BGA6589
MMIC wideband medium power amplifier
Rev. 3 — 28 November 2011
Product data sheet
1. Product profile
1.1 General description
The BGA6589 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband
medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic low thermal
resistance SMD package.
The BGA6x89 series of medium power gain blocks are resistive feedback Darlington
configured amplifiers. Resistive feedback provides large bandwidth with high accuracy.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
Broadband 50 gain block
20 dBm output power
SOT89 package
Single supply voltage needed
1.3 Applications
Broadband medium power gain blocks
Small signal high linearity amplifiers
Variable gain and high output power in combination with the BGA2031
Cellular, PCS and CDPD
IF/RF buffer amplifier
Wireless data SONET
Oscillator amplifier, final PA
Drivers for CATV amplifier
BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD
DC device voltage
on pin 1; IS = 81 mA
-
4.8
-
V
IS
DC supply current
VS = 9 V; Rbias = 51 ;
Tj = 25 C
-
81
-
mA
s212
insertion power gain
f = 1950 MHz
-
17
-
dB
NF
noise figure
f = 1950 MHz
-
3.3
-
dB
PL1dB
load power at 1 dB gain
compression
f = 850 MHz
-
21
-
dBm
f = 1950 MHz
-
20
-
dBm
2. Pinning information
Table 2.
Pinning
Pin
Description
1
RF_OUT/BIAS
2
GND
3
RF_IN
Simplified outline
Graphic symbol
3
1
2
3
2
sym130
1
3. Ordering information
Table 3.
Ordering information
Type number
BGA6589
Package
Name
Description
Version
SC-62
plastic surface-mounted package; collector pad for
good heat transfer; 3 leads
SOT89
4. Marking
Table 4.
BGA6589
Product data sheet
Marking codes
Type number
Marking code
BGA6589
5A
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max
Unit
on pin 1; RF input AC coupled
-
6
V
-
150
mA
-
800
mW
VD
DC device voltage
IS
DC supply current
Ptot
total power dissipation Tsp 70 C
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
PD
drive power
-
15
dBm
VESD
electrostatic discharge Human Body Model (HBM);
voltage
According JEDEC standard 22-A114E
-
200
V
Charged Device Model (CDM);
According JEDEC standard 22-C101B
-
2
kV
[1]
[1]
Tsp is the temperature at the solder point of the ground lead, pin 2.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from junction to solder point
Tsp 70 C
Rth(j-sp)
[1]
[1]
Typ
Unit
100
K/W
Tsp is the temperature at the solder point of the ground lead, pin 2.
7. Characteristics
Table 7.
Static characteristics
VS = 9 V; Tj = 25 C; Rbias = 51 .[1]
Symbol Parameter
VD
DC device voltage
IS
DC supply current
[1]
Conditions
Min
Typ
Max Unit
on pin 1; IS = 81 mA
-
4.8
-
V
73
81
89
mA
VS = DC operating supply voltage applied to Rbias; see Figure 10.
Table 8.
Characteristics
VS = 9 V; IS = 81 mA; Tamb = 25 C; Rbias = 51 ; IP3(out) tone spacing = 1 MHz; PL = 0 dBm per tone
(see Figure 10); ZL = ZS = 50 ; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
s212
f = 850 MHz
-
22
-
dB
f = 1950 MHz
-
17
-
dB
f = 2500 MHz
-
15
-
dB
f = 850 MHz
-
9
-
dB
f = 1950 MHz
-
11
-
dB
f = 2500 MHz
-
15
-
dB
RLIN
BGA6589
Product data sheet
insertion power gain
return losses input
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
Table 8.
Characteristics …continued
VS = 9 V; IS = 81 mA; Tamb = 25 C; Rbias = 51 ; IP3(out) tone spacing = 1 MHz; PL = 0 dBm per tone
(see Figure 10); ZL = ZS = 50 ; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
RLOUT
f = 850 MHz
-
10
-
dB
f = 1950 MHz
-
13
-
dB
f = 2500 MHz
-
13
-
dB
f = 850 MHz
-
3.0
-
dB
f = 1950 MHz
-
3.3
-
dB
dB
NF
K
return losses output
noise figure
stability factor
f = 2500 MHz
-
3.4
-
f = 850 MHz
-
1.1
-
f = 2500 MHz
-
1.1
-
PL1dB
load power at 1 dB gain
compression
f = 850 MHz
-
21
-
dBm
f = 1950 MHz
-
20
-
dBm
IP3(in)
input intercept point
f = 850 MHz
-
11
-
dBm
f = 2500 MHz
-
15
-
dBm
f = 850 MHz
-
33
-
dBm
f = 2500 MHz
-
30
-
dBm
IP3(out)
output intercept point
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
1
2
5
0°
0
−5
−0.2
−135°
10
200 MHz
2.6 GHz
−2
−0.5
−45°
−1
−90°
1.0
mgx409
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 .
