NX3L2T66
Dual low-ohmic single-pole single-throw analog switch
Rev. 7.1 — 12 August 2020
1
Product data sheet
General description
NX3L2T66 is a dual low-ohmic single-pole single-throw analog switch. Each switch has
two input/output terminals (nY and nZ) and an active HIGH enable input (nE). When pin
nE is LOW, the analog switch is turned off.
Schmitt trigger action at the enable input (nE) makes the circuit tolerant to slower input
rise and fall times. A low input voltage threshold allows pin nE to be driven by lower level
logic signals without a significant increase in supply current ICC. This makes it possible
for the NX3L2T66 to switch 4.3 V signals with a 1.8 V digital controller, eliminating the
need for logic level translation.
NX3L2T66 allows signals with amplitude up to VCC to be transmitted from nY to nZ;
or from nZ to nY. Its low ON resistance (0.5 Ω) and flatness (0.13 Ω) ensures minimal
attenuation and distortion of transmitted signals.
2
Features and benefits
• Wide supply voltage range from 1.4 V to 4.3 V
• Very low ON resistance (peak):
– 1.6 Ω (typical) at VCC = 1.4 V
– 1.0 Ω (typical) at VCC = 1.65 V
– 0.55 Ω (typical) at VCC = 2.3 V
– 0.50 Ω (typical) at VCC = 2.7 V
– 0.50 Ω (typical) at VCC = 4.3 V
• High noise immunity
• ESD protection:
– HBM JESD22-A114F Class 3A exceeds 7500 V
– MM JESD22-A115-A exceeds 200 V
– CDM AEC-Q100-011 revision B exceeds 1000 V
– IEC61000-4-2 contact discharge exceeds 4000 V for switch ports
• CMOS low-power consumption
• Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
• 1.8 V control logic at VCC = 3.6 V
• Control input accepts voltages above supply voltage
• Very low supply current, even when input is below VCC
• High current handling capability (350 mA continuous current under 3.3 V supply)
• Specified from -40 °C to +85 °C and from -40 °C to +125 °C
NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
3
Applications
• Cell phone
• PDA
• Portable media player
4
Ordering information
Table 1. Ordering information
Type number
Topside
[1]
marking
Package
Name
Description
Version
NX3L2T66GT
DOO
XSON8
plastic extremely thin small outline package; no leads;
8 terminals; body 1 × 1.95 × 0.5 mm
SOT833-1
NX3L2T66GM
DOO
XQFN8
plastic extremely thin quad flat package; no leads; 8
terminals; body 1.6 × 1.6 × 0.5 mm
SOT902-2
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
4.1 Ordering options
Table 2. Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum order Temperature
quantity
NX3L2T66GT
NX3L2T66GT,115
XSON8
REEL 7" Q1 NDP
5000
Tamb = -40 °C to +125 °C
NX3L2T66GM
NX3L2T66GM,125
XQFN8
REEL 7" Q3 NDP
4000
Tamb = -40 °C to +125 °C
5
Functional diagram
1Y
1Z
1E
2Z
2Y
Y
2E
E
001aag497
Figure 1. Logic symbol
NX3L2T66
Product data sheet
Z
001aah372
Figure 2. Logic diagram (one switch)
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
6
Pinning information
6.1 Pinning
NX3L2T66
1Y
1
8
VCC
1Z
2
7
1E
2E
3
6
2Z
GND
4
5
2Y
001aaj083
Transparent top view
Figure 3. Pin configuration SOT833-1 (XSON8)
NX3L2T66
1E
1
2Z
2Y
8
VCC
terminal 1
index area
1Y
2
6
1Z
3
5
2E
GND
4
7
001aaj084
Transparent top view
Figure 4. Pin configuration SOT902-2 (XQFN8)
6.2 Pin description
Table 3. Pin description
Symbol
Description
Pin
SOT833-1
SOT902-2
1Y, 2Y
1, 5
7, 3
independent input or output
1Z, 2Z
2, 6
6, 2
independent input or output
GND
4
4
ground (0 V)
1E, 2E
7, 3
1, 5
enable input (active HIGH)
VCC
8
8
supply voltage
NX3L2T66
Product data sheet
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3 / 21
NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
7
Functional description
Table 4. Function table
[1]
Input nE
Switch
L
OFF-state
H
ON-state
[1]
H = HIGH voltage level; L = LOW voltage level
8
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Conditions
enable input nE
Min
Max
Unit
-0.5
+4.6
V
[1]
-0.5
+4.6
V
[2]
-0.5
VCC + 0.5 V
VSW
switch voltage
IIK
input clamping current
VI < -0.5 V
-50
-
mA
ISK
switch clamping current
VI < -0.5 V or VI > VCC + 0.5 V
-
±50
mA
ISW
switch current
VSW > -0.5 V or VSW < VCC + 0.5 V; source or
sink current
-
±350
mA
VSW > -0.5 V or VSW < VCC + 0.5 V; pulsed at
1 ms duration, < 10 % duty cycle; peak current
-
±500
mA
-65
+150
°C
-
250
mW
Tstg
storage temperature
Ptot
[1]
[2]
[3]
total power dissipation
[3]
Tamb = -40 °C to +125 °C
The minimum input voltage rating may be exceeded if the input current rating is observed.
