NXQ1TXA5/404J

NXQ1TXA5 One-chip 5 V Qi wireless transmitter Rev. 1.2 — 10 September 2015 Product short data sheet 1. General description The NXQ1TXA5 is a controller/driver IC for a 5 V Qi-certified/compliant low-power wireless charger. It offers a fully integrated solution that includes a 5 V full-bridge power) stage, as defined in Wireless Power Consortium (WPC) 5 V Qi standards A5, A11, A12 and A16. The NXQ1TXA5 uses dedicated analog ping circuitry to detect devices, according to the Qi standard, achieving extremely low standby power consumption. If a Qi-compliant receiver is detected, the NXQ1TXA5 starts to communicate with it. If the receiver is recognized, it safely initiates wireless power transfer from the transmitter to the receiver, while monitoring for fault conditions such as overheating or interference from metal objects. The device is optimized to operate from a USB power supply and uses Smart Power Limiting (SPL) to adjust the output power automatically to compensate for power-limited supplies. The device supports Foreign Object Detection (FOD). LED outputs and a buzzer output are available for the user interface. The LED outputs feature a number of blinking modes. Static Power Reduction (SPR) allows multiple NXQ1TXA5-based transmitters to operate from a single USB power supply by limiting power consumption per device. The NXQ1TXA5 is available in a 5 mm  5 mm, 32-pin HVQFN package. 2. Features and benefits  One-chip WPC 1.1.2 Qi-compliant device for A5/A11/A12/A16 5 V single-coil low-power transmitter  Operates from 5 V supply  Integrated high-efficiency full-bridge power stage with low EMI radiation meeting EN55022 radiated and conducted emission limits  Very few external components required, minimizing cost and board space  Extremely low-power receiver detection circuitry; standby power 10 mW (typical)  Power stage fully protected against overcurrents and overtemperature  Fully integrated accurate coil current measurement  Demodulates and decodes communication packages from Qi-compliant receivers  PID regulation for closed-loop power drive and control  Internal 1.8 V digital supply generation  LED (2) and buzzer outputs  NTC input for external temperature check and protection  On-chip thermal protection  Small HVQFN 32-pin package (5  5 mm) with 0.5 mm pitch NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter  FOD with automatic switching between V1.1 and V1.0 for legacy receiver support  FOD levels can be adjusted using external resistors to compensate for application differences to meet Qi certification requirements  Smart Power Limiting (SPL) function to adapt to power-limited 5 V supplies  Static Power Reduction (SPR) function to limit power consumption  Supports Near Field Communication (NFC) TAG applications with delayed start-up 3. Applications  Wireless Power Consortium (WPC) certified/compliant Qi wireless power transmitters 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDDP IDDP power supply voltage on pins VDDP1 and VDDP2 3.5 - 5.25 V power supply current on pins VDDP1 and VDDP2 Ping mode (average current) - 2 2.8 mA Power_Transfer mode (no load) - 15 - mA Power_Transfer mode (with load) - - 5 A 5. Ordering information Table 2. Ordering information Type number NXQ1TXA5 Package Name Description Version HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5  5  0.85 mm SOT617-3 5.1 Ordering options Table 3. Ordering options Type number Orderable part number Package Packing method Minimum Temperature ordering quantity NXQ1TXA5 NXQ1TXA5/404J HVQFN32 reel 7" Q1/T1, *standard mark SMD non-dry-pack 1500 NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 Tamb = 20 C to +85 C © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 6. Block diagram 6&/ 6'$   9''3  9''3   ,& ,17(5)$&( '(02' '(9,&( '(7(&7 287387 67$*(  *1'3 *1''  32:(5   6/23( ('*(  02'( 6(/(&7 92/7$*( 6(16(  635 635 1)&B)' 1)6B',6 ;7$/B,1 ;7$/B287  32:(5 &21752/    8, &21752/ N+] 26&,//$725 6 95 %; copper thickness each layer 70 m 30 K/W NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 11. Characteristics Table 7. DC characteristics Tamb = 25 C, default settings unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit VDDP power supply voltage on pin VDDP1 and VDDP 3.5 - 5.25 V IDDP power supply current on pins VDDP1 and VDDP2: Ping mode (peak current) [1] - 1 - A Ping mode (average current) [1] - 2 2.8 mA - 2 30 A Standby mode (STBY HIGH) - 15 - mA Power_Transfer mode (average current with load) - - 2 A Power_Transfer mode (absolute peak current with load) - - 5 A Power_Transfer mode (no load) [1] [1] Current consumption in the NXQ1TXA5_SDS; no external load connected between terminals OUT1 and OUT2. Table 8. AC characteristics Tamb = 25 C, default settings unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Start-up and Power_Transfer modes 110 - 205 kHz BTL power stage fsw switching frequency fsw(step) switching frequency step size Start-up and Power_Transfer modes - 500 - Hz  duty cycle Start-up and Power_Transfer modes 0 - 50 % step duty cycle step size Start-up and Power_Transfer modes - 0.1 - % VIH HIGH-level input voltage Standby mode 1.2 - VDDP V VIL LOW-level input voltage Operating mode - - 0.6 V 0 - 1.5 V 400 - VDDP mV - - 20 mA 400 - VDDP mV - - 20 mA STBY pin FOD1, FOD2, FOD3, CONFIG and NTC pins input voltage VI operating range [1] LED_G, LED_R and NFC_DIS outputs output voltage VO Iload load current set externally open-drain output [2] BUZZER output output voltage VO Iload