PCA9670D,518

PCA9670 Remote 8-bit I/O expander for Fm+ I2C-bus with reset Rev. 3 — 30 May 2013 Product data sheet 1. General description The PCA9670 provides general-purpose remote I/O expansion via the two-wire bidirectional I2C-bus (serial clock (SCL), serial data (SDA)). The devices consist of eight quasi-bidirectional ports, 1 MHz 30 mA drive I2C-bus interface, three hardware address inputs and a reset input operating between 2.3 V and 5.5 V. 1 MHz I2C-bus Fast-mode Plus (Fm+) can support PWM dimming of LEDs, and higher I2C-bus drive 30 mA allows more devices to be on the bus without the need for bus buffers. The quasi-bidirectional port can be independently assigned as an input to monitor interrupt status or keypads, or as an output to activate indicator devices such as LEDs. The system master can read from the input port or write to the output port through a single register. The low current consumption of 2.5 A (typical, static) is great for mobile applications and the latched output ports have 25 mA high current sink drive capability for directly driving LEDs. The PCA9670 has three hardware address pins and allows up to 64 of these PCA9670 I/O expanders on the same I2C-bus without the need for bus buffers, supporting up to 512 I/Os (for example, 512 LEDs). The internal Power-On Reset (POR) and active LOW hardware reset pin (RESET) initialize the I/Os as inputs with a weak internal pull-up 100 A current source. 2. Features and benefits              I2C-bus to parallel port expander 1 MHz I2C-bus interface (Fast-mode Plus I2C-bus) SDA with 30 mA sink capability for 4000 pF buses Operating supply voltage 2.3 V to 5.5 V with 5.5 V tolerant I/Os held to VDD with 100 A current source 8-bit remote I/O pins that default to inputs at power-up Latched outputs with 25 mA sink capability for directly driving LEDs Total package sink capability of 200 mA Active LOW reset input Sixty-four programmable slave addresses using three address pins Readable device ID (manufacturer, device type, and revision) Software reset Low standby current (2.5 A typical) 40 C to +85 C operation PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset  ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101  Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA  Packages offered: SO16, TSSOP16 and HVQFN16 3. Applications           LED signs and displays Servers Keypads Industrial control Medical equipment PLCs Cellular telephones Mobile devices Gaming machines Instrumentation and test measurement 4. Ordering information Table 1. Ordering information Type number Topside marking Package Name Description Version PCA9670BS 670 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3  3  0.85 mm SOT758-1 PCA9670D PCA9670D SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 PCA9670PW PCA9670 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 4.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature range PCA9670BS PCA9670BS,118 HVQFN16 Reel 13” Q1/T1 *standard mark SMD 6000 Tamb = 40 C to +85 C PCA9670D PCA9670PW PCA9670D,512 SO16 Standard marking * tube dry pack 1920 Tamb = 40 C to +85 C PCA9670D,518 SO16 Reel 13” Q1/T1 *standard mark SMD dry pack 1000 Tamb = 40 C to +85 C PCA9670PW,112 TSSOP16 Standard marking * IC’s tube - DSC bulk pack 2400 Tamb = 40 C to +85 C PCA9670PW,118 TSSOP16 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 2 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 5. Block diagram PCA9670 AD0 AD1 AD2 SCL SDA RESET VDD INPUT FILTER I2C-BUS CONTROL SHIFT REGISTER 8 BITS I/O PORT P0 to P7 write pulse read pulse POWER-ON RESET VSS 002aac256 Fig 1. Block diagram of PCA9670 IOH write pulse VDD 100 µA Itrt(pu) data from Shift Register D Q FF IOL CI P0 to P7 S power-on reset VSS D Q FF read pulse CI S data to Shift Register Fig 2. PCA9670 Product data sheet 002aah741 Simplified schematic diagram of P0 to P7 All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 3 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 6. Pinning information 6.1 Pinning AD0 1 1 16 VDD 2 16 VDD 15 SDA AD0 AD1 AD1 2 15 SDA AD2 3 14 SCL AD2 3 14 SCL P0 4 13 RESET P0 4 P1 5 12 P7 P1 5 P2 6 11 P6 P2 6 11 P6 P3 7 10 P5 P3 7 10 P5 VSS 8 9 VSS 8 PCA9670D P4 PCA9670PW 12 P7 9 002aac257 P4 002aac258 AD2 1 P0 2 Pin configuration for TSSOP16 13 SDA terminal 1 index area 14 VDD Fig 4. 15 AD0 Pin configuration for SO16 16 AD1 Fig 3. 13 RESET 12 SCL 11 RESET PCA9670BS 7 8 P5 9 P4 4 6 P2 VSS 10 P7 5 3 P3 P1 P6 002aac261 Transparent top view Fig 5. Pin configuration for HVQFN16 6.2 Pin description Table 3. Symbol AD0 PCA9670 Product data sheet Pin description Pin Description SO16, TSSOP16 HVQFN16 1 15 address input 0 AD1 2 16 address input 1 AD2 3 1 address input 2 P0 4 2 quasi-bidirectional I/O 0 P1 5 3 quasi-bidirectional I/O 1 P2 6 4 quasi-bidirectional I/O 2 P3 7 5 quasi-bidirectional I/O 3 VSS 8 6[1] supply ground P4 9 7 quasi-bidirectional I/O 4 P5 10 8 quasi-bidirectional I/O 5 P6 11 9 quasi-bidirectional I/O 6 All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 4 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Table 3. Symbol Pin description …continued Pin Description SO16, TSSOP16 HVQFN16 P7 12 10 quasi-bidirectional I/O 7 RESET 13 11 reset input (active LOW) SCL 14 12 serial clock line SDA 15 13 serial data line VDD 16 14 supply voltage [1] HVQFN16 package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region. 