Fig 1.
BGA6589
Product data sheet
Input reflection coefficient (S11); typical values
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
2.6 GHz
0.2
180°
0
0.2
1
0.5
2
5
10
0°
0
200 MHz
−5
−0.2
−135°
−2
−0.5
−45°
−1
1.0
−90°
mgx410
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 .
Fig 2.
Output reflection coefficient (s22); typical values
mgx412
25
|s21|2
(dB)
20
mgx411
0
|s12|2
(dB)
−10
15
−20
10
−30
5
0
0
500
1000
1500
2000
2500
f (MHz)
−40
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 .
Fig 3.
Insertion gain (s212) as a function of
frequency; typical values
BGA6589
Product data sheet
0
500
1000
1500
2000
2500
f (MHz)
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 .
Fig 4.
Isolation (s122) as a function of frequency;
typical values
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
mgx413
25
PL1dB
(dBm)
mgx414
40
IP3(out)
(dBm)
20
30
15
20
10
10
5
0
0
0
500
1000
1500
0
2000
2500
f (MHz)
IS = 81 mA; VS = 9 V; ZO = 50 .
Fig 5.
Fig 6.
mgx416
1500
2000
2500
f (MHz)
Output intercept as a function of frequency;
typical values
mgx415
5
NF
(dB)
K
4
4
3
3
2
2
1
1
0
0
0
500
1000
1500
2000
2500
f (MHz)
0
IS = 81 mA; VS = 9 V; ZO = 50 .
Fig 7.
1000
IS = 81 mA; VS = 9 V; PL = 0 dBm; ZO = 50 .
Load power as a function of frequency; typical
values
5
500
Product data sheet
1000
1500
2000
2500
f (MHz)
IS = 81 mA; VS = 9 V; ZO = 50 .
Stability factor as a function of frequency;
typical values
BGA6589
500
Fig 8.
Noise figure as a function of frequency; typical
values
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
mgx417
100
Is
(mA)
90
80
70
60
−40
−20
0
40
20
60
80
Tj (°C)
VS = 9 V; Rbias 51 .
Fig 9.
Supply current as a function of operating junction temperature; typical values
8. Application information
Figure 10 shows a typical application circuit for the BGA6589 MMIC. The device is
internally matched to 50 , and therefore does not require any external matching. The
value of the input and output DC blocking capacitors C1 and C2 depends on the operating
frequency; see Table 9. Capacitors C1 and C2 are used in conjunction with L1 and C3 to
fine tune the input and output impedance. Capacitor C4 is a supply decoupling capacitor.
A 1 F capacitor (C5) can be added for optimum supply decoupling. The external
components should be placed as close as possible to the MMIC. When using via holes,
use multiple via holes per pin in order to limit ground path induction. Resistor R1 is a bias
resistor providing DC current stability with temperature.
R1(2)
VS
C3
C4
C5(1)
L1
50 Ω
microstrip
C1
3
1
VD C2
50 Ω
microstrip
2
mgx419
(1) Optional capacitor for optimum supply decoupling.
(2) R1 values at operating supply voltage (VS):
VS = 6 V; R1 = 15 .
VS = 9 V; R1 = 51 .
VS = 11.5 V; R1 = 82 .
Fig 10. Typical application circuit
BGA6589
Product data sheet
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
Table 9.
List of components
See Figure 10 for circuit.
Component
Description
Type
Value at operating frequency
500 MHz
800 MHz
1950 MHz
2400 MHz
3500 MHz
C1, C2
multilayer ceramic chip
capacitor
0603
220 pF
100 pF
68 pF
56 pF
39 pF
C3
multilayer ceramic chip
capacitor
0603
100 pF
68 pF
22 pF
22 pF
15 pF
C4
multilayer ceramic chip
capacitor
0603
1 nF
1 nF
1 nF
1 nF
1 nF
C5[1]
electrolytic or tantalum
capacitor
0603
1 F
1 F
1 F
1 F
1 F
L1
SMD inductor
0603
68 nH
33 nH
22 nH
18 nH
15 nH
R1
SMD resistor, 0.5 W;
VS = 9 V
-
51
51
51
51
51
[1]
Optional.