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V.
For XSON8 and XQFN8 packages: Above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
9
Recommended operating conditions
Table 6. Recommended operating conditions
Symbol Parameter
VCC
supply voltage
VI
input voltage
VSW
switch voltage
Tamb
ambient temperature
Δt/ΔV
[1]
[2]
input transition rise and fall rate
Conditions
enable input nE
[1]
VCC = 1.4 V to 4.3 V
[2]
Min
Typ
Max
Unit
1.4
-
4.3
V
0
-
4.3
V
0
-
VCC
V
-40
-
+125
°C
-
-
200
ns/V
To avoid sinking GND current from terminal nZ when switch current flows in terminal nY, the voltage drop across the bidirectional switch must not exceed
0.4 V. If the switch current flows into terminal nZ, no GND current will flow from terminal nY. In this case, there is no limit for the voltage drop across the
switch.
Applies to control signal levels.
NX3L2T66
Product data sheet
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
10 Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
VIH
VIL
Conditions
Tamb = 25 °C
Typ
Max
Min
VCC = 1.4 V to 1.6 V
0.9
-
-
0.9
-
-
V
VCC = 1.65 V to 1.95 V
0.9
-
-
0.9
-
-
V
VCC = 2.3 V to 2.7 V
1.1
-
-
1.1
-
-
V
VCC = 2.7 V to 3.6 V
1.3
-
-
1.3
-
-
V
VCC = 3.6 V to 4.3 V
1.4
-
-
1.4
-
-
V
VCC = 1.4 V to 1.6 V
-
-
0.3
-
0.3
0.3
V
VCC = 1.65 V to 1.95 V
-
-
0.4
-
0.4
0.3
V
VCC = 2.3 V to 2.7 V
-
-
0.4
-
0.4
0.4
V
VCC = 2.7 V to 3.6 V
-
-
0.5
-
0.5
0.5
V
VCC = 3.6 V to 4.3 V
-
-
0.6
-
0.6
0.6
V
-
-
-
-
±0.5
±1
μA
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
VCC = 3.6 V to 4.3 V
-
-
±10
-
±50
±500
nA
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
VCC = 3.6 V to 4.3 V
-
-
±10
-
±50
±500
nA
VCC = 3.6 V
-
-
100
-
690
6000
nA
VCC = 4.3 V
-
-
150
-
800
7000
nA
VSW = GND or VCC
additional
supply current
VI = 2.6 V; VCC = 4.3 V
-
2.0
4.0
-
7
7
μA
VI = 2.6 V; VCC = 3.6 V
-
0.35
0.7
-
1
1
μA
VI = 1.8 V; VCC = 4.3 V
-
7.0
10.0
-
15
15
μA
VI = 1.8 V; VCC = 3.6 V
-
2.5
4.0
-
5
5
μA
VI = 1.8 V; VCC = 2.5 V
-
50
200
-
300
500
nA
HIGH-level
input voltage
LOW-level
input voltage
input leakage
current
enable input nE; VI = GND
to 4.3 V; VCC = 1.4 V to
4.3 V
IS(OFF)
OFF-state
leakage
current
nY port; see Figure 5
ON-state
leakage
current
nZ port; see Figure 6
ICC
ΔICC
Unit
Min
II
IS(ON)
Tamb = -40 °C to +125 °C
Max
Max
(85 °C) (125 °C)
supply current VI = VCC or GND; VSW =
GND or VCC
CI
input
capacitance
-
1.0
-
-
-
-
pF
CS(OFF)
OFF-state
capacitance
-
35
-
-
-
-
pF
NX3L2T66
Product data sheet
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Symbol Parameter
CS(ON)
Conditions
Tamb = 25 °C
ON-state
capacitance
Tamb = -40 °C to +125 °C
Min
Typ
Max
Min
-
110
-
-
Unit
Max
Max
(85 °C) (125 °C)
-
-
pF
10.1 Test circuits
VCC
VCC
nE
VIL
nZ
VI
nE
VIH
nY
IS
IS
GND
VO
nZ
nY
GND
VI
VO
001aaj221
001aaj222
VI = 0.3 V or VCC - 0.3 V; VO = VCC - 0.3 V or 0.3 V.
