PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Rev. 2 — 29 July 2010 Product data sheet
1. General description
The PCA9671 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plus (Fm+) family. The PCA9671 is a drop in upgrade for the PCF8575 providing higher I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time and more device addresses (64 versus 8) to allow many more devices on the bus without address conflicts. The difference between the PCA9671 and the PCF8575 is that the interrupt output on the PCF8575 is replaced by a RESET input on the PCA9671. The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The PCA9671 has a low current consumption and includes latched outputs with 25 mA high current drive capability for directly driving LEDs. The internal Power-On Reset (POR), hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.
2. Features and benefits
1 MHz I2C-bus interface Compliant with the I2C-bus Fast-mode and Standard-mode SDA with 30 mA sink capability for 4000 pF buses 2.3 V to 5.5 V operation with 5.5 V tolerant I/Os 16-bit remote I/O pins that default to inputs at power-up Latched outputs with 25 mA sink capability for directly driving LEDs Total package sink capability of 400 mA Active LOW reset input 64 programmable slave addresses using 3 address pins Readable device ID (manufacturer, device type, and revision) Low standby current −40 °C to +85 °C operation ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
3. Applications
LED signs and displays Servers Industrial control Medical equipment PLCs Cellular telephones Gaming machines Instrumentation and test measurement
4. Ordering information
Table 1. Type number PCA9671D PCA9671DB PCA9671DK Ordering information Topside mark PCA9671D PCA9671DB PCA9671 Package Name SO24 SSOP24 SSOP24[1] Description plastic small outline package; 24 leads; body width 7.5 mm Version SOT137-1
plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 plastic shrink small outline package; 24 leads; body width 3.9 mm; SOT556-1 lead pitch 0.635 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 SOT815-1 SOT616-1
PCA9671PW PCA9671PW TSSOP24 PCA9671BQ PCA9671BS 9671 9671
DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 × 5.5 × 0.85 mm HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 × 4 × 0.85 mm
[1]
Also known as QSOP24.
PCA9671
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
5. Block diagram
PCA9671
AD0 AD1 AD2 SCL SDA INPUT FILTER I2C-BUS CONTROL SHIFT REGISTER 16 BITS I/O PORT P00 to P07 P10 to P17
RESET VDD VSS
POWER-ON RESET
write pulse read pulse
002aac244
Fig 1.
Block diagram of PCA9671
write pulse Itrt(pu) data from Shift Register D FF CI S power-on reset D FF read pulse CI S Q Q
100 μA
IOH
VDD
IOL
P00 to P07 P10 to P17
VSS
data to Shift Register
002aab631
to interrupt logic
Fig 2.
Simplified schematic diagram of P00 to P17
PCA9671
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
6. Pinning information
6.1 Pinning
RESET AD1 AD2 P00 P01 P02 P03 P04 P05
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 AD0 20 P17 19 P16 18 P15 17 P14 16 P13 15 P12 14 P11 13 P10
002aac245
RESET AD1 AD2 P00 P01 P02 P03 P04 P05
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 AD0 20 P17 19 P16 18 P15 17 P14 16 P13 15 P12 14 P11 13 P10
002aac246
PCA9671D
PCA9671PW
P06 10 P07 11 VSS 12
P06 10 P07 11 VSS 12
Fig 3.
Pin configuration for SO24
Fig 4.
Pin configuration for TSSOP24
RESET AD1 AD2 P00 P01 P02 P03 P04 P05
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 AD0 20 P17 19 P16 18 P15 17 P14 16 P13 15 P12 14 P11 13 P10
002aac270
RESET AD1 AD2 P00 P01 P02 P03 P04 P05
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 AD0 20 P17 19 P16 18 P15 17 P14 16 P13 15 P12 14 P11 13 P10
002aac247
PCA9671DK
PCA9671DB
P06 10 P07 11 VSS 12
P06 10 P07 11 VSS 12
Fig 5.
Pin configuration for SSOP24 (QSOP24)
Fig 6.
