PCF1179C
4-digit duplex LCD car clock
Rev. 3 — 12 February 2015
Product data sheet
1. General description
The PCF1179C is a single chip, 4.19 MHz car clock circuit providing hours, minutes, and
seconds functions. It is designed to drive a 4-digit duplex liquid crystal display (LCD).
Two external single-pole, single-throw push buttons accomplish all time setting functions.
Time calibration and voltage regulator are electrically programmable via an on-chip
EEPROM. The circuit is battery-operated via an internal voltage regulator and an external
resistor.
2. Features and benefits
Internal voltage regulator is electrically programmable for various LCD voltages
Time calibration is electrically programmable (no trimming capacitor required)
LCD voltage adjusts with temperature for a good contrast
4.19 MHz oscillator
12-hour or 24-hour mode
Operating ambient temperature: 40 C to +85 C
28-lead plastic SMD (SO28)
4 Hz set mode.
3. Ordering information
Table 1.
Ordering information
Type number
PCF1179CT
Package
Name
Description
Version
SO28
plastic small outline package; 28 leads; SOT136-1
body width 7.5 mm
3.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCF1179CT
PCF1179CT,112
935059760112
Tube
1
PCF1179CT
PCF1179CT,118
935059760118
Reel Pack, SMD, 13 inch
1
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
4. Marking
Table 3.
Marking codes
Type number
Marking code
PCF1179CT
PCF1179CT
5. Block diagram
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Fig 1.
Block diagram of PCF1179C
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
6. Pinning information
6.1 Pinning
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Top view. For mechanical details, see Figure 9.
Fig 2.
PCF1179C
Product data sheet
Pin configuration of PCF1179CT
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
6.2 Pin description
Table 4.
Pin description
Symbol
Pin
Description
S1
1
hour adjustment input
DATA
2
EEPROM data input
OSC_IN
3
oscillator input
OSC_OUT
4
oscillator output
VSS
5
negative supply voltage
MODE
6
12/24-hour mode select input
VPP
7
programming voltage input
TS
8
test speed-up mode input
ENABLE
9
enable input (for S1 and S2)
VDD
10
positive supply voltage
FLASH
11
colon option input
SEL
12
EEPROM select input
S2
13
minute adjustment input
B4/C4
14
segment drivers
G4/D4
15
F4/E4
16
B3/C3
17
G3/A3/D3
18
F3/E3
19
A4/COL
20
B2/C2
21
G2/D2
22
F2/E2
23
B1/C1
24
A2/A1/D1/E1/G1 25
PCF1179C
Product data sheet
AM/PM
26
BP2
27
backplane 2
BP1
28
backplane 1
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
7. Functional description
7.1 Outputs
Typical displays for the PCF1179C are shown in Figure 3.
KRXUPRGH
KRXUPRGH
DDD
Fig 3.
Typical displays for the PCF1179C
The circuit outputs 1:2 multiplexed data (duplex) to the LCD. The segment assignment of
the LCD is show in Figure 4.
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Fig 4.
Segment assignment of the LCD
7.2 LCD voltage
Generation of BP1 and BP2 (three-level backplane signals at VDD, VDD/2, and 0) and the
output signals are shown in Figure 5.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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5 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
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Fig 5.
Backplane and segment output signals
The average voltages across the segments are:
1. VON(RMS) = 0.79VDD
2. VOFF(RMS) = 0.35VDD
For a good contrast, the adjustable voltage regulator controls the supply voltage (see
Figure 6 and Section 7.13) in relation to temperature. For example, when VDD = 4.5 V
at +25 C, then:
• VDD = 3 V to 4 V at +85 C
• VDD = 5 V to 6 V at 40 C
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
DDD
966
9
7DPE &
(1) Programmed to 4.0 V at 25 C (value within the specified operating range).
(2) Programmed to 4.5 V at 25 C (value within the specified operating range).
(3) Programmed to 5.0 V at 25 C (value within the specified operating range).
Fig 6.
Regulated voltage as a function of temperature (typical)
7.3 12/24-hour mode
Operation in 12-hour or 24-hour mode is selected by connecting MODE to VDD or VSS
respectively. If MODE is left open-circuit and a reset occurs, the mode changes from
12-hour to 24-hour mode or vice versa.
7.4 Power-on
After connecting the supply, the start-up mode is:
• MODE connected to VDD: 12-hour mode, 1:00 AM.
• MODE connected to VSS: 24-hour mode, 0:00.
• MODE left open-circuit: 24-hour mode, 0:00 or 1:00.
7.5 Colon
If FLASH is connected to VDD, the colon pulses at 1 Hz.
If FLASH is connected to VSS, the colon is static.
