PCA82C251T/YM,118

PCA82C251 CAN transceiver for 24 V systems Rev. 04 — 25 August 2011 Product data sheet 1. General description The PCA82C251 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. 2. Features and benefits          Fully compatible with the “ISO 11898-24 V” standard Slope control to reduce Radio Frequency Interference (RFI) Thermally protected Short-circuit proof to battery and ground in 24 V powered systems Low-current Standby mode An unpowered node does not disturb the bus lines At least 110 nodes can be connected High speed (up to 1 MBd) High immunity against electromagnetic interference. 3. Applications  High-speed applications (up to 1 MBd) in trucks and busses. 4. Quick reference data Table 1. Quick reference data Symbol Parameter VCC supply voltage ICC supply current 1/tbit maximum transmission speed VCAN CANH, CANL input/output voltage Vdiff differential bus voltage tPD propagation delay Tamb ambient temperature Conditions Min Max Unit 4.5 5.5 V Standby mode - 275 A non-return-to-zero 1 - MBd 36 +36 V 1.5 3.0 V - 50 ns 40 +125 C High-speed mode PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 5. Ordering information Table 2. Ordering information Type number PCA82C251T Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 6. Block diagram VCC 3 1 PROTECTION TXD DRIVER 8 SLOPE/ STANDBY Rs 7 4 CANH RXD CANL 6 RECEIVER Vref 5 REFERENCE VOLTAGE PCA82C251 2 mbg613 GND Fig 1. Block diagram 7. Pinning information 7.1 Pinning TXD 1 GND 2 8 Rs 7 CANH PCA82C251 VCC 3 6 CANL RXD 4 5 Vref mbg612 Fig 2. PCA82C251 Product data sheet Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 2 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 7.2 Pin description Table 3. Pin description Symbol Pin Description TXD 1 transmit data input GND 2 ground VCC 3 supply voltage RXD 4 receive data output Vref 5 reference voltage output CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input 8. Functional description The PCA82C251 is the interface between a CAN protocol controller and the physical bus. It is primarily intended for applications up to 1 MBd in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO 11898-24 V” standard. A current-limiting circuit protects the transmitter output stage against short-circuits to positive and negative battery voltage. Although power dissipation will increase as a result of a short circuit fault condition, this feature will prevent destruction of the transmitter output stage. If the junction temperature exceeds approximately 160 C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for most of the power dissipated, this will result in reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain operational. The thermal protection is needed, in particular, when a bus line is short-circuited. The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment. Pin 8 (Rs) allows three different modes of operation to be selected: High-speed, Slope control and Standby. For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slopes. A shielded cable is recommended to avoid RFI problems. High-speed mode is selected by connecting pin 8 to ground. Slope control mode allows the use of an unshielded twisted pair or a parallel pair of wires as bus lines. To reduce RFI, the rise and fall slopes should be limited. The rise and fall slopes can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8. If a HIGH level is applied to pin 8, the circuit enters a low-current Standby mode. In this mode, the transmitter is switched off and the receiver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 3 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slower in Standby mode, the first message will be lost at higher bit rates. Table 4. Truth table of the CAN transceiver Supply TXD CANH CANL Bus state RXD 4.5 V to 5.5 V 0 HIGH LOW dominant 0 4.5 V to 5.5 V 1 (or floating) floating floating recessive 1[1] 4.5 V < VCC < 5.5 V X[2] floating if VRs > 0.75VCC floating if floating VRs > 0.75VCC X[1] 0 V < VCC < 4.5 V floating floating floating X[2] [1] If another bus node is transmitting a dominant bit, then RXD is