . . . . . . . . 8 Recommended operating conditions . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of WLCSP packages . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information . . . . . . . . . . . . . . . . . . . . . . 14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 14.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 16 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 34 34 35 36 40 41 41 41 42 42 42 42 43 43 44 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 August 2015 Document identifier: NX2A4WP_SDS