PCA9501
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit
EEPROM and 6 address pins
Rev. 04 — 10 February 2009
Product data sheet
1. General description
The PCA9501 is an 8-bit I/O expander with an on-board 2-kbit EEPROM.
The I/O expandable eight quasi-bidirectional data pins can be independently assigned as
inputs or outputs to monitor board level status or activate indicator devices such as LEDs.
The system master writes to the I/O configuration bits in the same way as for the
PCF8574. The data for each input or output is kept in the corresponding input or output
register. The system master can read all registers.
The EEPROM can be used to store error codes or board manufacturing data for
read-back by application software for diagnostic purposes and are included in the I/O
expander package.
The PCA9501 active LOW open-drain interrupt output is activated when any input state
differs from its corresponding input port register state. It is used to indicate to the system
master that an input state has changed and the device needs to be interrogated.
The PCA9501 has six address pins with internal pull-up resistors allowing up to
64 devices to share the common two-wire I2C-bus software protocol serial data bus. The
fixed GPIO address starts with ‘0’ and the fixed EEPROM I2C-bus address starts with ‘1’,
so the PCA9501 appears as two separate devices to the bus master.
The PCA9501 supports hot insertion to facilitate usage in removable cards on backplane
systems.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
8 general purpose input/output expander/collector
Replacement for PCF8574 with integrated 2-kbit EEPROM
Internal 256 × 8 EEPROM
Self timed write cycle (5 ms typical)
16 byte page write operation
I2C-bus and SMBus interface logic
Internal power-on reset
Noise filter on SCL/SDA inputs
Active LOW interrupt output
6 address pins allowing up to 64 devices on the I2C-bus/SMBus
No glitch on power-up
Supports hot insertion
Power-up with all channels configured as inputs
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
n
n
n
n
n
Low standby current
Operating power supply voltage range of 2.5 V to 3.6 V
5 V tolerant inputs/outputs
0 Hz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: SO20, TSSOP20, HVQFN20
3. Applications
n
n
n
n
n
n
n
n
Board version tracking and configuration
Board health monitoring and status reporting
Multi-card systems in telecom, networking, and base station infrastructure equipment
Field recall and troubleshooting functions for installed boards
General-purpose integrated I/O with memory
Replacement for PCF8574 with integrated 2-kbit EEPROM
Bus master sees GPIO and EEPROM as two separate devices
Six hardware address pins allow up to 64 PCA9501s to be located in the same
I2C-bus/SMBus
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9501D
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
PCA9501PW
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
PCA9501BS
HVQFN20
plastic thermal enhanced very thin quad flat package;
no leads; 20 terminals; body 5 × 5 × 0.85 mm
SOT662-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Topside mark
Temperature range
PCA9501D
PCA9501D
−40 °C to +85 °C
PCA9501PW
PCA9501
−40 °C to +85 °C
PCA9501BS
9501
−40 °C to +85 °C
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
2 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
5. Block diagram
PCA9501
300 kΩ
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
A0
8-bit
A1
A2
A3
write pulse
A4
INPUT/
OUTPUT
PORTS
read pulse
A5
SCL
INPUT
FILTER
SDA
VDD
I2C-BUS/SMBus
CONTROL
LP
FILTER
INT
VDD
POWER-ON
RESET
VSS
EEPROM
256 × 8
WC
002aac000
Fig 1.
Block diagram of PCA9501
6. Pinning information
6.1 Pinning
A0
1
20 VDD
A0
1
20 VDD
A1
2
19 SDA
A1
2
19 SDA
A2
3
18 SCL
A2
3
18 SCL
IO0
4
17 WC
IO0
4
17 WC
IO1
5
16 IO7
IO1
5
IO2
6
15 IO6
IO2
6
IO3
7
14 IO5
IO3
7
14 IO5
INT
8
13 IO4
INT
8
13 IO4
A5
9
12 A3
A5
9
12 A3
VSS 10
11 A4
VSS 10
11 A4
PCA9501D
002aab997
Fig 2.
Pin configuration for SO20
PCA9501_4
Product data sheet
PCA9501PW
16 IO7
15 IO6
002aab998
Fig 3.