Pin configuration for SSOP24
PCA9671
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
RESET
terminal 1 index area 22 RESET AD1 20 SDA 19 SCL 21 VDD AD2 P00 P01 18 AD0 17 P17 16 P16 15 P15 14 P14 13 P13 P10 10 P11 11 P12 12 7 8 9 P02 P03 P04 P05 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 AD0 20 P17 19 P16 18 P15 17 P14 16 P13 15 P12 14 P11 P10 13
24 AD2
terminal 1 index area P00 P01 P02 P03 P04 P05 1 2 3 4 5 6
23 AD1
PCA9671BQ
PCA9671BS
P06 10 P07 11 VSS 12
P06
P07
VSS
1
002aac248
002aac271
Transparent top view
Transparent top view
Fig 7.
Pin configuration for HVQFN24
Fig 8.
Pin configuration for DHVQFN24
6.2 Pin description
Table 2. Symbol Pin description Pin SO24, SSOP24, QSOP24, HVQFN24 TSSOP24, DHVQFN24 RESET AD1 AD2 P00 P01 P02 P03 P04 P05 P06 P07 VSS P10 P11 P12 P13 P14 P15 P16 P17
PCA9671
Description
1 2 3 4 5 6 7 8 9 10 11 12[1] 13 14 15 16 17 18 19 20
22 23 24 1 2 3 4 5 6 7 8 9[1] 10 11 12 13 14 15 16 17
reset input (active LOW) address input 1 address input 2 quasi-bidirectional I/O 00 quasi-bidirectional I/O 01 quasi-bidirectional I/O 02 quasi-bidirectional I/O 03 quasi-bidirectional I/O 04 quasi-bidirectional I/O 05 quasi-bidirectional I/O 06 quasi-bidirectional I/O 07 supply ground quasi-bidirectional I/O 10 quasi-bidirectional I/O 11 quasi-bidirectional I/O 12 quasi-bidirectional I/O 13 quasi-bidirectional I/O 14 quasi-bidirectional I/O 15 quasi-bidirectional I/O 16 quasi-bidirectional I/O 17
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Pin description …continued Pin SO24, SSOP24, QSOP24, HVQFN24 TSSOP24, DHVQFN24 Description
Table 2. Symbol
AD0 SCL SDA VDD
[1]
21 22 23 24
18 19 20 21
address input 0 serial clock line input serial data line input/output supply voltage
HVQFN and DHVQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region.
7. Functional description
Refer to Figure 1 “Block diagram of PCA9671”.
7.1 Device address
Following a START condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). The address of the PCA9671 is shown in Figure 9. Slave address pins AD2, AD1, and AD0 choose 1 of 64 slave addresses. To conserve power, no internal pull-up resistors are incorporated on AD2, AD1, and AD0. Address values depending on AD2, AD1, and AD0 can be found in Table 3 “PCA9671 address map”. Remark: The General Call address (0000 0000) and the Device ID address (1111 100X) are reserved and cannot be used as device address. Failure to follow this requirement will cause the PCA9671 not to acknowledge. Remark: Reserved I2C-bus addresses must be used with caution since they can interfere with:
• “reserved for future use” I2C-bus addresses (0000 011, 1111 101, 1111 110, 1111 111) • slave devices that use the 10-bit addressing scheme (1111 0xx) • High speed mode (Hs-mode) master code (0000 1xx)
slave address A6 A5 A4 A3 A2 A1 A0 R/W
programmable
002aab636
Fig 9.
PCA9671 address
The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8575 is applied.
