OM7802/BGU7003/CMMB,598

AN11097 CMMB LNA with BGU7003, 400 MHz to 800 MHz Rev. 01 — 29 March 2012 Application note Document information Info Content Keywords LNA, 400 MHZ - 800 MHz, BGU7003, CMMB Abstract The document provides the circuit, layout, Bill Of Materials (BOM) and performance information for a CMMB LNA equipped with NXP Semiconductors’ BGU7003. AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz Revision history Rev Date Description v.1 20120329 initial version Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 2 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 1. Introduction The BGU7003 is a wideband Silicon Germanium Amplifier MMIC for high-speed, low-noise applications. It is used for Low Noise Amplifiers (LNA) applications up to 6 GHz such as GPS, satellite radios, cordless phones and Chinese Mobile Multimedia Broadcasting (CMMB). The BGU7003 contains 1 RF stage and an internal bias that is temperature stabilized. It also contains a power-down function to shut down the amplifier, using a logic signal on the enable pin. The BGU7003 is ideal for use in portable electronic devices, such as mobile phones, Personal Digital Assistants (PDA), Personal Navigation Devices (PND). The CMMB LNA evaluation board (EVB) is designed to evaluate the performance of the BGU7003 when it is applied as a CMMB LNA. This document provides the application diagram, board layout, bill of materials, and some typical results. aaa-001331 Fig 1. AN11097 Application note BGU7003 400 MHz - 800 MHz LNA evaluation board All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 3 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 2. General description The BGU7003 is a wideband Silicon Germanium SiGe transistor with an internal bias circuit. The bias circuit is temperature stabilized, which maintains a constant current during fluctuations in temperature. The bias current for the RF stage is set via an external bias resistor which provides design flexibility when choosing the bias current. The MMIC is supplied with a power-down function that allows the designer to control the MMIC via a logic signal. The power-down mode only consumes 0.4 A. A simplified internal circuit of the BGU7003 is given in Figure 2. Rb 6 1 Vcc BIAS AND ENABLE CIRCUIT RFin GND 2 5 3 4 Enable RFout aaa-001332 Fig 2. Simplified circuit of the BGU7003 The BGU7003 is not internally matched so a matching circuit must be designed for both input and output. The fact that no internal matching is available, makes the product suitable for various application areas. The BGU7003, applied as a CMMB LNA, is described in the following sections. AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 4 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 3. Application board The BGU7003 EVB simplifies the evaluation of the BGU7003 wideband amplifier MMIC, for the CMMB application area. The EVB enables testing of the device performance and requires no additional support circuitry. The board is fully assembled with the BGU7003 IC, including input and output matching to optimize the performance. The board is provided with SMA connectors to connect the input and output signals to RF test equipment. This document describes the EVB using a 2.5 V supply voltage. 3.1 Application circuit The application diagram, as supplied on the evaluation board, is given in Figure 3. VCC GND R1 C3 R2 C5 R3 RF in C1 C2 R5 1 6 2 5 L1 3 L2 C6 4 L3 RF out BGU7003 C7 C4 R4 aaa-001333 Fig 3. Circuit diagram of the evaluation board AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 5 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 3.2 Board layout Figure 4 shows the board layout and components. aaa-001334 Fig 4. Printed circuit board of the BGF7003 CMMB evaluation board 3.3 PCB layout The PCB layout is an essential part in RF circuit design. The EVB of the BGU7003 serves as a guideline for laying out a board using the BGU7003. Controlled impedance lines are used for all high frequency inputs and outputs. Bypass VCC with decoupling capacitors located as close as possible to the device. For long bias lines, it may be necessary to add decoupling capacitors in the line farther away from the device. Correct grounding of the GND pin is also essential for the performance. The GND pin is either connected directly to the ground plane or through vias, or both. The EVB is made of FR4 material using the stack shown in Figure 5. The material supplier is ISOLA DURAVER; r = 4.6  4.9: T = 0.02 17 µm Cu 0.25 mm FR4 Critical 17 µm Cu 0.50 mm FR4 only for mechanical rigidity of PCB 17 µm Cu 0.25 mm FR4 only for mechanical rigidity