PCA8537
Automotive LCD driver for multiplex rates up to 1:8
Rev. 2 — 7 April 2015
Product data sheet
1. General description
The PCA8537 is a fully featured Liquid Crystal Display (LCD)1 driver, specifically designed
for high-contrast Vertical Alignment (VA) LCD with multiplex rates up to 1:8. It generates
the drive signals for any static or multiplexed LCD containing up to eight backplanes,
46 segments, and up to 352 elements. The PCA8537 features an internal charge pump
with internal capacitors for on-chip generation of the LCD driving voltage. To ensure an
optimal and stable contrast over the full temperature range, the PCA8537 offers a
programmable temperature compensation of the LCD supply voltage. The PCA8537 can
be easily connected to a microcontroller by either the two-line I2C-bus (PCA8537AH) or a
three-line bidirectional SPI-bus (PCA8537BH).
For a selection of NXP LCD segment drivers, see Table 43 on page 72.
2. Features and benefits
AEC Q100 compliant for automotive applications.
Low-power single-chip LCD controller and driver
352 elements allowing to drive:
up to 44 7-segment alphanumeric characters
up to 22 14-segment alphanumeric characters
Selectable backplane drive configuration: static, 2, 4, 6, or 8 backplane multiplexing
Software programmable internal charge pump for on-chip LCD voltage generation up
to 9 V with internal capacitors
400 kHz I2C-bus interface (PCA8537AH)
5 MHz SPI-bus interface (PCA8537BH)
Programmable temperature compensation of VLCD in four regions
Selectable display bias configuration
Wide range for digital power supply: from 1.8 V to 5.5 V
Wide LCD supply range: from 2.5 V for low threshold LCDs and up to 9.0 V for high
threshold twisted nematic LCDs
Display memory bank switching in static, duplex, and quadruplex drive modes
352-bit RAM for display data storage
Programmable frame frequency in the range of 60 Hz to 300 Hz in steps of 10 Hz;
factory calibrated
Integrated temperature sensor with temperature readout
On chip calibration of internal oscillator frequency and VLCD
Manufactured in silicon gate CMOS process
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
3. Applications
Instrument cluster
Car radio
Climate control units
4. Ordering information
Table 1.
Ordering information
Type number
Interface type
Package
Name
Description
Version
PCA8537AH
I2C-bus
TQFP64
plastic thin quad flat package;
64 leads; body 10 10 1.0 mm
SOT357-1
PCA8537BH
SPI-bus
TQFP64
plastic thin quad flat package;
64 leads; body 10 10 1.0 mm
SOT357-1
4.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCA8537AH/Q900/1
PCA8537AH/Q900/1,5
935297895518
tape and reel, 13 inch, dry pack
1
PCA8537BH/Q900/1
PCA8537BH/Q900/1,5
935297896518
tape and reel, 13 inch, dry pack
1
5. Marking
Table 3.
PCA8537
Product data sheet
Marking codes
Type number
Marking code
PCA8537AH/Q900/1
PCA8537AH
PCA8537BH/Q900/1
PCA8537BH
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
6. Block diagram
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Fig 20. Temperature measurement block with digital temperature filter
Like any other filtering, the digital temperature filter (see Figure 20) introduces a certain
delay in the measurement of temperature. This behavior is illustrated in Figure 21.
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(1) Environment temperature, T1 (C).
(2) Measured temperature, T2 (C).
(3) Temperature deviation, T = T2 T1.
Fig 21. Temperature measurement delay during ramping up-down of the environment
temperature
This delay may cause undesired effects at start-up when the environment temperature
may be different than the reset value of the PCA8537 which is 20 C. In this case, it takes
up to 30 s until the correct measured temperature value will be available. A control bit,
TFE (see Table 23 on page 16), is implemented to enable or disable the digital
temperature filter. This bit is set logic 0 by default, which means, that the filter is disabled
and the unfiltered environment temperature value is available to calculate the desired
VLCD.
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
29 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.4.2
Temperature adjustment of the VLCD
Due to the temperature dependency of the liquid crystal viscosity the LCD controlling
voltage VLCD might have to be adjusted at different temperatures to maintain optimal
contrast. The temperature behavior of the liquid comes from the LCD manufacturer. The
slope has to be set to compensate for the liquid behavior. Internal temperature
compensation may be enabled via bit TCE (see Table 10 on page 10).
The ambient temperature range is split up into four equally sized regions and a different
temperature coefficient can be applied to each. Each coefficient can be selected from a
choice of eight different slopes. Each one of these coefficients may be independently
selected (see Table 27).
Table 27.
Temperature coefficients
SLA to SLD register value
Corresponding slope factor, SFA to SFD (mV/C)
000[1]
0
001
4
010
8
011
16
100
40
101
+4
110
+8
111
+16
[1]
Default value.
The slope factors imply a linear correction, however the implementation is in steps of
30 mV.
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Fig 22. Example of segmented temperature coefficients
The offset voltage is calculated according to Table 28.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
30 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
Table 28.
Calculation of the VLCD offset voltage
Temperature range
Voffset(LCD) voltage (mV)
T 40 C
V offset LCD = 30 SFA + 30 SFB
40 C T 10 C
V offset LCD = – 10 – T SFA + 30 SFB
10 C < T 20 C
V offset LCD = 20 – T SFB
20 C < T 50 C
V offset LCD = T – 20 SFC
50 C < T < 80 C
V offset LCD = T – 50 SFD + 30 SFC
80 C
V offset LCD = 30 SFD + 30 SFC
[1]
T[1]
No temperature compensation is possible above 80 C. Above this value, the system maintains the
compensation value from 80 C.
Example: Assumed that Tamb = 8 C; SFB= 16 mV/C:
V offset LCD = 20 – – 8 x – 16 = 28 – 16 = – 448mV
Remark: Care must be taken that the ranges of VPR[7:0] and VT[7:0] do not cause
clipping and hence undesired results. The device will not permit overflow or underflow and
will clamp results to either end of the range.
8.4.5 LCD voltage selector
The LCD voltage selector co-ordinates the multiplexing of the LCD in accordance with the
selected LCD drive configuration. The operation of the voltage selector is controlled by the
Set-bias-mode command (see Table 15 on page 12) and the Set-MUX-mode command
(see Table 14 on page 12).
Intermediate LCD biasing voltages are obtained from an internal voltage divider. The
biasing configurations that apply to the preferred modes of operation, together with the
biasing characteristics as functions of VLCD and the resulting discrimination ratios (D), are
given in Table 29.
Discrimination is a term which is defined as the ratio of the one and off RMS voltage
across a segment. It can be thought of as a measurement of contrast.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
31 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
Table 29.
LCD drive modes: summary of characteristics
LCD drive
mode
VLCD[2]
Backplanes
Bias levels
LCD bias
configuration
static
1
2
static
0
1
Von(RMS)
1:2 multiplex
2
3
1⁄
2
0.354
0.791
2.236
2.828Voff(RMS)
1:2 multiplex
2
4
1⁄
3
0.333
0.745
2.236
3.0Voff(RMS)
5
1⁄
4
0.395
0.729
1.845
2.529Voff(RMS)
4
3
1⁄
2
0.433
0.661
1.527
2.309Voff(RMS)
4
4
1⁄
3
0.333
0.577
1.732
3.0Voff(RMS)
5
1⁄
4
0.331
0.545
1.646
3.024Voff(RMS)
3
1⁄
2
0.456
0.612
1.341
2.191Voff(RMS)
1:2
multiplex[3]
1:4
multiplex[3]
1:4 multiplex
1:4
multiplex[3]
1:6
multiplex[3]
Number of:
2
4
6
V off RMS
----------------------V LCD
V on RMS
---------------------V LCD
V on RMS [1]
D = ---------------------V off RMS
1:6 multiplex
6
4
1⁄
3
0.333
0.509
1.527
3.0Voff(RMS)
1:6 multiplex
6
5
1⁄
4
0.306
0.467
1.527
3.266Voff(RMS)
1:8 multiplex[3]
8
3
1⁄
2
0.467
0.586
1.254
2.138Voff(RMS)
4
1⁄
3
0.333
0.471
1.414
3.0Voff(RMS)
5
1⁄
4
0.293
0.424
1.447
3.411Voff(RMS)
1:8
multiplex[3]
1:8 multiplex
8
8
[1]
Determined from Equation 5.
