NX5DV330DS,118

NX5DV330 Quad 1-of-2 video multiplexer/demultiplexer Rev. 03 — 5 August 2009 Product data sheet 1. General description The NX5DV330 is a quad 1-of-2 high-speed TTL-compatible video multiplexer/demultiplexer. The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise It has a digital select input (S), four independent inputs/outputs (nY0, nY1), a common input/output (nZ) and an active LOW enable input (E). When pin E is HIGH, the switch is turned off. Schmitt-trigger action at the enable input (E) and select input (S) makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 4.0 V to 5.5 V. The NX5DV330 is characterized for operation from −40 °C to +85 °C. 2. Features 5 Ω switch connection between two ports TTL-compatible input levels Minimal propagation delay through the switch ESD protection: u HBM JESD22-A114E Class 2A exceeds 2000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA n n n n NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NX5DV330D −40 °C to +85 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 NX5DV330DS −40 °C to +85 °C SSOP16[1] plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1 NX5DV330PW −40 °C to +85 °C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 NX5DV330BQ −40 °C to +85 °C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm [1] SOT763-1 Also known as QSOP16. 4. Functional diagram 1Z 4 2 3 2Z 7 5 6 3Z 9 11 10 4Z 14 12 13 S E 1Y0 1Y1 2Y0 2Y1 3Y0 3Y1 4Y0 4Y1 1 15 001aai498 Fig 1. Logic diagram NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 2 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 5. Pinning information 5.1 Pinning NX5DV330 S 1 16 VCC 1Y0 2 15 E 1Y1 3 14 4Y0 1Z 4 13 4Y1 2Y0 5 12 4Z 2Y1 6 11 3Y0 2Z 7 GND 8 NX5DV330 10 3Y1 9 3Z S 1 16 VCC 1Y0 2 15 E 1Y1 3 14 4Y0 1Z 4 13 4Y1 2Y0 5 12 4Z 2Y1 6 11 3Y0 2Z 7 10 3Y1 GND 8 9 001aai499 Fig 2. 3Z 001aai500 Pin configuration for SOT109-1 (SO16) Fig 3. Pin configuration for SOT519-1 (SSOP16) 1 NX5DV330 1Y0 2 15 E 1Y1 3 14 4Y0 1Z 4 13 4Y1 14 4Y0 2Y0 5 4 13 4Y1 2Y1 6 2Y0 5 12 4Z 2Z 7 2Y1 6 11 3Y0 2Z 7 10 3Y1 GND 8 2 15 E 1Y1 3 1Z 9 3Z 12 4Z GND(1) 11 3Y0 10 3Y1 9 1Y0 3Z 16 VCC 8 1 GND S 001aak330 Transparent top view 001aai501 Fig 4. S terminal 1 index area 16 VCC NX5DV330 Pin configuration for SOT403-1 (TSSOP16) Fig 5. Pin configuration for SOT763-1 (DHVQFN16) 5.2 Pin description Table 2. Pin description Symbol Pin Description S 1 select control input 1Y0, 1Y1, 2Y0, 2Y1, 3Y1, 3Y0, 4Y1, 4Y0 2, 3, 5, 6, 10, 11, 13, 14 independent input or output 1Z, 2Z, 3Z, 4Z 4, 7, 9, 12 independent input or output GND 8 ground (0 V) E 15 enable input (active LOW) VCC 16 positive supply voltage NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 3 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 6. Functional description Table 3. Function selection H = HIGH voltage level; L = LOW voltage level; X = Don’t care. Input Switch E S L L Y0 to Z or Z to Y0 L H Y1 to Z or Z to Y1 H X switch off 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VI input voltage ISW switch current continuous current through each switch IIK input clamping current VI < 0 V Tstg storage temperature Ptot total power dissipation [1] Conditions [1] [2][3][4] Min Max Unit −0.5 +7.0 V −0.5 +7.0 V - 128 mA - −50 mA −65 +150 °C - 500 mW The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C. [3] For SSOP16 (QSOP16) and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 °C. [4] For DHVQFN16 packages: above 60 °C derate linearly with 4.5 mW/K. 8. Recommended operating conditions Table 5. Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Symbol Parameter VCC Conditions Min Typ Max Unit supply voltage 4.0 5.0 5.5 V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V VH hysteresis voltage pin S, E - 45 - mV Tamb ambient temperature operating in free-air −40 +25 +85 °C NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 4 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 9. Static characteristics Table 6. Static characteristics Tamb = −40 °C to +85 °C. Symbol Parameter Conditions Min Typ[1] Max Unit VIK input clamping voltage VCC = 4.5 V; II = −18 mA - - −1.2 V II input leakage current pin S, E; VCC = 5.5 V; VI = GND or 5.5 V - - ±1 µA IS(OFF) OFF-state leakage current VCC = 5.5 V; VI = GND; VO = 0 V to 5.5 V - - ±1 µA IOFF power-off leakage current VCC = 0 V; VI = VO = 0 V to 5.5 V - - ±1 µA ICC supply current VCC = 5.5 V; IO = 0 mA; VI = VCC or GND - - 3 µA - - 2.5 mA ∆ICC additional supply current pin S, E; VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND CI input capacitance pin S, E; VI = 5 V or 0 V - 3.5 - pF Cio(off) off-state input/output capacitance Z port; VCC = 5 V; VO = 5 V or 0 V; E = VCC - 6.0 - pF Y port; VCC = 5 V; VO = 5 V or 0 V; E = VCC - 4.0 - pF Cio(on) on-state input/output capacitance Z port; VCC = 5 V; VO = 5 V or 0 V; E = GND - 14 - pF RON ON resistance VCC = 4.5 V VI = 1.0 V; II = 13 mA - 3 7 Ω VI = 2.0 V; II = 26 mA - 7 10 Ω [1] [2] [3] All typical values are measured at VCC = 5 V; Tamb = 25 °C. [2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. [3] Measured by the voltage drop between the Z and the Y terminals at the indicated current through the switch. ON-state resistance is determined by the lowest voltage of the two (Z or Y) terminals. 