7. Functional description Refer to Figure 1 “Block diagram of PCA9670”. 7.1 Device address Following a START condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). The address format of the PCA9670 is shown in Figure 6. Slave address pins AD2, AD1, and AD0 are used to choose one of 64 slave addresses. These devices can monitor the change in SDA or SCL in addition to the static levels of VDD or VSS to decode four states allowing a larger address range. To conserve power, no internal pull-up resistors are incorporated on AD2, AD1, or AD0 so they must be externally connected to VDD, VSS directly or through resistors, or to SCL or SDA directly. Address values depending on AD2, AD1, and AD0 can be found in Table 4 “PCA9670 address map”. Remark: When using the PCA9670, reserved I2C-bus addresses must be used with caution since they can interfere with: • “reserved for future use” I2C-bus addresses (0000 011, 1111 101, 1111 110, 1111 111) • slave devices that use the 10-bit addressing scheme (1111 0xx) • High speed mode (Hs-mode) master code (0000 1xx) slave address A6 A5 A4 A3 A2 A1 programmable Fig 6. A0 R/W 002aab636 PCA9670 address The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8574 or newer PCA8574 is applied. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 5 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 7.1.1 Address maps Table 4. PCA9670 address map Pin connectivity PCA9670 Product data sheet Address of PCA9670 Address byte value Write Read 7-bit hexadecimal address without R/W - 20h 21h 10h 1 - 22h 23h 11h 1 0 - 24h 25h 12h 1 1 - 26h 27h 13h 1 0 0 - 28h 29h 14h 1 0 1 - 2Ah 2Bh 15h 0 - 2Ch 2Dh 16h 1 - 2Eh 2Fh 17h 0 - 30h 31h 18h 0 1 - 32h 33h 19h 0 1 0 - 34h 35h 1Ah 0 1 1 - 36h 37h 1Bh 1 1 0 0 - 38h 39h 1Ch 1 1 1 0 1 - 3Ah 3Bh 1Dh 0 1 1 1 1 0 - 3Ch 3Dh 1Eh 0 1 1 1 1 1 - 3Eh 3Fh 1Fh 0 1 0 0 0 0 0 - 40h 41h 20h VDD 0 1 0 0 0 0 1 - 42h 43h 21h VDD VSS 0 1 0 0 0 1 0 - 44h 45h 22h VDD VDD 0 1 0 0 0 1 1 - 46h 47h 23h VDD VSS VSS 0 1 0 0 1 0 0 - 48h 49h 24h VDD VSS VDD 0 1 0 0 1 0 1 - 4Ah 4Bh 25h VDD VDD VSS 0 1 0 0 1 1 0 - 4Ch 4Dh 26h VDD VDD VDD 0 1 0 0 1 1 1 - 4Eh 4Fh 27h VSS VSS SCL 0 1 0 1 0 0 0 - 50h 51h 28h VSS VSS SDA 0 1 0 1 0 0 1 - 52h 53h 29h VSS VDD SCL 0 1 0 1 0 1 0 - 54h 55h 2Ah VSS VDD SDA 0 1 0 1 0 1 1 - 56h 57h 2Bh VDD VSS SCL 0 1 0 1 1 0 0 - 58h 59h 2Ch VDD VSS SDA 0 1 0 1 1 0 1 - 5Ah 5Bh 2Dh VDD VDD SCL 0 1 0 1 1 1 0 - 5Ch 5Dh 2Eh VDD VDD SDA 0 1 0 1 1 1 1 - 5Eh 5Fh 2Fh AD2 AD1 AD0 A6 A5 A4 A3 A2 A1 A0 R/W VSS SCL VSS 0 0 1 0 0 0 0 VSS SCL VDD 0 0 1 0 0 0 VSS SDA VSS 0 0 1 0 0 VSS SDA VDD 0 0 1 0 0 VDD SCL VSS 0 0 1 0 VDD SCL VDD 0 0 1 0 VDD SDA VSS 0 0 1 0 1 1 VDD SDA VDD 0 0 1 0 1 1 VSS SCL SCL 0 0 1 1 0 0 VSS SCL SDA 0 0 1 1 0 VSS SDA SCL 0 0 1 1 VSS SDA SDA 0 0 1 1 VDD SCL SCL 0 0 1 VDD SCL SDA 0 0 VDD SDA SCL 0 VDD SDA SDA 0 VSS VSS VSS VSS VSS VSS VSS All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 6 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Table 4. PCA9670 address map …continued Pin connectivity AD2 PCA9670 Product data sheet AD1 Address of PCA9670 Address byte value AD0 A6 A5 A4 A3 A2 A1 A0 R/W Write Read 7-bit hexadecimal address without R/W SCL SCL VSS 1 0 1 0 0 0 0 - A0h A1h 50h SCL SCL VDD 1 0 1 0 0 0 1 - A2h A3h 51h SCL SDA VSS 1 0 1 0 0 1 0 - A4h A5h 52h SCL SDA VDD 1 0 1 0 0 1 1 - A6h A7h 53h SDA SCL VSS 1 0 1 0 1 0 0 - A8h A9h 54h SDA SCL VDD 1 0 1 0 1 0 1 - AAh ABh 55h SDA SDA VSS 1 0 1 0 1 1 0 - ACh ADh 56h SDA SDA VDD 1 0 1 0 1 1 1 - AEh AFh 57h SCL SCL SCL 1 0 1 1 0 0 0 - B0h B1h 58h SCL SCL SDA 1 0 1 1 0 0 1 - B2h B3h 59h SCL SDA SCL 1 0 1 1 0 1 0 - B4h B5h 5Ah SCL SDA SDA 1 0 1 1 0 1 1 - B6h B7h 5Bh SDA SCL SCL 1 0 1 1 1 0 0 - B8h B9h 5Ch SDA SCL SDA 1 0 1 1 1 0 1 - BAh BBh 5Dh SDA SDA SCL 1 0 1 1 1 1 0 - BCh BDh 5Eh SDA SDA SDA 1 0 1 1 1 1 1 - BEh BFh 5Fh SCL VSS VSS 1 1 0 0 0 0 0 - C0h C1h 60h SCL VSS VDD 1 1 0 0 0 0 1 - C2h C3h 61h SCL VDD VSS 1 1 0 0 0 1 0 - C4h C5h 62h SCL VDD VDD 1 1 0 0 0 1 1 - C6h C7h 63h SDA VSS VSS 1 1 0 0 1 0 0 - C8h C9h 64h SDA VSS VDD 1 1 0 0 1 0 1 - CAh CBh 65h SDA VDD VSS 1 1 0 0 1 1 0 - CCh CDh 66h SDA VDD VDD 1 1 0 0 1 1 1 - CEh CFh 67h SCL VSS SCL 1 1 1 0 0 0 0 - E0h E1h 70h SCL VSS SDA 1 1 1 0 0 0 1 - E2h E3h 71h SCL VDD SCL 1 1 1 0 0 1 0 - E4h E5h 72h SCL VDD SDA 1 1 1 0 0 1 1 - E6h E7h 73h SDA VSS SCL 1 1 1 0 1 0 0 - E8h E9h 74h SDA VSS SDA 1 1 1 0 1 0 1 - EAh EBh 75h SDA VDD SCL 1 1 1 0 1 1 0 - ECh EDh 76h SDA VDD SDA 1 1 1 0 1 1 1 - EEh EFh 77h All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 7 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 7.2 Software Reset Call, and device ID addresses Two other different addresses can be sent to the PCA9670. • General Call address: allows resetting the PCA9670 through the I2C-bus upon reception of the right I2C-bus sequence. See Section 7.2.1 “Software Reset” for more information. • Device ID address: allows reading ID information from the device (manufacturer, part identification, revision). See Section 7.2.2 “Device ID (PCA9670 ID field)” for more information. R/W 0 0 0 0 0 0 0 0 002aac115 Fig 7. General Call address 1 1 1 1 1 0 0 R/W 002aac116 Fig 8. Device ID address 7.2.1 Software Reset The Software Reset Call allows all the devices in the I2C-bus to be reset to the power-up state value through a specific formatted I2C-bus command. To be performed correctly, it implies that the I2C-bus is functional and that there is no device hanging the bus. The Software Reset sequence is defined as following: 1. A START command is sent by the I2C-bus master. 