PCA9553

PCA9553 4-bit I2C-bus LED driver with programmable blink rates Rev. 06 — 29 December 2008 Product data sheet 1. General description The PCA9553 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set, etc.) timer. The uniqueness of this device is the internal oscillator with two programmable blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the bus master must send repeated commands to turn the LED on and off. This greatly increases the amount of traffic on the I2C-bus and uses up one of the master's timers. The PCA9553 LED blinker instead requires only the initial set-up command to program BLINK RATE 1 and BLINK RATE 2 (i.e., the frequency and duty cycle). From then on, only one command from the bus master is required to turn each individual open-drain output ON, OFF, or to cycle at BLINK RATE 1 or BLINK RATE 2. Maximum output sink current is 25 mA per bit and 100 mA per package. Any bits not used for controlling the LEDs can be used for General Purpose Parallel Input/Output (GPIO) expansion. Power-On Reset (POR) initializes the registers to their default state, all zeroes, causing the bits to be set HIGH (LED off). Due to pin limitations, the PCA9553 is not featured with hardware address pins. The PCA9553/01 and the PCA9553/02 have different fixed I2C-bus addresses allowing operation of both on the same bus. 2. Features I 4 LED drivers (on, off, flashing at a programmable rate) I 2 selectable, fully programmable blink rates (frequency and duty cycle) between 0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds) I Input/outputs not used as LED drivers can be used as regular GPIOs I Internal oscillator requires no external components I I2C-bus interface logic compatible with SMBus I Internal power-on reset I Noise filter on SCL/SDA inputs I 4 open-drain outputs directly drive LEDs to 25 mA I Controlled edge rates to minimize ground bounce I No glitch on power-up I Supports hot insertion I Low standby current I Operating power supply voltage range of 2.3 V to 5.5 V I 0 Hz to 400 kHz clock frequency NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates I ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Packages offered: SO8, TSSOP8 (MSOP8), HVSON8 3. Ordering information Table 1. Ordering information Package Name PCA9553D/01 PCA9553D/02 PCA9553DP/01 PCA9553DP/02 PCA9553TK[2] PCA9553TK/02 [1] [2] Also known as MSOP8. PCA9553TK uses version /01 address. Type number Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 SOT505-1 SO8 TSSOP8[1] plastic thin shrink small outline package; 8 leads; body width 3 mm HVSON8 plastic thermal enhanced very thin small outline SOT908-1 package; no leads; 8 terminals; body 3 × 3 × 0.85 mm 4. Marking Table 2. Marking codes Marking code 9553/1 9553/2 P53/1 P53/2 P53/1 P53/2 Type number PCA9553D/01 PCA9553D/02 PCA9553DP/01 PCA9553DP/02 PCA9553TK PCA9553TK/02 PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 2 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 5. Block diagram PCA9553 INPUT REGISTER I2C-BUS CONTROL SCL SDA INPUT FILTERS LED SELECT (LSn) REGISTER 0 1 PRESCALER 0 REGISTER OSCILLATOR VSS 002aad745 VDD POWER-ON RESET PWM0 REGISTER PWM1 REGISTER LEDn BLINK0 BLINK1 PRESCALER 1 REGISTER Only one I/O shown for clarity. Fig 1. Block diagram PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 3 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 6. Pinning information 6.1 Pinning LED0 LED1 LED2 VSS 1 8 VDD SDA SCL LED3 LED0 LED1 1 2 8 7 VDD 2 PCA9553D/01 7 3 PCA9553D/02 6 4 002aad678 SDA PCA9553DP/01 PCA9553DP/02 6 SCL LED2 3 VSS 4 002aad679 5 5 LED3 Fig 2. Pin configuration for SO8 Fig 3. PCA9553TK PCA9553TK/02 Pin configuration for TSSOP8 terminal 1 index area LED0 LED1 LED2 VSS 1 2 3 4 8 7 6 5 VDD SDA SCL LED3 002aad680 Transparent top view Fig 4. Pin configuration for HVSON8 6.2 Pin description Table 3. Symbol LED0 LED1 LED2 VSS LED3 SCL SDA VDD [1] Pin description Pin 1 2 3 4[1] 5 6 7 8 Description LED driver 0 LED driver 1 LED driver 2 supply ground LED driver 3 serial clock line serial data line supply voltage HVSON8 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 4 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 7. Functional description Refer to Figure 1 “Block diagram”. 7.1 Device address Following a START condition the bus master must output the address of the slave it is accessing. The address of the PCA9553/01 is shown in Figure 5 and PCA9553/02 in Figure 6. PCA9553TK uses the version /01 address. slave address 1 1 0 0 0 1 0 R/W 1 1 slave address 0 0 0 1 1 R/W 002aad742 002aad743 Fig 5. PCA9553/01 slave address Fig 6. PCA9553/02 slave address The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. 