Pin configuration for TSSOP20
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
3 of 28
PCA9501
NXP Semiconductors
16 SCL
17 SDA
18 VDD
20 A1
terminal 1
index area
19 A0
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
A2
1
15 WC
IO0
2
14 IO7
IO1
3
IO2
4
12 IO5
IO3
5
11 IO4
7
8
9
A5
VSS
A4
13 IO6
A3 10
6
INT
PCA9501BS
002aab999
Transparent top view
Fig 4.
Pin configuration for HVQFN20
6.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SO20, TSSOP20
HVQFN20
A0
1
19
A1
2
20
A2
3
1
A3
12
10
A4
11
9
A5
9
7
IO0
4
2
IO1
5
3
IO2
6
4
IO3
7
5
IO4
13
11
IO5
14
12
IO6
15
13
IO7
16
14
address lines (internal pull-up)
quasi-bidirectional I/O pins
INT
8
6
active LOW interrupt output (open-drain)
VSS
10
8[1]
supply ground
WC
17
15
active LOW write control pin
SCL
18
16
I2C-bus serial clock
SDA
19
17
I2C-bus serial data
VDD
20
18
supply voltage
[1]
HVQFN20 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
printed-circuit board in the thermal pad region.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
4 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
7. Functional description
Refer also to Figure 1 “Block diagram of PCA9501”.
VDD
write pulse
100 µA
D
data from shift register
Q
FF
IO0 to IO7
CI
S
power-on reset
VSS
D
Q
FF
CI
read pulse
S
to interrupt logic
data to shift register
002aac001
Fig 5.
Simplified schematic diagram of each I/O
7.1 Device addressing
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9501 is shown in Figure 6. Internal pull-up resistors
are incorporated on the hardware-selectable address pins.
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
slave address
0
A5
fixed
A4
A3
A2
slave address
A1
A0 R/W
hardware programmable
002aac002
a. I/O expander
Fig 6.
1
fixed
A5
A4
A3
A2
A1
A0 R/W
hardware programmable
002aac003
b. Memory
PCA9501 slave addresses
Remark: Reserved I2C-bus addresses must be used with caution since they can interfere
with:
•
•
•
•
Reserved for future use I2C-bus addresses (0000 011, 1111 1xx)
Slave devices that use the 10-bit addressing scheme (1111 0xx)
Slave devices that are designed to respond to the General Call address (0000 000)
Hs-mode master code (0000 1xx)
PCA9501_4
Product data sheet
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Rev. 04 — 10 February 2009
5 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
7.2 Control register
The PCA9501 contains a single 8-bit register called the Control register, which can be
written and read via the I2C-bus. This register is sent after a successful acknowledgment
of the slave address.
It contains the I/O operation information.
7.3 I/O operations
(Refer also to Figure 5.)
Each of the PCA9501's eight I/Os can be independently used as an input or output.
Output data is transmitted to the port by the I/O Write mode (see Figure 7). Input I/O data
is transferred from the port to the microcontroller by the Read mode (see Figure 8).
SCL
1
2
3
4
5
6
7
8
9
slave address (I/O expander)
SDA S
data to port
0 A5 A4 A3 A2 A1 A0 0
START condition
A
R/W
data to port
DATA 1
A
acknowledge
from slave
DATA 2
A
acknowledge
from slave
acknowledge
from slave
write to port
tv(Q)
tv(Q)
data out from port
DATA 1 VALID
DATA 2 VALID
002aad290
Fig 7.
I/O Write mode (output)
SCL
1
2
3
4
5
6
7
8
9
slave address (I/O expander)
SDA S
0 A5 A4 A3 A2 A1 A0 1
START condition
R/W
data from port
A
DATA 1
data from port
A
DATA 4
acknowledge
from master
acknowledge
from slave
no acknowledge
from master
1
P
STOP
condition
read from
port
DATA 2
data into
port
DATA 1
DATA 3
th(D)
DATA 4
tsu(D)
INT
tv(INT)
trst(INT)
002aad291
Fig 8.
