OM7808/BGU7003W/FMHI,598

AN11034 High Ohmic FM LNA for embedded Antenna in Portable applications with BGU7003W Rev. 1.0 — 15 July 2011 Application note Document information Info Content Keywords BGU7003W, LNA, FM, embedded Antenna Abstract The document provides circuit, layout, BOM and performance information on FM band using BGU7003W AN11034 NXP Semiconductors High Ohmic FM LNA Revision history Rev Date Description 1.0 Initial document 20110715 Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 2 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 1. Introduction „Music‟ as mobile value proposition has become increasingly popular in recent years. Transferring MP3 from the PC and playing on the mobile is now common, eased by decline in memory prices. This trend has re-ignited interest in FM Radio on Mobile as people want to keep up with the news, listen to new music, in addition to playing their MP3 collection. With NXP„s FM LNA‟s consumers can listen to FM Radio on their mobile phone speaker. They amplify the weak signal solving impedance mismatch between embedded antennas and the FM Radio receiver. 2. Application Circuit The FM LNA application circuit is built with BGU7003W (LNA MMIC). It needs 8 (9 components used in the EVB) external components for matching, biasing and decoupling. The layout has also additional foot print for 0402 components, those are reserved for different applications or ESD protection and matching purpose. Fig 1. High Ohmic FM LNA schematic AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 3 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 2.1 Components Table 1. Bill of materials Component Position on Layout Value Unit Type Remark C1 Z3 0.56 pF MurataGRM1555 Stability (in case of using D2, C1 is not necessary) C2, C6 Z4, Z15 330 pF MurataGRM1555 DC blocking C3, C5, C4 Z6, Z9, Z20 47 nF DC decoupling (C4 is not necessary) R1 Z7 6.8 kΩ Bias setting R2 Z11 56 Ω Stability / Matching R3 Z13 10 Ω Stability Z1, Z16, Z19, Z21 0 Ω Jumper Reserved for ESD & matching Z5, Z8, Z10, Z12, Z14, Z17, Z18, NC Not connected Reserved for ESD & matching D1 D1 BGU7003W D2 Z2 PESD5V0F1BL ESD Diode (optional) 2.2 PCB Layout Fig 2. AN11034 Application note PCB material stack All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 4 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA Fig 3. Layout and assembly AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 5 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 3. Measurement results 3.1 Measurement results Table 2. Typical measurement results measured on the evaluation board [1] Tamb = 25 °C; Vcc = Ven = Vrb = 2.85 V; ICC(tot) = 3.2 mA ; f = 100 MHz; ZS = ZL = 50 Ω unless otherwise specified. All measurements are done with SMA-connectors as reference plane. Parameter Symbol Value Unit Remark AN11034 Application note supply voltage supply current Vcc [1] ICC(tot) 2.85 3.2 V mA noise figure insertion power gain NF 1.2 dB 13 dB input return loss RLin 0.5 dB output return loss input power at 1 dB gain compression output power at 1 dB gain compression input third-order intercept point output third-order intercept point RLout 16.5 dB Pi(1dB) -23 dBm Po(1dB) -11 dBm [2] -15 dBm -2 dBm │S21│ IP3I IP3O 2 [2] [1] ICC(tot) = ICC + IRF_OUT + IR_BIAS [2] The third order intercept point is measured at -30 dBm per tone at RF_IN (f1 = 100 MHz; f2 = 100.2 MHz) All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 6 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 3.2 Graphs All the measurements have done on the application board. The reference planes for the measurements are the SMA-connectors on the application board. Fig 4. AN11034 Application note Gain, Input and Output Matching All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 7 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA Fig 5. AN11034 Application note Isolation All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 8 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA Fig 6. Input and Output Impedance AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 9 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA Fig 7. Stability AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 10 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 4. Legal information 4.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 4.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors‟ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer‟s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. whether the NXP Semiconductors product is suitable and fit for the customer‟s applications and products planned, as well as for the planned application and use of customer‟s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer‟s applications or products, or the application or use by customer‟s third party customer(s). Customer is responsible for doing all necessary testing for the customer‟s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer‟s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer‟s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 4.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer‟s sole responsibility to determine AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 11 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 5. List of figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. High Ohmic FM LNA schematic ........................ 3 PCB material stack ........................................... 4 Layout and assembly ........................................ 5 Gain, Input and Output Matching ...................... 7 Isolation............................................................. 8 Input and Output Impedance............................. 9 Stability ........................................................... 10 AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 12 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 6. List of tables Table 1. Table 2. Bill of materials.................................................. 4 Typical measurement results measured on the evaluation board ............................................... 6 AN11034 Application note All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 July 2011 © NXP B.V. 2011. All rights reserved. 13 of 14 AN11034 NXP Semiconductors High Ohmic FM LNA 7. Contents 1. 2. 2.1 2.2 3. 3.1 3.2 4. 4.1 4.2 4.3 5. 6. 7. Introduction ......................................................... 3 Application Circuit .............................................. 3 Components ....................................................... 4 PCB Layout ........................................................ 4 Measurement results .......................................... 6 Measurement results .......................................... 6 Graphs ............................................................... 7 Legal information .............................................. 11 Definitions ........................................................ 11 Disclaimers....................................................... 11 Trademarks ...................................................... 11 List of figures..................................................... 12 List of tables ...................................................... 13 Contents ............................................................. 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. © NXP B.V. 2011. All rights reserved. For more information, visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 July 2011 Document identifier: AN11034