VI = 0.3 V or VCC - 0.3 V; VO = open circuit.
Figure 5. Test circuit for measuring OFF-state leakage
current
Figure 6. Test circuit for measuring ON-state leakage
current
10.2 ON resistance
Table 8. ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14.
Symbol
Parameter
Conditions
Tamb = -40 °
C to +85 °C
Min
RON(peak)
ON resistance (peak)
Max
1.6
3.7
-
4.1
Ω
VCC = 1.65 V
-
1.0
1.6
-
1.7
Ω
VCC = 2.3 V
-
0.55
0.8
-
0.9
Ω
VCC = 2.7 V
-
0.5
0.75
-
0.9
Ω
-
0.5
0.75
-
0.9
Ω
VCC = 1.4 V
-
0.04
0.3
-
0.3
Ω
VCC = 1.65 V
-
0.04
0.2
-
0.3
Ω
VCC = 2.3 V
-
0.02
0.08
-
0.1
Ω
VCC = 2.7 V
-
0.02
0.075
-
0.1
Ω
-
0.02
0.075
-
0.1
Ω
-
1.0
3.3
-
3.6
Ω
ON resistance (flatness) VI = GND to VCC; ISW =
100 mA
VCC = 1.4 V
Product data sheet
Min
-
ON resistance mismatch VI = GND to VCC; ISW =
between channels
100 mA
NX3L2T66
Max
VCC = 1.4 V
[2]
VCC = 4.3 V
RON(flat)
[1]
Unit
VI = GND to VCC; ISW =
100 mA; see Figure 7
VCC = 4.3 V
ΔRON
Typ
Tamb = -40 °
C to +125 °C
[3]
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Symbol
Parameter
Conditions
Tamb = -40 °
C to +85 °C
Min
[1]
[2]
[3]
Typ
[1]
Tamb = -40 °
C to +125 °C
Max
Min
Max
Unit
VCC = 1.65 V
-
0.5
1.2
-
1.3
Ω
VCC = 2.3 V
-
0.15
0.3
-
0.35
Ω
VCC = 2.7 V
-
0.13
0.3
-
0.35
Ω
VCC = 4.3 V
-
0.2
0.4
-
0.45
Ω
Typical values are measured at Tamb = 25 °C.
Measured at identical VCC, temperature and input voltage.
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and temperature.
10.3 ON resistance test circuit and graphs
001aag564
1.6
RON
(Ω)
1.2
(1)
0.8
(2)
(3)
(4)
0.4
(5)
(6)
VSW
0
VCC
nE
VIH
nZ
VI
nY
GND
ISW
001aaj223
RON = VSW / ISW.
Figure 7. Test circuit for measuring ON resistance
NX3L2T66
Product data sheet
0
1
2
3
4
VI (V)
5
1. VCC = 1.5 V.
2. VCC = 1.8 V.
3. VCC = 2.5 V.
4. VCC = 2.7 V.
5. VCC = 3.3 V.
6. VCC = 4.3 V.
Measured at Tamb = 25 °C.
Figure 8. Typical ON resistance as a function of input
voltage
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
001aag565
1.6
RON
(Ω)
RON
(Ω)
0.8
1.2
0.4
0.4
0
0.2
0
1
2
VI (V)
0
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 9. ON resistance as a function of input voltage;
VCC = 1.5 V
0
1
2
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 10. ON resistance as a function of input voltage;
VCC = 1.8 V
001aag567
1.0
001aag568
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
(1)
(2)
(3)
(4)
0.6
(1)
(2)
(3)
(4)
0.8
1.