I/O Read mode (input)
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
6 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
7.3.1 Quasi-bidirectional I/Os
A quasi-bidirectional I/O can be used as an input or output without the use of a control
signal for data direction. At power-on the I/Os are HIGH. In this mode, only a current
source to VDD is active. An additional strong pull-up to VDD allows fast rising edges into
heavily loaded outputs. These devices turn on when an output is written HIGH, and are
switched off by the negative edge of SCL. The I/Os should be HIGH before being used as
inputs. See Figure 9.
SCL
1
2
3
4
5
6
7
8
9
slave address (I/O expander)
SDA S
0 A5 A4 A3 A2 A1 A0 0
START condition
R/W
data to port
A
1
acknowledge
from slave
STOP
condition
data to port
A
IO3
acknowledge
from slave
0
A
P
acknowledge
from slave
IO3
IO3 output voltage
IO3 pull-up output current
IOHt
IOH
002aad292
Fig 9.
Transient pull-up current (IOHt) while IO3 changes from LOW to HIGH and back to LOW
7.3.2 Interrupt
The PCA9501 provides an open-drain output (INT) which can be fed to a corresponding
input of the microcontroller. This gives these chips a type of master function which can
initiate an action elsewhere in the system. See Figure 10.
An interrupt is generated by any rising or falling edge of the port inputs in the input mode.
After time tv(INT) the signal INT is valid. See Figure 11.
Resetting and reactivating the interrupt circuit is achieved when data on the port is
changed to the original setting or data is read from or written to the port which has
generated the interrupt.
Resetting occurs as follows:
• In the Read mode at the acknowledge bit after the rising edge of the SCL signal
• In the Write mode at the acknowledge bit after the HIGH-to-LOW transition of the SCL
signal
• Returning of the port data to its original setting
• Interrupts which occur during the acknowledge clock pulse may be lost (or very short)
due to the resetting of the interrupt during this pulse.
Each change of the I/Os after resetting will be detected and, after the next rising clock
edge, will be transmitted as INT. Reading from or writing to another device does not affect
the interrupt circuit.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
7 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
VDD
device 1
device 2
device 16
PCA9501
PCA9501
PCA9501
INT
INT
INT
MICROCONTROLLER
INT
002aad293
Fig 10. Application of multiple PCA9501s with interrupt
SCL
1
2
3
4
5
6
7
8
9
slave address (I/O expander)
SDA S
0 A5 A4 A3 A2 A1 A0 1
START condition
data from port
A
R/W
1
1
IO5
P
STOP
condition
acknowledge
from slave
data into IO5
tv(INT)
trst(INT)
INT
002aad294
Fig 11. Interrupt generated by a change of input to IO5
7.4 Memory operations
7.4.1 Write operations
Write operations require an additional address field to indicate the memory address
location to be written. The address field is eight bits long providing access to any one of
the 256 words of memory. There are two types of write operations, ‘byte write’ and ‘page
write’.
Write operation is possible when the Write Control pin (WC) is put at a LOW logic level (0).
When this control signal is set at 1, write operation is not possible and data in the memory
is protected.
‘Byte write’ and ‘page write’ explained below assume that WC is set to 0.
7.4.1.1
Byte write
To perform a byte write, the START condition is followed by the memory slave address and
the R/W bit set to 0. The PCA9501 will respond with an acknowledge and then consider
the next eight bits sent as the word address and the eight bits after the word address as
the data. The PCA9501 will issue an acknowledge after the receipt of both the word
address and the data. To terminate the data transfer the master issues the STOP
condition, initiating the internal write cycle to the non-volatile memory. Only write and read
operations to the quasi-bidirectional I/Os are allowed during the internal write cycle.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
8 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
slave address (memory)
SDA S
word address
1 A5 A4 A3 A2 A1 A0 0
START condition
R/W
data
A
A
A
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
P
STOP condition.
Write to the memory
is performed.