logic 0. [2] X = don’t care. Table 5. floating Pin Rs summary Condition forced at pin Rs Mode Resulting voltage or current at pin Rs VRs > 0.75VCC Standby IRs < 10 A 10 A < IRs < 200 A Slope control 0.4VCC < VRs < 0.6VCC VRs < 0.3VCC High-speed IRs < 500 A 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin 2; positive input current. Symbol Parameter Conditions Min Max Unit V VCC supply voltage 0.3 +7.0 Vn DC voltage at pins 1, 4, 5 and 8 0.3 VCC + 0.3 V V6 DC voltage at pin 6 (CANL) 36 +36 V 0 V < VCC < 5.5 V; no time limit [1] 36 +36 V 0 V < VCC < 5.5 V; no time limit [2] 36 +36 V 36 +36 V 0 V < VCC < 5.5 V; TXD HIGH or floating V7 DC voltage at pins 7 (CANH) 0 V < VCC < 5.5 V; no time limit see Figure 8 Vtrt transient voltage at pins 6 and 7 Tstg storage temperature Tamb ambient temperature Tvj VESD 200 +200 V 55 +150 C 40 +125 C virtual junction temperature [3] 40 +150 C electrostatic discharge voltage [4] 2500 +2500 V [5] 250 +250 V [1] TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/s for voltages above +30 V. [2] Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW. [3] In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj = Tamb + Pd  Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb). [4] Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. [5] Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V. PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 4 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 160 K/W 11. Characteristics Table 8. Characteristics VCC = 4.5 V to 5.5 V; Tamb = 40 C to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Conditions Min Typ Max Unit Supply I3 supply current dominant; V1 = 1 V; VCC = 5.1 V - - 78 mA dominant; V1 = 1 V; VCC = 5.25 V - - 80 mA dominant; V1 = 1 V; VCC = 5.5 V - - 85 mA - - 10 mA - - 275 A recessive; V1 = 4 V; R8 = 47 k Standby [1] DC bus transmitter VIH HIGH-level input voltage output recessive 0.7VCC - VCC + 0.3 V VIL LOW-level input voltage output dominant 0.3 - 0.3VCC IIH HIGH-level input current V1 = 4 V 200 - +30 A IIL LOW-level input current V1 = 1 V  - 600 A V6,7 recessive bus voltage V1 = 4 V; no load 2.0 - 3.0 V ILO off-state output leakage current 2 V < (V6, V7) < 7 V 2 - +2 mA 5 V < (V6, V7) < 36 V 10 - +10 mA V7 CANH output voltage V1 = 1 V; VCC = 4.75 V to 5.5 V 3.0 - 4.5 V V1 = 1 V; VCC = 4.5 V to 4.75 V 2.75 V 4.5 V6 CANL output voltage V1 = 1 V 0.5 - 2.0 V V6, 7 difference between output voltage at pins 6 and 7 V1 = 1 V 1.5 - 3.0 V V1 = 1 V; RL = 45  1.5 - - V V1 = 4 V; no load 500 - +50 mV - - 200 mA Isc7 short-circuit CANH current V7 = 5 V V7 = 36 V - 100 - mA Isc6 short-circuit CANL current V6 = 36 V - - 200 mA DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; 2 V < (V6, V7) < 7 V; unless otherwise specified Vdiff(r) Vdiff(d) differential input voltage (recessive) differential input voltage (dominant) PCA82C251 Product data sheet [2] 1.0 - +0.5 V [2] 1.0 - +0.4 V 0.9 - 5.0 V 7 V < (V6, V7) < 12 V; not Standby mode 1.0 - 5.0 V Standby mode 0.97 - 5.0 V Standby mode; VCC = 4.5 V to 5.10 V 0.91 - 5.0 V 7 V < (V6, V7) < 12 V All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 5 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems Table 8. Characteristics …continued VCC = 4.5 V to 5.5 V; Tamb = 40 C to +125 C; RL = 60 ; I8 > 10 A; unless otherwise specified; all voltages referenced to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Conditions Min Typ Max Unit Vdiff(hys) differential input hysteresis see Figure 5 - 150 - mV VOH HIGH-level output voltage pin 4; I4 = 100 A 0.8VCC - VCC V VOL LOW-level output voltage pin 4; I4 = 1 mA 0 - 0.2VCC V I4 = 10 mA 0 - 1.5 V CANH, CANL 5 - 25 k 20 - 100 k Ri input resistance Rdiff differential input resistance Reference output reference output voltage Vref V8 = 1 V; I5 < 50 A 0.45VCC - 0.55VCC V V8 = 4 V; I5 < 5 A 0.4VCC - 0.6VCC V Timing (CL = 100 pF; see Figure 3, Figure 4, Figure 6 and Figure 7) tbit minimum bit time Rext = 0  - - 1 s tonTXD delay TXD to bus active Rext = 0  - - 50 ns toffTXD delay TXD to bus inactive Rext = 0  - 40 80 ns tonRXD delay TXD to receiver