7.6 Time setting
The push button inputs S1 and S2 have a pull-up resistor to facilitate the use of
single-pole, single-throw contacts. A debounce circuit is incorporated to protect against
contact bounce and parasitic voltages.
7.7 Set enable
Inputs S1 and S2 are enabled by connecting ENABLE to VDD or disabled by connecting it
to VSS.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
7.8 Set hours
When S1 is connected to VSS, the hours displayed advances by one and after one second
it continues with four advances per second until S1 is released (auto-increment).
7.9 Set minutes
When S2 is connected to VSS, the time displayed in minutes advances by one and after
one second it continues with four advances per second until S2 is released
(auto-increment). In addition to the minute correction, the seconds counter is reset to
zero. Overflow in the minute counter does not have an influence on the hour counter.
7.10 Segment test/reset
When S1 and S2 are connected to VSS, all LCD segments are switched ON. Releasing
push buttons S1 and S2 resets the display. No reset occurs when DATA is connected to
VSS (overlapping S1 and S2).
7.11 Test mode
When TS is connected to VDD, the device is in normal operating mode. When connecting
TS to VSS, all counters (seconds, minutes, and hours) are stopped, allowing quick testing
of the display via S1 and S2 (debounce and auto-increment times are 64 times faster). TS
has a pull-up resistor but for reasons of safety it should be connected to VDD.
7.12 EEPROM
VPP has a pull-up resistor but for reasons of safety it should be connected to VDD.
7.13 LCD voltage programming
To enable LCD voltage programming, SEL is set to open-circuit and a level of VDD 5 V is
applied to VPP, see Figure 7. The first pulse (tE) applied to the DATA input clears the
EEPROM to give the lowest voltage output. Further pulses (tL) increment the output
voltage by steps of typically 150 mV (Tamb = 25 C). For programming, measure
VDD VSS and apply a store pulse (tW) when the required value is reached. If the
maximum number of steps (n = 31) is reached and an additional pulse is applied the
voltage returns to the lowest value.
PCF1179C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
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Programming diagram
7.14 Time calibration
To compensate for the tolerance in the quartz crystal frequency which has been positively
offset (nominal deviation +60 106) by capacitors at the oscillator input and output, a
number (n) of 262 144 Hz pulses are inhibited every second of operation.
The number (n) is stored in a non-volatile memory which is achieved by the following
steps, see Figure 7:
1. Set SEL to VSS and a level of VDD 5 V to VPP
2. The quartz-frequency deviation f/f is measured and (n) is calculated (see Table 5)
3. A first pulse, tE, is applied to the DATA input. It clears the EEPROM to give the highest
backplane frequency
4. The calculated pulses (n) are entered in (tH, tL). If the maximum backplane period is
reached and an additional pulse is applied, the period returns to the lowest value.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
5. The backplane period is controlled and then correctly fixed by applying the store pulse
tW
6. Release SEL and VPP.
Table 5.
Time calibration
t = 7.63 s; SEL at VSS.
PCF1179C
Product data sheet
Oscillator-frequency
deviationf/f ( 106)
Number of pulses (n)
Backplane period (ms)
0
0
15.625
+3.8
1
15.633
+7.6
2
15.641
+11.4
3
15.648
:
:
:
+117.8
31
15.861
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
8. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
with respect to VSS
-
8
V
IDD
supply current
VSS = 0 V
-
3
mA
VI
input voltage
all pins except VPP, DATA
0.3
VDD + 0.3
V
VESD
electrostatic discharge
voltage
HBM
Ilu
[1]
3
VDD + 0.3
V
[2]
-
2000
V
latch-up current
[3]
-
100
mA
Tstg
storage temperature
[4]
55
+125
C
Tamb
ambient temperature
40
+85
C
pins VPP, DATA
operating device
[1]
Connecting the supply voltage with reverse polarity, does not harm the circuit, provided the current is limited to 10 mA by an external
resistor.
[2]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[3]
Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the store and transport requirements (see Ref. 10 “UM10569”) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
10. Characteristics
Table 7.