002aad296
Fig 12. Byte write
7.4.1.2
Page write
A page write is initiated in the same way as the byte write, if after sending the first word of
data the STOP condition is not received, the PCA9501 considers subsequent words as
data. After each data word the PCA9501 responds with an acknowledge and the four least
significant bits of the memory address field are incremented. Should the master not send
a STOP condition after 16 data words, the address counter will return to its initial value
and overwrite the data previously written. After the receipt of the STOP condition the
inputs will behave as with the byte write during the internal write cycle.
slave address (memory)
SDA S
word address
1 A5 A4 A3 A2 A1 A0 0
START condition
R/W
data to memory
A
A
acknowledge
from slave
acknowledge
from slave
DATA n
data to memory
A
acknowledge
from slave
DATA n + 3
A
P
acknowledge
from slave
STOP condition.
Write to the memory is performed.
002aad297
Fig 13. Page write
7.4.2 Read operations
PCA9501 read operations are initiated in an identical manner to write operations with the
exception that the memory slave address R/W bit is set to ‘1’. There are three types of
read operations: current address read, random read and sequential read.
7.4.2.1
Current address read
The PCA9501 contains an internal address counter that increments after each read or
write access and as a result, if the last word accessed was at address ‘n’ then the address
counter contains the address ‘n + 1’.
When the PCA9501 receives its memory slave address with the R/W bit set to one it
issues an acknowledge and uses the next eight clocks to transmit the data contained at
the address stored in the address counter. The master ceases the transmission by issuing
the STOP condition after the eighth bit. There is no ninth clock cycle for the acknowledge.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
9 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
slave address (memory)
SDA S
data from memory
1 A5 A4 A3 A2 A1 A0 1
START condition
R/W
A
P
acknowledge
from slave
STOP condition
002aad298
Fig 14. Current address read
7.4.2.2
Random read
The PCA9501’s random read mode allows the address to be read from to be specified by
the master. This is done by performing a dummy write to set the address counter to the
location to be read. The master must perform a byte write to the address location to be
read, but instead of transmitting the data after receiving the acknowledge from the
PCA9501, the master re-issues the START condition and memory slave address with the
R/W bit set to one. The PCA9501 will then transmit an acknowledge and use the next
eight clock cycles to transmit the data contained in the addressed location. The master
ceases the transmission by issuing the STOP condition after the eighth bit, omitting the
ninth clock cycle acknowledge.
slave address (memory)
SDA S
word address
1 A5 A4 A3 A2 A1 A0 0
START condition
R/W
A
slave address (memory)
A
acknowledge
from slave
acknowledge
from slave
S
data from memory
1 A5 A4 A3 A2 A1 A0 1
START condition
A
P
STOP
condition
R/W
acknowledge
from slave
002aad299
Fig 15. Random read
7.4.2.3
Sequential read
The PCA9501 sequential read is an extension of either the current address read or
random read. If the master does not issue a STOP condition after it has received the
eighth data bit, but instead issues an acknowledge, the PCA9501 will increment the
address counter and use the next eight cycles to transmit the data from that location. The
master can continue this process to read the contents of the entire memory. Upon
reaching address 255 the counter will return to address 0 and continue transmitting data
until a STOP condition is received. The master ceases the transmission by issuing the
STOP condition after the eighth bit, omitting the ninth clock cycle acknowledge.
slave address (memory)
SDA S
data from memory
1 A5 A4 A3 A2 A1 A0 1
START condition
R/W
A
DATA n
acknowledge
from slave
data from memory
A
DATA n + 1
acknowledge
from master
data from memory
A
acknowledge
from master
DATA n + X
P
STOP
condition
002aad300
Fig 16. Sequential read
PCA9501_4
Product data sheet
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Rev. 04 — 10 February 2009
10 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
8. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 17).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 17. Bit transfer
8.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 18).
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 18. Definition of START and STOP conditions
8.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 19).
