NX5P3090
USB PD and type C current-limited power switch
Rev. 1 — 1 August 2016
Product data sheet
1. General description
The NX5P3090 is a precision adjustable current-limited power switch for USB PD
application. The device includes under voltage lockout, over-temperature protection, and
reverse current protection circuits to automatically isolate the switch terminals when a
fault condition occurs. The 29 V tolerance on VBUS pin ensures the device is able to work
on a USB PD port; a current limit input (ILIM) pin defines the over-current limit threshold;
an open-drain fault output (FAULT) indicates when a fault condition has occurred.
The over-current limit threshold can be programmed from 400 mA to 3.3 A, using an
external resistor between the ILIM pin and GND pin. In the over current condition, the
device will clamp the output current to the value set by ILIM and keep the switch on while
assert the FAULT flag. To minimize current surges during turn on, the device has built in
soft start which controls the power switch rise time.
Surge protection has been integrated in the device to enhance system robustness. The
enable input includes integrated logic level translation making the device compatible with
lower voltage processors and controllers.
NX5P3090 is offered in a 12 bump 1.35 x 1.65 mm, 0.4 mm pitch WLCSP package.
2. Features and benefits
VINT supply voltage range from 2.5 V to 5.5 V
29 V tolerance on VBUS and EN pin
Adjustable current limit from 400 mA to 3.3 A
Clamped current output in over-current condition
Very low ON resistance: 34 m (typical)
Active HIGH EN pin with internal pull down resistor
All time Reverse Current Protection
Over Temperature Protection
Surge protection: IEC61000-4-5 exceeds ±80 V on VBUS
Safety approvals
UL 62368-1, 2nd Edition, File no. 20160526-E470128
IEC 62368-1 (ed.2), File no. DK-54536-UL
ESD protection
IEC61000-4-2 contact discharge exceeds 8 kV on VBUS
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM AEC standard Q100-01 (JESD22-C101E) exceeds 500 V
Specified from 40 C to +85 C ambient temperature
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
3. Applications
Notebook and Ultrabook
USB PD and Type C port/hubs
Tablet and Smart phone
4. Ordering information
Table 1.
Ordering information
Type number
NX5P3090UK
Topside
marking
Package
Name
Description
Version
X5PT2
WLCSP12
wafer level chip-scale package; 12 bumps; 1.65 x 1.35 x
0.525 mm; 0.4 mm pitch (backside coating included)
SOT1390-5
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
Minimum
order quantity
Temperature
NX5P3090UK
NX5P3090UKZ
WLCSP12
REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
3000
Tamb = 40 C to +85 C
5. Marking
Table 3.
Marking
Line
Marking
Description
A
X5PT2
basic type name
B
mmmmm
wafer lot code (mmmmm)
C
Z5YWW
manufacturing code
Z = foundry location
5 = assembly location
Y = assembly year code
WW = assembly week code
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
6. Functional diagram
REVERSE-CURRENT
PROTECTION
ILIM
OVER-CURRENT
CLAMPING
VINT
VBUS
UVLO
SURGE
PROTECTION
EN
CONTROL
Rpd
FAULT
THERMAL
SHUTDOWN
aaa-024124
Fig 1.
Logic diagram
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
7. Pinning information
7.1 Pinning
ball A1
index area
NX5P3090
1
2
NX5P3090
3
1
2
3
A
A
EN
/FAULT
ILIM
B
B
VINT
VINT
GND
C
C
VINT
VBUS
GND
D
D
VBUS
VBUS
GND
Transparent top view
Transparent top view
aaa-024125
Fig 2.
aaa-024126
Pin configuration
Fig 3.
Pin map
7.2 Pin description
Table 4.
Pin description
Symbol
Pin
Description
VBUS
C2, D1, D2
power output; 29 V tolerance
ILIM
A3
current limiter setting. connects a resistor to GND to set the threshold
FAULT
A2
fault condition indicator (open-drain output)
EN
A1
enable input (active HIGH)
GND
B3, C3, D3
ground (0 V)
VINT
B1, C1, B2
power input
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
8. Functional description
Table 5.