[2]
Determined from Equation 4.
[3]
In these examples, the discrimination factor and hence the contrast ratios are smaller. The advantage of these LCD drive modes is a
power saving from a reduction of the LCD voltage VLCD.
A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD
threshold voltage (Vth), typically when the LCD exhibits approximately 10 % contrast. In
the static drive mode, a suitable choice is VLCD > 3Vth.
1
Bias is calculated by ------------- , where the values for a are
1+a
a = 1 for 1⁄2 bias
a = 2 for 1⁄3 bias
a = 3 for 1⁄4 bias
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 3
V on RMS =
V LCD
a 2 + 2a + n
-----------------------------2
n 1 + a
(3)
where VLCD is the resultant voltage at the LCD segment and where the values for n are
n = 1 for static mode
n = 2 for 1:2 multiplex
n = 4 for 1:4 multiplex
n = 6 for 1:6 multiplex
n = 8 for 1:8 multiplex
The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 4:
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
32 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
V off RMS =
V LCD
a 2 – 2a + n
-----------------------------2
n 1 + a
(4)
Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 5:
V on RMS
--------------------- =
V off RMS
2
a + 1 + n – 1
-------------------------------------------2
a – 1 + n – 1
(5)
It should be noted that VLCD is sometimes referred as the LCD operating voltage.
8.4.5.1
Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The
RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of
the pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vth(off)) and the other at 90 % relative transmission (at Vth(on)), see
Figure 23. For a good contrast performance, the following rules should be followed:
V on RMS V th on
(6)
V off RMS V th off
(7)
Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection
of a (see Equation 3), n (see Equation 5), and the VLCD voltage.
Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module
manufacturer. Vth(off) is sometimes just named Vth. Vth(on) is sometimes named saturation
voltage Vsat.
It is important to match the module properties to those of the driver in order to achieve
optimum performance.
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Fig 23. Electro-optical characteristic: relative transmission curve of the liquid
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
33 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.6 LCD drive mode waveforms
8.4.6.1
Static drive mode
The static LCD drive mode is used when a single backplane is provided in the LCD.
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Vstate1(t) = VSn(t) VBP0(t).
Vstate2(t) = V(Sn + 1)(t) VBP0(t).
Von(RMS)(t) = VLCD.
Voff(RMS)(t) = 0 V.
Fig 24. Static drive mode waveforms (line inversion mode)
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
34 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.6.2
1:2 multiplex drive mode
When two backplanes are provided in the LCD, the 1:2 multiplex mode applies. The
PCA8537 allows the use of 1⁄2 bias or 1⁄3 bias in this mode as shown in Figure 25 and
Figure 26.
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Vstate1(t) = VSn(t) VBP0(t).
Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.791VLCD.
Voff(RMS)(t) = 0.354VLCD.
Fig 25. Waveforms for the 1:2 multiplex drive mode with 1⁄2 bias (line inversion mode)
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
35 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Vstate1(t) = VSn(t) VBP0(t).
Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.745VLCD.
Voff(RMS)(t) = 0.333VLCD.
Fig 26. Waveforms for the 1:2 multiplex drive mode with 1⁄3 bias (line inversion mode)
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
36 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.6.3
1:4 multiplex drive mode
When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies, as
shown in Figure 27.
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Vstate1(t) = VSn(t) VBP0(t).
Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.577VLCD.
Voff(RMS)(t) = 0.333VLCD.
Fig 27. Waveforms for the 1:4 multiplex drive mode with 1⁄3 bias (line inversion mode)
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
37 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.6.4
1:6 multiplex drive mode
When six backplanes are provided in the LCD, the 1:6 multiplex drive mode applies. The
PCA8537 allows the use of 1⁄3 bias or 1⁄4 bias in this mode as shown in Figure 28 and
Figure 29.
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Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.509VLCD. Voff(RMS)(t) = 0.333VLCD.
Fig 28. Waveforms for 1:6 multiplex drive mode with 1⁄3 bias (line inversion mode)
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
38 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn(t) VBP1(t).
Von(RMS)(t) = 0.467VLCD. Voff(RMS)(t) = 0.306VLCD.
Fig 29. Waveforms for 1:6 multiplex drive mode with 1⁄4 bias (line inversion mode)
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
39 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
8.4.6.5
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Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn(t) VBP1(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 30. Waveforms for 1:8 multiplex drive mode with 1⁄4 bias (line inversion mode)
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
40 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Vstate1(t) = VSn(t) VBP0(t). Vstate2(t) = VSn(t) VBP1(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 31. Waveforms for 1:8 multiplex drive mode with 1⁄4 bias (frame inversion mode)
PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
8.5 Backplane and segment outputs
8.5.1 Backplane outputs
The LCD drive section includes eight backplane outputs: BP0 to BP7. The backplane
output signals are generated based on the selected LCD multiplex drive mode.
Table 30 describes which outputs are active for each of the multiplex drive modes and
what signal is generated.
Table 30.
Mapping of output pins and corresponding signals with respect to driving mode
MUX
mode
Output pin
BP0
BP1
BP2
BP3
BP4
BP5
S45/BP6 S44/BP7
Signal
1:8
BP0
BP1
BP2
BP3
BP4
BP5
BP6
BP7
1:6
BP0
BP1
BP2
BP3
BP4
BP5
S45
S44
1:4
BP0
BP1
BP2
BP3
BP0[1]
BP1[1]
BP2[1]
BP3[1]
1:2
BP0
BP1
BP0[1]
BP1[1]
BP0[1]
BP1[1]
BP0[1]
BP1[1]
static
BP0
BP0[1]
BP0[1]
BP0[1]
BP0[1]
BP0[1]
BP0[1]
BP0[1]
[1]
8.5.1.1
These pins may optionally or alternatively be connected to the display to improve drive strength. Connect
only with the corresponding output pin carrying the same signal. If not required, they can be left open
circuit.
1:8 multiplex drive mode
In 1:8 multiplex drive mode, BP0 to BP7 must be connected directly to the LCD.
8.5.1.2
1:6 multiplex drive mode
1:6 multiplex mode is a special case. In this mode BP0 to BP5 must be connected directly
to the display as back plane signals and S44 and S45 must be connected to the display as
segment signals.
8.5.1.3
1:4 multiplex drive mode
In the 1:4 multiplex drive mode, BP0 to BP3 must be connected directly to the LCD.
The unused BPs may be left open-circuit. Optionally they may also be connected to the
display to increase drive strength.
•
•
•
•
8.5.1.4
BP0 is repeated on BP4
BP1 is repeated on BP5
BP2 is repeated on BP6
BP3 is repeated on BP7
1:2 multiplex drive mode
In the 1:2 multiplex drive mode, BP0 and BP1 must be connected directly to the LCD.
The unused BPs may be left open-circuit. Optionally they may also be connected to the
display to increase drive strength.
• BP0 is repeated on BP2, BP4, and BP6
• BP1 is repeated on BP3, BP5, and BP7
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Automotive LCD driver for multiplex rates up to 1:8
8.5.1.5
Static drive mode
In the static drive mode, BP0 must be connected directly to the LCD.
In the static drive mode, the same signal is carried by all eight backplane outputs and they
can be connected in parallel for very high drive requirements.
• BP0 is repeated on BP1, BP2, BP3, BP4, BP5, BP6, and BP7
8.5.2 Segment outputs
The LCD drive section includes up to 46 segment outputs. Segments S0 to S43 are
always segment outputs. There are also two more segment outputs which become active
in 1:6 multiplex mode. These are S45/BP6 and S44/BP7 and must also be connected
directly to the display.
The segment output signals are generated based on the multiplexed backplane signals
and with data resident in the display register. When less than 46 segment outputs are
required, the unused segment outputs must be left open-circuit.