2. The reserved General Call I2C-bus address ‘0000 000’ with the R/W bit set to 0 (write) is sent by the I2C-bus master. 3. The PCA9670 device(s) acknowledge(s) after seeing the General Call address ‘0000 0000’ (00h) only. If the R/W bit is set to 1 (read), no acknowledge is returned to the I2C-bus master. 4. Once the General Call address has been sent and acknowledged, the master sends 1 byte. The value of the byte must be equal to 06h. a. The PCA9670 acknowledges this value only. If the byte is not equal to 06h, the PCA9670 does not acknowledge it. If more than 1 byte of data is sent, the PCA9670 does not acknowledge any more. 5. Once the right byte has been sent and correctly acknowledged, the master sends a STOP command to end the Software Reset sequence: the PCA9670 then resets to the default value (power-up value) and is ready to be addressed again within the specified bus free time. If the master sends a Repeated START instead, no reset is performed. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 8 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset The I2C-bus master must interpret a non-acknowledge from the PCA9670 (at any time) as a ‘Software Reset Abort’. The PCA9670 does not initiate a reset of its registers. The unique sequence that initiates a Software Reset is described in Figure 9. SWRST Call I2C-bus address S 0 0 0 0 0 START condition 0 0 SWRST data = 06h 0 A 0 0 R/W acknowledge from slave(s) 0 0 0 1 1 0 A P acknowledge from slave(s) PCA9670 is(are) reset. Registers are set to default power-up values. 002aac263 Fig 9. Software Reset sequence Simple code for Software Reset: 7.2.2 Device ID (PCA9670 ID field) The Device ID field is a 3-byte read-only (24 bits) word giving the following information: • 12 bits with the manufacturer name, unique per manufacturer (for example, NXP). • 9 bits with the part identification, assigned by manufacturer. • 3 bits with the die revision, assigned by manufacturer (for example, Rev X). The Device ID is read-only, hardwired in the device and can be accessed as follows: 1. START command 2. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W bit set to 0 (write). 3. The master sends the I2C-bus slave address of the slave device it needs to identify. The LSB is a ‘Don’t care’ value. Only one device must acknowledge this byte (the one that has the I2C-bus slave address). 4. The master sends a Re-START command. Remark: A STOP command followed by a START command will reset the slave state machine and the Device ID read cannot be performed. Remark: A STOP command or a Re-START command followed by an access to another slave device will reset the slave state machine and the Device ID read cannot be performed. 5. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W bit set to 1 (read). 6. The device ID read can be done, starting with the 12 manufacturer bits (first byte + 4 MSB of the second byte), followed by the 9 part identification bits and then the 3 die revision bits (3 LSB of the third byte). 7. The master ends the reading sequence by NACKing the last byte, thus resetting the slave device state machine and allowing the master to send the STOP command. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 9 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Remark: The reading of the Device ID can be stopped anytime by sending a NACK command. Remark: If the master continues to ACK the bytes after the third byte, the PCA9670 rolls back to the first byte and keeps sending the Device ID sequence until a NACK has been detected. For the PCA9670, the Device ID is as shown in Figure 10. manufacturer 0 0 0 part identification 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 revision 0 002aac264 Fig 10. PCA9670 Device ID field acknowledge from one or several slaves Device ID address S 1 1 1 1 1 0 START condition 0 I2C-bus slave address of the device to be identified acknowledge from slave to be identified Device ID address 0 A A6 A5 A4 A3 A2 A1 A0 0 A Sr 1 R/W don’t care acknowledge from master acknowledge from slave to be identified 1 1 1 repeated START condition acknowledge from master 1 0 0 1 A R/W no acknowledge from master M M A M3 M2 M1 M0 P8 P7 P6 P5 A P4 P3 P2 P1 P0 R2 R1 R0 A P 11 10 M9 M8 M7 M6 M5 M4 STOP condition manufacturer name = 000000000000 part identification = 100000000 revision = 000 002aac267 If more than 2 bytes are read, the slave device loops back to the first byte (manufacturer byte) and keeps sending data until the master generates a ‘no acknowledge’. Fig 11. Device ID field reading Simple code for reading Device ID: PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 10 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 8. I/O programming 8.1 Quasi-bidirectional I/O architecture A quasi-bidirectional I/O is an input or output port without using a direction control register. Whenever the master reads the register, the value returned to master depends on the actual voltage or status of the pin. At power-on, all the ports are HIGH with a weak 100 A internal pull-up to VDD but can be driven LOW by an internal transistor, or an external signal. The I/O ports are entirely