Function table[1]
EN
VINT
VBUS
FAULT
Switch
X
VINT+40mV (>4ms)
L
reverse current; switch open
H
2.5V to 5.5V
Z
L
Over-temperature; switch open
[1]
H = HIGH voltage level; L = LOW voltage level.
8.1 EN Input
When the EN pin is set LOW, the N-channel MOSFET will be disabled, the device will
enter low-power mode disabling all protection circuits and setting the FAULT pin high
impedance. When EN is set HIGH, all protection circuits will be enabled and then, if no
fault conditions exist, the N-channel MOSFET will be turn on. There is a 100 us de-glitch
time on EN pin from LOW to HIGH.
8.2 Under-voltage lock-out
Independently of the logic level on the EN pin, the under-voltage lockout (UVLO) circuit
disables the N-channel MOSFET and enters low power mode until the input voltage
reaches the UVLO turn-on threshold level VUVLO.
8.3 ILIM
The over-current protection circuit's (OCP) trigger value Iocp can be set using an external
resistor RILIM connected between ILIM pin and GND pin. When EN is HIGH and the ILIM
pin is pulled to ground, the N-channel MOSFET will be disabled and the FAULT output set
LOW. The detailed IOCP setting is given in Section 8.4.
8.4 Over-current protection (OCP)
The device offers over current protection when enabled, three possible over-current
conditions can occur. These conditions are:
• Over-current at start-up, ISW > Iocp when enabling the N-channel MOSFET.
• Over-current after enabled, ISW > Iocp when the N-channel MOSFET is already ON.
• Short circuit after enabled, ISW > 10 A (typical).
In the over current condition, because the device clamps the output current rather than
completely shut down the switch, the power dissipation on the device might be increased
which could lead to over temperature protection (see Section 8.7).
8.4.1 Over-current at start-up
If the device senses a VBUS short to GND or over-current while enabling the N-channel
MOSFET, OCP is triggered. It limits the output current to Iocp and after the de-glitch time
sets the FAULT output LOW.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
8.4.2 Over-current when enabled
If the device senses ISW > Iocp after enabled, OCP is triggered. It limits the output current
to Iocp and after the de-glitch time sets the FAULT output LOW. Limiting the output current
reduces VO(VOUT).
8.4.3 Short circuit when enabled
If the device senses ISW > 10 A after enabled, a short circuit is detected. The device
disables the N-channel MOSFET immediately. It then re-enables the N-channel MOSFET
and limit the output current to Iocp, and after the de-glitch time the FAULT output is set
LOW.
8.5 Reverse-Current protection (RCP)
When the VBUS pin voltage exceeds the input voltage by 40 mV (typical) the device will
protect itself from damage by switching off the MOSFET after 4 ms de-glitch time.
When the VBUS pin voltage exceeds the VINT voltage by 100 mV, the device will
shutdown the FET immediately without any de-glitch time.
FAULT pin will be set LOW in the reverse-current protection condition.
In the RCP state, when the VBUS voltage drops below VINT voltage, the device will exit
the RCP state in 128 us and resume normal operation.
Before normal turn on, the device will always check the RCP condition first, if higher
voltage is detected on VBUS pin, it will never turn on the power MOSFET even EN pin is
pulled HIGH.
8.6 FAULT output
The FAULT output is an open-drain output that requires an external pull-up resistor. If any
of the protection circuits is activated, the FAULT output will be set LOW to indicate a fault
has occurred. The FAULT output will return to the high impedance state automatically
once the fault condition is removed. An internal delay (de-glitch) circuit for the over-current
protection (8 ms typical) and reverse-current protection (4 ms typical) is used when
entering fault conditions. This ensures that FAULT is not accidentally asserted.
Over-temperature condition will not be deglitched, the FAULT signal will be asserted
immediately.