8.5.2.1
Static, 1:8, 1:4, 1:2 multiplex drive mode
In these drive modes, segments S0 to S43 must be connected to the display.
8.5.2.2
1:6 multiplex drive mode
In this drive mode, segments S0 to S43, S44, and S45 must be connected to the display.
8.6 Display controller
The display controller executes the commands identified by the command decoder. It
contains the status registers of the PCA8537 and co-ordinates their effects. The controller
is also responsible for loading display data into the display RAM as required by the filling
order.
8.7 Display register
The display register holds the display data while the corresponding multiplex signals are
generated.
8.8 Display RAM
The display RAM stores LCD data. Depending on the multiplex drive mode, the
arrangement of the RAM is changed.
•
•
•
•
•
multiplex drive mode 1:8: RAM is 44 8 bit
multiplex drive mode 1:6: RAM is 46 6 bit
multiplex drive mode 1:4: RAM is 44 4 bit arranged in two banks
multiplex drive mode 1:2: RAM is 44 2 bit arranged in two banks
static drive mode: RAM is 44 1 bit arranged in two banks
A logic 1 in the RAM bit map indicates the on-state of the corresponding LCD element;
similarly, a logic 0 indicates the off-state.
There is a one-to-one correspondence between
PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
• the bits in the RAM bitmap and the LCD elements,
• the RAM columns and the segment outputs,
• the RAM rows and the backplane outputs.
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The display RAM bitmap shows the direct relationship between the display RAM column and the
segment outputs; and between the bits in a RAM row and the backplane outputs.
Fig 32. Display RAM bitmap
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Automotive LCD driver for multiplex rates up to 1:8
The display RAM bit map, Figure 32, shows row 0 to row 7 which correspond with the
backplane outputs BP0 to BP7, and column 0 to column 45 which correspond with the
segment outputs S0 to S45. In multiplexed LCD applications, the data of each row of the
display RAM is time-multiplexed with the corresponding backplane (row 0 with BP0, row 1
with BP1, and so on).
When display data is transmitted to the PCA8537, the display bytes received are stored in
the display RAM in accordance with the selected LCD multiplex drive mode. The data is
stored as it arrives. Depending on the current multiplex drive mode, data is stored
singularly, in pairs, quadruples, sextuples or bytes.
8.8.1 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This
allows the loading of an individual display data byte, or a series of display data bytes, into
any location of the display RAM. The sequence commences with the initialization of the
data pointer by the Load-data-pointer command (see Table 16 on page 12).
Following this command, an arriving data byte is stored starting at the display RAM
address indicated by the data pointer.
After each byte stored, the data pointer is automatically incremented in accordance with
the chosen LCD multiplex drive mode configuration:
•
•
•
•
•
by eight (static drive mode)
by four (1:2 multiplex drive mode)
by two (1:4 multiplex drive mode)
by one or two (1:6 multiplex drive mode), see Figure 37 on page 48
by one (1:8 multiplex drive mode)
When the address counter reaches the end of the RAM row, it stops incrementing after the
last byte is transmitted. Redundant bits of the last byte transmitted are discarded.
Additional bytes, sent after the end of the RAM is reached, will be discarded too. The data
pointer does not wrap around to the beginning. To send new RAM data, the data pointer
must be reset.
If an I2C-bus or SPI-bus data access is terminated early, then the state of the data pointer
is unknown. The data pointer must then be re-written before further RAM accesses.
8.8.2 RAM filling in static drive mode
In the static drive mode the eight transmitted data bits are placed in eight successive
display RAM columns in row 0 (see Figure 33).
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
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Fig 33. Display RAM filling order in static drive mode
In order to fill the whole RAM row, 6 bytes must be sent to the PCA8537, but the last 4 bits
from the last byte are discarded (see Figure 34).
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Fig 34. Discarded bits at the end of data transmission
When bit IBS is set to bank 1 (see Table 19 on page 14), then data is stored in row 4.
8.8.3 RAM filling in 1:2 multiplex drive mode
In the 1:2 multiplex drive mode the eight transmitted data bits are placed in four
successive display RAM columns (see Figure 35). In order to fill the whole two RAM rows
11 bytes need to be sent to the PCA8537.
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Fig 35. Display RAM filling order in 1:2 multiplex drive mode
When bit IBS is set to bank 1 (see Table 19 on page 14), then data is stored in row 4 and
row 5.
PCA8537
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
8.8.4 RAM filling in 1:4 multiplex drive mode
In the 1:4 multiplex drive mode the eight transmitted data bits are placed in two
successive display RAM columns of four rows (see Figure 36). In order to fill the whole
four RAM rows 22 bytes need to be sent to the PCA8537.
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Fig 36. Display RAM filling order in 1:4 multiplex drive mode
When bit IBS is set to bank 1 (see Table 19 on page 14), then data is stored in rows 4 to
row 7.
8.8.5 RAM filling in 1:6 multiplex drive mode
In the 1:6 multiplex drive mode the RAM is organized in six rows and 46 columns. The
eight transmitted data bits are placed in such a way, that a column is filled up (see
Figure 37). The remaining bits are wrapped up into the next column. In order to fill the
whole RAM addresses 35 bytes need to be sent to the PCA8537, however the four least
significant bits of the 35th byte are discarded.
PCA8537
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
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Fig 37. Display RAM filling order in 1:6 multiplex drive mode
When data transfer is initiated, then the MSB of the first byte will always be placed in
row 0. Data must be transferred contiguously to achieve RAM filling as described in
Figure 37.
8.8.6 RAM filling in 1:8 multiplex drive mode
In the 1:8 multiplex drive mode the eight transmitted data bits are placed into eight rows of
one display RAM column (see Figure 38). In order to fill the whole RAM addresses
44 bytes need to be sent to the PCA8537.
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
8.9 Bank selection
The PCA8537 includes a RAM bank switching feature in the static, 1:2, and 1:4 multiplex
drive modes. A bank can be thought of as a collection of RAM rows. The RAM bank
switching gives the provision for preparing display information in an alternative bank and
to be able to switch to it once it is complete.
There are two banks; bank 0 and bank 1. Figure 32 on page 44 shows the location of
these banks relative to the RAM map. Input and output banks can be set independently
from one another with the Bank-select command (see Table 19 on page 14). Figure 39
shows the concept.
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Fig 39. Bank selection
In Figure 40 an example is shown for 1:4 multiplex drive mode where the displayed data is
read from the first four rows of the memory (bank 0), while the transmitted data is stored in
the second four rows of the memory (bank 1).
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Fig 40. Example of the Bank-select command with multiplex drive mode 1:4
8.9.1 Input bank selection
The IBS (input bank selection) bit of the Bank-select command (see Table 19) controls
where display data is loaded into the display RAM.
The input bank selection works independently of output bank selection.
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Automotive LCD driver for multiplex rates up to 1:8
8.9.2 Output bank selection
The OBS bit of the Bank-select command (see Table 19 on page 14) controls from which
bank display data is taken,
The output bank selection works independently of input bank selection.
9. Bus interfaces
9.1 Control byte
After initiating the communication over the bus and sending the slave address (I2C-bus,
see Section 9.2) or subaddress (SPI-bus, see Section 9.3), a control byte follows. The
purpose of this byte is to indicate both, the content for the following data bytes (RAM or
command) and to indicate that more control bytes will follow.
Typical sequences could be:
• Slave address/subaddress - control byte - command byte - command byte - command
byte - end
• Slave address/subaddress - control byte - RAM byte - RAM byte - RAM byte - end
• Slave address/subaddress - control byte - command byte - control byte - RAM byte end
In this way, it is possible to send a mixture of RAM and command data in one access or
alternatively, to send just one type of data in one access.
Table 31.
Control byte description
Bit
Symbol
7
CO
6
5 to 0
Binary value
Description
continue bit
0
last control byte
1
control bytes continue
RS
register selection
0
command register
1
data register
-
not relevant
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Fig 41. Control byte format
PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
9.2 I2C-bus interface characteristics (PCA8537AH)
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor when connected to the output
stages of a device. Data transfer may be initiated only when the bus is not busy.