PCA9671 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7.1.1 Address maps
Table 3. AD2 VSS VSS VSS VSS VDD VDD VDD VDD VSS VSS VSS VSS VDD VDD VDD VDD VSS VSS VSS VSS VDD VDD VDD VDD VSS VSS VSS VSS VDD VDD VDD VDD PCA9671 address map AD1 SCL SCL SDA SDA SCL SCL SDA SDA SCL SCL SDA SDA SCL SCL SDA SDA VSS VSS VDD VDD VSS VSS VDD VDD VSS VSS VDD VDD VSS VSS VDD VDD AD0 VSS VDD VSS VDD VSS VDD VSS VDD SCL SDA SCL SDA SCL SDA SCL SDA VSS VDD VSS VDD VSS VDD VSS VDD SCL SDA SCL SDA SCL SDA SCL SDA A6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Address (hex) 20h 22h 24h 26h 28h 2Ah 2Ch 2Eh 30h 32h 34h 36h 38h 3Ah 3Ch 3Eh 40h 42h 44h 46h 48h 4Ah 4Ch 4Eh 50h 52h 54h 56h 58h 5Ah 5Ch 5Eh
PCA9671
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
PCA9671 address map …continued AD1 SCL SCL SDA SDA SCL SCL SDA SDA SCL SCL SDA SDA SCL SCL SDA SDA VSS VSS VDD VDD VSS VSS VDD VDD VSS VSS VDD VDD VSS VSS VDD VDD AD0 VSS VDD VSS VDD VSS VDD VSS VDD SCL SDA SCL SDA SCL SDA SCL SDA VSS VDD VSS VDD VSS VDD VSS VDD SCL SDA SCL SDA SCL SDA SCL SDA A6 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Address (hex) A0h A2h A4h A6h A8h AAh ACh AEh B0h B2h B4h B6h B8h BAh BCh BEh C0h C2h C4h C6h C8h CAh CCh CEh E0h E2h E4h E6h E8h EAh ECh EEh
Table 3. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA
PCA9671
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7.2 Software Reset call, and device ID addresses
Two other different addresses can be sent to the PCA9671.
• General Call address: allows to reset the PCA9671 through the I2C-bus upon
reception of the right I2C-bus sequence. See Section 7.2.1 “Software Reset” for more information.
• Device ID address: allows to read ID information from the device (manufacturer, part
identification, revision). See Section 7.2.2 “Device ID (PCA9671 ID field)” for more information.
R/W 0 0 0 0 0 0 0 0
002aac155
Fig 10. General Call address
1
1
1
1
1
0
0
R/W
002aab638
Fig 11. Device ID address
7.2.1 Software Reset
The Software Reset Call allows all the devices in the I2C-bus to be reset to the power-up state value through a specific formatted I2C-bus command. To be performed correctly, it implies that the I2C-bus is functional and that there is no device hanging the bus. The Software Reset sequence is defined as following: 1. A START command is sent by the I2C-bus master. 2. The reserved General Call I2C-bus address ‘0000 000’ with the R/W bit set to logic 0 (write) is sent by the I2C-bus master. 3. The PCA9671 device(s) acknowledge(s) after seeing the General Call address ‘0000 0000’ (00h) only. If the R/W bit is set to logic 1 (read), no acknowledge is returned to the I2C-bus master. 4. Once the General Call address has been sent and acknowledged, the master sends 1 byte. The value of the byte must be equal to 06h. a. The PCA9671 acknowledges this value only. If the byte is not equal to 06h, the PCA9671 does not acknowledge it. If more than 1 byte of data is sent, the PCA9671 does not acknowledge any more. 5. Once the right byte has been sent and correctly acknowledged, the master sends a STOP command to end the Software Reset sequence: the PCA9671 then resets to the default value (power-up value) and is ready to be addressed again within the specified bus free time. If the master sends a Repeated START instead, no reset is performed.
PCA9671
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
The I2C-bus master must interpret a non-acknowledge from the PCA9671 (at any time) as a ‘Software Reset Abort’. The PCA9671 does not initiate a reset of its registers. The unique sequence that initiates a Software Reset is described in Figure 12.
SWRST Call I2C-bus address S 0 0 0 0 0 0 0 0 R/W acknowledge from slave(s) A 0
SWRST data = 06h 0 0 0 0 1 1 0 A P
START condition
acknowledge from slave(s)
PCA9671 is(are) reset. Registers are set to default power-up values.