8.7 Over-temperature protection
When EN is HIGH, the device junction temperature exceeds 140 °C, the over-temperature
protection (OTP) circuit will disable the N-channel MOSFET and indicate a fault condition
by setting the FAULT pin LOW. Any transition on the EN pin will have no effect. Once the
device temperature decreases below 115 °C the device will return to the defined state.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
9. Application diagram
USB connector
5V
SOURCE
VINT
VBUS
VBUS
CINT
VDD
CBUS
47 KΩ
/FAULT
USB
CONTROLLER/
PROCESSOR
ILIM
EN
GND
RILIM
GND
aaa-024128
0.1 F ceramic capacitor (CINT) is required for local decoupling. Higher capacitor values CINT further reduce the voltage drop at
the input. When driving inductive loads, a larger capacitance CINT prevents voltage spikes from exceeding absolute maximum
voltage of VIN. The CBUS capacitor should be placed as closer as possible to VBUS pin.
Fig 4.
Application diagram
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
10. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
input voltage
VI
Conditions
Min
Max
Unit
VBUS, EN
[1]
0.5
+29
V
VINT
[2]
0.5
+6
V
0.5
+6
V
0.5
+6
V
ILIM
[1]
VO
output voltage
FAULT
IIK
input clamping current
input EN: VI(EN) < 0.5 V
50
-
mA
input ILIM: VI(ILIM) < 0.5 V
50
-
mA
II(source)
input source current
input IILIM
-
1
mA
IOK
output clamping current
VO < 0 V
50
-
mA
ISK
switch clamping current
input VIN: VI(VIN) < 0.5 V
50
-
mA
ISW
switch current
Tj(max)
maximum junction
temperature
Tstg
storage temperature
Ptot
total power dissipation
output VOUT: VO(VOUT) < 0.5 V
VSW > 0.5 V
[3]
[4]
50
-
mA
-
3.6
A
40
+150
C
65
+150
C
-
910
mW
[1]
The minimum input voltage rating may be exceeded if the input current rating is observed.
[2]
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3]
Internally limited.
[4]
The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction
with lower ambient temperatures. The conditions to determine the specified values are Tamb = 25 °C and the use of a two layer PCB.
11. Recommended operating conditions
Table 7.
Recommended operating conditions
Symbol Parameter
input voltage
VI
Conditions
Min
Max
Unit
VINT
2.5
5.5
V
EN; VBUS (OFF state)
0
20
V
VO
Output voltage
VBUS
0
5
V
ISW
switch current
Tj = 40 C to +85 C
0
3
A
10
-
mA
16
140
k
0.1
-
F
40
+85
C
IO(sink)
output sink current
output FAULT
RILIM
current limit resistance
input ILIM
Cdec
decoupling capacitance
VIN to GND
Tamb
ambient temperature
[1]
[1]
Current-limit threshold resistor range from ILIM to GND.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
12. Thermal characteristics
Table 8.
Symbol
Rth(j-a)
[1]
Thermal characteristics
Parameter
Conditions
[1]
thermal resistance from junction to ambient
Typ
Unit
109
K/W
Rth(j-a) is dependent upon board layout. To minimize Rth(j-a), ensure all pins have a solid connection to larger copper layer areas. In
multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop
varnish under the device.
13. Static characteristics
Table 9.
Static characteristics
At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced
to GND (ground = 0 V). See Figure 10
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VIH
HIGH-level input
voltage
EN input; VI(VINT) = 2.5 V to 5.5 V;
1.2
-
-
V
VIL
LOW-level input
voltage
EN input; VIVINT) = 2.5 V to 5.5 V;
-
-
0.4
V
II
input leakage
current
EN input; VI(VINT) = 5.0 V;
-
-
7.5
A
I(VIN)
supply current
VBUS open; VI(VINT) = 5.0 V
EN = GND (low power mode);
-
0.9
5
A
EN = VI(VIN); RILIM = 33 k
-
196
280
A
EN = VI(VIN); RILIM = 16 k
-
210
290
A
VBUS OFF-State
leakage current
VI(VINT) = 5.0 V; VI(VBUS) = 0 V; EN = LOW
-
1
10
A
VINT OFF-state
leakage current
VI(VBUS) = 5.0 V; VI(VINT) = 0 V;
EN = LOW
-
1
10
A
IS(ON)
RCP leakage
current
VI(VINT) = 0 V; VI(VBUS) = 5 V; EN = 5 V
-
0.9
10
A
Rpd
EN pin Pull-down
resistance
VI(VINT) = 5 V
Vtrip
trip level voltage
RCP; VI(VINT) = 2.5 V to 5.5 V
-
40
-
mV
VUVLO
under voltage
lockout voltage
VINT pin
-
2.27
2.45
V
Vhys(UVLO)
under voltage
lockout hysteresis
voltage
-
100
-
mV
VOL
LOW-level output
voltage
-
-
0.5
V
CI
EN pin
-
13.5
-
pF
IS(OFF)
[1]
1
FAULT; IO = 8 mA
M
Typical values are measured at Tamb = 25 C.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
13.1 Graphs
DDD
,9,1
X$
7DPE&
VI(EN) = GND; VI(VINT) = 5.0 V
Fig 5.