independent of each other but each I/O octal is controlled by the same read or write data byte. Advantages of the quasi-bidirectional I/O over totem pole I/O include: • Better for driving LEDs since the p-channel (transistor to VDD) is small, which saves die size and therefore cost. LED drive only requires an internal transistor to ground, while the LED is connected to VDD through a current-limiting resistor. Totem pole I/O have both an n-channel and p-channel transistors, which allow solid HIGH and LOW output levels without a pull-up resistor — good for logic levels. • Simpler architecture — only a single register and the I/O can be both input and output at the same time. Totem pole I/O have a direction register which specifies the port pin direction and it is always in that configuration unless the direction is explicitly changed. • Does not require a command byte. The simplicity of one register (no need for the pointer register or technically, the command byte) is an advantage in some embedded systems where every byte counts because of memory or bandwidth limitations. There is only one register to control four possibilities of the port pin: Input HIGH, input LOW, output HIGH or output LOW. Input HIGH: The master needs to write 1 to the register to set the port as an input mode if the device is not in the default power-on condition. The master reads the register to check the input status. If the external source pulls the port pin up to VDD or drives logic 1, then the master will read the value of 1. Input LOW: The master needs to write 1 to the register to set the port to input mode if the device is not in the default power-on condition. The master reads the register to check the input status. If the external source pulls the port pin down to VSS or drives logic 0, which sinks the weak 100 A current source, then the master will read the value of 0. Output HIGH: The master writes 1 to the register. There is an additional ‘accelerator’ or strong pull-up current when the master sets the port HIGH. The additional strong pull-up is only active during the HIGH time of the acknowledge clock cycle. This accelerator current helps the port’s 100 A current source make a faster rising edge into a heavily loaded output, but only at the start of the acknowledge clock cycle to avoid bus contention if an external signal is pulling the port LOW to VSS/driving the port with logic 0 at the same time. After the half clock cycle there is only the 100 A current source to hold the port HIGH. Output LOW: The master writes 0 to the register. There is a strong current sink transistor that holds the port pin LOW. A large current may flow into the port, which could potentially damage the part if the master writes a 0 to the register and an external source is pulling the port HIGH at the same time. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 11 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset VDD input HIGH weak 100 µA current source (inactive when output LOW) pull-up with resistor to VDD or external drive HIGH output HIGH accelerator pull-up P port P7 - P0 pull-down with resistor to VSS or external drive LOW output LOW input LOW VSS 002aah683 Fig 12. Simple quasi-bidirectional I/O 8.2 Writing to the port (Output mode) The master (microcontroller) sends the START condition and slave address, setting the last bit of the address byte to logic 0 for the write mode. The PCA9670 acknowledges and the master then sends the data byte for P7 to P0 to the port register. As the clock line goes HIGH, the 8-bit data is presented on the port lines after it has been acknowledged by the PCA9670. If a LOW is written, the strong pull-down turns on and stays on. If a HIGH is written, the strong pull-up turns on for 1⁄2 of the clock cycle, then the line is held HIGH by the weak current source. The master can then send a STOP condition or continuing sending data. The number of data bytes that can be sent successively is not limited and the previous data is overwritten every time a data byte has been sent and acknowledged. Ensure a logic 1 is written for any port that is being used as an input to ensure the strong external pull-down is turned off. SCL 1 2 3 4 5 6 7 8 9 slave address data 1 SDA S A6 A5 A4 A3 A2 A1 A0 0 START condition R/W data 2 A P7 P6 1 P4 P3 P2 P1 P0 A P7 0 P5 P4 P3 P2 P1 P0 A P5 P5 acknowledge from slave acknowledge from slave acknowledge from slave write to port tv(Q) tv(Q) data output from port DATA 1 VALID DATA 2 VALID P5 output voltage P5 pull-up output current Itrt(pu) IOH 002aac265 Fig 13. Write mode (output) PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 12 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 8.3 Reading from a port (Input mode) The port must have been previously written to logic 1, which is the condition after power-on reset or hardware reset or software reset. To enter the Read mode the master (microcontroller) addresses the slave device and sets the last bit of the address byte to logic 1 (address byte read). The slave will acknowledge and then send the data byte to the master. The master will NACK and then send the STOP condition or ACK and read the input register again. The read of any pin being used as an output will indicate HIGH or LOW depending on the actual state of the input pin. If the data on the input port changes faster