10. Dynamic characteristics Table 7. Dynamic characteristics Tamb = −40 °C to +85 °C; for test circuit see Figure 7. Symbol Parameter Conditions ton turn-on time S to nZ; see Figure 6 VCC = 4.5 V to 5.5 V toff turn-off time Typ Max Unit - 4.0 6.0 ns - 2.3 6.0 ns S to nZ; see Figure 6 VCC = 4.5 V to 5.5 V NX5DV330_3 Product data sheet Min © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 5 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 11. Waveforms VI VM VM S input GND ton toff VOH VY VY nZ output GND 001aai502 Measurement points are given in Table 8. VOH is the typical voltage output level that occurs with the output load. Fig 6. Table 8. Input (S) to output (nZ) turn-on and turn-off time Measurement points Supply voltage Input Output VCC VI VM VY 4.5 V to 5.5 V GND to 3.0 V 1.5 V 0.9VOH VCC S Y0 Z Y1 VY0 VY1 E G Vi 50 Ω V VO RL CL GND 001aai503 Test data is given in Table 9. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. Fig 7. Table 9. Test circuit for measuring turn-on and turn-off times Test data Input Load VI fi tr, tf VY0 VY1 RL CL GND to 3.0 V ≤ 10 MHz ≤ 2.5 ns GND to 3.0 V 3.0 V to GND 75 Ω 20 pF NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 6 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 12. Additional dynamic characteristics Table 10. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise specified); Tamb = 25 °C; VCC = 4.5 V to 5.5 V. Symbol Parameter Conditions Min Typ Max Unit Gdif differential gain fi = 3.58 MHz; RL = 150 Ω - 0.64 - % ϕdif differential phase fi = 3.58 MHz; RL = 150 Ω - 0.1 - deg f(−3dB) −3 dB frequency response RL = 150 Ω; see Figure 8 300 - - MHz αiso isolation (OFF-state) fi = 10 MHz; RL = 150 Ω; see Figure 9 - −60 - dB - −63 - dB Xtalk [1] crosstalk [1] between switches; see Figure 10; fi = 10 MHz; RL = 150 Ω; Ri = 10 Ω All unused analog input pins (nZ) and outputs pins (nYn) are connected through 10 Ω and 50 Ω pull-down resistors, respectively. 13. Test circuits VCC S VIL or VIH Y0 1 switch switch 1 2 S VIL VIH Z Y1 2 fi dB RL GND 001aai505 Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads −3 dB. Fig 8. Test circuit for measuring the frequency response when channel is in ON-state VCC S VIL or VIH Y0 1 switch switch 1 2 S VIH VIL Z Y1 2 fi RL RL dB GND 001aai506 Adjust fi voltage to obtain 0 dBm level at input. Fig 9. Test circuit for measuring isolation (OFF-state) NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 7 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 1E VIH or VIL 1Z 1Y fi 50 Ω RL 2Z Ri 2Y RL dB 001aai507 Adjust fi voltage to obtain 0 dBm level at input. Fig 10. Test circuit for measuring crosstalk voltage between digital inputs and switch NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 8 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 14. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT109-1 (SO16) NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 9 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT519-1 A X c y HE v M A Z 9 16 A2 A (A 3) A1 θ Lp L 8 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp v w y Z (1) θ mm 1.73 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 6.2 5.8 1 0.89 0.41 0.2 0.18 0.09 0.18 0.05 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-05-04 03-02-18 SOT519-1 Fig 12. Package outline SOT519-1 (SSOP16) NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 10 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 13. Package outline SOT403-1 (TSSOP16) NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 11 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B w M C b L 1 8 Eh e 16 9 15 10 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.6 3.4 2.15 1.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT763-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 14. Package outline SOT763-1 (DHVQFN16) NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 12 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 15. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 16. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes NX5DV330_3 20090805 Product data sheet - NX5DV330_2 Modifications: • Added type number NX5DV330BQ (DHVQFN16 package) NX5DV330_2 20080825 Product data sheet - NX5DV330_1 NX5DV330_1 20080815 Product data sheet - - NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 13 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 17.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NX5DV330_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 August 2009 14 of 15 NX5DV330 NXP Semiconductors Quad 1-of-2 video multiplexer/demultiplexer 19. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Additional dynamic characteristics . . . . . . . . . 7 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 August 2009 Document identifier: NX5DV330_3