OFF state supply current versus temperature
DDD
,9,1
X$
7DPE&
VI(EN) = VI(VINT); VI(VINT) = 5.0 V
(1) RILIM = 33 K
(2) RILIM = 16 K
Fig 6.
NX5P3090
Product data sheet
ON state supply current versus temperature
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
,RII9,17
X$
9,9,179
VI(EN) = GND; VI(VBUS) = 0 V; RILIM = 16 K
(1) Tamb = -40 C
(2) Tamb = +25 C
(3) Tamb = +85 C
Fig 7.
VBUS off state leakage versus temperature
DDD
,RII9%86
ȝ$
9,9%869
VI(EN) = GND; VI(VINT) = 0 V; RILIM = 16 K
(1) Tamb = -40 C
(2) Tamb = +25 C
(3) Tamb = +85 C
Fig 8.
NX5P3090
Product data sheet
VINT off state leakage versus temperature
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
9%869,17
9
,%86
$
7LPHȝV
RILIM = 20 k; VI(VINT) = 0 V
(1) Surge current
(2) Surge voltage on VBUS
Fig 9.
Surge protection waveform
VIN
10 kΩ
FAULT signal
control signal
VINT
VBUS
VOUT
10 μF
1 μF
ILIM
FAULT
RILIM
EN
GND
aaa-024133
Fig 10. Typical characteristics reference schematic
13.2 Thermal shutdown
Table 10. Thermal shutdown
VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tth(ots)
over temperature shutdown
threshold temperature
VI(VINT) = 2.5 to 5.5 V
-
140
-
C
Tth(otp)hys
hysteresis of over temperature
protection threshold temperature
VI(VINT) = 2.5 to 5.5 V
-
25
-
C
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
13.3 ON resistance
Table 11. ON resistance
VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10
Symbol
Parameter
Conditions
Min
RON
ON resistance
VI(VINT) = 2.5 to 5.5 V; see Figure 11
Typ
Max
Unit
Tamb = 25 C
-
34
37
m
Tamb = 40 C to +85 C
-
-
46
m
13.4 ON resistance graphs
DDD
5RQ
P
7DPE&
VI(VINT) = 5.0 V
Fig 11. Typical ON resistance versus temperature
DDD
5RQ
Pȍ
7LPHPV
VI(VINT) = 5.0 V
Fig 12. Typical ON resistance versus enable time
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
13.5 Current limit
Table 12. Current limit
VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; Voltages are referenced to GND (ground = 0 V). See Figure 10
Symbol
Parameter
Conditions
Iocp
over current
protection current
VI(VINT) = 2.5 to 5.5 V; Tamb = 40 C to +85 C;
[1]
Min
Typ[1]
Max
Unit
RILIM = 140 k
330
421
465
mA
RILIM = 100 k
480
581
625
mA
RILIM = 54 k
915
1057
1107
mA
RILIM = 33 k
1505
1723
1780
mA
RILIM = 24.5 k
2085
2330
2398
mA
RILIM = 20 k
2567
2848
2920
mA
RILIM = 16 k
3186
3490
3585
mA
ILIM shorted to VINT
125
180
220
mA
Typical values are measured at Tamb = 25 C. 1 % tolerance resistor is recommend for RILIM
Iocp can be calculated with below equation, x = RILIM (k):
I OCP MAX = 49495x – 0.948
(1)
I OCP TYP = 52775x –0.979
(2)
I OCP MIN = 57949x –1.042
(3)
13.6 Current limit graphs
DDD
,2&3
$
5,/,0.