2.
3.
4.
001aag566
1.0
0.2
0
1
2
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 11. ON resistance as a function of input voltage;
VCC = 2.5 V
NX3L2T66
Product data sheet
0
3
0
1
2
VI (V)
3
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 12. ON resistance as a function of input voltage;
VCC = 2.7 V
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
001aag569
1.0
RON
(Ω)
RON
(Ω)
0.8
0.8
0.6
0.6
(1)
(2)
(3)
(4)
0.4
0
(1)
(2)
(3)
(4)
0.4
0.2
1.
2.
3.
4.
001aaj896
1.0
0.2
0
1
2
3
VI (V)
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
1.
2.
3.
4.
Figure 13. ON resistance as a function of input voltage;
VCC = 3.3 V
NX3L2T66
Product data sheet
0
4
0
1
2
3
4
VI (V)
5
Tamb = 125 °C.
Tamb = 85 °C.
Tamb = 25 °C.
Tamb = -40 °C.
Figure 14. ON resistance as a function of input voltage;
VCC = 4.3 V
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
11 Dynamic characteristics
Table 9. Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 16.
Symbol Parameter
ten
enable time
tdis
[1]
disable time
Conditions
Tamb = 25 °C
Tamb = -40 °C to +125 °C
Unit
Min
Typ
Max
Min
Max
(85 °C)
Max
(125 °C)
VCC = 1.4 V to 1.6 V
-
35
49
-
53
57
ns
VCC = 1.65 V to
1.95 V
-
28
40
-
43
48
ns
VCC = 2.3 V to 2.7 V
-
20
30
-
32
35
ns
VCC = 2.7 V to 3.6 V
-
18
28
-
30
32
ns
VCC = 3.6 V to 4.3 V
-
18
28
-
30
32
ns
VCC = 1.4 V to 1.6 V
-
32
70
-
80
90
ns
VCC = 1.65 V to
1.95 V
-
23
55
-
60
65
ns
VCC = 2.3 V to 2.7 V
-
14
25
-
30
35
ns
VCC = 2.7 V to 3.6 V
-
11
20
-
25
30
ns
VCC = 3.6 V to 4.3 V
-
11
20
-
25
30
ns
[1]
nE to nZ or nY; see
Figure 15
nE to nZ or nY; see
Figure 15
Typical values are measured at Tamb = 25 °C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.
11.1 Waveform and test circuits
VI
nE input
VM
GND
ten
nY output
OFF to HIGH
HIGH to OFF
VOH
tdis
VX
VX
GND
switch
disabled
switch
enabled
switch
disabled
001aah376
Measurement points are given in Table 10.
Logic level: VOH is the typical output voltage level that occurs with the output load.
Figure 15. Enable and disable times
NX3L2T66
Product data sheet
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Table 10. Measurement points
Supply voltage
Input
Output
VCC
VM
VX
1.4 V to 4.3 V
0.5VCC
0.9VOH
VCC
nE
nY/nZ
G
VI
V
VO
RL
nZ/nY
VEXT = 1.5 V
CL
001aaj224
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Figure 16. Test circuit for measuring switching times
Table 11. Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
1.4 V to 4.3 V
VCC
≤ 2.5 ns
35 pF
50 Ω
Load
11.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf ≤ 2.5 ns.
Symbol Parameter
THD
total harmonic
distortion
Conditions
Tamb = 25 °C
Min
Typ
Max
VCC = 1.4 V; VI = 1 V (p-p)
-
0.15
-
%
VCC = 1.65 V; VI = 1.2 V (p-p)
-
0.10
-
%
VCC = 2.3 V; VI = 1.5 V (p-p)
-
0.02
-
%
VCC = 2.7 V; VI = 2 V (p-p)
-
0.02
-
%
-
0.02
-
%
-
60
-
MHz
fi = 20 Hz to 20 kHz; RL = 32 Ω; see Figure 17
[1]
VCC = 4.3 V; VI = 2 V (p-p)
f(-3dB)
αiso
-3 dB frequency
response
isolation (OFF-state)
NX3L2T66
Product data sheet
Unit
RL = 50 Ω; see Figure 18
[1]
VCC = 1.4 V to 4.3 V
fi = 100 kHz; RL = 50 Ω; see Figure 19
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Rev. 7.1 — 12 August 2020
[1]
© NXP B.V. 2020. All rights reserved.
