PCA9540BDP

PCA9540B 2-channel I2C-bus multiplexer Rev. 04 — 3 September 2009 Product data sheet 1. General description The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I2C-bus. The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels. Only one SCx/SDx channel is selected at a time, determined by the contents of the programmable control register. A power-on reset function puts the registers in their default state and initializes the I2C-bus state machine with no channels selected. The pass gates of the multiplexer are constructed such that the VDD pin can be used to limit the maximum high voltage that will be passed by the PCA9540B. This allows the use of different bus voltages on each SCx/SDx pair, so that 1.8 V, 2.5 V or 3.3 V parts can communicate with 5 V parts without any additional protection. External pull-up resistors can pull the bus up to the desired voltage level for this channel. All I/O pins are 5 V tolerant. 2. Features I I I I I I I I I I I I I 1-of-2 bidirectional translating multiplexer I2C-bus interface logic; compatible with SMBus standards Channel selection via I2C-bus Power up with all multiplexer channels deselected Low Ron switches Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses No glitch on power-up Supports hot insertion Low standby current Operating power supply voltage range of 2.3 V to 5.5 V 5 V tolerant inputs 0 Hz to 400 kHz clock frequency ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD2-A115 and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Packages offered: SO8, TSSOP8, XSON8U NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 3. Ordering information Table 1. Ordering information Tamb = −40 °C to +85 °C Type number PCA9540BD PCA9540BDP PCA9540BGD Topside mark PA9540B 9540B 40B Package Name SO8 TSSOP8 XSON8U Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 plastic extremely thin small outline package; no leads; 8 terminals; SOT996-2 UTLP based; body 3 × 2 × 0.5 mm 4. Block diagram PCA9540B SD0 SD1 SC0 SC1 VSS SWITCH CONTROL LOGIC VDD POWER-ON RESET SCL SDA INPUT FILTER I2C-BUS CONTROL 002aae715 Fig 1. Block diagram of PCA9540B PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 2 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 5. Pinning information 5.1 Pinning SCL SDA VDD SD0 1 2 8 7 SC1 SCL SD1 VSS SC0 1 2 3 4 002aae714 8 7 SC1 SD1 VSS SC0 PCA9540BD 3 4 002aae713 SDA VDD SD0 6 5 PCA9540BDP 6 5 Fig 2. Pin configuration for SO8 Fig 3. Pin configuration for TSSOP8 SCL SDA VDD SD0 1 2 8 7 SC1 SD1 VSS SC0 PCA9540BGD 3 4 6 5 002aae753 Transparent top view Fig 4. Pin configuration for XSON8U 5.2 Pin description Table 2. Symbol SCL SDA VDD SD0 SC0 VSS SD1 SC1 Pin description Pin 1 2 3 4 5 6 7 8 Description serial clock line serial data line supply voltage serial data 0 serial clock 0 supply ground serial data 1 serial clock 1 PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 3 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 6. Functional description Refer to Figure 1 “Block diagram of PCA9540B”. 6.1 Device addressing Following a START condition the bus master must output the address of the slave it is accessing. The address of the PCA9540B is shown in Figure 5. slave address 1 1 1 0 fixed 0 0 0 R/W 002aae716 Fig 5. Slave address The last bit of the slave address defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. 6.2 Control register Following the successful acknowledgement of the slave address, the bus master will send a byte to the PCA9540B which will be stored in the Control register. If multiple bytes are received by the PCA9540B, it will save the last byte received. This register can be written and read via the I2C-bus. channel selection bits (read/write) 7 X 6 X 5 X 4 X 3 X 2 B2 1 B1 0 B0 002aae717 enable bit Fig 6. Control register 6.2.1 Control register definition A SCx/SDx downstream pair, or channel, is selected by the contents of the Control register. This register is written after the PCA9540B has been addressed. The 2 LSBs of the control byte are used to determine which channel is to be selected. When a channel is selected, it will become active after a STOP condition has been placed on the I2C-bus. This ensures that all SCx/SDx lines will be in a HIGH state when the channel is made active, so that no false conditions are generated at the time of connection. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 4 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer Control register: Write—channel selection; Read—channel status D6 X X X X 0 D5 X X X X 0 D4 X X X X 0 D3 X X X X 0 B2 0 1 1 1 0 B1 X 0 0 1 0 B0 X 0 1 X 0 Command no channel selected channel 0 enabled channel 1 enabled no channel selected no channel selected; power-up default state Table 3. D7 X X X X 0 6.3 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9540B in a reset condition until VDD has reached VPOR. At this point, the reset condition is released and the PCA9540B registers and I2C-bus state machine are initialized to their default states (all zeroes), causing all the channels to be deselected. Thereafter, VDD must be lowered below 0.2 V to reset the device. 6.4 Voltage translation The pass gate transistors of the PCA9540B are constructed such that the VDD voltage can be used to limit the maximum voltage that will be passed from one I2C-bus to another. 5.0 Vo(sw) (V) 4.0 (1) 002aaa964 3.0 (2) (3) 2.0 1.0 2.0 2.5 3.0 3.5 4.0 4.5 5.5 5.0 VDD (V) (1) maximum (2) typical (3) minimum Fig 7. Pass gate voltage versus supply voltage Figure 7 shows the voltage characteristics of the pass gate transistors (note that the graph was generated using the data specified in Section 10 “Static characteristics” of this data sheet). In order for the PCA9540B to act as a voltage translator, the Vo(sw) voltage should be equal to, or lower than the lowest bus voltage. For example, if the main bus was running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 5 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer Figure 7, we see that Vo(sw)(max) will be at 2.7 V when the PCA9540B supply voltage is 3.5 V or lower so the PCA9540B supply voltage could be set to 3.3 V. Pull-up resistors can then be used to bring the bus voltages to their appropriate levels (see Figure 14). More Information can be found in application note AN262, “PCA954X family of I2C/SMBus multiplexers and switches”. 7. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 8). SDA SCL data line stable; data valid change of data allowed mba607 Fig 8. Bit transfer 7.2 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 9). SDA SCL S START condition P STOP condition mba608 Fig 9. Definition of START and STOP conditions PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 6 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 7.3 System configuration A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 10). SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER SLAVE 002aaa966 Fig 10. System configuration 7.4 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also, a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement 002aaa987 9 Fig 11. Acknowledgement on the I2C-bus PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 7 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 7.5 Bus transactions slave address SDA S 1 1 1 0 0 0 0 0 A X X X control register X X B2 B1 B0 A P START condition R/W acknowledge from slave acknowledge from slave STOP condition 002aae719 Fig 12. Write control register slave address SDA S 1 1 1 0 0 0 0 1 A X X X control register X X B2 B1 last byte B0 NA P START condition R/W acknowledge from slave no acknowledge from master STOP condition 002aae720 Fig 13. Read control register 8. Application design-in information VDD = 2.7 V to 5.5 V VDD = 3.3 V V = 2.7 V to 5.5 V SDA SCL SDA SCL SD0 SC0 channel 0 PCA9540B I2C-bus/SMBus master SD1 SC1 VSS 002aae721 V = 2.7 V to 5.5 V channel 1 Fig 14. Typical application PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 8 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to ground (VSS = 0 V).