Table 10. Scattering parameters
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 ; Tamb = 25 C.
f (MHz)
s11
s21
s12
s22
K factor
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
200
0.30
6.87
16.61
161.86
0.04
2.38
0.34
20.03
1.0
300
0.31
10.91
16.18
153.02
0.04
3.66
0.34
30.50
1.0
400
0.32
15.72
15.59
144.39
0.04
5.17
0.34
40.74
1.1
500
0.33
21.0
14.91
136.01
0.04
6.75
0.34
50.56
1.1
600
0.33
26.44
14.19
128.12
0.04
8.67
0.34
60.07
1.1
700
0.34
32.08
13.51
120.88
0.04
10.94
0.33
69.21
1.1
800
0.34
37.75
12.77
114.19
0.04
13.65
0.33
77.91
1.1
900
0.35
43.18
11.88
107.40
0.04
15.15
0.32
86.13
1.1
1000
0.35
48.9
11.22
101.34
0.04
17.89
0.32
94.01
1.1
1100
0.35
54.2
10.64
95.86
0.04
19.93
0.31
101.7
1.1
1200
0.35
59.55
10.0
90.82
0.05
22.11
0.30
109.1
1.1
1300
0.34
64.78
9.39
85.46
0.05
24.10
0.30
116.4
1.1
1400
0.34
69.93
8.93
80.15
0.05
24.62
0.29
123.6
1.1
1500
0.33
74.81
8.54
75.95
0.05
25.98
0.28
130.9
1.1
1600
0.33
79.82
8.07
72.26
0.05
27.67
0.27
138.2
1.1
1700
0.32
84.88
7.60
67.95
0.06
28.69
0.26
145.7
1.1
1800
0.31
89.81
7.32
63.43
0.06
28.33
0.25
153.6
1.1
1900
0.30
94.89
7.08
59.81
0.06
28.44
0.24
162.0
1.1
2000
0.29
100.3
6.74
56.09
0.07
29.27
0.23
170.7
1.1
2100
0.28
105.9
6.46
51.84
0.07
29.17
0.23
179.99
1.1
2200
0.26
111.8
6.28
48.02
0.07
28.46
0.22
170.17
1.2
2300
0.25
118.0
6.07
45.0
0.08
28.37
0.22
160.16
1.2
2400
0.24
125.2
5.78
41.33
0.08
28.17
0.22
149.59
1.1
BGA6589
Product data sheet
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
Table 10. Scattering parameters …continued
IS = 81 mA; VS = 9 V; PD = 30 dBm; ZO = 50 ; Tamb = 25 C.
f (MHz)
s11
s21
s12
s22
K factor
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
Magnitude
(ratio)
Angle
(degree)
2500
0.22
132.8
5.61
36.72
0.08
26.46
0.23
139.39
1.2
2600
0.21
141.3
5.51
33.15
0.09
24.85
0.24
129.67
1.0
2700
0.21
153.3
5.33
30.04
0.09
24.72
0.28
120.55
1.2
2800
0.07
127.7
6.44
28.98
0.12
24.46
0.28
80.88
1.2
2900
0.19
167.20
4.88
19.14
0.10
20.48
0.27
105.15
1.2
3000
0.18
178.11
4.78
16.89
0.10
19.71
0.30
96.35
1.2
3100
0.18
165.13
4.57
16.56
0.11
18.98
0.32
89.48
1.0
BGA6589
Product data sheet
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
9. Package outline
Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
SOT89
B
D
A
bp3
E
HE
Lp
1
2
3
c
bp2
w M B
bp1
e1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp1
bp2
bp3
c
D
E
e
e1
HE
Lp
w
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.23
4.6
4.4
2.6
2.4
3.0
1.5
4.25
3.75
1.2
0.8
0.13
OUTLINE
VERSION
REFERENCES
IEC
SOT89
JEDEC
JEITA
TO-243
SC-62
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16
06-08-29
Fig 11. Package outline SOT89 (SC-62)
BGA6589
Product data sheet
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
10. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDPD
Cellular Digital Packet Data
IF
Intermediate Frequency
PCS
Power Center Substation
SMD
Surface-Mounted Device
SONET
Synchronous Optical NETwork
11. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA6589 v.3
20111128
Product data sheet
-
BGA6589 v.2
Modifications:
•
Table 5 “Limiting values” on page 3: Electrostatic discharge voltage data added.
BGA6589 v.2
20090525
Product data sheet
-
BGA6589 v.1
BGA6589 v.1
20030919
Product specification
-
-
BGA6589
Product data sheet
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BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
BGA6589
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 28 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 14
BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA6589
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 28 November 2011
© NXP B.V. 2011. All rights reserved.
13 of 14
BGA6589
NXP Semiconductors
MMIC wideband medium power amplifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 November 2011
Document identifier: BGA6589
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