11 / 21
NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Symbol Parameter
Conditions
Tamb = 25 °C
Min
Typ
Max
-
-90
-
dB
-
0.2
-
V
-
0.2
-
V
-
-90
-
dB
VCC = 1.5 V
-
3
-
pC
VCC = 1.8 V
-
3
-
pC
VCC = 2.5 V
-
3
-
pC
VCC = 3.3 V
-
3
-
pC
VCC = 4.3 V
-
6
-
pC
VCC = 1.4 V to 4.3 V
Vct
crosstalk voltage
between digital inputs and switch; fi = 1 MHz; CL =
50 pF; RL = 50 Ω; see Figure 20
VCC = 1.4 V to 3.6 V
VCC = 3.6 V to 4.3 V
Xtalk
crosstalk
between switches; fi = 100 kHz; RL = 50 Ω; see
Figure 21
VCC = 1.4 V to 4.3 V
Qinj
[1]
charge injection
Unit
[1]
fi = 1 MHz; CL = 0.1 nF; RL = 1 MΩ; Vgen = 0 V; Rgen
= 0 Ω; see Figure 22
fi is biased at 0.5VCC.
11.3 Test circuits
VCC
0.5VCC
nE
VIH
RL
nY/nZ
nZ/nY
D
fi
001aaj225
Figure 17. Test circuit for measuring total harmonic distortion
VCC
0.5VCC
nE
VIH
nY/nZ
RL
nZ/nY
dB
fi
001aaj226
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads -3 dB.
Figure 18. Test circuit for measuring the frequency response when channel is in ON-state
NX3L2T66
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
0.5VCC
VCC
VIL
RL
0.5VCC
nE
RL
nY/nZ
nZ/nY
dB
fi
001aaj227
Adjust fi voltage to obtain 0 dBm level at input.
Figure 19. Test circuit for measuring isolation (OFF-state)
VCC
nE
nY/nZ
G
VI
nZ/nY
RL
RL
0.5VCC
0.5VCC
V
CL
VO
001aaj228
a. Test circuit
logic
input (nE)
off
on
off
VO
Vct
001aaj231
b. input and output pulse definitions
Figure 20. Test circuit for measuring crosstalk voltage between digital inputs and switch
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
0.5VCC
1E
VIH
RL
1Y or 1Z
fi
1Z or 1Y
CHANNEL
ON
50 Ω
V
VO1
0.5VCC
2E
VIL
RL
2Z or 2Y
2Y or 2Z
CHANNEL
OFF
Ri
50 Ω
V
VO2
001aah382
20 log10 (VO2 / VO1) or 20 log10 (VO1 / VO2).
Figure 21. Test circuit for measuring crosstalk between switches
VCC
nE
nY/nZ
G
VI
V
VO
RL
nZ/nY
Rgen
Vgen
CL
GND
001aaj229
a. Test circuit
logic
input (nE)
off
on
off
VO
VO
001aaj232
Definition: Qinj = ΔVO × CL.