load current set externally open-drain output [2] NFC_FD, SPR1 and SPR2 pins VIH HIGH-level input voltage 1 1.8 VDDP V VIL LOW-level input voltage - - 0.6 V I2C pins: SCL and SDA VIH HIGH-level input voltage 1 - 3.6 V VIL LOW-level input voltage - - 0.6 V NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter Table 8. AC characteristics …continued Tamb = 25 C, default settings unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit - - 1.8 V 32 32.768 33.5 kHz - - 1 W 8 12 14 pF Oscillator: pins XTAL_IN and XTAL_OUT input voltage VI External crystal requirements fnom nominal frequency DL drive level [3] load capacitance CL [1] The nominal operating range is from 0 V to 1.5 V. However, any level between 1.5 V and VDDP has the same effect (as 1.5 V). [2] The output voltage at maximum load current is guaranteed not to exceed 400 mV. [3] The load capacitors are embedded in the NXQ1TXA5_SDS. 12. Application information 12.1 Crystal oscillator The NXQ1TXA5 uses an external low-cost 32.768 kHz crystal, with a 1 % accuracy. The crystal should support a load capacitance of  12 pF (the load capacitance is embedded in the NXQ1TXA5). Do not connect the crystal to the NXQ1TXA5 using vias, but directly on the top layer of the PCB. If possible, shield the crystal by connecting the casing to ground. The crystal is connected to the oscillator input pin (XTAL_IN) via a 2.2 pF series capacitor. 12.2 Supply decoupling Effective supply decoupling is required. The decoupling capacitors must to be chosen such that the effective capacitance is at least 10 F at a DC bias voltage of 5.5 V and a frequency of 205 kHz for each supply pin. To improve HF behavior and reduce EMI, mount smaller (10 nF) high-quality capacitors in parallel with the larger capacitors. 12.3 Snubber network Snubber RC networks are connected to outputs OUT1 and OUT2. Each snubber network consists of a 6.8 nF capacitor in series with a 1  resistor to ground (see Figure 3). 12.4 Exposed die-pad ground and thermal connection For optimal thermal and electrical performance, the device bottom exposed die-pad MUST be soldered to a PCB solder land under the exposed die-pad. To have good electrical contact and thermal flow from the device to the bottom copper layer, the PCB solder land under the device MUST be connected with plated-through vias to the copper bottom layer of the PCB. In this way, the PCB bottom copper layer can provide heat sinking for the device dissipation. In the NXQ1TXA5 application note examples are provided for recommended layouts with good thermal and electrical performance. NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 12.5 Application diagram 9''3 9''3 5 Nȍ & Q) / 6&/ )2' )2' )2' &21),* 17&    9''3 8 6'$ 9''3 5 Nȍ  5 Nȍ & Q) 9''3 5 Nȍ  5 Nȍ & Q) 9''3 5 Nȍ  ' *UHHQ &'(& 5 Nȍ  ' 5HG & —) 9 % 5 Nȍ & Q) & —) 9      & Q) 9  67%< & Q) 9 & Q) 9 & Q) 9  287   287 & Q)   5 ȍ   287 %8==(5 7(67 5 7%'  /('B5  1;47;$ & ;7$/B,1   S)          1)&B',6 1)&B)' 635 635 9''3 *1'9''3 *1'9''3 *1'3 ;7$/B287 966 N+]  *1'3 5 7%'  5 ȍ  *1'3 5 7%'  /('B* & Q) *1'3 5 Nȍ 5 7%'   *1'' & Q)  287  DDD Fig 3. NXQ1TXA5 application diagram NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 13. Package outline +94)1SODVWLFWKHUPDOHQKDQFHGYHU\WKLQTXDGIODWSDFNDJHQROHDGV WHUPLQDOVERG\[[PP ' % 627 $ WHUPLQDO LQGH[DUHD $ $ ( GHWDLO; & H H Y Z H E   \ & & $ % & \ /   H H (K H   WHUPLQDO LQGH[DUHD   ; 'K   'LPHQVLRQV 8QLW PP PP VFDOH $ $ E PD[   QRP  PLQ   F ' 'K ( (K         H H H    / Y Z \ \        1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ 627 Fig 4. 5HIHUHQFHV ,(& -('(& -(,7$ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH   02 Package outline SOT617-3 (HVQFN32) NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 14. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes NXQ1TXA5_SDS v.1.2 20150910 Product data sheet - NXQ1TXA5_SDS v.1.1 Modifications: • Section 13 “Package outline” has been updated. NXQ1TXA5_SDS v.1.1 20150909 Product data sheet - NXQ1TXA5_SDS v.1 NXQ1TXA5_SDS v.1 20150730 Product data sheet - - NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. NXQ1TXA5_SDS Product short data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXQ1TXA5_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1.2 — 10 September 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 15 NXQ1TXA5 NXP Semiconductors One-chip 5 V Qi wireless transmitter 17. Contents 1 2 3 4 5 5.1 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.1.1 8.2.1.2 8.2.2 8.2.3 8.2.4 9 10 11 12 12.1 12.2 12.3 12.4 12.5 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device operation. . . . . . . . . . . . . . . . . . . . . . . . 5 Protection mechanisms . . . . . . . . . . . . . . . . . . 6 OverTemperature Protection (OTP) . . . . . . . . . 6 Software OTP . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Hardware OTP . . . . . . . . . . . . . . . . . . . . . . . . . 6 OverCurrent Protection (OCP) . . . . . . . . . . . . . 6 Foreign Object Detection (FOD) . . . . . . . . . . . . 6 Negative Temperature Coefficient (NTC) . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 9 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply decoupling . . . . . . . . . . . . . . . . . . . . . . 9 Snubber network . . . . . . . . . . . . . . . . . . . . . . . 9 Exposed die-pad ground and thermal connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application diagram . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 September 2015 Document identifier: NXQ1TXA5_SDS