than the master can read, this data may be lost. The DATA 2 and DATA 3 are lost because these data did not meet the set-up time and hold time (see Figure 14). slave address data from port SDA S A6 A5 A4 A3 A2 A1 A0 1 START condition R/W DATA 1 A data from port A acknowledge from slave DATA 4 no acknowledge from master 1 P STOP condition acknowledge from master read from port DATA 2 data at port DATA 1 DATA 3 th(D) tsu(D) DATA 4 002aac266 A LOW-to-HIGH transition of SDA while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the last acknowledge phase is valid (Output mode). Input data is lost. Fig 14. Read input port register 8.4 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9670 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9670 registers and I2C-bus/SMBus state machine will initialize to their default states of all I/Os to inputs with weak current source to VDD. Thereafter VDD must be lowered below VPOR and back up to the operation voltage for power-on reset cycle. 8.5 RESET input A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The PCA9670 registers and I2C-bus state machine will be held in their default state until the RESET input is once again HIGH. This RESET input pin requires a pull-up resistor to VDD if no active connection is used. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 13 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 9. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 9.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 15). SDA SCL data line stable; data valid change of data allowed mba607 Fig 15. Bit transfer 9.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 16.) SDA SCL S P START condition STOP condition mba608 Fig 16. Definition of START and STOP conditions PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 14 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 9.2 System configuration A device generating a message is a ‘transmitter'; a device receiving is the ‘receiver'. The device that controls the message is the ‘master' and the devices which are controlled by the master are the ‘slaves' (see Figure 17). SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER SLAVE 002aaa966 Fig 17. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit (see Figure 18). The acknowledge bit is an active LOW level (generated by the receiving device) that indicates to the transmitter that the data transfer was successful. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that wants to issue an acknowledge bit has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge bit related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. data output by transmitter not acknowledge data output by receiver acknowledge SCL from master 1 2 S START condition 8 9 clock pulse for acknowledgement 002aaa987 Fig 18. Acknowledgement on the I2C-bus PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 15 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in Figure 19, P0 and P1 are inputs, and P2 to P7 are outputs. When used in this configuration, during a write, the input (P0 and P1) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P2 to P7). If 10 A internal output HIGH is not enough current source, the port needs external pull-up resistor. During a read, the logic levels of the external devices driving the input ports (P0 and P1) and the previous written logic level to the output ports (P2 to P7) will be read. The GPIO also has a reset line (RESET) that can be connected to an output pin of the microprocessor. Since the device does not have an interrupt output, changes of the I/Os can be monitored by reading the input register. If both a RESET and INT are needed, use the PCA9672. VDD VDD CORE PROCESSOR VDD SDA SCL RESET AD0 AD1 AD2 P0 P1 P2 P3 P4 P5 P6 P7 temperature sensor battery status control for latch control for switch control for audio control for camera control for MP3 002aac298 Fig 19. Bidirectional I/O expander application 10.2 How to read and write to I/O expander (example) In the application example of PCA9670 shown in Figure 19, the microcontroller wants to control the P3 switch ON and the P7 LED ON when the temperature sensor P0 changes. 1. When the system power on: Core Processor needs to issue an initial command to set P0 and P1 as inputs and P[7:2] as outputs with value 1010 00 (LED off, MP3 off, camera on, audio off, switch off and latch off). 2. Operation: When the temperature changes above the threshold, the temperature sensor signal will toggle from HIGH to LOW. The INT will be activated and notifies the ‘core processor’ that there have been changes on the input pins. Read the input register. If P0 = 0 (temperature sensor has changed), then turn on LED and turn on switch. 