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
11 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 19. System configuration
8.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 20. Acknowledgement on the I2C-bus
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
12 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
9. Application design-in information
A central processor/controller typically located on the system main board can use the
400 kHz I2C-bus/SMBus to poll the PCA9501 devices located on the system cards for
status or version control type of information. The PCA9501 may be programmed at
manufacturing to store information regarding board build, firmware version, manufacturer
identification, configuration option data, and so on. Alternately, these devices can be used
as convenient interface for board configuration, thereby utilizing the I2C-bus/SMBus as an
intra-system communication bus
up to
64 cards
I2C-bus
CPU
OR
µC
ASIC
I2C-bus
I2C-bus
BACKPLANE
configuration control
I2C-bus
PCA9501
I2C-bus
CONTROL
I2C-bus
GPIO
EEPROM
monitoring
and
control
INPUTS
ALARM
LEDs
card ID, subroutines, configuration data, or revision history
002aac026
Fig 21. PCA9501 used as interface for board configuration
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
13 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
VDD
10 kΩ
10 kΩ
10 kΩ
VDD
10 kΩ
(optional)
SUB-SYSTEM 1
(e.g., temp sensor)
2 kΩ
VDD
INT
MASTER
CONTROLLER
SCL
SCL
IO0
SDA
SDA
IO1
PCA9501
INT
INT
VSS
SUB-SYSTEM 2
(e.g., counter)
IO2
A5
IO3
A4
IO4
A3
RESET
A
controlled
switch
(e.g., CBT device)
enable
IO5
A2
B
IO6
A1
IO7
A0
SUB-SYSTEM 3
(e.g., alarm system)
VSS
ALARM
VDD
002aac025
GPIO device address configured as 0110 000x for this example.
EEPROM device address configured as 1110 000x for this example.
IO0, IO2, IO3 configured as outputs.
IO1, IO4, IO5 configured as inputs.
IO6, IO7 are not used and must be configured as outputs.
Fig 22. Typical application
10. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
−0.5
+4.0
V
VI
input voltage
VSS − 0.5
5.5
V
II
input current
−20
+20
mA
IO
output current
−25
+25
mA
IDD
supply current
−100
+100
mA
ISS
ground supply current
−100
+100
mA
Ptot
total power dissipation
-
400
mW
P/out
power dissipation per output
-
100
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
operating
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
14 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
11. Static characteristics
Table 5.
Static characteristics
VDD = 3.3 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
2.5
A0 to A5; WC = HIGH
-
Typ
Max
Unit
3.3
3.6
V
-
60
µA
Supply
VDD
supply voltage
IDDQ
standby current
IDD1
supply current read
-
-
1
mA
IDD2
supply current write
-
-
2
mA
VPOR
power-on reset voltage
-
-
2.4
V
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
ILI
input leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
-
7
pF
I/O expander port
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IIHL(max)
input current through protection diodes
−400
-
+400
µA
10
25
-
mA
[1]
IOL
LOW-level output current
VOL = 1 V
IOH
HIGH-level output current
VOH = VSS
30
100
300
µA
IOHt
transient pull-up current
-
2
-
mA
Ci
input capacitance
-
-
10
pF
Co
output capacitance
-
-
10
pF
Address inputs A0 to A5; WC input
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
VI = VDD
−1
-
+1
µA
pull-up; VI = VSS
10
25
100
µA
Interrupt output INT
IOL
LOW-level output current
VOL = 0.4 V
1.6
-
-
mA
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
[1]
Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
PCA9501_4
Product data sheet
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Rev. 04 — 10 February 2009
15 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
002aad307
20
IOH
(µA)
−40
002aad308
20
VDD = 2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
VDD = 2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
IOH
(µA)
−20
−60
−100
−100
−160
−140
0
1.2
2.4
3.6
0
1.2
VOH (V)
2.4
3.6
VOH (V)
a. Tamb = −40 °C
b. Tamb = 25 °C
002aad309
20
VDD = 2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
IOH
(µA)
−20
−60
−100
−140
0
1.2
2.4
3.6
VOH (V)
c. Tamb = 85 °C
Fig 23. VOH versus IOH
Remark: Rapid fall-off in VOH at current inception is due to a diode that provides 5 V
overvoltage protection for the GPIO I/O pins. When the GPIO I/Os are being used as
inputs, the internal current source VOH should be evaluated to determine if external pull-up
resistors are required to provide sufficient VIH threshold noise margin.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
16 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
12. Dynamic characteristics
Table 6.