Fig 13. Typical over current protection current versus external resistor value RILIM
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
14. Dynamic characteristics
Table 13. Dynamic characteristics
At recommended operating conditions; VI(VINT) = VI(EN), RFAULT = 10 k unless otherwise specified; voltages are referenced to
GND (ground = 0 V).
Min
Typ[1]
Max
Unit
VI(VINT) = 5.0 V
-
2.5
-
ms
VI(VINT) = 2.5 V
-
1.4
-
ms
VI(VINT) = 5.0 V
-
0.2
-
ms
VI(VINT) = 2.5 V
-
0.2
-
ms
-
1.5
-
ms
-
13
-
s
FAULT in OCP; VI(VINT) = 5 V
-
8
-
ms
RCP; FAULT in RCP; VI(VINT) = 5 V
-
4
-
ms
Symbol
Parameter
Conditions
tTLH
LOW to HIGH output
transition time
VOUT; CL = 1 F; RL = 100 ; see Figure 14
and Figure 15
VOUT; CL = 1 F; RL = 100 ; see Figure 14
and Figure 15
HIGH to LOW output
transition time
tTHL
EN to VOUT; CL = 1 F; RL = 100 ;
seeFigure 14and Figure 15
enable time
ten
VI(VINT) = 5.0 V
EN to VOUT; CL = 1 F; RL = 100 ; see
Figure 14 and Figure 15
disable time
tdis
VI(VINT) = 5.0 V
deglitch time
tdegl
[1]
Typical values are measured at Tamb = 25 C.
14.1 Waveform and test circuits
VI
EN input
VM
GND
ten
tdis
VOH
Vx
VBUS output
VY
GND
tTHL
tTLH
aaa-024134
Measurement points are given in Table 14.
Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 14. Switching times and rise and fall times
Table 14.
Measurement points
Supply voltage
EN Input
Output
VI(VIN)
VM
VX
VY
5.0 V
0.5 VI(EN)
0.9 VOH
0.1 VOH
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
EN
VOUT
VI
G
VIN
VEXT
CL
RL
aaa-011077
Test data is given in Table 15.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 15. Test circuit for measuring switching times
Table 15.
Test data
Supply voltage
EN Input
Load
VEXT
VI(EN)
CL
RL
5.0 V
0 to VI(VIN)
1 F
100
DDD
9%86(1
9
,9,1
$
WLPHPV
VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;
(1) VO(VBUS)
(2) I(VIN)
(3) VI(EN)
Fig 16. Typical 1 F load enable time and inrush current
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
16 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
9%86(1
9
,9,1
$
WLPHPV
VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F;
(1) VO(VBUS)
(2) I(VIN)
(3) VI(EN)
Fig 17. Typical 100 F load enable time and inrush current
DDD
9%86(1
9
,9,1
$
WLPHXV
VI(VINT) = 5 V; RL = 5.1 ; CL = 1 F;
(1) VO(VBUS)
(2) I(VIN)
(3) VI(EN)
Fig 18. Typical 1 F load turn off
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
9%86(1
9
,9,1
$
WLPHPV
VI(VIN) = 5 V; RL = 5.1 ; CL = 100 F
(1) VO(VBUS)
(2) I(VIN)
(3) VI(EN)
Fig 19. Typical 100 F load turn off
DDD
9%86
9,17)/7
9
,9,1
$
7LPHPV
VI(VINT) = 4 V
(1) VO(VBUS)
(2) VI(VINT)
(3) I(VIN)
(4) FAULT
Fig 20. Reverse-current protection response
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
,9,1
$
9%86
9,17)/7
9
7LPHPV
VI(VIN) = 4V
(1) VO(VBUS)
(2) VI(VINT)
(3) I(VIN)
(4) FAULT
Fig 21. Reverse-current protection recovery
9%86
9,17)/7
9
DDD
,9,1
$
7LPHPV
VI(VIN) = 5 V; RILIM = 33 k.