9.2.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as a control signal (see Figure 42).
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Fig 42. Bit transfer
9.2.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy.
A HIGH-to-LOW change of the data line, while the clock is HIGH is defined as the START
condition (S).
A LOW-to-HIGH change of the data line while the clock is HIGH is defined as the STOP
condition (P).
The START and STOP conditions are shown in Figure 43.
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Fig 43. Definition of START and STOP conditions
9.2.3 System configuration
A device generating a message is a transmitter, a device receiving a message is the
receiver. The device that controls the message is the master and the devices which are
controlled by the master are the slaves. The system configuration is shown in Figure 44.
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
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Fig 44. System configuration
9.2.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of 8 bits is followed by an acknowledge
cycle.
• A slave receiver which is addressed must generate an acknowledge after the
reception of each byte.
• Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
• The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
• A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is shown in Figure 45.
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Fig 45. Acknowledgement on the I2C-bus
9.2.5 I2C-bus controller
The PCA8537AH acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or
transmit data to an I2C-bus master receiver. The only data output from PCA8537AH are
the acknowledge signals and the temperature readout byte of the selected device.
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Automotive LCD driver for multiplex rates up to 1:8
9.2.6 Input filters
To enhance noise immunity in electrically adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
9.2.7 I2C-bus slave address
The device selection depends on the I2C-bus slave address.
Two different I2C-bus slave addresses can be used to address the PCA8537AH (see
Table 32).
Table 32.
I2C slave address byte
Slave address
Bit
7
6
5
4
3
2
1
MSB
0
0
LSB
1
1
1
0
0
A0
R/W
Bit 1 of the slave address is defined by connecting the input A0 to either VSS (logic 0) or
VDD (logic 1). Therefore, two instances of PCA8537AH can be distinguished on the same
I2C-bus.
The least significant bit of the slave address byte is bit R/W (see Table 33).
Table 33.
R/W bit description
Symbol
Value
R/W
[1]
Description
data read or write selection
0
write data
1
read data[1]
Only used for temperature readout from PCA8537AH (see Table 21 on page 15).
9.2.8 I2C-bus protocol
The I2C-bus protocol is shown in Figure 46. The sequence is initiated with a START
condition (S) from the I2C-bus master which is followed by one of the two PCA8537AH
slave addresses available. All PCA8537AH’s with the corresponding A0 level
acknowledge in parallel to the slave address, but all PCA8537AH with an alternative A0
level ignore the whole I2C-bus transfer.
After acknowledgement, a control byte follows (see Section 9.1 on page 50).
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
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The display bytes are stored in the display RAM at the address specified by the data
pointer.
The acknowledgement after each byte is made only by the addressed PCA8537AH. After
the last display byte, the I2C-bus master issues a STOP condition (P). Alternatively a
START may be issued to RESTART an I2C-bus access.
9.2.9 Data read
If a temperature readout (byte TD[7:0]) is made, the R/W bit must be logic 1 and then the
next data byte following is provided by the PCA8537AH as shown in Figure 47.
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PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
54 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
9.3 SPI-bus interface (PCA8537BH)
Data transfer to the device is made via a three-line SPI-bus (see Table 31). The SPI-bus is
reset whenever the chip enable pin CE is inactive.
Table 34.
Pin
Serial interface
Function
Description
LOW[1]
CE
chip enable input; active
SCL
serial clock input
when HIGH, the interface is reset;
-
SDIO
serial data input output
input data is sampled on the rising edge of SCL;
data is output on the falling edge of SCL
[1]
The chip enable must not be wired permanently LOW.
9.3.1 Data transmission
The chip enable signal is used to identify the transmitted data. Each data transfer is a
byte, with the Most Significant Bit (MSB) sent first.
The transmission is controlled by the active LOW chip enable signal CE. The first byte
transmitted is the subaddress byte.
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Fig 48. Data transfer overview
The subaddress byte opens the communication with a read/write bit and a subaddress.
The subaddress is used to identify multiple devices on one SPI-bus.
Table 35.
Subaddress byte definition
Bit
Symbol
7
R/W
Binary value
Description
data read or write selection
0
write data
1
read data[1]
6 to 5
SA[1:0]
01
subaddress; other codes will cause the device
to ignore data transfer
4 to 0
-
-
unused
[1]
Only used for temperature readout from PCA8537BH (see Table 21 on page 15).
After the subaddress byte, a control byte follows (see Section 9.1 on page 50).
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
55 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Data transfers are terminated by de-asserting CE (set CE to logic 1)
Fig 49. SPI-bus write example
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In this example, the multiplex mode is set to 1:8. The transfer is terminated by CE returning to logic 1. After the last bit is
transmitted, the state of the SDIO line is not important.
Fig 50. SPI-bus write example
9.3.2 Data read
The temperature readout data byte TD[7:0] can be read from the PCA8537BH.
A readout is initiated by sending the subaddress byte with the R/W bit set high. The
transmission is controlled by the active LOW chip enable signal CE.
After the last bit of the subaddress byte is transmitted, the PCA8537BH will immediately
start to drive the SDIO line. It is only necessary to read the values once, however since
the update of the register is asynchronous to the interface clock, it is recommended to
read the register twice and check for a stable value.
The readout is terminated by asserting CE. At this time, the SDIO bus is released. It is
important that the bus is not left floating and that the microcontroller then takes over
driving of the bus.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
56 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
5:
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Fig 51. SPI-bus read example
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
57 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
10. Internal circuitry
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(1) Output resistance, RO, see Table 37 on page 60.
Fig 52. Device protection diagram for PCA8537AH
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(1) Output resistance, RO, see Table 37 on page 60.
Fig 53. Device protection diagram for PCA8537BH
11. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Static voltages across the liquid crystal display can build up when the LCD supply voltage
(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted
display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
58 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
12. Limiting values
Table 36. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
PCA8537
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VDD1
supply voltage 1
digital
0.5
+6.5
V
VDD2
supply voltage 2
analog
0.5
+6.5
V
IDD1
supply current 1
digital
50
+50
mA
IDD2
supply current 2
analog
50
+50
mA
VLCD
LCD supply voltage
0.5
+10
V
IDD(LCD)
LCD supply current
Vi
input voltage
II
input current
VO
output voltage
50
+50
mA
0.5
+6.5
V
10
+10
mA
on pins S0 to S45,
BP0 to BP7
0.5
+10
V
on pins SDA,
SDIO, CLK
0.5
+6.5
V
on pins CLK, CE,
SDA, SCL, A0,
SDIO, T1, T2
IO
output current
10
+10
mA
ISS
ground supply current
50
+50
mA
Ptot
total power dissipation
-
400
mW
P/out
power dissipation per
output
-
100
mW
VESD
electrostatic discharge
voltage
V
HBM
[1]
-
4500
CDM
[2]
-
1500
V
Ilu
latch-up current
[3]
-
200
mA
Tstg
storage temperature
[4]
65
+150
C
Tamb
ambient temperature
40
+95
C
operating device
[1]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[2]
Pass level; Charged-Device Model (CDM), according to Ref. 7 “JESD22-C101”.