002aac281
Fig 12. Software Reset sequence
7.2.2 Device ID (PCA9671 ID field)
The Device ID field is a 3-byte read-only (24 bits) word giving the following information:
• 8 bits with the manufacturer name, unique per manufacturer (for example,
NXP Semiconductors).
• 13 bits with the part identification, assigned by manufacturer, the 7 MSBs with the
category ID and the 6 LSBs with the feature ID (for example, PCA9671 16-bit quasi-output I/O expander).
• 3 bits with the die revision, assigned by manufacturer (for example, Rev X).
The Device ID is read-only, hardwired in the device and can be accessed as follows: 1. START command. 2. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W bit set to logic 0 (write). 3. The master sends the I2C-bus slave address of the slave device it needs to identify. The LSB is a ‘Don’t care’ value. Only one device must acknowledge this byte (the one that has the I2C-bus slave address). 4. The master sends a Re-START command. Remark: A STOP command followed by a START command will reset the slave state machine and the Device ID read cannot be performed. Remark: A STOP command or a Re-START command followed by an access to another slave device will reset the slave state machine and the Device ID read cannot be performed. 5. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W bit set to logic 1 (read). 6. The device ID read can be done, starting with the 8 manufacturer bits (first byte + 4 MSB of the second byte), followed by the 13 part identification bits and then the 3 die revision bits (3 LSB of the third byte). 7. The master ends the reading sequence by NACKing the last byte, thus resetting the slave device state machine and allowing the master to send the STOP command.
PCA9671
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Remark: The reading of the Device ID can be stopped anytime by sending a NACK command. Remark: If the master continues to ACK the bytes after the third byte, the PCA9671 rolls back to the first byte and keeps sending the Device ID sequence until a NACK has been detected. For the PCA9671, the Device ID is as shown in Figure 13.
manufacturer
0
0
0
0
0
0
0
0
part identification
0
0
0
0
0
0
1
0
1
0
1
0
0
category identification
feature identification revision 0 0 0
002aac249
Fig 13. PCA9671 ID
acknowledge from one or several slave(s) device ID address S 1 1 1 1 1 0 0 0 R/W don't care A A6 A5 A4 A3 A2 A1 A0 X I2C-bus slave address of the device to be identified acknowledge from master
acknowledge from slave to be identified acknowledge from slave to be identified A 1 1 1 1 1 0 0 1 R/W A
START condition
device ID address acknowledge from master
no acknowledge from master P
M7 M6 M5 M4 M3 M2 M1 M0 A C6 C5 C4 C3 C2 C1 C0 F5 A F4 P3 P2 P1 P0 R2 R1 R0 A category identification = 0000001 revision = 000 feature identification = 010100
manufacturer name = 00000000
STOP condition
002aac335
If more than 2 bytes are read, the slave device loops back to the first byte (manufacturer byte) and keeps sending data until the master generates a ‘no acknowledge’.
Fig 14. Device ID field reading
PCA9671
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Product data sheet
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8. I/O programming
8.1 Quasi-bidirectional I/O architecture
The PCA9671’s 16 ports (see Figure 2) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the Read mode (see Figure 17). Output data is transmitted to the ports in the Write mode (see Figure 16). Every data transmission from the PCA9671 must consist of an even number of bytes, the first byte will be referred to as P07 to P00, and the second byte as P17 to P10. The third will be referred to as P07 to P00, and so on. This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data directions. At power-on the I/Os are HIGH. In this mode only a current source (IOH) to VDD is active. An additional strong pull-up to VDD (Itrt(pu)) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on, as all the I/Os are set HIGH, all of them can be used as inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Remark: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS.