of PCB 17 µm Cu aaa-001335 Fig 5. AN11097 Application note Stack of the PCB material All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 6 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 3.4 Bill Of Materials (BOM) Table 1. BGU7003 400 MHz band LNA EVB parts List Part reference Description Comment Footprint Vendor Value C1 Capacitor Input matching 0402 MurataGRM1555 10 pF C2 and C6 Capacitor DC blocking 0402 MurataGRM1555 100 pF C3 Capacitor LF decoupling 0402 MurataGRM1555 0.1 F C4 Capacitor Feedback 0402 MurataGRM1555 470 pF C5 Capacitor LF decoupling 0402 MurataGRM1555 0.1 F C7 Capacitor Output matching 0402 MurataGRM1555 1.0 pF L1 Inductor Input matching 0402 Murata/LQW15A, high Q, low Rs 22 nH L2 Inductor DC bias 0402 Murata/LQW15A 120 nH L3 Inductor Output matching 0402 Murata/LQW15A, high Q, low Rs 15 nH R1 and R2 Resistor Backup tune pads 0402 Various 0 R3 Resistor Bias setting 0402 Various 3.3 k R4 Resistor Feedback 0402 Various 1.2 k R5 Resistor Stability 0402 Various 560  X1 and X2 SMARF connector RF input/output - Johnson, End launch SMA 142-0701-841 - X3 DC header - Molex, PCB header, Right Angle, 1 row, 3 way 90121-0763 Bias connector 4. Equipment required The following equipment is necessary to measure the evaluation board: • DC power supply up to 5 mA at 2.5 V (up to 15 V for bias control). • RF signal generator capable of generating an RF signal at the operating frequency of CMMB. • RF spectrum analyzer that covers the operating frequency of 400 MHZ to 800 MHz as well as a few of the harmonics. 6 GHz is sufficient. A version with the capability of also measuring the noise figure is useful. • Ammeter to measure the supply current (optional). • Network analyzer for measuring gain, return loss and reverse Isolation. • Noise figure analyzer. AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 7 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 5. Connections and setup The BGU7003, CMMB EVB is fully assembled and tested. For a step-by-step guide on how to operate the EVB and test the device functionality, proceed with the following steps: 1. Connect a 2.5 V DC power supply to the VCC and GND terminals. 2. Connect the RF signal generator to the RF input of the EVB and the spectrum analyzer to the RF output. – Do not turn on the RF output of the signal generator yet 3. Set the signal generator to 30 dBm output power at 600 MHz. 4. Set the spectrum analyzer to 600 MHz center frequency with a reference level of 0 dBm. 5. Turn on the DC power supply and it should read approximately 5 mA. 6. Enable the RF output of the generator - the spectrum analyzer displays a tone of 600 MHz at approximately 11 dBm. 7. An alternative to using the combination of the signal generator and spectrum analyzer, is to use a Network Analyzer (NWA). The NWA can measure gain as well as input and output return losses. 8. For noise figure evaluation, it is possible to use either a noise figure analyzer or a spectrum analyzer with noise option. Use a 5 dB noise source, such as the Agilent 364A. Do not use any form of adaptor or cable between the noise source and the EVB when measuring the noise figure of the evaluation board. Using adaptors and cables, affects the noise performance. aaa-001336 Fig 6. Evaluation board and connectors AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 8 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6. Summary of typical evaluation board test results Table 2. Typical results measured on the evaluation board Testing made at 600 MHz unless otherwise specified, Temp = 25 C Symbol NF Description noise Value Unit figure[1] 1.2 dB gain[1] Gp power 19.5 dB RLin input return loss 10.2 dB RLout output return loss 17.9 dB isol(r) reverse isolation 24.2 dB Pi(1dB) input power at 1 dB gain compression 19.7 dBm PL(1dB) output power at 1 dB gain compression 1.0 dBm IP3I input third-order intercept point 3.3 dBm [1] The NF and gain figures are measured at the SMA connectors of the EVB. The losses of the connectors and the PCB are not subtracted, improving the NF by approximately 0.1 dB. 6.1 Noise figure plot Figure 7 is a plot of the noise figure in the 400 MHz to 800 MHz frequency band. The center of the plot (x-axis) is 600 MHz. aaa-001337 Fig 7. AN11097 Application note Plot of noise figure All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 9 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.2 Noise figure tabular data Rohde & Schwarz FSU supplies the data for the noise figure and it is shown in tabular form in Figure 8. Frequency List Results RF NF Noise Temp Gain 400.000 MHz 1.395 dB 109.843 K 20.332 dB 