[3]
Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the NXP store and transport requirements (see Ref. 10 “NX3-00092”) the devices have to be
stored at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
59 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
13. Static characteristics
Table 37. Static characteristics
VDD1 = 1.8 V to 5.5 V; VDD2 = 2.5 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 9.0 V; Tamb = 40 C to +95 C; temperature
measurement enabled; 1:8 multiplex drive mode; 1⁄4 bias; LCD outputs are open circuit; RAM is all written with logic 1; inputs
at VSS or VDD; internal clock with maximum prescale factor; I2C-bus/SPI-bus inactive; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD1
supply voltage 1
logic
1.8
-
5.5
V
VDD2
supply voltage 2
analog;
VDD2 VDD1
2.5
-
5.5
V
Supplies
charge pump set to 2 VDD2
charge pump set to 3 VDD2
VLCD
LCD supply voltage
2.5
-
5.5
V
VLCD VDD2
[1]
2.5
-
9.0
V
[2]
0.10
-
+0.10
V
VLCD
LCD voltage variation
VDD1 = VDD2 = 5.0 V;
VLCD = 6.99 V
IDD1
supply current 1
digital;
display disabled;
charge pump off
-
90
200
A
IDD2
supply current 2
display disabled;
charge pump off;
external VLCD
-
0.5
-
A
-
30
40
A
-
200
-
A
-
85
-
A
VDD2 = 5.5 V;
charge pump set to 2 VDD2;
internal VLCD = 7.0 V
display disabled
display enabled
external VLCD = 7.0 V;
display enabled;
[3]
IDD(LCD)
LCD supply current
IDD(pd)
power-down mode supply on pin VDD1
current
-
1
3
A
ILCD(pd)
power-down LCD current
-
15
25
A
Tacc
temperature accuracy
readout temperature error;
VDD1 = 5.0 V
Tamb = 40 C to +95 C
5
-
+5
C
Tamb = 25 C
3
-
+3
C
Logic
VSS 0.5 -
VDD + 0.5 V
on pins CLK and A0
-
-
0.3VDD
V
on pins CLK and A0
0.7VDD
-
-
V
output voltage
0.5
-
VDD + 0.5 V
VOH
HIGH-level output voltage on pin CLK
0.8VDD
-
-
VOL
LOW-level output voltage
-
-
0.2VDD
V
IOH
HIGH-level output current output source current;
VOH = 4.6 V;
VDD = 5 V;
on pin CLK
1
-
-
mA
VI
input voltage
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
VO
PCA8537
Product data sheet
on pin CLK
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Rev. 2 — 7 April 2015
V
© NXP Semiconductors N.V. 2015. All rights reserved.
60 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
Table 37. Static characteristics …continued
VDD1 = 1.8 V to 5.5 V; VDD2 = 2.5 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 9.0 V; Tamb = 40 C to +95 C; temperature
measurement enabled; 1:8 multiplex drive mode; 1⁄4 bias; LCD outputs are open circuit; RAM is all written with logic 1; inputs
at VSS or VDD; internal clock with maximum prescale factor; I2C-bus/SPI-bus inactive; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IOL
LOW-level output current
output sink current;
VOL = 0.4 V;
VDD = 5 V;
on pin CLK
1
-
-
mA
VPOR
power-on reset voltage
-
-
1.6
V
IL
leakage current
1
-
+1
A
pins SDA, SCL
VSS 0.5 -
5.5
V
pin SDIO
VSS 0.5 -
VDD + 0.5 V
[4]
Vi = VDD or VSS;
on pins CLK and A0
I2C- and SPI-bus lines; pins SDA, SCL and SDIO
input voltage
VI
VIL
LOW-level input voltage
pins SDA, SCL, and SDIO
-
-
0.3VDD
V
VIH
HIGH-level input voltage
pins SDA, SCL, and SDIO
0.7VDD
-
-
V
VO
output voltage
pins SDA and SCL
0.5
-
5.5
V
SDIO
0.5
-
VDD + 0.5 V
VOL = 0.4 V;
VDD = 5 V;
on pin SDA and SDIO
3
-
-
mA
IOL
LOW-level output current
IOH
HIGH-level output current VOH = 4.6 V;
VDD = 5 V;
on pin SDIO
3
-
-
mA
IL
leakage current
VI = VDD or VSS
1
-
+1
A
output voltage variation
on pins BP0 to BP7
[5]
15
-
+15
mV
on pins S0 to S45
[6]
15
-
+15
mV
VLCD = 7 V;
on pins BP0 to BP7
[7]
0.3
0.8
1.5
k
VLCD = 7 V;
on pins S0 to S45
[7]
0.6
1.5
3
k
LCD outputs
VO
output resistance
RO
[1]
When supplying external VLCD it must be VLCD VDD2. Also when using the internal charge pump to generate a certain VLCD, VPR[7:0]
must be set to a value that the voltage is higher than VDD2 (see Section 8.4.2).
[2]
Calibrated at testing stage. VLCD temperature compensation is disabled.
[3]
Tested on sample basis.
[4]
If VDD1 < VPOR a reset occurs.
[5]
Variation between any 2 backplanes on a given voltage level; static measured.
[6]
Variation between any 2 segments on a given voltage level; static measured.
[7]
Outputs measured one at a time.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
61 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
DDD
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VLCD = 5 V to 9 V.
Remark: Only valid if the charge pump is driven in a safe range as described in Figure 18 and
Figure 19.
a. VDD = 5 V
DDD
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VLCD = 5 V to 9 V.
Remark: Only valid if the charge pump is driven in a safe range as described in Figure 18 and
Figure 19.
b. VDD = 3 V
Fig 54. LCD voltage variation with respect to temperature
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
62 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
DDD
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VDD2 = 5.0 V; 1:8 multiplex drive mode; 1⁄4 bias; temperature measurement enabled; LCD outputs
are open circuit; RAM all logic 1; inputs at VSS or VDD; internal clock with max prescale factor; bus
active.
(1) Charge pump on; VDD1 = 5.5 V; charge pump configuration: VLCD = 2 VDD2; VPR[7:0] set to
7.0 V; display enabled.
(2) Charge pump off; VDD1 = 5.0 V; display disabled.
Fig 55. Typical IDD1 with respect to temperature
DDD
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VDD1 = VDD2 = 5.0 V; 1:8 multiplex drive mode; 1⁄4 bias; temperature measurement enabled; flat
temperature compensation; LCD outputs are open circuit; RAM all logic 1; inputs at VSS or VDD;
internal clock with max prescale factor; bus inactive; charge pump on; charge pump configuration:
VLCD = 2 VDD2; VPR[7:0] set to 7.0 V; display enabled.
Fig 56. Typical IDD2 with respect to temperature
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
63 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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VDD1 = VDD2 = 5.0 V; 1:8 multiplex drive mode; 1⁄4 bias; LCD outputs are open circuit; RAM all logic
1; inputs at VSS or VDD; internal clock with max prescale factor; bus inactive; charge pump off;
VLCD = 7.0 V, external supplied; display enabled.
Fig 57. Typical IDD(LCD) with respect to temperature
14. Dynamic characteristics
Table 38. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 9.0 V; Tamb = 40 C to +95 C; unless otherwise specified.
Symbol
Parameter
fclk(ext)
external clock frequency
Conditions
tclk(H)
clock HIGH time
tclk(L)
clock LOW time
external clock source used
fclk
clock frequency
tw(rst)L
LOW-level reset time
[1]
[1]
on pin CLK; see Table 18
Min
Typ
Max
Unit
450
-
14500
Hz
33
-
-
s
33
-
-
s
7800
9600
11040
Hz
400
-
-
ns
Frequency present on OSCCLK with default display frequency division factor.
IFON
WFON +
WFON /
9''
&/.
9''
DDD
Fig 58. Driver timing waveforms
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
64 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
WZ UVW /
5(6(7
9''
DDD
Fig 59. RESET timing
Table 39. Timing characteristics: I2C-bus
VDD1 = 1.8 V to 5.5 V; VDD2 = 2.5 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +95 C; unless otherwise specified.
Symbol
Parameter
fSCL
tBUF
Conditions
Min
Typ
Max
Unit
SCL clock frequency
-
-
400
kHz
bus free time between a
STOP and START condition
1.3
-
-
s
tHD;STA
hold time (repeated) START
condition
0.6
-
-
s
tSU;STA
set-up time for a repeated
START condition
0.6
-
-
s
tVD;DAT
data valid time
[4]
-
-
0.9
s
tVD;ACK
data valid acknowledge time
[5]
-
-
0.9
s
tLOW
LOW period of the SCL clock
1.3
-
-
s
tHIGH
HIGH period of the SCL clock
0.6
-
-
s
tf
fall time
of both SDA and SCL signals
-
-
0.3
s
tr
rise time
of both SDA and SCL signals
-
-
0.3
s
Cb
capacitive load for each bus
line
-
-
400
pF
tSU;DAT
data set-up time
100
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tSU;STO
set-up time for STOP
condition
0.6
-
-
s
tw(spike)
spike pulse width
-
-
50
ns
[1]
Internal calibration made with OTP so that the maximum variation is 15 % over whole temperature and voltage range. The typical fclk
frequency generates a typical frame frequency of 200 Hz when the default frequency division factor is used.