(1) VO(VBUS).
(2) VI(VINT)
(3) I(VIN)
(4) FAULT
Fig 22. Device into current limit after enabled
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
19 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
DDD
9%86
9,17)/7
9
,9,1
$
7LPHPV
VI(VIN) = 5 V; RILIM = 33 k.
(1) VO(VBUS)
(2) VI(VINT)
(3) I(VIN)
(4) FAULT
Fig 23. Device start up with VBUS short to GND
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
20 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
15. Package outline
:/&63ZDIHUOHYHOFKLSVFDOHSDFNDJH
EXPSV[[PP%DFNVLGHFRDWLQJLQFOXGHG
(
$
627
%
EDOO$
LQGH[DUHD
$
$
'
$
GHWDLO;
H
H
&
Y
Z
E
& $ %
&
\
'
H
&
H
H
%
$
EDOO$
LQGH[DUHD
;
PP
VFDOH
'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV
8QLW
PP
$
$
$
E
PD[
QRP
PLQ
'
(
H
H
H
Y
Z
\
1RWH%DFNVLGHFRDWLQJP
2XWOLQH
YHUVLRQ
VRWBSR
5HIHUHQFHV
,(&
627
-('(&
-(,7$
(XURSHDQ
SURMHFWLRQ
,VVXHGDWH
Fig 24. Package outline WLCSP12
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
21 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
16. Packing information
16.1 Packing method
%DUFRGHODEHO
'U\DJHQW
%DJ
(6'SULQW
5HODWLYHKXPLGLW\
LQGLFDWRU
0RLVWXUHFDXWLRQ
SULQW
(6'HPERVVHG
7DSH
5HHODVVHPEO\
%DUFRGHODEHO
*XDUGEDQG
3ULQWHGSODQRER[
&LUFXODUVSURFNHWKROHVRSSRVLWHWKH
ODEHOVLGHRIUHHO
&RYHUWDSH
4$VHDO
&DUULHUWDSH
6SDFHIRUDGGLWLRQDO
ODEHO
3UHSULQWHG(6'
ZDUQLQJ
%DUFRGHODEHO
'U\SDFN,'VWLFNHU
3ULQWHGSODQRER[
DDD
Fig 25. Reel dry pack for SMD: guard band; embossed tape
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
22 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
Table 16.
Dimensions and quantities
Reel dimensions
d w (mm) [1]
SPQ/PQ
(pcs) [2]
Reels
per box
Outer box dimensions
l w h (mm)
180 8
3000
1
209 206 34
[1]
d = reel diameter; w = tape width.
[2]
Packing quantity dependent on specific product type.
View ordering and availability details at NXP order portal, or contact your local NXP representative.
16.2 Product orientation
47 47
EDOO
47 47
DDD
DDD
Tape pocket quadrants
Ball 1 is in quadrant Q1/T1
Fig 26. Product orientation in carrier tape
16.3 Carrier tape dimensions
4 mm
W
K0
A0
B0
P1
T
direction of feed
001aao148
Fig 27. Carrier tape dimensions
Table 17. Carrier tape dimensions
In accordance with IEC 60286-3.
NX5P3090
Product data sheet
A0 (mm)
B0 (mm)
K0 (mm)
T (mm)
P1 (mm)
W (mm)
1.61 0.05
1.78 0.05
0.73 0.05
0.25 0.02
4.0 0.1
8 0.3 / 0.1
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
23 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
16.4 Reel dimensions
A
Z
W2
B
ØC
ØD
detail Z
001aao149
Fig 28. Schematic view of reel
Table 18. Reel dimensions
In accordance with IEC 60286-3.
NX5P3090
Product data sheet
A [nom]
(mm)
W2 [max]
(mm)
B [min]
(mm)
C [min]
(mm)
D [min]
(mm)
180
14.4
1.5
12.8
20.2
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
24 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
16.5 Barcode label
Fixed text
Country of origin
i.e. "Made in....." or
"Diffused in EU [+]
Assembled in......