7.2 Control register Following the successful acknowledgement of the slave address, the bus master will send a byte to the PCA9553 which will be stored in the Control register. 0 0 0 AI 0 B2 B1 B0 Auto-Increment flag register address 002aad744 Reset state: 00h Fig 7. Control register The lowest 3 bits are used as a pointer to determine which register will be accessed. If the Auto-Increment flag is set, the three low order bits of the Control register are automatically incremented after a read or write. This allows the user to program the registers sequentially. The contents of these bits will rollover to ‘000’ after the last register is accessed. When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the sequence must start by reading a register different from ‘0’ (B2 B1 B0 ≠ 0 0 0). Only the 3 least significant bits are affected by the AI flag. Unused bits must be programmed with zeroes. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 5 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates Control register definition B1 0 0 1 1 0 0 B0 0 1 0 1 0 1 Register name INPUT PSC0 PWM0 PSC1 PWM1 LS0 Type read read/write read/write read/write read/write read/write Register function input register frequency prescaler 0 PWM register 0 frequency prescaler 1 PWM register 1 LED selector Table 4. B2 0 0 0 0 1 1 7.3 Register descriptions 7.3.1 INPUT - Input register The INPUT register reflects the state of the device pins. Writes to this register will be acknowledged but will have no effect. Table 5. Bit Symbol Default INPUT - Input register description 7 INPUT[7] 0 6 INPUT[6] 0 5 INPUT[5] 0 4 INPUT[4] 0 3 LED3 X 2 LED2 X 1 LED1 X 0 LED0 X Remark: The default value ‘X’ is determined by the externally applied logic level (normally logic 1) when used for directly driving LED with pull-up to VDD. 7.3.2 PSC0 - Frequency Prescaler 0 PSC0 is used to program the period of the PWM output. The period of BLINK0 = (PSC0 + 1) / 44. Table 6. Bit Symbol Default PSC0 - Frequency Prescaler 0 register description 7 PSC0[7] 1 6 PSC0[6] 1 5 PSC0[5] 1 4 PSC0[4] 1 3 PSC0[3] 1 2 PSC0[2] 1 1 PSC0[1] 1 0 PSC0[0] 1 7.3.3 PWM0 - Pulse Width Modulation 0 The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off) when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is programmed with 00h, then the PWM0 output is always LOW. The duty cycle of BLINK0 = (256 − PWM0) / 256. Table 7. Bit Symbol Default PWM0 - Pulse Width Modulation 0 register description 7 PWM0 [7] 1 6 PWM0 [6] 0 5 PWM0 [5] 0 4 PWM0 [4] 0 3 PWM0 [3] 0 2 PWM0 [2] 0 1 PWM0 [1] 0 0 PWM0 [0] 0 PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 6 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 7.3.4 PSC1 - Frequency Prescaler 1 PSC1 is used to program the period of the PWM output. The period of BLINK1 = (PSC1 + 1) / 44. Table 8. Bit Symbol Default PSC1 - Frequency Prescaler 1 register description 7 PSC1[7] 1 6 PSC1[6] 1 5 PSC1[5] 1 4 PSC1[4] 1 3 PSC1[3] 1 2 PSC1[2] 1 1 PSC1[1] 1 0 PSC1[0] 1 7.3.5 PWM1 - Pulse Width Modulation 1 The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off) when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is programmed with 00h, then the PWM1 output is always LOW. The duty cycle of BLINK1 = (256 − PWM1) / 256. Table 9. Bit Symbol Default PWM1 - Pulse Width Modulation 1 register description 7 PWM1 [7] 1 6 PWM1 [6] 0 5 PWM1 [5] 0 4 PWM1 [4] 0 3 PWM1 [3] 0 2 PWM1 [2] 0 1 PWM1 [1] 0 0 PWM1 [0] 0 7.3.6 LS0 - LED selector register The LS0 LED select register determines the source of the LED data. 00 = output is set LOW (LED on) 01 = output is set high-impedance (LED off; default) 10 = output blinks at PWM0 rate 11 = output blinks at PWM1 rate Table 10. LS0 - LED selector register bit description Legend: * default value. Register LS0 Bit 7:6 5:4 3:2 1:0 Value 01* 01* 01* 01* Description LED3 selected LED2 selected LED1 selected LED0 selected LS0 - LED0 to LED3 selector PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 7 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 7.4 Pins used as general purpose I/Os LED pins not used to control LEDs can be used as general purpose I/Os. For use as input: Set LEDn to high-impedance (01) and then read the pin state via the Input register. For use as output: Connect external pull-up resistor to the pin and size it according to the DC recommended operating characteristics. LED output pin is HIGH when the output is programmed as high-impedance, and LOW when the output is programmed LOW through the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or PWM1 are used. 7.5 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9553 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9553 registers are initialized to their default states, with all outputs in the OFF state. Thereafter, VDD must be lowered below 0.2 V to reset the device. 8. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 8). SDA SCL data line stable; data valid change of data allowed mba607 Fig 8. Bit transfer 8.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 9). PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 8 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates SDA SDA SCL S START condition P STOP condition SCL mba608 Fig 9. Definition of START and STOP conditions 8.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 10). SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER SLAVE 002aaa966 Fig 10. System configuration 8.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 9 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement 002aaa987 9 Fig 11. Acknowledgement on the I2C-bus 8.4 Bus transactions SCL 1 2 3 4 5 6 7 8 9 command byte data to register DATA 1 A acknowledge from slave slave address SDA S 1 1 0 0 0 1 0 0 R/W A 0 0 0 AI 0 B2 B1 B0 A acknowledge from slave START condition write to register acknowledge from slave tv(Q) data out from port DATA 1 VALID 002aad746 Fig 12. Write to register slave address SDA S 1 1 0 0 0 1 0 0 R/W A 0 0 command byte 0 AI 0 B2 B1 B0 A acknowledge from slave data from register A DATA (first byte) Auto-Increment register address if AI = 1 A acknowledge from master data from register DATA (last byte) NA P STOP condition (cont.) START condition acknowledge from slave slave address (cont.) S 1 1 0 0 0 1 0 1 R/W acknowledge from slave (repeated) START condition no acknowledge from master at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter 002aad747 Fig 13. Read from register PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 10 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates no acknowledge from master slave address SDA S 1 1 0 0 0 1 0 1 R/W A acknowledge from slave data from port DATA 1 A acknowledge from master data from port DATA 4 NA P STOP condition START condition read from port th(D) data into port DATA 2 DATA 3 tsu(D) DATA 4 002aad748 This figure assumes the command byte has previously been programmed with 00h. PCA9553/01 shown. Fig 14. Read input port register 9. Application design-in information 5V 5V I2C-BUS/SMBus MASTER SDA SCL 10 kΩ 10 kΩ VDD SDA SCL LED0 LED1 LED2 LED3 PCA9553 VSS 002aad749 Fig 15. Typical application 9.1 Minimizing IDD when the I/Os are used to control LEDs When the I/Os are used to control LEDs, they are normally connected to VDD through a resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower than VDD and is specified as ∆IDD in Table 13 “Static characteristics”. Designs needing to minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD when the LED is off. Figure 16 shows a high value resistor in parallel with the LED. Figure 17 shows VDD less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at or above VDD and prevents additional supply current consumption when the LED is off. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 11 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates VDD 3.3 V 5V VDD LED 100 kΩ VDD LED LEDn LEDn 002aac189 002aac190 Fig 16. High value resistor in parallel with the LED Fig 17. Device supplied by a lower voltage 9.2 Programming example The following example shows how to set LED0 and LED1 off. It will then set LED2 to blink at 1 Hz, 50 % duty cycle. LED3 will be set to blink at 4 Hz, 25 % duty cycle. PCA9553/01 is used in this example. Table 11. START PCA9553 address PSC0 subaddress + Auto-Increment Set prescaler PSC0 to achieve a period of 1 second: PSC0 + 1 Blink period = 1 = ----------------------44 PSC0 = 43 Set PWM0 duty cycle to 50 %: 256 – PWM0 -------------------------------- = 0.5 256 PWM0 = 128 Set prescaler PSC1 to achieve a period of 0.25 seconds: PSC1 + 1 Blink period = 0.25 = ----------------------44 PSC1 = 10 Set PWM1 output duty cycle to 25 %: 256 – PWM1 -------------------------------- = 0.25 256 PWM1 = 192 Set LED0 on, LED1 off, LED2 set to blink at PSC0, PWM0, LED3 set to blink at PSC1, PWM1 STOP E4h P C0h 0Ah 80h Programming PCA9553 I2C-bus S C4h 11h 2Bh Program sequence PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 12 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 10. Limiting values Table 12. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI/O IO(LEDn) ISS Ptot Tstg Tamb Parameter supply voltage voltage on an input/output pin output current on pin LEDn ground supply current total power dissipation storage temperature ambient temperature operating Conditions Min −0.5 VSS − 0.5 −65 −40 Max +6.0 5.5 ±25 100 400 +150 +85 Unit V V mA mA mW °C °C PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 13 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 11. Static characteristics Table 13. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Supplies VDD IDD Istb ∆IDD supply voltage supply current standby current additional quiescent supply current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance LOW-level input voltage HIGH-level input voltage LOW-level output current VOL = 0.4 V VDD = 2.3 V VDD = 3.0 V VDD = 5.0 V VOL = 0.7 V VDD = 2.3 V VDD = 3.0 V VDD = 5.0 V ILI Cio [1] [2] [3] [3] [3] [3] [3] [3] [3] Parameter Conditions Min 2.3 Typ[1] 350 1.9 - Max 5.5 500 3.0 325 Unit V µA µA µA operating mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz Standby mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz Standby mode; VDD = 5.5 V; every LED I/O at VI = 4.3 V; fSCL = 0 kHz no load; VI = VDD or VSS [2] - VPOR VIL VIH IOL IL Ci I/Os VIL VIH IOL −0.5 0.7VDD 1.7 6.5 3.7 2.1 2.2 +0.3VDD 5.5 +1 5 +0.8 5.5 +1 5 V V V mA µA pF V V mA mA mA mA mA mA µA pF Input SCL; input/output SDA VOL = 0.4 V VI = VDD = VSS VI = VSS 3 −1 −0.5 2.0 9 12 15 15 20 25 −1 - input leakage current input/output capacitance VDD = 3.6 V; VI = 0 V or VDD Typical limits at VDD = 3.3 V, Tamb = 25 °C. VDD must be lowered to 0.2 V in order to reset part. Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 14 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 20 % percent variation 0% 002aac191 (1) 20 % percent variation 0% 002aac192 (1) (2) (2) −20 % (3) −20 % (3) −40 % −40 −20 0 20 40 60 100 Tamb (°C) 80 −40 % −40 −20 0 20 40 60 100 80 Tamb (°C) (1) maximum (2) average (3) minimum (1) maximum (2) average (3) minimum Fig 18. Typical frequency variation over process at VDD = 2.3 V to 3.0 V Fig 19. Typical frequency variation over process at VDD = 3.0 V to 5.5 V PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 15 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 12. Dynamic characteristics Table 14. Symbol Dynamic characteristics Parameter Conditions Standard-mode I2C-bus Min fSCL tBUF tHD;STA tSU;STA tSU;STO tHD;DAT tVD;ACK tVD;DAT tSU;DAT tLOW tHIGH tr tf tSP Port timing tv(Q) tsu(D) th(D) [1] [2] [3] Fast-mode I2C-bus Min 0 1.3 0.6 0.6 0.6 0 100 1.3 0.6 20 + 20 + 0.1Cb[3] 0.1Cb[3] Max 400 600 600 600 300 300 50 Unit Max 100 600 600 1500 1000 300 50 SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition set-up time for a repeated START condition set-up time for STOP condition data hold time data valid acknowledge time data valid time data set-up time LOW period of the SCL clock HIGH period of the SCL clock rise time of both SDA and SCL signals fall time of both SDA and SCL signals pulse width of spikes that must be suppressed by the input filter data output valid time data input set-up time data input hold time tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. tVD;DAT = minimum time for SDA data output to be valid following SCL LOW. Cb = total capacitance of one bus line in pF. [1] 0 4.7 4.0 4.7 4.0 0 250 4.7 4.0 LOW-level HIGH-level [2] [2] kHz µs µs µs µs ns ns ns ns ns µs µs ns ns ns 100 1 200 - 100 1 200 - ns ns µs PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 16 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates SDA tBUF tLOW SCL tr tf tHD;STA tSP tHD;STA P S tHD;DAT tHIGH tSU;DAT Sr tSU;STA tSU;STO P 002aaa986 Fig 20. Definition of timing protocol START condition (S) tSU;STA bit 7 MSB (A7) tLOW tHIGH bit 6 (A6) bit 1 (D1) bit 0 (D0) acknowledge (A) STOP condition (P) 1 / fSCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tVD;DAT tVD;ACK tSU;STO 002aab285 Rise and fall times refer to VIL and VIH. Fig 21. I2C-bus timing diagram 13. Test information VDD open VSS VDD PULSE GENERATOR VI DUT RT VO RL 500 Ω CL 50 pF 002aab880 RL = load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current). CL = load capacitance includes jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generators. Fig 22. Test circuitry for switching times PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 17 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 14. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index θ Lp 1 e bp 4 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8o o 0 ISSUE DATE 99-12-27 03-02-18 Fig 23. Package outline SOT96-1 (SO8) PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 18 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 D E A X c y HE vMA Z 8 5 A2 pin 1 index A1 (A3) A θ Lp L 1 e bp 4 detail X wM 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 θ 6° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18 Fig 24. Package outline SOT505-1 (TSSOP8) PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 19 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-1 0 1 scale 2 mm X D B A E A A1 c detail X terminal 1 index area terminal 1 index area 1 e1 e b 4 v w M M CAB C C y1 C y exposed tie bar (4×) L Eh exposed tie bar (4×) 8 5 Dh DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.3 0.2 c 0.2 D(1) 3.1 2.9 Dh 2.25 1.95 E(1) 3.1 2.9 Eh 1.65 1.35 e 0.5 e1 1.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT908-1 REFERENCES IEC JEDEC MO-229 JEITA EUROPEAN PROJECTION ISSUE DATE 05-09-26 05-10-05 Fig 25. Package outline SOT908-1 (HVSON8) PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 20 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 21 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 26) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 15 and 16 Table 15. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 16. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 26. PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 22 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 26. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 17. Acronym AI CDM DSP ESD GPIO HBM I2C-bus I/O LED MCU MM MPU PCB POR PWM SMBus Abbreviations Description Auto-Increment Charged-Device Model Digital Signal Processor ElectroStatic Discharge General Purpose Input/Output Human Body Model Inter-Integrated Circuit bus Input/Output Light Emitting Diode MicroController Unit Machine Model MicroProcessor Unit Printed-Circuit Board Power-On Reset Pulse Width Modulation System Management Bus PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 23 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 18. Revision history Table 18. Revision history Release date 20081229 Data sheet status Product data sheet Change notice Supersedes PCA9553_5 Document ID PCA9553_6 Modifications: • Table 2 “Marking codes”: – marking code for type number PCA9553D/01 changed from “P9553/1” to “9553/1” – marking code for type number PCA9553D/02 changed from “P9553/2” to “9553/2” – marking code for type number PCA9553TK changed from “P53” to “P53/1” PCA9553_5 PCA9553_4 PCA9553_3 (9397 750 13728) PCA9553_2 (9397 750 11464) PCA9553_1 (9397 750 10859) 20080422 20060818 20041001 20030502 20021213 Product data sheet Product data sheet Product data sheet Product data Product data ECN 853-2397 29856 dated 2003 Apr 24 ECN 853-2397 29264 dated 2002 Dec 09 PCA9553_4 PCA9553_3 PCA9553_2 PCA9553_1 PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 24 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 19. Legal information 19.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9553_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 29 December 2008 25 of 26 NXP Semiconductors PCA9553 4-bit I2C-bus LED driver with programmable blink rates 21. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.3.1 7.3.2 7.3.3 7.3.4 7.3.5 7.3.6 7.4 7.5 8 8.1 8.1.1 8.2 8.3 8.4 9 9.1 9.2 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 5 Register descriptions . . . . . . . . . . . . . . . . . . . . 6 INPUT - Input register. . . . . . . . . . . . . . . . . . . . 6 PSC0 - Frequency Prescaler 0 . . . . . . . . . . . . . 6 PWM0 - Pulse Width Modulation 0 . . . . . . . . . . 6 PSC1 - Frequency Prescaler 1 . . . . . . . . . . . . . 7 PWM1 - Pulse Width Modulation 1 . . . . . . . . . . 7 LS0 - LED selector register. . . . . . . . . . . . . . . . 7 Pins used as general purpose I/Os . . . . . . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 Characteristics of the I2C-bus. . . . . . . . . . . . . . 8 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 START and STOP conditions . . . . . . . . . . . . . . 8 System configuration . . . . . . . . . . . . . . . . . . . . 9 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10 Application design-in information . . . . . . . . . 11 Minimizing IDD when the I/Os are used to control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Programming example . . . . . . . . . . . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 Test information . . . . . . . . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Handling information. . . . . . . . . . . . . . . . . . . . 21 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 19.1 19.2 19.3 19.4 20 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 25 25 25 25 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 December 2008 Document identifier: PCA9553_6