[1] Symbol VDD VI II IO IDD ISS Ptot Tstg Tamb [1] Parameter supply voltage input voltage input current output current supply current ground supply current total power dissipation storage temperature ambient temperature Conditions Min −0.5 −0.5 −60 Max +7.0 +7.0 ±20 ±25 ±100 ±100 400 +150 +85 Unit V V mA mA mA mA mW °C °C operating −40 The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 125 °C. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 9 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 10. Static characteristics Table 5. Static characteristics at VDD = 2.3 V to 3.6 V VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. See Table 6 for VDD = 3.6 V to 5.5 V. Symbol Supply VDD IDD supply voltage supply current operating mode; VDD = 3.6 V; no load; VI = VDD or VSS; fSCL = 100 kHz standby mode; VDD = 3.6 V; no load; VI = VDD or VSS; fSCL = 0 kHz no load; VI = VDD or VSS [1] Parameter Conditions Min 2.3 - Typ 20 Max 3.6 50 Unit V µA Istb standby current - 0.1 1 µA VPOR VIL VIH IOL IL Ci Pass gate Ron power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance ON-state resistance −0.5 0.7VDD 1.6 7 11 16 1.9 1.5 2.5 2.1 +0.3VDD 6 +1 8 31 55 2.8 2.0 +1 5 V V V mA mA µA pF Ω Ω V V V V µA pF Input SCL; input/output SDA VOL = 0.4 V VOL = 0.6 V VI = VDD or VSS VI = VSS VDD = 3.0 V to 3.6 V; VO = 0.4 V; IO = 15 mA VDD = 2.3 V to 2.7 V; VO = 0.4 V; IO = 10 mA 3 6 −1 5 7 1.6 1.1 −1 - Vo(sw) switch output voltage Vi(sw) = VDD = 3.3 V; Io(sw) = −100 µA Vi(sw) = VDD = 3.0 V to 3.6 V; Io(sw) = −100 µA Vi(sw) = VDD = 2.5 V; Io(sw) = −100 µA Vi(sw) = VDD = 2.3 V to 2.7 V; Io(sw) = −100 µA IL Cio [1] leakage current input/output capacitance VI = VDD or VSS VI = VSS VDD must be lowered to 0.2 V in order to reset part. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 10 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer Table 6. Static characteristics at VDD = 3.6 V to 5.5 V VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. See Table 5 for VDD = 2.3 V to 3.6 V. Symbol Supply VDD IDD supply voltage supply current operating mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz standby mode; VDD = 5.5 V; no load; VI = VDD or VSS no load; VI = VDD or VSS [1] Parameter Conditions Min 3.6 - Typ 65 Max 5.5 100 Unit V µA Istb VPOR VIL VIH IOL IIL IIH Ci Pass gate Ron Vo(sw) standby current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current LOW-level input current HIGH-level input current input capacitance ON-state resistance switch output voltage −0.5 0.7VDD 0.3 1.6 6 9 3.6 2.5 1 2.1 +0.3VDD 6 +1 +1 8 24 4.5 +1 5 µA V V V mA mA µA µA pF Ω V V µA pF Input SCL; input/output SDA VOL = 0.4 V VOL = 0.6 V VI = VSS VI = VDD VI = VSS VDD = 4.5 V to 5.5 V; VO = 0.4 V; IO = 15 mA Vi(sw) = VDD = 5.0 V; Io(sw) = −100 µA Vi(sw) = VDD = 4.5 V to 5.5 V; Io(sw) = −100 µA 3 6 −1 −1 4 2.6 −1 - IL Cio [1] leakage current input/output capacitance VI = VDD or VSS VI = VSS VDD must be lowered to 0.2 V in order to reset part. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 11 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 11. Dynamic characteristics Table 7. Symbol Dynamic characteristics Parameter Conditions Standard-mode I2C-bus Min tPD fSCL tBUF tHD;STA tLOW tHIGH tSU;STA tSU;STO tHD;DAT tSU;DAT tr tf Cb tSP tVD;DAT tVD;ACK [1] [2] [3] [4] [5] Fast-mode I2C-bus Min 0 1.3 0.6 1.3 0.6 0.6 0.6 0[3] 100 20 + 0.1Cb[4] Max 0.3[1] 400 0.9 300 300 400 50 1 0.6 1 Unit Max 0.3[1] 100 3.45 1000 300 400 50 1 0.6 1 propagation delay SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition LOW period of the SCL clock HIGH period of the SCL clock set-up time for a repeated START condition set-up time for STOP condition data hold time data set-up time rise time of both SDA and SCL signals fall time of both SDA and SCL signals capacitive load for each bus line pulse width of spikes that must be suppressed by the input filter data valid time data valid acknowledge time from SDA to SDx, or SCL to SCx 0 4.7 [2] ns kHz µs µs µs µs µs µs µs ns ns ns pF ns µs µs µs 4.0 4.7 4.0 4.7 4.0 0[3] 250 - 20 + 0.1Cb[4] - HIGH-to-LOW LOW-to-HIGH [5] [5] - Pass gate propagation delay is calculated from the 20 Ω typical Ron and the 15 pF load capacitance. After this period, the first clock pulse is generated. A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to bridge the undefined region of the falling edge of SCL. Cb = total capacitance of one bus line in pF. Measurements taken with 1 kΩ pull-up resistor and 50 pF load. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 12 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer SDA tBUF tLOW SCL tr tf tHD;STA tSP tHD;STA P S tHD;DAT tHIGH tSU;DAT Sr tSU;STA tSU;STO P 002aaa986 Fig 15. Definition of timing on the I2C-bus PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 13 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 12. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index θ Lp 1 e bp 4 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8o o 0 ISSUE DATE 99-12-27 03-02-18 Fig 16. Package outline SOT96-1 (SO8) PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 14 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 D E A X c y HE vMA Z 8 5 A2 pin 1 index A1 (A3) A θ Lp L 1 e bp 4 detail X wM 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 θ 6° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18 Fig 17. Package outline SOT505-1 (TSSOP8) PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 15 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm SOT996-2 D B A E A A1 detail X terminal 1 index area e1 L1 1 e b 4 v w M M CAB C C y1 C y L2 L 8 5 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1 OUTLINE VERSION SOT996-2 REFERENCES IEC --JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 18. Package outline SOT996-2 (XSON8U) PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 16 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 17 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 19) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 19. PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 18 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 10. Acronym CDM ESD HBM I2C-bus I/O IC LSB MM POR SMBus Abbreviations Description Charged-Device Model ElectroStatic Discharge Human Body Model Inter-Integrated Circuit bus Input/Output Integrated Circuit Least Significant Bit Machine Model Power-On Reset System Management Bus PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 19 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 15. Revision history Table 11. Revision history Release date 20090903 Data sheet status Product data sheet Change notice Supersedes PCA9540B_3 Document ID PCA9540B_4 Modifications: PCA9540B_3 PCA9540B_2 (9397 750 13731) PCA9540B_1 (9397 750 12918) • Added XSON8U package offering (affects Section 2 “Features” last bullet item, Table 1 “Ordering information”, Section 5.1 “Pinning”, and Section 12 “Package outline”). Product data sheet Product data sheet Product data PCA9540B_2 PCA9540B_1 - 20090528 20040929 20040413 PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 20 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9540B_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 3 September 2009 21 of 22 NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer 18. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.3 6.4 7 7.1 7.2 7.3 7.4 7.5 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Device addressing . . . . . . . . . . . . . . . . . . . . . . 4 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 4 Control register definition . . . . . . . . . . . . . . . . . 4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 5 Voltage translation . . . . . . . . . . . . . . . . . . . . . . 5 Characteristics of the I2C-bus. . . . . . . . . . . . . . 6 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 START and STOP conditions . . . . . . . . . . . . . . 6 System configuration . . . . . . . . . . . . . . . . . . . . 7 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 8 Application design-in information . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering of SMD packages . . . . . . . . . . . . . . 17 Introduction to soldering . . . . . . . . . . . . . . . . . 17 Wave and reflow soldering . . . . . . . . . . . . . . . 17 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 September 2009 Document identifier: PCA9540B_4