8.2 Writing to the port (Output mode)
To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the Write mode is entered. The PCA9671 acknowledges and the master sends the first data byte for P07 to P00. After the first data byte is acknowledged by the PCA9671, the second data byte P17 to P10 is sent by the master. Once again, the PCA9671 acknowledges the receipt of the data. Each 8-bit data is presented on the port lines after it has been acknowledged by the PCA9671. The number of data bytes that can be sent successively is not limited. After every two bytes, the previous data is overwritten. The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data byte in every pair refers to Port 1 (P17 to P10). See Figure 15.
first byte 07 06 05 04 03 02 01 00 A 17 16 15
second byte 14 13 12 11 10 A
P07 P06 P05 P04 P03 P02 P01 P00
P17 P16 P15 P14 P13 P12 P11 P10
002aab634
Fig 15. Correlation between bits and ports
PCA9671
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PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SCL
1
2
3
4
5
6
7
8
9 data to port 0 data to port 1
slave address SDA S A6 A5 A4 A3 A2 A1 A0 0 START condition R/W
PPPPP P PP PPPPPP A 07 06 1 04 03 02 01 00 A 17 1 15 14 13 12 11 10 A P05 acknowledge from slave P16 acknowledge from slave tv(Q) acknowledge from slave
write to port tv(Q) data A0 and B0 valid
data output from port P05 output voltage
DATA A0 AND B0 VALID
P05 pull-up ouput current P16 output voltage
Itrt(pu) IOH
P16 pull-up ouput current
Itrt(pu) IOH
002aac250
Fig 16. Write mode (output)
8.3 Reading from a port (Input mode)
All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the Read mode is entered. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost.
PCA9671
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Product data sheet Rev. 2 — 29 July 2010 14 of 35
PCA9671
NXP Semiconductors
SCL SDA S
1
2
3
4
5
6
7
8
9 P0x P1x A acknowledge from master DATA 11 A acknowledge from master P0x DATA 00 A acknowledge from master P1x DATA 12 1 P
0
1
0
0 A2 A1 A0 1 R/W
A
DATA 00
START condition
acknowledge from slave read from port 0
no acknowledge from master
data into port 0
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DATA 00
read from port 1
data into port 1
DATA 10
DATA 11
DATA12
002aac251
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Fig 17. Read input port register, scenario 1
PCA9671
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Product data sheet Rev. 2 — 29 July 2010 15 of 35
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NXP Semiconductors
SCL SDA S
1
2
3
4
5
6
7
8
9 P0x P1x A acknowledge from master DATA 10 A acknowledge from master P0x DATA 03 A acknowledge from master P1x DATA 12 1 P
0
1
0
0 A2 A1 A0 1 R/W
A
DATA 00
START condition
acknowledge from slave read from port 0 th(D) data into port 0 DATA 00
no acknowledge from master
tsu(D) DATA 01 th(D) DATA 02 DATA 03
read from port 1 tsu(D) data into port 1 DATA 10 DATA 11 DATA12
002aac252
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Fig 18. Read input port register, scenario 2
PCA9671
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9671 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9671 registers and I2C-bus/SMBus state machine will initialize to their default states. Thereafter VDD must be lowered below 0.2 V to reset the device.
8.5 RESET input
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The PCA9671 registers and I2C-bus state machine will be held in their default state until the RESET input is once again HIGH.
9. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
9.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 19).
SDA
SCL data line stable; data valid change of data allowed
mba607
Fig 19. Bit transfer
9.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 20).
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SDA
SCL S START condition P STOP condition
mba608
Fig 20. Definition of START and STOP conditions
9.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 21).
SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER
SLAVE
002aaa966
Fig 21. System configuration
9.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement
002aaa987
9
Fig 22. Acknowledgement on the I2C-bus
10. Application design-in information
10.1 Bidirectional I/O expander applications
In the 8-bit I/O expander application shown in Figure 23, P00 and P01 are inputs, and P02 to P07 are outputs. When used in this configuration, during a write, the input (P00 and P01) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to P07). During a read, the logic levels of the external devices driving the input ports (P00 and P01) and the previous written logic level to the output ports (P02 to P07) will be read. The GPIO also has a reset line (RESET) that can be connected to an output pin of the microprocessor. Since the device does not have an interrupt output, changes of the I/Os can be monitored by reading the input registers. If both a RESET and INT are needed, use the PCA9673.