Characteristics
VDD = 3 V to 6 V; VSS = 0 V; Tamb = 40 C to +85 C; crystal: f = 4.194304 MHz; Rs = 50 ; CL = 12 pF; maximum frequency
tolerance = 30 106; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
voltage regulator
programmed to 4.5 V at
Tamb = 25 C
3
-
6
V
VDD
supply voltage variation
S1 or S2 closed
-
-
50
mV
TC
supply voltage variation
due to temperature
-
0.35
-
%/K
-
16
-
mV/K
700
950
-
A
47
-
-
F
-
-
Supply
VDD
IDD
supply current
CEXT
capacitance
VDD = 4.5 V
[1]
external capacitor
Oscillator
start time
tosc
f/f
frequency deviation
nominal n = 0
0
200
60
106
110
ms
106
106
-
f/f
frequency stability
-
-
1
Rfb
feedback resistance
300
1000
3000
k
Ci
input capacitance
-
16
-
pF
Co
output capacitance
-
27
-
pF
VDD = 100 mV
-
Inputs
RO
pull-up resistance
S1, S2, TS, SEL, DATA
45
90
180
k
RO
pull-up/pull-down
resistance
MODE
100
300
1000
k
IIL
leakage current
ENABLE, FLASH
-
-
2
A
td
debounce time
S1 and S2 only
30
65
100
ms
VPP = VDD 5 V
70
-
700
A
during programming
-
500
-
A
output resistance
100 A
-
-
3
k
output resistance
100 A
-
-
5
k
DC offset voltage
200 k/1 nF
-
-
50
mV
VPP programming voltage
output current
IO2
Backplane (HIGH and LOW levels)
RBP
Segment
RSEG
LCD
Voffset(DC)
[1]
A suitable resistor (R) must be selected (example):
a) VDD = 5 V; Rmax = (12 V 5 V)/700 A = 10 k.
b) VDD = 5 V; Rtyp = (12 V 5 V)/1000 A = 7 k (1000 A, to have more reserve).
c) IDD must not exceed 3 mA.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
12 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
11. Application information
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Fig 8.
PCF1179C
Product data sheet
Application diagram
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
12. Package outline
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PCF1179C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
14 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
13. Packing information
13.1 Tape and reel information
For tape and reel packing information, see Ref. 9 “SOT136-1_118” on page 19.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 9.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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16 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
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17 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
15. Soldering: Footprint information
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Fig 11. Footprint information for reflow soldering of SOT136-1 (SO28) of PCF1179CT
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
16. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10853 — ESD and EMC sensitivity of IC
[3]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[4]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[6]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7]
JESD78 — IC Latch-Up Test
[8]
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[9]
SOT136-1_118 — SO28; Reel dry pack; SMD, 13", packing information
[10] UM10569 — Store and transport requirements
PCF1179C
Product data sheet
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Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NXP Semiconductors
4-digit duplex LCD car clock
17. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF1179C v.3
20150212
Product data sheet
-
PCF1179C v.2
Modifications:
PCF1179C
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Removed obsolete product types
Fixed typos
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
20 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF1179C
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
21 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCF1179C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
22 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
20. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Ordering information . . . . . . . . . . . . . . . . . . . . .1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . .1
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4
Time calibration . . . . . . . . . . . . . . . . . . . . . . . .10
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .12
SnPb eutectic process (from J-STD-020D) . . .16
Lead-free process (from J-STD-020D) . . . . . .16
Revision history . . . . . . . . . . . . . . . . . . . . . . . .20
PCF1179C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
23 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
21. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Block diagram of PCF1179C . . . . . . . . . . . . . . . . .2
Pin configuration of PCF1179CT . . . . . . . . . . . . . .3
Typical displays for the PCF1179C . . . . . . . . . . . .5
Segment assignment of the LCD . . . . . . . . . . . . . .5
Backplane and segment output signals . . . . . . . . .6
Regulated voltage as a function of temperature
(typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Fig 7. Programming diagram . . . . . . . . . . . . . . . . . . . . . .9
Fig 8. Application diagram . . . . . . . . . . . . . . . . . . . . . . .13
Fig 9. Package outline SOT136-1 (SO28) of
PCF1179CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Fig 10. Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Fig 11. Footprint information for reflow soldering of
SOT136-1 (SO28) of PCF1179CT . . . . . . . . . . . .18
PCF1179C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
24 of 25
PCF1179C
NXP Semiconductors
4-digit duplex LCD car clock
22. Contents
1
2
3
3.1
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
8
9
10
11
12
13
13.1
14
14.1
14.2
14.3
14.4
15
16
17
18
18.1
18.2
18.3
18.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
LCD voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
12/24-hour mode . . . . . . . . . . . . . . . . . . . . . . . 7
Power-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Colon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Time setting . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Set enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Set hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Set minutes. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Segment test/reset . . . . . . . . . . . . . . . . . . . . . . 8
Test mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
LCD voltage programming . . . . . . . . . . . . . . . . 8
Time calibration . . . . . . . . . . . . . . . . . . . . . . . . 9
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Packing information . . . . . . . . . . . . . . . . . . . . 15
Tape and reel information . . . . . . . . . . . . . . . . 15
Soldering of SMD packages . . . . . . . . . . . . . . 15
Introduction to soldering . . . . . . . . . . . . . . . . . 15
Wave and reflow soldering . . . . . . . . . . . . . . . 15
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering: Footprint information . . . . . . . . . . 18
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
19
20
21
22
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
23
24
25
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 February 2015
Document identifier: PCF1179C
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