active Rext = 0  - 55 120 ns toffRXD delay TXD to receiver inactive Rext = 0 ; Tamb < +85 C VCC = 4.5 V to 5.1 V - 80 150 ns Rext = 0 ; VCC = 4.5 V to 5.1 V - 80 170 ns Rext = 0 ; Tamb < +85 C - 90 170 ns Rext = 0 k - 90 190 ns Rext = 47 k - 290 400 ns tonRXD delay TXD to receiver active Rext = 47 k - 440 550 ns SR CANH, CANL slew rate Rext = 47 k - 7 - V/s tWAKE wake-up time from Standby (via pin 8) see Figure 6 - - 20 s tdRXDL bus dominant to RXD LOW V8 = 4 V; see Figure 7 - - 3 s Standby/Slope control (pin 8) Vstb input voltage for Standby mode 0.75VCC - - V Islope Slope control mode current 10 - 200 A Vslope Slope control mode voltage 0.4VCC - 0.6VCC V [1] I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC; Tamb < 90 C. [2] This is valid for the receiver in all modes: High-speed, Slope control and Standby. PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 6 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems +5 V 100 nF VCC TXD CANH PCA82C251 60 Ω Vref 100 pF CANL RXD Rs GND 30 pF Rext 015aaa243 Fig 3. Test circuit for dynamic characteristics. VCC VTXD 0V 0.9 V Vdiff 0.5 V 0.7VCC VRXD 0.3VCC tonTXD toffTXD tonRXD Fig 4. toffRXD mbg615 Timing diagram for dynamic characteristics. VRXD HIGH LOW hysteresis 0.5 Fig 5. PCA82C251 Product data sheet 0.9 Vdiff (V) mbg616 Hysteresis. All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 7 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems VCC VRs 0V VRXD tWAKE mbg617 VTXD = 1 V. Fig 6. Timing diagram for wake-up from Standby. 1.5 V Vdiff 0V VRXD tdRXDL mbg618 VRs = 4 V; VTXD = 4 V. Fig 7. Timing diagram for bus dominant to RXD LOW. 100 nF +5 V VCC TXD Vref RXD 3 1 7 CANH PCA82C251 5 6 CANL 500 pF 8 GND SCHAFFNER GENERATOR 60 Ω 4 2 500 pF Rs 47 kΩ mbg619 The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig 8. PCA82C251 Product data sheet Test circuit for automotive transients. All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 8 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 12. Application information P8xC592 CAN-CONTROLLER CTX0 CRX0 CRX1 PX,Y Rext TXD RXD Vref +5 V Rs VCC PCA82C251 CAN-TRANSCEIVER CANH 120 Ω 100 nF GND CANL CAN BUS LINE 120 Ω mbg620 (1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW). (2) If no slope control is desired: Rext = 0. Fig 9. PCA82C251 Product data sheet PCA82C251 CAN transceiver application diagram All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 9 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 10. Package outline SOT96-1 (SO8) PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 10 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 11 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 11) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 11. PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 12 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 11. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 13 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA82C251_4 20110825 Product data sheet - PCA82C251_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. DIP8 package discontinued; bare die no longer available. Section 4 “Quick reference data” tPD propagation delay added. Typing errors corrected in Table 8 and Figure 3. PCA82C251_3 20000113 Product data sheet - PCA82C251_2 PCA82C251_2 19970314 Product data sheet - PCA82C251_1 PCA82C251_1 - Product data sheet - - PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 14 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be PCA82C251 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 15 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA82C251 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 04 — 25 August 2011 © NXP B.V. 2011. All rights reserved. 16 of 17 PCA82C251 NXP Semiconductors CAN transceiver for 24 V systems 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering of SMD packages . . . . . . . . . . . . . . 11 Introduction to soldering . . . . . . . . . . . . . . . . . 11 Wave and reflow soldering . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 August 2011 Document identifier: PCA82C251