Packing unit (PQ) identification
2nd traceability lot number*
2nd (youngest) date code*
2nd Quantity*
Traceability lot number
Date code
With linear barcode
Quantity
With linear barcode
Type number
NXP 12NC
With linear barcode
NXP SEMICONDUCTORS
MADE IN >COUNTRY<
[PRODUCT INFO]
(Q) QTY
Optional product information*
Re-approval date code*
Origin code
Product Manufacturing Code
MSL at the Peak Body solder
temperature with tin/lead*
MSL at the higher lead-free
Peak Body Temperature*
2D matrix with all data
(including the data identifiers)
HALOGEN FREE
(30P) TYPE
RoHS compliant
(1P) CODENO
Additional info if halogen
free product
Additional info on RoHS
(33T) PUID: B.0987654321
(30T) LOT2
(31D) REDATE
(30D) DATE2 (32T) ORIG
(30Q) QTY2
(31T) PMC
(31P) MSL/PBT
(1T) LOT
MSL/PBT
(9D) DATE
Lead-free symbol
001aak714
Fig 29. Example of typical box and reel information barcode label
Table 19.
NX5P3090
Product data sheet
Barcode label dimensions
Box barcode label
l w (mm)
Reel barcode label
l w (mm)
100 75
100 75
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
25 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
17. Soldering of WLCSP packages
17.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
17.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
17.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 20.
Table 20.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
26 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
17.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
17.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
17.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
27 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
17.3.4 Cleaning
Cleaning can be done after reflow soldering.
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
28 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
18. Abbreviations
Table 21.
Abbreviations
Acronym
Description
ESD
ElectroStatic Discharge
CDM
Charged Device Model
HBM
Human Body Model
USB
Universal Serial Bus
VOIP
Voice over Internet Protocol
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
29 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
19. Revision history
Table 22.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX5P3090 v.1
20160801
Product data sheet
-
-
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
30 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NX5P3090
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
31 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX5P3090
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
32 of 33
NX5P3090
NXP Semiconductors
USB PD and type C current-limited power switch
22. Contents
1
2
3
4
4.1
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.5
8.6
8.7
9
10
11
12
13
13.1
13.2
13.3
13.4
13.5
13.6
14
14.1
15
16
16.1
16.2
16.3
16.4
16.5
17
17.1
17.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
EN Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Under-voltage lock-out . . . . . . . . . . . . . . . . . . . 5
ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Over-current protection (OCP) . . . . . . . . . . . . . 5
Over-current at start-up . . . . . . . . . . . . . . . . . . 5
Over-current when enabled . . . . . . . . . . . . . . . 6
Short circuit when enabled . . . . . . . . . . . . . . . . 6
Reverse-Current protection (RCP) . . . . . . . . . . 6
FAULT output . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Over-temperature protection . . . . . . . . . . . . . . 6
Application diagram . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 12
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . 13
ON resistance graphs . . . . . . . . . . . . . . . . . . . 13
Current limit . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Current limit graphs . . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Waveform and test circuits . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Packing information . . . . . . . . . . . . . . . . . . . . 22
Packing method . . . . . . . . . . . . . . . . . . . . . . . 22
Product orientation . . . . . . . . . . . . . . . . . . . . . 23
Carrier tape dimensions . . . . . . . . . . . . . . . . . 23
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . 24
Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 25
Soldering of WLCSP packages. . . . . . . . . . . . 26
Introduction to soldering WLCSP packages . . 26
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 26
17.3
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
17.3.1
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.2
Quality of solder joint . . . . . . . . . . . . . . . . . . .
17.3.3
Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.4
Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
19
Revision history . . . . . . . . . . . . . . . . . . . . . . .
20
Legal information . . . . . . . . . . . . . . . . . . . . . .
20.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
20.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
20.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
21
Contact information . . . . . . . . . . . . . . . . . . . .
22
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
27
27
27
28
29
30
31
31
31
31
32
32
33
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 August 2016
Document identifier: NX5P3090