ΔVO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
b. Input and output pulse definitions
Figure 22. Test circuit for measuring charge injection
NX3L2T66
Product data sheet
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
12 Package outline
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Figure 23. Package outline SOT833-1 (XSON8)
NX3L2T66
Product data sheet
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NX3L2T66
NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
X
D
B
A
terminal 1
index area
E
A
A1
detail X
e
v
w
b
4
3
C
C A B
C
y1 C
y
5
e1
terminal 1
index area
2
6
L 1
7
k
8
L2
L
k
metal area
not for soldering
L3
L1
0
1
Dimensions
Unit(1)
mm
max
nom
min
2 mm
scale
A
0.5
A1
b
D
E
e
e1
0.05 0.25 1.65 1.65
0.20 1.60 1.60 0.55
0.00 0.15 1.55 1.55
0.5
k
0.2
L
L1
L2
L3
0.35 0.15 0.25 0.35
0.30 0.10 0.20 0.30
0.25 0.05 0.15 0.25
v
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT902-2
---
MO-255
---
sot902-2_po
European
projection
Issue date
16-07-14
16-11-08
Figure 24. Package outline SOT902-2 (XQFN8)
NX3L2T66
Product data sheet
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NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
13 Abbreviations
Table 13. Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PDA
Personal Digital Assistant
14 Revision history
Table 14. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX3L2T66 v.7.1
20200811
Product data sheet
-
-
Modifications:
• Removed NX3L2T66GD package option
• Updated Figure 24
NX3L2T66 v.7
20130208
Product data sheet
-
NX3L2T66 v.6
NX3L2T66 v.6
20120606
Product data sheet
-
NX3L2T66 v.5
NX3L2T66 v.5
20111107
Product data sheet
-
NX3L2T66 v.4
NX3L2T66 v.4
20101229
Product data sheet
-
NX3L2T66 v.3
NX3L2T66 v.3
20090828
Product data sheet
-
NX3L2T66 v.2
NX3L2T66 v.2
20090420
Product data sheet
-
NX3L2T66 v.1
NX3L2T66 v.1
20081204
Product data sheet
-
-
NX3L2T66
Product data sheet
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NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
15 Legal information
15.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
NX3L2T66
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
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18 / 21
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NXP Semiconductors
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
NX3L2T66
Product data sheet
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................3
Function table ....................................................4
Limiting values .................................................. 4
Recommended operating conditions ................. 4
Static characteristics ......................................... 5
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
ON resistance ................................................... 6
Dynamic characteristics .................................. 10
Measurement points ........................................11
Test data ......................................................... 11
Additional dynamic characteristics .................. 11
Abbreviations ...................................................17
Revision history ...............................................17
Fig. 13.
ON resistance as a function of input voltage;
VCC = 3.3 V ..................................................... 9
ON resistance as a function of input voltage;
VCC = 4.3 V ..................................................... 9
Enable and disable times ................................10
Test circuit for measuring switching times ....... 11
Test circuit for measuring total harmonic
distortion .......................................................... 12
Test circuit for measuring the frequency
response when channel is in ON-state ............12
Test circuit for measuring isolation (OFFstate) ................................................................13
Test circuit for measuring crosstalk voltage
between digital inputs and switch ....................13
Test circuit for measuring crosstalk between
switches ...........................................................14
Test circuit for measuring charge injection ...... 14
Package outline SOT833-1 (XSON8) ..............15
Package outline SOT902-2 (XQFN8) .............. 16
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Fig. 12.
Logic symbol ..................................................... 2
Logic diagram (one switch) ............................... 2
Pin configuration SOT833-1 (XSON8) ...............3
Pin configuration SOT902-2 (XQFN8) ...............3
Test circuit for measuring OFF-state
leakage current ................................................. 6
Test circuit for measuring ON-state leakage
current ............................................................... 6
Test circuit for measuring ON resistance .......... 7
Typical ON resistance as a function of input
voltage ............................................................... 7
ON resistance as a function of input voltage;
VCC = 1.5 V ..................................................... 8
ON resistance as a function of input voltage;
VCC = 1.8 V ..................................................... 8
ON resistance as a function of input voltage;
VCC = 2.5 V ..................................................... 8
ON resistance as a function of input voltage;
VCC = 2.7 V ..................................................... 8
NX3L2T66
Product data sheet
Fig. 14.
Fig. 15.
Fig. 16.
Fig. 17.
Fig. 18.
Fig. 19.
Fig. 20.
Fig. 21.
Fig. 22.
Fig. 23.
Fig. 24.
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NXP Semiconductors
Dual low-ohmic single-pole single-throw analog switch
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
12
13
14
15
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................2
Ordering information .......................................... 2
Ordering options ................................................ 2
Functional diagram ............................................. 2
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 3
Functional description ........................................4
Limiting values .................................................... 4
Recommended operating conditions ................ 4
Static characteristics .......................................... 5
Test circuits ....................................................... 6
ON resistance ....................................................6
ON resistance test circuit and graphs ................7
Dynamic characteristics ...................................10
Waveform and test circuits .............................. 10
Additional dynamic characteristics ...................11
Test circuits ..................................................... 12
Package outline .................................................15
Abbreviations .................................................... 17
Revision history ................................................ 17
Legal information .............................................. 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2020.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 August 2020
Document identifier: NX3L2T66
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