VDD
VDD VDD
CORE PROCESSOR
SDA SCL RESET
A0 A1 A2
P00 P01 P02 P03 P04 P05 P06 P07
temperature sensor battery status control for latch control for switch control for audio control for camera control for MP3
002aac253
Fig 23. Bidirectional I/O expander application
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
10.2 High current-drive load applications
The GPIO has a maximum sinking current of 25 mA per bit. In applications requiring additional drive, two port pins in the same octal may be connected together to sink up to 50 mA current. Both bits must then always be turned on or off together. Up to 8 pins (one octal) can be connected together to drive 200 mA.
VDD
VDD
VDD
CORE PROCESSOR
SDA SCL RESET
A0 A1 A2
P00 P01 P02 P03 P04 P05 P06 P07
LOAD
002aac254
Fig 24. High current-drive load application
11. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD IDD ISS VI II IO Ptot P/out Tstg Tamb
[1]
Parameter supply voltage supply current ground supply current input voltage input current output current total power dissipation power dissipation per output storage temperature ambient temperature
Conditions
Min −0.5 VSS − 0.5 −65
Max +6 ±100 ±600 5.5 ±20 ±50[1] 600 200 +150 +85
Unit V mA mA V mA mA mW mW °C °C
operating
−40
Total package (maximum) output current is 600 mA.
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
12. Static characteristics
Table 5. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Supplies VDD IDD Istb VPOR VIL VIH IOL IL Ci IOL supply voltage supply current standby current power-on reset voltage LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance LOW-level output current[2] VOL = 0.4 V VI = VDD or VSS VI = VSS VOL = 0.5 V; VDD = 2.3 V VOL = 0.5 V; VDD = 3.0 V VOL = 0.5 V; VDD = 4.5 V IOL(tot) IOH Itrt(pu) Ci Co VIL VIH ILI Ci VIL VIH ILI Ci
[1] [2] [3]
Parameter
Conditions
Min 2.3
Typ 200 2.5 1.8 4 27 35 42 −150 −1.0 4 4 3 3
Max 5.5 500 10 2.0
Unit V μA μA V
operating mode; no load; VI = VDD or VSS; fSCL = 400 kHz standby mode; no load; VI = VDD or VSS
[1]
−0.5 0.7VDD 20 −1 12 17 25 −30 −0.5
[3] [3]
Input SCL; input/output SDA +0.3VDD V 5.5 +1 10 400 −300 10 10 +0.8 5.5 +1 5 V mA μA pF mA mA mA mA μA mA pF pF V V μA pF
I/Os; P00 to P07 and P10 to P17
total LOW-level output
current[2]
VOL = 0.5 V; VDD = 4.5 V VOH = VSS
HIGH-level output current input capacitance output capacitance LOW-level input voltage HIGH-level input voltage input leakage current input capacitance LOW-level input voltage HIGH-level input voltage input leakage current input capacitance
transient boosted pull-up current VOH = VSS; see Figure 16
−0.5 2 −1 −0.5 0.7VDD −1 -
Input RESET
Inputs AD0, AD1, AD2 +0.3VDD V 5.5 +1 5 V μA pF
The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and set all I/Os to logic 1 (with current source to VDD). Each bit must be limited to a maximum of 25 mA and the total package limited to 400 mA due to internal busing limits. The value is not tested, but verified on sampling basis.