450.000 MHz 1.336 dB 104.488 K 20.347 dB 500.000 MHz 1.298 dB 101.033 K 20.113 dB 550.000 MHz 1.273 dB 98.818 K 19.694 dB 600.000 MHz 1.270 dB 98.496 K 19.576 dB 650.000 MHz 1.260 dB 97.627 K 19.507 dB 700.000 MHz 1.228 dB 94.746 K 19.304 dB 750.000 MHz 1.224 dB 94.405 K 18.760 dB 800.000 MHz 1.241 dB 95.951 K 18.227 dB aaa-001338 Fig 8. Table of noise figure 6.3 Stability aaa-001339 K-factor, Line mag (10 MHz - 10 GHz) Fig 9. AN11097 Application note Plot of stability performance All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 10 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.4 Input return loss - Smith chart aaa-001341 200 MHz - 1 GHz Reference plane = input SMA connector on PC board Fig 10. Smith chart of input return losses AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 11 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.5 Forward gain, wide sweep aaa-001342 200 MHz - 1 GHz Fig 11. Plot of forward gain AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 12 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.6 Reverse isolation aaa-001343 200 MHz - 1 GHz Fig 12. Plot of reverse isolation AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 13 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.7 Output return loss - log magnitude aaa-001344 200 MHz - 1 GHz Fig 13. Plot of output return losses AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 14 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 6.8 Output return loss - Smith chart aaa-001345 200 MHz - 1 GHz Reference plane = input SMA connector on PC board Fig 14. Smith chart of output return losses AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 15 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 7. Legal information 7.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 7.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product AN11097 Application note design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 7.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 16 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 8. Tables Table 1. Table 2. BGU7003 400 MHz band LNA EVB parts List . .7 Typical results measured on the evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. BGU7003 400 MHz - 800 MHz LNA evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Simplified circuit of the BGU7003 . . . . . . . . . . . . .4 Circuit diagram of the evaluation board . . . . . . . . .5 Printed circuit board of the BGF7003 CMMB evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . .6 Stack of the PCB material . . . . . . . . . . . . . . . . . . .6 Evaluation board and connectors . . . . . . . . . . . . .8 Plot of noise figure . . . . . . . . . . . . . . . . . . . . . . . . .9 Table of noise figure. . . . . . . . . . . . . . . . . . . . . . .10 Plot of stability performance. . . . . . . . . . . . . . . . .10 Smith chart of input return losses . . . . . . . . . . . . 11 Plot of forward gain . . . . . . . . . . . . . . . . . . . . . . .12 Plot of reverse isolation . . . . . . . . . . . . . . . . . . . .13 Plot of output return losses . . . . . . . . . . . . . . . . .14 Smith chart of output return losses . . . . . . . . . . .15 AN11097 Application note All information provided in this document is subject to legal disclaimers. Rev. 01 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 17 of 18 AN11097 NXP Semiconductors CMMB LNA with BGU7003, 400 MHz to 800 MHz 10. Contents 1 2 3 3.1 3.2 3.3 3.4 4 5 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 7 7.1 7.2 7.3 8 9 10 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 General description . . . . . . . . . . . . . . . . . . . . . . 4 Application board . . . . . . . . . . . . . . . . . . . . . . . 5 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 5 Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . . 7 Equipment required . . . . . . . . . . . . . . . . . . . . . . 7 Connections and setup . . . . . . . . . . . . . . . . . . . 8 Summary of typical evaluation board test results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Noise figure plot . . . . . . . . . . . . . . . . . . . . . . . . 9 Noise figure tabular data. . . . . . . . . . . . . . . . . 10 Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Input return loss - Smith chart . . . . . . . . . . . . 11 Forward gain, wide sweep . . . . . . . . . . . . . . . 12 Reverse isolation . . . . . . . . . . . . . . . . . . . . . . 13 Output return loss - log magnitude . . . . . . . . . 14 Output return loss - Smith chart . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 March 2012 Document identifier: AN11097