[2]
The typical value is defined at VDD1 = VDD2 = 5.0 V and 30 C.
[3]
All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an
input voltage swing of VSS to VDD.
[4]
tVD;DAT = minimum time for valid SDA output following SCL LOW.
[5]
tVD;ACK = time for acknowledgement signal from SCL LOW to SDA output LOW.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
65 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Fig 60. I2C-bus timing waveforms
Table 40. Timing characteristics: SPI-bus
VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +95 C. All timing values are valid within the operating supply voltage and
temperature range and referenced to VIL and VIH with an input voltage swing of VSS to VDD.
Symbol
Parameter
Conditions
VDD < 2.7 V
VDD 2.7 V
Min
Max
Min
Max
Unit
Timing characteristics (see Figure 61)
fclk(SCL)
SCL clock frequency
-
2
-
5
MHz
tSCL
SCL time
500
-
200
-
ns
tclk(H)
clock HIGH time
200
-
80
-
ns
tclk(L)
clock LOW time
200
-
80
-
ns
tr
rise time
for SCL signal
-
100
-
100
ns
tf
fall time
for SCL signal
-
100
-
100
ns
tsu(CE)
CE set-up time
150
-
80
-
ns
th(CE)
CE hold time
0
-
0
-
ns
trec(CE)
CE recovery time
100
-
100
-
ns
tsu
set-up time
set-up time for SDI data
35
-
10
-
ns
th
hold time
hold time for SDI data
25
-
15
-
ns
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
66 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
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Fig 61. SPI-bus timing
15. Test information
15.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
67 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
16. Package outline
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287/,1(
9(56,21
,(&
-('(&
627
(
06
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(8523($1
352-(&7,21
,668('$7(
Fig 62. Package outline SOT357-1 (TQFP64)
PCA8537
Product data sheet
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PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
PCA8537
Product data sheet
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
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PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
18.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
18.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 63) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 41 and 42
Table 41.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 42.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 63.
PCA8537
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PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 63. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
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71 of 82
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NXP Semiconductors
PCA8537
Product data sheet
19. Appendix
19.1 LCD segment driver selection
Table 43.
Selection of LCD segment drivers
Type name
Number of elements at MUX
ffr (Hz)
Interface Package
AECQ100
PCA8553DTT
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C / SPI
TSSOP56 Y
PCA8546ATT
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
I2C
TSSOP56 Y
PCA8546BTT
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
SPI
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
Y
40 to 95
I2C
TQFP64
Y
60 to
300[1]
Y
Y
40 to 95
SPI
TQFP64
Y
N
N
40 to 85
I2C
LQFP80
N
N
40 to 95
I2C
LQFP80
Y
Y
40 to 105
I2C
LQFP80
Y
TSSOP56 N
88
-
-
-
44
88
176 -
-
-
1.8 to 5.5 2.5 to 9
PCF85134HL
60
120 180 240 -
-
-
1.8 to 5.5 2.5 to 6.5 82
PCA8543AHL
60
60
120 180 240 120 -
240 -
-
-
1.8 to 5.5 2.5 to 8
2.5 to 5.5 2.5 to 9
82
Y
N
60 to
300[1]
300[1]
Y
PCF8545ATT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to
N
N
40 to 85
I2C
PCF8545BTT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
SPI
TSSOP56 N
PCF8536AT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 85
I2C
TSSOP56 N
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 85
SPI
TSSOP56 N
300[1]
TSSOP56 Y
PCF8536BT
-
-
-
176 252 320 -
PCA8536AT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to
N
N
40 to 95
I2C
PCA8536BT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
SPI
TSSOP56 Y
PCF8537AH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 85
I2C
TQFP64
N
1.8 to 5.5 2.5 to 9
60 to
300[1]
Y
Y
40 to 85
SPI
TQFP64
N
300[1]
PCF8537BH
44
88
-
176 276 352 -
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to
Y
Y
40 to 95
TQFP64
Y
PCA8537BH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 95
SPI
TQFP64
Y
PCA9620H
60
120 -
240 320 480 -
2.5 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 105 I2C
LQFP80
Y
2.5 to 5.5 2.5 to 9
300[1]
Y
40 to 105
I2C
Bare die
Y
PCA9620U
60
120 -
240 320 480 -
60 to
Y
PCF8576DU
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
I2C
Bare die
N
PCF8576EUG
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
I2C
Bare die
N
N
40 to 105
I2C
Bare die
Y
N
40 to 85
I2C
Bare die
N
N
40 to 95
I2C
Bare die
Y
PCA8576FUG
PCF85133U
PCA85133U
40
80
80
80
120 160 -
160 240 320 160 240 320 -
-
-
1.8 to 5.5 2.5 to 8
200
N
1.8 to 5.5 2.5 to 6.5 82,
110[2]
1.8 to 5.5 2.5 to 8
110[2]
82,
N
N
PCA8537
72 of 82
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PCA8537AH
I2C
Automotive LCD driver for multiplex rates up to 1:8
Rev. 2 — 7 April 2015
All information provided in this document is subject to legal disclaimers.
PCA8547BHT
PCA85134H
-
176 -
1:9
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
1:2 1:3
44
1:6 1:8
VLCD (V)
1:1
PCA8547AHT
1:4
VDD (V)
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Selection of LCD segment drivers …continued
Type name
Number of elements at MUX
ffr (Hz)
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
AECQ100
PCA85233UG
80
160 240 320 -
-
-
1.8 to 5.5 2.5 to 8
150, 220[2]
N
N
40 to 105 I2C
Bare die
Y
PCF85132U
160 320 480 640 -
-
-
1.8 to 5.5 1.8 to 8
60 to 90[1]
N
N
40 to 85
I2C
Bare die
N
Y
40 to 105
I2C
Bare die
Y
N
40 to 95
I2C
Bare die
Y
N
N
40 to 95
I2C
Bare die
Y
Y
Y
40 to 85
I2C / SPI
Bare die
N
Y
40 to 105
I2C
Bare die
Y
PCA85132U
408 -
160 320 480 640 -
PCA85232U
160 320 480 640 -
PCF8538UG
102 204 -
PCA8538UG
102 204 -
Software programmable.
[2]
Hardware selectable.
-
-
2.5 to 5.5 4 to 12
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
45 to
300[1]
60 to
90[1]
117 to
176[1]
408 612 816 918 2.5 to 5.5 4 to 12
45 to 300[1]
408 612 816 918 2.5 to 5.5 4 to 12
300[1]
45 to
Y
N
Y
/ SPI
/ SPI
PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
Rev. 2 — 7 April 2015
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[1]
-
1:9
Interface Package
1:2 1:3
102 204 -
1:6 1:8
VLCD (V)
1:1
PCA8530DUG
1:4
VDD (V)
NXP Semiconductors
PCA8537
Product data sheet
Table 43.
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
20. Abbreviations
Table 44.
Acronym
PCA8537
Product data sheet
Abbreviations
Description
AEC
Automotive Electronics Council
CMOS
Complementary Metal Oxide Semiconductor
DC
Direct Current
EPROM
Erasable Programmable Read-Only Memory
HBM
Human Body Model
I2C
Inter-Integrated Circuit bus
IC
Integrated Circuit
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MSB
Most Significant Bit
MSL
Moisture Sensitivity Level
MUX
Multiplexer
OTP
One Time Programmable
PCB
Printed-Circuit Board
POR
Power-On Reset
RC
Resistance-Capacitance
RAM
Random Access Memory
RMS
Root Mean Square
SCL
Serial Clock Line
SDA
Serial DAta line
SMD
Surface Mount Device
SPI
Serial Peripheral Interface
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PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
21. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10853 — ESD and EMC sensitivity of IC
[3]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[4]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[6]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7]
JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[8]
JESD78 — IC Latch-Up Test
[9]
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[10] NX3-00092 — NXP store and transport requirements
[11] SNV-FA-01-02 — Marking Formats Integrated Circuits
[12] UM10204 — I2C-bus specification and user manual
PCA8537
Product data sheet
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PCA8537
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Automotive LCD driver for multiplex rates up to 1:8
22. Revision history
Table 45.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA8537 v.2
20150407
Product data sheet
-
PCA8537 v.1
Modifications:
PCA8537 v.1
PCA8537
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Adjusted Figure 32
Fixed typos
20120531
Product data sheet
-
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Rev. 2 — 7 April 2015
-
© NXP Semiconductors N.V. 2015. All rights reserved.