3. Software code: //System Power on // write to PCA9670 with data 1010 0011b to set P[7:2] outputs and P[1:0] inputs //Initial setting for PCA9670 while (1) //Looping look for P0 = 0 PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 16 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset { //Read PCA9670 data If (P0 == 0) //Temperature sensor activated { // write to PCA9670 with data 0010 1011b to turn on LED (P7), on Switch (P3) and keep P[1:0] as input ports. // Write to PCA9670 Exit the loop; } } 10.3 High current-drive load applications The GPIO has a minimum guaranteed sinking current of 25 mA per bit at 5.5 V. In applications requiring additional drive, two port pins may be connected together to sink up to 50 mA current. Both bits must then always be turned on or off together. Up to 8 pins can be connected together to drive 200 mA, which is the device recommended total limit. Each pin needs its own limiting resistor as shown in Figure 20 to prevent damage to the device should all ports not be turned on at the same time. VDD VDD SDA SCL RESET CORE PROCESSOR AD0 AD1 AD2 VDD P0 P1 P2 P3 P4 P5 P6 P7 LOAD 002aac299 Fig 20. High current-drive load application 10.4 Migration path NXP offers new, more capable drop-in replacements for the PCA9670 in newer space-saving packages. Table 5. PCA9670 migration path Type number I2C-bus frequency Voltage range Number of addresses per device Interrupt Reset Total package sink current PCF8574/74A 100 kHz 2.5 V to 6 V 8 yes no 80 mA PCA8574/74A 400 kHz 2.3 V to 5.5 V 8 yes no 200 mA PCA9674/74A 1 MHz Fm+ 2.3 V to 5.5 V 64 yes no 200 mA PCA9670 1 MHz Fm+ 2.3 V to 5.5 V 64 no yes 200 mA PCA9672 1 MHz Fm+ 2.3 V to 5.5 V 16 yes yes 200 mA PCA9670 replaces the interrupt output of the PCA9674 with hardware reset input to retain the maximum number of addresses. PCA9672 replaces address A2 of the PCA9674 with hardware reset input to retain the interrupt, but limit the number of addresses. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 17 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 11. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage Conditions Min Max Unit 0.5 +6 V IDD supply current - 100 mA ISS ground supply current - 400 mA VI input voltage VSS  0.5 5.5 V II input current - 20 mA IO output current - 50 mA Ptot total power dissipation - 400 mW P/out power dissipation per output - 100 mW Tj(max) maximum junction temperature - 125 C Tstg storage temperature 65 +150 C Tamb ambient temperature 40 +85 C [1] [1] operating Total package (maximum) output current is 400 mA. 12. Thermal characteristics Table 7. PCA9670 Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient SO16 package 115 C/W TSSOP16 package 160 C/W HVQFN16 package 40 C/W All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 18 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 13. Static characteristics Table 8. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDD supply voltage 2.3 - 5.5 V IDD supply current Operating mode; no load; VI = VDD or VSS; fSCL = 1 MHz; AD0, AD1, AD2 = static H or L - 266 500 A Istb standby current Standby mode; no load; VI = VDD or VSS; fSCL = 0 kHz - 2.5 10 A VPOR power-on reset voltage - 1.8 2.0 V [1] Input SCL; input/output SDA VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V; VDD = 2.3 V 20 - - mA VOL = 0.4 V; VDD = 3.0 V 25 - - mA VOL = 0.4 V; VDD = 4.5 V 30 - - mA IL leakage current VI = VDD or VSS 1 - +1 A Ci input capacitance VI = VSS - 4 10 pF I/Os; P0 to P7 VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.5 V; VDD = 2.3 V [2] 12 27 - mA VOL = 0.5 V; VDD = 3.0 V [2] 17 35 - mA 25 41 - mA - - 200 mA 30 250 300 A VOL = 0.5 V; VDD = 4.5 V [2] IOL(tot) total LOW-level output current VOL = 0.5 V; VDD = 4.5 V [2] IOH HIGH-level output current VOH = VSS Itrt(pu) transient boosted pull-up current VOH = VSS; see Figure 13 Ci input capacitance [3] Co output capacitance [3] 0.5 1.0 - mA - 3 10 pF - 3 10 pF Input RESET VIL LOW-level input voltage 0.5 - +0.8 V VIH HIGH-level input voltage 2 - 5.5 V ILI input leakage current 1 - +1 A Ci input capacitance - 3 5 pF Inputs AD0, AD1, AD2 VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current 1 - +1 A Ci input capacitance - 3 5 pF [1] The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and set all I/Os to logic 1 (with current source to VDD). [2] Each bit must be limited to a maximum of 25 mA and the total package limited to 200 mA due to internal busing limits. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 19 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset [3] The value is not tested, but verified on sampling basis. 14. Dynamic characteristics Table 9. Dynamic characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Standard mode I2C-bus Min Max Fast mode I2C-bus Min Max Fast-mode Plus Unit I2C-bus Min Max fSCL SCL clock frequency 0 100 0 400 0 1000 tBUF bus free time between a STOP and START condition 4.7 - 1.3 - 0.5 - kHz s tHD;STA hold time (repeated) START condition 4.0 - 0.6 - 0.26 - s tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - 0.26 - s tSU;STO set-up time for STOP condition 4.0 - 0.6 - 0.26 - s tHD;DAT data hold time 0 - 0 - 0 - ns 0.3 3.45 0.1 0.9 0.05 0.45 s 300 - 50 - 50 450 ns tVD;ACK data valid acknowledge time [1] tVD;DAT data valid time [2] tSU;DAT data set-up time 250 - 100 - 50 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - 0.5 - s tHIGH HIGH period of the SCL clock 4.0 - 0.6 - 0.26 - s tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb[3] 300 - 120 ns tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb[3] 300 - 120 ns tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 - 50 ns - 4 - 4 - 4 s [4][5] [6] Port timing; CL  100 pF (see Figure 14 and Figure 13) tv(Q) data output valid time tsu(D) data input set-up time 0 - 0 - 0 - s th(D) data input hold time 4 - 4 - 4 - s 4 - 4 - 4 - s Reset timing (see Figure 22) tw(rst) reset pulse width trec(rst) reset recovery time trst reset time 0 - 0 - 0 - s 100 - 100 - 100 - s [1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. [2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. [3] Cb = total capacitance of one bus line in pF. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 20 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset [4] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to bridge the undefined region SCL’s falling edge. [5] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [6] Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns. START condition (S) protocol bit 7 MSB (A7) tSU;STA tLOW bit 6 (A6) tHIGH bit 0 (R/W) acknowledge (A) STOP condition (P) 1 / fSCL 0.7 × VDD SCL 0.3 × VDD tBUF tf tr 0.7 × VDD SDA 0.3 × VDD tSU;DAT tHD;STA tHD;DAT tVD;ACK tVD;DAT tSU;STO 002aab175 Rise and fall times refer to VIL and VIH. Fig 21. I2C-bus timing diagram ACK or read cycle START SCL SDA 30 % trst RESET 50 % 50 % 50 % trec(rst) tw(rst) trst 50 % IOx_y output off 002aac018 Fig 22. Reset timing PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 21 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 15. Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A B D SOT758-1 terminal 1 index area A E A1 c detail X e1 C 1/2 e e 5 y y1 C v M C A B w M C b 8 L 4 9 e e2 Eh 1/2 e 12 1 16 terminal 1 index area 13 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 1.75 1.45 3.1 2.9 1.75 1.45 0.5 1.5 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT758-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 02-03-25 02-10-21 Fig 23. Package outline SOT758-1 (HVQFN16) PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 22 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 24. Package outline SOT162-1 (SO16) PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 23 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 25. Package outline SOT403-1 (TSSOP16) PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 24 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 16. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 17. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 17.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 17.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 17.3 Wave soldering Key characteristics in wave soldering are: PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 25 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 17.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 26) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 10 and 11 Table 10. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 11. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 26. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 26 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 26. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 27 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 18. Soldering: PCB footprints Footprint information for reflow soldering of HVQFN16 package SOT758-1 Hx Gx D P 0.025 0.025 C (0.105) SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area nSPx nSPy 2 2 Dimensions in mm P Ax Ay Bx By C D SLx SLy 0.50 4.00 4.00 2.20 2.20 0.90 0.24 1.50 1.50 Issue date SPx tot SPy tot 0.90 0.90 SPx SPy Gx Gy Hx Hy 0.30 0.30 3.30 3.30 4.25 4.25 12-03-07 12-03-08 sot758-1_fr Fig 27. PCB footprint for SOT758-1 (HVQFN16); reflow soldering PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 28 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Footprint information for reflow soldering of SO16 package SOT162-1 Hx Gx P2 (0.125) Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 1.270 P2 Ay 1.320 11.200 By C D1 D2 6.400 2.400 0.700 Gx 0.800 10.040 Gy Hx Hy 8.600 11.900 11.450 sot162-1_fr Fig 28. PCB footprint for SOT162-1 (SO16); reflow soldering PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 29 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 (0.125) Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 P2 Ay By C D1 D2 Gx Gy Hx Hy 0.650 0.750 7.200 4.500 1.350 0.400 0.600 5.600 5.300 5.800 7.450 sot403-1_fr Fig 29. PCB footprint for SOT403-1 (TSSOP16); reflow soldering PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 30 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 19. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged-Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge GPIO General Purpose Input/Output HBM Human Body Model LED Light Emitting Diode IC Integrated Circuit I2C-bus Inter IC bus ID Identification LSB Least Significant Bit MSB Most Significant Bit PLC Programmable Logic Controller RAID Redundant Array of Independent Disks 20. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9670 v.3 20130530 Product data sheet - PCA9670 v.2 Modifications: • • • Section 1 “General description” re-written Section 2 “Features and benefits” re-written Section 3 “Applications”: – Added (new) third bullet, “Keypads” – Added (new) eighth bullet, “Mobile devices” • • • • • • Added Section 4.1 “Ordering options” Figure 2 “Simplified schematic diagram of P0 to P7” modified: removed diode between “VDD” and “P0 to P7”; removed exclusive-OR gate and signal “to interrupt logic” Section 7.1 “Device address”: re-written Table 4 “PCA9670 address map” updated: added separate columns for “Write” and “Read” under “Address byte value” column; added (new) column “7-bit hexadecimal address without R/W” Section 7.2.1 “Software Reset”: added paragraph that follows Figure 9 Section 7.2.2 “Device ID (PCA9670 ID field)”: – first bullet item following first paragraph changed from “8 bits with the manufacturer name” to “12 bits with the manufacturer name” – second bullet item re-written – List item 6. on page 9 changed from “starting with the 8 manufacturer bits ... , followed by the 13 part identification bits” to “starting with the 12 manufacturer bits ... , followed by the 9 part identification bits” – Figure 10 “PCA9670 Device ID field” modified – Figure 11 modified: added “Sr” bit – added paragraph that follows Figure 11 PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 31 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Table 13. Revision history …continued Document ID Modifications: (continued) Release date • • • • • • • • Data sheet status Change notice Supersedes Section 8.1 “Quasi-bidirectional I/O architecture” re-written Section 8.2 “Writing to the port (Output mode)”, first paragraph: first, second and third sentences re-written Figure 13 “Write mode (output)” updated Section 8.3 “Reading from a port (Input mode)” re-written Figure 14 “Read input port register” updated: label corrected from “data into port” to “data at port” Section 8.4 “Power-on reset”: second and third sentences re-written Section 8.5 “RESET input”: added new third sentence Section 9.3 “Acknowledge”: – first paragraph: second and third sentences re-written – second paragraph: third sentence re-written • Section 10.1 “Bidirectional I/O expander applications”, second paragraph, second sentence changed from “use the PCA9671” to “use the PCA9672” • • Added Section 10.2 “How to read and write to I/O expander (example)” Section 10.3 “High current-drive load applications”: – first paragraph re-written – Figure 20 “High current-drive load application” modified: added resistors on P6 and P7 signals • • • • Added Section 10.4 “Migration path” Table 6 “Limiting values”: added Tj(max) limits Added Section 12 “Thermal characteristics” Table 8 “Static characteristics”: – sub-section “I/Os; P0 to P7”: added VIL characteristic – sub-section “I/Os; P0 to P7”: added VIH characteristic – sub-section “Input RESET” is corrected by removing IOH row • • Figure 21 “I2C-bus timing diagram” updated: added 0.7  VDD and 0.3  VDD reference lines Added Section 18 “Soldering: PCB footprints” PCA9670 v.2 20070717 Product data sheet - PCA9670 v.1 PCA9670 v.1 20060620 Objective data sheet - - PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 32 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 21. Legal information 21.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 21.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 21.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA9670 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 33 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 21.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 22. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9670 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 34 of 35 PCA9670 NXP Semiconductors Remote 8-bit I/O expander for Fm+ I2C-bus with reset 23. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.1.1 7.2 7.2.1 7.2.2 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.1.1 9.2 9.3 10 10.1 10.2 10.3 10.4 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Software Reset Call, and device ID addresses 8 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 Device ID (PCA9670 ID field) . . . . . . . . . . . . . . 9 I/O programming . . . . . . . . . . . . . . . . . . . . . . . 11 Quasi-bidirectional I/O architecture . . . . . . . . 11 Writing to the port (Output mode) . . . . . . . . . . 12 Reading from a port (Input mode) . . . . . . . . . 13 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 13 RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Characteristics of the I2C-bus . . . . . . . . . . . . 14 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 START and STOP conditions . . . . . . . . . . . . . 14 System configuration . . . . . . . . . . . . . . . . . . . 15 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application design-in information . . . . . . . . . 16 Bidirectional I/O expander applications . . . . . 16 How to read and write to I/O expander (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 High current-drive load applications . . . . . . . . 17 Migration path . . . . . . . . . . . . . . . . . . . . . . . . . 17 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18 Thermal characteristics . . . . . . . . . . . . . . . . . 18 Static characteristics. . . . . . . . . . . . . . . . . . . . 19 Dynamic characteristics . . . . . . . . . . . . . . . . . 20 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22 Handling information. . . . . . . . . . . . . . . . . . . . 25 Soldering of SMD packages . . . . . . . . . . . . . . 25 Introduction to soldering . . . . . . . . . . . . . . . . . 25 Wave and reflow soldering . . . . . . . . . . . . . . . 25 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26 Soldering: PCB footprints. . . . . . . . . . . . . . . . 28 19 20 21 21.1 21.2 21.3 21.4 22 23 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 31 33 33 33 33 34 34 35 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 May 2013 Document identifier: PCA9670