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13. Dynamic characteristics
Table 6. Dynamic characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Standard-mode I2C-bus Min fSCL tBUF SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition set-up time for a repeated START condition set-up time for STOP condition data hold time data valid acknowledge time [1] data valid time [2] data set-up time LOW period of the SCL clock HIGH period of the SCL clock fall time of both SDA and SCL signals rise time of both SDA and SCL signals pulse width of spikes that must be suppressed by the input filter [6] data output valid time data input set-up time data input hold time reset pulse width reset recovery time reset time
[4][5]
Fast-mode I2C-bus Min 0 1.3 Max 400 -
Fast-mode Plus I2C-bus Min 0 0.5 Max 1000 -
Unit
Max 100 -
0 4.7
kHz μs
tHD;STA tSU;STA tSU;STO tHD;DAT tVD;ACK tVD;DAT tSU;DAT tLOW tHIGH tf tr tSP
4.0 4.7 4.0 0 0.3 300 250 4.7 4.0 -
3.45 300 1000 50
0.6 0.6 0.6 0 0.1 50 100 1.3 0.6 20 + 0.1Cb [3] 20 + 0.1Cb [3] -
0.9 300 300 50
0.26 0.26 0.26 0 0.05 50 50 0.5 0.26 -
0.45 450 120 120 50
μs μs μs ns μs ns ns μs μs ns ns ns
Port timing; CL ≤ 100 pF (see Figure 17 and Figure 16) tv(Q) tsu(D) th(D) tw(rst) trec(rst) trst
[1] [2] [3] [4]
0 4 4 0 100
4 -
0 4 4 0 100
4 -
0 4 4 0 100
4 -
μs μs μs ns ns ns
Reset timing (see Figure 26)
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. Cb = total capacitance of one bus line in pF. A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to bridge the undefined region SCL’s falling edge.
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
[5]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
[6]
protocol
START condition (S) tSU;STA
bit 7 MSB (A7) tLOW tHIGH
bit 6 (A6)
bit 0 (R/W)
acknowledge (A)
STOP condition (P)
1/f SCL
SCL tBUF tr tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 25. I2C-bus timing diagram
START SCL
ACK or read cycle
SDA 30 % trst RESET 50 % trec(rst) 50 % tw(rst) trst P0n, P1n 50 % output off
002aac282
50 %
Fig 26. Reset timing
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
14. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) θ A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
θ
o
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 27. Package outline SOT137-1 (SO24)
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c
y
HE
vMA
Z
24 13
Q A2
pin 1 index
A1
(A 3) θ Lp L
A
1
12
detail X wM
e
bp
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3
0.25
bp 0.38 0.25
c 0.20 0.09
D (1) 8.4 8.0
E (1) 5.4 5.2
e 0.65
HE 7.9 7.6
L 1.25
Lp 1.03 0.63
Q 0.9 0.7
v 0.2
w 0.13
y 0.1
Z (1) 0.8 0.4
θ 8 o 0
o
ISSUE DATE 99-12-27 03-02-19
Fig 28. Package outline SOT340-1 (SSOP24)
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
D
E
A
X
c y HE vM A
Z
24 13
A2 A1 (A 3) θ Lp L
1 12
A
detail X wM
e
bp
0
2.5 scale
5 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm inches A max. 1.73 0.068 A1 0.25 0.10 A2 1.55 1.40 A3 0.25 0.01 bp 0.31 0.20 c 0.25 0.18 D(1) 8.8 8.6 E(1) 4.0 3.8 e 0.635 HE 6.2 5.8 L 1 Lp 0.89 0.41 v 0.25 0.01 w 0.18 y 0.1 Z(1) 1.05 0.66 0.040 0.026 θ 8o o 0 8o o 0
0.0098 0.061 0.0040 0.055
0.012 0.0098 0.344 0.157 0.244 0.035 0.025 0.041 0.008 0.0075 0.337 0.150 0.228 0.016
0.007 0.004
Note 1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included. OUTLINE VERSION SOT556-1 REFERENCES IEC JEDEC MO-137 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 29. Package outline SOT556-1 (SSOP24)
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
θ Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 θ 8o 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 30. Package outline SOT355-1 (TSSOP24)
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
SOT815-1
D
B
A
E
A
A1 c
detail X terminal 1 index area C terminal 1 index area 2 L 12 e1 e b 11 vMCAB wM C y1 C y
1
Eh
e2
24 13
23 Dh 0
14 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 5.6 5.4 Dh 4.25 3.95 E (1) 3.6 3.4 Eh 2.25 1.95 e 0.5 e1 4.5 e2 1.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT815-1 REFERENCES IEC --JEDEC --JEITA --EUROPEAN PROJECTION
ISSUE DATE 03-04-29
Fig 31. Package outline SOT815-1 (DHVQFN24)
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
D
B
A
terminal 1 index area A A1 E c
detail X
e1
1/2
C e b 12 vMCAB wMC 13 e y1 C y
e 7 L 6
Eh
1/2
e2 e
1
18
terminal 1 index area
24 Dh 0