76 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
23.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
23.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCA8537
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
77 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
23.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA8537
Product data sheet
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Rev. 2 — 7 April 2015
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78 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
25. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description of PCA8537AH and
PCA8537BH . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Commands of PCA8537 . . . . . . . . . . . . . . . . . .7
Initialize - initialize command bit description . . .8
OTP-refresh - OTP-refresh command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Oscillator-ctrl - oscillator control command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Charge-pump-ctrl - charge pump control
command bit description . . . . . . . . . . . . . . . . . .9
Temp-msr-ctrl - temperature measurement control
command bit description . . . . . . . . . . . . . . . . .10
Temp-comp - temperature compensation
coefficients command . . . . . . . . . . . . . . . . . . .10
Set-VPR - set VPR command bit description . 11
Display-enable - display enable command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Set-MUX-mode - set multiplex drive mode
command bit description . . . . . . . . . . . . . . . . .12
Set-bias-mode - set bias mode command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Load-data-pointer - load data pointer command
bit description . . . . . . . . . . . . . . . . . . . . . . . . .12
Frame frequency - frame frequency and output
clock frequency command bit description . . . .13
Frame frequency values . . . . . . . . . . . . . . . . .13
Bank-select - bank select command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Write-RAM-data - write RAM data command
bit description . . . . . . . . . . . . . . . . . . . . . . . . .14
Temp-read - temperature readout command
bit description . . . . . . . . . . . . . . . . . . . . . . . . .15
Invmode_ctrl - drive scheme inversion
command bit description . . . . . . . . . . . . . . . . .15
Temp-filter - digital temperature filter
command bit description . . . . . . . . . . . . . . . . .16
Reset state . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Selection of display configurations . . . . . . . . . .23
Temperature measurement update rate . . . . . .28
Temperature coefficients. . . . . . . . . . . . . . . . . .30
Calculation of the VLCD offset voltage. . . . . . . .31
LCD drive modes: summary of characteristics .32
Mapping of output pins and corresponding
signals with respect to driving mode. . . . . . . . .42
Control byte description . . . . . . . . . . . . . . . . . .50
I2C slave address byte . . . . . . . . . . . . . . . . . . .53
R/W bit description . . . . . . . . . . . . . . . . . . . . . .53
Serial interface . . . . . . . . . . . . . . . . . . . . . . . . .55
Subaddress byte definition . . . . . . . . . . . . . . . .55
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .59
Static characteristics . . . . . . . . . . . . . . . . . . . .60
Dynamic characteristics . . . . . . . . . . . . . . . . . .64
Timing characteristics: I2C-bus . . . . . . . . . . . .65
PCA8537
Product data sheet
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Timing characteristics: SPI-bus . . . . . . . . . . . . 66
SnPb eutectic process (from J-STD-020D) . . . 70
Lead-free process (from J-STD-020D) . . . . . . 70
Selection of LCD segment drivers . . . . . . . . . 72
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 74
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 76
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
79 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
26. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Block diagram of PCA8537AH. . . . . . . . . . . . . . . .3
Block diagram of PCA8537BH. . . . . . . . . . . . . . . .4
Pin configuration for TQFP64 (PCA8537AH). . . . .5
Pin configuration for TQFP64 (PCA8537BH). . . . .5
Recommended start-up sequence when using
the internal charge pump and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Recommended start-up sequence when using
an external supplied VLCD and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Recommended start-up sequence when using
the internal charge pump and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Recommended start-up sequence when using
an external supplied VLCD and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Recommended power-down sequence for
minimum power-down current when using the
internal charge pump and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Recommended power-down sequence when
using an external supplied VLCD and the internal
clock signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Recommended power-down sequence when
using the internal charge pump and an external
clock signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Recommended power-down sequence for
minimum power-down current when using an
external supplied VLCD and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Example of displays suitable for PCA8537 . . . . .23
Typical I2C system configuration when using
the internal VLCD generation . . . . . . . . . . . . . . . .23
Typical SPI system configuration when using
an external VLCD . . . . . . . . . . . . . . . . . . . . . . . . .24
VLCD generation including temperature
compensation . . . . . . . . . . . . . . . . . . . . . . . . . . .25
VLCD programming of PCA8537 (assuming
VT[7:0] = 0h) . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Charge pump driving capability with
VDD2 = 3.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Charge pump driving capability with
VDD2 = 5.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Temperature measurement block with digital
temperature filter . . . . . . . . . . . . . . . . . . . . . . . . .29
Temperature measurement delay during
ramping up-down of the environment
temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Example of segmented temperature
coefficients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Electro-optical characteristic: relative
transmission curve of the liquid . . . . . . . . . . . . . .33
Static drive mode waveforms (line inversion
mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Waveforms for the 1:2 multiplex drive mode
with 1⁄2 bias (line inversion mode) . . . . . . . . . . . .35
PCA8537
Product data sheet
Fig 26. Waveforms for the 1:2 multiplex drive mode
with 1⁄3 bias (line inversion mode) . . . . . . . . . . . . 36
Fig 27. Waveforms for the 1:4 multiplex drive mode
with 1⁄3 bias (line inversion mode) . . . . . . . . . . . . 37
Fig 28. Waveforms for 1:6 multiplex drive mode
with 1⁄3 bias (line inversion mode) . . . . . . . . . . . . 38
Fig 29. Waveforms for 1:6 multiplex drive mode
with 1⁄4 bias (line inversion mode) . . . . . . . . . . . . 39
Fig 30. Waveforms for 1:8 multiplex drive mode
with 1⁄4 bias (line inversion mode) . . . . . . . . . . . . 40
Fig 31. Waveforms for 1:8 multiplex drive mode
with 1⁄4 bias (frame inversion mode) . . . . . . . . . . 41
Fig 32. Display RAM bitmap . . . . . . . . . . . . . . . . . . . . . . 44
Fig 33. Display RAM filling order in static drive mode . . . 46
Fig 34. Discarded bits at the end of data transmission . . 46
Fig 35. Display RAM filling order in 1:2 multiplex drive
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Fig 36. Display RAM filling order in 1:4 multiplex drive
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Fig 37. Display RAM filling order in 1:6 multiplex drive
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Fig 38. Display RAM filling order in 1:8 multiplex drive
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Fig 39. Bank selection. . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Fig 40. Example of the Bank-select command with
multiplex drive mode 1:4 . . . . . . . . . . . . . . . . . . . 49
Fig 41. Control byte format . . . . . . . . . . . . . . . . . . . . . . . 50