Dynamic characteristics
Symbol
I2C-bus
Parameter
timing[1]
Conditions
Min
Typ
Max
Unit
(see Figure 24)
fSCL
SCL clock frequency
-
-
400
kHz
tSP
pulse width of spikes that must be
suppressed by the input filter
-
-
50
ns
tBUF
bus free time between a STOP and START
condition
1.3
-
-
µs
tSU;STA
set-up time for a repeated START condition
0.6
-
-
µs
tHD;STA
hold time (repeated) START condition
0.6
-
-
µs
tr
rise time of both SDA and SCL signals
-
-
0.3
µs
tf
fall time of both SDA and SCL signals
-
-
0.3
µs
tSU;DAT
data set-up time
250
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tVD;DAT
data valid time
-
-
1.0
µs
tSU;STO
set-up time for STOP condition
0.6
-
-
µs
SCL LOW to
data output
Port timing
tv(Q)
data output valid time
CL ≤ 100 pF
-
-
4
µs
tsu(D)
data input set-up time
CL ≤ 100 pF
0
-
-
µs
th(D)
data input hold time
CL ≤ 100 pF
4
-
-
µs
Interrupt timing
tv(INT)
valid time on pin INT
CL ≤ 100 pF
-
-
4
µs
trst(INT)
reset time on pin INT
CL ≤ 100 pF
-
-
4
µs
Power-up timing
tpu(R)
tpu(W)
read power-up time
[2]
-
-
1
ms
write power-up time
[2]
-
-
5
ms
[3]
-
5
10
ms
Write cycle limits (see Figure 25)
Tcy(W)
write cycle time
[1]
All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input
voltage swing of VSS to VDD.
[2]
tpu(R) and tpu(W) are the delays required from the time VDD is stable until the specified operation can be initiated. These parameters are
guaranteed by design.
[3]
Tcy(W) is the maximum time that the device requires to perform the internal write operation.
Table 7.
Non-volatile storage specifications
Parameter
Specification
memory cell data retention
10 years minimum
number of memory cell write cycles
100,000 cycles minimum
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
17 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
START
condition
(S)
protocol
bit 7
MSB
(A7)
tSU;STA
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
acknowledge
(A)
STOP
condition
(P)
1/f
SCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Fig 24. I2C-bus timing
SCL
SDA
8th bit
ACK
word n
memory
address
Tcy(W)
STOP
condition
START
condition
002aad310
Fig 25. Write cycle timing
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
18 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
13. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 26. Package outline SOT163-1 (SO20)
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
19 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 27. Package outline SOT360-1 (TSSOP20)
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
20 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
A
B
D
SOT662-1
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
b
6
y
y1 C
v M C A B
w M C
10
L
11
5
e
e2
Eh
1
15
terminal 1
index area
20
16
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.38
0.23
c
D(1)
Dh
E(1)
Eh
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
e
e1
2.6
0.65
e2
L
v
w
y
y1
2.6
0.75
0.50
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT662-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 28. Package outline SOT662-1 (HVQFN20)
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
21 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
22 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 29) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 29.
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
23 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 29. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 10.
Abbreviations
Acronym
Description
ASIC
Application Specific Integrated Circuit
CBT
Cross Bar Technology
CDM
Charged-Device Model
CPU
Central Processing Unit
EEPROM
Electrically Erasable Programmable Read Only Memory
ESD
ElectroStatic Discharge
GPIO
General Purpose Input/Output
HBM
Human Body Model
I2C-bus
Inter Integrated Circuit bus
I/O
Input/Output
IC
Integrated Circuit
LED
Light Emitting Diode
LP
Low-Pass
µC
micro Controller
MM
Machine Model
SMBus
System Management Bus
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
24 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
16. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9501_4
20090210
Product data sheet
-
PCA9501_3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
•
Section 1 “General description”, 5th paragraph, 2nd sentence changed from “The fixed GPIO
address starts with ‘1’ and the fixed EEPROM I2C address starts with ‘0’, ...” to “The fixed GPIO
address starts with ‘0’ and the fixed EEPROM I2C-bus address starts with ‘1’, ...”