19 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.1 3.9 Dh 2.25 1.95 E (1) 4.1 3.9 Eh 2.25 1.95 e 0.5 e1 2.5 e2 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT616-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22
Fig 32. Package outline SOT616-1 (HVQFN24)
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15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
• • • • • •
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
• Solder bath specifications, including temperature and impurities 16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 33) than a SnPb process, thus reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8
Table 7. SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 2.5 ≥ 2.5 Table 8. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (°C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 ≥ 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 33.
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 33. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.
17. Abbreviations
Table 9. Acronym CDM CMOS ESD GPIO HBM I2C-bus I/O IC ID LED LSB MM MSB PLC PWM RAID SMBus Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor ElectroStatic Discharge General Purpose Input/Output Human Body Model Inter-Integrated Circuit bus Input/Output Integrated Circuit Identification Light Emitting Diode Least Significant Bit Machine Model Most Significant Bit Programmable Logic Controller Pulse Width Modulation Redundant Array of Independent Disks System Management Bus
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
18. Revision history
Table 10. Revision history Release date 20100729 Data sheet status Product data sheet Change notice Supersedes PCA9671 v.1 Document ID PCA9671 v.2 Modifications: PCA9671 v.1
•
Table 5 “Static characteristics”, sub-section “Input RESET” is corrected by removing IOH specification Product data sheet -
20061220
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Remote 16-bit I/O expander for Fm+ I2C-bus with reset
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
© NXP B.V. 2010. All rights reserved.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
PCA9671
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 2 — 29 July 2010
33 of 35
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9671
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 29 July 2010
34 of 35
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
21. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.2 7.2.1 7.2.2 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.1.1 9.2 9.3 10 10.1 10.2 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Software Reset call, and device ID addresses . 9 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device ID (PCA9671 ID field) . . . . . . . . . . . . . 10 I/O programming . . . . . . . . . . . . . . . . . . . . . . . 12 Quasi-bidirectional I/O architecture . . . . . . . . 12 Writing to the port (Output mode) . . . . . . . . . . 12 Reading from a port (Input mode) . . . . . . . . . 13 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16 RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Characteristics of the I2C-bus . . . . . . . . . . . . 16 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 START and STOP conditions . . . . . . . . . . . . . 16 System configuration . . . . . . . . . . . . . . . . . . . 17 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 17 Application design-in information . . . . . . . . . 18 Bidirectional I/O expander applications . . . . . 18 High current-drive load applications . . . . . . . . 19 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19 Static characteristics. . . . . . . . . . . . . . . . . . . . 20 Dynamic characteristics . . . . . . . . . . . . . . . . . 21 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Handling information. . . . . . . . . . . . . . . . . . . . 29 Soldering of SMD packages . . . . . . . . . . . . . . 29 Introduction to soldering . . . . . . . . . . . . . . . . . 29 Wave and reflow soldering . . . . . . . . . . . . . . . 29 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 29 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 30 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32 Legal information. . . . . . . . . . . . . . . . . . . . . . . 33 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 19.4 20 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Contact information . . . . . . . . . . . . . . . . . . . . 34 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 July 2010 Document identifier: PCA9671