PMEG6002TV,115

PMEG6002EB; PMEG6002TV 0.2 A very low VF MEGA Schottky barrier rectifiers Rev. 01 — 24 November 2006 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ultra small and flat lead Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package Configuration NXP JEITA PMEG6002EB SOD523 SC-79 single PMEG6002TV SOT666 - dual isolated 1.2 Features n n n n Forward current: IF ≤ 0.2 A Reverse voltage: VR ≤ 60 V Very low forward voltage Ultra small and flat lead SMD plastic packages 1.3 Applications n n n n n Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption applications 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit IF forward current Tamb ≤ 25 °C - - 0.2 A VR reverse voltage - - 60 V - 540 600 mV Per diode VF [1] forward voltage Pulse test: tp ≤ 300 µs; δ ≤ 0.02. IF = 200 mA [1] PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol SOD523 1 cathode 2 anode [1] 1 1 2 2 sym001 SOT666 1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 [1] cathode (diode 1) 6 5 4 1 2 3 6 5 4 1 2 3 006aaa440 The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PMEG6002EB SC-79 plastic surface-mounted package; 2 leads SOD523 PMEG6002TV - plastic surface-mounted package; 6 leads SOT666 4. Marking Table 5. Marking codes Type number Marking code PMEG6002EB B2 PMEG6002TV 1B PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 2 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 60 V IF forward current Tamb ≤ 25 °C - 0.2 A IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 2 A IFSM non-repetitive peak forward current square wave; tp = 8 ms [1] - 2.5 A Ptot total power dissipation Tamb ≤ 25 °C PMEG6002EB [1] - 300 mW PMEG6002TV [1] - 200 mW [2] - 300 mW [1] - 300 mW [2] - 400 mW Per device total power dissipation Ptot Tamb ≤ 25 °C PMEG6002TV Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 3 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit Per device Rth(j-a) PMEG6002EB [1][2] - - 400 K/W PMEG6002TV [1][2] - - 416 K/W [1][3] - - 318 K/W PMEG6002EB - - 75 K/W PMEG6002TV - - 195 K/W [4] thermal resistance from junction to solder point Rth(j-sp) [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Soldering point of cathode tab. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 0.1 mA - 130 170 mV IF = 1 mA - 190 230 mV IF = 10 mA - 260 300 mV IF = 100 mA - 420 470 mV IF = 200 mA - 540 600 mV VR = 10 V - 2 10 µA VR = 60 V - 20 100 µA VR = 10 V; Tamb = 100 °C - 310 - µA VR = 1 V; f = 1 MHz - 14 20 pF Per diode VF IR Cd [1] [1] forward voltage reverse current diode capacitance Pulse test: tp ≤ 300 µs; δ ≤ 0.02. PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 4 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 006aaa765 103 006aaa766 5 IR 10 (µA) 104 IF (mA) (1) (2) 102 103 (3) 102 10 10 (1) (2) (3) (4) (5) 1 (4) 1 10−1 10−2 (5) 10−3 10−1 0 0.2 0.4 0.6 0.8 0 1.0 20 VF (V) 40 60 VR (V) (1) Tamb = 150 °C (1) Tamb = 150 °C (2) Tamb = 125 °C (2) Tamb = 125 °C (3) Tamb = 85 °C (3) Tamb = 85 °C (4) Tamb = 25 °C (4) Tamb = 25 °C (5) Tamb = −40 °C (5) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values 006aaa767 30 Cd (pF) 20 10 0 0 20 40 60 VR (V) f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 5 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 8. Test information P t2 t1 t2 duty cycle δ = t1 t 006aaa812 Fig 4. Duty cycle definition 9. Package outline 0.85 0.75 0.65 0.58 1.7 1.5 1 6 0.6 0.5 5 4 0.3 0.1 1.65 1.25 1.55 1.15 1.7 1.5 1.3 1.1 pin 1 index 1 2 0.34 0.26 0.17 0.11 Dimensions in mm 3 0.18 0.08 0.27 0.17 1 02-12-13 Fig 5. Package outline SOD523 (SC-79) 2 0.5 Dimensions in mm 04-11-08 Fig 6. Package outline SOT666 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 PMEG6002EB SOD523 PMEG6002TV SOT666 [1] 8000 10000 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel -115 - - -135 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - For further information and the availability of packing methods, see Section 14. PMEG6002EB_PMEG6002TV_1 Product data sheet 4000 © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 6 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 11. Soldering 2.15 0.50 0.60 1.20 solder lands solder paste 0.30 0.40 solder resist 1.80 1.90 occupied area mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD523 (SC-79) 2.75 2.45 2.10 1.60 0.15 (4×) 0.40 (6×) 2.00 1.70 1.00 0.55 (2×) 0.30 (2×) 0.375 (4×) 1.20 2.20 2.50 solder lands placement area solder resist occupied area 0.075 Dimensions in mm Reflow soldering is the only recommended soldering method. Fig 8. Reflow soldering footprint SOT666 PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 7 of 10 PMEG6002EB; PMEG6002TV NXP Semiconductors 0.2 A very low VF MEGA Schottky barrier rectifiers 12. Revision history Table 10. Revision history Document ID Release date PMEG6002EB_PMEG6002TV_1 20061124 Data sheet status Change notice Supersedes Product data sheet - - PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 8 of 10 NXP Semiconductors PMEG6002EB; PMEG6002TV 0.2 A very low VF MEGA Schottky barrier rectifiers 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com PMEG6002EB_PMEG6002TV_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 24 November 2006 9 of 10 NXP Semiconductors PMEG6002EB; PMEG6002TV 0.2 A very low VF MEGA Schottky barrier rectifiers 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 November 2006 Document identifier: PMEG6002EB_PMEG6002TV_1