Table 3 “Pin description”:
– pin “WC” corrected to “WC”
– added Table note 1 and its reference at HVQFN20 pin 8
– changed naming convention for pins I/On to “IOn”
•
•
•
Section 7.1 “Device addressing”: added Remark and bulleted list (4 items)
Figure 7 “I/O Write mode (output)”: changed symbol “tpv” to “tv(Q)”
Figure 8 “I/O Read mode (input)”:
– changed symbol “tph” to “th(D)”
– changed symbol “tps” to “tsu(D)”
– changed symbol “tiv” to “tv(INT)”
– changed symbol “tir” to “trst(INT)”
•
•
Section 7.3.2 “Interrupt”, 2nd paragraph: changed symbol “tiv” to “tv(INT)”
Figure 11 “Interrupt generated by a change of input to IO5”:
– changed symbol “tiv” to “tv(INT)”
– changed symbol “tir” to “trst(INT)”
•
Table 4 “Limiting values”:
– changed symbol “VCC” to “VDD”
– changed parameter for ISS from “supply current” to “ground supply current”
– changed symbol “PO” to “P/out”
•
Table 5 “Static characteristics”:
– sub-section “Input SCL; input/output SDA”: changed symbol “IL” to “ILI”
– sub-section “Address inputs A0 to A5; WC input”: changed symbol “IL” to “ILI”
– added reference to Table note 1 at IOL in sub-section “I/O expander port”
•
Table 6 “Dynamic characteristics”:
– sub-section “I2C-bus timing”: changed symbol/parameter from “tSW, tolerable spike width on
bus” to “tSP, pulse width of spikes that must be suppressed by the input filter”
– sub-section “Port timing”: changed symbol “tpv” to “tv(Q)”
– sub-section “Port timing”: changed symbol “tph” to “th(D)”
– sub-section “Port timing”: changed symbol “tps” to “tsu(D)”
– sub-section “Interrupt timing”: changed symbol “tiv” to “tv(INT)”
– sub-section “Interrupt timing”: changed symbol “tir” to “trst(INT)”
– sub-section “Power-up timing”: changed symbol “tPUR” to “tpu(R)”
– sub-section “Power-up timing”: changed symbol “tPUW” to “tpu(W)”
– sub-section “Write cycle limits”: changed symbol “tWR” to “Tcy(W)”
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
25 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
Table 11.
Revision history …continued
Document ID
Modifications:
(continued)
Release date
•
•
Data sheet status
Change notice
Supersedes
added Section 15 “Abbreviations”
updated soldering information
PCA9501_3
(9397 750 14135)
20040930
Product data
-
PCA9501_2
PCA9501_2
(9397 750 12058)
20030912
Product data
853-2370 30128 of
2003 Jul 18
PCA9501_1
PCA9501_1
(9397 750 10327)
20020927
Product data
853-2370 28875 of
2002 Sep 09
-
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
26 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9501_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 10 February 2009
27 of 28
PCA9501
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
19. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.4
7.4.1
7.4.1.1
7.4.1.2
7.4.2
7.4.2.1
7.4.2.2
7.4.2.3
8
8.1
8.1.1
8.2
8.3
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Device addressing . . . . . . . . . . . . . . . . . . . . . . 5
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 6
I/O operations . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Quasi-bidirectional I/Os . . . . . . . . . . . . . . . . . . 7
Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Memory operations . . . . . . . . . . . . . . . . . . . . . . 8
Write operations . . . . . . . . . . . . . . . . . . . . . . . . 8
Byte write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Page write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Read operations . . . . . . . . . . . . . . . . . . . . . . . . 9
Current address read . . . . . . . . . . . . . . . . . . . . 9
Random read . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sequential read. . . . . . . . . . . . . . . . . . . . . . . . 10
Characteristics of the I2C-bus. . . . . . . . . . . . . 11
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
START and STOP conditions . . . . . . . . . . . . . 11
System configuration . . . . . . . . . . . . . . . . . . . 11
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application design-in information . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering of SMD packages . . . . . . . . . . . . . . 22
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
18
19
Contact information . . . . . . . . . . . . . . . . . . . . 27
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 February 2009
Document identifier: PCA9501_4
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