Fig 42. Bit transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Fig 43. Definition of START and STOP conditions . . . . . 51
Fig 44. System configuration. . . . . . . . . . . . . . . . . . . . . . 52
Fig 45. Acknowledgement on the I2C-bus. . . . . . . . . . . . 52
Fig 46. I2C-bus protocol, write mode. . . . . . . . . . . . . . . . 54
Fig 47. I2C-bus protocol, read mode . . . . . . . . . . . . . . . . 54
Fig 48. Data transfer overview . . . . . . . . . . . . . . . . . . . . 55
Fig 49. SPI-bus write example . . . . . . . . . . . . . . . . . . . . 56
Fig 50. SPI-bus write example . . . . . . . . . . . . . . . . . . . . 56
Fig 51. SPI-bus read example. . . . . . . . . . . . . . . . . . . . . 57
Fig 52. Device protection diagram for PCA8537AH . . . . 58
Fig 53. Device protection diagram for PCA8537BH . . . . 58
Fig 54. LCD voltage variation with respect to
temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Fig 55. Typical IDD1 with respect to temperature . . . . . . . 63
Fig 56. Typical IDD2 with respect to temperature . . . . . . . 63
Fig 57. Typical IDD(LCD) with respect to temperature . . . . 64
Fig 58. Driver timing waveforms . . . . . . . . . . . . . . . . . . . 64
Fig 59. RESET timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Fig 60. I2C-bus timing waveforms . . . . . . . . . . . . . . . . . . 66
Fig 61. SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Fig 62. Package outline SOT357-1 (TQFP64) . . . . . . . . 68
Fig 63. Temperature profiles for large and small
components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
80 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
27. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
Functional description . . . . . . . . . . . . . . . . . . . 7
8.1
Commands of PCA8537 . . . . . . . . . . . . . . . . . . 7
8.1.1
Command: Initialize . . . . . . . . . . . . . . . . . . . . . 7
8.1.2
Command: OTP-refresh . . . . . . . . . . . . . . . . . . 8
8.1.3
Command: Oscillator-ctrl . . . . . . . . . . . . . . . . . 8
8.1.3.1
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1.3.2
Internal oscillator . . . . . . . . . . . . . . . . . . . . . . . 8
8.1.3.3
External clock . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.1.4
Command: Charge-pump-ctrl . . . . . . . . . . . . . . 9
8.1.5
Command: Temp-msr-ctrl . . . . . . . . . . . . . . . . 10
8.1.6
Command: Temp-comp . . . . . . . . . . . . . . . . . 10
8.1.7
Command: Set-VPR . . . . . . . . . . . . . . . . . . . . 11
8.1.8
Command: Display-enable . . . . . . . . . . . . . . . 11
8.1.9
Command: Set-MUX-mode . . . . . . . . . . . . . . 12
8.1.10
Command: Set-bias-mode . . . . . . . . . . . . . . . 12
8.1.11
Command: Load-data-pointer. . . . . . . . . . . . . 12
8.1.12
Command: Frame-frequency . . . . . . . . . . . . . 13
8.1.12.1 Timing and frame frequency . . . . . . . . . . . . . . 14
8.1.13
Command: Bank-select . . . . . . . . . . . . . . . . . 14
8.1.14
Command: Write-RAM-data . . . . . . . . . . . . . . 14
8.1.15
Command: Temp-read . . . . . . . . . . . . . . . . . . 15
8.1.16
Command: Invmode_ctrl . . . . . . . . . . . . . . . . 15
8.1.17
Command: Temp-filter . . . . . . . . . . . . . . . . . . 16
8.2
Start-up and shut-down. . . . . . . . . . . . . . . . . . 16
8.2.1
Power-On Reset (POR) . . . . . . . . . . . . . . . . . 16
8.2.2
RESET pin function . . . . . . . . . . . . . . . . . . . . 17
8.2.3
Recommended start-up sequences . . . . . . . . 17
8.2.4
Recommended sequences to enter
power-down mode . . . . . . . . . . . . . . . . . . . . . 20
8.3
Possible display configurations . . . . . . . . . . . 22
8.4
LCD supply voltage. . . . . . . . . . . . . . . . . . . . . 24
8.4.1
External VLCD supply . . . . . . . . . . . . . . . . . . . 24
8.4.2
Internal VLCD generation . . . . . . . . . . . . . . . . . 24
8.4.3
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.4.3.1
Charge pump configuration . . . . . . . . . . . . . . 26
8.4.3.2
Charge pump driving capability . . . . . . . . . . . 26
8.4.4
8.4.4.1
8.4.4.2
8.4.5
8.4.5.1
8.4.6
8.4.6.1
8.4.6.2
8.4.6.3
8.4.6.4
8.4.6.5
8.5
8.5.1
8.5.1.1
8.5.1.2
8.5.1.3
8.5.1.4
8.5.1.5
8.5.2
8.5.2.1
8.5.2.2
8.6
8.7
8.8
8.8.1
8.8.2
8.8.3
8.8.4
8.8.5
8.8.6
8.9
8.9.1
8.9.2
9
9.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
9.2.7
9.2.8
9.2.9
9.3
Temperature measurement and temperature
compensation of VLCD . . . . . . . . . . . . . . . . . .
Temperature readout . . . . . . . . . . . . . . . . . . .
Temperature adjustment of the VLCD . . . . . . .
LCD voltage selector . . . . . . . . . . . . . . . . . . .
Electro-optical performance . . . . . . . . . . . . . .
LCD drive mode waveforms. . . . . . . . . . . . . .
Static drive mode . . . . . . . . . . . . . . . . . . . . . .
1:2 multiplex drive mode . . . . . . . . . . . . . . . .
1:4 multiplex drive mode . . . . . . . . . . . . . . . .
1:6 multiplex drive mode . . . . . . . . . . . . . . . .
1:8 multiplex drive mode . . . . . . . . . . . . . . . .
Backplane and segment outputs . . . . . . . . . .
Backplane outputs . . . . . . . . . . . . . . . . . . . . .
1:8 multiplex drive mode . . . . . . . . . . . . . . . .
1:6 multiplex drive mode . . . . . . . . . . . . . . . .
1:4 multiplex drive mode . . . . . . . . . . . . . . . .
1:2 multiplex drive mode . . . . . . . . . . . . . . . .
Static drive mode . . . . . . . . . . . . . . . . . . . . . .
Segment outputs . . . . . . . . . . . . . . . . . . . . . .
Static, 1:8, 1:4, 1:2 multiplex drive mode . . . .
1:6 multiplex drive mode . . . . . . . . . . . . . . . .
Display controller . . . . . . . . . . . . . . . . . . . . . .
Display register . . . . . . . . . . . . . . . . . . . . . . .
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . .
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . .
RAM filling in static drive mode . . . . . . . . . . .
RAM filling in 1:2 multiplex drive mode . . . . .
RAM filling in 1:4 multiplex drive mode . . . . .
RAM filling in 1:6 multiplex drive mode . . . . .
RAM filling in 1:8 multiplex drive mode . . . . .
Bank selection . . . . . . . . . . . . . . . . . . . . . . . .
Input bank selection . . . . . . . . . . . . . . . . . . . .
Output bank selection . . . . . . . . . . . . . . . . . .
Bus interfaces . . . . . . . . . . . . . . . . . . . . . . . . .
Control byte . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus interface characteristics
(PCA8537AH) . . . . . . . . . . . . . . . . . . . . . . . .
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . .
START and STOP conditions. . . . . . . . . . . . .
System configuration . . . . . . . . . . . . . . . . . . .
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus controller . . . . . . . . . . . . . . . . . . . . . .
Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus slave address . . . . . . . . . . . . . . . . . .
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . .
Data read . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI-bus interface (PCA8537BH) . . . . . . . . . .
28
28
30
31
33
34
34
35
37
38
40
42
42
42
42
42
42
43
43
43
43
43
43
43
45
45
46
47
47
48
49
49
50
50
50
51
51
51
51
52
52
53
53
53
54
55
continued >>
PCA8537
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
81 of 82
PCA8537
NXP Semiconductors
Automotive LCD driver for multiplex rates up to 1:8
9.3.1
9.3.2
10
11
12
13
14
15
15.1
16
17
18
18.1
18.2
18.3
18.4
19
19.1
20
21
22
23
23.1
23.2
23.3
23.4
24
25
26
27
Data transmission . . . . . . . . . . . . . . . . . . . . . .
Data read . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . .
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics. . . . . . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . . .
Quality information . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Handling information. . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering . . . . . . . . . . . . . . . . .
Wave and reflow soldering . . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . .
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LCD segment driver selection. . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
References . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
55
56
58
58
59
60
64
67
67
68
69
69
69
69
70
70
72
72
74
75
76
77
77
77
77
78
78
79
80
81
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 April 2015
Document identifier: PCA8537
工商网监
湘ICP备2023018690号
